EP3305039A1 - Electronic device comprising a printed circuit board with improved cooling - Google Patents

Electronic device comprising a printed circuit board with improved cooling

Info

Publication number
EP3305039A1
EP3305039A1 EP16725060.4A EP16725060A EP3305039A1 EP 3305039 A1 EP3305039 A1 EP 3305039A1 EP 16725060 A EP16725060 A EP 16725060A EP 3305039 A1 EP3305039 A1 EP 3305039A1
Authority
EP
European Patent Office
Prior art keywords
electronic device
printed circuit
circuit board
wells
thermally conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP16725060.4A
Other languages
German (de)
French (fr)
Inventor
Wissam DIB
Abdenour ABDELLI
Fabien VIDAL-NAQUET
Marco FRANCESSETTI
Denny CHIONO
Davide Bettoni
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mavel EDT SpA
Original Assignee
IFP Energies Nouvelles IFPEN
Mavel SRL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by IFP Energies Nouvelles IFPEN, Mavel SRL filed Critical IFP Energies Nouvelles IFPEN
Publication of EP3305039A1 publication Critical patent/EP3305039A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09572—Solder filled plated through-hole in the final product
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material

Definitions

  • Electronic device comprising a printed circuit board with improved cooling.
  • the present invention relates to an electronic device comprising a printed circuit board with improved cooling of the components it carries.
  • this device is an inverter that is capable of converting a DC current, typically provided by a battery, into an alternating current, typically to be supplied to an electrical machine, such as a motor.
  • this inverter typically comprises various components with a set of power components, which perform DC / AC conversion alternation, and a set of signal components, which processes measurements and performs a logic of control for power components.
  • this card is composed of a succession of electrically conductive and electrically insulating alternate layers, of at least one component mounted on the upper layer and a cooling device of the components of the card.
  • this cooling device is a finned radiator which is placed on the lower layer of the card.
  • this card is traversed right through by wells coated internally with a layer of a thermally conductive metal.
  • This device is advantageous because it allows to evacuate part of the heat but may be insufficient when large amounts of heat are to be dissipated.
  • the present invention proposes to overcome the above drawbacks with an electronic device that ensures the cooling of these components even when they emit a large amount of heat.
  • the device of the invention uses substantially the same techniques as those currently used for the manufacture of printed circuit boards and mounting components on the printed circuit board.
  • the present invention relates to an electronic device comprising a printed circuit board carrying at least one component comprising at least one power component and / or at least one power conductor, said printed circuit board comprising an alternating succession of insulating and conductive layers, wells having an electrically and thermally conductive inner coating and passing through the thickness of the board, and a board cooling device, characterized in that the interior of the well is further filled with a material thermally conductive to achieve a thermal bridge between the component and the cooling device.
  • the thermally conductive material may be the bonding material of the component with the card.
  • the thermally conductive material may be tin.
  • the card may carry a thermal paste placed between the lower layer of the card and the cooling device.
  • the wells may be pierced and internally coated with a conductive metal layer and filled with a thermally conductive material.
  • the wells may be pierced, internally coated with a conductive metal layer and filled with a thermally conductive material and a thermal paste.
  • Figure 1 shows a part of an electronic device 10 comprising a printed circuit board 12, here a part of a device comprising switching circuits, for example an inverter.
  • This printed circuit board 12 carries at least one series of components with a power component 14 and its main body 16 and at least one power conductor 18 which is able to receive or emit electrical power advantageously being connected to a conducting track 20.
