EP3803300A1 - Infrared temperature measurement and stabilization thereof - Google Patents
Infrared temperature measurement and stabilization thereofInfo
- Publication number
- EP3803300A1 EP3803300A1 EP19807004.7A EP19807004A EP3803300A1 EP 3803300 A1 EP3803300 A1 EP 3803300A1 EP 19807004 A EP19807004 A EP 19807004A EP 3803300 A1 EP3803300 A1 EP 3803300A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- sensor
- temperature
- sensor assembly
- metallic frame
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000006641 stabilisation Effects 0.000 title abstract description 31
- 238000011105 stabilization Methods 0.000 title abstract description 31
- 238000009529 body temperature measurement Methods 0.000 title abstract description 16
- 238000000034 method Methods 0.000 claims abstract description 25
- 239000000463 material Substances 0.000 claims description 32
- 239000010949 copper Substances 0.000 claims description 14
- 229920003023 plastic Polymers 0.000 claims description 14
- 239000004033 plastic Substances 0.000 claims description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 13
- 229910052802 copper Inorganic materials 0.000 claims description 13
- 238000012544 monitoring process Methods 0.000 claims description 11
- 239000000945 filler Substances 0.000 claims description 9
- 239000011521 glass Substances 0.000 claims description 9
- 239000004020 conductor Substances 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 description 80
- 238000005259 measurement Methods 0.000 description 18
- 230000007613 environmental effect Effects 0.000 description 11
- 238000010438 heat treatment Methods 0.000 description 11
- 230000000694 effects Effects 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 230000000087 stabilizing effect Effects 0.000 description 6
- -1 poly(methyl methacrylate) Polymers 0.000 description 5
- 230000002829 reductive effect Effects 0.000 description 5
- 230000008901 benefit Effects 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 230000001105 regulatory effect Effects 0.000 description 4
- 230000004044 response Effects 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 230000004075 alteration Effects 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 229920002873 Polyethylenimine Polymers 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 239000004954 Polyphthalamide Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000004433 Thermoplastic polyurethane Substances 0.000 description 2
- 239000005083 Zinc sulfide Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 2
- 229920001903 high density polyethylene Polymers 0.000 description 2
- 239000004700 high-density polyethylene Substances 0.000 description 2
- 230000001965 increasing effect Effects 0.000 description 2
- 230000000670 limiting effect Effects 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 229920002492 poly(sulfone) Polymers 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 229920006375 polyphtalamide Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- IOLCXVTUBQKXJR-UHFFFAOYSA-M potassium bromide Chemical compound [K+].[Br-] IOLCXVTUBQKXJR-UHFFFAOYSA-M 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229920002725 thermoplastic elastomer Polymers 0.000 description 2
- 239000012815 thermoplastic material Substances 0.000 description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 2
- 229910052984 zinc sulfide Inorganic materials 0.000 description 2
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 2
- PFNQVRZLDWYSCW-UHFFFAOYSA-N (fluoren-9-ylideneamino) n-naphthalen-1-ylcarbamate Chemical compound C12=CC=CC=C2C2=CC=CC=C2C1=NOC(=O)NC1=CC=CC2=CC=CC=C12 PFNQVRZLDWYSCW-UHFFFAOYSA-N 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- 125000002777 acetyl group Chemical class [H]C([H])([H])C(*)=O 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 1
- 229910001634 calcium fluoride Inorganic materials 0.000 description 1
- 230000005465 channeling Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000001010 compromised effect Effects 0.000 description 1
- MPTQRFCYZCXJFQ-UHFFFAOYSA-L copper(II) chloride dihydrate Chemical compound O.O.[Cl-].[Cl-].[Cu+2] MPTQRFCYZCXJFQ-UHFFFAOYSA-L 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- ORUIBWPALBXDOA-UHFFFAOYSA-L magnesium fluoride Chemical compound [F-].[F-].[Mg+2] ORUIBWPALBXDOA-UHFFFAOYSA-L 0.000 description 1
- 229910001635 magnesium fluoride Inorganic materials 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000002991 molded plastic Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000002470 thermal conductor Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/04—Casings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/04—Casings
- G01J5/041—Mountings in enclosures or in a particular environment
- G01J5/045—Sealings; Vacuum enclosures; Encapsulated packages; Wafer bonding structures; Getter arrangements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/04—Casings
- G01J5/046—Materials; Selection of thermal materials
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/06—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/06—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity
- G01J5/061—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity by controlling the temperature of the apparatus or parts thereof, e.g. using cooling means or thermostats
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/06—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity
- G01J5/064—Ambient temperature sensor; Housing temperature sensor; Constructional details thereof
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/06—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity
- G01J5/068—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity by controlling parameters other than temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/08—Optical arrangements
- G01J5/0875—Windows; Arrangements for fastening thereof
Definitions
- One of the most basic IR temperature sensor designs consists of a lens that focuses I R energy onto to a detector.
