EP3787102B1 - Résonateur - Google Patents

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Publication number
EP3787102B1
EP3787102B1 EP19194435.4A EP19194435A EP3787102B1 EP 3787102 B1 EP3787102 B1 EP 3787102B1 EP 19194435 A EP19194435 A EP 19194435A EP 3787102 B1 EP3787102 B1 EP 3787102B1
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EP
European Patent Office
Prior art keywords
resonator
resonator elements
electrically conductive
elements
waveguide region
Prior art date
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EP19194435.4A
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German (de)
English (en)
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EP3787102A1 (fr
Inventor
Efstratios Doumanis
Juha Olli Jokilahti
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Nokia Technologies Oy
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Nokia Technologies Oy
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Priority to EP19194435.4A priority Critical patent/EP3787102B1/fr
Priority to CN202010877317.9A priority patent/CN112448114A/zh
Publication of EP3787102A1 publication Critical patent/EP3787102A1/fr
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/201—Filters for transverse electromagnetic waves
    • H01P1/205—Comb or interdigital filters; Cascaded coaxial cavities
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P7/00—Resonators of the waveguide type
    • H01P7/10—Dielectric resonators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/201—Filters for transverse electromagnetic waves
    • H01P1/205—Comb or interdigital filters; Cascaded coaxial cavities
    • H01P1/2053—Comb or interdigital filters; Cascaded coaxial cavities the coaxial cavity resonators being disposed parall to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/207—Hollow waveguide filters
    • H01P1/208—Cascaded cavities; Cascaded resonators inside a hollow waveguide structure
    • H01P1/2084—Cascaded cavities; Cascaded resonators inside a hollow waveguide structure with dielectric resonators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • H01P11/007—Manufacturing frequency-selective devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P7/00—Resonators of the waveguide type
    • H01P7/04—Coaxial resonators

Definitions

  • This invention relates to resonators and method of manufacture thereof.
  • Radio frequency (RF) filters may comprise one or more resonators.
  • a resonator is a device or system that exhibits resonant behaviour.
  • base transceiver stations use RF filters, for example for reducing interference by rejecting out-of-band signals that may interfere with transmission and/or reception.
  • a low-pass RF filter is commonly used in BTS filter units for removing or attenuating harmonic interference signals from the stopband.
  • a BTS duplexer may comprise a filter, able to separate transmit and receive channels. Filtering systems may employ a plurality of different resonators.
  • cavity filters may be employed, which typically comprise a resonator within a conducting box defining an interior cavity which acts as a waveguide, as illustrated in EP 3 301 752 A1 , US 3 562 677 A and WO 2009/072666 A1 .
  • the cavity may comprise a dielectric material.
  • an apparatus comprising: a dielectric substrate comprising first and second surfaces; first and second electrically conductive elements respectively provided on the first and second surfaces; a post wall provided by a plurality of electrically conductive posts, each of which is on or passes through the substrate to interconnect the first and second electrically conductive elements, the post wall defining a waveguide region in the substrate; and a resonator comprising one or more first resonator elements extending from the first electrically conductive element and into the waveguide region, the one or more first resonator elements not contacting the second electrically conductive element, and one or more second resonator elements extending from the second electrically conductive element and into the waveguide region, the one or more second resonator elements not
  • the first and second substrate surfaces may be opposite one another.
  • the one or more first resonator elements and the one or more second resonator elements may be arranged parallel with one another in the waveguide region.
  • the apparatus may comprise a plurality of said first resonator elements, spatially arranged so as to provide in a section of the waveguide region a circular shape, or other suitable shape.
  • the apparatus may comprise a plurality of said second resonator elements, spatially arranged to provide in the section of the waveguide region a substantially circular shape, or other shape, which is concentric with that provided by the plurality of first resonator elements.
  • the one or more first and second resonator elements may comprise electrically conductive posts.
  • the dielectric substrate may be a ceramic material, or an organic or polymer material.
  • the post wall may define a plurality of adjacent waveguide regions within the dielectric substrate, and the apparatus may further comprise a signal coupling means between the adjacent waveguide regions, and wherein a said resonator may be provided in each of the waveguide regions.
  • the apparatus may provide a filter apparatus for a telecommunications base station.
