EP3475676A1 - Mire d'etalonnage pour installation de prises de vues - Google Patents
Mire d'etalonnage pour installation de prises de vuesInfo
- Publication number
- EP3475676A1 EP3475676A1 EP17745394.1A EP17745394A EP3475676A1 EP 3475676 A1 EP3475676 A1 EP 3475676A1 EP 17745394 A EP17745394 A EP 17745394A EP 3475676 A1 EP3475676 A1 EP 3475676A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- image
- pattern
- holes
- acquisition system
- image acquisition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000003384 imaging method Methods 0.000 title 1
- 230000003287 optical effect Effects 0.000 claims abstract description 31
- 238000007689 inspection Methods 0.000 claims description 27
- 238000012360 testing method Methods 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 13
- 238000001514 detection method Methods 0.000 claims description 7
- 238000013507 mapping Methods 0.000 claims description 3
- 238000012545 processing Methods 0.000 description 19
- 238000009434 installation Methods 0.000 description 10
- 230000006870 function Effects 0.000 description 8
- 230000009466 transformation Effects 0.000 description 6
- 230000005855 radiation Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000004913 activation Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- PXFBZOLANLWPMH-UHFFFAOYSA-N 16-Epiaffinine Natural products C1C(C2=CC=CC=C2N2)=C2C(=O)CC2C(=CC)CN(C)C1C2CO PXFBZOLANLWPMH-UHFFFAOYSA-N 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000013213 extrapolation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/80—Analysis of captured images to determine intrinsic or extrinsic camera parameters, i.e. camera calibration
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B21/00—Microscopes
- G02B21/0004—Microscopes specially adapted for specific applications
- G02B21/0016—Technical microscopes, e.g. for inspection or measuring in industrial production processes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/32—Fiducial marks and measuring scales within the optical system
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G06T7/001—Industrial image inspection using an image reference approach
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/30—Determination of transform parameters for the alignment of images, i.e. image registration
- G06T7/33—Determination of transform parameters for the alignment of images, i.e. image registration using feature-based methods
- G06T7/337—Determination of transform parameters for the alignment of images, i.e. image registration using feature-based methods involving reference images or patches
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30141—Printed circuit board [PCB]
Definitions
- the present description relates generally to photographic installations and, more particularly, to optical inspection installations, for example electronic cards.
- the present description relates to a calibration chart for such a camera installation.
- An optical inspection facility and more generally shooting can provide first data and second data of different natures during the inspection of the same scene.
- the optical inspection facility can provide a three-dimensional image of the scene and a two-dimensional color-level image of the scene.
- the optical inspection facility may provide a first three-dimensional image of the scene using cameras and a second three-dimensional image of the scene using a laser scanner.
- first and second data may be desirable to be able to combine first and second data of different natures relating to the same scene. It must then be possible to match the first data and the second data.
- a calibration chart also called a calibration chart.
- This pattern includes items that are easily unambiguously detectable when the pattern is inspected to provide the first and second data. Such elements are called invariant elements. The invariant elements detected in the first data are then matched with the invariant elements detected in the second data.
- an object of an embodiment is to overcome at least in part the disadvantages of calibration standards for installation of pictures described above.
- An object of an embodiment is to provide a calibration pattern suitable for photographic installations, including optical inspection facilities.
- Another object of an embodiment is a calibration pattern comprising elements unambiguously detectable by different image acquisition systems.
- Another object of an embodiment is a calibration pattern that can be made at a reduced cost.
- an embodiment provides a calibration pattern of an optical system, formed of a plate having through holes.
- the plate comprises first and second opposite faces, each hole passing through the plate from the first face to the second face.
- the cross-section of at least one of the holes increases from the first face to the second face.
- At least one of the holes is a frustoconical hole.
- At least one of the holes comprises a first cylindrical portion extending through a second cylindrical portion, the diameter of the first cylindrical portion being smaller than the diameter of the second cylindrical portion.
