EP3277430B1 - Fluid ejection device, method of forming fluid ejection device and fluid ejection system - Google Patents
Fluid ejection device, method of forming fluid ejection device and fluid ejection system Download PDFInfo
- Publication number
- EP3277430B1 EP3277430B1 EP16771755.2A EP16771755A EP3277430B1 EP 3277430 B1 EP3277430 B1 EP 3277430B1 EP 16771755 A EP16771755 A EP 16771755A EP 3277430 B1 EP3277430 B1 EP 3277430B1
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- EP
- European Patent Office
- Prior art keywords
- fluid
- interior
- ejection
- reservoir
- fluid ejection
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Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
- B05B1/02—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14145—Structure of the manifold
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
- B41J2/17503—Ink cartridges
- B41J2/17513—Inner structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
- B41J2/17503—Ink cartridges
- B41J2/17526—Electrical contacts to the cartridge
- B41J2/1753—Details of contacts on the cartridge, e.g. protection of contacts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
- B41J2/17503—Ink cartridges
- B41J2/17553—Outer structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
- B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
- B05B13/04—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during spraying operation
Definitions
- This invention is related to fluid ejection devices, and in particular, to fluid ejection devices that minimize fluid waste.
- fluids may be transported from a fluid reservoir and applied to a target surface with a fluid applicator, such as, for example, a pipette or fluid dropper.
- a fluid applicator such as, for example, a pipette or fluid dropper.
- US 2008/309740 A1 discloses a fluid supply tank for a micro-fluid ejection head and a method for improving operation of a micro-fluid ejection device.
- the fluid supply tank has a body portion for holding a fluid to be ejected.
- the body portion includes a fluid exit port on an exit end thereof and a cover on an opposing end thereof.
- An internal vent conduit is disposed in the tank between the exit end and the cover for air removal adjacent to the exit port.
- An object of the present invention is to provide a fluid ejection device for depositing predetermined quantities of fluid onto a target surface.
- Another object of the present invention is to provide a fluid ejection device for ejecting a predetermined quantity of fluid while minimizing any remainder fluid to be stored in the fluid ejection device so that fluid waste is minimized.
- a fluid ejection device having the features of claim 1 is provided.
- the interior passage of the fluid reservoir, the interior bore of the body, and the one or more interior fluid paths are adapted to gravity feed the fluid to the fluid ejection chip upon entry into the interior passage of the fluid reservoir.
- At least a portion of the fluid reservoir protrudes from the body.
- the one or more fluid ejection actuators are thermal ejection actuators.
- the fluid ejection chip comprises a substrate, a flow feature layer disposed over the substrate, and a nozzle layer disposed over the flow feature layer.
- the fluid reservoir comprises a wall and one or more fluid control surfaces disposed along an interior surface of the wall.
- the interior fluid paths are axially aligned such that the fluid is gravity fed to the fluid ejection chip upon entry into the interior passage of the fluid reservoir.
- the one or more fluid control surfaces are disposed along the interior passage of the fluid reservoir, and the fluid adheres to the one or more fluid control surfaces.
- the one or more fluid control surfaces protrude from the annular wall of the fluid reservoir.
- the one or more fluid control surfaces are recessed into the annular wall of the fluid reservoir.
- the fluid ejection device further comprises an adapter coupled with the fluid reservoir and defining the interior passage in fluid communication with the interior passage of the fluid reservoir, wherein the adapter that interengages a fluid storage device such that a quantity of fluid can be transferred from fluid storage device into fluid ejection device for ejection onto a target surface.
- the adapter comprises a needle for penetrating a portion of the fluid storage device.
- the needle comprises an interior channel for fluid communication with the fluid storage device.
- a method of forming a fluid ejection device having the features of claim 11 is provided.
- the interior fluid channel of the fluid reservoir, the interior fluid path, the interior bore, and the interior fluid channel together providing a fluid path that is substantially devoid of obstructions.
