EP3442648B1 - Verbindungsanordnung für die leitung von medizinischen vorrichtungen - Google Patents

Verbindungsanordnung für die leitung von medizinischen vorrichtungen Download PDF

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Publication number
EP3442648B1
EP3442648B1 EP17718785.3A EP17718785A EP3442648B1 EP 3442648 B1 EP3442648 B1 EP 3442648B1 EP 17718785 A EP17718785 A EP 17718785A EP 3442648 B1 EP3442648 B1 EP 3442648B1
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EP
European Patent Office
Prior art keywords
lead
filar
connection element
end portion
micrometers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP17718785.3A
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English (en)
French (fr)
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EP3442648A1 (de
Inventor
Darren Janzig
Robert J. Davies
Seth M. Humphrys
Richard T. Stone
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Medtronic Inc
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Medtronic Inc
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Publication of EP3442648A1 publication Critical patent/EP3442648A1/de
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Classifications

    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N1/00—Electrotherapy; Circuits therefor
    • A61N1/18—Applying electric currents by contact electrodes
    • A61N1/32—Applying electric currents by contact electrodes alternating or intermittent currents
    • A61N1/36—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
    • A61N1/372—Arrangements in connection with the implantation of stimulators
    • A61N1/375—Constructional arrangements, e.g. casings
    • A61N1/3752—Details of casing-lead connections
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N1/00—Electrotherapy; Circuits therefor
    • A61N1/02—Details
    • A61N1/04—Electrodes
    • A61N1/05—Electrodes for implantation or insertion into the body, e.g. heart electrode
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K15/00—Electron-beam welding or cutting
    • B23K15/0046—Welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N1/00—Electrotherapy; Circuits therefor
    • A61N1/02—Details
    • A61N1/04—Electrodes
    • A61N1/05—Electrodes for implantation or insertion into the body, e.g. heart electrode
    • A61N1/0551—Spinal or peripheral nerve electrodes
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N1/00—Electrotherapy; Circuits therefor
    • A61N1/18—Applying electric currents by contact electrodes
    • A61N1/32—Applying electric currents by contact electrodes alternating or intermittent currents
    • A61N1/36—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
    • A61N1/3605—Implantable neurostimulators for stimulating central or peripheral nerve system
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices

Definitions

  • Implantable electrical signal generators such as pacemakers, defibrillators, neurostimulators, and the like, have been used to treat a variety of diseases. Such devices generate electrical signals that are transferred to a patient's tissue through electrodes present on a distal end portion of a lead.
  • the proximal end portion of a lead, connected to a signal generator typically contains a number of connectors corresponding to the number of electrodes.
  • Conductors also referred to as wire filars or filars, run within and along the lead body and electrically couple the connectors to the electrodes.
  • Document US 2014/0316502 A1 relates to an assembly of a lead.
  • Document WO 2009/131725 A1 relates to an end interconnector for one or both ends of a lead body for an implantable medical device.
  • Document US 2011/0072657 A1 relates to a method of fabrication of stimulation leads.
  • the present disclosure relates to a robust medical device lead connection assembly.
  • the robust connection assembly may efficiently and effectively connect lead filars to connection elements to form implantable leads and extensions.
  • the invention is defined by the appended claims.
  • a method includes positioning an end portion of a lead filar to overlap a lead end connection element such that the positioning creates mutual interference between the lead filar and the lead end connection element, and forming an interference configuration. Then melting the end portion of the lead filar to form a weld joint and allow the end portion of the lead filar to move towards the end connection element.
  • a method of forming a medical device lead connection element includes overlapping and contacting an end portion of a lead filar with a connection element to form an overlap portion. Then deflecting the filar overlap portion within an elastic range of the lead filar, to form a loaded state. The method then includes melting the filar overlap region to form a weld pool and allowing the weld pool to cool and form a weld joint.
  • a method of forming a medical device lead connection element includes overlapping and deflecting an end portion of a lead filar with a connection element to form an overlap portion in a loaded configuration.
  • the end portion of a lead filar is deflected within an elastic range of the lead filar. Melting the filar overlap region to form a weld pool and allowing the lead filter end portion to move to a prescribed position and forming a contiguous element with the connection element.
  • the method then includes allowing the weld pool to cool and form a weld joint.
  • Coupled refers to two elements being attached to each other either directly (in direct contact with each other) or indirectly (having one or more elements between and attaching the two elements).
  • the present disclosure relates to a robust medical device lead connection assembly.
  • the robust connection assembly may efficiently and effectively connect lead filars to connection elements.
  • the robust connection may be formed by contacting a lead filar with another lead filar or connection tab or element.
  • the lead filar and second lead filar or connection tab or element overlap each other and are in flexure. Melting a portion of the lead filar with either the second lead filar or connection tab, relieves the flexural stress and aligns the lead filar with either the second lead filar or connection tab and utilizes surface tension of the weld pool to form a weld joint.
  • This method forms a repeatable, robust weld joint and may be utilized on small diameter filars. While the present disclosure is not so limited, an appreciation of various aspects of the disclosure will be gained through a discussion of the examples provided below.
  • FIG. 1 shows a general environmental view 10 for an implantable stimulation system. While a stimulation system is illustrated, it is understood that any implantable medical device having a lead body may be utilized with the filar connection and methods described herein.
  • Stimulation system 20 includes a stimulator 22 (such as a neurostimulator, for example), an optional stimulation lead extension 30, and a stimulation lead 40.
  • Stimulator 22 is typically implanted subcutaneously in a patient's body 28 at a location selected by the clinician; although FIG. 1 illustrates stimulator 22 implanted in the patient's abdomen, other locations are suitable.
  • Stimulation lead 40 is typically fixed in place terminating near the desired location selected by the clinician using a device such as an adjustable anchor.
  • FIG. 2 shows an enlarged view of implantable stimulation system 20 having implantable stimulator 22, stimulation lead 40, and optional lead extension 30.
  • Implantable stimulator 22 has a housing 24, a power supply (for example, a battery) within housing 24, and stimulation electronics coupled to the power supply and coupled to a connector block 26, which is also known as a terminal block.
  • Stimulation lead 40 has a lead proximal end 42, a lead distal end 44 and a lead body 45. At lead distal end 44 is an electrode contact having at least one stimulation electrode (not illustrated).
  • Lead extension 30 has an extension proximal end 32, an extension distal end 34, and an extension body 35. Lead proximal end 42 connects to lead extension distal end 34 at connector 50; either or both lead proximal end 42 or extension distal end 34 may include an electrode tip that engages with connector 50.