- the pattern is applied to a calibration of an optical card inspection facility.
- One embodiment also provides an optical system comprising a first two-dimensional or three-dimensional image acquisition system and a second image acquisition system and a calibration target as defined above.
- An embodiment also provides a method for calibrating the optical system, using a pattern as defined above, comprising the following steps:
- each first registration point being associated with the representation of one of the holes of the test pattern on the first image
- each second registration point being associated with the representation of one of the holes of the test pattern on the second image
- the method comprises determining a transform function adapted to match each point of the first image a point of the second image.
- the first face of the pattern is oriented towards the first image acquisition system and the second image acquisition system.
- the first image acquisition system is adapted to detect a first signal, the holes of the pattern appearing on the first image by a lack of detection of the first signal by the first acquisition system of images and the second image acquisition system is adapted to detect a second signal, the holes of the pattern appearing on the second image by a lack of detection of the second signal by the second image acquisition system.
- FIG. 1 represents, partially and schematically, an embodiment of an optical circuit inspection installation of electronic circuits
- Figure 2 is a schematic top view of an embodiment of a calibration pattern
- Figures 3 to 5 are sectional views of embodiments of a hole in the pattern of Figure 2;
- Fig. 6 is a block diagram illustrating an embodiment of a method for matching data of different natures provided by the optical inspection facility of Fig. 1;
- FIG. 7 represents an exemplary image of a pattern taken by a camera. detailed description
- a three-dimensional image of an object is a cloud of points, for example several million points, of at least a portion of the outer surface of the object in which each point of the surface is identified by its coordinates determined with respect to a three-dimensional space mark.
- a two-dimensional image, or 2D image is a digital image acquired by a camera and corresponding to a matrix of pixels.
- FIG. 1 represents, partially and schematically, an embodiment of an optical inspection installation 10, for example for electronic circuit boards.
- Each electronic circuit Card is placed on a conveyor 12, for example a flat conveyor.
- the conveyor 12 is able to move the card circuit in a direction X, for example a horizontal direction to bring it into a region of the optical inspection facility, called the scene S, in which images of the circuit card can be acquired.
- the conveyor 12 may comprise a set of belts and rollers driven by a rotating electric motor.
- the conveyor 12 may comprise a linear motor moving a carriage on which rests the electronic circuit Card.
- the circuit Card corresponds, for example, to a rectangular card having a length and a width ranging from 50 mm to 550 mm.
- the direction of movement Card circuit may be a horizontal direction perpendicular to the X direction shown in FIG.
- the installation 10 comprises at least first and second different observation sensors of the card Card present in the scene S and determines, from the signals supplied by the first and second sensors, first and second data of different natures used for the inspection of the card card present in the scene S.
- the first sensor is a camera and the second sensor is a laser scanner.
- the first data may correspond to a three-dimensional image or a two-dimensional image determined from the signals provided by the first sensor and the second data may correspond to a three-dimensional image or to a two-dimensional image determined from the signals provided by the second sensor.
- the system 10 comprises a first image acquisition system 15 of the card circuit.
- the first image acquisition system 15 comprises an image projection device P comprising at least one projector, a single projector P being represented in FIG. 1.
- the projectors P can be substantially aligned in a direction perpendicular to the direction X.
- the first acquisition system 15 further comprises an image acquisition device C comprising at least one digital camera, a single camera C being shown in FIG. 1.
- the cameras C may be substantially aligned, for example by groups of cameras, preferably in a direction perpendicular to the direction X and / or be arranged on either side of the projector or projectors
- each camera C may comprise a matrix of photodetectors distributed in rows and columns.
- Each photodetector is adapted to provide a detection signal representative of the amount of light it has received during an exposure time.
- the projector P and the camera C are connected to a processing module 16 and the first acquisition system 15 is controlled by the processing module 16.
- the processing module 16 is adapted to provide a three-dimensional image or a two-dimensional image of the card Card present in the scene S from the two-dimensional images provided by the camera C while images are projected on the circuit Card by the projector P.