- the fluid ejection chip comprises one or more fluid ejection actuators.
- the fluid ejection chip is attached to the body such that the interior fluid path of the fluid ejection chip is axially aligned with the interior fluid channel of the fluid reservoir.
- the method further comprises the step of extending at least partially through the body and defining an interior fluid channel in fluid communication with the interior bore of the body.
- the fluid reservoir comprises an annular wall and one or more fluid control surfaces disposed along an interior surface of the annular wall.
- the method further comprises the step of coupling an adapter to the fluid reservoir, the fluid reservoir that couples with a fluid storage device.
- a fluid ejection system comprising a fluid ejection printer and a fluid ejection device.
- the fluid ejection printer comprises a housing and at least one of an internal power source or one or more electrical contacts in electrical communication with an external power source.
- the fluid ejection device comprises a body defining an interior bore, a fluid reservoir, a fluid ejection chip, and an electrical connector in electrical communication with the fluid ejection printer so that power is supplied from the fluid ejection printer to the fluid ejection chip.
- the fluid reservoir defines an interior passage that receives a fluid, and is in fluid communication with the interior bore of the body.
- the fluid ejection chip is coupled with the body and comprises one or more fluid ejection actuators.
- the fluid ejection chip has one or more interior fluid paths in fluid communication with the interior bore of the body to cause ejection of the fluid upon activation of the one or more fluid ejection actuators.
- the interior passage of the fluid reservoir, the interior bore of the body, and the one or more interior fluid paths are substantially devoid of obstructions such that the fluid is gravity fed to the fluid ejection chip upon entry into the interior passage of the fluid reservoir.
- the fluid reservoir comprises a wall and one or more fluid control surfaces disposed along an interior surface of the wall.
- the interior fluid paths are axially aligned such that the fluid is gravity fed to the fluid ejection chip upon entry into the interior passage of the fluid reservoir.
- the one or more fluid control surfaces are disposed along the interior passage of the fluid reservoir so that the fluid adheres to the one or more fluid control surfaces.
- the adapter is coupled with the fluid reservoir and defines an interior passage in fluid communication with the interior passage of the fluid reservoir.
- the fluid ejection device according to the present invention can deposit predetermined quantities of fluid onto a target surface.
- Fluid ejection device 100 includes a body 102 along which a fluid reservoir 110, an electrical connector 120, and a fluid ejection chip 130 are disposed.
- Body 102 may be an elongate member that includes a user engagement portion 104 and an ejection portion 106.
- User engagement portion 104 may include a surface feature 105 (e.g., a knob, bump, or ledge) to provide a user or grasping tool with a recognizable and easily-grasped region for handling fluid ejection device 100.
- Ejection portion 106 includes fluid reservoir 110, fluid ejection chip 130, and at least a portion of electrical connector 120, as described further herein.
- Body 102 may be formed of one or more suitable materials for applications described herein, for example, glass, polymeric materials, and composite materials, to name a few.
- user engagement portion 104 and/or ejection portion 106 may have different configurations.
- electrical connector 120 extends along a portion of body 102 and is in electrical communication with fluid ejection chip 130 via one or more bond pads 122.
- Electrical connector 120 may be a tab automated bonded (TAB) circuit that includes electrical conductors (not shown) that can contact a portion of a fluid ejection system to provide electrical power for fluid ejection chip 130, as described further herein.
- electrical connector 120 may have a different configuration, for example, a configuration in which electrical connector 120 is interiorly disposed along at least a portion of body 102.
- Fluid reservoir 110 protrudes from the surface of body 102 and presents an opening 112 into an interior fluid channel 114 ( FIG. 4 ) extending through fluid reservoir 110.
- Fluid reservoir 110 may have a hollow, dome-shaped profile, as shown.
- Fluid reservoir 110 may be a separable component that is coupled to body 102, for example, by adhesion, welding, or mechanical coupling, to name a few.