  • Lead 40 and lead extension 30 provide electrical communication from stimulator 22 to the electrode contact at distal end 44.
  • Lead distal end 44 contains at least one electrode but in most embodiments has a plurality of such electrodes (for example, 4, 8, 16, etc.).
  • Extending through lead 40 and lead extension 30 are electrically conducting wires, often referred to as filars or wire filars, that couple stimulator 22 to the electrode contact and its electrode(s).
  • the filars may form a multi-filar coil extending along the lead body length.
  • the lead filars may, for example, be stranded (made up of many small wires), braided-stranded or "BSW" (braided of many small wires), or solid or monofilament. Extending over and covering the wire filars may be an electrically insulating jacket or sheath. Typically, this jacket is a polymeric material, such as ethylene tetrafluoroethylene (ETFE), polytetrafluoroethylene (PTFE), silicone rubber or polyurethane. Other materials that act as electrical insulators can be used. In some embodiments, a shielding layer or jacket may be present, optionally over the insulating jacket. An example of one suitable shielding layer is described in U.S. Patent Application Publication No. 2005/0222658 .
  • This disclosure is directed to a robust connection and methods of welding filars to other filars or connection elements that may form modular components of a lead or lead extension or any component of a lead system.
  • This can be utilized in any number of filar connection points in the lead 40 and/or lead extension 30 to provide electrical communication from stimulator 22 to the electrode contact at a distal end 44 of the lead system.
  • the modular end pieces or interconnects of this invention makes reference to "lead”, “leads”, “lead body”, and the like, generically, and that this discussion is not limiting to positions or uses of the end interconnects of this disclosure, but that they may be used at any location.
  • the end piece interconnector and the lead structures could be used with applications other than just stimulators.
  • FIG. 3 is schematic diagram of an illustrative filar 120 in flexure with and overlapping a connection element 110.
  • FIG. 4 is a schematic diagram of an illustrative filar 120 aligned with the connection element 110 after melting the lead filar end portion 122 and forming the weld joint 130.
  • the lead filar 120 contacts the connection element 110 and the lead filar 120 or the connection element 110 or both flex against each other so that one or both are in flexure, where one or both deflects within the elastic limit of each of the lead filar 120 and the connection element 110.
  • the lead filar 120 may extend the length of the lead body and be in electrical connection with a lead contact at a distal end of the lead body, as described above.
  • the phrase "elastic limit” refers to the extent to which a solid element may be deflected without permanent alteration to the shape of the solid element.
  • the filar 120 may be elastically deformed or deflected.
  • One illustrative method of forming a medical device lead connection element includes positioning an end portion 122 of a lead filar 120 to overlap a lead end connection element 110 such that the positioning creates mutual interference (meaning that they both want to occupy the same space) between the lead filar 120 and the lead end connection element 110, and forming an interference configuration. Then melting the end portion 122 of the lead filar 120 to form a weld joint 130 and allow the end portion 122 of the lead filar 120 to move towards the end connection element 110.
  • One illustrative method of forming a medical device lead connection element includes overlapping and contacting an end portion 122 of a lead filar 120 with a connection element 110 to form an overlap portion " O " having a lateral distance value or length value.
  • the lead filar extends along a length of a lead body and preferably forms a portion of a multi-filar coil as described herein.
  • the method includes deflecting the filar overlap portion "O" within an elastic range of the lead filar 120, to form a loaded state.
  • the method then includes melting the filar overlap region "O" to form a weld pool 130 and allowing the weld pool 130 to cool and form a weld joint.
  • a method of forming a medical device lead connection element includes overlapping and deflecting an end portion 122 of a lead filar 120 with a connection element 110 to form an overlap portion "O" in a deflected or loaded configuration.
  • the end portion 122 of the lead filar 120 is deflected within an elastic range of the lead filar. Melting the filar overlap region "O" to forms a weld pool 130 and allows the lead filter end portion 122 to move to a prescribed position (or unloaded configuration) and form a contiguous element with the connection element 110.
  • the method then includes allowing the weld pool 130 to cool and form a weld joint.
  • Melting the filar overlap region "O" to form a weld pool 130 utilizes surface tension of the weld pool to maintain the integrity of the weld pool.
  • Surface tension is surface energy that may define and retain the shape of the weld joint in the molten state.
  • Surface energy or surface tension may overtake a force such as gravity to define and retain the shape of the weld joint in the molten state.