  • a method comprising: providing first and second electrically conductive elements respectively on first and second surfaces of a dielectric substrate; providing a post wall comprising a plurality of electrically conductive posts such that each is on or passes through the substrate to interconnect the first and second electrically conductive elements, the post wall defining a waveguide region in the substrate; and providing a resonator comprising one or more first resonator elements extending from the first electrically conductive element and into the waveguide region, the one or more first resonator elements not contacting the second electrically conductive element, and one or more second resonator elements extending from the second electrically conductive element and into the waveguide region, the one or more second resonator elements not contacting the first electrically conductive element, wherein the one or more first resonator elements and the one or more second resonator elements extend into the waveguide region in opposite directions, characterized in that the one or more first resonator elements and the one or more second resonator elements at least
  • the first and second substrate surfaces may be provided substantially opposite one another.
  • the provided one or more first resonator elements and the one or more second resonator elements may be arranged substantially parallel with one another in the waveguide region.
  • the method may further comprise providing a plurality of said first resonator elements, spatially arranged so as to provide in a section of the waveguide region a substantially circular shape, although other shapes may be employed.
  • the one or more first and second resonator elements may comprise electrically conductive posts.
  • the dielectric substrate may be a ceramic material, or an organic or polymer material.
  • the post wall may define a plurality of adjacent waveguide regions within the dielectric substrate, and the method may further comprise providing a signal coupling means between the adjacent waveguide regions, and wherein a said resonator may be provided in each of the waveguide regions.
  • Embodiments described herein relate to resonators, for example as may be used in filters and also to filter systems that may comprise one or more of said resonators.
  • the resonators described herein may however be used in any field or application.
  • Embodiments particularly, though not exclusively, relate to radiofrequency (RF) resonators and filters. Embodiments may also relate to methods of manufacture of such resonators and filters.
  • RF radiofrequency
  • Embodiments particularly, though not exclusively, relate to RF filters for use in base transceiver stations (BTS) of mobile communications networks.
  • BTS base transceiver stations
  • Compactness may refer to how small the volume occupied by a resonator is, whilst providing required RF performance. Integration may refer to how one can provide one or more of such resonators on a chip or substrate, possibly with other components.
  • Next generation communications standards such as the 5G standard, may involve larger numbers of devices in telecommunications equipment such as the BTS. There is therefore a need for lower physical volume filters and / or high integration. Cost is also a factor.
  • Substrate integrated waveguides may be used for the transmission of electromagnetic waves, generally being planar structures similar to integrated circuits (ICs). As such, they can be fabricated using standard IC or printed circuit board (PCB) processes and integrated into ICs providing one or more other resonators or other functionality.
  • Example embodiments may employ SIW processes to provide one or more resonators, for example for 5G and/or other mm-wave systems.
  • FIG. 1 shows a simplified cellular BTS 1 which may be part of, or associated with, an antenna tower 3 carrying one or more RF antennas 5 in signal communication with the BTS 1 using one or more conductors 7.
  • the BTS 1 is usually housed in an enclosure located at or near the base of the antenna tower 3, but it is also known to provide the BTS or at least the radio head towards the top of the antenna tower, closely coupled to the antenna, to minimise feeder cable loss which may increase with higher frequencies, and may be a driving factor for lower size and weight of such equipment.
  • the BTS 1 is in signal communication with a backhaul communications system 11 which provides intermediate links to a core network.
  • various analogue and digital signal processing modules for example, one or more RF filter units 9 may be provided which employ one or more resonators.
  • a plurality of RF filter units 9 may be provided, serving different purposes. These may be low-pass, high-pass and/or band-pass filter units.
  • a RF filter unit 9 may comprise one or more low-pass filters for removing or attenuating spurious signals from the stopband. Such spurious signals may, for example, result from harmonic interference.
  • the RF filter unit 9 may comprise one or more band-pass filters for passing a selected range of frequencies whilst rejecting out-of-band frequencies.
  • the RF filter unit 9 may for example comprise a duplexer for microwave telecommunication applications. Duplexers are provided at base stations, as represented in Figure 1 , for enabling both transmit and receive channels to use the same filter unit.
  • the RF filter unit 9 may comprise an enclosure housing or providing one or more filters of one or more of the low-pass, high-pass and band-pass types.