- the first acquisition system 15 does not include a projector and comprises at least one camera, for example a telecentric camera, disposed directly above the scene S, for example in place of the projector P in FIG. 1, and connected to the processing module 16.
- a camera for example a telecentric camera
- the processing module 16 may comprise a computer or a microcontroller comprising a processor and a non-volatile memory in which instruction sequences are stored, the execution of which by the processor enables the processing module 16 to perform the desired functions.
- the processing module 16 may correspond to a dedicated electronic circuit.
- the electric motor 14 is further controlled by the processing module 16.
- the optical inspection facility 10 may include a second image acquisition system 20.
- the second image acquisition system 20 comprises a laser scanner.
- the laser scanner 20 is connected to the processing module 16 and the second acquisition system 20 is controlled by the processing module 16.
- the processing module 16 is adapted to provide a three-dimensional image of the card Card present in the scene S from the signals provided by the laser scanner 20.
- control means of the conveyor 12, the camera C and the projector P, the laser scanner 20 of the installation The above-described optical inspection methods are within the skill of the art and are not described in more detail.
- a pattern is used which is arranged in the scene S in place of an electronic card.
- FIG. 2 is a schematic top view of an embodiment of a calibration pattern 30.
- the calibration pattern 30 comprises a plate 32 having two opposite faces 34 and 36, the face 36 not being visible. in Figure 2.
- the faces 34 and 36 are preferably substantially planar and parallel.
- the plate 32 is pierced with holes 38 passing through the plate from the face 34 to the face 36 and opening on the two faces 34, 36.
- the face 34 of the plate 32 is the face which is intended to be observed by the control systems. acquisition 15, 20 of the optical inspection facility 10 during a calibration operation.
- the holes 38 may be arranged in rows and columns. However, another arrangement of the holes 38 may be provided, the holes 38 being, for example, arranged in staggered rows.
- the plate 32 may comprise from three to several thousand holes 38.
- the thickness of the plate 32 may be between 1 millimeter and 20 millimeters, depending on the material used.
- the gap between two adjacent holes 38 of the same row may be between 1 millimeter and 20 millimeters.
- the material making up the plate 32 may be chosen from the group comprising a metal, a metal alloy, a plastic material or a composite material.
- the pattern 30 may be manufactured by drilling the holes 38 in the plate 32 by means of a piercing tool.
- FIG. 3 is a partial schematic sectional view of the calibration pattern 30 at one of the holes 38 and illustrates an embodiment of the holes 38 in which the holes 38 have a substantially constant cross-section over any the thickness of the plate 32.
- the holes 38 are cylindrical with a circular base.
- the diameter of each hole 38 may be between 1 millimeter and 10 millimeters.
- all the holes 38 have substantially the same diameter.
- the holes 38 have a cross section which is not constant over the entire thickness of the plate 32 and which increases from the face 34 towards the face 36.
- Figure 4 is a view similar to Figure 3 of another embodiment of the holes 38 of the test pattern 30 in which the holes 38 are substantially frustoconical, for example circular base.
- Each hole 38 then comprises a circular opening 40 on the face 34 and a circular opening 42 on the face 36, the diameter of the circular opening 40 being smaller than the diameter of the circular opening 42.
- the diameter of the circular opening 40 each hole 38 may be between 1 millimeter and 10 millimeters and the diameter of the circular opening 42 of each hole 38 may be between 2 millimeters and 20 millimeters.
- FIG. 5 is a view similar to FIG. 3 of another embodiment of the holes 38 of the test pattern 30 in which each hole 38 is lamed and comprises a first cylindrical portion 44 with a circular base which is extended by a second cylindrical portion 46 with circular base.
- the first cylindrical portion 44 opens on the face 34 and the second cylindrical portion 46 opens on the face 36.
- the diameter of the first cylindrical portion 44 is smaller than the diameter of the second cylindrical portion 46.