  • the lead filar 120 has a diameter D of less than 250 micrometers, or less than 200 micrometers, or less than 150 micrometers, or less than 125 micrometers, or less than 100 micrometers, or from 50 to 150 micrometers, or from 50 to 125 micrometers, or from 70 to 100 micrometers.
  • the lead filar 120 may be insulated and this insulation may add an additional 5 to 40 micrometers of thickness around the insulated portion of the lead filar 120 .
  • the positioning step may increase static forces at the overlap region resulting in a loaded state and the melting step may decrease these static forces at the overlap, resulting in an unloaded state.
  • the melting step may coalesce the overlap region to form the weld pool.
  • the heating or melting step relieves stress from the lead filar 120 in flexure and/or stress from the connection element 110 in flexure.
  • the heating or melting step causes the lead filar 120 and/or the connection element 110 to move toward each other or align with each other and move away from the flexed or biased position to a relaxed or less-stressed state.
  • the lead filar 120 may overlap "O" (or extend over the distal end toward the proximal end of) the connection element 110.
  • the end portion 122 of a lead filar 120 overlaps the connection element 110 by at least a distance value of 0.3(diameter) or 30% of the diameter and by no more than 3 diameters or 300% of the diameter of the lead filar, or in a range from about 0.5 to 2 diameters or in a range from 0.5 to 1 diameter.
  • the contacting step forms an angle ⁇ between the lead filar 120 and the connection element 110 in a range from 1 to 70 degrees or from 10 to 50 degrees or from 25 to 50 degrees.
  • the melting step reduces the angle ⁇ between the lead filar 120 and the connection element 110 by at least 10 degrees, or at least 20 degrees, or at least 30 degrees, or by at least 10%, or at least 25%, or at least 50%.
  • FIG. 4 is a schematic diagram of an illustrative filar 120 aligned with the connection element 110 after melting the lead filar end portion 122 and forming the weld joint.
  • a weld joint 130 is formed by heating and melting at least a portion of the end portion 122 of a lead filar 120 and a portion of the connection element 110 in contact with the lead filar 120.
  • the weld joint 130 is initially metal in the liquid state. Surface tension holds the liquid metal in the weld pool until it cools to the solid metal weld joint, as described above.
  • the melting step may form the weld 130 without additional weld material.
  • the weld is formed with a laser weld or an e-beam weld. This is particularly useful when the lead filar 120 and/or the connection element 110 is formed of TiMo or a TiMo alloy. It has been found that ⁇ TiMo alloy increases in modulus and strength when heated to the liquid phase (by transforming a portion to an ⁇ crystal structure). After the melting step, the weld is cooled to complete the connection.
  • FIG. 5 is a schematic diagram side elevation view of an illustrative medical device lead connection 201 pre-weld.
  • the medical device lead connection 201 includes a plurality of lead filars 120 in flexure with a corresponding plurality of connection element 110.
  • the connection element 110 forms a portion of the connection element 210 such as connector (described above in FIG. 2 ).
  • the lead body includes 4 or more, or 8 or more filars 120 in helical or spiral wound along the lead 220 body.
  • the lead body includes 10 or more, or 12 or more filars 120 in helical or spiral wound along the lead 220 body. Increasing the number of filars in the lead body increases the difficulty in termination of these individual filars to connection elements.
  • Shielding may surround the spiral wound filars 120. Once positioned as illustrated, lasers can heat and melt a portion of the lead filar 120 and/or the connection element 110 sequentially or simultaneously to form the connection from the filar to the connection element 210.
  • the filars 120 in helical or spiral wound along the lead 220 body may form a multi-filar coil having an outer diameter of less than 1.5 millimeters or less than 1 millimeter or in a range from 500 to 900 micrometers or in a range from 625 to 875 micrometers.
  • This multi-filar coil may have an inner diameter in a range from 200 to 1000 micromters or from 350 to 800 micrometers, or from 250 to 600 micrometers.
  • the multi-filar coil inner diameter may define an open lumen that may be configured to receive a stylet for lead placement.
  • FIG. 6 is a schematic diagram side elevation view of an illustrative medical device lead connection 202 post-weld.
  • the medical device lead connection 202 includes a plurality of lead filars 120 is aligned and fixed to the corresponding plurality of connection elements 110 and forming corresponding weld joints 130.
  • the weld joints 130 may be formed as described above, sequentially or at the same time.
  • two lead filars 120 are in flexure and may be connected as described above. Specifically, contacting a fixed lead filar with an end portion of a second lead filar and heating the lead filars to form a weld joint and release the flexure or stress and allowing the filars to move to a relaxed or aligned state. In embodiments where the lead filars have substantially the same diameter and cross-sectional shape, an isodiametric weld joint is formed.