- fluid reservoir 110 may be integrally formed with body 102.
- fluid reservoir 110 may have a different configuration, for example, a configuration in which fluid reservoir 110 is flush or recessed with the body 102 of fluid ejection device 100 and/or a configuration in which fluid reservoir 110 is not a curved structure.
- Fluid ejection chip 130 is disposed along the body 102 of fluid ejection device 102 on an opposite side from fluid reservoir 110 such that one or more nozzles 172 of fluid ejection chip 130 are exposed facing a target surface upon which one or more fluids are to be deposited, for example, a testing slide or petri dish.
- fluid reservoir 110 and fluid ejection chip 130 are aligned along an axis B extending through fluid ejection device 100 such that a substantially linear and unobstructed fluid path is defined between the opening 112 of fluid reservoir 110 and nozzles 172 of fluid ejection chip 130, as described further herein.
- fluids deposited into fluid reservoir 110 can be gravity fed to fluid ejection chip 130.
- fluid reservoir 110 may have a configuration such that a backpressure is provided to at least partially counteract the force of gravity on fluids deposited into fluid reservoir 110, e.g., to control a flow rate of fluid passing through fluid ejection device 100.
- FIG. 4 an enlarged cross-sectional view of a portion of fluid ejection device 100 is shown, including fluid reservoir 110 and fluid ejection chip 130.
- the interior fluid channel 114 may widen downwardly in the direction of body 102, along a vertical distance of, for example, about 5mm.
- the interior fluid channel 114 may widen from a narrowest interior diameter at opening 112 of, for example, between about 5mm and about 15mm, to a widest interior diameter of, for example, between about 15mm and about 25mm where the fluid reservoir 110 meets the body 102.
- interior fluid channel 114 may widen from an interior diameter of, for example, 10mm at the opening 112 to a diameter of, for example, 18mm at the widest portion of interior fluid channel 114.
- fluid reservoir 110 is dimensioned to accommodate a volume of fluid.
- fluid reservoir 110 may be dimensioned to accommodate, for example, between about 1.8 cm 3 of fluid and about 4.1 cm 3 of fluid.
- fluid reservoir 110 may be dimensioned to accommodate about 0.5 grams of a water-based fluid.
- body 102 includes an interior bore 108 upon which fluid reservoir 110 is disposed so that a fluid path is formed between the interior fluid channel 114 of the fluid reservoir 110 and the interior bore 108 of the body 102.
- Interior bore 108 may have a similar diameter to the interior diameter of the widest portion of fluid reservoir 110, for example, between about 15mm and about 25mm. In embodiments, interior bore 108 may have a different diameter.
- Fluid ejection chip 130 may be mounted to body 102 in a suitable fashion, for example, adhesion, molding, or ultrasonic welding.
- fluid ejection device 100 can be assembled by providing body 102 having fluid reservoir 110 and attaching fluid ejection chip 130 to a portion of body 102 such that an interior fluid path of the fluid ejection chip 130 is in fluid communication with the interior bore 108 of the body 102 and the interior fluid channel 114 of the fluid reservoir 110 to provide a substantially unobstructed fluid path.
- Fluid ejection chip 130 may include a substrate 140, a plurality of fluid ejector elements 150, a flow feature layer 160, and/or a nozzle layer 170. In embodiments, ejection chip 130 may have a different configuration.
- Substrate 140 may be formed of semiconductor and/or insulator materials, for example, silicon, silicon dioxide, sapphire, germanium, gallium arsenide, and/or indium phosphide, to name a few.
- a portion of the substrate 140 may be processed to form one or more fluid channels 144 in fluid communication with the interior bore 108 of the body 102.
- processing portions of a fluid ejection chip may include, for example, mechanical deformation such as grinding, chemical etching, or patterning desired structures with photoresist, to name a few.
- One or more ejector elements 150 may be disposed on the substrate 110.