  • the power component 14 may be an electronic component, such as, for example, a static switch, a MOSFET (Metal-Oxide-Semiconductor Field Effect Transistor), an IGBT transistor (Insulated Bipolar Transistor), resistance, etc.
  • the component may be a component that is not called power but a component that generates significant heat, such as a processor.
  • the printed circuit board 12 preferably comprises a succession of insulating layers 22 and conductive layers 24 which reciprocally alternate by being stacked on top of each other.
  • the insulating layers 22 preferably comprise an electrically and thermally insulating material, for example glass fibers.
  • the conductive layers 24 advantageously comprise a mixture of an electrically and thermally conductive material, preferably a metal such as, for example, copper and an electrically and thermally insulating material.
  • the card 12 further comprises a mounting base 26 for receiving the main body 1 6 of the power component.
  • This mounting base 26 comprises a conductive plate 28 for each conductive layer 24 and in contact therewith. These plates advantageously all have the same shape and are preferably stacked.
  • the card comprises, at the mounting base 26, a plurality of wells 30 substantially perpendicular to the face of the layers 22, 24 and which pass through the entire thickness of the printed circuit board being regularly spaced from each other.
  • these wells comprise an internal coating of conductive metal
  • the conductive layers 32 preferably of the same metal as the conductive layers, such as copper.
  • These wells are preferably obtained by drilling through the thickness of the circuit board. These holes are then lined internally a thin layer of conductive metal, for example by a galvanizing process, leaving a hollow column remain inside this well.
  • a cooling device 34 of the card is also carried by this card.
  • this device is placed on the lower layer of the card and allows the evacuation of heat generated by the components of the card with the external medium, here air.
  • this device is a fin radiator 34 which is in contact with the lower ends 36 of the wells 30 through a hardenable material 38, such as a thermal paste.
  • a hardenable material 38 such as a thermal paste.
  • This paste which is malleable, is placed between the lower layer of the card and the wall of the radiator which faces him by being in contact with the conductive inner lining of the wells. Following its installation, the paste hardens and then ensures a rigid connection between the card and the radiator and the thermal connection with the wells.
  • the body 1 6 of the power component 14 is advantageously connected to the mounting base 26 through a bonding layer 40 of a material known per se, such as tin.
  • this material which is also thermally conductive, allows the thermal connection to be made with the upper ends 42 of the wells and with the inner lining of the wells 30. As best illustrated in FIG. the hollow column inside the wells is filled with a heat-conducting material 44 between the two ends 36, 42.
  • this material comes from the material of the tie layer, here tin.
  • the tin flows into the hollow column of the well to completely fill the hollow column between the two ends of the well.
  • thermal paste makes it possible to ensure thermal contact between the tin and the radiator when the tin does not reach the lower end of one or more wells. Indeed, after the operation of filling the wells and during the introduction of the thermal paste, which is initially malleable, it penetrates inside the wells until it is in contact with the well. 'tin. This contact then makes it possible to ensure the heat transfer between the wells and the radiator.
  • the conductive track 20 of Figure 1 is connected to the radiator by a plurality of wells 30 'provided with a copper-based inner coating.
  • the interior of these wells is filled with a heat conductive material. This material is preferably tin which is used to ensure the connection of the driver with the track.
  • the wells 30 'facing the track 20 are filled with heat conductive material, here tin, so as to ensure thermal conduction to the cooling device 34 of the heat produced by Joule effect by the track.
  • heat conductive material here tin

