EP3673499A1 - Module électrique à transformateur plan - Google Patents

Module électrique à transformateur plan

Info

Publication number
EP3673499A1
EP3673499A1 EP18755208.8A EP18755208A EP3673499A1 EP 3673499 A1 EP3673499 A1 EP 3673499A1 EP 18755208 A EP18755208 A EP 18755208A EP 3673499 A1 EP3673499 A1 EP 3673499A1
Authority
EP
European Patent Office
Prior art keywords
circuit board
connection
main circuit
electrical module
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP18755208.8A
Other languages
German (de)
English (en)
Inventor
Peter Scholz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Phoenix Contact GmbH and Co KG
Original Assignee
Phoenix Contact GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Phoenix Contact GmbH and Co KG filed Critical Phoenix Contact GmbH and Co KG
Publication of EP3673499A1 publication Critical patent/EP3673499A1/fr
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/02—Casings
    • H01F27/027—Casings specially adapted for combination of signal type inductors or transformers with electronic circuits, e.g. mounting on printed circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/06—Mounting, supporting or suspending transformers, reactors or choke coils not being of the signal type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/06—Mounting, supporting or suspending transformers, reactors or choke coils not being of the signal type
    • H01F2027/065—Mounting on printed circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H01F2027/2819—Planar transformers with printed windings, e.g. surrounded by two cores and to be mounted on printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09154—Bevelled, chamferred or tapered edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/1003—Non-printed inductor

Definitions

  • the invention relates to an electrical module with a planar transformer.
  • Planar transformers also called planar transformers, are used, among other things, for the electrical isolation of circuits, with a planar transformer being a special feature of a transformer, which is characterized by its particularly flat design. Planar transformers can have a height in the
  • Millimeter Rail are preferably used in electrical modules or electrical devices that are designed to be particularly compact in terms of their geometric dimensions.
  • planar transformers can transmit energy, signals and / or data. Due to the transformer characteristic also circuits with different AC voltage levels can be interconnected.
  • planar transformer or a planar transformer is described, which is designed particularly flat. This is achieved by arranging the individual windings of the planar transformer side by side in a plane instead of as usual. As a result, the overall height of the planar transformer can be further reduced.
  • Low profile planar transformers are particularly suitable for use on narrow, low profile electrical equipment. Such an electrical device is for example a buffer amplifier.
  • a major challenge with narrow electrical devices, such as isolation amplifiers, is to make good use of the available volume within a housing in order to be able to arrange as many components as possible with the required spacing and associated interconnects.
  • the available height inside the housing is particularly relevant for the assembly of printed circuit boards or boards, as the
  • Limits of the housing specify a maximum placement height.
  • buffer amplifiers are often sized for industrial applications.
  • sensors connected to the isolating amplifiers can also be used in potentially explosive areas. Therefore, the isolation amplifiers used for this purpose are according to relevant standards, e.g. according to DIN EN 60079-11, designed and dimensioned.
  • relevant standards e.g. according to DIN EN 60079-11, designed and dimensioned.
  • Table 5 of DIN EN 60079-11 e.g. Version EN 60079-11: 2012, Table 5 of which is based on the table of attached Figure 9.
  • Table 5 specifies minimum values for clearances and creepage distances as well as separation distances, which must be adhered to at air-isolated and solids-isolated distances in order to maintain a certain level of protection or a voltage class.
  • the separation distance in solid insulation in protection level ia, ib is at least one millimeter (1.0 mm ) must be.
  • This value is also referred to as "separation distance" or "TO".
  • the predetermined separation distances TO specify minimum distances and must always be adhered to in the components of an electrical device used. This also applies, for example, to conductor tracks of a printed circuit board both in the horizontal direction (side by side on the same layer) and in the vertical direction (one above the other on different layers with an insulating layer in between). Accordingly, the requirements of the Separation distances TO for isolating amplifiers or its transformers are met if they are to be dimensioned according to the corresponding standard.