- the detector can convert the measured energy to an electrical signal, which can be displayed in units of temperature.
- An object’s emissivity is used together with the captured energy in order to convert measured energy into temperature.
- Today, more sophisticated sensors can passively compensate for ambient temperature variations so as to effect accurate measurement of a target object.
- IR sensors One very useful feature of IR sensors is the ability to measure temperatures, e.g., without physical contact. This temperature monitoring ability is especially useful in situations where objects are in motion, e.g., in vehicular applications.
- environmental effects upon the sensor require protective housings and the like to be installed to protect the sensors from environmental elements.
- Protective housings and the like include materials that vary in temperature and contribute to the IR energy path of the sensor thereby making accurate and efficient temperature measurements difficult.
- thermopile IR sensor
- thermal conditions such as a wide range in operating temperatures, temperature rate of change, or static thermal gradients in the sensing region or path.
- Any IR visible object in the path between the sensing component and the measurement target will both deliver energy to the sensor as well as block a portion of the thermal energy emitted by object target; resulting in accurate and inefficient temperature measurement.
- IR infrared
- intermediate media such as optical lens and protective window
- RTDs e.g., sensor housing, baseplate, etc.
- one or more aspects can deliver a final temperature indication response time that is significantly reduced by actively stabilizing the key measurement components.
- Temperature compensation including both sensor steady-state temperature and rate of change dependencies, can be significantly reduced or eliminated by actively stabilizing the key measurement components by way of RTDs together with temperature control components and circuitry.
- Fig. 1 is an illustration of an example infrared (IR) temperature sensor system capable of component stabilization, according to one or more embodiments.
- IR infrared
- FIG. 3 is an illustration of an example top-down view of a self- heating temperature sensor system, according to one or more embodiments.
- Fig. 4 is an illustration of an example electrical schematic of components and circuitry that facilitate temperature stabilization, according to one or more embodiments.
- Fig. 5 is an illustration of an example method for facilitating active temperature stabilization, according to one or more embodiments.
- Fig. 8 is an illustration of an example bottom perspective view of an example sensor assembly, according to one or more embodiments.
- Fig. 9 is an illustration of an example side perspective view of an example sensor assembly, according to one or more embodiments.
- Fig. 12 is an illustration of an example placement of a conductive frame, according to one or more embodiments.
- Fig. 13 is an illustration of an example side perspective view of a protective housing and circuit board base, according to one or more embodiments.
- Fig. 15 is an illustration of glass fillers positioned onto leads, according to one or more embodiments.
- Fig. 17 is an illustration of an example infrared (IR) temperature monitoring system, according to one or more embodiments.
- one or more embodiments provides for stabilization of critical measurement components as well as other‘visible’ objects in an infrared (IR) temperature measurement system.
- One or more embodiments can effectively stabilize interference caused by a protective cap or housing as well as other IR‘visible’ components in close proximity to the IR sensor.
- IR thermal measurement is highly susceptible to the thermal energy state and flux of both the sensing element and IR‘visible’ media in (and around) the target-object path.
- Active stabilization of the thermal energy or absolute temperature of these system components is one underlying principal of this disclosure. This temperature stabilization enhances accuracy and can be performed at an efficient rate as compared to conventional IR sensor systems.
- an IR temperature system may comprise an overmolded sensor assembly in which the overmolding encapsulates and protects components of the sensor assembly.
- the overmolded sensor assembly according to the innovation eliminates the need for a housing seal plug and adhesives or other attachments means for securing a separate protective cover and, thus, does not have the same potential seal vulnerabilities.
- the IR temperature system does not include a separate protective housing.
- the components of the sensor assembly may be overmolded with a protective material.
- Suitable materials for overmolding include most any plastic or suitably rigid material.
- the overmolding material may comprise a thermoplastic material such as a polyamide thermoplastic material.
- the overmolding material may comprise a suitable polymer including acrylonitrile butadiene styrene (ABS), acetal, high-density polyethylene (HDPE), liquid crystal polymers (LCPs), polyethylenimine (PEI) ,poly(methyl methacrylate) (PMMA), polycarbonate (PC), polypropylene (PP), polyphthalamide (PPA), polyphenylene sulfide (PPS) polystyrene (PS), polysulfone (PSU), thermoplastic elastomers (TPE), thermoplastic polyurethanes (TPU), polyether ether ketone (PEEK), or any combination of two or more thereof.