- Ejector elements 150 may be comprised of one or more conductive and/or resistive materials so that when electrical power is supplied to the ejector elements 150, heat is caused to accumulate on and/or near the ejector elements 150 to eject fluid therefrom, as described further herein.
- ejector elements 150 may be configured as thermal ejection actuators.
- ejector elements 150 may be formed of more than one layered material, such as a heater stack that may include a resistive element, dielectric, and protective layer. The amount of heat generated by ejector elements 150 may be directly proportional to the amount of power supplied to the ejector elements 150.
- power may be supplied to ejector elements 150 such that a predetermined thermal profile is generated by ejector elements 150, for example, a series of electrical power pulses of constant or variable amplitude and/or duration to achieve intended performance.
- ejector elements 150 may have a different electrical power configuration, for example, with the use of a piezoelectric element.
- an ejector element having a different configuration may be used with fluid ejection chip 130, for example, an ejector element that ejects fluid through the transfer of kinetic energy such as an electroactive polymer (EAP).
- EAP electroactive polymer
- a flow feature layer 160 may be disposed over the substrate 140.
- Flow feature layer 160 may be disposed in a layered or otherwise generally planar abutting relationship with respect to substrate 140.
- Flow feature layer 160 may be formed of, for example, a polymeric material.
- Flow feature layer 160 may be processed such that one or more flow features 162 are formed along and/or within flow feature layer 160.
- flow features 162 may have geometry and/or dimensioning so that flow features 162 are configured to direct the flow of fluid through fluid ejection chip 130.
- a nozzle layer 170 may be disposed over the flow feature layer 160.
- nozzle layer 170 may be disposed in a layered relationship with flow feature layer 160.
- nozzle layer 170 may be formed of, for example, a polymeric material.
- Nozzle layer 170 may be processed such that nozzles 172 are provided along an exposed surface of nozzle layer 170 as exit apertures for fluid being ejected from fluid ejection chip 130. Accordingly, nozzles 172 may have geometry and/or dimensioning configured to direct the trajectory of fluid exiting fluid ejection chip 130. Accordingly, fluid ejection chip 130 defines an interior fluid volume for accommodating fluid.
- the various features of fluid ejection chip 130 described herein may be processed in a way so that a desired interior volume is achieved.
- Respective fluid channels 144, flow features 162, and/or nozzles 172 may collectively define one or more fluid paths within fluid ejector chip 130, such as fluid path F 1 and fluid path F 2 as shown, such that fluids can move from fluid reservoir 110, through fluid ejection chip 130, and exit through nozzles 172.
- fluid paths F 1 and F 2 are substantially devoid of obstructions (open) such that the opportunity of fluids to pool, trap, or otherwise become blocked is substantially minimized.
- fluid channel 114 of fluid reservoir 110 and the interior bore 108 of body 102 together with fluid paths F 1 and F 2 , provide a substantially linear and unobstructed path through which fluids can flow so that substantially all of a fluid deposited into fluid reservoir 110 is ejected through nozzles 172.
- fluid ejector chip 130 can be provided such that a predetermined, discrete quantity of fluid is ejected onto a target surface while minimizing fluid waste due to the substantially linear and unobstructed fluid path provided by the interior configuration of fluid ejector chip 130.
- Fluid ejection device 100 as described herein is suitable for use with, for example, relatively small quantities of fluid and accordingly may have a compact configuration.
- fluid ejection device 100 may minimize manufacturing time and costs such that fluid ejection device 100 can be produced as a disposable device, e.g., a one-time use device. It may be desirable to use a disposable printhead design in a number of fields of application such as medical and laboratory testing, for example, to avoid sample contamination.
- Fluid ejection system 1000 includes a fluid ejection printer 200 which is configured to receive at least a portion of fluid ejection device 100.
- fluid ejection printer 200 may receive a differently-configured fluid ejection device.