  • the intrinsic safety criterion dictates a certain minimum thickness of a printed circuit board for a transformer. However, one generally wants to keep the thickness of the printed circuit board as low as possible in order to make the best possible use of the limited space within a housing for equipping the printed circuit board with components, in particular for exploiting the maximum possible
  • the invention accordingly proposes an electrical module with a planar transformer, wherein the electrical module has a housing with an interior space. The interior of the housing has an internal height. Furthermore, the electrical module has a main printed circuit board with a first thickness, wherein at least one electronic component is arranged on the main printed circuit board. It is further provided that the planar transformer is arranged on an additional printed circuit board with the second thickness, wherein the main printed circuit board has a recess which receives the additional printed circuit board.
  • the main circuit board and the additional circuit board are connected to each other via a connection. Furthermore, both the main circuit board and the additional circuit board may each have a plurality of electrically conductive and electrically insulating layers.
  • a "printed circuit board” (printed circuit board, PCB) is understood to mean a carrier for electronic components.
  • a main circuit board and one or more additional circuit boards may be arranged in a common housing.
  • the housing protects the internal structure of the electrical module.
  • the housing may, for example, be cuboid or have any geometric shape that allows to arrange the components of the electrical module within an interior of the housing.
  • the interior in this case has a geometric extension with a height, width and depth, wherein these sizes do not have to have the same extent at all points within the housing, ie, the housing may differ for example from a rectangular base or cuboid geometry.
  • electrical module is to be understood in the following to mean that an electrical module can be part of a more complex electrical device, whereby the electrical module is a closed unit with its own housing understand that may have interfaces for electrical and / or mechanical contact with other modules or electrical equipment. Furthermore, an electrical module may be part of an electrical device. Furthermore, it may also be possible for a plurality of modules to be combined to form an overall unit, for example by juxtaposing individual module housings on a common electrical rail or by electrically interconnecting the modules with one another to form a larger unit, for example an electrical device.
  • the inventively proposed module preferably has a housing height PI or total thickness in the vertical direction in the millimeter range of, for example, about 0.5 cm to about 1.8 cm or more, but not more than a few centimeters, preferably less than two centimeters.
  • housing heights for example, about 3 mm to about 5 mm possible. Accordingly remain in the interior of the housing as assembly height PO, for example, 4.5 mm to about 1.6 cm, due to a wall thickness of the housing.
  • assembly height PO for example, 4.5 mm to about 1.6 cm, due to a wall thickness of the housing.
  • the term "assembly height" is understood to mean the expansion of the module in the orthogonal direction with respect to an arranged printed circuit board inside the housing
  • a mounting height can be present on both sides of the printed circuit board, i.e. from the respective surface of the printed circuit board
  • the housing shape of the electrical module is preferably formed cuboid, so that there is a constant assembly height along the main circuit board.
  • the circuit board has, for example, a thickness HO of 1 mm.
  • Printed circuit board thickness HO of the enclosure height PI remains mounting heights P01 and P01 on the two sides of the PCB, whereby the assembly heights can be smaller than 2 mm. It is envisaged that the planar transformer is not received directly on the main circuit board of the electrical module, but is arranged on an additional circuit board. For this purpose, the main circuit board has a recess, wherein in this Recess the additional circuit board is arranged. In this way, the
  • Main circuit board to be replaced in a predetermined area by the additional circuit board is replaced in a predetermined area by the additional circuit board.
  • An integration of the additional printed circuit board in the surface of the main circuit board has the advantage that the space in the interior of the housing of the electrical module is used compactly to arrange further mechanical component elements, such as connectors, and electrical components and the planar transformer therein.
  • the use of an additional circuit board has the advantage that insulation requirements can be met, even if the main circuit board for this purpose does not have a sufficiently large thickness.
  • the main circuit board may have a minimum first thickness to the mechanical
  • planar transformer to ensure. Therefore, the planar transformer can not be integrated into the module without additional measures and is arranged on the additional printed circuit board.