- ABS acrylonitrile butadiene styrene
- HDPE high-density polyethylene
- LCPs liquid crystal polymers
- PEI polyethylenimine
- PMMA poly(methyl methacrylate)
- PC polycarbonate
- PP polypropylene
- PPA
- the overmolding may encase all of the components of the sensor assembly excluding the optical components, connectors and/or cable exits. Any configuration of sensor assembly components described herein may be encased in the overmolding material according to embodiments of the innovation.
- the overmolded sensor assembly may include a tophat, a sensor element, a sensor PCB, wiring (e.g., exit wires), and an inset molded IR transparent or semi-transparent lens.
- the overmolding material and the inset molded IR transparent or semi- transparent lens may comprise an infrared-transmitting material.
- the inset molded IR transparent or semi-transparent lens may comprise zinc sulfide, silicon, germanium, N-BK7, UV fused silicon, zinc selenide, sapphire, calcium fluoride, magnesium fluoride, sodium chloride, potassium bromide, or the like.
- the lens may comprise a material selected from zinc sulfide, silicon, or germanium.
- the overmolding material may be selected from any suitable overmolding material, including those described above.
- the window 104 fluctuates often during operation, a heat source is provided to stabilize its temperature thereby increasing performance of the IR temperature monitoring functionality. Additionally, because the window 104 is most often manufactured of plastic, fluctuations in temperature are slow as plastic is not an efficient conductor of heat.
- An example conductive metal frame equipped with resistive temperature devices (RTDs) will be described in greater below. This conductive metal is deposited on the inner side of the protective housing 102 and can focus heat upon the window 104. It will be understood and appreciated that other aspects can include an optional temperature directional means (e.g., cone-like device) that captures heat from a conductive source equipped with RTDs and channels that heat to the window 104 and components of the sensor 106.
- RTDs resistive temperature devices
- the heating effects and efficiency as described herein can be affected by the low conductivity of the captive air within the protective housing.
- a temperature channeling means e.g., funnel, (illustrated as dashed lines 1 10)
- heat can be contained within the inner area of the cone, thereby enhancing stabilization effects.
- temperature compensation is currently handled by collecting sensor responses over a wide range of temperatures. Thereafter, the indication is adjusted using sensor unique correction factors. This is both time consuming and leads to compromised accuracy. Large thermal masses are added to slow temperature rates of change and to resolve thermal gradients. Unfortunately, this approach leads to enhanced device size and longer thermal response times.
- the measurement system 100 of Fig. 1 can actively control the thermal environment of key components of the IR measurement system. Following is a review of options available to stabilize temperatures.
- One technique of the sensor systems allows the sensor 106 to come into thermal equilibrium shortly after the environment temperature and heat sources stabilize. To accomplish this, the thermopile sensor 106 is exposed directly to the environment with little or no protection from corrosive or harsh environments. This direct exposure is needed in order for its temperature to track the environmental temperature in a reasonable amount of time. Unfortunately, direct exposure results in damage and corrosive elements upon the sensor.
- Another alternative technique employs thermal separation of heat sources, such as power dissipating electronic components, while enhancing passive thermal conduction between a protective cover and environmental media heat transfer. It will be understood that traditional products have limited performance over wide ambient temperature range.
- FIG. 2 a bottom view of an example self-heating temperature sensor 200 is shown.
- Item 202 is illustrative of a baseplate of the thermopile of Fig. 1.
- An RTD 204 capable of detecting and generating heat can be thermally bonded to the baseplate 202. Accordingly, in addition to detecting thermal power, RTD 204 can also generate heat thereby stabilizing the temperature of the baseplate 202, along with other components of the system.
- Lead apertures 206 are shown and provide means by which thermopile leads can traverse the baseplate 202 to accompanying circuitry.
- temperature can be monitored via the RTD.
- the RTDs employed in connection with one or more aspects can both monitor and deliver heat as desired.
- a decision is made at 506 to determine if the monitored temperature is consistent with the desired temperature setpoint. If yes, the methodology returns to 504 to monitor the temperature.
- the protective housing 702 shields a sensor housing 704, for example, from environmental effects.
- the sensor housing 704 can be manufactured of stainless steel or most any other suitably rigid material.
- a sensor optic lens 706 can be fitted atop the sensor housing 704.
- the lens 706 is transparent and can be manufactured of silicon or other suitably transparent or translucent material.
- the RTDs may be capable of use in a mode that can measure temperature and deliver heat simultaneously.