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The invention relates to an electronic device (10) comprising a printed circuit board (12) supporting at least one component including at lest one power component (14) and/or at least one power conductor (18), said printed circuit board comprising an alternating series of insulating (22) and conductive (24) layers, and sinks (30, 30') provided with an electrically and thermally conductive inner coating (32) that extend through the thickness of the board, as well as comprising a device (34) for cooling the board. According to the invention, the interior of the sinks is also filled with a thermally conductive material (44) in order to provide a thermal bridge between the component and the cooling device (34).

Description

Dispositif électronique comprenant une carte de circuit imprimé avec un refroidissement amélioré.  Electronic device comprising a printed circuit board with improved cooling.
La présente invention se rapporte à un dispositif électronique comprenant une carte de circuit imprimé avec un refroidissement amélioré des composants qu'elle porte. The present invention relates to an electronic device comprising a printed circuit board with improved cooling of the components it carries.
Un exemple de ce dispositif est un onduleur qui est capable de convertir un courant continu, généralement fourni par une batterie, en un courant alternatif, généralement pour être fourni à une machine électrique, comme un moteur. Pour effectuer cette opération, cet onduleur comprend typiquement des composants divers avec un ensemble de composants de puissance, qui effectuent l'alternance de conversion courant continu/courant alternatif, et un ensemble de composants de signal, qui traite des mesures et effectue une logique de commande pour les composants de puissance. An example of this device is an inverter that is capable of converting a DC current, typically provided by a battery, into an alternating current, typically to be supplied to an electrical machine, such as a motor. To perform this operation, this inverter typically comprises various components with a set of power components, which perform DC / AC conversion alternation, and a set of signal components, which processes measurements and performs a logic of control for power components.
Ces composants sont typiquement montés sur une carte de circuit imprimé, qui permet de lier électriquement et qui agit comme un support mécanique pour ces composants. Cependant, une telle carte de circuit imprimé est inefficace d'un aspect thermique, c'est-à-dire qu'elle n'est pas appropriée pour évacuer la chaleur générée par les composants de puissance. These components are typically mounted on a printed circuit board, which electrically bonds and acts as a mechanical support for these components. However, such a printed circuit board is inefficient in a thermal aspect, i.e., it is not suitable for evacuating the heat generated by the power components.
Pour assurer le refroidissement d'une telle carte, comme cela est mieux décrit dans la demande de brevet EP 2 809 135, celle-ci est composée d'une succession de couches alternées conductrices et isolantes électriquement, d'au moins un composant monté sur la couche supérieure et d'un dispositif de refroidissement des composants de la carte. Dans l'exemple décrit par cette demande de brevet, ce dispositif de refroidissement est un radiateur à ailettes qui est placé sur la couche inférieure de la carte. Pour assurer la transmission de la chaleur entre les composants et le radiateur, cette carte est traversée de part en part par des puits revêtus intérieurement d'une couche d'un métal thermiquement conductrice. To ensure the cooling of such a card, as is better described in the patent application EP 2 809 135, it is composed of a succession of electrically conductive and electrically insulating alternate layers, of at least one component mounted on the upper layer and a cooling device of the components of the card. In the example described by this patent application, this cooling device is a finned radiator which is placed on the lower layer of the card. To ensure the transmission of heat between the components and the radiator, this card is traversed right through by wells coated internally with a layer of a thermally conductive metal.
Ces puits relient avantageusement les composants électroniques au radiateur et permettent d'évacuer la chaleur générée par ces composants vers le radiateur en assurant ainsi le refroidissement de la carte.  These wells advantageously connect the electronic components to the radiator and allow to evacuate the heat generated by these components to the radiator thus ensuring the cooling of the card.
Ce dispositif est avantageux car il permet d'évacuer une partie de la chaleur mais peut s'avérer insuffisant lorsque de grandes quantités de chaleur sont à dissiper. This device is advantageous because it allows to evacuate part of the heat but may be insufficient when large amounts of heat are to be dissipated.