- the diameter of the first cylindrical portion 44 can be between 1 millimeter and 10 millimeters and the diameter of the second cylindrical portion 46 may be between 2 millimeters and 20 millimeters.
- the thickness of the first cylindrical portion 44 may be between 0.4 millimeters and 5 millimeters.
- each hole 38 may be different from a circle and may be polygonal, especially square or triangular.
- An advantage of providing the holes 38 of circular section, constant or variable, is that the pattern 30 can be manufactured simply and at low cost. During a calibration operation, the target 30 is not pressed against a support so that the holes 38 of the test pattern are not closed.
- FIG. 6 is a block diagram illustrating an embodiment of a calibration method of the optical inspection facility 10 shown in FIG. 1.
- the calibration method may be implemented at the end of manufacture. of the optical inspection facility 10 or after a displacement of the optical inspection facility 10.
- the process comprises successive steps 50, 52, 54, 56 and 58.
- step 50 calibration target 30 is set up in scene S, for example by means of conveyor 12.
- step 52 at least one first image of the target 30 is determined by the processing module 16 from the signals provided by the first image acquisition system 15 and a second image of the target 30 is determined by the processing module 16 from the signals provided by the second image acquisition system 20.
- the target 30 can be moved in the scene S between the activation of the first image acquisition system 15 and the activation of the second image acquisition system 20.
- the whole of the target 30 is represented on the first and second images.
- only a portion of the pattern 30 may be present on at least one of the first and second images.
- at least one corner of the target 30 is preferably shown in this image.
- the image acquisition systems 15, 20 are suitable for acquiring an image by detecting the intensity of a radiation reflected by the test pattern 30. It may be a radiation projected onto the 30, by the image acquisition system and reflected by the test pattern 30 or from the reflection of the ambient light by the test pattern 30.
- the holes 38 of the test pattern 30 appear on the image acquired by each acquisition system. images as areas where there is no detection of a radiation since no radiation is reflected by the holes 38.
- FIG. 7 represents an example of an image I of the test pattern 30 obtained by a camera in the case where the target 30 comprises cylindrical or frustoconical holes 38.
- the holes 38 appear in the image I as discs 60 having a saturated color or a saturated gray level, for example black discs.
- the portion of the face 34 of the pattern 30 around each hole 38 has a light color so as to increase the contrast of the image acquired at each disc 60, and thus facilitate the identification of the holes 38.
- the cross section of the holes 38 increases away from the face 34 of the pattern 30 observed by each image acquisition system 15, 20. This allows, advantageously, to prevent the edges of the holes 38 at the face 34 from appearing on the image determined by the processing module 16 from the signals supplied by the image acquisition system 15, 20, in particular when the viewing angle of the image acquisition system 15, 20 is not perpendicular to the face 34 of the test pattern 30.
- step 54 for each image I, the processing module 16 determines for each disk 60 the coordinates of a point, called a tracking point in the rest of the description, representative of the disk 60 in the coordinate system associated with the image I.
- the registration point corresponds to the barycentre of the pixels of the image belonging to the disk 60.
- the processing module 16 associates at each registration point of the first image of the test pattern 30 determined by the processing module 16 the corresponding registration point of the second image of the test pattern determined by the test module. processing 16.
- the processing module 16 determines a transform function for passing coordinates of any point of the first image of the target 30 into the coordinate system of the first image at the coordinates of the corresponding point of the second image of the target 30 in the coordinate system of the second image and satisfying the constraint that at the coordinates of each registration point of the first image of the target In the coordinate system of the first image correspond the coordinates of the corresponding registration point of the second image of the target 30 in the coordinate system of the second image.
- the transformation function can be obtained by any type of extrapolation method.
- the transformation function is an affine transformation.
- the greater the number of registration points used for the determination of the transformation function the more the mapping of any point of the first image of the target 30 into the coordinate system of the first image and the coordinates of the first image. corresponding point of the second image of the target 30 in the coordinate system of the second image by the transformation function can be obtained correctly.