  • the additional printed circuit board has a minimum thickness in order to ensure the desired level of protection of the planar transformer. It is in addition to the mechanical requirements also electrically in relation to a required
  • Main circuit board and the additional circuit board is stepped.
  • a stage can improve a mechanical fixation because the geometry of the stage
  • connection itself is part of the main circuit board and / or the additional circuit board. This means that in such a case, no further component is used to connect between the main circuit board and the auxiliary circuit board
  • a step-shaped geometry has the advantage that a support surface or a contact surface is provided by the step, depending after which layer has the step in the interior of the housing.
  • step is to be understood as meaning a geometry which has a first surface with a first orientation and a second surface with a second orientation, wherein the first and the second surface are arranged at right angles or nearly at right angles to each other
  • one of the surfaces of the staircase geometry is aligned parallel to a surface of one of the circuit boards, and advantageously one of the surfaces of the staircase geometry is oriented perpendicular to a surface of one of the circuit boards.
  • connection is formed by a step on the main circuit board.
  • the stage may be designed such that the additional printed circuit board is supported on the main circuit board and the stage also serves as a mechanical stop for the additional printed circuit board.
  • connection is formed by a step on the additional printed circuit board.
  • Main circuit board a stepped geometry in their edge regions, so the step-shaped geometries of the two printed circuit boards can be an interlocking
  • connection has an oblique contact surface.
  • the oblique contact surface can be formed, for example, in an edge region of the main printed circuit board and / or the additional printed circuit board.
  • connection is linear.
  • a “line connection” is a connection to understand that has a small contact surface and is ideally formed from a line in three-dimensional view. This line appears as a point in a cross-sectional view and provides a connection between the main board and the auxiliary board.
  • the punctiform connection in sectional view can be described in a three-dimensional view as a linear connection or contact line with any position in space.
  • Such a contact line can be present as a mechanical and / or electrical connection, for example as
  • Deep milling be provided, wherein the electrical contact can be made by metallization of the deep milling.
  • a line-shaped connection in particular in the form of an electrical connection, by, for example
  • connection is both an electrical and a mechanical connection.
  • connection may provide mechanical stability and electrical connection between the main circuit board and the auxiliary circuit board.
  • the advantage of a linear connection is, for example, a simple production of the connection. This can be inexpensive and fast to produce.
  • connection has a contact surface.
  • the contact surface may be oblique, vertical or vertical within the interior of the housing or with respect to one of the
  • a "contact surface” is to be understood as meaning an area that is at least partially planar and allows contact between two printed circuit boards at several points or a contiguous surface
  • a contact surface may be provided, for example, by a step-shaped geometry provided that the mating contact surface is planar with the step-shaped geometry
  • a contact surface has the advantage that the connection
  • vibration-proof can be formed, which, for example, in
  • a combination of a linear connection and a connection through a contact surface is also possible.
  • a planar connection may be present, while in a further area a linear connection is present, wherein both types of connection together provide the connection according to the invention between the main circuit board and the additional circuit board.
  • connection has a deep groove.
  • a deep groove is understood as meaning a mechanical depression which is designed such that it forms a
  • a deep milling is understood to mean a vertical milling (z-axis milling) in which one or more non-vertically continuous depressions are milled.
  • z-axis milling a vertical milling in which one or more non-vertically continuous depressions are milled.
  • Main board cooperates and provides a connection. It can also be provided that the main circuit board has a Tiefenfräsung, which cooperates with a corresponding geometry of the additional printed circuit board and a
  • a deep milling for example, has the advantage that it is easy to manufacture and this precise geometries can be produced.
  • Main circuit board is arranged centrally with respect to the inner height. This has the advantage that the main circuit board can be equipped on both sides similar with components. Furthermore, a contacting of the main printed circuit board to the outside can also take place in a simple manner in that the housing has a recess through which the main printed circuit board can at least partly protrude in order to provide, for example, a plug connection of a pluggable connection technology. Due to the symmetrical arrangement of the main circuit board with respect to an internal height or also with respect to an external height by uniform wall thicknesses of the housing, the contacting is also arranged centrally on the housing. In an alternative embodiment, with respect to the position of the main circuit board, it may be provided that the main circuit board is asymmetrical with respect to the main circuit board
  • connection provides an electrical and a mechanical connection.