La présente invention se propose de remédier aux inconvénients ci-dessus grâce à un dispositif électronique qui permet d'assurer le refroidissement de ces composants même lorsque ceux-ci dégagent une grande quantité de chaleur. The present invention proposes to overcome the above drawbacks with an electronic device that ensures the cooling of these components even when they emit a large amount of heat.
De plus, le dispositif de l'invention utilise sensiblement les mêmes techniques que celles qui sont actuellement employés pour la fabrication de cartes de circuits imprimés et de montage des composants sur la carte de circuit imprimé. A cet effet, la présente invention concerne un dispositif électronique comprenant une carte de circuit imprimé portant au moins un composant comprenant au moins un composant de puissance et/ou au moins un conducteur de puissance, ladite carte de circuit imprimé comportant une succession en alternance de couches isolantes et conductrices, des puits portant un revêtement intérieur conducteur électriquement et thermiquement et traversant l'épaisseur de la carte, et un dispositif de refroidissement de la carte, caractérisé en ce que l'intérieur du puits est rempli en outre d'une matière thermiquement conductrice pour réaliser un pont thermique entre le composant et le dispositif de refroidissement.  In addition, the device of the invention uses substantially the same techniques as those currently used for the manufacture of printed circuit boards and mounting components on the printed circuit board. For this purpose, the present invention relates to an electronic device comprising a printed circuit board carrying at least one component comprising at least one power component and / or at least one power conductor, said printed circuit board comprising an alternating succession of insulating and conductive layers, wells having an electrically and thermally conductive inner coating and passing through the thickness of the board, and a board cooling device, characterized in that the interior of the well is further filled with a material thermally conductive to achieve a thermal bridge between the component and the cooling device.
La matière thermiquement conductrice peut être la matière de liaison du composant avec la carte. The thermally conductive material may be the bonding material of the component with the card.
La matière thermiquement conductrice peut être de l'étain. La carte peut porter une pâte thermique placée entre la couche inférieure de la carte et le dispositif de refroidissement. Les puits peuvent être obtenus par perçage et être revêtus intérieurement d'une couche de métal conducteur et être remplis d'une matière thermiquement conductrice. The thermally conductive material may be tin. The card may carry a thermal paste placed between the lower layer of the card and the cooling device. The wells may be pierced and internally coated with a conductive metal layer and filled with a thermally conductive material.
Les puits peuvent être obtenus par perçage, être revêtus intérieurement d'une couche de métal conducteur et être remplis d'une matière thermiquement conductrice ainsi que d'une pâte thermique. The wells may be pierced, internally coated with a conductive metal layer and filled with a thermally conductive material and a thermal paste.
Les autres caractéristiques et avantages de l'invention vont apparaître maintenant à la lecture de la description qui va suivre, donnée à titre uniquement illustratif et non limitatif, et à laquelle sont annexées : The other features and advantages of the invention will now appear on reading the following description, given solely by way of illustration and not limitation, and to which are appended:
- la figure 1 qui est une vue de dessus schématique locale de la carte de circuit imprimé et  - Figure 1 which is a schematic top view of the printed circuit board and
- la figure 2 qui est une vue schématique en coupe selon la ligne 2-2 de la figure 1 .  - Figure 2 which is a schematic sectional view along the line 2-2 of Figure 1.
La figure 1 montre une partie d'un dispositif électronique 10 comprenant une carte de circuit imprimé 12, ici une partie d'un dispositif comprenant des circuits de commutation, par exemple un onduleur. Figure 1 shows a part of an electronic device 10 comprising a printed circuit board 12, here a part of a device comprising switching circuits, for example an inverter.
Cette carte de circuit imprimé 12 porte au moins une série de composants avec un composant de puissance 14 et son corps principal 16 et au moins un conducteur de puissance 18 qui est apte à recevoir ou émettre une puissance électrique en étant avantageusement relié à une piste conductrice 20.  This printed circuit board 12 carries at least one series of components with a power component 14 and its main body 16 and at least one power conductor 18 which is able to receive or emit electrical power advantageously being connected to a conducting track 20.
