EP3827196A1

EP3827196A1 - Illuminated sign having an electrical cable with a vertical structure

Info

Publication number: EP3827196A1
Application number: EP19759645.5A
Authority: EP
Inventors: Kevin SARELS
Original assignee: Kaiwen Consulting
Current assignee: Kaiwen Consulting
Priority date: 2018-07-24
Filing date: 2019-07-22
Publication date: 2021-06-02
Anticipated expiration: 2039-07-22
Also published as: EP3827196C0; US11287115B2; CA3098640A1; EP3827196B1; US20210180777A1; FR3084442A1; FR3084442B1; WO2020021190A1

Abstract

The present invention relates to a light illumination apparatus (100) comprising a plurality of light sources (20) positioned on the front face (10a) of a support plate (10), said light sources (20) each having at least one first (21) and one second (22) electrical terminal in which said support plate (10) comprises an upper conductive layer (11) and a lower conductive layer (12) said upper (11) and lower (12) layers being electrically insulated from one another by an intermediate insulating layer (13) and in which, for each light layer (20), the first (11) and second (12) electrical terminals are respectively electrically connected to the upper (11) and lower (12) layers, or vice versa.

Description

LIGHT SIGN WITH ELECTRIC WIRING WITH STRUCTURE

VERTICAL

Technical field and prior art

The present invention relates to the field of lighting fixtures, and in particular that of illuminated signs.

The object of the present invention relates more particularly to a qualitative lighting apparatus both in terms of lighting and of control of the operating temperature as well as on the manufacturing process which is associated with it.

The present invention will find many advantageous applications, in particular for signs such as for example shop signs which are generally made to measure and individually or in small quantities.

Other advantageous applications could also be envisaged for the design of other lighting devices of the luminaire type and / or of light decoration.

The characteristics sought for a good quality illuminated sign are as follows:

homogeneous illumination;

good mechanical strength and good reliability; and

a small footprint and a small thickness.

Today, to obtain good light homogeneity and a small thickness for a sign, preferably using light-emitting diodes or LEDs (acronym for "Ught-Einitting Diode").

An LED source can be implemented in several ways when manufacturing a light sign.

So far, this manufacturing has been directly linked to the products and electronic components available on the market by manufacturers.

Conventionally, LEDs are offered in particular in the form of a chain, ribbons, plates or even individually, each type of LED can be used to manufacture a different type of light sign depending on the need and the manufacturing method used .

In FIGS. 1a-1b and the annexed to this description, the case of the one letter “G” of 120 millimeters in height in “Times new roman” font to be illuminated is taken as an example and will be described according to the main manufacturing methods used so far. According to the first example in FIG. 1a, the letter "G" is here produced according to the so-called "module" method.

This method is the most used; it mainly consists of having LED modules in series in order to achieve the desired shape.

The Applicant submits, however, that this method is not satisfactory because it does not always make it possible to illuminate small shapes in a homogeneous manner.

In the example of the "G" in 120 millimeters illustrated here, it is not possible to arrange the modules in the thinnest parts: the lighting obtained is therefore not optimal.

In the second example in FIG. 1b, an LED strip is provided on the support to form the letter "G". The insertion of such an LED strip allows light to be placed in much smaller shapes.

The distribution of the LED points is however not homogeneous as can be seen in Figure lb. In addition, the LED strip is subjected to high stresses (twists, heat, cuts, etc.).

For these reasons, this so-called "LED ribbon" method is not generally synonymous with good quality signs.

It is possible to obtain better results in terms of lighting by a third method called "individual LEDs". This method illustrated in Figure le is however little used given the manpower necessary to apply it to different and varied forms.

For each desired shape, it is necessary to wire the resistors and the LEDs adequately to form a tailor-made electrical circuit where each LED point is optimally placed.

For this method, it is therefore necessary to plan a significant additional time for the design of the electrical circuit and the arrangement of all the components.

The fourth method known so far is the so-called “printed circuit” method (not illustrated here). This method consists in creating a printed circuit which contains all the LEDs and resistors of the individual method but in an industrial way.

This method is very effective for mass-produced signs, but it requires the development of the printed circuit, the production of a negative for the printing of copper plates and heavy tools for the industrial process. These tools are not suitable for unitary productions or small series that characterize illuminated signs.

All of the above methods have in common the fact that they are difficult to industrialize in the case of unitary production, as is generally the case in the production of illuminated signs.

A large part of the cost is therefore linked to labor.

Whether to have modules (module method), insert ribbons (LED ribbon method), solder LEDs individually (individual LED method) or even create a printed circuit containing all the LEDs and resistors (method printed circuits), there is currently no simple method for automating the insertion of LED components in a random form.