  • Embodiments herein concern single and multi-mode cavity filters.
  • Cavity filters typically comprise one or more resonators within a conducting box which defines an interior cavity within which signals propagate. The cavity provides an internal waveguide for RF signals.
  • Cavity filters offer a high-Q (low loss) characteristic and sharp cut-off, particularly when used with one or more dielectric resonators.
  • Multi-mode filters typically implement two or more resonators in a single physical body, such that reductions in filter size can be obtained.
  • a multi-mode filter may have two or more resonant peaks at different predetermined frequencies.
  • Dielectric resonators which may be comprised within the cavity of the cavity filter, may be used to provide the different modes at respective resonant frequencies, which may be determined by the dimensions of the dielectric resonator.
  • a ceramic block is an example dielectric that is typically coated in a metallic layer, for example silver, to provide the cavity and prevent leakage of RF energy which will adversely affect the filter performance.
  • Embodiments herein describe cavity filters which comprise one or more dielectric resonators, wherein the dielectric material used may be ceramic, for example low temperature co-fired ceramic (LTCC) which may be produced in accordance with example embodiments using LTCC techniques.
  • LTCC low temperature co-fired ceramic
  • LTCC may provide a multi-layer glass ceramic substrate which is co-fired with low resistance conductors such as copper at a low firing temperature, usually below 1000 degrees centigrade. LTCC production is generally low cost.
  • example embodiments provide an apparatus comprising a dielectric substrate comprising first and second surfaces, with first and second electrically conductive elements respectively provided on the first and second surfaces.
  • the dielectric substrate may comprise any suitable substrate such as ceramic / LTCC.
  • the conductive elements may comprise metal, for example metalized layers deposited on the respective first and second surfaces.
  • Example embodiments may also comprise a post wall provided by plurality of electrically conductive posts, e.g. vias to use IC fabrication terminology, each of which is on or which passes through the substrate to interconnect the first and second electrically conductive elements.
  • the post wall may define a waveguide region in the substrate.
  • a resonator comprising one or more first resonator elements, connected to, and extending from, the first electrically conductive element and into the waveguide region, but not contacting the second electrically conductive element, and also one or more second resonator elements, connected to, and extending from, the second electrically conductive element and into the waveguide region but not contacting the first electrically conductive element.
  • blind resonator element may be used hereinafter to refer to such resonator elements that are directly and/or electrically connected at one part to one of the electrically conductive elements but which have a free end within the waveguide region not contacting the other conductive element.
  • a post wall comprises a plurality of discrete, generally elongate posts which may be formed of metal.
  • the posts may synthesise an electromagnetic waveguide by virtue of their spatial arrangement, which may need to be of a suitable density, i.e. with adjacent posts sufficiently close to suitably contain electromagnetic energy.
  • Posts may comprise metallized "via holes" as well as solid elongate structures.
  • the posts electrically connect the first and second conductors on the respective surfaces and hence may extend all the way though the substrate or they may be provided on the outer surface of the substrate, e.g. on or partially within a side wall.
  • the arrangement of post walls may provide similar guided wave and mode characteristics to conventional waveguides, but are cheaper to produce and are lighter.
  • a blind resonator element may be formed and arranged similar to a post of the post wall, being either a solid post or plated via hole, but is one that does not extend all the way between the first and second conductors; rather, one part or end is connected to, say, the first conductor and the other terminates within the substrate, stopping short of the second conductor.
  • the dielectric substrate may comprise a substantially cuboid block of material, having six rectangular sides, including first and second major surfaces, usually opposite one another, which carry the first and second conductors respectively.
  • the first and second conductors may be metalized plates, which are substantially planar, and which may be deposited on the first and second major surfaces in the conventional way.
  • the one or more first blind resonator elements and the one or more second blind resonator elements may be arranged substantially parallel with one another in the waveguide region.
  • the first blind resonator elements may extend generally downwards from the first conductor and the second blind resonator elements may extend generally upwards from the second conductor. They extend into the waveguide region in substantially opposite directions and at least partially overlap, i.e. when viewed from a direction perpendicular to the major surfaces, or, put another way, when viewed from a direction which is substantially non-parallel to the extent of the one or more first and second resonator elements.