A titre d'exemple non limitatif, le composant de puissance 14 peut être un composant électronique, tel que, par exemple, un commutateur statique, un transistor MOSFET (Metal-Oxide-Semiconductor Transistor à effet de champ), un transistor IGBT (Insulated Gâte Bipolar Transistor), une résistance, etc. De même, le composant peut être un composant qui ne soit pas dit de puissance mais un composant qui génère une chaleur significative, comme un processeur. Sur la figure 2, la carte de circuit imprimé 12 comprend de préférence une succession de couches isolantes 22 et de couches conductrices 24 qui alternent réciproquement en étant empilées les unes sur les autres. By way of nonlimiting example, the power component 14 may be an electronic component, such as, for example, a static switch, a MOSFET (Metal-Oxide-Semiconductor Field Effect Transistor), an IGBT transistor (Insulated Bipolar Transistor), resistance, etc. Similarly, the component may be a component that is not called power but a component that generates significant heat, such as a processor. In Figure 2, the printed circuit board 12 preferably comprises a succession of insulating layers 22 and conductive layers 24 which reciprocally alternate by being stacked on top of each other.
Ces couches sont reliées les unes aux autres par tous moyens connus à la portée de l'homme du métier.  These layers are connected to each other by any known means within the reach of the skilled person.
Les couches isolantes 22 comprennent de préférence un matériau électriquement et thermiquement isolant, par exemple des fibres de verre. Les couches conductrices 24 comprennent avantageusement un mélange d'un matériau électriquement et thermiquement conducteur, de préférence un métal tel que par exemple le cuivre et d'un matériau électriquement et thermiquement isolant. The insulating layers 22 preferably comprise an electrically and thermally insulating material, for example glass fibers. The conductive layers 24 advantageously comprise a mixture of an electrically and thermally conductive material, preferably a metal such as, for example, copper and an electrically and thermally insulating material.
La carte 12 comprend en outre une base de montage 26 pour la réception du corps principal 1 6 du composant de puissance. The card 12 further comprises a mounting base 26 for receiving the main body 1 6 of the power component.
Cette base de montage 26 comprend une plaque conductrice 28 pour chaque couche conductrice 24 et en contact avec celle-ci. Ces plaques ont avantageusement toutes une même forme et sont de préférence empilées.  This mounting base 26 comprises a conductive plate 28 for each conductive layer 24 and in contact therewith. These plates advantageously all have the same shape and are preferably stacked.
La carte comprend, au niveau de la base de montage 26, une pluralité de puits 30 sensiblement perpendiculaires à la face des couches 22, 24 et qui traversent toute l'épaisseur de la carte à circuit imprimé en étant régulièrement espacés les uns des autres. The card comprises, at the mounting base 26, a plurality of wells 30 substantially perpendicular to the face of the layers 22, 24 and which pass through the entire thickness of the printed circuit board being regularly spaced from each other.
Ces puits permettent de réaliser un contact électrique et thermique avec les plaques conductrices 28 des couches conductrices 24.  These wells make it possible to make electrical and thermal contact with the conductive plates 28 of the conductive layers 24.
Pour cela, ces puits comprennent un revêtement interne de métal conducteur For this purpose, these wells comprise an internal coating of conductive metal
32, de préférence du même métal que les couches conductrices, tel que du cuivre. 32, preferably of the same metal as the conductive layers, such as copper.
Ces puits sont de préférence obtenus par perçage au travers de l'épaisseur de la carte du circuit imprimé. Ces perçages sont ensuite revêtus intérieurement d'une mince couche de métal conducteur, par exemple par un procédé de galvanisation, en laissant subsister une colonne creuse à l'intérieur de ce puits. These wells are preferably obtained by drilling through the thickness of the circuit board. These holes are then lined internally a thin layer of conductive metal, for example by a galvanizing process, leaving a hollow column remain inside this well.
Un dispositif de refroidissement 34 de la carte est également porté par cette carte. Préférentiellement, ce dispositif est placé sur la couche inférieure de la carte et permet l'évacuation de chaleur générée par les composants de la carte avec le milieu extérieur, ici de l'air. A cooling device 34 of the card is also carried by this card. Preferably, this device is placed on the lower layer of the card and allows the evacuation of heat generated by the components of the card with the external medium, here air.
Avantageusement, ce dispositif est un radiateur à ailette 34 qui est en contact avec les extrémités inférieures 36 des puits 30 au travers d'une matière durcissable 38, comme une pâte thermique. Cette pâte, qui est malléable, est placée entre la couche inférieure de la carte et la paroi du radiateur qui lui fait face en étant en contact avec le revêtement intérieur conducteur des puits. Suite à sa mise en place, la pâte durcit et assure alors une liaison rigide entre la carte et le radiateur ainsi que la connexion thermique avec les puits. Advantageously, this device is a fin radiator 34 which is in contact with the lower ends 36 of the wells 30 through a hardenable material 38, such as a thermal paste. This paste, which is malleable, is placed between the lower layer of the card and the wall of the radiator which faces him by being in contact with the conductive inner lining of the wells. Following its installation, the paste hardens and then ensures a rigid connection between the card and the radiator and the thermal connection with the wells.