- a testing surface T which may be, for example, a group of test tubes or an array of recessed reservoirs into which fluid can be deposited.
- testing surface T may be, for example, a testing slide or petri dish.
- testing surface T may be provided on a portion of fluid ejection printer 200.
- Fluid ejection printer 200 includes a housing 202 and at least one carrier 210 for receiving a portion of fluid ejection device 100.
- carrier 210 may include an interior recess for receiving a portion of fluid ejection device 100 and/or may present a surface suitable for coupling with fluid ejection device 100, for example, a clip, clamp, or tab structure, to name a few.
- Carrier 210 may also include an electrically conductive portion (not shown) for contacting and supplying electrical power through the electrical connector 120 ( FIG. 3 ) of fluid ejection device 100, e.g., from an internal power source or an electrical power supply line. In this regard, carrier 210 provides a physical and electrical interface between fluid ejection device 100 and fluid ejection printer 200.
- carrier 210 may be movable with respect to fluid ejection printer 200 along a series of rails with which carrier 210 is directly and/or indirectly slidable. As shown, carrier 210 may be slidably movable along a pair of lateral rails 212, which are each in turn slidably movable along a pair of lengthwise rails 214. In this regard, carrier 210 may be movable along a two-dimensional plane parallel to the testing surface T, e.g., an x-y grid.
- Fluid ejection printer 200 may also include a controller 204 for effecting various electrically-powered functions, for example, firing of ejection actuators 150 ( FIG. 4 ) of fluid ejection device 100.
- controller 204 may include or be electronically coupled with one or more processors that can read instructions from non-transitory computer memory. Electrically powered functions of fluid ejection printer 200 may be actuated manually by a user through an interface 216, which may be, for example, buttons, knobs, toggles, and/or capacitive touchscreens, to name a few.
- a user may insert or otherwise mount fluid ejection device 100 to carrier 210 of fluid ejection printer 200.
- a quantity of fluid may then be deposited into the fluid reservoir 110 of fluid ejection device 100, for example, with a pipette or dropper.
- a quantity of fluid may be deposited into fluid reservoir 110 by an automated device, for example, a portion of fluid ejection printer 200.
- the quantity of fluid that can be accommodated in fluid ejection device 100 depends upon the interior volume of the fluid reservoir 110, the volume of the interior bore 108 of body 102, and the interior volume of the fluid ejection chip 130.
- one or more electrical power pulses can be provided to fluid actuators 150 to cause flash vaporization and ejection of droplets of fluid from nozzles 172.
- FIG. 6A an enlarged cross-sectional view of a portion of fluid ejection device 100 is shown, including fluid reservoir 110 and fluid ejection chip 130.
- Annular wall 112A has an exterior surface 112a and an interior surface 112b. Accordingly, an interior diameter of fluid reservoir 110 can be measured between two diametrically opposed points on the interior surface 112b of annular wall 112A.
- the interior diameter of fluid reservoir 110 may widen from a narrowest point at the top of annular wall 112A of, for example, between about 5mm and 10mm, to a widest point at the bottom of annular wall 112A of, for example, between about 15mm and about 25mm.
- fluid reservoir 110 may have an interior diameter that widens from 10mm at the top of annular wall 112A to 18mm at the bottom of annular wall 112A.
- a height of fluid reservoir 110 can be measured between a vertically highest point and a vertically lowest point of annular wall 112A.
- Fluid reservoir 110 may have a height of, for example, between about 3mm and about 10mm. In embodiments, fluid reservoir 110 may have a height of 5mm. In embodiments, fluid reservoir 110 may be dimensioned to accommodate, for example, between about 1.8 cm 3 of fluid and about 4.1 cm 3 of fluid. In embodiments, fluid reservoir 110 may be dimensioned to accommodate about 0.5 grams of a water-based fluid. In this regard, the interior diameter and height of fluid reservoir 110 can be selected to provide a desired interior volume. In embodiments, fluid reservoir 110 may have a different configuration, e.g., an elliptical profile, a rectangular profile, a triangular profile, or a tapered profile such as a conical profile, to name a few.
