EP3368865B1 - Device for measuring characteristics of a fluid - Google Patents

Device for measuring characteristics of a fluid Download PDF

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Publication number
EP3368865B1
EP3368865B1 EP16787881.8A EP16787881A EP3368865B1 EP 3368865 B1 EP3368865 B1 EP 3368865B1 EP 16787881 A EP16787881 A EP 16787881A EP 3368865 B1 EP3368865 B1 EP 3368865B1
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EP
European Patent Office
Prior art keywords
sensor
support
main face
electrical contact
contact element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
EP16787881.8A
Other languages
German (de)
French (fr)
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EP3368865A1 (en
Inventor
Philippe Robert
Jean-Philippe Polizzi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
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Publication of EP3368865A1 publication Critical patent/EP3368865A1/en
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0069—Electrical connection means from the sensor to its support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/30—Supports specially adapted for an instrument; Supports specially adapted for a set of instruments
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/142—Multiple part housings
    • G01L19/143—Two part housings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Definitions

  • the invention relates to a device and a method for measuring one or more characteristics of a fluid, for example the pressure, or the force of a flow or the wall force to determine the flow rate, of a liquid fluid. or gaseous.
  • the invention can be applied in particular to a pressure measurement of a fluid for industrial, automotive, medical, avionic, or general public applications, etc.
  • Gas sensors, flow sensors or pressure sensors are found in many fields of application. Whatever the domain considered, reliability and reduction of production costs are essential elements that are sought after. These aspects must be dealt with at the level of the sensitive element, that is to say of the sensor which is produced for example in the form of a MEMS / NEMS component or of an electronic component, but also at the level of the packaging. and the assembly of this sensor.
  • a first solution consists in using a protective gel dispensed inside the case in which the sensor is encapsulated and which covers the membrane of the sensor (which forms the part of the sensor which is sensitive to the characteristic measured) as well as the connectors ( contact pads, connection wires).
  • the housing has an opening leading to the protective gel so that the membrane can be subjected to the characteristic measured via the protective gel.
  • This first solution is not, however, suitable for corrosive environments or measurements of the characteristics of liquids because the protective gel is permeable to humidity and can deteriorate on contact with an aggressive medium. In addition, problems of adhesion and / or aging of the protective gel also arise. In addition, this first solution can only be used for pressure sensors and not for other types of sensor (flow sensor).
  • a second solution consists in encapsulating the sensor in a cavity filled with a non-deformable fluid, generally a silicone oil.
  • a non-deformable fluid generally a silicone oil.
  • the sensor is placed in a box filled with this oil.
  • the housing is then hermetically closed by a cover provided with a flexible metal membrane so that the characterized fluid and the oil encapsulating the sensor are at the same pressure. The pressure is then transmitted to the sensor via the oil.
  • a third solution consists in mounting the sensor on the rear face (“Backside sense silicon packages”).
  • the rear face of the sensor which comprises the part sensitive to the characteristic intended to be measured, is secured to an inner wall of a protective case, for example via a sealing bead.
  • An orifice passes through the housing and opens onto this sensitive part of the sensor so that it is exposed to the fluid to be characterized.
  • Elements of electrical contact of the sensor are on the front face of the sensor which is exposed to the interior volume of the protective box.
  • the electrical contact elements and the connectors are isolated from the fluid by the sealing cord connecting the sensor to the box. The fluid is therefore in contact only with the sensitive part of the sensor which is for example made of silicon.
  • This solution limits temperature drifts and the cost of packaging compared to the second solution described above, and provides more effective protection against corrosive fluids than the first solution using the protective gel.
  • this third solution poses problems of resistance to high pressure (typically greater than about 10 bars), taking into account the mode of transfer of the sensor (on the rear face) to the case which makes it sensitive to tearing in the event of overpressure.
  • the document WO 2010/079004 describes another solution in which the sensor is assembled on a front face of a substrate by flip-chip in order to electrically and mechanically connect the sensor to the substrate. Because the electrical and mechanical connections between the sensor and the substrate are obtained simultaneously by the implementation of the same step, this limits the possible configurations and is moreover difficult to achieve technologically. Furthermore, the electrical connection of the sensor is made on the front face of the substrate which is in contact with the fluid.
  • the electrical contact elements of the sensor and of the support are arranged on the same side of the device, opposite to that intended to be in contact with the fluid to be characterized. These electrical contact elements are well protected vis-à-vis the fluid to be characterized due to the hermetic and / or sealed connection between the sensor and the support, thus hermetically and / or sealingly isolating the two opposite sides of the device.
  • Such a measuring device can therefore be used to characterize an aggressive or corrosive or electrically conductive fluid.
  • the senor is robustly assembled to the support, without the sensor having to undergo tensile stresses which risk causing it to be torn from the support.
  • the support can advantageously be of the ceramic or glass type, which makes it possible to minimize the stresses which would be caused by a difference in thermal expansion coefficients between the sensor and the support.
  • the support can correspond to other types of boxes such as: TO, plastic, CSP ("Chip Scale Package"), etc.
  • Such a measuring device also has the advantage of being able to be produced at low cost.
  • the support can be flat, that is to say can correspond to a layer or a plate.
  • the electrical connections and the mechanical connections may not be made simultaneously, the electrical and mechanical connections between the sensor and the support not being made on the same face of the support.
  • the sensor can correspond to a pressure sensor (absolute or differential), to a flow sensor of a liquid or gaseous fluid.
  • the sensor can also correspond to a microphone, or correspond to any sensor for example of the MEMS / NEMS (“Micro-Electro-Mechanical System / Nano-Electro-Mechanical System”) type.
  • connection between the second main face of the sensor and the second main face of the support can be sealed when the fluid corresponds to a liquid.
  • this joining can be hermetic.
  • the second main face of the support can be intended to be in contact with the fluid.
  • the sensitive part of the sensor may comprise at least one membrane, the sensor possibly being of the piezoresistive or capacitive or piezoelectric or thermal type.
  • the second main face of the sensor can be secured to the second main face of the support by at least one hermetic and / or waterproof sealing bead or by direct bonding.
  • the device comprises at least one cover secured to the second main face of the sensor and delimiting, with the second main face of the sensor, at least one hermetically closed cavity opposite which is disposed at least the sensitive part of the sensor.
  • a configuration makes it possible in particular to form a vacuum in the cavity.
  • the sensitive part of the sensor is not subjected to a pressure coming from the side of the second main face of the sensor, and can therefore measure in absolute value the pressure on the side of the first main face of the sensor, and therefore the pressure of the fluid in absolute value.
  • the second main face of the support can be hermetically secured and / or sealed to the cover which is hermetically secured to the second main face of the sensor.
  • the hermetic and / or sealed mechanical connection between the second main face of the support and the second main face of the sensor is produced by means of the cover.
  • the second electrical contact element can be electrically connected to the first electrical contact element by at least one electrical connection passing through the cover.
  • an electrical connection can correspond for example to a via conductor formed in the cover or any electrical connection passing through an opening formed in the cover.
  • the sensitive part of the sensor is offset laterally relative to the opening of the support, that is to say not to be disposed opposite the opening.
  • This configuration makes it possible to obtain better mechanical and thermal decoupling of the sensor relative to the region of attachment of the sensor to the support situated on the periphery of the opening of the support.
  • the sensitive part of the sensor may not be surrounded by a region of the sensor secured to the support.
  • the region of the sensor secured to the support in this case corresponds to the parts of the sensor in contact, directly or indirectly, with the support or with the sealing bead.
  • a projection of the surface of the sensitive part in a plane parallel to the second main face of the sensor is not superimposed on a projection, in this same plane, of the region of the sensor secured to the support.
  • the device may also comprise at least one protective material covering at least part of the second main face of the sensor and at least part of the second electrical contact element. Additional protection can thus be provided to the elements covered by this protective material, for example a gel or a protective cover.
  • the device may further comprise a support element disposed between the second electrical contact element and the first main face of the support. This configuration is advantageous when the support is made from a material that is not compatible with the production of electrical contact elements thereon.
  • This configuration allows in particular to provide additional protection of the sensor.
  • the device may further comprise at least one protective cover secured to the first main face of the support and forming, with the support and the sensor, at least one volume in which the first electrical contact element is located and a part of the second electrical contact element, the second electrical contact element passing through the support and having one end disposed outside the volume.
  • the volume formed by the protective cover can be hermetically sealed and / or sealed, or the protective cover can be crossed by at least one orifice opening into the volume.
  • Such a protective cover provides additional protection to the sensor and to the electrical contact elements of the device.
  • the volume is closed hermetically, it is possible to form a vacuum in this volume.
  • the sensitive part of the sensor is not subjected to a pressure coming from the side of the second main face of the sensor, and can therefore measure in absolute value the pressure on the side of the first main face of the sensor, and therefore the pressure of the fluid in absolute value.
  • the protective cover is crossed by at least one orifice opening into the volume, the device can perform a relative or differential pressure measurement between the pressure applied by the fluid on the sensitive part of the sensor and the pressure undergone by the sensor on the side of the first main face of the sensor.
  • the second electrical contact element can be electrically connected to the first electrical contact element by means of an electrical and / or electronic element disposed on the first main face of the support.
  • the invention also relates to a measuring assembly comprising at least one measuring device as defined above and a conduit, or pipe, in which the fluid is able to circulate, in which the second main face of the support of the measuring device is hermetically and / or tightly secured to one end or to a wall of the duct such that the sensitive part of the sensor is exposed to the interior of the conduit through the end or an opening formed in the wall of the conduit.
  • the method also comprises, between the production of the support and the attachment of the sensor to the support, a step of attachment of a cover to the second main face of the sensor and delimiting, with the second main face of the sensor, at least one hermetically closed cavity opposite which is arranged at least the sensitive part of the sensor.
  • the device 100 corresponds to a device for measuring the pressure or the pressure variation of a fluid.
  • the device 100 includes a sensor 102 which here corresponds to a MEMS type pressure sensor.
  • the sensor 102 comprises a first main face 104 provided with a part 106 sensitive to the characteristic or characteristics of the fluid to be measured, that is to say here a part sensitive to the pressure exerted by the fluid.
  • the pressure exerted by the fluid on the sensor 102 is symbolized by the arrow referenced 108.
  • This part 106 is formed here by a thinned region of the substrate of the sensor 102, this region forming a membrane acting as an electromechanical transducer sensitive to pressure because this membrane comprises a piezoresistive material.
  • the sensor 102 also includes a second main face 110, opposite to the first main face 104, on which is produced at least a first electrical contact element 112 corresponding to a contact pad on which the pressure measurement signal delivered by the sensor 102 is obtained.
  • the sensor 102 comprises several first electrical contact elements 112 arranged on the second main face 110.
  • the first main face 104 of the sensor 102 is intended to be in contact with the fluid whose pressure is measured, and the second main face 110 of the sensor 102 is intended to be hermetically and / or sealed vis-à-vis the fluid.
  • the device 100 forms a differential pressure measurement device measuring the difference between the pressure to which the first main face 104 is subjected ( fluid pressure) and that prevailing on the side of the second main face 110. If a vacuum is formed on the side of the second main face 110, the device 100 then forms an absolute pressure measuring device measuring the absolute value of the pressure exerted by the fluid on the sensor 102.
  • the device 100 also includes a support 114 comprising a first main face 116 and a second main face 118 opposite the first main face 116.
  • the support 114 is here flat and is for example formed by a ceramic or glass plate on which are deposited conductive tracks for example by screen printing.
  • the support 114 may correspond to a PCB type plate (“Printed Circuit Board”, or printed circuit board).
  • Second electrical contact elements 120 (the support 114 comprises at least a second electrical contact element 120) are arranged on the first main face 116 of the support 114 and are electrically connected to the first electrical contact elements 112 by electrical wires 122 or any other suitable means of electrical connection.
  • the support 114 also includes an opening 124 passing through the entire thickness of the support 114, that is to say formed through the first and second main faces 116, 118 of the support 114.
  • the second main face 110 of the sensor 102 is hermetically and / or sealed to the second main face 118 of the support 114.
  • this hermetic and / or sealed connection is obtained by a sealing bead 126 formed at the periphery of the opening 124 of the support 114 and around the first electrical contact elements 112.