  • the connection is located inside the housing and is preferably manufactured automatically.
  • the main circuit board and the additional circuit board have a common metallized contact surface.
  • Such a contact surface is advantageous for a permanent connection between the main circuit board and the additional circuit board.
  • the contact surface comprises copper material.
  • the contact surface may be formed by one or a plurality of metal pads.
  • the first thickness of the main circuit board is less than the second thickness of the additional circuit board. Accordingly, the heights of the two circuit boards are different. Accordingly, the thickness of the main circuit board is designed according to mechanical criteria and made as thin as possible. In this way, as far as possible a large assembly space is provided on both sides of the motherboard. Furthermore, the additional printed circuit board is subject to criteria for the design of the planar transformer, for example as
  • the additional printed circuit board is not only designed according to mechanical criteria in terms of their thickness, but also according to electrical criteria, for example, to meet a certain level of protection.
  • the height or thickness of the additional circuit board will be greater than the height or thickness of the main circuit board.
  • the main circuit board is equipped on both sides with at least one component. In this way, the available space in the interior of the housing of the electrical module is widely used.
  • the electrical module provides an isolation amplifier.
  • an isolation amplifier is understood as meaning an electrical unit which, with a planar transformer, forms a galvanic separation of at least two
  • Doubling a voltage value for example, a gear ratio with respect to the values of input to output of the isolation amplifier of 1: 2 is used.
  • the isolation amplifier is used in potentially explosive areas.
  • the proposed isolation amplifier meets, for example, a standard required for this purpose, such as the standard DIN EN 60079-1 1,
  • the isolation amplifier according to the invention is designed and dimensioned to take into account safety aspects, in particular to meet requirements for insulating properties or Mmdestisolationsabfar.
  • the standard DIN EN 60079-11, e.g. Version EN 60079-11: 2012 specifies, depending on a desired protection level, insulation properties and minimum distances within the isolation amplifier and its environment.
  • the planar transformer as part of the isolation amplifier in such a case meets the requirements of the desired level of protection and can accordingly as "intrinsically safe
  • Planar transformer or be designed as an intrinsically safe transformer ".
  • intrinsic safety is to be understood as a technical term, with respect to a
  • an electrical module which has Mmdestisolierabrange, wherein the minimum distances according to Table 5 of DIN EN 60079-11, version EN 60079-11: 2012 are selected, in particular the electrical module
  • an intrinsically safe module can be provided, which in
  • Fig. 2 shows a second embodiment of a lying within the scope of the invention
  • Fig. 3 shows a third embodiment of a lying within the scope of the invention
  • Fig. 4 shows an embodiment of an additional circuit board
  • Main circuit board is integrated in a plan view
  • FIG. 5 shows the additional printed circuit board of FIG. 4 in a plan view
  • FIG. 6 shows an embodiment of a main circuit board in cross-sectional view
  • 7 shows an exemplary embodiment of an additional printed circuit board in cross-sectional view with Tiefenfräsung.
  • FIG. 8 shows the additional printed circuit board of FIG. 7 with a metal contact
  • Fig. 1 1 shows an embodiment of a compound with two oblique
  • Fig. 12 shows an embodiment of a compound with two stepped
  • Fig. 13 shows an embodiment of a compound with an oblique contact surface and a step-shaped geometry.
  • FIGS. 1 to 3 each show an electrical module 100 in a cross-sectional view, the embodiments of FIGS. 1 to 3 differing in the arrangement of printed circuit boards and their connection 150 with one another.
  • the electrical modules 100 each have a housing, in each of which a main circuit board 110 and a
  • Additional printed circuit board 120 are arranged.
  • circuit board PCBl In such electrical modules or electrical devices with narrow housings is typically at least one circuit board PCBl or a board with a thickness of HO, depending on the embodiment, more or less centrally in the existing cavity of the housing is arranged.