Comme visible sur la figure 2, le corps 1 6 du composant de puissance 14 est avantageusement connecté à la base de montage 26 au travers d'une couche de liaison 40 d'une matière connue en soi, comme de l'étain. As can be seen in FIG. 2, the body 1 6 of the power component 14 is advantageously connected to the mounting base 26 through a bonding layer 40 of a material known per se, such as tin.
Outre le fait de réaliser la connexion avec la base, cette matière, qui est également thermiquement conductrice, permet de réaliser la connexion thermique avec les extrémités supérieures 42 des puits et avec le revêtement interne des puits 30. Comme mieux illustré sur la figure 2, la colonne creuse à l'intérieur des puits est remplie d'une matière conductrice de chaleur 44 entre les deux extrémités 36, 42.  In addition to making the connection with the base, this material, which is also thermally conductive, allows the thermal connection to be made with the upper ends 42 of the wells and with the inner lining of the wells 30. As best illustrated in FIG. the hollow column inside the wells is filled with a heat-conducting material 44 between the two ends 36, 42.
De manière préférentielle, cette matière provient de la matière de la couche de liaison, ici de l'étain. Ainsi, lors de l'opération de connexion, l'étain s'écoule dans la colonne creuse du puits jusqu'à remplir complètement la colonne creuse entre les deux extrémités du puits.  Preferably, this material comes from the material of the tie layer, here tin. Thus, during the connection operation, the tin flows into the hollow column of the well to completely fill the hollow column between the two ends of the well.
Ceci permet de réaliser à la fois la connexion du composant 14 avec la base et le remplissage de l'intérieur des puits. Il est donc crée un pont thermique entre le composant 14 et le radiateur de refroidissement 34 par les matières (cuivre et étain) de l'intérieur des puits 30 et la pâte thermique 38. Grâce à cela, la conductivité thermique de la carte est supérieure d'environThis allows for both the connection of the component 14 with the base and the filling of the interior of the wells. It is therefore created a thermal bridge between the component 14 and the cooling radiator 34 by the materials (copper and tin) of the interior of the wells 30 and the thermal paste 38. Thanks to this, the thermal conductivity of the card is greater about
50% à celle des cartes de l'art antérieur. 50% to that of the cards of the prior art.
Il est à noter que l'utilisation d'une pâte thermique permet d'assurer le contact thermique entre l'étain et le radiateur lorsque l'étain n'atteint pas l'extrémité inférieure d'un ou plusieurs puits. En effet, après l'opération de remplissage des puits et lors de la mise en place de la pâte thermique, qui est initialement malléable, celle-ci pénètre à l'intérieur des puits jusqu'à ce qu'elle soit au contact avec l'étain. Ce contact permet alors d'assurer le transfert de chaleur entre les puits et le radiateur. It should be noted that the use of a thermal paste makes it possible to ensure thermal contact between the tin and the radiator when the tin does not reach the lower end of one or more wells. Indeed, after the operation of filling the wells and during the introduction of the thermal paste, which is initially malleable, it penetrates inside the wells until it is in contact with the well. 'tin. This contact then makes it possible to ensure the heat transfer between the wells and the radiator.
Bien entendu et cela sans sortir du cadre de l'invention, la piste conductrice 20 de la figure 1 est reliée au radiateur par une multiplicité de puits 30' munis d'un revêtement interne à base de cuivre. Dans la zone de jonction avec le conducteur de puissance 18, l'intérieur de ces puits est rempli d'une matière conductrice de chaleur. Cette matière est avantageusement de l'étain qui est utilisé pour assurer la liaison du conducteur avec la piste. Of course and without departing from the scope of the invention, the conductive track 20 of Figure 1 is connected to the radiator by a plurality of wells 30 'provided with a copper-based inner coating. In the junction zone with the power conductor 18, the interior of these wells is filled with a heat conductive material. This material is preferably tin which is used to ensure the connection of the driver with the track.
Préférentiellement, les puits 30' en regard de la piste 20 sont remplis de matière conductrice de chaleur, ici de l'étain, de manière à assurer la conduction thermique vers le dispositif de refroidissement 34 de la chaleur produite par effet Joule par la piste.  Preferably, the wells 30 'facing the track 20 are filled with heat conductive material, here tin, so as to ensure thermal conduction to the cooling device 34 of the heat produced by Joule effect by the track.

