EP3384071A1 - Method for galvanic metal deposition - Google Patents
Method for galvanic metal depositionInfo
- Publication number
- EP3384071A1 EP3384071A1 EP16805782.6A EP16805782A EP3384071A1 EP 3384071 A1 EP3384071 A1 EP 3384071A1 EP 16805782 A EP16805782 A EP 16805782A EP 3384071 A1 EP3384071 A1 EP 3384071A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- substrate
- substrate holder
- movement
- path
- carried out
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 53
- 238000001465 metallisation Methods 0.000 title claims abstract description 11
- 239000000758 substrate Substances 0.000 claims abstract description 252
- 239000003792 electrolyte Substances 0.000 claims abstract description 54
- 238000000151 deposition Methods 0.000 claims abstract description 4
- 230000008021 deposition Effects 0.000 claims abstract description 4
- 239000012530 fluid Substances 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 description 18
- 238000000576 coating method Methods 0.000 description 18
- 238000002474 experimental method Methods 0.000 description 14
- 239000011295 pitch Substances 0.000 description 14
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 238000007747 plating Methods 0.000 description 5
- 150000002500 ions Chemical class 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 238000005137 deposition process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 230000037361 pathway Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
Definitions
- the first movement is non-continuous, wherein the second movement is carried out when the first movement is stopped.
- An advantage of this feature is that the process of carrying out the first and the second movements can be repeated in the same way and at the same place on the substrate surface. Preferably, more than one cycle of execution of the first and the second movements is carried out on the same place on the substrate surface.
- first and the second movements are carried out by starting at the beginning of a predetermined time period, wherein a last movement ends with the end of the predetermined time, wherein the execution of first and second movements is repeated and ended at the end of the execution of all first and second movements along the first path, when time period has expired.
- the method is carried out using a substrate holder reception apparatus for clamping a substrate holder in a substrate holder clamping direction in a predetermined position of the substrate holder and releasing the substrate holder, comprising at least one substrate holder connection device for mechanical aligning and electrically contacting of the substrate holder, wherein the substrate holder connection device comprises a separate substrate holder alignment device for aligning the substrate holder with the sub- strate holder connection device in an alignment direction, and a separate substrate holder contact device for electrically contacting the substrate holder.
- Pitch means the distance between stops of the first movement which corresponds to shifting of the position of the second movement. If two pitches are indicated, the experiment has been carried out twice using the different pitches and leading to different NU results.
- Figures 9A and 9B show the measurement result of the thickness of a metal coating of a galvanically metal plated substrate which has been indicated as experiment 222 in the Table above (Comparative Example).
- measurement results are displayed as numbers, whereas in Figure 9B, the thickest lines represent the average thickness.
- Other thinner lines marked by small "+” or "-” represent deviations from the average thickness of the metal deposition on the substrate, wherein the higher the deviation is the thicker the respective lines are depicted.
- the thickness of the coating has been measured at 49 points on the related substrate surface.
- a simple circle has been used as the first path according to the state-of-the-art. Second paths have not been executed.
- the substrate has a circular circumference.
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP15197885.5A EP3176288A1 (en) | 2015-12-03 | 2015-12-03 | Method for galvanic metal deposition |
PCT/EP2016/079395 WO2017093382A1 (en) | 2015-12-03 | 2016-12-01 | Method for galvanic metal deposition |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3384071A1 true EP3384071A1 (en) | 2018-10-10 |
EP3384071B1 EP3384071B1 (en) | 2020-06-03 |
Family
ID=54834648
