EP3322840A1 - Method for producing a wire from a first metal, comprising a cladding layer made of a second metal - Google Patents
Method for producing a wire from a first metal, comprising a cladding layer made of a second metalInfo
- Publication number
- EP3322840A1 EP3322840A1 EP16730750.3A EP16730750A EP3322840A1 EP 3322840 A1 EP3322840 A1 EP 3322840A1 EP 16730750 A EP16730750 A EP 16730750A EP 3322840 A1 EP3322840 A1 EP 3322840A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- wire
- metal
- container
- coating composition
- liquid coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
- C23C18/1632—Features specific for the apparatus, e.g. layout of cells and of its equipment, multiple cells
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
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- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
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- C25D3/00—Electroplating: Baths therefor
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Definitions
- Core-sheath bonding wires having a metal core and a metal sheath of a different and generally more noble metal than the core are known
- the inventive method for producing a wire of a metal 1 with a cladding layer of a metal 2 is a
- Coating process More specifically, it is a method for
- liquid coating composition is a
- Composition is.
- step (a) of the method according to the invention a wire with a
- Cross-sectional area of the wire can be, for example, rectangular, elliptical or round, for example circular.
- it is round wire with a diameter in the range of for example 10 to 500 ⁇ .
- the metal 1 is copper, silver, gold, nickel or an alloy of one of these metals with at least one other metal.
- pure copper, silver, gold or nickel are meant purities of 99.0 to 99.99 wt .-%, while alloy here means that the base metal copper, silver, gold or nickel> 50 to ⁇ 99 wt .-% of the alloy. Examples of possible
- Alloy metals are copper, silver, gold, nickel, zinc, tin, antimony and manganese.
- Such wires are known in the art.
- they can be prepared by providing a metal 1, ie as a metal with the desired one Purity or as a metal alloy of desired composition, from which then in the usual way a wire precursor, for example, a round wire precursor with a diameter in the range of 3 to 300 mm can be produced by casting.
- a wire precursor for example, a round wire precursor with a diameter in the range of 3 to 300 mm can be produced by casting.
- Such a wire precursor may then be subjected to conventional rolling, drawing and / or annealing steps to ultimately form the wire to be provided according to step (a).
- the wire In general, it is convenient to provide the wire with a clean metallic surface, for example, freed of excipients and other impurities, e.g. degreased and / or freed of oxide.
- a clean metallic surface for example, freed of excipients and other impurities, e.g. degreased and / or freed of oxide.
- Methods for producing a clean metallic surface are known to the person skilled in the art and do not require any detailed explanation, examples being pickling methods, electrolytic cleaning and
- the cross-sectional area or diameter of the wire or round wire provided in step (a) may be its final cross-sectional area or final diameter. This is in particular in wires with a cross-sectional area or round wires with a diameter respectively at the lower end of the above ranges of 75 to 200,000 ⁇ 2 or 10 to 500 ⁇ the case, for example in the range of 75 to 2000 ⁇ 2 for the wire cross-sectional area or from 10 to 50 ⁇ for the
- Applying round wire from the metal 1 is one of the strengths of
- the grains of the cladding layer which can be made visible by electron back-scattering diffraction (EBSD) or electron microscopy in this embodiment have no preferred direction, but instead form the grain structure of the metal 1 located below the cladding layer.
- EBSD electron back-scattering diffraction
- the wire provided in step (a) with end cross-sectional area or round wire with end diameter are preferred embodiments.
- Diameter respectively at the upper end of said areas for example in the range of 700 to 200,000 ⁇ 2 for the wire cross-sectional area or from 30 to 500 ⁇ for the round wire diameter, it is possible to reduce to a smaller end cross-sectional area or a smaller end diameter and thus To carry out an extension of the coated wire or round wire after completion of step (f1) or (f2), for example by conventional wire drawing.
- the grains of the cladding layer which are visibly feasible by EBSD or electron microscopy have an orientation or preferred direction running in the wire direction.
- the wire is provided in a wadded form in step (a).