  • the sealing bead 126 may correspond to a bead metallic material, polymer (in the case of a watertight but not hermetic connection), fusible glass, etc.
  • the first electrical contact elements 112 and the sensitive part 106 are arranged opposite the opening 124.
  • the electrical wires 122 pass through the support 114 at this opening 124.
  • the second main face 118 of the support 114 may be in contact with the fluid, but not the first main face 116 of the support 114.
  • all of the connections of the measuring device 100 that is to say the first and second electrical contact elements 112, 120, are hermetically and / or tightly protected from the fluid by virtue of the hermetic and / or sealed connection between the two main faces 110, 118 forming a hermetic and / or sealed barrier against the fluid.
  • the figure 2 represents the measuring device 100 according to a second embodiment.
  • the sensor 102 of the device 100 according to the second embodiment corresponds to a capacitive pressure sensor in which the movements of the membrane corresponding to the sensitive part 106 of the sensor 102 are electrically transformed via a change in the value of an electrical capacity of the sensitive part 106.
  • the other elements of the device 100 according to this second embodiment are similar to those of the device 100 previously described in connection with the figure 1 .
  • the figure 3 shows an example of mounting a measuring device 100, here similar to the device 100 previously described in connection with the figure 1 , in one conduit, or pipe, 202, corresponding for example to a metallic or plastic pipe, in which the fluid, the pressure of which is intended to be measured, circulates, which form a measuring assembly 200.
  • the device 100 is secured hermetically and / or so watertight at one end of the duct 202, or a wall of the duct 202 at an opening 201 formed in this wall, such that the sensitive part 106 of the sensor 102 is exposed inside the duct 202.
  • This connection is made between the wall of the duct 202 and the second main face 116 of the support.
  • the sealing of this connection is ensured in this example by an O-ring 204 disposed on the wall of the duct 202 to which the device 100 is secured, for example by mechanical tightening.
  • the fluid flowing in the conduit 202 exerts pressure on the sensitive part 106 of the sensor 102 and the electrical contact elements 112 and 120 of the sensor 102 and of the support 114 are not exposed to this fluid.
  • the figure 4 shows a measuring device 100 according to a third embodiment.
  • the second electrical contact elements 120 are not disposed directly on the first main face 116 of the support 114, but are disposed on a support element 128 itself disposed on the first main face 116 of the support 114. Without the presence of the support element 128 (as in the first and second embodiments described above), the material of the support 114 must be both compatible with the fluid whose characteristic is measured, capable of forming a sealing and / or hermetic barrier with respect to this fluid, and allowing the production of the second electrical contact elements 120 on its first main face 116.
  • compatibility with the fluid the characteristic is measured and the capacity to form a sealing and / or hermetic barrier vis-à-vis this fluid is dissociated from the compatibility of production of the second elements of c electrical ontact 120, since only the material of the support element 128 must be able to allow the production of the second electrical contact elements 120 thereon.
  • the support element 128 corresponds for example to a printed circuit.
  • the figure 5 shows a measuring device 100 according to a fourth embodiment.
  • the device 100 further comprises a cover 130 secured to the second main face 110 of the sensor 102 and delimiting, with this second main face 110, a cavity 132 hermetically closed, for example under vacuum, at the level of the part of the second main face 110 which is opposite the sensitive part 106.
  • the vacuum cavity 132 allows the device 100 to measure the absolute value of the pressure of the fluid 108 due to the fact that the part of the second main face 110 facing the sensitive element 106 is not subjected to the ambient pressure prevailing on the side of the second main face 110.
  • the cover 130 is sealed under vacuum to the second main face 110.
  • first electrical contact elements 112 are taken out of the cavity 132 by forming hermetic crossings of then the interior of the cavity 132 towards the exterior of this cavity 132 so that these contacts are accessible from the exterior of the cavity 132 and can be electrically connected to the second electrical contact elements 120.
  • the figure 6 shows a measuring device 100 according to a fifth embodiment.
  • the device 100 includes a protective material 134, which corresponds to a protective gel on the example of the figure 6 but which could for example be produced in the form of a protective cover or in another form, here covering the second main face 110 of the sensor 102 as well as the second electrical contact elements 120 and the wires 122. All the elements of electrical connection of the device 100 are here protected by the protective material 134. In the absence of the cover 130 (when the device 100 is intended to perform a differential pressure measurement), this protective material 134 also makes it possible to protect the part of the second main face 110 of the sensor 102 which is here protected by the cover 130 .
  • the production of the protective material 134 is compatible with the embodiments previously described.
  • the figure 7 shows a measuring device 100 according to a sixth embodiment.
  • the support 114 is part of a housing 136 surrounding the sensor 102.
  • This housing 136 forms a first volume 138 in which the sensitive part 106 of the sensor 102 is arranged and a second volume 140 in which the first electrical contact elements 112 and a portion of the second electrical contact elements 120 are disposed.
  • the first and second volumes 138, 140 are hermetically isolated from one another by virtue of the hermetic connection made between the sensor 102 and the support 114.
  • the housing 136 also comprises an orifice 142 opening into the first volume 138 and allowing for the fluid to enter this first volume 138 and to come into contact with the sensitive part 106 of the sensor 102.
  • the second electrical contact elements 120 extend on the support 114 such that they pass through the housing 136 and that ends 144 of these second electrical contact elements 120 open out of the housing 136.
  • This box 136 provides protection for the sensor 102 as well as for the connection of the device 100.
  • this device 100 can perform an absolute or differential pressure measurement even in the absence of the cover. 130.
  • Such a housing 136 can also be produced for the various embodiments previously described.
  • the figure 8 shows a measuring device 100 according to a seventh embodiment.
  • the device 100 includes a protective cover 146 secured to the first main face 116 of the support 114 and forming, with the support 114 and the sensor 102, a volume 148 in which the first electrical contact elements 110 are located and a part of the second electrical contact elements 120.
  • the cover 146 provides protection for the electronic part of the device 100.
  • the second elements electrical contact 120 pass through the support 114 (through the main faces 116, 118 of the support 114) so that these electrical contact elements 120 are accessible from outside the volume 148.
  • a waterproof and / or hermetic material 150 present around the parts of the second electrical contact elements 120 passing through the support 114 provide sealing and / or hermeticity between the second main face 118 of the support 118 and the interior of the volume 148.
  • the volume 148 can be hermetically sealed. In this case, the cover 130 can be removed.
  • the figure 9 shows a measuring device 100 according to an eighth embodiment.
  • the protective cover 146 is secured to the first main face 116 of the support 114.
  • the cover 146 is here crossed by an orifice 152 thus putting the interior of the volume 148 into communication with the ambient atmosphere on the side of the first main face 116 of the support 114, and in particular the pressure of this atmosphere symbolized by the arrow referenced 154 on the figure 9 .
  • the device 100 here performs a differential pressure measurement between the pressure 108 of the fluid and the pressure 154 to which the second main face 110 of the sensor 102 is subjected.
  • the second main face 110 of the sensor 102 is protected by the protective material 134, here a protective gel.
  • a differential pressure measurement is carried out because this protective gel 134 transmits the pressure 154 on the second main face of the sensor 102.
  • the figure 10 shows a measuring device 100 according to a ninth embodiment.
  • This measurement device 100 includes all the elements of that previously described in connection with the figure 8 .
  • the electrical connection between one of the first electrical contact elements 112 and one of the second electrical contact elements 120 is not produced directly by a wire 122, but by means of an electrical and / or electronic circuit 156, for example an ASIC (“Application-Specific Integrated Circuit”) circuit, an electronic card, or more generally any intermediate electrical and / or electronic element.
  • this element 156 is disposed in the volume 148, on the first main face 116 of the support 114. Wires 122 make the electrical connections between the first electrical contact element 112 and the circuit 156, and between the circuit 156 and the second element electrical contact 120.
  • Such an “indirect” electrical connection between the two electrical contact elements 112, 120 can be produced for one or more of the first and second electrical contact elements 112, 120.
  • such an electrical connection via the circuit 156 can be carried out in the various embodiments previously described.
  • the figure 11 shows a measuring device 100 according to a tenth embodiment.
  • the support 114 is not secured directly to the second main face 110 of the sensor 102.
  • the cover 130 is here produced such that it includes parts 158 on which the second main face 118 of the support 114 is hermetically secured by the sealing bead 126, the cover 130 (and therefore also the parts 158) being hermetically secured to the second main face 110 of the sensor 102.
  • the second electrical contact elements 120 are electrically connected to the first electrical contact elements 112 by means of the electrical wires 122 which pass through the cover 130 via openings 160 formed in the parts 158 of the cover 130.
  • Such a cover 130 is compatible with the embodiments previously described.
  • the figure 12 shows a measuring device 100 according to an eleventh embodiment.
  • the cover 130 has a large thickness and occupies part of the opening 124 formed through the support 114.
  • the first electrical contact elements 112 are electrically connected to the second electrical contact elements 120 by the wires 122 but also by conductive vias (or TSV for “Through Silicon Via”) 162 which pass through the cover 130.
  • conductive vias or TSV for “Through Silicon Via”
  • Such an embodiment allows, because the contact pads to which the wires 122 are connected are not formed directly by the first electrical contact elements 112 but by studs 164 present on the top of the cover 130 and to which the conductive vias 162 are connected, to produce the sensor 102 with a reduced size. This also facilitates the electrical connection between the first electrical contact elements 112 and the second electrical contact elements 120.
  • Such a cover 130 and the conductive vias 162 can be produced in the various embodiments previously described.
  • the measuring device 100 is made such that the first electrical contact element (s) 112 are disposed opposite the opening 124 passing through the support 114, the electrical connections formed by the wires 122 or the vias conductors 162 between these first electrical contact elements 112 and the second electrical contact elements 120 passing through this opening 124.
  • the sensitive part 106 of the sensor 102 is also disposed opposite this opening 124.
  • the figure 13 shows the measuring device 100 according to a twelfth embodiment in which the sensitive part 106 of the sensor 102 is offset laterally relative to the opening 124.
  • the first electrical contact elements 112 is arranged in view of the opening 124.
  • the wire 122 which connects this first electrical contact element 112 to the second electrical contact element 120 passes through the opening 124 as well as the cover 130 thanks to an opening 160 formed in the cover 130.
  • the support 114 is hermetically secured to a part 158 of the cover 130 at the periphery of the opening 124 by the sealing bead 126, the cover 130 being itself hermetically secured to the sensor 102.
  • the figure 14 represents the measuring device 100 according to a thirteenth embodiment.
  • This measuring device 100 is substantially similar to that previously described in connection with the figure 13 , except that the support 114 is here secured directly to the second main face 110 of the sensor 102.
  • the embodiments represented on the Figures 13 and 14 have the advantage of shifting the sensitive part 106 of the sensor 102 from the sealing zone between the support 114 and the sensor 102, which makes it possible to obtain better mechanical and thermal decoupling of the sensitive part 106 of the sensor 102 vis-à-vis the sealing area.
  • This offset of the sensitive part 106 of the sensor 102 with respect to the sealing zone can also be achieved in the embodiments previously described.
  • a method of producing a measuring device 100 for example similar to that previously described in connection with the figure 8 , is described below in conjunction with Figures 15A to 15D .
  • the sensor 102 is firstly produced in MEMS technology.
  • the cover 130 is secured hermetically on the first main face 110 of the sensor 102.
  • the support 114 is also prepared by forming the opening 124 through the main faces 116 and 118 of the support 114.
  • the second contact elements 120 are secured to the support 114 by passing them through the support 114 as shown in the figure 15A .
  • the sensor 102 is first of all aligned with the opening 124 of the support 114, then hermetically secured to the support 114 by soldering, with the sealing bead 126 ( figure 15B ).
  • the electrical connections between the first electrical contact elements 112 and the second electrical contact elements 120 are then produced by connecting the wires 122 to these elements ( figure 15C ).
  • the measuring device 100 is completed by sealing the protective cover 146 on the first main face 116 of the support 114.
  • This sealing is for example carried out by resistance welding, soldering, gluing, fusible glass, or any other suitable sealing technique .
  • the measuring device 100 corresponds to a device for measuring the pressure of a fluid, the sensor 102 corresponding to a pressure sensor. It is however possible that the sensor 102 is able to measure one or more characteristics of the fluid other than the pressure, or corresponds to another type of sensor, for example a microphone.
  • the hermetic and / or sealed connection between the sensor 102 and the support 114 is produced by the sealing bead 126.
  • the connection between the sensor 102 and the support 114 is carried out by the implementation of a direct bonding, also called bonding by molecular adhesion, between the sensor 102 and the support 114.
  • this bonding direct can be implemented by using or not using portions of suitable materials which are deposited beforehand on the sensor 102 and the support 114, for example portions of SiO 2 .
  • the electrical connections between the first and second electrical contact elements can be formed by different connection elements than those previously described, such as for example conductive balls or any other suitable means.