  • the first blind resonator elements may be spatially arranged so as to provide in a section of the waveguide region a substantially circular shape, although other shapes such as rectangular oval or elliptical shapes may be provided .
  • the plurality of second blind resonator elements may be spatially arranged to provide in the section of the waveguide region a substantially circular, or other alternative shape, which may be concentric, i.e. sharing the same axis, within the shape provided by the plurality of first blind resonator elements when viewed from above or below.
  • the plurality of second blind resonator elements may share substantially the same vertical axis X-X as that of plurality of first blind resonator elements.
  • FIG. 2A is a partially-exploded perspective view of an apparatus 20 according to an embodiment.
  • the apparatus 20 comprises a cuboid block of a solid substrate 22, having upper and lower major surfaces 23A, 23B and four side surfaces.
  • the substrate 22 may be partially filled with another substance, such as air.
  • the upper surface 23A has a first metal layer 24 deposited thereon and the lower surface 23B a second metal layer 26 deposited thereon.
  • the first and second metal layers 24, 26 may be substantially planar.
  • a first plurality of blind resonator elements 28A are each connected at one end to the first metal layer 24 and extend into substrate 22 but stop short of the second metal layer 26.
  • the arrangement of the first blind resonator elements 28A is substantially that of a circle, when viewed from above, as shown in Figure 2B . Collectively, the first blind resonator elements 28A provide part of a resonator.
  • a second plurality of blind resonator elements28B are each connected at one end to the second metal layer 26 (not shown) and extend into the substrate 22 in the opposite direction to that of the first plurality of blind resonator elements28A, but stop short of the first metal layer 24.
  • the arrangement of the second blind resonator elements28B is substantially that of a circle, when viewed from above, as shown in Figure 2D . It will be understood that the first and second blind resonator elements28A, 28B partially overlap when viewed from one side, e.g. when viewed from a direction which is substantially non-parallel to the extent of the one or more first and second resonator elements.
  • the circle or other shape formed by one set may be concentric with the other set, i.e. it may have a common axis X-X.
  • first and second blind resonator elements28A, 28B provide, in conjunction with a post wall 29 to be described below, a resonator comprising a coaxial set of overlapping blind resonator elements 28A, 28B within the post wall.
  • each post of the post wall 29 connects the first and second metal layers 24, 26.
  • the spatial arrangement of the posts of said post wall 29 is that of a rectangle, or other shape, when viewed from above, defining within the interior of its four "walls" a waveguide region.
  • the resonator provided by the first and second blind resonator elements 28A, 28B may be formed using SIW processes and fabrication technology.
  • the result is a dense and integrated structure that is simple to produce, is low cost, is robust and has a relatively small volume.
  • the process augments low tolerances compared with, for example, implementing a similar resonator using two machined metallic cylinders overlapping each other in an air cavity with a small gap in-between, i.e. in close proximity. This may be difficult to implement in practice, and is susceptible to mechanical tolerances, whereas embodiments described herein do not have this drawback.
  • Minimizing the gap between two or more sets of resonator elements 28A, 28B is more straightforward to achieve using SIW and related fabrication processes. Low tolerances are a critical part of 5G and other mm-wave applications.
  • Figures 3A - 3C respectively show the output of computer simulations representing the electric field, magnetic field and surface current density for the Figure 2 resonator at the fundamental mode.
  • the results shown in Figures 3A - 3C demonstrate that this resonator exhibits a typical coaxial resonator magnetic field distribution.
  • the electric field is contained in the middle of the solid dielectric block between the overlapping set of blind resonator elements 28A, 28B.
  • the electric field distribution demonstrates the concept of low tolerances, since once can notice that a blind resonator element's slight disposition should not have a big effect into the macroscopic performance of the resonator.
  • Figures 2A - 2D show an apparatus providing a single cavity resonator and similar principles can be applied to a multi-cavity resonator, as now described with reference to Figure 4 .
  • a plurality of resonators may be implemented in this manner using the same or different layers as the initial structure, i.e. using physical stacking of resonators.
  • Cross-coupling between the different resonators on different layers may be achieved using, for example, metal probes and/or openings (irises).
  • an apparatus comprises a cuboid block of a solid substrate 41, having upper and lower major surfaces 42A, 42B and four side surfaces.
