EP3764169B1 - Method for frosting some parts of a silicon timepiece component - Google Patents
Method for frosting some parts of a silicon timepiece component Download PDFInfo
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- EP3764169B1 EP3764169B1 EP19185364.7A EP19185364A EP3764169B1 EP 3764169 B1 EP3764169 B1 EP 3764169B1 EP 19185364 A EP19185364 A EP 19185364A EP 3764169 B1 EP3764169 B1 EP 3764169B1
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- etching
- silicon surface
- silicon
- sacrificial layer
- layer
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims description 70
- 229910052710 silicon Inorganic materials 0.000 title claims description 62
- 239000010703 silicon Substances 0.000 title claims description 62
- 238000000034 method Methods 0.000 title claims description 48
- 238000005530 etching Methods 0.000 claims description 56
- 239000011347 resin Substances 0.000 claims description 33
- 229920005989 resin Polymers 0.000 claims description 33
- 238000000708 deep reactive-ion etching Methods 0.000 claims description 26
- 238000002161 passivation Methods 0.000 claims description 15
- 238000000151 deposition Methods 0.000 claims description 9
- 238000001020 plasma etching Methods 0.000 claims description 9
- 238000000137 annealing Methods 0.000 claims description 4
- 150000002500 ions Chemical class 0.000 claims description 3
- 230000001788 irregular Effects 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 14
- 238000004519 manufacturing process Methods 0.000 description 10
- 238000007788 roughening Methods 0.000 description 8
- 229910004298 SiO 2 Inorganic materials 0.000 description 7
- 235000012239 silicon dioxide Nutrition 0.000 description 7
- 239000000377 silicon dioxide Substances 0.000 description 7
- 238000000206 photolithography Methods 0.000 description 6
- 239000000470 constituent Substances 0.000 description 5
- 238000005459 micromachining Methods 0.000 description 5
- 230000008021 deposition Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000007789 gas Substances 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 101100277553 Caenorhabditis elegans dep-1 gene Proteins 0.000 description 1
- 241000287107 Passer Species 0.000 description 1
- 241001354471 Pseudobahia Species 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000013043 chemical agent Substances 0.000 description 1
- 239000013626 chemical specie Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000003902 lesion Effects 0.000 description 1
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- 230000007246 mechanism Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G04—HOROLOGY
- G04B—MECHANICALLY-DRIVEN CLOCKS OR WATCHES; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS
- G04B19/00—Indicating the time by visual means
- G04B19/04—Hands; Discs with a single mark or the like
- G04B19/042—Construction and manufacture of the hands; arrangements for increasing reading accuracy
-
- G—PHYSICS
- G04—HOROLOGY
- G04B—MECHANICALLY-DRIVEN CLOCKS OR WATCHES; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS
- G04B13/00—Gearwork
- G04B13/02—Wheels; Pinions; Spindles; Pivots
-
- G—PHYSICS
- G04—HOROLOGY
- G04B—MECHANICALLY-DRIVEN CLOCKS OR WATCHES; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS
- G04B15/00—Escapements
- G04B15/14—Component parts or constructional details, e.g. construction of the lever or the escape wheel
-
- G—PHYSICS
- G04—HOROLOGY
- G04B—MECHANICALLY-DRIVEN CLOCKS OR WATCHES; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS
- G04B17/00—Mechanisms for stabilising frequency
- G04B17/04—Oscillators acting by spring tension
- G04B17/06—Oscillators with hairsprings, e.g. balance
- G04B17/066—Manufacture of the spiral spring
-
- G—PHYSICS
- G04—HOROLOGY
- G04B—MECHANICALLY-DRIVEN CLOCKS OR WATCHES; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS
- G04B19/00—Indicating the time by visual means
- G04B19/06—Dials
- G04B19/12—Selection of materials for dials or graduations markings
-
- G—PHYSICS
- G04—HOROLOGY
- G04D—APPARATUS OR TOOLS SPECIALLY DESIGNED FOR MAKING OR MAINTAINING CLOCKS OR WATCHES
- G04D3/00—Watchmakers' or watch-repairers' machines or tools for working materials
- G04D3/0074—Watchmakers' or watch-repairers' machines or tools for working materials for treatment of the material, e.g. surface treatment
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Micromachines (AREA)
- Weting (AREA)
Description
La présente invention concerne un procédé pour dépolir par endroits une surface en silicium. Elle concerne plus particulièrement un procédé pour dépolir par endroits une surface en silicium d'un wafer dans lequel on va ensuite microusiner un composant horloger ou, alternativement, pour dépolir par endroits une surface en silicium du composant horloger lui-même ou de l'ébauche de celui-ci.The present invention relates to a method for roughening a silicon surface in places. It relates more particularly to a method for roughening in places a silicon surface of a wafer in which a watch component will then be micro-machined or, alternatively, for roughening in places a silicon surface of the watch component itself or of the blank of this one.