Description

DOMAINE TECHNIQUE ET ART ANTÉRIEURTECHNICAL AREA AND PRIOR ART

L'invention porte sur un dispositif et un procédé de mesure d'une ou plusieurs caractéristiques d'un fluide, par exemple la pression, ou encore la force d'un écoulement ou la force pariétale pour déterminer le débit, d'un fluide liquide ou gazeux. L'invention peut s'appliquer notamment à une mesure de pression d'un fluide pour des applications industrielles, automobiles, médicales, avioniques, ou encore grand public, etc.The invention relates to a device and a method for measuring one or more characteristics of a fluid, for example the pressure, or the force of a flow or the wall force to determine the flow rate, of a liquid fluid. or gaseous. The invention can be applied in particular to a pressure measurement of a fluid for industrial, automotive, medical, avionic, or general public applications, etc.

Les capteurs de gaz, les capteurs de débit ou les capteurs de pression, se retrouvent dans de nombreux domaines d'application. Quel que soit le domaine considéré, la fiabilité et la réduction des coûts de réalisation sont des éléments essentiels qui sont recherchés. Ces aspects doivent être traités au niveau de l'élément sensible, c'est-à-dire du capteur qui est réalisé par exemple sous la forme d'un composant MEMS/NEMS ou d'un composant électronique, mais également au niveau du packaging et de l'assemblage de ce capteur.Gas sensors, flow sensors or pressure sensors are found in many fields of application. Whatever the domain considered, reliability and reduction of production costs are essential elements that are sought after. These aspects must be dealt with at the level of the sensitive element, that is to say of the sensor which is produced for example in the form of a MEMS / NEMS component or of an electronic component, but also at the level of the packaging. and the assembly of this sensor.

Pour assurer le maximum de fiabilité, notamment pour des environnements ayant des contraintes sévères (gaz ou fluides corrosifs, tenue du capteur à haute pression et/ou à haute température), le packaging et l'assemblage du capteur doivent être à même d'offrir :

  • une configuration d'assemblage protégeant la connectique vis-à-vis du milieu dans lequel la mesure est réalisée (pour éviter les risques de corrosion, de court-circuit, etc.) ;
  • un assemblage du capteur avec le boitier qui soit capable de tenir des hautes pressions (par exemple supérieures à 10 bars) et/ou des chocs en pression, sans risque d'arrachement du capteur ;
  • si possible une configuration de packaging limitant les contraintes mécaniques sur le capteur dues à l'assemblage avec le boitier et les contraintes thermiques sur le capteur liées à son report ;
  • une approche à bas coût (report et assemblage simple, comportant un nombre limité d'éléments).
To ensure maximum reliability, especially for environments with severe constraints (corrosive gases or fluids, resistance of the sensor to high pressure and / or high temperature), the packaging and assembly of the sensor must be able to offer :
  • an assembly configuration protecting the connections vis-à-vis the environment in which the measurement is made (to avoid the risk of corrosion, short-circuit, etc.);
  • an assembly of the sensor with the housing which is capable of withstanding high pressures (for example greater than 10 bars) and / or pressure shocks, without the risk of the sensor tearing off;
  • if possible, a packaging configuration limiting the mechanical stresses on the sensor due to assembly with the housing and the thermal stresses on the sensor linked to its transfer;
  • a low cost approach (simple transfer and assembly, comprising a limited number of elements).

Pour protéger la connectique vis-à-vis du milieu dans lequel la mesure est réalisée et répondre au problème de tenue du capteur aux hautes pressions et aux hautes températures, plusieurs solutions existent.To protect the connection with respect to the environment in which the measurement is carried out and to respond to the problem of the sensor withstand high pressures and high temperatures, several solutions exist.

Une première solution consiste à utiliser un gel de protection dispensé à l'intérieur du boitier dans lequel le capteur est encapsulé et qui recouvre la membrane du capteur (qui forme la partie du capteur qui est sensible à la caractéristique mesurée) ainsi que la connectique (plots de contact, fils de connexion). Le boitier comporte un orifice débouchant sur le gel de protection afin que la membrane puisse être soumise à la caractéristique mesurée via le gel de protection.A first solution consists in using a protective gel dispensed inside the case in which the sensor is encapsulated and which covers the membrane of the sensor (which forms the part of the sensor which is sensitive to the characteristic measured) as well as the connectors ( contact pads, connection wires). The housing has an opening leading to the protective gel so that the membrane can be subjected to the characteristic measured via the protective gel.

Cette première solution n'est toutefois pas adaptée aux environnements corrosifs ou aux mesures de caractéristiques de liquides car le gel de protection est perméable à l'humidité et peut se détériorer au contact d'un milieu agressif. De plus, des problèmes d'adhérence et/ou de vieillissement du gel de protection se posent également. En outre, cette première solution ne peut être utilisée que pour des capteurs de pression et non pour d'autres types de capteur (capteur de débit).This first solution is not, however, suitable for corrosive environments or measurements of the characteristics of liquids because the protective gel is permeable to humidity and can deteriorate on contact with an aggressive medium. In addition, problems of adhesion and / or aging of the protective gel also arise. In addition, this first solution can only be used for pressure sensors and not for other types of sensor (flow sensor).

Une deuxième solution consiste à encapsuler le capteur dans une cavité remplie d'un fluide non déformable, généralement une huile siliconée. Dans ce cas, le capteur est placé dans un boitier rempli de cette huile. Le boitier est ensuite fermé hermétiquement par un couvercle muni d'une membrane métallique souple afin que le fluide caractérisé et l'huile encapsulant le capteur soient à la même pression. La pression est alors transmise sur le capteur via l'huile.A second solution consists in encapsulating the sensor in a cavity filled with a non-deformable fluid, generally a silicone oil. In this case, the sensor is placed in a box filled with this oil. The housing is then hermetically closed by a cover provided with a flexible metal membrane so that the characterized fluid and the oil encapsulating the sensor are at the same pressure. The pressure is then transmitted to the sensor via the oil.

Toutefois, un tel packaging selon cette deuxième solution est coûteux car complexe à réaliser. Cette solution est complexe à mettre en œuvre car elle nécessite de réaliser une fermeture hermétique du boitier sans créer de pression initiale dans l'huile et sans emprisonner de bulle d'air qui entraverait la bonne transmission de la pression au capteur. En outre, ce type de packaging est source de dérives thermiques liées à l'huile utilisée et sujet au vieillissement de l'huile utilisée. Enfin, cette deuxième solution n'est utilisable que pour un capteur de pression.However, such packaging according to this second solution is expensive because it is complex to produce. This solution is complex to implement because it requires hermetically closing the housing without creating initial pressure in the oil and without trapping an air bubble which would impede the proper transmission of the pressure to the sensor. In addition, this type of packaging is a source of thermal drifts linked to the oil used and subject to aging of the oil used. Finally, this second solution can only be used for a pressure sensor.

Une troisième solution consiste à réaliser un montage du capteur en face arrière (« Backside sense silicon packages »). Suivant cette configuration, la face arrière du capteur, qui comporte la partie sensible à la caractéristique destinée à être mesurée, est solidarisée à une paroi intérieure d'un boitier de protection par exemple via un cordon de scellement. Un orifice traverse le boitier et débouche sur cette partie sensible du capteur afin qu'elle soit exposée au fluide à caractériser. Des éléments de contact électrique du capteur se trouvent sur la face avant du capteur qui est exposée au volume intérieur du boitier de protection. Les éléments de contact électrique et la connectique sont isolés du fluide par le cordon de scellement reliant le capteur au boitier. Le fluide n'est donc en contact qu'avec la partie sensible du capteur qui est par exemple en silicium.A third solution consists in mounting the sensor on the rear face (“Backside sense silicon packages”). According to this configuration, the rear face of the sensor, which comprises the part sensitive to the characteristic intended to be measured, is secured to an inner wall of a protective case, for example via a sealing bead. An orifice passes through the housing and opens onto this sensitive part of the sensor so that it is exposed to the fluid to be characterized. Elements of electrical contact of the sensor are on the front face of the sensor which is exposed to the interior volume of the protective box. The electrical contact elements and the connectors are isolated from the fluid by the sealing cord connecting the sensor to the box. The fluid is therefore in contact only with the sensitive part of the sensor which is for example made of silicon.

Cette solution limite les dérives en température et le coût du packaging par rapport à la deuxième solution exposée précédemment, et confère une protection plus efficace vis-à-vis des fluides corrosifs que la première solution utilisant le gel de protection.This solution limits temperature drifts and the cost of packaging compared to the second solution described above, and provides more effective protection against corrosive fluids than the first solution using the protective gel.

Par contre, cette troisième solution pose des problèmes de tenue à haute pression (typiquement supérieures à environ 10 bars), compte tenu du mode de report du capteur (en face arrière) sur le boitier qui le rend sensible à l'arrachement en cas de surpression.On the other hand, this third solution poses problems of resistance to high pressure (typically greater than about 10 bars), taking into account the mode of transfer of the sensor (on the rear face) to the case which makes it sensitive to tearing in the event of overpressure.

Le document WO 2010/079004 décrit une autre solution dans laquelle le capteur est assemblé sur une face avant d'un substrat par flip-chip afin de relier électriquement et mécaniquement le capteur au substrat. Du fait que les connexions électrique et mécanique entre le capteur et le substrat sont obtenues simultanément par la mise en œuvre d'une même étape, cela limite les configurations possibles et est de plus difficile à réaliser technologiquement. Par ailleurs, la connexion électrique du capteur se fait sur la face avant du substrat qui est en contact avec le fluide.The document WO 2010/079004 describes another solution in which the sensor is assembled on a front face of a substrate by flip-chip in order to electrically and mechanically connect the sensor to the substrate. Because the electrical and mechanical connections between the sensor and the substrate are obtained simultaneously by the implementation of the same step, this limits the possible configurations and is moreover difficult to achieve technologically. Furthermore, the electrical connection of the sensor is made on the front face of the substrate which is in contact with the fluid.

EXPOSÉ DE L'INVENTIONSTATEMENT OF THE INVENTION

Un but de la présente invention est de proposer un dispositif de mesure répondant aux problèmes exposés ci-dessus pour les solutions d'assemblage et de packaging de capteur de l'art antérieur, c'est-à-dire permettant :

  • de protéger efficacement les connexions électriques du dispositif de mesure vis-à-vis du fluide à caractériser ;
  • de réaliser un assemblage capteur/boitier robuste ;
  • de limiter les contraintes mécaniques et thermiques sur le capteur ;
  • qui puisse être réalisé à faible coût.
An object of the present invention is to propose a measuring device responding to the problems set out above for the assembly and packaging solutions of sensor of the prior art, that is to say allowing:
  • effectively protect the electrical connections of the measuring device from the fluid to be characterized;
  • to make a robust sensor / box assembly;
  • limit mechanical and thermal stresses on the sensor;
  • that can be achieved at low cost.

Pour cela, la présente invention propose un dispositif de mesure d'au moins une caractéristique d'un fluide, comportant au moins :

  • un capteur comprenant une première face principale munie d'au moins une partie sensible à ladite caractéristique et destinée à être en contact avec le fluide, et une deuxième face principale opposée à la première face principale et munie d'au moins un premier élément de contact électrique sur lequel au moins un signal de mesure du capteur est apte à être obtenu ;
  • un support comprenant une première face principale munie d'au moins un deuxième élément de contact électrique relié électriquement au premier élément de contact électrique, une deuxième face principale opposée à la première face principale du support, et au moins une ouverture traversant les première et deuxième faces principales du support ;
dans lequel la deuxième face principale du capteur est solidarisée de manière étanche et/ou hermétique à la deuxième face principale du support au moins au niveau de la périphérie de l'ouverture et telle qu'au moins une partie du premier élément de contact électrique soit disposée en regard de et/ou dans l'ouverture, et dans lequel la partie sensible du capteur est déportée latéralement par rapport à l'ouverture du support et n'est pas entourée par une région du capteur solidarisée au support.For this, the present invention provides a device for measuring at least one characteristic of a fluid, comprising at least:
  • a sensor comprising a first main face provided with at least one part sensitive to said characteristic and intended to be in contact with the fluid, and a second main face opposite to the first main face and provided with at least one first contact element electrical on which at least one sensor measurement signal is able to be obtained;
  • a support comprising a first main face provided with at least one second electrical contact element electrically connected to the first electrical contact element, a second main face opposite the first main face of the support, and at least one opening passing through the first and second main faces of the support;
wherein the second main face of the sensor is secured in a sealed and / or hermetic manner to the second main face of the support at least at the periphery of the opening and such that at least part of the first electrical contact element is disposed opposite and / or in the opening, and in which the sensitive part of the sensor is offset laterally relative to the opening of the support and is not surrounded by a region of the sensor secured to the support.