The Applicant therefore submits that the design of the luminous signs proposed so far does not allow at the same time uniform lighting, a controlled operating temperature and a reduced manufacturing cost in particular.

Subject and summary of the present invention

The object of the present invention is to improve the situation described above.

The present invention therefore aims to remedy the various drawbacks mentioned above by proposing an innovative circuit structure and electrical wiring allowing the design of a lighting apparatus proposing tailor-made and unique light forms and offering homogeneous and of good quality.

The object of the present invention relates according to a first aspect to a luminous lighting apparatus comprising a plurality of light sources positioned on the front face of a support plate.

Preferably, the light sources are positioned according to a determined layout plan to form a predetermined lighting pattern.

According to the present invention, the light sources each have at least first and second electrical terminals.

In a first embodiment of the present invention, light sources are used each having first and second terminals respectively having first and second conductive rods of different lengths. In a second embodiment of the present invention, light sources of SMD LED type are used to be mounted on the surface of the plate (CMS type technology - for “Surface Mounted Component”). In this mode, the first and second terminals of each of the sources do not have conductive rods. The surface of the component supporting the terminals is substantially flat: the first and second terminals are simple contactors forming a connection pin.

According to the present invention, the support plate comprises an upper conductive layer and a lower conductive layer, the upper and lower layers being electrically insulated from each other by an insulating intermediate layer.

According to the present invention, the first and second electrical terminals of each light source are electrically connected respectively to the upper and lower layers by vertical wiring, or vice versa.

It is understood here that the upper and lower layers are connected to the same electric generator.

The sandwich structure provided in the context of the present invention with two conductive layers separated from one another by an insulating layer makes it possible to design a qualitative lighting apparatus in terms of lighting and control of the operating temperature while being simple to to implement.

This structure differs from that proposed with the individual LED method, in particular in that, according to the present invention, the two terminals of each light source are connected respectively between the upper and lower layers forming two distinct horizontal planes electrically isolated one of the 'other.

It is understood here that all the light sources are therefore wired simultaneously by supplying the light sources with two horizontal layers and superimposed on conductive materials.

Unlike the individual LED method, the wiring of light sources is not done on a horizontal plane thanks to an electric circuit, but on a vertical plane by establishing through LED components an electrical contact of the two independent conductive layers to two different heights.

In one embodiment of the present invention, the first and second terminals respectively have first and second rods of different lengths.

In one case, the first rod of the first terminal is shorter than the second rod of the second terminal. In this case, the first terminal is electrically connected to the upper layer and the second terminal is electrically connected to the lower layer. In the other case, it will be understood that the first rod of the first terminal is longer than the second rod of the second terminal. In this case, the first terminal is electrically connected to the lower layer and the second terminal is electrically connected to the upper layer.

Advantageously, the support plate comprises, for each light source, a first hole opening into the front facade and crossing at least partially the upper layer.

In an advantageous embodiment, the first hole is dimensioned to receive the first or second electrical terminal (the one electrically connected to the upper layer) in order to establish an electrical contact point between the light source and the upper layer.

It is understood here that such a first hole is dimensioned to receive the first or the second conductive rod of the light source.

In another embodiment of the present invention, a light source is used whose first and second terminals do not have conductive rods. The terminals are flat.

To establish an electrical contact point between the source and the upper layer, this embodiment implements an electrical bridge; such an electric bridge makes it possible to establish an electrical connection between one of the flat terminals of the light source and the upper layer.

A specific plate structure is implemented here for this other mode.

Preferably, the plate comprises on the front facade a first insulating layer; this upper conductive layer is therefore sandwiched between the insulating intermediate layer and the first insulating layer.

Preferably, the first hole crosses the first insulating layer to lead to the front facade.

Preferably, a first electrical bridge is housed inside said first hole, said first electrical bridge electrically connecting the upper layer to the front panel to establish on the front panel an electrical contact point between the first or second electrical terminal of the light source. and the top layer.

Preferably, the first electric bridge is electrically isolated by an insulating sheath.

The assembly formed by the hole and the electrical bridge forms an electronic via. Such a via is thus in the form of a so-called metallized hole making it possible to establish an electrical connection between the two conductive layers of the plate. Advantageously, the support plate comprises, for each light source, a second hole opening into the front facade of the plate and passing through the upper layer, the insulating layer and at least partially the lower layer.

In the embodiment using electrical terminals having conductive rods of different lengths, the second hole is dimensioned to receive the second or first electrical terminal (the one electrically connected to the lower layer) in order to establish an electrical contact point between the light source and the lower layer.

