EP3589774A1 - Substrate-carrier structure - Google Patents

Substrate-carrier structure

Info

Publication number
EP3589774A1
EP3589774A1 EP18708654.1A EP18708654A EP3589774A1 EP 3589774 A1 EP3589774 A1 EP 3589774A1 EP 18708654 A EP18708654 A EP 18708654A EP 3589774 A1 EP3589774 A1 EP 3589774A1
Authority
EP
European Patent Office
Prior art keywords
substrate
carrier structure
carrier
structure according
groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP18708654.1A
Other languages
German (de)
French (fr)
Inventor
Shane BRAUN
Jonathan Kuntz
Joshua AUMAN
Joseph WENDEL
Austin MOHNEY
Tom Goetz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SGL Carbon SE
Original Assignee
SGL Carbon SE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SGL Carbon SE filed Critical SGL Carbon SE
Publication of EP3589774A1 publication Critical patent/EP3589774A1/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582—Rigid and flat substrates, e.g. plates or discs
    • C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C23C14/505—Substrate holders for rotation of the substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4581—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber characterised by material of construction or surface finish of the means for supporting the substrate
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02—Epitaxial-layer growth
    • C30B25/12—Substrate holders or susceptors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Definitions

  • This invention relates to a novel substrate carrier structure wherein the substrate may be a wafer and its use in nanoscale processes, such as deposition and/or growth processes.
  • substrate-carrier structures comprise a carrier structure containing at least one pocket which physically supports the wafer substrate to provide heat dissipation and transfer during the growth/deposition processes (W. S. Rees, CVD of nonmetals, Wiley- VCH, Weinheim, 1996; A. C. Jones, P. O'Brien, CVD of Compound Semiconductors, VCH, Weinheim, 1997).
  • the profile of the pocket floor can contribute to a consistent heat transfer across the surface of the wafer substrate. This temperature of the wafer is one of the main factors influencing film properties in the above mentioned deposition and growth processes.
  • US 2013/0319319 describe a substrate-carrier structure wherein the carrier structure comprises a pocket which is placed on the backside of the carrier structure and wherein this pocket has a two-stage structure, i.e. an upper-stage portion and a lower-stage portion.
  • the uniformity of the heat transfer influences the film properties in the deposition and growth processes mentioned above.
  • the thickness of the deposited film can be unequal resulting in an insufficient yield of the deposited layers.
  • the object of the present invention is therefore to provide an improved substrate-carrier structure increasing the uniformity and yield of the layers deposited during the growth/deposition process on the substrate which may be a wafer.
  • a substrate-carrier structure wherein the backside and/ or frontside of the carrier structure, preferably the backside, comprises at least one groove.
  • One factor which influences the uniformity of the heat transfer across the surface of the substrate is the mechanical support/stability to the overall carrier structure.
  • mechanical support to the surface of the carrier structure is given; in particular the mechanical deformation of the carrier substrate perpendicular to said surface is prevented.
  • Such a carrier structure has a decreased shape compared to prior art substrates carriers having no grooves.
  • This groove/these grooves reduce variability in flatness of the carrier structure wherein the design of the carrier structure can preferably be adapted to gas delivery systems and heating elements being used in the corresponding growth/deposition process.
  • the arrangement of the at least one groove on the carrier can be radial or concentric or it can be combination of a radial and concentric arrangement.
  • a radial groove is defined as a groove extending from the edge to the center of the substrate-carrier structure and a concentric groove shows no interruption around the perimeter.
  • the concentric grooves prevent a height runout arround the perimeter of the substrate -carrier structure. This means that the circular grooves ensure that the carrier shape is more uniform and not saddle-shaped, which would be higher in one axis than the other. This has the further advantage that during the use of the substrate carrier- structure in a growth process, the coated substrates are heated and coated equally, which results in a higher quality of the coated products.
  • the number of grooves is not limited, however, it is preferred that in case of radial grooves the number thereof is in the range of 1 to 18, preferably of 2 to 16, more preferably in the range of 2 to 14 and in case of concentric grooves the number thereof is preferably in the range of 1 to 6, more preferably of 2 to . If a combination of radial and concentrical grooves is used the numbers of grooves mentioned before are valid.
  • the cross-sectional design of a groove/the grooves can be angular (V-shape), rectangular, or circular. If more than one groove is present the cross-sectional design of each groove can be the same or it can be any combination of the mentioned cross- sectional designs.
  • the depth of the grooves is no larger than 90 % of the total substrate carrier thickness, i.e. these grooves do not represent through holes. Above a depth of 90 % of the total substrate-carrier structure thickness the substrate-carrier structure becomes brittle and below a depth of 1 % of the total substrate-carrier structure thickness no effect of the grooves can be seen.
