EP3327166A1 - Verfahren zur erstellung einer leiterbahn - Google Patents

Verfahren zur erstellung einer leiterbahn Download PDF

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Publication number
EP3327166A1
EP3327166A1 EP16382563.1A EP16382563A EP3327166A1 EP 3327166 A1 EP3327166 A1 EP 3327166A1 EP 16382563 A EP16382563 A EP 16382563A EP 3327166 A1 EP3327166 A1 EP 3327166A1
Authority
EP
European Patent Office
Prior art keywords
electronic assembly
manufacturing
plasma
zone
distance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP16382563.1A
Other languages
English (en)
French (fr)
Inventor
Daniel Teba
Alfonso-Manuel GUZMAN
Francisco Martinez
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Valeo Iluminacion SA
Original Assignee
Valeo Iluminacion SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valeo Iluminacion SA filed Critical Valeo Iluminacion SA
Priority to EP16382563.1A priority Critical patent/EP3327166A1/de
Publication of EP3327166A1 publication Critical patent/EP3327166A1/de
Withdrawn legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/04—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the coating material
    • C23C4/06—Metallic material
    • C23C4/08—Metallic material containing only metal elements
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/12—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
    • C23C4/134—Plasma spraying

Definitions

  • the present invention belongs to the field of electronic assemblies comprising conductive tracks directly deposited on a plastics substrate.
  • Plasma deposition is sometimes used to create a conductive track in a plastic part.
  • This process comprises the step of including in the plasma flow some metal dust particles, usually copper, tin, aluminium or alloys of them, that are melted by the plasma flow and then deposited on the plastic part, thus creating a conductive track on said plastic part.
  • This metal deposition usually requires that the plastic surface is prepared enough. Some irregularities or even foreign objects which are present in the surface before the conductive track is created may affect to the performance or operation of said conductive track.
  • the invention provides a solution for this problem by means of a method for creating a conductive track according to claim 1.
  • Preferred embodiments of the invention are defined in dependent claims.
  • the invention provides a method for manufacturing an electronic assembly, the method comprising the steps of:
  • Such method advantageously provides a first step of preparing the surface of the plastics substrate for performing the second step.
  • This first step has some effects on the surface of the plastics substrate.
  • a first effect would be electrostatic charges removal, due to the electrostatic features of the plasma flow.
  • a second effect would be foreign particles removal, including oils, release agents, plasticizers or liquid contaminants volatilization, due to the high temperature of the plasma flow.
  • a third effect would be plastic base roughness or irregularities melted, also due to the high temperature of the plasma flow.
  • a fourth effect would be the fluency of polymers part surface, making smoother metal deposition.
  • the first plasma nozzle does not contain metal dust flow.
  • it improves the effect of the preparation step.
  • the conductive track is directly deposited by applying a main plasma flow with metal dust on the first zone. This step may be carried out, for instance, using the device described in document US 2015/174686 A1 , and concretely in its claim 1.
  • the first step is carried out with the first plasma nozzle being at a first distance of the plastics substrate
  • the second step is carried out with the second plasma nozzle being at a second distance of the plastics substrate, the second distance being the same or lower than the first distance
  • This method improves the effects of the preliminary plasma flow in the plastics substrate.
  • the first plasma nozzle is the same as the second plasma nozzle. This makes this method simpler, faster and less expensive.
  • the first distance is comprised between 23 and 25 mm. This has been found to be a good distance for performing this step.
  • the second distance is comprised between 21 and 23 mm. This has been found to be a good distance for performing this step.
  • the first plasma nozzle moves at a speed comprised between 0.015 and 0.04 m/s, preferably between 0.018 and 0.022 m/s. This has been found to be a good speed for performing this step, the metal dust being deposited in the plastics substrate with a good compaction and low thickness.
  • the preliminary plasma flow is created with a microwave frequency between 40 and 65 kHz, preferably between 60 and 65 kHz. This range improves the effects caused by the first step.
  • the preliminary plasma flow is created applying an electric power between 0.95 and 1.05 kW. This range improves the effects caused by the first step without spending too much electrical power.
  • the preliminary plasma flow exits the first plasma nozzle at a flow rate comprised between 1.30 and 1.35 l/s. This range improves the effects caused by the first step without spending too much plasma flow.
  • the conductive track is applied on a subregion of the first zone.
  • a subregion the first zone should be understood as a portion of this first zone.
  • the first zone is a prepared zone, and the conductive track is applied inside this first zone, but not necessarily covering the whole first zone. However, in other cases, the subregion could cover the whole first zone.
  • the first zone is a strip and the subregion is another strip which is narrower than the first zone.