It is understood here that such a second hole is dimensioned to receive the second or first conductive rod of the light source.

In the other embodiment using flat electrical terminals, we find the implementation of an electronic via to electrically connect one of the terminals of the light source to the lower layer.

In this mode, the plate thus comprises on the rear facade of the plate a second insulating layer; said conductive lower layer is thus sandwiched between the insulating intermediate layer and the second insulating layer.

Preferably, a second electric bridge is housed inside the second hole, said second electric bridge electrically connecting said lower layer to the front facade to establish on the front facade an electrical contact point between the second or first electrical terminal of the light source. and the bottom layer.

Preferably, the second electric bridge is electrically isolated by an insulating sheath.

Thus, in the embodiment implementing LEDs of SMD LED type with flat terminals for surface mounting of CMS type, the present invention provides for the implementation of an electronic card with a grid allowing a plurality of possibilities of 'predefined locations. Each potential location for an LED makes it possible to make the connection between the upper layer by means of two isolated electrical contact points between them and the two conductive layers, said to be central, of the electronic card. These connections are made using electronic vias internal to the card.

In this mode with a multilayer structure having five layers, the two central conductive layers (positive and negative) have the function of distributing the electric charge uniformly over the whole of said electronic card: the presence of these two central conductive layers allows to distribute the electrical charge.

Preferably, it is also possible to provide vertical wiring of these two conductive layers to an additional layer on the rear face. It thus becomes possible to select positive contact areas and negative contact areas on this layer to possibly facilitate wiring or even carry out future tests. Advantageously, fixing means having conductivity properties are implemented at each of the electrical contact points to secure each of the light sources on the support plate while ensuring electrical conductivity between each of the sources and respectively the upper layers. and lower.

According to a preferred embodiment, the fixing means comprise a conductive adhesive.

Preferably, this conductive adhesive is an adhesive of the epoxy type mixed with conductive particles of the type for example silver or tin in particular.

According to another alternative embodiment, the fixing means comprise a weld.

Such a weld is therefore implemented at each of the electrical contact points so as to ensure an integral connection between each of the sources and the upper and lower layers while ensuring electrical conductivity.

Advantageously, the first and second electrical terminals of each of the light sources are electrically isolated from the lower and upper layers respectively, or vice versa.

In an advantageous embodiment of the present invention with a second hole as above, it is further provided that the support plate has a third hole, called a blind hole, opening on the front facade and passing through the upper layer and at least partially the insulating layer.

In this mode, the blind hole is preferably substantially centered on the second hole and has a diameter greater than the second hole so as to electrically isolate the upper layer and the second or first electrical terminal which is electrically connected to the lower layer.

We understand here that the second and third holes are co-axial and that the third hole, which is shallower than the second hole, has a larger diameter than the latter so as to electrically isolate the upper layer and the electrical terminal which is electrically connected with the bottom layer

Advantageously, the apparatus according to the present invention comprises electrical supply means connected respectively to the upper and lower layers for supplying direct current to each of the light sources.

In a preferred embodiment, provision is made for the support plate to include a glass fiber panel covered with two copper plates. In this mode, the panel is used insulating layer and the two copper plates serve respectively as upper and lower layers.

Preferably, the light sources comprise at least one light-emitting diode of LED type and / or an individual module receiving a light-emitting diode of LED type SMD (for “Surface Mounted Device”).

Preferably, each light source is in the form of an electronic component configured to withstand a voltage of 12 Volts and comprising an individual LED and a micro-resistance, encapsulated in a resin capsule.

The object of the present invention relates according to a second aspect to a method of manufacturing a luminous lighting apparatus comprising a plurality of light sources positioned on the front face of a support plate, each light source having at least a first and a second electrical terminals.

According to the present invention, the method comprises the following steps:

a supply of a support plate comprising an upper conductive layer and a lower conductive layer, the upper and lower layers being electrically insulated from each other by an insulating intermediate layer, and

an electrical connection step during which the first and second electrical terminals of each light source are electrically connected respectively to the upper and lower layers, or vice versa.

This manufacturing technique thus makes it possible to implement light sources of the type, for example LED, individually on a support, this in an automated manner.

Advantageously, the method according to the present invention comprises, prior to the electrical connection step, a first machining step during which the support plate is machined so as to form a first hole opening into the front facade and passing through at least partially the top layer.