  • the width to depth ratio of the groove is less than 10. If a radial design of the grooves is chosen the length of each groove is preferably smaller than the radius of the carrier structure, typically by less than 95 % of the carrier radius. However, it is also possible that the length extends through the carrier center or to the carrier edge.
  • cross-sectional design, the depth and the aspect ratio of the groove(s) depend on conditions of the deposition and/or growth process used, i.e. on the desired properties of the product resulting from such a process.
  • the inventive carrier structure further comprises at least one pocket being part of the frontside of the carrier structure.
  • the uniformity of the heat transfer across the surface of the substrate is also influenced by the contact surfaces of the substrate and of the carrier and by the spacing between the substrate and the pocket surface(s).
  • the pocket floor profile should be engineered in such a way to provide a consistent heat transfer across the surface of the wafer substrate. For substrate-carrier structures containing multiple pockets this uniformity must translate to all pockets. Independent of the number of pockets on a given substrate-carrier structure, each pocket's dimensions are influenced by the overall carrier shape which is influenced by the grooves. This shape is defined as the physical deflection both circumferentially and across the diameter of the substrate carrier. Failure to provide consistent substrate- carrier structure shape/flatness will ultimately lead to pocket structure variability and therefore poor process uniformity and yield of the layers deposited during the growth/deposition process on the substrate.
  • the profile of the pocket(s) can be flat, concave or convex or any combination thereof.
  • the number of pockets depends on the dimensions of the carrier structure and on the desired properties of the final product.
  • the pockets have a diameter of 25 - 500 mm, preferably 45 - 455 mm, more preferably 45 - 305 mm.
  • the carrier is made of a material selected from the group consisting of graphite, silicon carbide, graphite or coated with silicon carbide or carbonfiber reinforced carbon (CFRC) coated with silicon carbide or any arbitrary mixture thereof.
  • CFRC carbonfiber reinforced carbon
  • the inventive substrate-carrier structure can be used in epitaxial, polycrystalline, or amorphous growth production processes, like CVD (Chemical Vapor Deposition), VPE (Vapor Phase Epitaxy), and PVD (Physical Vapor Deposition).
  • CVD Chemical Vapor Deposition
  • VPE Vapor Phase Epitaxy
  • PVD Physical Vapor Deposition
  • a graphite carrier contains at least 3 radial grooves extending from the near center of the carrier to the near edge. These radial grooves, preferably symmetrically arranged, provide rigidity along the carrier radius to mitigate deflection that would otherwise cause the carrier to move convex or concave. This reduction in carrier deflection variability leads to a more consistent pocket floor profile, providing the targeted wafer-to-carrier spacing to enhance within-wafer uniformity and subsequently yield.
  • N number of wafer susceptor
  • a graphite carrier contains at least one circular groove, preferably three circular grooves being concentric with the carrier.
  • This circular feature acts to increase the rigidity of the carrier around the circumference to mitigate deflection that would otherwise cause the carrier to bend or warp.
  • This provides a uniformly flat carrier edge, serving two main purposes; Pocket floor profiles would be more consistent due to the lack in carrier shape variability.
  • the spacing between the carrier and reactor components would be more consistent. These components could include heat sources, gas delivery systems, or metrology equipment in which spacing is critical to the operation.
  • Consistency in the space between the carrier and the components will provide more uniform deposition or growth parameters (temperature, concentration, pressure, flow rate, etc.) Furthermore, the concentric grooves ensure that the pockets of the carrier are flat and not convex resulting in substrates being equally heated and coated.
  • a graphite carrier contains at least 1 circular groove and at least 3 radial grooves.
  • the radial grooves provide rigidity along the substrate-carrier structure radius to mitigate deflection that otherwise cause the substrate-carrier structure to move convex or concave.
  • the circular groove acts to increase the rigidity of the carrier around the circumference to mitigate deflection that otherwise cause the carrier to bend or warp.
  • pocket floor profiles would be more consistent due to the lack in the substrate-carrier structure shape variability. This reduction in substrate-carrier structure deflection variability leads to a more consistent pocket floor profile.
  • the spacing between the substrate-carrier structure and the substrate-wafer is optimized and the temperature distribution is improved.
  • the spacing between the carrier and reactor components is more consistent. These components could include heat sources, gas delivery systems, or metrology equipment in which spacing is critical to the operation. Consistency in the space between the carrier and the components provide a more uniform deposition or growth parameters ( i.e. temperature, concentration, pressure, flow rate ).
  • Figure 1 shows a carrier in a top view only having circular grooves
  • Figure 2 shows a carrier in a top view only having radial grooves
  • Figure 3 shows a carrier in a top view having radial and circular grooves

