EP3305039A1 - Electronic device comprising a printed circuit board with improved cooling - Google Patents
Electronic device comprising a printed circuit board with improved coolingInfo
- Publication number
- EP3305039A1 EP3305039A1 EP16725060.4A EP16725060A EP3305039A1 EP 3305039 A1 EP3305039 A1 EP 3305039A1 EP 16725060 A EP16725060 A EP 16725060A EP 3305039 A1 EP3305039 A1 EP 3305039A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- electronic device
- printed circuit
- circuit board
- wells
- thermally conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 19
- 239000004020 conductor Substances 0.000 claims abstract description 19
- 239000011248 coating agent Substances 0.000 claims abstract description 5
- 238000000576 coating method Methods 0.000 claims abstract description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 238000005553 drilling Methods 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- -1 for example Substances 0.000 description 1
- 238000005246 galvanizing Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09572—Solder filled plated through-hole in the final product
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
Definitions
- Electronic device comprising a printed circuit board with improved cooling.
- the present invention relates to an electronic device comprising a printed circuit board with improved cooling of the components it carries.
- this device is an inverter that is capable of converting a DC current, typically provided by a battery, into an alternating current, typically to be supplied to an electrical machine, such as a motor.
- this inverter typically comprises various components with a set of power components, which perform DC / AC conversion alternation, and a set of signal components, which processes measurements and performs a logic of control for power components.
- this card is composed of a succession of electrically conductive and electrically insulating alternate layers, of at least one component mounted on the upper layer and a cooling device of the components of the card.
- this cooling device is a finned radiator which is placed on the lower layer of the card.
- this card is traversed right through by wells coated internally with a layer of a thermally conductive metal.
- This device is advantageous because it allows to evacuate part of the heat but may be insufficient when large amounts of heat are to be dissipated.
- the present invention proposes to overcome the above drawbacks with an electronic device that ensures the cooling of these components even when they emit a large amount of heat.
- the device of the invention uses substantially the same techniques as those currently used for the manufacture of printed circuit boards and mounting components on the printed circuit board.
- the present invention relates to an electronic device comprising a printed circuit board carrying at least one component comprising at least one power component and / or at least one power conductor, said printed circuit board comprising an alternating succession of insulating and conductive layers, wells having an electrically and thermally conductive inner coating and passing through the thickness of the board, and a board cooling device, characterized in that the interior of the well is further filled with a material thermally conductive to achieve a thermal bridge between the component and the cooling device.
- the thermally conductive material may be the bonding material of the component with the card.
- the thermally conductive material may be tin.
- the card may carry a thermal paste placed between the lower layer of the card and the cooling device.
- the wells may be pierced and internally coated with a conductive metal layer and filled with a thermally conductive material.
- the wells may be pierced, internally coated with a conductive metal layer and filled with a thermally conductive material and a thermal paste.
- Figure 1 shows a part of an electronic device 10 comprising a printed circuit board 12, here a part of a device comprising switching circuits, for example an inverter.
- This printed circuit board 12 carries at least one series of components with a power component 14 and its main body 16 and at least one power conductor 18 which is able to receive or emit electrical power advantageously being connected to a conducting track 20.
- the power component 14 may be an electronic component, such as, for example, a static switch, a MOSFET (Metal-Oxide-Semiconductor Field Effect Transistor), an IGBT transistor (Insulated Bipolar Transistor), resistance, etc.
- the component may be a component that is not called power but a component that generates significant heat, such as a processor.
- the printed circuit board 12 preferably comprises a succession of insulating layers 22 and conductive layers 24 which reciprocally alternate by being stacked on top of each other.
- the insulating layers 22 preferably comprise an electrically and thermally insulating material, for example glass fibers.
- the conductive layers 24 advantageously comprise a mixture of an electrically and thermally conductive material, preferably a metal such as, for example, copper and an electrically and thermally insulating material.
- the card 12 further comprises a mounting base 26 for receiving the main body 1 6 of the power component.
- This mounting base 26 comprises a conductive plate 28 for each conductive layer 24 and in contact therewith. These plates advantageously all have the same shape and are preferably stacked.
- the card comprises, at the mounting base 26, a plurality of wells 30 substantially perpendicular to the face of the layers 22, 24 and which pass through the entire thickness of the printed circuit board being regularly spaced from each other.
- these wells comprise an internal coating of conductive metal
- the conductive layers 32 preferably of the same metal as the conductive layers, such as copper.
- These wells are preferably obtained by drilling through the thickness of the circuit board. These holes are then lined internally a thin layer of conductive metal, for example by a galvanizing process, leaving a hollow column remain inside this well.
- a cooling device 34 of the card is also carried by this card.
- this device is placed on the lower layer of the card and allows the evacuation of heat generated by the components of the card with the external medium, here air.
- this device is a fin radiator 34 which is in contact with the lower ends 36 of the wells 30 through a hardenable material 38, such as a thermal paste.
- a hardenable material 38 such as a thermal paste.
- This paste which is malleable, is placed between the lower layer of the card and the wall of the radiator which faces him by being in contact with the conductive inner lining of the wells. Following its installation, the paste hardens and then ensures a rigid connection between the card and the radiator and the thermal connection with the wells.
- the body 1 6 of the power component 14 is advantageously connected to the mounting base 26 through a bonding layer 40 of a material known per se, such as tin.
- this material which is also thermally conductive, allows the thermal connection to be made with the upper ends 42 of the wells and with the inner lining of the wells 30. As best illustrated in FIG. the hollow column inside the wells is filled with a heat-conducting material 44 between the two ends 36, 42.
- this material comes from the material of the tie layer, here tin.