In one embodiment (here called the first mode) using a light source having electrical terminals in the form of conductive rods of different lengths, it can be provided during this machining that the first hole is preferably dimensioned for receive the first or second electrical terminal (here the shortest conductive rod) in order to establish an electrical contact point between the light source and the upper layer. In another advantageous embodiment (here called the second mode) implementing a light source having flat electrical terminals (SMD LED for example), the support plate further comprises a first insulating layer covering the upper conductive layer In this mode , the support plate is provided during this factory machining so that the first hole passes through this said first insulating layer.

Advantageously, the method according to the present invention comprises, prior to the electrical connection step, a second machining step during which the support plate is machined so as to form a second hole opening into the front face and passing through the upper layer. , the insulating layer and at least partially the bottom layer.

During this machining, it is provided in the first mode that the second hole is preferably dimensioned to receive the second or first electrical terminal in order to establish an electrical contact point between the light source and the lower layer.

Advantageously, the electrical connection step comprises the implementation at each of the electrical contact points of fixing means (of the type for example a solder or a conductive adhesive of epoxy type mixed with conductive particles of the type for example silver or tin) to fix each of the sources together on the support plate while ensuring the electrical conductivity between each of the sources and respectively the upper and lower layers.

Preferably, during the electrical connection step, the first and second electrical terminals of each light source are electrically isolated from the lower and upper layers respectively, or vice versa.

Advantageously, the method according to the present invention comprises, prior to the electrical connection step, a third machining step during which the support plate is machined so as to form a third hole, called a blind hole, opening out on the front facade and crossing the upper layer and at least partially the intermediate insulating layer.

During this machining, the blind hole is substantially centered on the second hole and has a diameter greater than the second hole so as to electrically isolate the upper layer and the second or first electrical terminal which is electrically connected to the lower layer.

There is also provided in the method a prior step of generating a computer file comprising in particular a determined layout plan making it possible to correctly and optimally position the light sources according to predefined criteria to form a predetermined lighting pattern. The object of the present invention relates, according to a third aspect, to the use of a luminous lighting device such as that described above for a luminous sign.

Thus, the present invention, by its various structural and functional technical characteristics, proposes a new design of a luminous sign with vertical cabling making it possible to solve the various problems encountered hitherto with existing solutions, namely:

the difficulty of distributing the light sources optimally for uniform lighting;

the impossibility of including an LED module in a narrow form (less than 10mm) and of connecting it electrically;

the increase in the operating temperature of the light sources in the case where they are highly concentrated (particularly for the LED strip); the time required with the existing methods to choose the location of each light source (each module, the layout of the LED strip or the placement of each LED and each resistor);

the time required for the electrical connection of all these methods, welding, wiring, etc. ;

the difficulty of automating placements and welds for tailor-made products; the need to have identical series of parts to consider industrial production.

Brief description of the attached figures

Other characteristics and advantages of the present invention will emerge from the description below, with reference to FIGS. 2 to 6 appended, which illustrate two exemplary embodiments thereof which have no limiting character and in which:

Figure 2 schematically shows a sectional view of a lighting fixture having a support plate to which LED type light sources are wired according to a first embodiment of the present invention;

FIG. 3 schematically represents a top view of a lighting device having a support plate to which LED type light sources are wired according to an exemplary embodiment according to FIG. 2; 4 shows a schematic top view of a support plate according to Figure 2 without light source; FIGS. 5A and 5B each schematically represent a sectional view of a lighting fixture having a support plate to which LED type light sources are wired according to a second embodiment of the present invention;

FIG. 6 represents a flow diagram of a method of manufacturing a lighting apparatus according to an exemplary embodiment of the present invention.

Detailed description according to an advantageous exemplary embodiment

The manufacture of a light sign according to two exemplary embodiments will now be described in what follows with reference to FIGS. 2 to 6.

As a reminder, one of the objectives of the present invention is to design a luminous sign making it possible to respond to a problem of production of a customized and unique light form offering qualitative lighting, that is to say homogeneous and limiting the operating heat. .

The two examples described here will each relate to the design of a light sign; it will however be understood that the invention can be implemented for any lighting or light decoration product, and in particular any lighting device which requires a tailor-made and unique shape.

The manufacturing process which has been developed within the framework of the present invention and which will be described in the following description makes it possible to implement individual light sources of LED type on a support in an automated manner.

We will speak here of LED source in the general sense.

The concept underlying the present invention consists of a manufacturing process aimed at wiring all the light sources 20, here LEDs, simultaneously by supplying the LED sources with two superimposed layers of conductive materials.

In the example described here, we use individual LED components suitable for 12 Volts, and not 3.3 Volts LEDs as is generally the case on existing signs.