  • circuit board PCB1 electronic components Bl, B2 are equipped, which form the electronic functionality of the module or device.
  • the electronic components are often present on both sides of the main circuit board 110. As shown in Figs. 1 to 3, for example, component Bl 112 on the top and component B2 113 on the underside of the main circuit board 110.
  • the main circuit board PCB1 110 is often placed more or less vertically in the center of the cavity, so the mounting heights P01 and P02 are identical or nearly the same.
  • the main circuit board PCB1 110 may also be slightly asymmetrically slid so that, for example, components 112, 113 may be located at a greater height on the top of the main circuit board and components 112, 113 having a lower height may be required on the bottom, so that different mounting heights are required become.
  • components 112, 113 may be located at a greater height on the top of the main circuit board and components 112, 113 having a lower height may be required on the bottom, so that different mounting heights are required become.
  • Additional printed circuit board 120 as well components on the top and / or bottom of the
  • Be arranged additional printed circuit board. 1 shows by way of example a component 127 on the upper side of the additional printed circuit board 120.
  • a more or less symmetrical placement of the main circuit board 110 within the cavity of the housing 101 is advantageous when external connections of the main circuit board 110 are to be made such that metallizations on the main circuit board 110 are to contact directly into connectors.
  • the main circuit board 110 can be partially pushed with their metal contacts outside or inside the housing 101 in a connector.
  • the illustrated electrical modules of FIGS. 1 to 3 may be isolation amplifiers. Such isolation amplifiers are provided in narrow housings.
  • the electrical modules of FIGS. 1 to 3 each have an outer width PI of, for example, about 6.2 mm.
  • a cavity is present with an internal height PO of, for example, about 4.5 mm.
  • the cavity is enclosed, for example, by two housing parts with a wall thickness of, for example, about 0.85 mm.
  • the main circuit board 110 may have a thickness HO of, for example, about 0.8 mm. This results in each case maximum
  • the mounting heights P01 and P02 could be further increased if the thickness of the circuit board HO was reduced.
  • a PCB thickness typically a PCB thickness of about 0.5 mm to about 1, 0 mm is selected.
  • the mounting heights P01, P02, for example, are each about 1.85 mm. Manufacturing tolerances are usually also taken into account, so that individual values can be different.
  • a central component of isolation amplifiers is the transformer or transformer. Accordingly, in almost every isolating amplifier there is at least one transformer dimensioned according to the standards in order to have a certain level of protection. In the area of a transformer, for example, galvanically isolated windings in solid insulation must at least comply with the dimension TO.
  • the transformer of a buffer amplifier is preferably formed as a planar transformer. According to the invention, the planar transformer is arranged on an additional printed circuit board, which may have a printed circuit board thickness Hl of 1.5 mm, for example, wherein the main printed circuit board 110 of the isolating amplifier is formed with a printed circuit board thickness H0 of, for example, 0.8 mm. Accordingly, the following relationship results: Hl> HO and Hl> TO, where TO is the required one
  • Minimum distance for a particular level of protection e.g. 1 mm according to Table 5 of the standard DIN EN 60079-11, e.g. the version EN 60079-11: 2012 is (see Fig. 9).
  • FIG. 1 shows a first embodiment of a construction of an electrical module 100 with a planar transformer in accordance with the invention
  • planar transformer is manufactured as a component on an additional printed circuit board PCB2 with the thickness Hl, which complies with all insulation requirements, so that the planar transformer can be used as an intrinsically safe planar transformer.
  • the Planarübertrager a ferrite core, which has two ferrite core parts.
  • Ferrite core parts of the planar transformer Fl and F2 protrude in the vertical direction by the distance Kl and K2 from the additional printed circuit board in both directions, so that a total thickness of the transformer of Kl + Hl + K2 results.
  • the total thickness of the planar transformer may typically be e.g. are about 4 mm.
  • the planar transformer fits into the cavity PO of, for example, about 4.5 mm.