  • the upper surface 42A has a first metal layer (not shown) deposited thereon and the lower surface 42B a second metal layer (not shown) deposited thereon.
  • the first and second metal layers may be substantially planar.
  • a first plurality of blind resonator elements 44 are each connected at one end to the first metal layer and extend into substrate 41 but stop short of the second metal layer. The same is true of a second and third plurality of blind resonator elements 45, 46.
  • the arrangement of the first, second and third plurality of blind resonator elements 44, 45, 46 is substantially that of a circle, or other shape, such as an oval or elliptical or similar, when viewed from above.
  • each set of blind resonator elements provide one part of a resonator.
  • fourth to sixth pluralities of blind resonator elements respectively concentric with, e.g. sharing a common vertical axis, the first to third pluralities of resonator elements 44, 45, 46, which extend in the opposite direction from the second metal layer on the lower surface 42B.
  • These 'pairs' of resonator elements provide three co-axial type structures.
  • the physical properties of the different pluralities of blind resonator elements can differ between individual elements. They can differ in terms of, for example, the number of resonator elements, the diameter of the circle or other shape, and also in terms of their length and the diameter of the elements.
  • the protrusion length or depth can also differ.
  • metal posts of a post wall arranged around, or just within, the substrate 41, e.g. similar to the post wall 29 in Figures 2C and 2D .
  • Each of the three resonators indicated partially in Figure 4 is located within a respective waveguide portion 43A - 43C.
  • Adjacent waveguide portions 43A - 43B and 43B - 43C are divided by means of opposed pairs of stub-like walls 47 that are inward extensions of the perimeter post wall and are similarly formed of metal posts or metalized via holes that connect to both the first and second metal layers.
  • the shape of the irises 48 can control aspects of the coupling that may be provided at the design stage.
  • the first and third waveguide portions 43A, 43C also comprise input and output excitation ports 49A, 49B for input and output of RF signals.
  • the ports 49A, 49B may be provided by blind or fully interconnecting posts. Excitation may be provided by other means, such as by micro strip excitation or coplanar waveguide excitation (CPW).
  • CPW coplanar waveguide excitation
  • any number of waveguide portions may be provided to provide a different filter response. It should also be appreciated that greater than two rows / circles of blind posts may be provided in a given resonator.
  • tuning means may be provided using conventional means, such as by providing one or more protruding devices such as screws, or by modifying external surfaces.
  • the ceramic block 22, 41 may be replaced with any suitable dielectric material, for example a printed circuit board (PCB) or other media, such as LTCC media.
  • PCB printed circuit board
  • Organic or polymer materials may also be used instead of ceramic.
  • the ceramic (or other material) block 22, 41 may be solid or may comprise one or more air pockets.
  • the relative permittivity of the ceramic block may be in the order of 2 - 12, but can be outside of these numbers.
  • Figure 5 is a graph showing computer simulated test results of the Figure 4 three-pole resonator apparatus 40.
  • the graph shows the s-parameter frequency response, particularly for Si,i and S2,1 parameters, and indicates a bandwidth of approximately 458 MHz, a fractional bandwidth of approximately 10.06 % and an insertion loss (IL) of approximately 0.4 dB.
  • Figure 6 is a flow diagram illustrating processing operations in manufacturing or fabricating a resonator apparatus according to example embodiments.
  • the order of the operations is not necessarily indicative of a required order of processing and further operations may be involved.
  • the operations may comprise a first operation of providing (61) first and second electrically conductive elements respectively on first and second surfaces of a dielectric substrate.
  • a further operation may comprise providing (62) a post wall comprising a plurality of electrically conductive posts such that each is on or passes through the substrate to interconnect the first and second electrically conductive elements, the post wall defining a waveguide region in the substrate.
  • a further operation may comprise providing (63) a resonator comprising one or more first blind resonator elements extending from the first electrically conductive element and into the waveguide region and one or more second blind resonator elements extending from the second electrically conductive element and into the waveguide region.
  • Embodiments therefore provide a cavity filter apparatus which comprises one or more dielectric resonators constructed and arranged to support one or more predetermined resonant modes.
  • the structure and production methods which may be used may produce a filter apparatus that is particularly suited to future telecommunications requirements, including those of low cost and higher density.