Dans un tel dispositif de mesure, les éléments de contact électrique du capteur et du support sont disposés du même côté du dispositif, opposé à celui destiné à être en contact avec le fluide à caractériser. Ces éléments de contact électrique sont bien protégés vis-à-vis du fluide à caractériser en raison de la solidarisation hermétique et/ou étanche entre le capteur et le support, isolant ainsi hermétiquement et/ou de manière étanche les deux côtés opposés du dispositif. Un tel dispositif de mesure est donc utilisable pour caractériser un fluide agressif ou corrosif ou électriquement conducteur.In such a measuring device, the electrical contact elements of the sensor and of the support are arranged on the same side of the device, opposite to that intended to be in contact with the fluid to be characterized. These electrical contact elements are well protected vis-à-vis the fluid to be characterized due to the hermetic and / or sealed connection between the sensor and the support, thus hermetically and / or sealingly isolating the two opposite sides of the device. Such a measuring device can therefore be used to characterize an aggressive or corrosive or electrically conductive fluid.

De plus, dans un tel dispositif de mesure, le capteur est assemblé de manière robuste au support, sans que le capteur n'ait à subir des contraintes de traction risquant de provoquer son arrachement du support.In addition, in such a measuring device, the sensor is robustly assembled to the support, without the sensor having to undergo tensile stresses which risk causing it to be torn from the support.

Le support peut être avantageusement de type céramique ou verre, ce qui permet de minimiser les contraintes qui seraient occasionnées par une différence de coefficients de dilatation thermique entre le capteur et le support. Toutefois, le support peut correspondre à d'autres types de boitiers tels que : TO, plastique, CSP (« Chip Scale Package »), etc.The support can advantageously be of the ceramic or glass type, which makes it possible to minimize the stresses which would be caused by a difference in thermal expansion coefficients between the sensor and the support. However, the support can correspond to other types of boxes such as: TO, plastic, CSP ("Chip Scale Package"), etc.

Un tel dispositif de mesure a également pour avantage de pouvoir être réalisé à bas coût.Such a measuring device also has the advantage of being able to be produced at low cost.

Dans le dispositif selon l'invention, le support peut être plan, c'est-à-dire peut correspondre à une couche ou une plaque.In the device according to the invention, the support can be flat, that is to say can correspond to a layer or a plate.

Dans le dispositif de mesure, les connexions électriques et les connexions mécaniques peuvent ne pas être réalisées simultanément, les connexions électriques et mécaniques entre le capteur et le support n'étant pas réalisées sur la même face du support.In the measuring device, the electrical connections and the mechanical connections may not be made simultaneously, the electrical and mechanical connections between the sensor and the support not being made on the same face of the support.

Le capteur peut correspondre à un capteur de pression (absolue ou différentielle), à un capteur de débit d'un fluide liquide ou gazeux. Le capteur peut également correspondre à un microphone, ou correspondre à n'importe quel capteur par exemple de type MEMS/NEMS (« Micro-Electro-Mechanical System/Nano-Electro-Mechanical System »).The sensor can correspond to a pressure sensor (absolute or differential), to a flow sensor of a liquid or gaseous fluid. The sensor can also correspond to a microphone, or correspond to any sensor for example of the MEMS / NEMS (“Micro-Electro-Mechanical System / Nano-Electro-Mechanical System”) type.

La solidarisation entre la deuxième face principale du capteur et la deuxième face principale du support peut être étanche lorsque le fluide correspond à un liquide. Lorsque le fluide est gazeux, cette solidarisation peut être hermétique.The connection between the second main face of the sensor and the second main face of the support can be sealed when the fluid corresponds to a liquid. When the fluid is gaseous, this joining can be hermetic.

La deuxième face principale du support peut être destinée à être en contact avec le fluide.The second main face of the support can be intended to be in contact with the fluid.

La partie sensible du capteur peut comporter au moins une membrane, le capteur pouvant être de type piézorésistif ou capacitif ou piézoélectrique ou thermique.The sensitive part of the sensor may comprise at least one membrane, the sensor possibly being of the piezoresistive or capacitive or piezoelectric or thermal type.

La deuxième face principale du capteur peut être solidarisée à la deuxième face principale du support par au moins un cordon de scellement hermétique et/ou étanche ou par collage direct.The second main face of the sensor can be secured to the second main face of the support by at least one hermetic and / or waterproof sealing bead or by direct bonding.

Le dispositif comporte au moins un capot solidarisé à la deuxième face principale du capteur et délimitant, avec la deuxième face principale du capteur, au moins une cavité fermée hermétiquement en regard de laquelle est disposée au moins la partie sensible du capteur. Une telle configuration permet notamment de former un vide dans la cavité. Ainsi, la partie sensible du capteur n'est pas soumise à une pression provenant du côté de la deuxième face principale du capteur, et peut donc mesurer en valeur absolue la pression du côté de la première face principale du capteur, et donc la pression du fluide en valeur absolue.The device comprises at least one cover secured to the second main face of the sensor and delimiting, with the second main face of the sensor, at least one hermetically closed cavity opposite which is disposed at least the sensitive part of the sensor. Such a configuration makes it possible in particular to form a vacuum in the cavity. Thus, the sensitive part of the sensor is not subjected to a pressure coming from the side of the second main face of the sensor, and can therefore measure in absolute value the pressure on the side of the first main face of the sensor, and therefore the pressure of the fluid in absolute value.

La deuxième face principale du support peut être solidarisée de manière hermétique et/ou étanche au capot qui est solidarisé hermétiquement à la deuxième face principale du capteur. Ainsi, la liaison mécanique hermétique et/ou étanche entre la deuxième face principale du support et la deuxième face principale du capteur est réalisée par l'intermédiaire du capot.The second main face of the support can be hermetically secured and / or sealed to the cover which is hermetically secured to the second main face of the sensor. Thus, the hermetic and / or sealed mechanical connection between the second main face of the support and the second main face of the sensor is produced by means of the cover.

Le deuxième élément de contact électrique peut être relié électriquement au premier élément de contact électrique par au moins une liaison électrique traversant le capot. Une telle liaison électrique peut correspondre par exemple à un via conducteur formé dans le capot ou toute liaison électrique passant par une ouverture formée dans le capot.The second electrical contact element can be electrically connected to the first electrical contact element by at least one electrical connection passing through the cover. Such an electrical connection can correspond for example to a via conductor formed in the cover or any electrical connection passing through an opening formed in the cover.

La partie sensible du capteur est déportée latéralement par rapport à l'ouverture du support, c'est-à-dire ne pas être disposée en regard de l'ouverture. Cette configuration permet d'obtenir un meilleur découplage mécanique et thermique du capteur par rapport à la région de solidarisation du capteur au support située en périphérie de l'ouverture du support. En outre, dans cette configuration, la partie sensible du capteur peut ne pas être entourée par une région du capteur solidarisée au support. Ainsi, les contraintes mécaniques générées par l'assemblage étanche et/ou hermétique entre la deuxième face principale du support et la deuxième face principale du capteur, au niveau de la région du capteur solidarisée au support, n'impactent pas la partie sensible du capteur, et donc le fonctionnement du capteur, notamment dans le cas d'un capteur de pression dont le principe de mesure est intrinsèquement sensible aux contraintes mécaniques. La région du capteur solidarisée au support correspond dans ce cas aux parties du capteur en contact, directement ou non, avec le support ou avec le cordon de scellement. Autrement dit, une projection de la surface de la partie sensible dans un plan parallèle à la deuxième face principale du capteur ne se superpose pas à une projection, dans ce même plan, de la région du capteur solidarisée au support.The sensitive part of the sensor is offset laterally relative to the opening of the support, that is to say not to be disposed opposite the opening. This configuration makes it possible to obtain better mechanical and thermal decoupling of the sensor relative to the region of attachment of the sensor to the support situated on the periphery of the opening of the support. In addition, in this configuration, the sensitive part of the sensor may not be surrounded by a region of the sensor secured to the support. Thus, the mechanical stresses generated by the sealed and / or hermetic assembly between the second main face of the support and the second main face of the sensor, at the level of the region of the sensor secured to the support, does not impact the sensitive part of the sensor, and therefore the operation of the sensor, in particular in the case of a pressure sensor whose measurement principle is intrinsically sensitive to mechanical stresses. The region of the sensor secured to the support in this case corresponds to the parts of the sensor in contact, directly or indirectly, with the support or with the sealing bead. In other words, a projection of the surface of the sensitive part in a plane parallel to the second main face of the sensor is not superimposed on a projection, in this same plane, of the region of the sensor secured to the support.

Le dispositif peut comporter en outre au moins un matériau de protection recouvrant au moins une partie de la deuxième face principale du capteur et au moins une partie du deuxième élément de contact électrique. Une protection supplémentaire peut ainsi être apportée aux éléments recouverts par ce matériau de protection, par exemple un gel ou un couvercle de protection.The device may also comprise at least one protective material covering at least part of the second main face of the sensor and at least part of the second electrical contact element. Additional protection can thus be provided to the elements covered by this protective material, for example a gel or a protective cover.

Le dispositif peut comporter en outre un élément de support disposé entre le deuxième élément de contact électrique et la première face principale du support. Cette configuration est avantageuse lorsque le support est réalisé à partir d'un matériau non compatible avec la réalisation d'éléments de contact électrique sur celui-ci.The device may further comprise a support element disposed between the second electrical contact element and the first main face of the support. This configuration is advantageous when the support is made from a material that is not compatible with the production of electrical contact elements thereon.

Dans une configuration particulière, le dispositif peut être tel que :

  • le support fait partie d'au moins un boitier entourant le capteur en formant au moins un premier volume dans lequel la partie sensible du capteur est disposée et un deuxième volume dans lequel le premier élément de contact électrique et une partie du deuxième élément de contact électrique sont disposés,
  • le support et le capteur forment une séparation hermétique et/ou étanche entre les premier et deuxième volumes,
  • le boitier est muni d'au moins un orifice débouchant dans le premier volume,
  • le deuxième élément de contact électrique traverse le boitier et comporte une extrémité disposée en dehors du boitier.
In a particular configuration, the device can be such that:
  • the support is part of at least one housing surrounding the sensor, forming at least a first volume in which the sensitive part of the sensor is arranged and a second volume in which the first electrical contact element and part of the second electrical contact element are willing,
  • the support and the sensor form a hermetic and / or sealed separation between the first and second volumes,
  • the case is provided with at least one orifice opening into the first volume,
  • the second electrical contact element passes through the housing and has one end disposed outside the housing.

Cette configuration permet notamment d'apporter une protection supplémentaire du capteur.This configuration allows in particular to provide additional protection of the sensor.

Dans une autre configuration, le dispositif peut comporter en outre au moins un couvercle de protection solidarisé à la première face principale du support et formant, avec le support et le capteur, au moins un volume dans lequel se trouvent le premier élément de contact électrique et une partie du deuxième élément de contact électrique, le deuxième élément de contact électrique traversant le support et comportant une extrémité disposée en dehors du volume.In another configuration, the device may further comprise at least one protective cover secured to the first main face of the support and forming, with the support and the sensor, at least one volume in which the first electrical contact element is located and a part of the second electrical contact element, the second electrical contact element passing through the support and having one end disposed outside the volume.

Le volume formé par le couvercle de protection peut être fermé hermétiquement et/ou de manière étanche, ou le couvercle de protection peut être traversé par au moins un orifice débouchant dans le volume.The volume formed by the protective cover can be hermetically sealed and / or sealed, or the protective cover can be crossed by at least one orifice opening into the volume.

Un tel couvercle de protection apporte une protection supplémentaire au capteur et aux éléments de contact électrique du dispositif. De plus, lorsque le volume est fermé hermétiquement, il est possible de former un vide dans ce volume. Ainsi, la partie sensible du capteur n'est pas soumise à une pression provenant du côté de la deuxième face principale du capteur, et peut donc mesurer en valeur absolue la pression du côté de la première face principale du capteur, et donc la pression du fluide en valeur absolue. Lorsque le couvercle de protection est traversé par au moins un orifice débouchant dans le volume, le dispositif peut réaliser une mesure de pression relative ou différentielle entre la pression appliquée par le fluide sur la partie sensible du capteur et la pression subie par le capteur du côté de la première face principale du capteur.Such a protective cover provides additional protection to the sensor and to the electrical contact elements of the device. In addition, when the volume is closed hermetically, it is possible to form a vacuum in this volume. Thus, the sensitive part of the sensor is not subjected to a pressure coming from the side of the second main face of the sensor, and can therefore measure in absolute value the pressure on the side of the first main face of the sensor, and therefore the pressure of the fluid in absolute value. When the protective cover is crossed by at least one orifice opening into the volume, the device can perform a relative or differential pressure measurement between the pressure applied by the fluid on the sensitive part of the sensor and the pressure undergone by the sensor on the side of the first main face of the sensor.