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  • Life Sciences & Earth Sciences (AREA)
  • Veterinary Medicine (AREA)
  • General Health & Medical Sciences (AREA)
  • Biomedical Technology (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Radiology & Medical Imaging (AREA)
  • Animal Behavior & Ethology (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Cardiology (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Plasma & Fusion (AREA)
  • Electrotherapy Devices (AREA)

Claims (13)

  1. Verfahren zum Ausbilden eines Leitungsverbindungselements für eine medizinische Vorrichtung, das Folgendes umfasst:
    Positionieren eines Endabschnitts eines Leitungsfadens (120), um ein Leitungsendverbindungselement (110) derart zu überlappen, dass das Positionieren eine gegenseitige Störung zwischen dem Leitungsfaden (120) und dem Leitungsendverbindungselement (110) erzeugt, und Ausbilden einer Störungskonfiguration, wobei der Leitungsfaden (120) und das Verbindungselement (110) einen Winkel in einem Bereich von 10° bis 50° ausbilden; und
    Schmelzen des Endabschnitts des Leitungsfadens (120), um eine Schweißnaht (130) auszubilden, und zu ermöglichen, dass sich der Endabschnitt des Leitungsfadens (120) in Richtung des Endverbindungselements (120) bewegt, wobei der Winkel zwischen dem Leitungsfaden (120) und dem Verbindungselement (110) um wenigstens 10° oder um wenigstens 10 % reduziert wird.
  2. Verfahren nach Anspruch 1, wobei der Positionierungsschritt das Leitungsendverbindungselement (110) oder den Endabschnitt eines Leitungsfadens (120) elastisch verformt.
  3. Verfahren nach einem der vorhergehenden Ansprüche, wobei die Oberflächenenergie die Form der Schweißnaht (130) in einem geschmolzenen Zustand definiert und beibehält.
  4. Verfahren nach einem der vorhergehenden Ansprüche, wobei der Positionierungsschritt statische Kräfte an der Überlappung erhöht, was zu einem belasteten Zustand führt, und der Schmelzschritt statische Kräfte an der Überlappung verringert, was zu einem unbelasteten Zustand führt.
  5. Verfahren nach einem der vorhergehenden Ansprüche, wobei der Schmelzschritt die Überlappung zusammenfügt, um das Schweißbad auszubilden.
  6. Verfahren nach einem der vorhergehenden Ansprüche, wobei der Endabschnitt des Leitungsfadens (120) einen Durchmesser von weniger als 250 Mikrometern oder weniger als 100 Mikrometern oder von 50 bis 125 Mikrometern aufweist.
  7. Verfahren nach einem der vorhergehenden Ansprüche, wobei der Positionierungsschritt das Überlappen des Leitungsendverbindungselements (110) mit dem Endabschnitt des Leitungsfadens (120) um wenigstens einen Abstandswert von 0,3 (Durchmesser) und nicht mehr als 3 Durchmessern des Leitungsfadens (120) umfasst.
  8. Verfahren nach einem der vorhergehenden Ansprüche, wobei der Endabschnitt des Leitungsfadens (120) aus TiMo oder einer TiMo-Legierung ausgebildet ist.
  9. Verfahren nach einem der vorhergehenden Ansprüche, wobei der Positionierungsschritt ein gleichzeitiges Inberührungbringen mehrerer Leitungsendverbindungselemente (110), die sich von einem Leitungsverbindungselement erstrecken, mit mehreren Endabschnitten von Leitungsfäden (120) umfasst, wobei ausgewählte Leitungsendverbindungselement (130) jeweils einen entsprechenden Endabschnitt eines ausgewählten Leitungsfadens (120) berühren, wobei jeder Leitungsfaden (120) sich mit dem ausgewählten Leitungsendverbindungselement (120) biegt und mit diesem überlappt.
  10. Verfahren nach einem der vorhergehenden Ansprüche, wobei der Positionierungsschritt das gleichzeitige Überlappen und Inberührungbringen von wenigstens 8 oder wenigstens 10 Leitungsfäden (120), die eine Multifadenspule ausbilden, mit einer entsprechenden Anzahl von Leitungsendverbindungselementen (110) umfasst.
  11. Verfahren nach einem der vorhergehenden Ansprüche, wobei der Positionierungsschritt einen Winkel zwischen dem Leitungsendverbindungselement und dem überlappenden Endabschnitt des Leitungsfadens (120) ausbildet, und der Winkel in einem Bereich von 1 bis 70 Grad oder von 10 bis 50 Grad oder von 25 bis 50 Grad liegt.
  12. Verfahren nach einem der vorhergehenden Ansprüche, wobei der Endabschnitt des Leitungsfadens (120) einen Durchmesser von weniger als 250 Mikrometern oder weniger als 100 Mikrometern oder von 50 bis 125 Mikrometern aufweist.
  13. Verfahren nach einem der vorhergehenden Ansprüche, wobei das Überlappen das Überlappen der Verbindungslasche mit dem Endabschnitt eines Leitungsfadens (120) um einen Abstandswert von wenigstens 0,3 (Durchmesser) und nicht mehr als 3 Durchmessern des Leitungsfadens (120) umfasst.
EP17718785.3A 2016-04-15 2017-04-13 Verbindungsanordnung für die leitung von medizinischen vorrichtungen Active EP3442648B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201662323080P 2016-04-15 2016-04-15
PCT/US2017/027339 WO2017180827A1 (en) 2016-04-15 2017-04-13 Medical device lead connection assembly