Such an LED component is in the form of a resin capsule comprising the LED as such and a micro-resistance. Such a component is thus configured to withstand a voltage of 12 Volts.

The process used is the closest to the method of individual LEDs, which makes it possible to obtain the most qualitative product in terms of lighting and control of the operating temperature. However, unlike this method, the wiring of each LED source is no longer on a horizontal plane thanks to an electrical circuit, but on a vertical plane by establishing the electrical contact between the two independent conductive layers at two different heights.

In the first embodiment illustrated in FIG. 2, provision is made to use LED type light sources with conductive rods of different lengths.

In this first example, during an initial step of supplying SI, there is a glass fiber panel covered on either side with a conductive plate, for example made of copper.

We also talk about sandwich panels.

Thus, it is understood that the glass fiber panel, which is made of an insulating material, constitutes an insulating layer 13 playing the role of electrical insulator between an upper conductive layer 11 and a lower conductive layer 12 (the copper plates).

In the second embodiment illustrated in FIGS. 5A and 5B, provision is made to use light sources of the SMD LED type with flat electrical terminals.

In this second example, a multilayer PCB type panel is used with, as in the first example, an intermediate insulating layer 13 acting as an electrical insulator between an upper conductive layer 11 and a lower conductive layer 12 and two insulating layers 17 and 18 sandwiching the whole 11-12-13. Layers 12 and 12 are so-called central layers.

This multilayer structure has many advantages such as ensuring an optimal distribution of the electric charge on the two central layers 11 and 12 to be able to wire all the LEDs without creating heating points as well as the possibility of creating strips for find the + and the - by bands on the lower layer.

As illustrated in FIGS. 2 and 5A-5B, the LED sources (or more generally the light sources) will be positioned on the front face 10a of the support plate 10, that is to say on the upper layer side 11.

It is desirable that the two layers 11 and 12 which are at different heights are electrically connected to each other. More precisely, the two layers 11 and 12 are wired to the same electric generator 40.

In each of the two examples described here, a vertical wiring structure is provided in which the two terminals 21 and 22 of each LED 20 are electrically connected with each of the two layers 11 and 12 respectively. Thus, as illustrated in FIGS. 2 or 5, an electrical connection step S 5 is provided during the manufacturing process during which the first 21 and second 22 electrical terminals of each light source 20 are electrically connected respectively to the upper layers 11 and lower 12.

To make such a so-called vertical wiring, the manufacturing process first provides for specific machining of the support plate 10.

In the two examples described, the plate will be machined so that each LED source 20 can come into contact with one of the two conductive layers 11 or 12 selectively.

There are in particular three machining steps S2, S3 and S4 which will make it possible to design vertical wiring for each LED source 20.

In the two examples described, provision is preferably made for the use of a CNC-type cutting machine of the CNC type which will machine the support plate 10 in a specific manner.

This CNC machine will be controlled automatically or semi-automatically thanks in particular to a layout plan generated during a step S0. During this step S0, a computer file intelligible by the CNC machine will be generated depending in particular on the desired shape and on various predetermined constraints. This file then contains the layout plan with in particular the position and orientation of each LED source.

In each of the two examples described here, the support plate 10 is therefore machined during a step S2 to form a first hole 14 according to the layout plan (orientation and position, in particular).

In the example illustrated in FIG. 2, this first hole 14 is machined so as to open up on the front panel 10a and at least partially pass through the upper layer 11.

In the example described here, this first hole 14 is also dimensioned to receive the first electrical terminal 21, here the shortest conductive rod.

In the example illustrated in FIGS. 5 A and 5B, the terminals 21-22 of the light source 20 are flat. It is intended here that this first hole 14 is machined so as to open up on the front panel 10a and at least partially pass through the upper layer 11 and the first insulating layer 17.

Then, the plate is machined during a step S3 to form a second hole 15, still according to the layout plan. In the example illustrated in FIG. 2, this second hole 15 is machined so as to open up on the front panel 10a and pass through the upper layer 11, the insulating layer 13 and at least partially the lower layer 12.

In the example described here, this second hole 15 is dimensioned to receive the second electrical terminal 22.

In the example illustrated in FIGS. 5A and 5B, this second hole 15 is machined so as to open up on the front panel 10a and pass through the first insulating layer 17, the upper layer 11, the insulating layer 13 and at least partially the lower layer 12 .

Finally, the support plate 10 is machined during a step S4 so as to form a third hole 16, called a blind hole.