- step 58 the pattern 30 is removed from scene S.
- An advantage of using the calibration pattern 30 is that it does not require prior knowledge of the position of the pattern 30 on the stage S, the shape of the holes 38 or the number of holes 38 of the test pattern 30.
- the transformation function described above can be used to express in a common coordinate system information determined from the two image acquisition systems 15, 20.
- the calibration pattern 30 may be used with any type of optical inspection facility 10. an object as soon as the optical inspection facility 10 provides first and second data from different sensors during an inspection operation of the object.
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Theoretical Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Signal Processing (AREA)
- Quality & Reliability (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Telescopes (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1655980A FR3053127B1 (fr) | 2016-06-27 | 2016-06-27 | Mire d'etalonnage pour installation de prises de vues |
PCT/FR2017/051686 WO2018002493A1 (fr) | 2016-06-27 | 2017-06-23 | Mire d'etalonnage pour installation de prises de vues |
Publications (1)
Publication Number | Publication Date |
---|---|
EP3475676A1 true EP3475676A1 (fr) | 2019-05-01 |
Family
ID=56611487
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP17745394.1A Withdrawn EP3475676A1 (fr) | 2016-06-27 | 2017-06-23 | Mire d'etalonnage pour installation de prises de vues |
Country Status (4)
Country | Link |
---|---|
US (1) | US10909722B2 (fr) |
EP (1) | EP3475676A1 (fr) |
FR (1) | FR3053127B1 (fr) |
WO (1) | WO2018002493A1 (fr) |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5876973A (ja) * | 1981-10-30 | 1983-05-10 | Nippon Denso Co Ltd | 光学的情報読取装置 |
JPH0461252A (ja) | 1990-06-28 | 1992-02-27 | Nec Kansai Ltd | 整列装置の挿入穴の穿孔方法 |
US5326963A (en) * | 1992-10-02 | 1994-07-05 | Kronos Incorporated | Electro-optic barcode reader |
US6915007B2 (en) * | 1998-01-16 | 2005-07-05 | Elwin M. Beaty | Method and apparatus for three dimensional inspection of electronic components |
US8155368B2 (en) * | 2008-04-30 | 2012-04-10 | George Cheung | Shoulder/neck supporting electronic application |
JP2009274335A (ja) * | 2008-05-15 | 2009-11-26 | Seiko Epson Corp | キャリブレーション治具 |
US8835870B2 (en) * | 2012-01-09 | 2014-09-16 | Electronics And Telecommunications Research Institute | Targets for generating ions and treatment apparatuses using the targets |
CN202688645U (zh) | 2012-07-12 | 2013-01-23 | 宜兴中大纺织有限公司 | 一种针刺机网板组件 |
CN203620929U (zh) | 2013-10-29 | 2014-06-04 | 济南奥美联亚工矿设备有限公司 | 一种具有自锁紧功能的聚氨酯筛板及其安装结构 |
US11051771B2 (en) * | 2014-06-17 | 2021-07-06 | Xintek, Inc. | Stationary intraoral tomosynthesis imaging systems, methods, and computer readable media for three dimensional dental imaging |
-
2016
- 2016-06-27 FR FR1655980A patent/FR3053127B1/fr active Active
-
2017
- 2017-06-23 WO PCT/FR2017/051686 patent/WO2018002493A1/fr unknown
- 2017-06-23 US US16/304,934 patent/US10909722B2/en active Active
- 2017-06-23 EP EP17745394.1A patent/EP3475676A1/fr not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
WO2018002493A4 (fr) | 2018-02-22 |
FR3053127B1 (fr) | 2019-05-03 |
FR3053127A1 (fr) | 2017-12-29 |
US20200202568A1 (en) | 2020-06-25 |
US10909722B2 (en) | 2021-02-02 |
WO2018002493A1 (fr) | 2018-01-04 |
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