Le deuxième élément de contact électrique peut être relié électriquement au premier élément de contact électrique par l'intermédiaire d'un élément électrique et/ou électronique disposé sur la première face principale du support.The second electrical contact element can be electrically connected to the first electrical contact element by means of an electrical and / or electronic element disposed on the first main face of the support.

L'invention porte également sur un ensemble de mesure comprenant au moins un dispositif de mesure tel que défini précédemment et un conduit, ou tuyau, dans lequel le fluide est apte à circuler, dans lequel la deuxième face principale du support du dispositif de mesure est solidarisée hermétiquement et/ou de manière étanche à une extrémité ou à une paroi du conduit telle que la partie sensible du capteur soit exposée à l'intérieur du conduit par l'intermédiaire de l'extrémité ou d'une ouverture formée dans la paroi du conduit.The invention also relates to a measuring assembly comprising at least one measuring device as defined above and a conduit, or pipe, in which the fluid is able to circulate, in which the second main face of the support of the measuring device is hermetically and / or tightly secured to one end or to a wall of the duct such that the sensitive part of the sensor is exposed to the interior of the conduit through the end or an opening formed in the wall of the conduit.

L'invention porte également sur un procédé de réalisation d'un dispositif de mesure d'au moins une caractéristique d'un fluide, comprenant au moins les étapes suivantes :

  • réalisation d'au moins un capteur comprenant une première face principale munie d'au moins une partie sensible à ladite caractéristique et destinée à être en contact avec le fluide, et une deuxième face principale opposée à la première face principale et munie d'au moins un premier élément de contact électrique sur lequel au moins un signal de mesure du capteur est apte à être obtenu ;
  • réalisation d'au moins un support comprenant une première face principale munie d'au moins un deuxième élément de contact électrique, une deuxième face principale opposée à la première face principale du support, et au moins une ouverture traversant les première et deuxième faces principales du support ;
  • solidarisation hermétique et/ou étanche de la deuxième face principale du capteur à la deuxième face principale du support au moins au niveau de la périphérie de l'ouverture et telle qu'au moins une partie du premier élément de contact électrique soit disposée en regard de et/ou dans l'ouverture ;
  • réalisation d'une liaison électrique reliant le deuxième élément de contact électrique au premier élément de contact électrique;
    et dans lequel la partie sensible du capteur est déportée latéralement par rapport à l'ouverture du support et n'est pas entourée par une région du capteur solidarisée au support.
The invention also relates to a method for producing a device for measuring at least one characteristic of a fluid, comprising at least the following steps:
  • production of at least one sensor comprising a first main face provided with at least one part sensitive to said characteristic and intended to be in contact with the fluid, and a second main face opposite to the first main face and provided with at least a first electrical contact element on which at least one measurement signal from the sensor is able to be obtained;
  • production of at least one support comprising a first main face provided with at least a second electrical contact element, a second main face opposite the first main face of the support, and at least one opening passing through the first and second main faces of the support;
  • hermetic and / or sealed connection of the second main face of the sensor to the second main face of the support at least at the periphery of the opening and such that at least part of the first electrical contact element is disposed opposite and / or in the opening;
  • making an electrical connection connecting the second electrical contact element to the first electrical contact element;
    and in which the sensitive part of the sensor is offset laterally with respect to the opening of the support and is not surrounded by a region of the sensor secured to the support.

Le procédé comporte également, entre la réalisation du support et la solidarisation du capteur au support, une étape de solidarisation d'un capot à la deuxième face principale du capteur et délimitant, avec la deuxième face principale du capteur, au moins une cavité fermée hermétiquement en regard de laquelle est disposée au moins la partie sensible du capteur.The method also comprises, between the production of the support and the attachment of the sensor to the support, a step of attachment of a cover to the second main face of the sensor and delimiting, with the second main face of the sensor, at least one hermetically closed cavity opposite which is arranged at least the sensitive part of the sensor.

BRÈVE DESCRIPTION DES DESSINSBRIEF DESCRIPTION OF THE DRAWINGS

La présente invention sera mieux comprise à la lecture de la description d'exemples de réalisation donnés à titre purement indicatif et nullement limitatif en faisant référence aux dessins annexés sur lesquels :

  • les figures 1 et 2 représentent un dispositif de mesure respectivement selon un premier et un deuxième modes de réalisation ;
  • la figure 3 représente un ensemble de mesure selon un mode de réalisation particulier;
  • les figures 4 à 14 représentent un dispositif de mesure, objet de la présente invention, selon différents modes de réalisation ;
  • les figures 15A à 15D représentent les étapes d'un procédé de réalisation d'un dispositif de mesure, objet de la présente invention, selon un mode de réalisation particulier.
The present invention will be better understood on reading the description of exemplary embodiments given for purely indicative and in no way limiting, with reference to the appended drawings in which:
  • the Figures 1 and 2 represent a measuring device respectively according to a first and a second embodiment;
  • the figure 3 represents a measurement assembly according to a particular embodiment;
  • the figures 4 to 14 represent a measuring device, object of the present invention, according to different embodiments;
  • the Figures 15A to 15D represent the steps of a method for producing a measurement device, object of the present invention, according to a particular embodiment.

Des parties identiques, similaires ou équivalentes des différentes figures décrites ci-après portent les mêmes références numériques de façon à faciliter le passage d'une figure à l'autre.Identical, similar or equivalent parts of the different figures described below have the same reference numerals so as to facilitate the passage from one figure to another.

Les différentes parties représentées sur les figures ne le sont pas nécessairement selon une échelle uniforme, pour rendre les figures plus lisibles.The different parts shown in the figures are not necessarily shown on a uniform scale, to make the figures more readable.

Les différentes possibilités (variantes et modes de réalisation) doivent être comprises comme n'étant pas exclusives les unes des autres et peuvent se combiner entre elles.The different possibilities (variants and embodiments) must be understood as not being mutually exclusive and can be combined with one another.

EXPOSÉ DÉTAILLÉ DE MODES DE RÉALISATION PARTICULIERSDETAILED PRESENTATION OF PARTICULAR EMBODIMENTS

On se réfère tout d'abord à la figure 1 qui représente un dispositif de mesure 100 selon un premier mode de réalisation. Dans ce premier mode de réalisation, le dispositif 100 correspond à un dispositif de mesure de pression ou de variation de pression d'un fluide.We first refer to the figure 1 which represents a measuring device 100 according to a first embodiment. In this first embodiment, the device 100 corresponds to a device for measuring the pressure or the pressure variation of a fluid.

Le dispositif 100 comporte un capteur 102 qui correspond ici à un capteur de pression de type MEMS. Le capteur 102 comporte une première face principale 104 munie d'une partie 106 sensible à la ou aux caractéristiques du fluide à mesurer, c'est-à-dire ici une partie sensible à la pression exercée par le fluide. Sur la figure 1, la pression exercée par le fluide sur le capteur 102 est symbolisée par la flèche référencée 108. Cette partie 106 est formée ici par une région amincie du substrat du capteur 102, cette région formant une membrane agissant comme un transducteur électromécanique sensible à la pression du fait que cette membrane comprend un matériau piézorésistif.The device 100 includes a sensor 102 which here corresponds to a MEMS type pressure sensor. The sensor 102 comprises a first main face 104 provided with a part 106 sensitive to the characteristic or characteristics of the fluid to be measured, that is to say here a part sensitive to the pressure exerted by the fluid. On the figure 1 , the pressure exerted by the fluid on the sensor 102 is symbolized by the arrow referenced 108. This part 106 is formed here by a thinned region of the substrate of the sensor 102, this region forming a membrane acting as an electromechanical transducer sensitive to pressure because this membrane comprises a piezoresistive material.

Le capteur 102 comporte également une deuxième face principale 110, opposée à la première face principale 104, sur laquelle est réalisé au moins un premier élément de contact électrique 112 correspondant à un plot de contact sur lequel le signal de mesure de pression délivré par le capteur 102 est obtenu. Sur la figure 1, le capteur 102 comporte plusieurs premiers éléments de contact électrique 112 disposés sur la deuxième face principale 110.The sensor 102 also includes a second main face 110, opposite to the first main face 104, on which is produced at least a first electrical contact element 112 corresponding to a contact pad on which the pressure measurement signal delivered by the sensor 102 is obtained. On the figure 1 , the sensor 102 comprises several first electrical contact elements 112 arranged on the second main face 110.

La première face principale 104 du capteur 102 est destinée à être en contact avec le fluide dont la pression est mesurée, et la deuxième face principale 110 du capteur 102 est destinée à être isolée hermétiquement et/ou de manière étanche vis-à-vis du fluide. Lorsque la deuxième face principale 110 du capteur 102 est soumise à une pression ambiante régnant du côté de cette face, le dispositif 100 forme alors un dispositif de mesure de pression différentielle mesurant la différence entre la pression à laquelle est soumise la première face principale 104 (pression du fluide) et celle régnant du côté de la deuxième face principale 110. Si un vide est formé du côté de la deuxième face principale 110, le dispositif 100 forme alors un dispositif de mesure de pression absolue mesurant la valeur absolue de la pression exercée par le fluide sur le capteur 102.The first main face 104 of the sensor 102 is intended to be in contact with the fluid whose pressure is measured, and the second main face 110 of the sensor 102 is intended to be hermetically and / or sealed vis-à-vis the fluid. When the second main face 110 of the sensor 102 is subjected to an ambient pressure prevailing on the side of this face, the device 100 then forms a differential pressure measurement device measuring the difference between the pressure to which the first main face 104 is subjected ( fluid pressure) and that prevailing on the side of the second main face 110. If a vacuum is formed on the side of the second main face 110, the device 100 then forms an absolute pressure measuring device measuring the absolute value of the pressure exerted by the fluid on the sensor 102.

Le dispositif 100 comporte également un support 114 comprenant une première face principale 116 et une deuxième face principale 118 opposée à la première face principale 116. Le support 114 est ici plan et est par exemple formé par une plaque de céramique ou de verre sur laquelle sont déposées des pistes conductrices par exemple par sérigraphie. En variante, le support 114 peut correspondre à une plaque de type PCB (« Printed Circuit Board », ou carte de circuit imprimé). Des deuxièmes éléments de contact électrique 120 (le support 114 comporte au moins un deuxième élément de contact électrique 120) sont disposés sur la première face principale 116 du support 114 et sont reliés électriquement aux premiers éléments de contact électrique 112 par des fils électriques 122 ou tout autre moyen de liaison électrique adapté. Le support 114 comporte également une ouverture 124 traversant toute l'épaisseur du support 114, c'est-à-dire formée à travers les première et deuxième faces principales 116, 118 du support 114.The device 100 also includes a support 114 comprising a first main face 116 and a second main face 118 opposite the first main face 116. The support 114 is here flat and is for example formed by a ceramic or glass plate on which are deposited conductive tracks for example by screen printing. As a variant, the support 114 may correspond to a PCB type plate (“Printed Circuit Board”, or printed circuit board). Second electrical contact elements 120 (the support 114 comprises at least a second electrical contact element 120) are arranged on the first main face 116 of the support 114 and are electrically connected to the first electrical contact elements 112 by electrical wires 122 or any other suitable means of electrical connection. The support 114 also includes an opening 124 passing through the entire thickness of the support 114, that is to say formed through the first and second main faces 116, 118 of the support 114.

La deuxième face principale 110 du capteur 102 est solidarisée de manière hermétique et/ou étanche à la deuxième face principale 118 du support 114. Dans le mode de réalisation représenté sur la figure 1, cette solidarisation hermétique et/ou étanche est obtenue par un cordon de scellement 126 formé au niveau de la périphérie de l'ouverture 124 du support 114 et autour des premiers éléments de contact électrique 112. Le cordon de scellement 126 peut correspondre à un cordon de matériau métallique, polymère (dans le cas d'une solidarisation étanche mais pas hermétique), de verre fusible, etc. Les premiers éléments de contact électrique 112 et la partie sensible 106 sont disposés en regard de l'ouverture 124. Les fils électriques 122 traversent le support 114 au niveau de cette ouverture 124.The second main face 110 of the sensor 102 is hermetically and / or sealed to the second main face 118 of the support 114. In the embodiment shown in the figure 1 , this hermetic and / or sealed connection is obtained by a sealing bead 126 formed at the periphery of the opening 124 of the support 114 and around the first electrical contact elements 112. The sealing bead 126 may correspond to a bead metallic material, polymer (in the case of a watertight but not hermetic connection), fusible glass, etc. The first electrical contact elements 112 and the sensitive part 106 are arranged opposite the opening 124. The electrical wires 122 pass through the support 114 at this opening 124.