- fluid reservoir 110 includes a number of fluid control surfaces 116 disposed circumferentially around the interior surface 112b of the annular wall 112A. Fluid control surfaces 116 may protrude at least partially into the interior fluid channel 114 such that fluid control surfaces 116 are disposed along a path that a fluid travels as it passes through fluid ejection device 100. Fluid control surfaces 116 may have a rounded rectangular profile in cross-section, as shown, or may have a different cross-sectional profile, as described further herein. In embodiments, fluid control surfaces 116 may integrally formed with the wall of fluid reservoir 110, e.g., may be molded with or cut from the annular wall 112A of fluid reservoir 110. In embodiments, fluid control surfaces 116 may be affixed to the interior wall of fluid reservoir 110, e.g., as an o-ring or circumferential clip.
- Fluid control surfaces 116 are configured to contact and engage, e.g., through an adhesion between the fluid and the fluid control surface 116, fluids passing through the interior fluid channel 114. As shown, fluids passing by fluid control surfaces 116 may adhere to the fluid control surfaces 116 at points of contact such that surface tension is generated across the fluid. In the exemplary embodiment shown, the outer perimeter of a volume of fluid passing through fluid ejection device 100 may adhere to fluid control surfaces 116 such that, as the bulk of the fluid volume continues to advance downwardly due to the effects of gravity, the outer periphery of the volume of fluid experiences a drag force such that a meniscus M is formed. Although the meniscus M is shown in FIG. 6A as being concave, the meniscus may have a convex formation depending on the liquid-control surface interface.
- fluid control surfaces 116 impart the fluid with a capillary action to at least partially counteract the weight of fluid passing through fluid reservoir 110 such that the speed, e.g., the flow rate, of fluid passing through interior fluid channel 114 may be slowed. Accordingly, fluid control surfaces 116 may exert backpressure on a fluid passing through fluid reservoir 110 as a degree of control on a fluid that is to be ejected from fluid ejection device 110. For example, fluid control surfaces 116 may minimize or prevent a fluid passing through interior fluid channel 114 from undesired behavior, such as drooling or dripping, before deliberate ejection by fluid chip 130, as described further herein. Such a measure of control by fluid control surfaces 116 on fluids passing through fluid reservoir 110 may contribute to minimizing waste with respect to fluids used with fluid ejection device 100 ( FIG. 1 ).
- FIG. 6B an alternative embodiment of the present invention is illustrated in cross-section, in which a number of fluid control surfaces 116B are disposed along the interior surface of an annular wall 112B of a fluid reservoir 110B.
- fluid control surface 116B have a curvate, e.g., rounded or dome-shaped, cross-sectional profile.
- fluid control surfaces 116C are disposed along the interior surface of an annular wall 112C of a fluid reservoir 110C.
- fluid control surfaces 116C have a pointed, e.g., wedge-shaped or triangular-shaped, cross-sectional profile.
- FIG. 6D another alternative embodiment of the present invention is illustrated, in which a number of fluid control surfaces 116D are disposed along the interior surface of an annular wall 112D of a fluid reservoir 110D. As shown, engaging surfaces 116C have an upwardly turned hook-shaped cross-sectional profile.
- FIG. 6E an alternative embodiment of the present invention is illustrated, in which a number of fluid control surfaces 116E are formed along the annular wall 112E of a fluid reservoir 110E. As shown, fluid control surfaces 116E do not protrude into the interior fluid path 114E of fluid reservoir 110E, but instead are recessed within the annular wall 112E of fluid reservoir 110E, e.g., by cutting or through inset molding of fluid reservoir 110E.
- fluid reservoirs described herein in embodiments of the present invention may have different surface configurations, e.g., shape, texture, and/or material composition, such that a desired amount of backpressure is provided to a fluid passing therethrough.