Dans le présent document, le verbe « dépolir » a le sens d'attaquer une surface de façon à lui ôter son « poli ». Une surface est ainsi qualifiée de « dépolie » lorsqu'elle présente une rugosité suffisante pour diffuser ou absorber la lumière incidente. Finalement, dans le contexte du présent document, une surface est dite rugueuse lorsqu'elle présente un relief irrégulier comprenant des creux et des pics, ces creux, ou cratères, présentant une profondeur allant d'une centaine de nanomètres à un micromètre.In this document, the verb "to roughen" has the meaning of attacking a surface so as to remove its "polish". A surface is thus qualified as “frosted” when it has sufficient roughness to diffuse or absorb the incident light. Finally, in the context of the present document, a surface is said to be rough when it has an irregular relief comprising hollows and peaks, these hollows, or craters, having a depth ranging from a hundred nanometers to one micrometer.
Reflet à la fois de la mode et de la technique, le monde de l'horlogerie accorde une place toute particulière à l'esthétique. C'est probablement la raison pour laquelle l'emploi de composants décorés y est monnaie courante. On pense en particulier (mais pas exclusivement) aux cadrans de montre, qui sont souvent ornés de gravures. Ces décorations traditionnelles existent dans de nombreuses variétés, ciselage, guillochage, perlage, soleillage, ou encore côtes de Genève, etc.Reflecting both fashion and technology, the world of watchmaking places a special emphasis on aesthetics. This is probably the reason why the use of decorated components is commonplace there. One thinks in particular (but not exclusively) of watch dials, which are often adorned with engravings. These traditional decorations exist in many varieties, chiselling, guillochage, beading, sunburst, or Côtes de Genève, etc.
Aujourd'hui, de plus en plus de composants horlogers sont réalisés en silicium. Or ce matériau possède un grand inconvénient : il est fragile. Si on le soumet à des contraintes qui dépassent une certaine intensité, il se casse sans déformation plastique préalable. En effet, le silicium n'est absolument pas ductile, et on comprendra donc qu'il ne peut pas être gravé en utilisant les techniques traditionnelles des horlogers.Today, more and more watch components are made of silicon. However, this material has a major drawback: it is fragile. If it is subjected to stresses that exceed a certain intensity, it breaks without prior plastic deformation. Indeed, silicon is absolutely not ductile, and it will therefore be understood that it cannot be engraved using the traditional techniques of watchmakers.