Etant donné la solidarisation hermétique et/ou étanche formée par le cordon de scellement 126 entre le capteur 102 et le support 114, la deuxième face principale 118 du support 114 peut être en contact avec le fluide, mais pas la première face principale 116 du support 114. Ainsi, toute la connectique du dispositif de mesure 100, c'est-à-dire les premiers et deuxièmes éléments de contact électrique 112, 120, sont protégés hermétiquement et/ou de manière étanche vis-à-vis du fluide grâce à la solidarisation hermétique et/ou étanche entre les deux faces principales 110, 118 formant une barrière hermétique et/ou étanche vis-à-vis du fluide.Given the hermetic and / or sealed connection formed by the sealing bead 126 between the sensor 102 and the support 114, the second main face 118 of the support 114 may be in contact with the fluid, but not the first main face 116 of the support 114. Thus, all of the connections of the measuring device 100, that is to say the first and second electrical contact elements 112, 120, are hermetically and / or tightly protected from the fluid by virtue of the hermetic and / or sealed connection between the two main faces 110, 118 forming a hermetic and / or sealed barrier against the fluid.

La figure 2 représente le dispositif de mesure 100 selon un deuxième mode de réalisation.The figure 2 represents the measuring device 100 according to a second embodiment.

Contrairement au premier mode de réalisation précédemment décrit dans lequel le capteur 102 est un capteur de pression à membrane piézorésistive, le capteur 102 du dispositif 100 selon le deuxième mode de réalisation correspond à un capteur de pression capacitif dans lequel les mouvements de la membrane correspondant à la partie sensible 106 du capteur 102 sont transformés électriquement via un changement de la valeur d'une capacité électrique de la partie sensible 106. Les autres éléments du dispositif 100 selon ce deuxième mode de réalisation sont similaires à ceux du dispositif 100 précédemment décrit en liaison avec la figure 1.Unlike the first embodiment previously described in which the sensor 102 is a pressure sensor with a piezoresistive membrane, the sensor 102 of the device 100 according to the second embodiment corresponds to a capacitive pressure sensor in which the movements of the membrane corresponding to the sensitive part 106 of the sensor 102 are electrically transformed via a change in the value of an electrical capacity of the sensitive part 106. The other elements of the device 100 according to this second embodiment are similar to those of the device 100 previously described in connection with the figure 1 .

La figure 3 représente un exemple de montage d'un dispositif de mesure 100, ici similaire au dispositif 100 précédemment décrit en liaison avec la figure 1, dans un conduit, ou tuyau, 202, correspondant par exemple à une canalisation métallique ou plastique, dans lequel circule le fluide dont la pression est destinée à être mesurée, qui forment un ensemble de mesure 200. Le dispositif 100 est solidarisé hermétiquement et/ou de manière étanche à une extrémité du conduit 202, ou une paroi du conduit 202 au niveau d'une ouverture 201 formée dans cette paroi, tel que la partie sensible 106 du capteur 102 soit exposée à l'intérieur du conduit 202. Cette solidarisation est réalisée entre la paroi du conduit 202 et la deuxième face principale 116 du support. L'étanchéité de cette liaison est assurée dans cet exemple par un joint torique 204 disposé sur la paroi du conduit 202 à laquelle le dispositif 100 est solidarisé par exemple par serrage mécanique. Ainsi, le fluide circulant dans le conduit 202 exerce une pression sur la partie sensible 106 du capteur 102 et les éléments de contact électrique 112 et 120 du capteur 102 et du support 114 ne sont pas exposés à ce fluide.The figure 3 shows an example of mounting a measuring device 100, here similar to the device 100 previously described in connection with the figure 1 , in one conduit, or pipe, 202, corresponding for example to a metallic or plastic pipe, in which the fluid, the pressure of which is intended to be measured, circulates, which form a measuring assembly 200. The device 100 is secured hermetically and / or so watertight at one end of the duct 202, or a wall of the duct 202 at an opening 201 formed in this wall, such that the sensitive part 106 of the sensor 102 is exposed inside the duct 202. This connection is made between the wall of the duct 202 and the second main face 116 of the support. The sealing of this connection is ensured in this example by an O-ring 204 disposed on the wall of the duct 202 to which the device 100 is secured, for example by mechanical tightening. Thus, the fluid flowing in the conduit 202 exerts pressure on the sensitive part 106 of the sensor 102 and the electrical contact elements 112 and 120 of the sensor 102 and of the support 114 are not exposed to this fluid.

La figure 4 représente un dispositif de mesure 100 selon un troisième mode de réalisation.The figure 4 shows a measuring device 100 according to a third embodiment.

Par rapport au premier mode de réalisation, les deuxièmes éléments de contact électrique 120 ne sont pas disposés directement sur la première face principale 116 du support 114, mais sont disposés sur un élément de support 128 lui-même disposé sur la première face principale 116 du support 114. Sans la présence de l'élément de support 128 (comme dans les premier et deuxième modes de réalisation précédemment décrits), le matériau du support 114 doit être à la fois compatible avec le fluide dont la caractéristique est mesurée, apte à former une barrière d'étanchéité et/ou hermétique vis-à-vis de ce fluide, et permettre la réalisation des deuxièmes éléments de contact électrique 120 sur sa première face principale 116. Dans ce troisième mode de réalisation, la compatibilité avec le fluide dont la caractéristique est mesurée et la capacité à former une barrière d'étanchéité et/ou hermétique vis-à-vis de ce fluide sont dissociée de la compatibilité de réalisation des deuxièmes éléments de contact électrique 120, du fait que seul le matériau de l'élément de support 128 doit être apte à permettre la réalisation des deuxièmes éléments de contact électrique 120 sur celui-ci. L'élément de support 128 correspond par exemple à un circuit imprimé.Compared to the first embodiment, the second electrical contact elements 120 are not disposed directly on the first main face 116 of the support 114, but are disposed on a support element 128 itself disposed on the first main face 116 of the support 114. Without the presence of the support element 128 (as in the first and second embodiments described above), the material of the support 114 must be both compatible with the fluid whose characteristic is measured, capable of forming a sealing and / or hermetic barrier with respect to this fluid, and allowing the production of the second electrical contact elements 120 on its first main face 116. In this third embodiment, compatibility with the fluid, the characteristic is measured and the capacity to form a sealing and / or hermetic barrier vis-à-vis this fluid is dissociated from the compatibility of production of the second elements of c electrical ontact 120, since only the material of the support element 128 must be able to allow the production of the second electrical contact elements 120 thereon. The support element 128 corresponds for example to a printed circuit.

La réalisation d'un tel élément de support 128 est compatible avec les modes de réalisation précédemment décrits.The production of such a support element 128 is compatible with the embodiments previously described.

La figure 5 représente un dispositif de mesure 100 selon un quatrième mode de réalisation.The figure 5 shows a measuring device 100 according to a fourth embodiment.

Par rapport au premier mode de réalisation, le dispositif 100 comporte en outre un capot 130 solidarisé à la deuxième face principale 110 du capteur 102 et délimitant, avec cette deuxième face principale 110, une cavité 132 fermée hermétiquement, par exemple sous vide, au niveau de la partie de la deuxième face principale 110 qui se trouve en regard de la partie sensible 106. Outre la protection mécanique apportée par la présence de ce capot 130, la cavité 132 sous vide permet au dispositif 100 de réaliser une mesure de la valeur absolue de la pression du fluide 108 du fait que la partie de la deuxième face principale 110 se trouvant face à l'élément sensible 106 n'est pas soumise à la pression ambiante régnant du côté de la deuxième face principale 110. Pour former cette cavité 132 sous vide, le capot 130 est scellé sous vide à la deuxième face principale 110. De plus, les premiers éléments de contact électrique 112 sont sortis de la cavité 132 en formant des traversées hermétiques depuis l'intérieur de la cavité 132 vers l'extérieur de cette cavité 132 afin que ces contacts soient accessibles depuis l'extérieur de la cavité 132 et puissent être reliés électriquement aux deuxièmes éléments de contact électrique 120.Compared to the first embodiment, the device 100 further comprises a cover 130 secured to the second main face 110 of the sensor 102 and delimiting, with this second main face 110, a cavity 132 hermetically closed, for example under vacuum, at the level of the part of the second main face 110 which is opposite the sensitive part 106. In addition to the mechanical protection provided by the presence of this cover 130, the vacuum cavity 132 allows the device 100 to measure the absolute value of the pressure of the fluid 108 due to the fact that the part of the second main face 110 facing the sensitive element 106 is not subjected to the ambient pressure prevailing on the side of the second main face 110. To form this cavity 132 under vacuum, the cover 130 is sealed under vacuum to the second main face 110. In addition, the first electrical contact elements 112 are taken out of the cavity 132 by forming hermetic crossings of then the interior of the cavity 132 towards the exterior of this cavity 132 so that these contacts are accessible from the exterior of the cavity 132 and can be electrically connected to the second electrical contact elements 120.

La réalisation du capot 130 et de la cavité 132 est compatible avec les différents modes de réalisation précédemment décrits.The production of the cover 130 and the cavity 132 is compatible with the various embodiments previously described.

La figure 6 représente un dispositif de mesure 100 selon un cinquième mode de réalisation.The figure 6 shows a measuring device 100 according to a fifth embodiment.

Par rapport au quatrième mode de réalisation précédemment décrit en liaison avec la figure 5, le dispositif 100 comporte un matériau de protection 134, qui correspond à un gel de protection sur l'exemple de la figure 6 mais qui pourrait être par exemple réalisé sous la forme d'un couvercle de protection ou sous une autre forme, recouvrant ici la deuxième face principale 110 du capteur 102 ainsi que les deuxièmes éléments de contact électrique 120 et les fils 122. Tous les éléments de connexion électrique du dispositif 100 sont ici protégés par le matériau de protection 134. En l'absence du capot 130 (lorsque le dispositif 100 est destiné à réaliser une mesure de pression différentielle), ce matériau de protection 134 permet également de protéger la partie de la deuxième face principale 110 du capteur 102 qui est ici protégée par le capot 130.Compared to the fourth embodiment previously described in connection with the figure 5 , the device 100 includes a protective material 134, which corresponds to a protective gel on the example of the figure 6 but which could for example be produced in the form of a protective cover or in another form, here covering the second main face 110 of the sensor 102 as well as the second electrical contact elements 120 and the wires 122. All the elements of electrical connection of the device 100 are here protected by the protective material 134. In the absence of the cover 130 (when the device 100 is intended to perform a differential pressure measurement), this protective material 134 also makes it possible to protect the part of the second main face 110 of the sensor 102 which is here protected by the cover 130 .

La réalisation du matériau de protection 134 est compatible avec les modes de réalisation précédemment décrits.The production of the protective material 134 is compatible with the embodiments previously described.

La figure 7 représente un dispositif de mesure 100 selon un sixième mode de réalisation.The figure 7 shows a measuring device 100 according to a sixth embodiment.

Dans ce sixième mode de réalisation, le support 114 fait partie d'un boitier 136 entourant le capteur 102. Ce boitier 136 forme un premier volume 138 dans lequel la partie sensible 106 du capteur 102 est disposée et un deuxième volume 140 dans lequel les premiers éléments de contact électrique 112 et une partie des deuxièmes éléments de contact électrique 120 sont disposés. Les premier et deuxième volumes 138, 140 sont isolés hermétiquement l'un de l'autre grâce à la solidarisation hermétique réalisée entre le capteur 102 et le support 114. Le boitier 136 comporte en outre un orifice 142 débouchant dans le premier volume 138 et permettant au fluide d'entrer dans ce premier volume 138 et de venir au contact de la partie sensible 106 du capteur 102. Enfin, les deuxièmes éléments de contact électrique 120 s'étendent sur le support 114 tels qu'ils traversent le boitier 136 et que des extrémités 144 de ces deuxièmes éléments de contact électrique 120 débouchent en dehors du boitier 136.In this sixth embodiment, the support 114 is part of a housing 136 surrounding the sensor 102. This housing 136 forms a first volume 138 in which the sensitive part 106 of the sensor 102 is arranged and a second volume 140 in which the first electrical contact elements 112 and a portion of the second electrical contact elements 120 are disposed. The first and second volumes 138, 140 are hermetically isolated from one another by virtue of the hermetic connection made between the sensor 102 and the support 114. The housing 136 also comprises an orifice 142 opening into the first volume 138 and allowing for the fluid to enter this first volume 138 and to come into contact with the sensitive part 106 of the sensor 102. Finally, the second electrical contact elements 120 extend on the support 114 such that they pass through the housing 136 and that ends 144 of these second electrical contact elements 120 open out of the housing 136.