As illustrated in FIGS. 2 or 5A-5B, this blind hole 16 is machined so as to open into the front facade 10a and pass through the upper layer 11 and at least partially the insulating layer 13 (and the first insulating layer 17 for the example of Figure 5)

In the example described here, this blind hole 16 is centered on the second hole 15 (co-axial with the latter) and has a diameter greater than that of the second hole 15.

There is also the same blind hole 16 in the embodiment of Figures 5A-5B.

These machining operations are repeated according to the layout plan for each LED source. Thus, it is understood that by making these holes 14, 15 and 16 according to the layout plan with different diameters and depths, it is possible to reach the conductive layers 11 and 12 in order to establish an electrical connection with each terminal 21 and 22 conductor of the LED source 20.

The machining of the blind hole 16 makes it possible to isolate the longest pole from the lower layer.

When positioning the LED sources 20, holes 14, 15 and 16 made during machining S2, S3 and S4 are therefore used. The LED sources 20 are then placed one by one on the support plate 10 at the location defined during the machining. The LED sources 20 are therefore placed upside down so as to have their conductive poles accessible and in contact with the sandwich panel 10.

It should be noted here that there are many LED components compatible with this manufacturing process, all of the through LEDs of 3 or 5 millimeters in diameter but also the individual micromodules receiving an LED of SMD type.

In the first example described here and illustrated in FIGS. 2, 3 and 4, the electrical connection S5 is therefore produced by inserting the first terminal 21 of the source 20 into the first hole 14 (the shortest conductive rod). In this way, an electrical contact point 21 a is established between the light source 20 and the upper layer 11.

In this configuration and as illustrated in FIG. 2, it is understood that the first terminal 21 of the LED source 20 is electrically isolated from the lower layer 12.

During connection S 5, the second terminal 22 (the longest conducting rod) of the source 20 is then inserted into the second hole 15 in order to establish an electrical contact point 22a between the light source 20 and the lower layer 12 .

Thanks to the diameter of the blind hole 16, the second terminal 22 of the LED source 20 is electrically isolated from the upper layer 11.

At each electrical contact point 21a and 22a (that is to say twice by LED), a drop of conductive adhesive is then deposited during the electrical connection S5.

In the example described here, an epoxy type adhesive is used mixed with microparticles of conductive material based on silver or tin for example.

So there are half of the drops that are in contact with the top layer and the other half that is in contact with the bottom layer.

Preferably, this adhesive must be prepared with the right conductivity so as not to oppose too great an electrical resistance and with the right viscosity so as not to move during handling.

After applying and drying the adhesive S6, the two conductive layers 11 and 12 are supplied in a step S7 using electrical power means 40 in direct current to supply all the LED sources 20 in bypass.

In the example described here, the LED sources used are 3.3 Volt LEDs. In this example, it is preferable to supply 3.3 V DC to these two layers.

It is also possible to use LED sources which are directly intended to be supplied with 12 Volts. In this case, it is possible to directly supply this electrical assembly with 12V.

In the second example described here and illustrated in FIGS. 5A-5B, the electrical contact points 21a and 22a between the conductive layers 11 and 12 and the source are implemented by electrical bridges l9a and 19b which are introduced respectively into the first 14 and second 15 holes. Once the bridges 19a and 19b have been introduced into each of the respective holes, a resin is poured into each of the said holes 14 and 15. This resin then forms an insulating sheath allowing electrical insulation of the bridges.

The electrical contact points 21a and 22a between the terminals of the electrical source 20 and each of the layers 11 and 12 are thus implemented on the front panel 10a via bridges. In this second example, the electrical connection of each of the terminals 21 and 22 of the light source with the layers 11 and 12 is produced by welding. Such a weld can be implemented for example by depositing an addition of solder type material then passing through the oven to secure the terminals to the plate.

In each of the examples, the LEDS sources are then placed on the support plate 10 previously machined to receive each LED with a predefined position and orientation.

This position and this orientation of the LED sources 20 is defined according to a layout plan during an initial step S0. Such a plan can be generated by computer with dedicated computer software depending on the shape of the desired lighting.

Once the plane has been generated, one or more plates are prepared forming a sandwich type panel having on its lower and upper surface a conductive material and at its heart an insulating material. This plate is drilled during machining to supply the LED sources 20 with the positive or negative conductive layer.

The advantage of having in addition a first and an example insulating layer sandwiching the assembly is to ensure an optimal distribution of the electric charge on the two central layers in order to be able to wire all the LEDs without creating warm-up points. This multilayer configuration also makes it possible to create bands to find the + and the - by bands on the lower layer.

Next, drops of conductive adhesive 31 are placed on the support plate 10 for each point of contact 21a and 22a with the LED 20.