Le silicium cristallin est opaque et réfléchit la lumière. Son aspect est celui d'un métal gris foncé. Cette teinte peut donner une apparence un peu austère aux pièces réalisées en silicium. Dans le but de remédier à cet inconvénient et de donner une apparence un peu plus gaie à ces composants, on a proposé de revêtir leur surface d'une mince couche de dioxyde transparent. En effet, cette couche de dioxyde de silicium est le théâtre de phénomènes d'interférences lumineuses accompagnés de l'apparition de couleurs irisées. Ces dernières ont notamment la particularité d'être dépendantes de l'angle d'observation. Les composants qui présentent de telles surfaces aux reflets arc-en-ciel sont très appréciés. Il n'en reste pas moins qu'un besoin demeure pour l'homme du métier de disposer d'un procédé lui permettant de travailler l'aspect des surfaces des composants horloger en silicium, d'une manière qui permette de conférer à chaque modèle de pièces d'horlogerie une personnalité proprement unique.Crystalline silicon is opaque and reflects light. Its appearance is that of a dark gray metal. This shade can give a somewhat austere appearance to parts made of silicon. In order to remedy this drawback and to give a somewhat more cheerful appearance to these components, it has been proposed to coat their surface with a thin layer of transparent dioxide. Indeed, this layer of silicon dioxide is the scene of light interference phenomena accompanied by the appearance of iridescent colors. The latter have the particularity of being dependent on the angle of observation. Components that feature such rainbow-colored surfaces are highly valued. The fact remains that a need remains for those skilled in the art to have a method allowing them to work on the appearance of the surfaces of watchmaking components in silicon, in a way that makes it possible to confer on each model of timepieces a truly unique personality.
On connaît des documents décrivant des procédés utilisant la gravure de type DRIE sur des substrats en silicium, par exemple
Un but de la présente invention est de remédier aux problèmes de l'art antérieur qui viennent d'être expliqués. La présente invention atteint ce but ainsi que d'autres en fournissant un procédé pour dépolir par endroits une surface en silicium, qui est conforme à la revendication 1 annexée.An object of the present invention is to remedy the problems of the prior art which have just been explained. The present invention achieves this and other objects by providing a method for spot-etching a silicon surface which is in accordance with appended claim 1.
Conformément à l'étape (a) du procédé de l'invention, on délimite d'abord les endroits de la surface en silicium qui seront dépolis en réalisant un masque de gravure comportant des ouvertures.In accordance with step (a) of the method of the invention, the places of the silicon surface which will be roughened are first delimited by producing an etching mask comprising openings.
Conformément à l'étape (b) du procédé de l'invention, on dépose une couche sacrificielle de résine sur le masque de gravure et à l'intérieur de ses ouvertures. Conformément à l'invention, la réalisation de la couche sacrificielle ne fait intervenir, ni exposition, ni recuit de la résine de la couche sacrificielle. Un avantage de cette particularité est qu'elle contribue à raccourcir et à simplifier la mise en oeuvre de l'étape (b) du procédé.In accordance with step (b) of the method of the invention, a sacrificial layer of resin is deposited on the etching mask and inside its openings. In accordance with the invention, the production of the sacrificial layer does not involve either exposure or annealing of the resin of the sacrificial layer. An advantage of this feature is that it contributes to shortening and simplifying the implementation of step (b) of the method.
Conformément à l'étape (c) du procédé de l'invention, on attaque ensuite la couche de résine sacrificielle par gravure ionique réactive profonde (habituellement désignée par son acronyme anglais « DRIE »), de manière à transférer des inhomogénéités de la couche sacrificielle sur les endroits à dépolir de la surface en silicium. La gravure ionique réactive profonde est la technique de gravure la plus utilisée pour le micro-usinage de composants à base de silicium. Cette technique est déjà décrite notamment dans le document de brevet
Comme on va le voir plus en détail ci-après, les différents modes de mise en oeuvre de l'invention permettent de dépolir par endroit, de façons identiques ou différentes, la surface d'un wafer en silicium dans lequel on va ensuite microusiner un composant horloger ou, alternativement, de dépolir par endroit une surface, ou plusieurs surfaces, du dit composant horloger lui-même ou de l'ébauche de celui-ci. On notera que le wafer, le composant horloger, ou son ébauche, peut avoir été préalablement recouvert ou non d'une couche de SiO2. L'invention permet d'associer sur une même plaque, ébauche ou composant, deux effets différents, tel que mat et brillant ou poli et dépoli, ce qui offre de nouvelles possibilités dans l'habillage.As will be seen in more detail below, the different embodiments of the invention make it possible to roughen in places, in identical or different ways, the surface of a silicon wafer in which a watchmaking component or, alternatively, to roughen in places one surface, or several surfaces, of said watchmaking component itself or of the blank thereof. It will be noted that the wafer, the timepiece component, or its blank, may or may not have been previously covered with a layer of SiO 2 . The invention makes it possible to combine on the same plate, blank or component, two different effects, such as matte and shiny or polished and frosted, which offers new possibilities in the dressing.