  • Dielectric resonators as described herein may also be provided in combination with other resonator technologies to provide hybrid technologies such as hybrid filters.
  • Figures 7A and 7B show a hybrid apparatus 70 which may comprise the Figure 4 dielectric resonator apparatus 40 according to an example embodiment mounted as a 'lid' for a more conventional cavity resonator 72.
  • the hybrid apparatus 70 may provide a Frequency Division Duplexing (FDD) filter to separate transmitted (higher power / performance) signals to the conventional cavity resonator 72 and lower power received signals to the dielectric resonator apparatus 40.
  • FDD Frequency Division Duplexing
  • Another option may be to utilise the dielectric resonator apparatus 40 as a low-pass filter or as a notch filter to assist the conventional cavity resonator 72 in particular use cases.
  • Suitable coupling means may couple signals between the dielectric resonator apparatus 40 and the conventional cavity resonator 72, e.g. coupling irises. Cavity walls are not shown in Figures 7A and 7B .
  • Figures 8A and 8B show how the Figure 4 dielectric resonator apparatus 40 may comprise a section or structure 80 that utilises a micro strip or coplanar waveguide excitation (CPW) feed and/or provides an additional micro strip or CPW filter, e.g. for additional low-pass or notch filtering.
  • CPW coplanar waveguide excitation
  • further sets of resonator elements for example additional to the first and second pluralities of resonator elements 28A, 28B described above with respect to Figures 2A- 2D may be provided.
  • at least a third "ring" or other shape of resonator elements by pass within or through the waveguide region in the dielectric substrate.
  • Figure 9 for example, which is a modified version of the Figure 2A- 2D structure, there is shown how a third ring of resonator elements 28C is provided within the first and second sets of resonator elements 28A, 28B.

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Claims (13)

  1. Appareil (20) comprenant :
    un substrat diélectrique (22) comprenant des première et deuxième surfaces (23A, 23B) ;
    des premier et deuxième éléments électro-conducteurs (24, 26) prévus respectivement sur les première et deuxième surfaces ;
    une paroi de montants (29) fournie par une pluralité de montants électro-conducteurs, dont chacun est sur ou passe à travers le substrat pour interconnecter les premier et deuxième éléments électro-conducteurs, la paroi de montants définissant une région de guide d'ondes dans le substrat ; et
    un résonateur comprenant un ou plusieurs premiers éléments de résonateur (28A) s'étendant à partir du premier élément électroconducteur et à l'intérieur de la région de guide d'ondes, les un ou plusieurs premiers éléments de résonateur n'étant pas en contact avec le deuxième élément électroconducteur, et un ou plusieurs deuxièmes éléments de résonateur (28B) s'étendant à partir du deuxième élément électroconducteur et à l'intérieur de la région de guide d'ondes, les un ou plusieurs deuxièmes éléments de résonateur n'étant pas en contact avec le premier élément électroconducteur,
    dans lequel les un ou plusieurs premiers éléments de résonateur et les un ou plusieurs deuxièmes éléments de résonateur s'étendent à l'intérieur de la région de guide d'ondes dans des directions opposées, caractérisé en ce que les uns ou plusieurs premiers éléments de résonateur et les uns ou plusieurs deuxièmes éléments de résonateur se chevauchent au moins en partie lorsqu'ils sont observés à partir d'une direction qui est non parallèle à l'étendue des un ou plusieurs premiers et deuxièmes éléments de résonateur.
  2. Appareil selon la revendication 1, dans lequel les première et deuxième surfaces de substrat sont opposées l'une à l'autre.
  3. Appareil selon la revendication 1 ou revendication 2, dans lequel les uns ou plusieurs premiers éléments de résonateur et les uns ou plusieurs deuxièmes éléments de résonateur sont agencés parallèlement les uns aux autres dans la région de guide d'ondes.
  4. Appareil selon l'une quelconque des revendications précédentes, comprenant une pluralité desdits premiers éléments de résonateur, agencés spatialement de manière à fournir dans une section de la région de guide d'ondes une forme circulaire.
  5. Appareil selon la revendication 4, comprenant une pluralité desdits deuxièmes éléments de résonateur, agencés spatialement pour fournir dans la section de la région de guide d'ondes une forme circulaire qui est concentrique avec celle fournie par la pluralité de premiers éléments de résonateur.