- this single component e.g., RTD
- RTD is capable of functionally measuring temperature while at the same time working to stabilize temperatures of other IR‘visible’ components (e.g., housing, baseplate, optic lens, protective housing window, etc.).
- the RTDs can be controlled by a circuit that facilitates maintenance of a particular temperature or setpoint (e.g., 120 °F).
- protective housing 902 can be equipped with a translucent window 904 on the top such that IR energy can be captured via a sensor or thermopile.
- the bottom section of the protective housing 902 is open such that sensor components can be inserted as described with regard to Fig. 7 supra.
- the open end of the protective housing 902 can be configured to mate to a circuit board 906, e.g., providing a waterproof or hermetic seal. It will be understood that, where appropriate, gaskets can be provided to assist with or enhance the sealing functionality.
- the frame 1400 of Fig. 14 can have a specific heat capacity of 385 J/Kg °K and a conductivity of 398 W/m °K.
- the glass fillers 1502 of Fig. 15 can have a conductivity of 0.836 W/m °K, as seen at 1500.
- heat transfer is a through conduction in a component and wherever two components come into contact.
- the outer surface of the protective housing can convect with the ambient temperature.
- the inner surface of the protective housing and the outer surface of the other components within the protective housing e.g., sensor housing
- convective heat transfer coefficient of 7.9 W/M A 2 K is used.
- a power source of 0.196W was specified at each RTD.
- the ambient temperature was fixed as -20 °C.
- a power source of 0.196W was applied at each RTD.
- the RTDs at the copper frame to reached a temperature of about 120 °F.
- the temperature at RTD near the baseplate for this power is 101 °F. It will be understood that this amount of stabilization is sufficient to enable efficient and accurate IR temperature measurements.
- control circuitry can be provided so as to use the stabilized component temperatures in IR energy to temperature conversions. As a result, effects of IR‘visible’ components are alleviated.
- the sensor component(s) may be thermally coupled to the optics so as to effect passive stabilization.
- the cover e.g., including optics
- the cover can be metalized using a conductive material (e.g., copper).
- the passive conductivity of thermal properties via the conductive metal can be used to stabilize the temperature(s) as described herein.
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Radiation Pyrometers (AREA)
- Glass Compositions (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/988,025 US10782187B2 (en) | 2010-07-08 | 2018-05-24 | Infrared temperature measurement and stabilization thereof |
PCT/US2019/034035 WO2019227065A1 (en) | 2018-05-24 | 2019-05-24 | Infrared temperature measurement and stabilization thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3803300A1 true EP3803300A1 (en) | 2021-04-14 |
EP3803300A4 EP3803300A4 (en) | 2022-03-30 |
Family
ID=68616498
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP19807004.7A Pending EP3803300A4 (en) | 2018-05-24 | 2019-05-24 | Infrared temperature measurement and stabilization thereof |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP3803300A4 (en) |
CA (2) | CA3155403A1 (en) |
WO (1) | WO2019227065A1 (en) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6549346B2 (en) * | 2000-10-17 | 2003-04-15 | Matsushita Electric Industrial Co., Ltd. | Assembled lens, optical head and optical recordable player with them |
EP2097725B1 (en) * | 2006-12-27 | 2019-08-28 | Analog Devices, Inc. | Control aperture for an ir sensor |
US8308353B2 (en) * | 2007-03-26 | 2012-11-13 | Terumo Kabushiki Kaisha | Ear thermometer and method of manufacturing ear thermometer |
EP2347233A4 (en) * | 2008-10-23 | 2017-12-20 | KAZ Europe SA | Non-contact medical thermometer with stray radiation shielding |
JP5531275B2 (en) * | 2009-10-02 | 2014-06-25 | 旭化成エレクトロニクス株式会社 | Infrared sensor and manufacturing method thereof |
US9228902B2 (en) * | 2010-07-08 | 2016-01-05 | Cvg Management Corporation | Infrared temperature measurement and stabilization thereof |
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2019
- 2019-05-24 CA CA3155403A patent/CA3155403A1/en active Pending
- 2019-05-24 EP EP19807004.7A patent/EP3803300A4/en active Pending
- 2019-05-24 WO PCT/US2019/034035 patent/WO2019227065A1/en unknown
- 2019-05-24 CA CA3105500A patent/CA3105500C/en active Active
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Publication number | Publication date |
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CA3105500A1 (en) | 2019-11-28 |
CA3105500C (en) | 2022-06-14 |
EP3803300A4 (en) | 2022-03-30 |
WO2019227065A1 (en) | 2019-11-28 |
CA3155403A1 (en) | 2019-11-28 |
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