De manière avantageuse, les surfaces dépolies par endroits correspondent à des surfaces visibles de l'extérieur de la pièce d'horlogerie. Les surfaces dépolies sont en outre de préférence situées dans des zones non fonctionnelles des composants horlogers, afin de ne pas interférer avec les mécanismes horlogers et maintenir des propriétés mécaniques optimales.Advantageously, the surfaces frosted in places correspond to surfaces visible from the outside of the timepiece. The frosted surfaces are also preferably located in non-functional areas of the timepiece components, so as not to interfere with the timepiece mechanisms and to maintain optimum mechanical properties.
D'autres caractéristiques et avantages de la présente invention apparaîtront à la lecture de la description qui va suivre, donnée uniquement à titre d'exemple non limitatif, et faite en référence aux dessins annexés dans lesquels :
- les
figures 1 à 5 sont des vues schématiques en coupe verticale qui constituent cinq instantanés successifs au cours de la mise en oeuvre d'un procédé pour dépolir par endroit une surface en silicium, qui est conforme à un premier mode de mise oeuvre particulier de de l'invention ; - les
figures 6 à 11 sont des vues schématiques en coupe verticale qui constituent six instantanés successifs au cours de la mise en oeuvre d'un procédé pour dépolir par endroit une surface en silicium, qui est conforme à un deuxième mode de mise oeuvre particulier de de l'invention ;
- la
figure 12 est une vue photographique montrant la face supérieure d'un wafer en silicium dont la surface a été dépolie par endroits en appliquant l'un ou l'autre des deux modes de mise en oeuvre particuliers de l'invention qui font respectivement l'objet desfigures 1 à 5 et6 à 11 ; - les
figures 13 et 14 sont deux vues schématiques en coupe verticale qui constituent deux instantanés au cours de la réalisation de composants horloger par micro-usinage d'un wafer en silicium dont la surface a préalablement été dépolie par endroits à l'aide de l'un ou l'autre des deux modes de mise en oeuvre particuliers de l'invention qui font respectivement l'objet desfigures 1 à 5 et6 à 11 ; - les
figures 15 et 16 sont deux vues au microscope d'un spiral à base de silicium dont la surface a été dépolie par endroits en appliquant un troisième mode de mise en oeuvre particulier de l'invention, ce dernier faisant l'objet desfigures 20 à 23 ; - les
figures 17 à 19 sont des vues schématiques en coupe verticale qui constituent trois instantanés successifs montrant la réalisation de l'ébauche d'un composant horloger en silicium par micro-usinage d'un wafer SOI ; - les
figures 20 à 23 sont des vues schématiques en coupe verticale qui constituent quatre instantanés successifs au cours de la mise en oeuvre d'un procédé pour dépolir par endroit une surface en silicium, qui est conforme à un troisième mode de mise oeuvre particulier de de l'invention.