Abstract

This invention relates to a substrate carrier structure wherein the substrate may be a wafer and its use in nanoscale processes, such as deposition and/or growth processes. The carrier structure (1) comprises grooves (2, 3) on its frontside and or backside.

Description

SUBSTRATE-CARRIER STRUCTURE
This invention relates to a novel substrate carrier structure wherein the substrate may be a wafer and its use in nanoscale processes, such as deposition and/or growth processes.
With the industry's trend towards device miniaturization, process consistency becomes a critical factor affecting final yields. These trends are observed in industries such as semiconductor, solar, epitaxial growth, and LED production. In order to produce the aforementioned nanoscale structures these industries use several deposition and growth techniques including CVD (Chemical Vapor Deposition), VPE (Vapor Phase Epitaxy) and PVD (Physical Vapor Deposition). Specifically, thin films produced by these techniques can have structures including monocrystalline, polycrystalline, and/or amorphous phases. In each process technique a substrate-carrier structure, is required.
Many of these substrate-carrier structures comprise a carrier structure containing at least one pocket which physically supports the wafer substrate to provide heat dissipation and transfer during the growth/deposition processes (W. S. Rees, CVD of nonmetals, Wiley- VCH, Weinheim, 1996; A. C. Jones, P. O'Brien, CVD of Compound Semiconductors, VCH, Weinheim, 1997). The profile of the pocket floor can contribute to a consistent heat transfer across the surface of the wafer substrate. This temperature of the wafer is one of the main factors influencing film properties in the above mentioned deposition and growth processes. US 2013/0319319 describe a substrate-carrier structure wherein the carrier structure comprises a pocket which is placed on the backside of the carrier structure and wherein this pocket has a two-stage structure, i.e. an upper-stage portion and a lower-stage portion. By using such a two-stage structure of the pocket the thermal transfer at the edge of the wafer substrate is improved, however, the heat transfer across the surface of the wafer substrate is not uniform.
The uniformity of the heat transfer influences the film properties in the deposition and growth processes mentioned above. By having a non-uniform heat transfer across the surface of the wafer substrate the thickness of the deposited film can be unequal resulting in an insufficient yield of the deposited layers.
The object of the present invention is therefore to provide an improved substrate-carrier structure increasing the uniformity and yield of the layers deposited during the growth/deposition process on the substrate which may be a wafer.
This object is solved by a substrate-carrier structure wherein the backside and/ or frontside of the carrier structure, preferably the backside, comprises at least one groove.
One factor which influences the uniformity of the heat transfer across the surface of the substrate is the mechanical support/stability to the overall carrier structure. By having at least one groove in the carrier structure mechanical support to the surface of the carrier structure is given; in particular the mechanical deformation of the carrier substrate perpendicular to said surface is prevented. Such a carrier structure has a decreased shape compared to prior art substrates carriers having no grooves. This groove/these grooves reduce variability in flatness of the carrier structure wherein the design of the carrier structure can preferably be adapted to gas delivery systems and heating elements being used in the corresponding growth/deposition process. The arrangement of the at least one groove on the carrier can be radial or concentric or it can be combination of a radial and concentric arrangement. In the context of the present invention a radial groove is defined as a groove extending from the edge to the center of the substrate-carrier structure and a concentric groove shows no interruption around the perimeter. The concentric grooves prevent a height runout arround the perimeter of the substrate -carrier structure. This means that the circular grooves ensure that the carrier shape is more uniform and not saddle-shaped, which would be higher in one axis than the other. This has the further advantage that during the use of the substrate carrier- structure in a growth process, the coated substrates are heated and coated equally, which results in a higher quality of the coated products. The number of grooves is not limited, however, it is preferred that in case of radial grooves the number thereof is in the range of 1 to 18, preferably of 2 to 16, more preferably in the range of 2 to 14 and in case of concentric grooves the number thereof is preferably in the range of 1 to 6, more preferably of 2 to . If a combination of radial and concentrical grooves is used the numbers of grooves mentioned before are valid.
The cross-sectional design of a groove/the grooves can be angular (V-shape), rectangular, or circular. If more than one groove is present the cross-sectional design of each groove can be the same or it can be any combination of the mentioned cross- sectional designs.
The depth of the grooves is no larger than 90 % of the total substrate carrier thickness, i.e. these grooves do not represent through holes. Above a depth of 90 % of the total substrate-carrier structure thickness the substrate-carrier structure becomes brittle and below a depth of 1 % of the total substrate-carrier structure thickness no effect of the grooves can be seen. The width to depth ratio of the groove is less than 10. If a radial design of the grooves is chosen the length of each groove is preferably smaller than the radius of the carrier structure, typically by less than 95 % of the carrier radius. However, it is also possible that the length extends through the carrier center or to the carrier edge.
It is to be understood that the cross-sectional design, the depth and the aspect ratio of the groove(s) depend on conditions of the deposition and/or growth process used, i.e. on the desired properties of the product resulting from such a process.