  6. Appareil selon l'une quelconque des revendications précédentes, dans lequel les un ou plusieurs premiers et deuxièmes éléments de résonateur comprennent des montants électro-conducteurs.
  7. Appareil selon l'une quelconque des revendications précédentes, dans lequel le substrat diélectrique est un matériau céramique.
  8. Appareil selon l'une quelconque des revendications précédentes, dans lequel la paroi de montants définit une pluralité de régions de guide d'ondes adjacentes dans le substrat diélectrique, l'appareil comprenant en outre un moyen de couplage de signal entre les régions de guide d'ondes adjacentes, et dans lequel un dit résonateur est fourni dans chacune des régions de guide d'ondes.
  9. Appareil de filtrage pour une station de base de télécommunications comprenant l'appareil selon l'une quelconque des revendications précédentes.
  10. Procédé comprenant :
    la fourniture (61) de premier et deuxième éléments électro-conducteurs (24, 26) respectivement sur des première et deuxième surfaces d'un substrat diélectrique (22) ;
    la fourniture (62) d'une paroi de montants (29) comprenant une pluralité de montants électro-conducteurs de telle sorte que chacun est sur ou passe à travers le substrat pour interconnecter les premier et deuxième éléments électro-conducteurs, la paroi de montants définissant une région de guide d'ondes dans le substrat ; et
    la fourniture (63) d'un résonateur comprenant un ou plusieurs premiers éléments de résonateur (28A) s'étendant à partir du premier élément électroconducteur et à l'intérieur de la région de guide d'ondes, les un ou plusieurs éléments de résonateur n'étant pas en contact avec le deuxième élément électroconducteur, et (64) un ou plusieurs deuxièmes éléments de résonateur (28B) s'étendant à partir du deuxième élément électroconducteur et à l'intérieur de la région de guide d'ondes, les un ou plusieurs deuxièmes éléments de résonateur n'étant pas en contact avec le premier élément électroconducteur,
    dans lequel les un ou plusieurs premiers éléments de résonateur fournis et les un ou plusieurs deuxièmes éléments de résonateur s'étendent à l'intérieur de la région de guide d'ondes dans des directions opposées, caractérisé en ce que les un ou plusieurs premiers éléments de résonateur et les un ou plusieurs deuxièmes éléments de résonateur se chevauchent au moins en partie lorsqu'ils sont observés à partir d'une direction qui est non parallèle à l'étendue des un ou plusieurs premiers et deuxièmes éléments de résonateur.
  11. Procédé selon la revendication 10, dans lequel les première et deuxième surfaces de substrat sont fournies à l'opposé l'une de l'autre.
  12. Procédé selon la revendication 10 ou revendication 11, dans lequel les un ou plusieurs premiers éléments de résonateur fournis et les un ou plusieurs deuxièmes éléments de résonateur sont agencés parallèlement les uns aux autres dans la région de guide d'ondes.
  13. Procédé selon l'une quelconque des revendications 10 à 12, comprenant en outre la fourniture d'une pluralité desdits premiers éléments de résonateur, agencés spatialement de manière à fournir dans une section de la région de guide d'ondes une forme circulaire.
EP19194435.4A 2019-08-29 2019-08-29 Résonateur Active EP3787102B1 (fr)

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009072666A1 (fr) * 2007-12-07 2009-06-11 Panasonic Corporation Dispositif rf stratifié muni de résonateurs verticaux

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3562677A (en) * 1968-11-22 1971-02-09 Corning Glass Works Cylindrical band-pass interdigital and comb-line filters
EP3104452A1 (fr) * 2015-06-10 2016-12-14 Alcatel Lucent Résonateur, filtre hyperfréquence et procédé de filtrage de fréquences radio
EP3301752A1 (fr) * 2016-09-28 2018-04-04 Nokia Technologies Oy Résonateur
CN106654495B (zh) * 2016-12-19 2019-01-11 中国电子科技集团公司第二十研究所 一种x波段基于基片集成波导同轴腔的滤波功分器

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009072666A1 (fr) * 2007-12-07 2009-06-11 Panasonic Corporation Dispositif rf stratifié muni de résonateurs verticaux

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CN112448114A (zh) 2021-03-05

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