- THE
figures 1 to 5 are schematic views in vertical section which constitute five successive snapshots during the implementation of a method for roughening a silicon surface in places, which is in accordance with a first particular embodiment of the invention; - THE
figures 6 to 11 are schematic views in vertical section which constitute six successive snapshots during the implementation a method for roughening a silicon surface in places, which conforms to a second particular embodiment of the invention;
- there
figure 12 is a photographic view showing the upper face of a silicon wafer whose surface has been roughened in places by applying one or the other of the two particular embodiments of the invention which are respectively the subject of thefigures 1 to 5 And6 to 11 ; - THE
figures 13 and 14 are two schematic views in vertical section which constitute two snapshots during the production of watchmaking components by micro-machining of a silicon wafer whose surface has previously been roughened in places using one or the other of the two particular embodiments of the invention which are respectively the subject of thefigures 1 to 5 And6 to 11 ; - THE
figures 15 and 16 are two views under a microscope of a silicon-based hairspring whose surface has been roughened in places by applying a third particular mode of implementation of the invention, the latter being the subject of thefigures 20 to 23 ; - THE
figures 17 to 19 are schematic views in vertical section which constitute three successive snapshots showing the production of the blank of a watchmaking component in silicon by micro-machining of an SOI wafer; - THE
figures 20 to 23 are schematic views in vertical section which constitute four successive snapshots during the implementation of a method for roughening a silicon surface in places, which is in accordance with a third particular embodiment of the invention.
On va maintenant décrire un premier mode exemplaire de mise en oeuvre du procédé de l'invention en faisant référence aux
La
La
La
Conformément à ce qu'indique le tableau I, la version du procédé DRIE utilisée dans le présent exemple est basée sur un cycle constitué par une étape (désignée par le sigle DEP) de formation d'une couche de passivation, suivie de deux étapes distinctes (respectivement désignées par E1 et E2) de gravure plasma. Pour former la couche de passivation, on injecte un mélange gazeux formé de 4/5 de C4F8 et de 1/5 de O2. Pour la première étape de gravure E1, on utilise un premier plasma produit à partir de SF6. La fonction de ce premier plasma est de désintégrer la partie de la couche de passivation qui se trouve au fond des profils. Quant à la deuxième étape de gravure E2, elle utilise un plasma formé à partir d'un mélange de SF6 et de C4F8. La fonction de ce deuxième plasma est de creuser les profils par gravure réactive du fond de ces derniers.In accordance with what Table I indicates, the version of the DRIE process used in the present example is based on a cycle consisting of a step (designated by the acronym DEP) of forming a passivation layer, followed by two distinct steps (respectively designated by E1 and E2) plasma etching. To form the passivation layer, a gas mixture formed of 4/5 C 4 F 8 and 1/5 O 2 is injected. For the first etching step E1, a first plasma produced from SF 6 is used. The function of this first plasma is to disintegrate the part of the passivation layer which is at the bottom of the profiles. As for the second etching step E2, it uses a plasma formed from a mixture of SF 6 and C 4 F 8 . The function of this second plasma is to hollow out the profiles by reactive etching of the bottom of the latter.
L'étape de gravure dont le résultat est illustré dans la
- la température du procédé (c.-à-d. la température de l'objet 2) est de 30°C. Autrement dit, elle est supérieure à la température ambiante, alors que la température est normalement comprise entre -10°C et 20°C. Dans ces conditions, la couche sacrificielle 8 cuit de manière inhomogène, jusqu'à ce qu'elle soit consommée totalement ;
- on effectue la gravure sans faire passer de flux d'Hélium au dos de l'objet 2. Autrement dit, on supprime la circulation de gaz sous la plaque support de l'appareil. En effet, ce gaz est susceptible de contribuer au refroidissement de l'objet 2. Dans les applications courantes en revanche, on a l'habitude d'injecter un flux d'hélium à cet endroit sous une pression comprise entre 5mT et 15mT ;
- la valeur indiquée dans la colonne intitulée « LF Platen » correspond à la puissance qui est utilisée pour accélérer les ions dans la direction perpendiculaire à la
surface 4. La puissance d'accélération contribue à l'inhomogénéité. Dans le présent exemple, on donne une valeur inhabituellement élevée à cette puissance pendant la phase de passivation (DEP), de l'ordre de 30 à 50 Watts, typiquement 40 Watts. Alors que, dans les applications courantes la puissance est normalement comprise entre 0 et 20 Watts durant la phase DEP et compriseentre 30 et 150 Watts durant les phases E1 et E2.