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP15197885.5A Withdrawn EP3176288A1 (en) | 2015-12-03 | 2015-12-03 | Method for galvanic metal deposition |
EP16805782.6A Active EP3384071B1 (en) | 2015-12-03 | 2016-12-01 | Method for galvanic metal deposition |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP15197885.5A Withdrawn EP3176288A1 (en) | 2015-12-03 | 2015-12-03 | Method for galvanic metal deposition |
Country Status (8)
Country | Link |
---|---|
US (1) | US10407788B2 (en) |
EP (2) | EP3176288A1 (en) |
JP (1) | JP6713536B2 (en) |
KR (1) | KR102166198B1 (en) |
CN (1) | CN108138347B (en) |
PT (1) | PT3384071T (en) |
TW (1) | TWI701360B (en) |
WO (1) | WO2017093382A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6995544B2 (en) * | 2017-09-20 | 2022-01-14 | 上村工業株式会社 | Surface treatment equipment and surface treatment method |
PT3758049T (en) | 2019-06-26 | 2022-03-21 | Atotech Deutschland Gmbh & Co Kg | Device and method for moving an object into a processing station, conveying system and processing apparatus |
EP3761348B1 (en) | 2019-07-05 | 2024-03-27 | Atotech Deutschland GmbH & Co. KG | System for conveying a substrate between processing stations of a processing apparatus, processing apparatus and methods of handling a substrate |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07113159B2 (en) * | 1988-08-29 | 1995-12-06 | 日本電装株式会社 | Plating equipment |
US5421987A (en) * | 1993-08-30 | 1995-06-06 | Tzanavaras; George | Precision high rate electroplating cell and method |
US5522975A (en) * | 1995-05-16 | 1996-06-04 | International Business Machines Corporation | Electroplating workpiece fixture |
JP3523197B2 (en) * | 1998-02-12 | 2004-04-26 | エーシーエム リサーチ,インコーポレイティド | Plating equipment and method |
US6280581B1 (en) * | 1998-12-29 | 2001-08-28 | David Cheng | Method and apparatus for electroplating films on semiconductor wafers |
JP2001049494A (en) * | 1999-08-11 | 2001-02-20 | Ebara Corp | Plating device |
AU2002367224A1 (en) * | 2001-12-24 | 2003-07-15 | Koninklijke Philips Electronics N.V. | Apparatus and method for electroplating a wafer surface |
JP2008019496A (en) * | 2006-07-14 | 2008-01-31 | Matsushita Electric Ind Co Ltd | Electrolytically plating apparatus and electrolytically plating method |
DE102007026633B4 (en) * | 2007-06-06 | 2009-04-02 | Atotech Deutschland Gmbh | Apparatus and method for the electrolytic treatment of plate-shaped goods |
FR2933425B1 (en) * | 2008-07-01 | 2010-09-10 | Alchimer | PROCESS FOR PREPARING AN ELECTRIC INSULATING FILM AND APPLICATION FOR METALLIZING VIAS THROUGH |
KR101470610B1 (en) * | 2012-11-15 | 2014-12-24 | (주)비엠씨 | Deposition apparatus containing moving deposition source |
EP2746432A1 (en) | 2012-12-20 | 2014-06-25 | Atotech Deutschland GmbH | Device for vertical galvanic metal deposition on a substrate |
US9399827B2 (en) * | 2013-04-29 | 2016-07-26 | Applied Materials, Inc. | Microelectronic substrate electro processing system |
EP2813601A1 (en) * | 2013-06-14 | 2014-12-17 | ATOTECH Deutschland GmbH | Device for moving a substrate holder during a vertical gal-vanic metal deposition, and a method for vertical galvanic metal deposition using such a device |
JP6813490B2 (en) * | 2015-08-05 | 2021-01-13 | アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングAtotech Deutschland GmbH | Board cage receiving device |
-
2015
- 2015-12-03 EP EP15197885.5A patent/EP3176288A1/en not_active Withdrawn
-
2016
- 2016-12-01 JP JP2018528787A patent/JP6713536B2/en active Active
- 2016-12-01 CN CN201680056415.8A patent/CN108138347B/en active Active
- 2016-12-01 US US15/756,755 patent/US10407788B2/en active Active
- 2016-12-01 EP EP16805782.6A patent/EP3384071B1/en active Active
- 2016-12-01 KR KR1020187018200A patent/KR102166198B1/en active IP Right Grant
- 2016-12-01 WO PCT/EP2016/079395 patent/WO2017093382A1/en active Application Filing
- 2016-12-01 PT PT168057826T patent/PT3384071T/en unknown
- 2016-12-02 TW TW105139888A patent/TWI701360B/en active
Also Published As
Publication number | Publication date |
---|---|
PT3384071T (en) | 2020-08-31 |
EP3176288A1 (en) | 2017-06-07 |
KR102166198B1 (en) | 2020-10-16 |
TWI701360B (en) | 2020-08-11 |
JP6713536B2 (en) | 2020-06-24 |
WO2017093382A1 (en) | 2017-06-08 |
US20180265999A1 (en) | 2018-09-20 |
EP3384071B1 (en) | 2020-06-03 |
CN108138347B (en) | 2020-07-10 |
KR20180086243A (en) | 2018-07-30 |
CN108138347A (en) | 2018-06-08 |
US10407788B2 (en) | 2019-09-10 |
JP2018536095A (en) | 2018-12-06 |
TW201728788A (en) | 2017-08-16 |
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