- a container is formed with a contour corresponding to the outline of the wire to be sheathed in step (a) or a width of up to 20 ⁇ , preferably up to 10 ⁇ wide, preferably completely around the wire outline Inlet opening provided.
- a gap partially circulating around the wire outline means that the wire touches the edge of the inlet opening, but not with its entire outline, while a gap completely circulating around the wire outline means that the wire does not touch the inlet opening.
- the circumferential gap is as uniformly wide as possible in accordance with a centered positioning of the wire to be sheathed within the gap
- said gap size provides sufficient Sealing of the container, in particular during step (e), ie leakage of the liquid coating composition can be prevented.
- Plastic has proven to be particularly useful.
- Container can have any shape of its own; he only has to allow the realization of step (e).
- a cylindrical container with an arrangement of the inlet opening is expedient in particular in the center of the cylinder base area.
- the material forming the edge of the inlet opening is expediently a hard material,
- the hard material may be diamond or ruby.
- a diamond may be used with a corresponding hole forming the inlet opening of the container. It may also be expedient if the material, in particular the hard material, is electrically non-conductive (electrical conductivity ⁇ 10 "8 S / m), for example diamond or ruby fulfill both properties.
- BALLOFFET as a means to equip the container with the inlet opening.
- a conventional die used in wire drawing can be used.
- a die made of titanium or stainless steel with a diamond enclosed therein and having a hole of corresponding outline may be used.
- the container can be open.
- the container has an outlet opening opposite to the inlet opening in outline-symmetry and at the same time having a common axis of rotation with the inlet opening for the coated wire leaving the container, ie leaving it in the course of step (e) after passing straight through the container coated wire;
- this arrangement means that the wire can run straight, ie unbent, uncurved, undeflected and untwisted, and can travel through the container by the shortest route from the inlet opening to the outlet opening.
- This arrangement of inlet opening and outlet opening largely ensures that there is no contact or possible mechanical damage to the wire surface either before or after the coating.
- the outline of the outlet opening can correspond to the outline of the coated wire leaving the container or form a gap which extends up to 20 ⁇ m at least partially, preferably completely around it.
- the outlet opening can be realized by the same means as the inlet opening.
- step (c) of the method according to the invention the wire provided in step (a) is introduced into the inlet opening, in the case of an inlet opening with a larger cross-sectional area or larger outline than that of the wire, preferably in the center. With the introduction of the wire, the basis for the already mentioned sufficient sealing of the container is created.
- step (d) of the method according to the invention one for applying the
- the liquid coating composition is a composition permitting an electroless application of metal 2 onto a substrate or a wire made of the metal 1, ie a direct application of metal 2 into elementary, metallic form on the metal 1 surface permitting composition.
- the liquid coating composition is a composition permitting electroplating with metal 2 of a substrate or wire made of the metal 1 connected as a cathode, ie a direct application of metal 2 into more elemental , metallic shape on the metal 1 surface permitting Composition.
- this may be an aqueous composition containing metal 2 as a dissolved salt or dissolved salts.
- the liquid coating composition is charged in an amount sufficient to ensure successful completion of step (e).
- the container can be partially or completely filled.
- the container may be equipped with a device for keeping the filling volume and / or the composition of the liquid coating composition constant so that the consumption or discharge of the liquid coating composition or components thereof during step (e) is ongoing Operation can be compensated.
- a device for recycling the liquid for example, a device for recycling the liquid
- Coating composition and / or a device for the subsequent dosing of the liquid coating composition or used during step (e) components thereof may be used.
- step (e) of the method according to the invention in step (c) in the
- Inlet opening inserted wire straight, i. unbent, uncurled, undeflected and untwisted through the container and thus also passed through the filled in step (d) in the container liquid coating composition.
- the wire leaves the container straight and in coated form, ie in a coated with a metal shell layer 2 form.
- step (e) the application of the metal 2 is carried out directly as metal 2.
- the contact time of the continuous wire or, more particularly, each increment of wire in the liquid coating composition is in the range of, for example, 0.005 to 50 seconds, more preferably 0.01 to 10 or 0.02 to 5 seconds and is determined by the rate at which the wire is passed through the liquid coating composition and the distance the wire or each wire increment in the liquid coating composition passes through.