  • the supplemental circuit board has terminals on its outer layers, e.g. over a
  • the planar transformer 122 is thus a self-contained component, e.g. can be populated in an SMT process and points as
  • Windings includes as well as the two ferrite core parts Fl 124 and F2 125 on.
  • the two ferrite core parts 124 and 125 may be used as equal parts, i. be formed with identical height, but this is not absolutely necessary. Furthermore, the two ferrite core parts 124 and 125 may be used as equal parts, i. be formed with identical height, but this is not absolutely necessary. Furthermore, the two ferrite core parts 124 and 125 may be used as equal parts, i. be formed with identical height, but this is not absolutely necessary. Furthermore, the two ferrite core parts 124 and 125 may be used as equal parts, i. be formed with identical height, but this is not absolutely necessary. Furthermore, the two ferrite core parts 124 and 125 may be used as equal parts, i. be formed with identical height, but this is not absolutely necessary. Furthermore, the two ferrite core parts 124 and 125 may be used as equal parts, i. be formed with identical height, but this is not absolutely necessary. Furthermore, the two ferrite core
  • Additional printed circuit board in addition to the planar transformer also other components B3, such.
  • Protective components fuses, resistors, semiconductors, etc.
  • components B3 can be better thermally coupled to the transformer than if they were arranged on the main circuit board 110. This can e.g. be useful for thermal monitoring of the transformer in case of failure.
  • the main circuit board PCB1 110 has a recess 111 to the
  • the additional printed circuit board 120 in the region of the transformer 122 has a recess 121 through which one or both core halves may protrude, for example the lower one
  • the main circuit board PCB1 110 is not vertically centered in the cavity PO, but shifted so far down that the mounting height P02 is smaller than the mounting height P01.
  • P02 may become so small that even component B2 113 with a very small height, eg less than one millimeter ( ⁇ 1 mm), may possibly not be able to be equipped at all.
  • the main circuit board PCBl 110 remains vertically centered or at least approximately vertically centered in the cavity or the interior of the housing 101 with the inner height PO, so that the mounting heights P01 and P02 are identical or at least approximately the same size and both the component Bl as well as the component B2 can find enough space.
  • a so-called Tiefenfräsung 151 is also appropriate as shown in FIG. 2 introduced into the additional printed circuit board PCB2 120 as a compound 150, which is dimensioned so that on the one hand, the electrical and mechanical connection between the two
  • FIG. 3 shows a third exemplary embodiment of a construction of an electrical module 100 with a planar transformer 122 in accordance with the invention
  • the main circuit board PCBl 110 remains in a more or less central position as the auxiliary circuit board PCB2 120.
  • the additional circuit board PCB2 120 is no longer on the
  • Printed circuit board PCBl 110 on, as is the case with the embodiments of FIGS. 1 and 2, but "floats" in a recess 111 of the main circuit board PCBl 110. This can for example by means of temporary mounts in the manufacturing process will be realized. In this position, both circuit boards 110, 120 (PCBl and PCB2) are mechanically and electrically connected to each other, which is about
  • Solder connections can be done.
  • the supplementary circuit board PCB2 120 can be compared to the second embodiment in the third embodiment
  • FIGS. 4 to 8 show further possible embodiments according to the invention.
  • Fig. 4 shows a main PCB PCBl 110 in an embodiment, which is based on the second embodiment of FIG. 2.
  • FIGS. 5 to 8 show further details.
  • Fig. 4 shows the interior of an electrical module 100 in the plan view with a main circuit board 110 and an additional circuit board 120.
  • an additional circuit board PCB2 120 with two planar transformers 130, 140 attached, each having a ferrite core pair Fl and F2, with only the
  • Ferrite core parts 131, 141 can be seen in the plan view of FIG. 5.
  • the main circuit board PCBl 110 has the layer structure 114 shown in FIG. 6 with four electrically conductive layers and insulating layers therebetween.