The two parts are then assembled to obtain a complete electrical circuit supplying all the LED sources of the form at one time. Each LED is therefore supplied with bypass individually.

The arrangement of LEDs amounts to having imperfect circles in a shape. This part can therefore be the subject of computer automation by providing the machine with spacing constraints with the edge of the shape and with spacing between the circles, in other words, between the LEDs.

The site plan can therefore be generated automatically or semi-automatically by computer from the drawing of the form to be produced.

It is therefore no longer necessary to manually decide the location of each element such as modules, LEDs or resistors, nor to decide on the electrical wiring that will connect these electrical components together. All the manufacturing steps described in the section can be robotized to a greater or lesser degree. It is therefore possible to benefit from all the advantages of the individual placement method while very greatly reducing the workforce to get there.

The robotization of this production must allow this production to be placed in countries with high labor costs and therefore bring production closer to the consumption centers of this product. This also leads to lower transport costs and times.

Finally, the manufacturing process also makes it possible to speed up the manufacturing of signs and therefore to have a competitive advantage in terms of production time compared to the competition which produces these products by hand.

It should be observed that this detailed description relates to a particular embodiment of the present invention, but that in no case this description does not have any limiting character with the object of the invention; on the contrary, it aims to remove any possible inaccuracy or misinterpretation of the claims which follow.

It should also be observed that the reference signs put in brackets in the following claims are in no way limiting; the sole purpose of these signs is to improve the intelligibility and understanding of the claims which follow, as well as the scope of the protection sought.

Claims

1. Luminous lighting apparatus (100) comprising a plurality of light sources (20) positioned on the front face (10a) of a support plate (10), said light sources (20) each having at least one first (21) and a second (22) electrical terminal,

said apparatus (100) being characterized in that said support plate (10) comprises an upper conductive layer (11) and a lower conductive layer (12), said upper (11) and lower (12) layers being electrically insulated one on the other by an insulating intermediate layer (13), and in that, for each light source (20), the first (11) and second (12) electrical terminals are electrically connected respectively to the upper (11) and lower layers (12), or vice versa.

2. Apparatus (100) according to claim 1, characterized in that said support plate (10) comprises, for each light source (20), a first hole (14) opening into the front face (lOa) of said plate and passing through at at least partially said upper layer (11).

3. Apparatus (100) according to claim 1 or 2, wherein said first hole (14) is dimensioned to receive said first (21) or second (22) electrical terminal to establish an electrical contact point (21a) between said light source (20) and said upper layer (11).

4. Apparatus (100) according to claim 1 or 2, wherein said plate comprises on the front face (10a) a first insulating layer (17), said upper conductive layer (11) being sandwiched between the insulating intermediate layer (13 ) and the first insulating layer (17), and in which said first hole (14) passes through said first insulating layer (17) to lead to the front facade (10a).

5. Apparatus (100) according to claim 4 related to claim 2, wherein a first electric bridge (l9a, l9b) is housed inside said first hole (14), said first electric bridge (l9a, 19b) connecting said upper layer (11) to the front face (10a) to establish an electrical contact point (2 la, 22a) between the front face said first (21) or second (22) electrical terminal of said light source (20) and said upper layer (11).

6. Apparatus (100) according to claim 5, wherein said first electrical bridge (19a, 19b) is electrically insulated by an insulating sheath.

7. Apparatus (100) according to any one of claims 1 to 6, wherein said support plate (10) comprises, for each light source (20), a second hole (15) opening into the front facade (lOa) of said plate and passing through said upper layer (11), said insulating layer (13) and at least partially said lower layer (12).

8. Apparatus (100) according to claim 7, wherein said second hole (15) is dimensioned to receive said second (22) or first (21) electrical terminal to establish an electrical contact point (22a) between said source light (20) and said lower layer (12).

9. Apparatus (100) according to any one of claims 1 to 7, wherein said plate (10) comprises on the rear facade (10b) a second insulating layer (18), said lower conductive layer (12) being sandwiched between the insulating intermediate layer (13) and said second insulating layer (18).

10. Apparatus (100) according to claim 9 attached to claim 7, wherein a second electric bridge (l9a, 19b) is housed inside said second hole (15), said second electric bridge (l9a, l9b) connecting said lower layer (12) at the front face (10a) to establish on the front face (10a) an electrical contact point (22a, 2 la) between said second (22) or first (21) electrical terminal of said light source ( 20) and said lower layer (12).

11. Apparatus (100) according to claim 10, wherein said second electrical bridge (l9a, l9b) is electrically insulated by an insulating sheath.