- the process temperature (ie the temperature of object 2) is 30°C. In other words, it is higher than the ambient temperature, whereas the temperature is normally between -10°C and 20°C. Under these conditions, the
sacrificial layer 8 cooks unevenly, until it is completely consumed; - the etching is carried out without passing any flow of helium on the back of the
object 2. In other words, the circulation of gas under the support plate of the device is suppressed. Indeed, this gas is likely to contribute to the cooling of theobject 2. In current applications, on the other hand, it is customary to inject a flow of helium at this location under a pressure of between 5 mT and 15 mT; - the value shown in the column labeled “LF Platen” corresponds to the power that is used to accelerate the ions in the direction perpendicular to the
surface 4. The accelerating power contributes to the inhomogeneity. In the present example, an unusually high value is given to this power during the passivation phase (DEP), of the order of 30 to 50 Watts, typically 40 Watts. Whereas, in current applications, the power is normally between 0 and 20 Watts during the DEP phase and between 30 and 150 Watts during the E1 and E2 phases.
Les trois différences ci-dessus favorisent une gravure très inhomogène de la résine et permettent ainsi de rendre la surface en silicium particulièrement rugueuse. L'homme du métier comprendra qu'il peut obtenir un degré de rugosité adapté à ses besoins particuliers en faisant varier les paramètres ci-dessus.The three differences above favor a very inhomogeneous etching of the resin and thus make it possible to make the silicon surface particularly rough. A person skilled in the art will understand that he can obtain a degree of roughness suited to his particular needs by varying the above parameters.
Conformément à l'invention, l'étape de gravure DRIE se poursuit assez longtemps pour transférer des inhomogénéités de la couche sacrificielle 8 sur les endroits à dépolir (ou autrement dit rugueux) de la surface en silicium 4. On comprendra donc que la gravure se poursuit au minimum jusqu'à ce que des orifices débouchants aient été créés à travers la couche sacrificielle 8. On peut par exemple repérer ce premier moment charnière par détection de la présence d'atomes de silicium, ou de composés comportant du silicium, dans le réacteur dans lequel la gravure DRIE est mise en oeuvre. À l'autre extrême, la gravure ne devrait pas être poursuivie après que la couche sacrificielle 8 a été totalement consommée. On comprendra que ce second moment charnière est concomitant avec la disparition des espèces chimiques caractéristiques de la couche sacrificielle, qui étaient présentes jusque-là dans le réacteur. Après étalonnage du procédé, l'homme du métier pourra déterminer, par exemple par chronométrage, le moment où il souhaite arrêter la gravure. Le moment que l'homme du métier choisira pour l'arrêt de la gravure sera situé dans l'intervalle entre les premier et second moments charnières susmentionnés.In accordance with the invention, the DRIE etching step continues long enough to transfer inhomogeneities from the
Enfin, la
On va maintenant décrire un deuxième mode exemplaire de mise en oeuvre du procédé de l'invention en faisant référence aux
En se référant plus particulièrement aux
La
L'étape dont le résultat est illustré dans la
La
L'étape de gravure dont le résultat est illustré dans la
La
La
Les
Comme on l'a vu, les
Les
La
La
Les
La figure suivante (la
La
La
L'ébauche de composant horloger peut enfin être détachée du restant du wafer SOI 22. A cet effet, on immerge le wafer SOI et l'ébauche dans un bain qui contient un agent chimique qui attaque le dioxyde de silicium tout en épargnant le silicium. On utilise de préférence de l'acide fluorhydrique tamponné (BHF).The watch component blank can finally be detached from the rest of the
Claims (7)
- A method of spot etching a silicon surface (4) of a timepiece component, the method comprising the following stepsa) forming an apertured etching mask (6; 15; 28) on the silicon surface, so that the areas of the surface to be etched are exposed;b) depositing a sacrificial layer (8; 18; 30) of resist on the exposed areas of the surface and on the etch mask, the sacrificial layer being formed without exposing the resist or annealing it;c) etching the sacrificial resin layer by deep reactive ion etching (DRIE), step c) continuing long enough to transfer inhomogeneities in the sacrificial layer onto the area of the silicon surface to be etched, so as roughen said area into an irregular relief comprising depressions and peaks, said depressions, or craters, having a depth of from about 100 nanometres to 1 micrometre.