Ce boitier 136 assure une protection du capteur 102 ainsi que de la connectique du dispositif 100. De plus, selon la pression régnant dans le deuxième volume 140, ce dispositif 100 peut réaliser une mesure de pression absolue ou différentielle même en l'absence du capot 130.This box 136 provides protection for the sensor 102 as well as for the connection of the device 100. In addition, depending on the pressure prevailing in the second volume 140, this device 100 can perform an absolute or differential pressure measurement even in the absence of the cover. 130.

Un tel boitier 136 peut également être réalisé pour les différents modes de réalisation précédemment décrits.Such a housing 136 can also be produced for the various embodiments previously described.

La figure 8 représente un dispositif de mesure 100 selon un septième mode de réalisation.The figure 8 shows a measuring device 100 according to a seventh embodiment.

Dans ce mode de réalisation, le dispositif 100 comporte un couvercle de protection 146 solidarisé à la première face principale 116 du support 114 et formant, avec le support 114 et le capteur 102, un volume 148 dans lequel se trouvent les premiers éléments de contact électrique 110 et une partie des deuxièmes éléments de contact électrique 120. Le couvercle 146 assure une protection de la partie électronique du dispositif 100. Les deuxièmes éléments de contact électrique 120 traversent le support 114 (à travers les faces principales 116, 118 du support 114) afin que ces éléments de contact électrique 120 soient accessibles depuis l'extérieur du volume 148. Un matériau étanche et/ou hermétique 150 présent autour des parties des deuxièmes éléments de contact électrique 120 traversant le support 114 assurent l'étanchéité et/ou l'herméticité entre la deuxième face principale 118 du support 118 et l'intérieur du volume 148. Lorsque le dispositif 100 est destiné à réaliser une mesure de pression absolue du fluide, le volume 148 peut être fermé hermétiquement. Dans ce cas, le capot 130 peut être supprimé.In this embodiment, the device 100 includes a protective cover 146 secured to the first main face 116 of the support 114 and forming, with the support 114 and the sensor 102, a volume 148 in which the first electrical contact elements 110 are located and a part of the second electrical contact elements 120. The cover 146 provides protection for the electronic part of the device 100. The second elements electrical contact 120 pass through the support 114 (through the main faces 116, 118 of the support 114) so that these electrical contact elements 120 are accessible from outside the volume 148. A waterproof and / or hermetic material 150 present around the parts of the second electrical contact elements 120 passing through the support 114 provide sealing and / or hermeticity between the second main face 118 of the support 118 and the interior of the volume 148. When the device 100 is intended to measure the absolute pressure of the fluid, the volume 148 can be hermetically sealed. In this case, the cover 130 can be removed.

La réalisation d'un tel couvercle de protection 146 est compatible avec les modes de réalisation précédemment décrits.The production of such a protective cover 146 is compatible with the embodiments previously described.

La figure 9 représente un dispositif de mesure 100 selon un huitième mode de réalisation.The figure 9 shows a measuring device 100 according to an eighth embodiment.

Comme dans le septième mode de réalisation précédemment décrit, le couvercle de protection 146 est solidarisé à la première face principale 116 du support 114. Toutefois, le couvercle 146 est ici traversé par un orifice 152 mettant ainsi en communication l'intérieur du volume 148 avec l'atmosphère ambiante du côté de la première face principale 116 du support 114, et notamment la pression de cette atmosphère symbolisée par la flèche référencée 154 sur la figure 9. Ainsi, le dispositif 100 réalise ici une mesure de pression différentielle entre la pression 108 du fluide et la pression 154 à laquelle est soumise la deuxième face principale 110 du capteur 102. Dans ce mode de réalisation, la deuxième face principale 110 du capteur 102 est protégée par le matériau de protection 134, ici un gel de protection. Une mesure de pression différentielle est réalisée car ce gel de protection 134 transmet la pression 154 sur la deuxième face principale du capteur 102.As in the seventh embodiment previously described, the protective cover 146 is secured to the first main face 116 of the support 114. However, the cover 146 is here crossed by an orifice 152 thus putting the interior of the volume 148 into communication with the ambient atmosphere on the side of the first main face 116 of the support 114, and in particular the pressure of this atmosphere symbolized by the arrow referenced 154 on the figure 9 . Thus, the device 100 here performs a differential pressure measurement between the pressure 108 of the fluid and the pressure 154 to which the second main face 110 of the sensor 102 is subjected. In this embodiment, the second main face 110 of the sensor 102 is protected by the protective material 134, here a protective gel. A differential pressure measurement is carried out because this protective gel 134 transmits the pressure 154 on the second main face of the sensor 102.

Là encore, la réalisation d'un tel couvercle de protection 146 est compatible avec les modes de réalisation précédemment décrits.Again, the production of such a protective cover 146 is compatible with the embodiments previously described.

La figure 10 représente un dispositif de mesure 100 selon un neuvième mode de réalisation.The figure 10 shows a measuring device 100 according to a ninth embodiment.

Ce dispositif de mesure 100 comporte tous les éléments de celui précédemment décrit en liaison avec la figure 8. Dans ce neuvième mode de réalisation, la liaison électrique entre l'un des premiers éléments de contact électrique 112 et l'un des deuxièmes éléments de contact électrique 120 n'est pas réalisée directement par un fil 122, mais par l'intermédiaire d'un circuit électrique et/ou électronique 156, par exemple un circuit ASIC (« Application-Specific Integrated Circuit »), une carte électronique, ou plus généralement tout élément électrique et/ou électronique intermédiaire. Sur la figure 10, cet élément 156 est disposé dans le volume 148, sur la première face principale 116 du support 114. Des fils 122 réalisent les liaisons électriques entre le premier élément de contact électrique 112 et le circuit 156, et entre le circuit 156 et le deuxième élément de contact électrique 120.This measurement device 100 includes all the elements of that previously described in connection with the figure 8 . In this ninth embodiment, the electrical connection between one of the first electrical contact elements 112 and one of the second electrical contact elements 120 is not produced directly by a wire 122, but by means of an electrical and / or electronic circuit 156, for example an ASIC (“Application-Specific Integrated Circuit”) circuit, an electronic card, or more generally any intermediate electrical and / or electronic element. On the figure 10 , this element 156 is disposed in the volume 148, on the first main face 116 of the support 114. Wires 122 make the electrical connections between the first electrical contact element 112 and the circuit 156, and between the circuit 156 and the second element electrical contact 120.

Une telle liaison électrique « indirecte » entre les deux éléments de contact électrique 112, 120 peut être réalisée pour un ou plusieurs des premiers et deuxièmes éléments de contact électrique 112, 120. De plus, une telle liaison électrique par l'intermédiaire du circuit 156 peut être réalisée dans les différents modes de réalisation précédemment décrits.Such an “indirect” electrical connection between the two electrical contact elements 112, 120 can be produced for one or more of the first and second electrical contact elements 112, 120. In addition, such an electrical connection via the circuit 156 can be carried out in the various embodiments previously described.

La figure 11 représente un dispositif de mesure 100 selon un dixième mode de réalisation.The figure 11 shows a measuring device 100 according to a tenth embodiment.

Dans ce mode de réalisation, le support 114 n'est pas solidarisé directement sur la deuxième face principale 110 du capteur 102. Le capot 130 est ici réalisé tel qu'il comporte des parties 158 sur lesquelles la deuxième face principale 118 du support 114 est solidarisée hermétiquement par le cordon de scellement 126, le capot 130 (et donc également les parties 158) étant solidarisé hermétiquement à la deuxième face principale 110 du capteur 102. Les deuxièmes éléments de contact électrique 120 sont reliés électriquement aux premiers éléments de contact électrique 112 par l'intermédiaire des fils électriques 122 qui traversent le capot 130 via des ouvertures 160 formées dans les parties 158 du capot 130.In this embodiment, the support 114 is not secured directly to the second main face 110 of the sensor 102. The cover 130 is here produced such that it includes parts 158 on which the second main face 118 of the support 114 is hermetically secured by the sealing bead 126, the cover 130 (and therefore also the parts 158) being hermetically secured to the second main face 110 of the sensor 102. The second electrical contact elements 120 are electrically connected to the first electrical contact elements 112 by means of the electrical wires 122 which pass through the cover 130 via openings 160 formed in the parts 158 of the cover 130.

Un tel capot 130 est compatible avec les modes de réalisation précédemment décrits.Such a cover 130 is compatible with the embodiments previously described.

La figure 12 représente un dispositif de mesure 100 selon un onzième mode de réalisation.The figure 12 shows a measuring device 100 according to an eleventh embodiment.

Dans ce onzième mode de réalisation, le capot 130 a une épaisseur importante et occupe une partie de l'ouverture 124 formée à travers le support 114. De plus, les premiers éléments de contact électrique 112 sont reliés électriquement aux deuxièmes éléments de contact électrique 120 par les fils 122 mais également par des vias conducteurs (ou TSV pour « Through Silicon Via ») 162 qui traversent le capot 130. Un tel mode de réalisation permet, du fait que les plots de contact auxquels sont reliés les fils 122 ne sont pas formés directement par les premiers éléments de contact électrique 112 mais par des plots 164 présents sur le sommet du capot 130 et auxquels sont reliés les vias conducteurs 162, de réaliser le capteur 102 avec une taille réduite. Cela facilite en outre la connexion électrique entre les premiers éléments de contact électrique 112 et les deuxièmes éléments de contact électrique 120.In this eleventh embodiment, the cover 130 has a large thickness and occupies part of the opening 124 formed through the support 114. In addition, the first electrical contact elements 112 are electrically connected to the second electrical contact elements 120 by the wires 122 but also by conductive vias (or TSV for “Through Silicon Via”) 162 which pass through the cover 130. Such an embodiment allows, because the contact pads to which the wires 122 are connected are not formed directly by the first electrical contact elements 112 but by studs 164 present on the top of the cover 130 and to which the conductive vias 162 are connected, to produce the sensor 102 with a reduced size. This also facilitates the electrical connection between the first electrical contact elements 112 and the second electrical contact elements 120.

Un tel capot 130 et les vias conducteurs 162 peuvent être réalisés dans les différents modes de réalisation précédemment décrits.Such a cover 130 and the conductive vias 162 can be produced in the various embodiments previously described.

Dans les modes de réalisation précédemment décrits, le dispositif de mesure 100 est réalisé tel que le ou les premiers éléments de contact électrique 112 soient disposés en regard de l'ouverture 124 traversant le support 114, les liaisons électriques formées par les fils 122 ou les vias conducteurs 162 entre ces premiers éléments de contact électrique 112 et les deuxièmes éléments de contact électrique 120 passant par cette ouverture 124. De plus, dans ces précédents modes de réalisation, la partie sensible 106 du capteur 102 est également disposée en regard de cette ouverture 124.In the embodiments described above, the measuring device 100 is made such that the first electrical contact element (s) 112 are disposed opposite the opening 124 passing through the support 114, the electrical connections formed by the wires 122 or the vias conductors 162 between these first electrical contact elements 112 and the second electrical contact elements 120 passing through this opening 124. In addition, in these previous embodiments, the sensitive part 106 of the sensor 102 is also disposed opposite this opening 124.

La figure 13 représente le dispositif de mesure 100 selon un douzième mode de réalisation dans lequel la partie sensible 106 du capteur 102 est déportée latéralement par rapport à l'ouverture 124. Sur cette figure, seul l'un des premiers éléments de contact électrique 112 est disposé en regard de l'ouverture 124. Le fil 122 qui relie ce premier élément de contact électrique 112 au deuxième élément de contact électrique 120 traverse l'ouverture 124 ainsi que le capot 130 grâce à une ouverture 160 formée dans le capot 130. De plus, dans ce douzième mode de réalisation, le support 114 est solidarisé hermétiquement à une partie 158 du capot 130 au niveau de la périphérie de l'ouverture 124 par le cordon de scellement 126, le capot 130 étant lui-même solidarisé hermétiquement au capteur 102.The figure 13 shows the measuring device 100 according to a twelfth embodiment in which the sensitive part 106 of the sensor 102 is offset laterally relative to the opening 124. In this figure, only one of the first electrical contact elements 112 is arranged in view of the opening 124. The wire 122 which connects this first electrical contact element 112 to the second electrical contact element 120 passes through the opening 124 as well as the cover 130 thanks to an opening 160 formed in the cover 130. In addition, in this twelfth embodiment, the support 114 is hermetically secured to a part 158 of the cover 130 at the periphery of the opening 124 by the sealing bead 126, the cover 130 being itself hermetically secured to the sensor 102.