The inventive carrier structure further comprises at least one pocket being part of the frontside of the carrier structure.
The uniformity of the heat transfer across the surface of the substrate is also influenced by the contact surfaces of the substrate and of the carrier and by the spacing between the substrate and the pocket surface(s). The pocket floor profile should be engineered in such a way to provide a consistent heat transfer across the surface of the wafer substrate. For substrate-carrier structures containing multiple pockets this uniformity must translate to all pockets. Independent of the number of pockets on a given substrate-carrier structure, each pocket's dimensions are influenced by the overall carrier shape which is influenced by the grooves. This shape is defined as the physical deflection both circumferentially and across the diameter of the substrate carrier. Failure to provide consistent substrate- carrier structure shape/flatness will ultimately lead to pocket structure variability and therefore poor process uniformity and yield of the layers deposited during the growth/deposition process on the substrate.
The profile of the pocket(s) can be flat, concave or convex or any combination thereof. The more uniform shape of the carrier results in lower scrap rates due to the higher uniformity of the deposited layers on the substrate-wafer during the growth process increases, because the flattness and shape of the pockets support a uniform
temperature distribution.
The number of pockets depends on the dimensions of the carrier structure and on the desired properties of the final product. Advantageously the pockets have a diameter of 25 - 500 mm, preferably 45 - 455 mm, more preferably 45 - 305 mm.
The carrier is made of a material selected from the group consisting of graphite, silicon carbide, graphite or coated with silicon carbide or carbonfiber reinforced carbon (CFRC) coated with silicon carbide or any arbitrary mixture thereof.
The inventive substrate-carrier structure can be used in epitaxial, polycrystalline, or amorphous growth production processes, like CVD (Chemical Vapor Deposition), VPE (Vapor Phase Epitaxy), and PVD (Physical Vapor Deposition). In the following, the present invention is described purely by way of example with reference to advantageous embodiments and with reference to the accompanying drawings.
Examples:
Example 1 :
According to this example a graphite carrier contains at least 3 radial grooves extending from the near center of the carrier to the near edge. These radial grooves, preferably symmetrically arranged, provide rigidity along the carrier radius to mitigate deflection that would otherwise cause the carrier to move convex or concave. This reduction in carrier deflection variability leads to a more consistent pocket floor profile, providing the targeted wafer-to-carrier spacing to enhance within-wafer uniformity and subsequently yield.
If for example 150 mm susceptors having for example 12 radial grooves are used it is possible to get a pocket profile having around 0.002 inches, whereas if no grooves are used it is only possible to get a pocket profile of around 0.004 inches.
N = number of wafer susceptor
Example 2:
According to this example a graphite carrier contains at least one circular groove, preferably three circular grooves being concentric with the carrier. This circular feature acts to increase the rigidity of the carrier around the circumference to mitigate deflection that would otherwise cause the carrier to bend or warp. This provides a uniformly flat carrier edge, serving two main purposes; Pocket floor profiles would be more consistent due to the lack in carrier shape variability. Also, the spacing between the carrier and reactor components would be more consistent. These components could include heat sources, gas delivery systems, or metrology equipment in which spacing is critical to the operation. Consistency in the space between the carrier and the components will provide more uniform deposition or growth parameters (temperature, concentration, pressure, flow rate, etc.) Furthermore, the concentric grooves ensure that the pockets of the carrier are flat and not convex resulting in substrates being equally heated and coated.
Example 3:
According to this example a graphite carrier contains at least 1 circular groove and at least 3 radial grooves. The radial grooves provide rigidity along the substrate-carrier structure radius to mitigate deflection that otherwise cause the substrate-carrier structure to move convex or concave. In parallel the circular groove acts to increase the rigidity of the carrier around the circumference to mitigate deflection that otherwise cause the carrier to bend or warp. As result, pocket floor profiles would be more consistent due to the lack in the substrate-carrier structure shape variability. This reduction in substrate-carrier structure deflection variability leads to a more consistent pocket floor profile. This further results in a more unformily deposited/grown layer on the wafer-substrate, because the spacing between the substrate-carrier structure and the substrate-wafer is optimized and the temperature distribution is improved. This has the further advantage that during the use of the substrate carrier-structure in a growth process, the coated substrates are heated and coated equally, which results in a higher quality of the coated products. In addition, the spacing between the carrier and reactor components is more consistent. These components could include heat sources, gas delivery systems, or metrology equipment in which spacing is critical to the operation. Consistency in the space between the carrier and the components provide a more uniform deposition or growth parameters ( i.e. temperature, concentration, pressure, flow rate ).
Figures:
Figure 1 shows a carrier in a top view only having circular grooves
Figure 2 shows a carrier in a top view only having radial grooves
Figure 3 shows a carrier in a top view having radial and circular grooves
Reference list
1 substrate-carrier structure
2 radial groove
3 circular groove
4 center of the substrate-carrier structure
5 edge of the substrate-carrier structure