  • the supplementary circuit board PCB2 120 of FIG. 4 and FIG. 5 has two edges each
  • the deep grooves 151 serve for the connection 150 between the main circuit board 110 and the additional circuit board 120. At the deep millings 151 there are copper contacts or copper pads (edge metallizations optional) which are connected to the main circuit board PCBl can be soldered.
  • Fig. 6 shows a layer structure of the main circuit board PCB1 having, for example, a maximum thickness of about 0.9 mm.
  • the individual layers alternately copper and an insulating layer have thicknesses in the micrometer range, for example, 35 ⁇ for each of a copper layer and 200 ⁇ for each one insulating layer, measured in the vertical direction of FIG.
  • FIG. 7 shows an exemplary layer structure of the additional printed circuit board of FIG. 4.
  • the additional printed circuit board PCB2 120 according to FIG. 7 has a layer structure 126 with four electrically conductive layers and insulating layers between them.
  • Planar transformer also still vias between each
  • Layers can be present.
  • the layer structure with the four layers for example, a maximum thickness of about 1.45 mm, without the outer
  • the additional circuit board has a stepped geometry 152, at the bottom of a metallic contact surface as
  • Edge metallization 153 is arranged, which is shown in Fig. 8.
  • Fig. 8 shows an embodiment with an edge metallization 153, wherein the metal is copper here (edge: edge plated pads).
  • edge metallization 153 the metal is copper here (edge: edge plated pads).
  • electrical connections between the main circuit board and the additional circuit board can be provided via the edge metallization 153.
  • FIGS. 10 to 13 show in addition to FIGS. 1 to 3 further embodiments of an electrical module 100 in a sectional view, wherein in FIGS. 10 to 13, only a part of the existing components are shown and for example the housing 101 and the electronic components 112, 113 are not shown.
  • FIGS. 10 to 13 each schematically show a main circuit board 110 and an additional circuit board 120, wherein the additional circuit board 120 is at least partially enclosed by two core parts 124 and 125.
  • the main circuit board 110 has in these embodiments smaller thickness compared to the additional circuit board 120 with a greater thickness.
  • FIGS. 10 to 13 Various variants of a type of connection 150 between a main circuit board 110 and an auxiliary circuit board 120 are shown in FIGS.
  • each embodiment of FIGS. 10 to 13 each have two connections 150, which are each formed the same or similar.
  • connection 150 between a straight contact surface of the main printed circuit board 110 and an oblique contact surface of FIG
  • the contact surface runs in Fig. 10 from bottom to top at an angle of approximately 45 degrees with respect to a horizontal orientation of
  • a blunt side of the connection surface is at the lower edge of the auxiliary circuit board, and a tip at the connection surface is at the upper edge of the auxiliary circuit board 120.
  • the height exceeds
  • Fig. 11 shows an embodiment of a compound 150 with a common oblique Kunststofffizze the main circuit board 1 10 and the additional circuit board 120.
  • the main circuit board 110 has an oblique Randfikiee, which corresponds to the oblique edge surface of the additional circuit board, so that both edge surfaces mechanically vollfizzig touch.
  • an electrical connection 150 is provided, which is linear and is shown in FIG. 11 in the sectional view as a point.
  • FIG. 12 shows an exemplary embodiment of a connection 150 having a step-shaped mechanical contact surface and a linear electrical connection 150 at the step, which is illustrated as a point-like connection in a sectional view of FIG. 12.
  • the edge portion of the main circuit board 110 has a step which forms a Aufiagefikiee upwards.
  • the edge portion of the additional circuit board 120 has a step which forms a Aufiagefikiee down.
  • the two stepped geometries correspond with each other.
  • the additional circuit board 120 rests on the main circuit board 110 at the connection 150. A reversal of the support would also be possible, so that the main circuit board 110 is supported on the additional conductor plate 120.
  • Fig. 13 shows an embodiment of a connection 150 in which the
  • Main circuit board 110 has an oblique Kunststofffikiee in its edge region. Furthermore, the additional printed circuit board 120 has a stepped geometry at its edge region. Here, the two edge geometries of the two circuit boards 110, 120 touch mechanically only in one point, or on a line, if the depth of the
  • Printed circuit boards 110, 120 considered. At this point in the cross-sectional view, a connection 150 is provided between the two circuit boards 110, 120, which acts both mechanically and electrically.