Publications (2)

Publication Number Publication Date
EP3442648A1 EP3442648A1 (de) 2019-02-20
EP3442648B1 true EP3442648B1 (de) 2022-04-13

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Publication number Priority date Publication date Assignee Title
US10940309B2 (en) 2016-12-16 2021-03-09 Medtronic, Inc. Techniques for forming a modular lead

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DE3630889A1 (de) * 1986-09-11 1988-03-24 Krupp Gmbh Verfahren zum laengsnahtschweissen von behaelterruempfen mittels laserstrahl und vorrichtung zur durchfuehrung des verfahrens
US6060682A (en) * 1997-11-13 2000-05-09 Westbroek; Wido Overlapping joint for laser welding of tailored blanks
US6477427B1 (en) 2000-03-31 2002-11-05 Medtronic Inc. Implantable stimulation lead and method of manufacture
US7877150B2 (en) 2004-03-30 2011-01-25 Medtronic, Inc. Lead electrode for use in an MRI-safe implantable medical device
US7787961B1 (en) 2007-07-11 2010-08-31 Pacesetter, Inc. Reduced-diameter body-implantable leads and methods of assembly
WO2009131725A1 (en) 2008-04-21 2009-10-29 Medtronic, Inc. Modular lead interconnector
US9054436B2 (en) 2009-09-30 2015-06-09 Advanced Neuromodulation Systems, Inc. Method of fabricating stimulation lead for applying electrical stimulation to tissue of a patient
US8712527B2 (en) 2009-10-30 2014-04-29 Medtronic, Inc. Implantable medical devices including elongated conductor bodies that facilitate device and lead configuration variants
US8918187B2 (en) 2010-03-31 2014-12-23 Medtronic, Inc Medical leads and related systems that include coiled filars with longitudinally straight ends
US8660662B2 (en) * 2011-04-22 2014-02-25 Medtronic, Inc. Low impedance, low modulus wire configurations for a medical device
US9421362B2 (en) * 2011-10-28 2016-08-23 Medtronic, Inc. Modular lead end

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WO2017180827A1 (en) 2017-10-19
US11666767B2 (en) 2023-06-06
US20190117982A1 (en) 2019-04-25
EP3442648A1 (de) 2019-02-20

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