- The method of to claim 1, characterised in that step (c) is carried out while the temperature (Temp) of the silicon surface is allowed to rise above ambient temperature.
- The method of claim 1, characterised in that step (c) is carried out while the temperature (Temp) of the silicon surface is allowed to rise above 30°C.
- The method of any one of claims 1, 2 and 3, characterised in that step (c) is carried out while the temperature (Temp) of the silicon surface is allowed to rise to the point that the sacrificial layer (8; 18; 30) bakes inhomogeneously, until it is completely consumed.
- The method of any one of the preceding claims, characterised in that step (c) is implemented while a power (LF Platen) greater than 40 Watts is provided in order to accelerate the ions in the direction perpendicular to the silicon surface during the passivation steps (DEP).
- The method of any one of the preceding claims, characterised in that step (c) comprises the following sub-steps:i. reactive ion etching the sacrificial layer (8; 18; 30) and/or the silicon surface through the apertures of the mask (6; 15; 28), so as to dig into the sacrificial layer and/or the silicon surface;ii. depositing a chemically inert passivation layer on the surfaces exposed by the etching in the previous step;iii. reactive ion etching the passivation layer through the apertures of the mask, so as to expose the sacrificial layer and/or silicon surface at the bottom of the trenches deepened in the previous substep (i);iv. repeating the execution of a sequence of substeps comprising steps (i), (ii) and (iii) until the end of step (c).
- A timepiece component having a silicon surface, said surface having been etched in places using the method of any one of claims 1 to 6.
Priority Applications (1)
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EP19185364.7A EP3764169B1 (en) | 2019-07-10 | 2019-07-10 | Method for frosting some parts of a silicon timepiece component |
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EP19185364.7A EP3764169B1 (en) | 2019-07-10 | 2019-07-10 | Method for frosting some parts of a silicon timepiece component |
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EP3764169A1 EP3764169A1 (en) | 2021-01-13 |
EP3764169B1 true EP3764169B1 (en) | 2023-03-15 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11970780B2 (en) * | 2021-12-30 | 2024-04-30 | Rubattel & Weyermann S.A. | Method for manufacturing appliques on a dial |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
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DE4241045C1 (en) | 1992-12-05 | 1994-05-26 | Bosch Gmbh Robert | Process for anisotropic etching of silicon |
FR2901635A1 (en) * | 2006-06-09 | 2007-11-30 | Commissariat Energie Atomique | Front and rear surfaces three dimensional electrical connection forming method for e.g. silicon substrate, involves engraving lines and trenches, and realising metallization of walls of lines and base of trenches on surfaces by layers |
CH708654A2 (en) * | 2013-10-01 | 2015-04-15 | Rado Montres Sa | A method of manufacturing an inlaid ceramic element of a timepiece and timepieces including such elements. |
CH708827A2 (en) * | 2013-11-08 | 2015-05-15 | Nivarox Sa | micromechanical part hollow, several functional levels and a one-piece based on a synthetic allotrope of carbon material. |
EP3002635B8 (en) * | 2014-09-29 | 2019-05-22 | Richemont International SA | Method for producing a spring element for a clock movement or another precision instrument |
EP3109199B1 (en) * | 2015-06-25 | 2022-05-11 | Nivarox-FAR S.A. | Silicon-based part with at least one chamfer and method for manufacturing same |
FR3046682B1 (en) * | 2016-01-12 | 2018-02-16 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | METHOD FOR MANUFACTURING A SCREEN WITH RETROREFLECTIVE MICROSTRUCTURES |
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2019
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Publication number | Priority date | Publication date | Assignee | Title |
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US11970780B2 (en) * | 2021-12-30 | 2024-04-30 | Rubattel & Weyermann S.A. | Method for manufacturing appliques on a dial |
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