La figure 14 représente le dispositif de mesure 100 selon un treizième mode de réalisation. Ce dispositif de mesure 100 est sensiblement similaire à celui précédemment décrit en liaison avec la figure 13, excepté que le support 114 est ici solidarisé directement à la deuxième face principale 110 du capteur 102.The figure 14 represents the measuring device 100 according to a thirteenth embodiment. This measuring device 100 is substantially similar to that previously described in connection with the figure 13 , except that the support 114 is here secured directly to the second main face 110 of the sensor 102.

Les modes de réalisation représentés sur les figures 13 et 14 ont pour avantage de déporter la partie sensible 106 du capteur 102 vis-à-vis de la zone de scellement entre le support 114 et le capteur 102, ce qui permet d'obtenir un meilleur découplage mécanique et thermique de la partie sensible 106 du capteur 102 vis-à-vis de la zone de scellement. Ce déport de la partie sensible 106 du capteur 102 vis-à-vis de la zone de scellement peut également être réalisé dans les modes de réalisation précédemment décrits.The embodiments represented on the Figures 13 and 14 have the advantage of shifting the sensitive part 106 of the sensor 102 from the sealing zone between the support 114 and the sensor 102, which makes it possible to obtain better mechanical and thermal decoupling of the sensitive part 106 of the sensor 102 vis-à-vis the sealing area. This offset of the sensitive part 106 of the sensor 102 with respect to the sealing zone can also be achieved in the embodiments previously described.

Un procédé de réalisation d'un dispositif de mesure 100, par exemple similaire à celui précédemment décrit en liaison avec la figure 8, est décrit ci-dessous en liaison avec les figures 15A à 15D.A method of producing a measuring device 100, for example similar to that previously described in connection with the figure 8 , is described below in conjunction with Figures 15A to 15D .

Le capteur 102 est tout d'abord réalisé en technologie MEMS. Le capot 130 est solidarisé hermétiquement sur la première face principale 110 du capteur 102. Le support 114 est également préparé en formant l'ouverture 124 à travers les faces principales 116 et 118 du support 114. Les deuxièmes éléments de contact 120 sont solidarisés au support 114 en les faisant traverser le support 114 comme représenté sur la figure 15A.The sensor 102 is firstly produced in MEMS technology. The cover 130 is secured hermetically on the first main face 110 of the sensor 102. The support 114 is also prepared by forming the opening 124 through the main faces 116 and 118 of the support 114. The second contact elements 120 are secured to the support 114 by passing them through the support 114 as shown in the figure 15A .

Le capteur 102 est tout d'abord aligné avec l'ouverture 124 du support 114, puis solidarisé hermétiquement au support 114 par brasure, avec le cordon de scellement 126 (figure 15B).The sensor 102 is first of all aligned with the opening 124 of the support 114, then hermetically secured to the support 114 by soldering, with the sealing bead 126 ( figure 15B ).

Les liaisons électriques entre les premiers éléments de contact électrique 112 et les deuxièmes éléments de contact électrique 120 sont ensuite réalisés en connectant les fils 122 à ces éléments (figure 15C).The electrical connections between the first electrical contact elements 112 and the second electrical contact elements 120 are then produced by connecting the wires 122 to these elements ( figure 15C ).

Enfin, comme représenté sur la figure 15D, le dispositif de mesure 100 est achevé en scellant le couvercle de protection 146 sur la première face principale 116 du support 114. Ce scellement est par exemple réalisé par soudure par résistance, brasure, collage, verre fusible, ou toute autre technique de scellement adaptée.Finally, as shown in the figure 15D , the measuring device 100 is completed by sealing the protective cover 146 on the first main face 116 of the support 114. This sealing is for example carried out by resistance welding, soldering, gluing, fusible glass, or any other suitable sealing technique .

Dans tous les modes de réalisation précédemment décrits, le dispositif de mesure 100 correspond à un dispositif de mesure de pression d'un fluide, le capteur 102 correspondant à un capteur de pression. Il est toutefois possible que le capteur 102 soit apte à mesurer une ou plusieurs caractéristiques du fluide autres que la pression, ou corresponde à un autre type de capteur, par exemple un microphone.In all the embodiments previously described, the measuring device 100 corresponds to a device for measuring the pressure of a fluid, the sensor 102 corresponding to a pressure sensor. It is however possible that the sensor 102 is able to measure one or more characteristics of the fluid other than the pressure, or corresponds to another type of sensor, for example a microphone.

Dans les différents modes de réalisation précédemment décrits, la solidarisation hermétique et/ou étanche entre le capteur 102 et le support 114 est réalisée par le cordon de scellement 126. En variante, il est possible que la solidarisation entre le capteur 102 et le support 114 soit réalisée par la mise en œuvre d'un collage direct, également appelé collage par adhésion moléculaire, entre le capteur 102 et le support 114. En fonction de la nature des matériaux destinés à être solidarisés l'un à l'autre, ce collage direct peut être mis en œuvre en faisant appel ou non à des portions de matériaux adaptées et déposées au préalable sur le capteur 102 et le support 114, par exemple des portions de SiO2.In the various embodiments described above, the hermetic and / or sealed connection between the sensor 102 and the support 114 is produced by the sealing bead 126. As a variant, it is possible that the connection between the sensor 102 and the support 114 is carried out by the implementation of a direct bonding, also called bonding by molecular adhesion, between the sensor 102 and the support 114. Depending on the nature of the materials intended to be secured to one another, this bonding direct can be implemented by using or not using portions of suitable materials which are deposited beforehand on the sensor 102 and the support 114, for example portions of SiO 2 .

En outre, les liaisons électriques entre les premiers et deuxièmes éléments de contact électrique peuvent être formés par des éléments de liaison différents que ceux précédemment décrits, comme par exemple des billes conductrices ou tout autre moyen adapté.In addition, the electrical connections between the first and second electrical contact elements can be formed by different connection elements than those previously described, such as for example conductive balls or any other suitable means.

Claims (14)

  1. Device (100) for measuring at least one characteristic of a fluid (108), comprising at least:
    - a sensor (102) comprising a first main face (104) provided with at least one sensing part (106) that is sensitive to said characteristic and intended to be in contact with the fluid, and a second main face (110) opposite the first main face (104) and provided with at least one first electrical contact element (112) on which at least one measurement signal from the sensor (102) can be obtained;
    - a support (114) comprising a first main face (116) provided with at least one second electrical contact element (120) electrically connected to the first electrical contact element (112), a second main face (118) opposite the first main face (116) of the support (114), and at least one opening (124) passing through the first and second main faces (116, 118) of the support (114);
    - a cap (130) attached to the second main face (110) of the sensor (102) and delimiting, with the second main face (110) of the sensor (102), at least one cavity (132) that is hermetically closed and facing which is arranged at least the sensing part (106) of the sensor (102);
    wherein the second main face (110) of the sensor (102) is attached in a watertight and/or hermetically-sealed manner to the second main face (118) of the support (114) at least at the periphery of the opening (124), and such that at least one part of the first electrical contact element (112) is arranged facing and/or inside the opening (124),
    characterized in that
    the sensing part (106) of the sensor (102) is laterally offset relative to the opening (124) of the support (114) and is not surrounded by a region of the sensor (102) attached to the support (114).
  2. Device (100) according to claim 1, wherein the second main face (118) of the support (114) is intended to be in contact with the fluid.
  3. Device (100) according to one of the previous claims, wherein the sensing part (106) of the sensor (102) comprises at least one membrane, whereby the sensor (102) is a piezoresistive or capacitive or piezoelectric or heat sensor.
  4. Device (100) according to one of the previous claims, wherein the second main face (110) of the sensor (102) is attached to the second main face (118) of the support (114) by at least one hermetic and/or watertight sealed seam (126) or by direct bonding.
  5. Device (100) according to one of the previous claims, wherein the second main face (118) of the support (114) is attached in a hermetically-sealed and/or watertight manner to the cap (130), which is hermetically attached to the second main face (110) of the sensor (102).
  6. Device (100) according to one of the previous claims, wherein the second electrical contact element (120) is electrically connected to the first electrical contact element (112) by at least one electrical connection (122, 162) passing through the cap (130).
  7. Device (100) according to one of the previous claims, further comprising at least one protective material (134) covering at least one part of the second main face (110) of the sensor (102) and at least one part of the second electrical contact element (120).
  8. Device (100) according to one of the previous claims, further comprising a supporting element (128) arranged between the second electrical contact element (120) and the first main face (116) of the support (114).
  9. Device (100) according to one of the previous claims, wherein:
    - the support (114) forms a part of at least one housing (136) surrounding the sensor (102) by forming at least one first volume (138) in which the sensing part (106) of the sensor (102) is arranged and a second volume (140) in which the first electrical contact element (112) and one part of the second electrical contact element (120) are arranged,
    - the support (114) and the sensor (102) form a hermetically-sealed and/or watertight separation between the first and second volumes (138, 140),
    - the housing (136) is provided with at least one orifice (142) opening out into the first volume (138),
    - the second electrical contact element (120) passes through the housing (136) and comprises an end (144) arranged outside of the housing (136).
  10. Device (100) according to one of claims 1 to 8, further comprising at least one protective cover (146) attached to the first main face (116) of the support (114) and forming, with the support (114) and the sensor (102), at least one volume (148) in which the first electrical contact element (112) and a part of the second electrical contact element (120) are located, whereby the second electrical contact element (120) passes through the support and comprises an end arranged outside the volume.
  11. Device (100) according to claim 10, wherein the volume (148) formed by the protective cover (146) is closed in a hermetically-sealed and/or watertight manner, or the protective cover (146) is penetrated by at least one orifice (152) opening out into the volume (148).
  12. Device (100) according to one of the previous claims, wherein the second electrical contact element (120) is electrically connected to the first electrical contact element (112) by way of an electrical and/or electronic element (156) arranged on the first main face (116) of the support (114).
  13. Measuring assembly (200) comprising at least one measuring device (100) according to one of the previous claims, and a duct (202) in which the fluid can circulate, wherein the second main face (118) of the support (114) of the measuring device (100) is attached in a hermetically-sealed and/or watertight manner to one end or to one wall of the duct (202) such that the sensing part (106) of the sensor (102) is exposed to the interior of the duct (202) by way of the end or by way of an opening (201) formed in the wall of the duct (202).
  14. Method for producing a device (100) for measuring at least one characteristic of a fluid (108), comprising at least the steps of:
    - producing at least one sensor (102) comprising a first main face (104) provided with at least one sensing part (106) that is sensitive to said characteristic and intended to be in contact with the fluid, and a second main face (110) opposite the first main face (104) and provided with at least one first electrical contact element (112) on which at least one measurement signal from the sensor (102) can be obtained;
    - producing at least one support (114) comprising a first main face (116) provided with at least one second electrical contact element (120), a second main face (118) opposite the first main face (116) of the support (114), and at least one opening (124) passing through the first and second main faces (116, 118) of the support (114);
    - attaching a cap (130) to the second main face (110) of the sensor (102) and delimiting, with the second main face (110) of the sensor (102), at least one cavity (132) that is hermetically closed and facing which is arranged at least the sensing part (106) of the sensor (102);
    - attaching in a hermetically-sealed and/or watertight manner the second main face (110) of the sensor (102) to the second main face (118) of the support (114) at least at the periphery of the opening (124), such that at least one part of the first electrical contact element (112) is arranged facing and/or inside the opening (124);
    - producing an electrical connection (122, 162) electrically connecting the second electrical contact element (120) to the first electrical contact element (112);
    characterized in that
    the sensing part (106) of the sensor (102) is laterally offset relative to the opening (124) of the support (114) and is not surrounded by a region of the sensor (102) attached to the support (114).
EP16787881.8A 2015-10-30 2016-10-28 Device for measuring characteristics of a fluid Active EP3368865B1 (en)

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FR1560428A FR3043196B1 (en) 2015-10-30 2015-10-30 FLUID CHARACTERISTIC MEASUREMENT DEVICE
PCT/EP2016/076013 WO2017072270A1 (en) 2015-10-30 2016-10-28 Device for measuring characteristics of a fluid

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DE112020001930A5 (en) * 2019-04-15 2022-01-05 Wika Alexander Wiegand Se & Co. Kg Sensor for recording pressure, level, density, temperature, mass and / or flow

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JPH1164137A (en) * 1997-08-25 1999-03-05 Hitachi Ltd Semiconductor pressure sensor
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FR3043196A1 (en) 2017-05-05
EP3368865A1 (en) 2018-09-05

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