Claims

Claims
1. Substrate-carrier structure, wherein the backside and/ or frontside of the carrier structure comprises at least one groove.
2. Substrate-carrier structure according to claim 1 wherein the at least one groove is arranged radial and/or concentric.
3. Subastrate-carrier structure according to claim 1 or 2, wherein the at least one groove has a design, when viewed in cross-section, which is angular, rectangular or circular.
4. Substrate-carrier structure according to claim 1 , wherein the at least one groove has a depth in the range of 1 % to 90 % of the total substrate carrier structure thickness.
5. Substrate-carrier structure according to claim 1 , wherein the width to depth ratio of the at least one groove is less than 10.
6. Substrate-carrier structure according to claim 1 , wherein the frontside of the
carrier structure further comprises at least one pocket.
7. Substrate-carrier structure according to claim 6, wherein the at least one pocket has a flat, concave or convex profile.
8. Substrate-carrier structure according to claim 6, wherein the at least one pocket has a diameter of 25 to 500 mm.
9. Substrate-carrier structure according to claim 1 , wherein the carrier is made of a material selected from the group consisting of graphite, silicon carbide, graphite or coated with silicon carbide or carbonfiber reinforced carbon (CFRC) coated with silicon carbide or any arbitrary mixture thereof.
0. Use of the substrate carrier-structure according to claim 1 or 2 for epitaxial, polycrystalline, or amorphous growth production processes.
EP18708654.1A 2017-02-28 2018-02-28 Substrate-carrier structure Pending EP3589774A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201762464551P 2017-02-28 2017-02-28
PCT/EP2018/054988 WO2018158348A1 (en) 2017-02-28 2018-02-28 Substrate-carrier structure

Publications (1)

Publication Number Publication Date
EP3589774A1 true EP3589774A1 (en) 2020-01-08

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP18708654.1A Pending EP3589774A1 (en) 2017-02-28 2018-02-28 Substrate-carrier structure

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