- the tin flows into the hollow column of the well to completely fill the hollow column between the two ends of the well.
- thermal paste makes it possible to ensure thermal contact between the tin and the radiator when the tin does not reach the lower end of one or more wells. Indeed, after the operation of filling the wells and during the introduction of the thermal paste, which is initially malleable, it penetrates inside the wells until it is in contact with the well. 'tin. This contact then makes it possible to ensure the heat transfer between the wells and the radiator.
- the conductive track 20 of Figure 1 is connected to the radiator by a plurality of wells 30 'provided with a copper-based inner coating.
- the interior of these wells is filled with a heat conductive material. This material is preferably tin which is used to ensure the connection of the driver with the track.
- the wells 30 'facing the track 20 are filled with heat conductive material, here tin, so as to ensure thermal conduction to the cooling device 34 of the heat produced by Joule effect by the track.
- heat conductive material here tin
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1554836A FR3036917B1 (en) | 2015-05-28 | 2015-05-28 | ELECTRONIC DEVICE COMPRISING A PRINTED CIRCUIT BOARD WITH IMPROVED COOLING. |
PCT/EP2016/060693 WO2016188762A1 (en) | 2015-05-28 | 2016-05-12 | Electronic device comprising a printed circuit board with improved cooling |
Publications (1)
Publication Number | Publication Date |
---|---|
EP3305039A1 true EP3305039A1 (en) | 2018-04-11 |
Family
ID=54066019
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP16725060.4A Withdrawn EP3305039A1 (en) | 2015-05-28 | 2016-05-12 | Electronic device comprising a printed circuit board with improved cooling |
Country Status (6)
Country | Link |
---|---|
US (1) | US20180168025A1 (en) |
EP (1) | EP3305039A1 (en) |
JP (1) | JP2018516462A (en) |
CN (1) | CN206506764U (en) |
FR (1) | FR3036917B1 (en) |
WO (1) | WO2016188762A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3065112A1 (en) * | 2017-04-11 | 2018-10-12 | Valeo Systemes De Controle Moteur | ELECTRONIC UNIT AND ELECTRICAL DEVICE COMPRISING SAID ELECTRONIC UNIT |
Family Cites Families (43)
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US4628407A (en) * | 1983-04-22 | 1986-12-09 | Cray Research, Inc. | Circuit module with enhanced heat transfer and distribution |
US5179366A (en) * | 1991-06-24 | 1993-01-12 | Motorola, Inc. | End terminated high power chip resistor assembly |
US5285352A (en) * | 1992-07-15 | 1994-02-08 | Motorola, Inc. | Pad array semiconductor device with thermal conductor and process for making the same |
DE4326506A1 (en) * | 1993-08-06 | 1995-02-09 | Bosch Gmbh Robert | Electrical appliance, in particular a switching device or controller for motor vehicles |
KR0163871B1 (en) * | 1995-11-25 | 1998-12-01 | 김광호 | Heat sink solder ball array package |
US5887435A (en) * | 1995-12-08 | 1999-03-30 | Litton Systems, Inc. | Environmentally protected module |
US5708566A (en) * | 1996-10-31 | 1998-01-13 | Motorola, Inc. | Solder bonded electronic module |
KR100244965B1 (en) * | 1997-08-12 | 2000-02-15 | 윤종용 | Method for manufacturing printed circuit board(PCB) and ball grid array(BGA) package |
US6156980A (en) * | 1998-06-04 | 2000-12-05 | Delco Electronics Corp. | Flip chip on circuit board with enhanced heat dissipation and method therefor |
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US6477052B1 (en) * | 2000-08-01 | 2002-11-05 | Daimlerchrysler Corporation | Multiple layer thin flexible circuit board |
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US7161239B2 (en) * | 2000-12-22 | 2007-01-09 | Broadcom Corporation | Ball grid array package enhanced with a thermal and electrical connector |
DE10101359A1 (en) * | 2001-01-13 | 2002-07-25 | Conti Temic Microelectronic | Method of manufacturing an electronic assembly |
US20030029637A1 (en) * | 2001-08-13 | 2003-02-13 | Tina Barcley | Circuit board assembly with ceramic capped components and heat transfer vias |
US20030161603A1 (en) * | 2002-02-27 | 2003-08-28 | Nadeau Mary J. | Receiver optical bench formed using passive alignment |
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US6671176B1 (en) * | 2002-06-27 | 2003-12-30 | Eastman Kodak Company | Method of cooling heat-generating electrical components |
US7161240B2 (en) * | 2002-06-27 | 2007-01-09 | Eastman Kodak Company | Insitu-cooled electrical assemblage |
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ITMI20130872A1 (en) | 2013-05-29 | 2013-08-28 | Mavel Srl | ELECTRONIC DEVICE INCLUDING A PRINTED CIRCUIT |
-
2015
- 2015-05-28 FR FR1554836A patent/FR3036917B1/en active Active
-
2016
- 2016-05-12 EP EP16725060.4A patent/EP3305039A1/en not_active Withdrawn
- 2016-05-12 CN CN201690000081.8U patent/CN206506764U/en active Active
- 2016-05-12 WO PCT/EP2016/060693 patent/WO2016188762A1/en active Application Filing
- 2016-05-12 JP JP2017561883A patent/JP2018516462A/en active Pending
- 2016-05-30 US US15/577,694 patent/US20180168025A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
FR3036917A1 (en) | 2016-12-02 |
WO2016188762A1 (en) | 2016-12-01 |
FR3036917B1 (en) | 2018-11-02 |
CN206506764U (en) | 2017-09-19 |
US20180168025A1 (en) | 2018-06-14 |
JP2018516462A (en) | 2018-06-21 |
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