  • This method ensures that the conductive track being laid by the main plasma flow is laid on a surface which has been previously prepared, by including this safety margin, so that little errors do not cause the conductive track being deposited outside this prepared zone.
  • the invention provides an electronic assembly obtained with a method according to the previous inventive aspect.
  • This electronic assembly may be used in more challenging environments than the standard electronic assemblies, since the conductive track comprised in it is attached to the plastics substrate in a stronger way.
  • the invention provides a lighting device for automotive vehicle comprising
  • An optical element is an element that has some optical properties to receive a light beam and emit it in a certain direction and/or shape, as a person skilled in automotive lighting would construe without any additional burden. Reflectors, collimators, light guides, projection lenses, etc., or the combination thereof are some examples of these optical elements.
  • Lighting devices for automotive vehicles can benefit from the use of electronic assemblies comprising conductive tracks which are deposited on a plastics substrate in a stronger way.
  • a wide range of the lighting device's parts can be used either as plastics substrate or as base for the plastics substrate (in which case the plastics substrate may for instance coat the base), taking into account that even three-dimensional plastics substrates are suitable for direct deposition of conductive tracks.
  • This method ensures that the conductive track will grip better even on irregular surfaces. Therefore, a dedicated printed board circuit is not required, which leads to reducing the cost and the weight of the lighting device. As was stated above, cost savings are even more significant due to the fact that direct deposition does not normally want removing conductive material to shape the conductive tracks.
  • Figure 1 shows a first step of a method for manufacturing an electronic assembly 1 according to the invention.
  • a preliminary plasma flow 21 is applied on the plastics substrate, by means of a first plasma nozzle 2.
  • This first plasma nozzle 2 is set at a first distance 22 from the plastics substrate 3, this first distance 22 being between 23 and 25 mm. Further, this first plasma nozzle 2 moves at a speed comprised between 0.018 and 0.022 m/s.
  • the preliminary plasma flow 21 is created with a microwave frequency between 60 and 65 kHz, applying an electric power between 0.95 and 1.05 kW.
  • This preliminary plasma flow 21 exits the first plasma nozzle 2 at a flow rate comprised between 1.30 and 1.35 l/s.
  • the preliminary plasma flow 21 acts on a first zone 31 of the plastics substrate 3.
  • This first zone 31 is prepared to receive a conductive track 4, as it has been prepared by the preliminary plasma flow 21, by removing debris and irregularities of the plastics substrate 3.
  • Figure 2 shows a second step of a method for manufacturing an electronic assembly according to the invention.
  • a second plasma nozzle 5 different from the first plasma nozzle 2 applies a main plasma flow 51 on the plastics substrate 3. In other embodiments, this step is carried out by the same first plasma nozzle 21.
  • the main plasma flow 51 differs from the preliminary plasma flow 21 in that the main plasma flow 51 further contains metal dust particles. These particles are introduced in the main plasma flow 51, inside or outside the plasma nozzle, and then melt by the high temperatures of the main plasma flow 51. When they reach the plastics substrate 3, they solidify on it, thus creating a conductive track 4 on the plastics substrate 3.
  • This second plasma nozzle 5 is set at a second distance 52 from the plastics substrate 3, equal or lower than the first distance 22.
  • this second distance 52 is between 21 and 23 mm.
  • the conductive track 4 deposited by the main plasma flow 51 affects a subregion of the first zone 31, so that even in the event of little errors, the conductive track 4 is always deposited on a zone which has been previously prepared to receive it.
  • the electronic assembly 1 which has been manufactured according to this method comprises a smoother and more regular zone on the plastics substrate with respect to the electronic assemblies manufactured by the methods known in the state of the art.
  • This method provides the conductive track with a more favourable location to be installed, without contaminants or irregularities, thus achieving a long-lasting arrangement of the conductive track 4 on the plastics substrate 3. Further, electrical conductivity in this track is improved, due to the fact that electrical flow is not dispersed within the contaminants.
  • Figure 3 shows a lighting device 10 for an automotive vehicle comprising
  • the forward direction should be understood as the advance direction of an automotive vehicle where the lighting device is intended to be installed.
  • the optical elements include a reflector 71 and a projection lens 72.
  • the reflector 71 is placed in the electronic assembly 1, arranged to reflect the light emitted by the semiconductor light source 6.
  • the projection lens is in turn located in a forward position with respect to the lighting device 10, and receives the light from the light source 6 which has been reflected by the reflector 71.
  • the projection lens 72 orientates this received light according to the vehicle advancing direction.
  • optical elements 71, 72 makes the lighting device 10 suitable for being installed in an automotive vehicle 100 and able to perform lighting functions, such as high-beam and low-beam.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
EP16382563.1A 2016-11-24 2016-11-24 Verfahren zur erstellung einer leiterbahn Withdrawn EP3327166A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP16382563.1A EP3327166A1 (de) 2016-11-24 2016-11-24 Verfahren zur erstellung einer leiterbahn