- Coating composition passed wire corresponds to the distance that each wire increment in the liquid coating composition passes through, the fill level or liquid column of the liquid coating composition in the container.
- Coating composition is done by means of conventional Umlenkrollen- and
- the wire speed or, more precisely, the speed with which the wire is conveyed is in the range of, for example, 0.5 to 200 m / min, in particular 5 to 150 m / min or 10 to 100 m / min.
- the orientation of the container or by this and the liquid therein is in the range of, for example, 0.5 to 200 m / min, in particular 5 to 150 m / min or 10 to 100 m / min.
- Coating composition of straight wire being passed may be horizontal or vertical or assume an intermediate orientation. Preferred is a vertical orientation, in particular with the direction of movement of the wire upwards.
- the wire may suitably be connected by means of a cathode connected,
- metallic contact roller can be switched as a cathode and so the wire coating, so the direct electroplating of the wire with the metal 2, allow. To exclude a short circuit, this is the edge of the
- Inlet opening forming material electrically non-conductive or non-live electrically non-conductive or non-live (electrically isolated).
- an electrically conductive ring which surrounds an edge of the inlet opening, electrically non-conductive material, such as diamond or ruby, be connected as a counter-anode; For example, comes as an electrically conductive ring of the outer metal edge of a die in question.
- one or more auxiliary anodes may be used, for example, an auxiliary anode of, for example, stainless steel or plated titanium, disposed in the liquid coating composition and around the continuous wire, for example as a grid, may be employed.
- a DC voltage in the range of, for example, 0.2 to 20 V at a current in the range of, for example, 0.001 to 5 A, particularly 0.001 to 1 A, or 0.001 to 0.2 A worked.
- the current densities used may range from, for example, 0.01 to 150 A / dm 2 .
- the layer thickness of the cladding layer of the metal 2 i. the layer thickness of the elemental metal 2 layer applied directly to the metal 1 surface in step (e) is in the range, for example, of the thickness of a monolayer of the metal 2 to 5000 nm or of, for example, 1 to 5000 nm and can be adjusted as desired ,
- the layer thickness of the metal cladding layer 2 can be set essentially by the following parameters:
- the layer thickness can be increased with higher concentration of the metal-forming chemical components in the liquid coating composition, with higher temperature during step (e) and with longer contact time between wire and liquid
- the layer thickness of the metal coating layer 2 can be set substantially by the following parameters: chemical composition of the liquid
- Coating composition contact time between wire switched as a cathode and liquid coating composition, current density.
- the layer thickness can be increased with higher concentration of the metal or salts of metal 2 in the liquid coating composition, with longer contact time between wire switched as cathode and more liquid
- method step (e) is the one during which the metal 2 is applied directly in elemental, metallic form to the metal 1-wire surface.
- the metal 2 cladding layer does not have to be formed in its elemental metallic form in steps (e) subsequent to step (e).
- a rinsing step may take place between completion of step (e) and step (f1) or (f2), for example in the form of a dipping or spray rinse.
- the liquid coating composition used in step (e) is aqueous
- the use of water as the rinsing medium is suitable, further examples of rinsing media are alcohol and alcohol / water mixtures.
- a non-aqueous liquid coating composition used in step (e) generally, it is not rinsed.
- the method according to the invention does not require inter-winding of the wire between steps (e) and (f1) or (e) and (f2).
- carrying out the method according to the invention without intermediate wire spooling between steps (e) and (f1) or (f2) is a preferred one
- the inventive method can also be made particularly efficient from a production perspective.
- step (f1) the wire coated in step (e), i. the provided with a coating in the sense of a metal cladding layer 2 wire only dried.
- the drying according to step (f1) may take place at a temperature or oven temperature in the range, for example, 20 to 150 ° C.
- temperature or "oven temperature” used in the description and claims in connection with steps (f1) and (f2) respectively mean the temperature of the respective atmosphere.
- the coated wire or its coating ie the metal 2-cladding layer
- the drying can be done for example in a continuous furnace, in particular in a tube furnace.