Claims

REVENDICATIONS
1 ) Dispositif électronique (10) comprenant une carte de circuit imprimé (12) portant au moins un composant comprenant au moins un composant de puissance (14) et/ou au moins un conducteur de puissance (18), ladite carte de circuit imprimé comportant une succession en alternance de couches isolantes (22) et conductrices (24), des puits (30, 30') portant un revêtement intérieur conducteur électriquement et thermiquement (32) et traversant l'épaisseur de la carte, et un dispositif de refroidissement (34) de la carte, caractérisé en ce que l'intérieur du puits est rempli en outre d'une matière thermiquement conductrice (44) pour réaliser un pont thermique entre le composant et le dispositif de refroidissement (34). An electronic device (10) comprising a printed circuit board (12) carrying at least one component comprising at least one power component (14) and / or at least one power conductor (18), said printed circuit board comprising an alternating succession of insulating (22) and conductive layers (24), wells (30, 30 ') carrying an electrically and thermally conductive inner coating (32) and passing through the thickness of the board, and a cooling device ( 34), characterized in that the interior of the well is further filled with a thermally conductive material (44) to provide a thermal bridge between the component and the cooling device (34).
2) Dispositif électronique (10) selon la revendication 1 , caractérisé en ce que la matière thermiquement conductrice est la matière de liaison (40) du composant avec la carte. 2) electronic device (10) according to claim 1, characterized in that the thermally conductive material is the connecting material (40) of the component with the card.
3) Dispositif électronique (10) selon la revendication 1 ou 2, caractérisé en ce que la matière thermiquement conductrice est de l'étain. 3) electronic device (10) according to claim 1 or 2, characterized in that the thermally conductive material is tin.
4) Dispositif électronique (10) selon la revendication 1 , caractérisé en ce que la carte porte une pâte thermique (38) placée entre la couche inférieure de la carte et le dispositif de refroidissement (34). 5) Dispositif électronique (10) selon l'une quelconque des revendications précédentes, caractérisé en ce que les puits sont obtenus par perçage, lesdits perçages étant revêtus intérieurement d'une couche de métal conducteur (32) et remplis d'une matière thermiquement conductrice (44). 6) Dispositif électronique (10) selon l'une quelconque des revendications 1 à4) An electronic device (10) according to claim 1, characterized in that the card carries a thermal paste (38) placed between the lower layer of the card and the cooling device (34). 5) An electronic device (10) according to any one of the preceding claims, characterized in that the wells are obtained by drilling, said bores being coated internally with a layer of conductive metal (32) and filled with a thermally conductive material (44). 6) An electronic device (10) according to any one of claims 1 to
4, caractérisé en ce que les puits sont obtenus par perçage, lesdits perçages étant revêtus intérieurement d'une couche de métal conducteur (32) et remplis d'une matière thermiquement conductrice (44) ainsi que d'une pâte thermique. 7) Machine électrique comprenant un dispositif électronique (10) selon l'une quelconque des revendications précédentes. 4, characterized in that the wells are obtained by drilling, said bores being lined internally with a layer of conductive metal (32) and filled with a thermally conductive material (44) and a thermal paste. An electric machine comprising an electronic device (10) according to any one of the preceding claims.
EP16725060.4A 2015-05-28 2016-05-12 Electronic device comprising a printed circuit board with improved cooling Withdrawn EP3305039A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1554836A FR3036917B1 (en) 2015-05-28 2015-05-28 ELECTRONIC DEVICE COMPRISING A PRINTED CIRCUIT BOARD WITH IMPROVED COOLING.
PCT/EP2016/060693 WO2016188762A1 (en) 2015-05-28 2016-05-12 Electronic device comprising a printed circuit board with improved cooling

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EP3305039A1 true EP3305039A1 (en) 2018-04-11

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EP (1) EP3305039A1 (en)
JP (1) JP2018516462A (en)
CN (1) CN206506764U (en)
FR (1) FR3036917B1 (en)
WO (1) WO2016188762A1 (en)

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Publication number Publication date
FR3036917A1 (en) 2016-12-02
WO2016188762A1 (en) 2016-12-01
FR3036917B1 (en) 2018-11-02
CN206506764U (en) 2017-09-19
US20180168025A1 (en) 2018-06-14
JP2018516462A (en) 2018-06-21

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