  • an electric module 100 which has a
  • Main circuit board 110 and at least one additional circuit board 120 wherein the main circuit board 110 and the auxiliary circuit board 120 can be electrically and mechanically connected to each other in different ways.
  • This connection 150 has the advantage that the electrical module 100 overall can have a low overall height and at the same time can be operated intrinsically safe in the sense of the standard DIN EN 60079-11 or on the international level of the version EN 60079-11: 2012. Reference numerals:

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

L'invention concerne un module électrique (100) comprenant un transformateur plan. Selon l'invention, le module électrique (100) comporte un boîtier (101) pourvu d'un espace intérieur ayant une longueur intérieure (L) et une hauteur intérieure (PO). En outre, le module électrique (100) comporte une carte de circuit imprimé principale (110) ayant une première épaisseur (HO). Au moins un composant électronique (112) est disposé sur la carte de circuit imprimé principale (110). Il est prévu ici de disposer le transformateur plan (122) sur une carte de circuit imprimé supplémentaire (120) ayant la deuxième épaisseur (H1). La carte de circuit imprimé principale (110) comporte un évidement (111) qui reçoit la carte de circuit imprimé supplémentaire (120). Il est également prévu de relier entre elles la carte de circuit imprimé principale (110) et la carte de circuit imprimé supplémentaire (120) par une connexion (150).
EP18755208.8A 2017-08-22 2018-08-22 Module électrique à transformateur plan Pending EP3673499A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
BE2017/5577A BE1025500B1 (de) 2017-08-22 2017-08-22 Elektrisches Modul mit einem Planartransformator
PCT/EP2018/072668 WO2019038329A1 (fr) 2017-08-22 2018-08-22 Module électrique à transformateur plan

Publications (1)

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EP3673499A1 true EP3673499A1 (fr) 2020-07-01

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Application Number Title Priority Date Filing Date
EP18755208.8A Pending EP3673499A1 (fr) 2017-08-22 2018-08-22 Module électrique à transformateur plan

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US (1) US11476030B2 (fr)
EP (1) EP3673499A1 (fr)
CN (1) CN111095448B (fr)
BE (1) BE1025500B1 (fr)
WO (1) WO2019038329A1 (fr)

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US11916489B2 (en) * 2021-02-10 2024-02-27 Innoscience (Suzhou) Technology Co., Ltd. High efficiency and high density GaN-based power converter
US11916005B2 (en) * 2021-02-10 2024-02-27 Innoscience (Suzhou) Technology Co., Ltd. Multi-functional PCB for assembling GaN-based power converter and method for manufacturing the same
US11916488B2 (en) 2021-02-10 2024-02-27 Innoscience (Suzhou) Technology Co., Ltd. High efficiency and high density GaN-based power converter
US11916490B2 (en) * 2021-02-10 2024-02-27 Innoscience (Suzhou) Technology Co., Ltd. Multi-functional PCB for assembling GaN-based power converter
US12155313B2 (en) * 2021-02-10 2024-11-26 Innoscience (Suzhou) Technology Co., Ltd. Multi-functional PCB for assembling GaN-based power converter
KR102642517B1 (ko) * 2021-10-06 2024-03-04 주식회사 솔루엠 평면 변압기, 및 이에 적용되는 보빈 어셈블리
US20250203799A1 (en) * 2023-12-15 2025-06-19 Power Integrations, Inc. Integrated power supply using a planar energy transfer element

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Publication number Publication date
US20200203053A1 (en) 2020-06-25
CN111095448A (zh) 2020-05-01
BE1025500A1 (de) 2019-03-19
US11476030B2 (en) 2022-10-18
BE1025500B1 (de) 2019-03-27
CN111095448B (zh) 2023-04-04
WO2019038329A1 (fr) 2019-02-28

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