- step (f1) having variant of the method according to the invention with a provided in step (a) end wire surface or end diameter having round wire, the formation of a
- step (f2) of the method according to the invention the wire coated in step (e) is thermally treated.
- the thermal treatment of step (f2) may be at a temperature or
- Oven temperature in the range of, for example, 100 to 800 ° C take place.
- the wire reaches a temperature at which the wire and / or its coating, ie the metal 2-coat layer, not only, if necessary, dried, but also as explained below chemically and / or physically to be changed.
- the thermal treatment can, for example, in a continuous furnace, in particular in a
- Continuous furnace continuous wire or, more precisely, each wire increment is in the range of, for example, 0.001 to 60 seconds, in particular 0.01 to 10 seconds or 0.02 to 5 seconds and results from the length of the
- Step (f2) may be performed, for example, if not just one
- Step (f2) may therefore be considered, for example, if the coating is electroplated as a cathode
- Coating composition is done. It may be expedient to work with an inert or reducing furnace atmosphere.
- core-sheath wire is characterized by a very homogeneous, uniformly thick and free of traces of mechanical damage or at least substantially free sheath layer and is particularly suitable for use as a bonding wire. If the core-sheath wire produced by the method according to the invention in the form of the provided with a metal sheath layer 2 of the metal 1 wire is not directly further processed or not used directly for bonding, it is generally wound in the usual manner and in this form to
- a round wire made of 4N copper (99.99% by weight of copper) with a diameter of 20 ⁇ m was clamped in an uncoiler and switched over as a cathode
- the round wire was introduced from below through an inlet opening located in the bottom of a vertically arranged cylindrical plastic container (inner diameter 40 mm, length 140 mm) and led straight through the container.
- the inlet opening consisted of a conventional die with bordered diamond with a diameter of 25 ⁇ having hole (from
- the container was also a round auxiliary anode made of plated titanium.
- the round wire was passed quite analogously through a second identical washing container. Subsequently, the round wire passed through a 60 cm long heated to 130 ° C tube furnace and was attached to a coil in a winder. The running direction of the round wire was from bottom to top with the order of arrangement from bottom to top: contact roller, container 1; Tray 2, tube furnace, spooler.
- the lower container 1 having the auxiliary anode was filled to the edge in accordance with the manufacturer's instructions with a solution of Palluna® ACF 800 having a pH of 6.5 and a palladium content of 12 g / l.
- the temperature of the solution was adjusted to 60 ° C.
- the arranged above the washing container 2 was with Water filled.
- the contact roller was connected to the negative pole of a DC power source, the auxiliary anode in the container 1 to the positive pole of the DC power source. Thereafter, the winder was turned on and set at a wire speed of 15 m / min.
- the DC source was set to a current of 10 mA.
- Example 2 The procedure was as in Example 1 with the difference that in the container 1 according to the manufacturer's instructions a pH of 7.5 and a gold content of 15 g / l having solution of Auruna® 559 filled and the coating process at 70 ° C and was carried out with a current of 15 mA.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electroplating Methods And Accessories (AREA)
- Metal Extraction Processes (AREA)
- Chemically Coating (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP15176473.5A EP3118353A1 (en) | 2015-07-13 | 2015-07-13 | Method for producing a wire from a first metal having a clad layer made from a second metal |
PCT/EP2016/062931 WO2017008956A1 (en) | 2015-07-13 | 2016-06-08 | Method for producing a wire from a first metal, comprising a cladding layer made of a second metal |