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP16382563.1A EP3327166A1 (de) 2016-11-24 2016-11-24 Verfahren zur erstellung einer leiterbahn

Publications (1)

Publication Number Publication Date
EP3327166A1 true EP3327166A1 (de) 2018-05-30

Family

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Family Applications (1)

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EP16382563.1A Withdrawn EP3327166A1 (de) 2016-11-24 2016-11-24 Verfahren zur erstellung einer leiterbahn

Country Status (1)

Country Link
EP (1) EP3327166A1 (de)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090067169A1 (en) * 2007-09-03 2009-03-12 Osram Gesellschaft Mit Beschrankter Haftung Luminous module and method for producing it
DE102010014552A1 (de) * 2010-03-22 2011-09-22 Timo Brummer Verfahren zur Plasmabeschichtung einer Substratoberfläche mit Beschichtungsflüssigkeit
US8241710B2 (en) * 2006-12-23 2012-08-14 Leoni Ag Method and apparatus for spraying on a track, in particular a conductor track, and electrical component with a conductor track
US20140342094A1 (en) * 2011-07-25 2014-11-20 Eckart Gmbh Use of Specially Coated Powdered Coating Materials and Coating Methods Using Such Coating Materials
WO2015054848A1 (en) * 2013-10-16 2015-04-23 GM Global Technology Operations LLC Making lithium secodary battery electrodes using an atmospheric plasma
US20150174686A1 (en) 2012-08-28 2015-06-25 Maschinenfabrik Reinhausen Gmbh Method and device for joining conductors to substrates

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8241710B2 (en) * 2006-12-23 2012-08-14 Leoni Ag Method and apparatus for spraying on a track, in particular a conductor track, and electrical component with a conductor track
US20090067169A1 (en) * 2007-09-03 2009-03-12 Osram Gesellschaft Mit Beschrankter Haftung Luminous module and method for producing it
DE102010014552A1 (de) * 2010-03-22 2011-09-22 Timo Brummer Verfahren zur Plasmabeschichtung einer Substratoberfläche mit Beschichtungsflüssigkeit
US20140342094A1 (en) * 2011-07-25 2014-11-20 Eckart Gmbh Use of Specially Coated Powdered Coating Materials and Coating Methods Using Such Coating Materials
US20150174686A1 (en) 2012-08-28 2015-06-25 Maschinenfabrik Reinhausen Gmbh Method and device for joining conductors to substrates
WO2015054848A1 (en) * 2013-10-16 2015-04-23 GM Global Technology Operations LLC Making lithium secodary battery electrodes using an atmospheric plasma

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