12. Apparatus (100) according to at least claim 3 or 5 and at least claim 8 or 10, characterized in that fixing means (30) having conductivity properties are implemented at each of the points of electric contact (21a, 22a) for integrally fixing each of said sources (20) on said support plate (10) while ensuring the electrical conductivity between each of said sources (20) and respectively the upper (11) and lower (12) layers.

13. Apparatus (100) according to claim 12, characterized in that the fixing means (30) comprise a conductive adhesive (31) of the epoxy type mixed with conductive particles of the type for example silver or tin in particular.

14. Apparatus (100) according to claim 12, characterized in that the fixing means (30) comprise a weld.

15. Apparatus (100) according to any one of the preceding claims, characterized in that the first (21) and second (22) electrical terminals of each of the light sources (20) are electrically isolated from the lower layers (12) and upper (11), or vice versa.

16. Apparatus (100) according to claim 15 attached at least to claim 7, characterized in that said support plate (10) has a third hole (16), said blind, opening at the front (10a) and passing through at least said upper layer (11) and at least partially said insulating layer (13), said blind hole (16) being substantially centered on said second hole (15) and having a diameter greater than said second hole (15) so as to electrically isolate said upper layer (12) and said second (22) or first (11) electrical terminal electrically connected to the lower layer (12).

17. Apparatus (100) according to any one of the preceding claims, characterized in that it comprises electrical supply means (40) connected respectively to the upper (11) and lower (12) layers for supplying direct current each. said light sources (20).

18. Apparatus (100) according to any one of the preceding claims, characterized in that the support plate (10) comprises a glass fiber panel covered with two copper plates, said panel serving as an insulating layer (13) and said two plates respectively serving as upper (11) and lower (12) layers.

19. Apparatus (100) according to any one of the preceding claims, characterized in that the light sources (20) comprise at least one LED-type light-emitting diode and / or an individual module receiving an SMD-type LED light-emitting diode.

20. Apparatus (100) according to any one of the preceding claims, characterized in that the light sources (20) are positioned according to a determined layout plane to form a predetermined lighting pattern.

21. Apparatus (100) according to any one of the preceding claims, characterized in that each light source (20) is in the form of an electronic component configured to support a voltage of 12 Volts and comprising an individual LED and a micro-resistance, encapsulated in a resin capsule.

22. Method for manufacturing a luminous lighting device (100) comprising a plurality of light sources (20) positioned on the front face (10a) of a support plate (10), each light source (20) having at least first (21) and second (22) electrical terminals, said method comprising the following steps:

- A supply (Sl) of a support plate (10) comprising an upper conductive layer (11) and a lower conductive layer (12), said upper (11) and lower (12) layers being electrically insulated one of the other by an insulating intermediate layer (13), and

an electrical connection step (S 5) during which the first (21) and second (22) electrical terminals of each light source (20) are electrically connected respectively to the upper (11) and lower (12) layers, or vice versa .

23. The method of claim 22, characterized in that it comprises, prior to the electrical connection step (S5), a first machining step (S2) during which said support plate (10) is machined from so as to form a first hole (14) opening into the front facade (10a) and at least partially crossing said upper layer (11).

24. The method of claim 23, characterized in that it comprises, prior to the electrical connection step (S5), a second machining step (S3) during which said support plate (10) is machined from so as to form a second hole (15) opening on the front facade and passing through said upper layer (11), said insulating layer (13) and at least partially the lower layer (12).

25. The method of claim 24, characterized in that the step of electrical connection (S5) comprises the implementation at each of the electrical contact points (21a, 22a) of fixing means (30) for securing each of said sources (20) on said support plate (10) while ensuring the electrical conductivity between each of said sources (20) and respectively the upper (11) and lower (12) layers.

26. Method according to any one of claims 22 to 25, characterized in that the step of electrical connection (S5) comprises electrical insulation of the first (21) and second (22) electrical terminals of each light source (20 ) with the lower (12) and upper (11) layers respectively, or vice versa.

27. A method according to claim 22 attached at least to claim 24, characterized in that it comprises a third machining step (S4) during which said support plate (10) is machined so as to form a third hole (16), said blind, opening into the front facade (10a) and passing through said upper layer (11) and at least partially said insulating layer (13), said blind hole (16) being substantially centered on said second hole (15) and having a diameter greater than that of the second hole (15) so as to electrically isolate said upper layer (11) and said second (22a) or first (2) electrical terminal electrically connected to the lower layer (12).

28. Use of a luminous lighting device (100) according to any one of claims 1 to 21 for a luminous sign.