Publications (1)
Publication Number | Publication Date |
---|---|
EP3322840A1 true EP3322840A1 (en) | 2018-05-23 |
Family
ID=53879295
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP15176473.5A Withdrawn EP3118353A1 (en) | 2015-07-13 | 2015-07-13 | Method for producing a wire from a first metal having a clad layer made from a second metal |
EP16730750.3A Withdrawn EP3322840A1 (en) | 2015-07-13 | 2016-06-08 | Method for producing a wire from a first metal, comprising a cladding layer made of a second metal |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP15176473.5A Withdrawn EP3118353A1 (en) | 2015-07-13 | 2015-07-13 | Method for producing a wire from a first metal having a clad layer made from a second metal |
Country Status (5)
Country | Link |
---|---|
EP (2) | EP3118353A1 (en) |
JP (1) | JP6532550B2 (en) |
CN (2) | CN107660239A (en) |
TW (1) | TWI640652B (en) |
WO (1) | WO2017008956A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG10201607523RA (en) * | 2016-09-09 | 2018-04-27 | Heraeus Materials Singapore Pte Ltd | Coated wire |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2445675A (en) * | 1941-11-22 | 1948-07-20 | William C Lang | Apparatus for producing coated wire by continuous process |
US2370973A (en) * | 1941-11-22 | 1945-03-06 | William C Lang | Method and apparatus for producing coated wire |
FR1172255A (en) * | 1957-02-08 | 1959-02-09 | Trefileries Et Laminoirs De Pr | Matt blackening of very fine metal wires |
DE2447584C2 (en) * | 1974-10-05 | 1983-01-05 | Steuler Industriewerke GmbH, 5410 Höhr-Grenzhausen | Method and device for the electrolytic metal coating of aluminum wire |
JPS5687468U (en) * | 1979-12-05 | 1981-07-13 | ||
JPS61214454A (en) * | 1985-03-19 | 1986-09-24 | Nippon Mining Co Ltd | Bonding wire for semiconductor device |
GB9309521D0 (en) * | 1993-05-08 | 1993-06-23 | United Wire Ltd | Improved method |
US6261436B1 (en) * | 1999-11-05 | 2001-07-17 | Asep Tec Co., Ltd. | Fabrication method for gold bonding wire |
JP2003197668A (en) * | 2001-12-10 | 2003-07-11 | Senmao Koochii Kofun Yugenkoshi | Bonding wire for semiconductor package, and its manufacturing method |
US7131308B2 (en) * | 2004-02-13 | 2006-11-07 | 3M Innovative Properties Company | Method for making metal cladded metal matrix composite wire |
KR101019811B1 (en) | 2005-01-05 | 2011-03-04 | 신닛테츠 마테리알즈 가부시키가이샤 | Bonding wire for semiconductor device |
EP2312628A2 (en) | 2007-07-24 | 2011-04-20 | Nippon Steel Materials Co., Ltd. | Semiconductor device bonding wire |
TW201614748A (en) * | 2013-01-23 | 2016-04-16 | Heraeus Materials Tech Gmbh | Coated wire for bonding applications, method for manufacturing the same, and application thereof in an electronic device |
CN104419915A (en) * | 2013-08-30 | 2015-03-18 | 江苏中江焊丝有限公司 | Chemical plating device |
US20160288272A1 (en) * | 2013-11-21 | 2016-10-06 | Heraeus Deutschland GmbH & Co. KG | Coated wire for bonding applications |
CN204417623U (en) * | 2014-12-11 | 2015-06-24 | 重庆材料研究院有限公司 | The plating apparatus of refractory metal silk |
-
2015
- 2015-07-13 EP EP15176473.5A patent/EP3118353A1/en not_active Withdrawn
-
2016
- 2016-06-08 CN CN201680030232.9A patent/CN107660239A/en active Pending
- 2016-06-08 EP EP16730750.3A patent/EP3322840A1/en not_active Withdrawn
- 2016-06-08 JP JP2017567383A patent/JP6532550B2/en active Active
- 2016-06-08 WO PCT/EP2016/062931 patent/WO2017008956A1/en unknown
- 2016-06-08 CN CN202111299045.XA patent/CN114000127A/en active Pending
- 2016-07-13 TW TW105122098A patent/TWI640652B/en active
Also Published As
Publication number | Publication date |
---|---|
CN114000127A (en) | 2022-02-01 |
JP6532550B2 (en) | 2019-06-19 |
WO2017008956A1 (en) | 2017-01-19 |
EP3118353A1 (en) | 2017-01-18 |
TW201723222A (en) | 2017-07-01 |
CN107660239A (en) | 2018-02-02 |
JP2018525519A (en) | 2018-09-06 |
TWI640652B (en) | 2018-11-11 |
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