- fluid control surfaces disposed along a fluid reservoir may have a different configuration, for example, a jagged, barbed, ridged, ribbed, or knurled cross-sectional profile, to name a few.
- fluid control surfaces disposed along a fluid reservoir may be continuous or may have one or more discontinuities therealong.
- a fluid reservoir may be treated, e.g., lined or coated, with a material to provide a desired flow rate of fluid passing therethrough, for example, a hydrophilic material.
- a fluid reservoir may contain additional fluid control surfaces, for example, a lip, ridge, and/or adhesive seam formed along the location at which the fluid reservoir and a fluid ejection device body meet.
- body 102 of fluid ejection device 100 includes an interior bore 108 upon which fluid reservoir 110 is disposed so that a fluid path is formed between the interior fluid channel 114 of the fluid reservoir 110 and the interior bore 108 of the body 102.
- interior bore 108 may have a similar diameter to the interior diameter of the widest portion of fluid reservoir 110, for example, between about 15mm and about 25mm. In embodiments, interior bore 108 may have a different diameter.
- Fluid ejection system 1000 includes a fluid ejection device 100 and a fluid storage device 190.
- fluid ejection device 100 is configured for coupling with fluid storage device 190 via an adapter 180 so that a quantity of fluid can be transferred from fluid storage device into fluid ejection device 100 for ejection onto a target surface.
- Fluid ejection device 100 includes a body 102 along which a fluid reservoir 110, an electrical connector 120, and a fluid ejection chip 130 are disposed.
- Body 102 may be an elongate member that includes a user engagement portion 104 and an ejection portion 106.
- User engagement portion 104 may include a surface feature 105 (e.g., a knob, bump, or ledge) to provide a user or grasping tool with a recognizable and easily-grasped region for handling fluid ejection device 100.
- Ejection portion 106 includes fluid reservoir 110, fluid ejection chip 130, and at least a portion of electrical connector 120, as described further herein.
- Body 102 may be formed of one or more suitable materials for applications described herein, for example, glass, polymeric materials, and composite materials, to name a few.
- user engagement portion 104 and/or ejection portion 106 may have different configurations.
- electrical connector 120 extends along a portion of body 102 and is in electrical communication with fluid ejection chip 130 via one or more bond pads 122.
- Electrical connector 120 may be a tab automated bonded (TAB) circuit that includes electrical conductors (not shown) that can contact a portion of a fluid ejection system to provide electrical power for fluid ejection chip 130, as described further herein.
- electrical connector 120 may have a different configuration, for example, a configuration in which electrical connector 120 is interiorly disposed along at least a portion of body 102.
- Fluid reservoir 110 protrudes from the surface of body 102 and presents an opening 112 into an interior fluid channel 114 ( FIG. 11 ) extending through fluid reservoir 110.
- Fluid reservoir 110 may have a hollow, dome-shaped profile, as shown.
- Fluid reservoir 110 may be a separable component that is coupled to body 102, for example, by adhesion, welding, or mechanical coupling, to name a few.
- fluid reservoir 110 may be integrally formed with body 102.
- fluid reservoir 110 may have a different configuration, for example, a configuration in which fluid reservoir 110 is flush or recessed with the body 102 of fluid ejection device 100 and/or a configuration in which fluid reservoir 110 is not a curved structure.
- adapter 180 is provided having a storage device portion 182 and an ejection device portion 184.
- Storage device portion 182 is configured for coupling with fluid storage device 190, as described further herein.
- Ejection device portion 184 may be configured for coupling with the body 102 of fluid ejection device 100.
- ejection device portion 184 of adapter 180 may define an interior chamber 112 dimensioned to at least partially receive fluid reservoir 110.
- Interior chamber 112 may have a profile similar to fluid reservoir 110 or may have a different configuration.
- ejection device portion 184 may include a pair of downwardly extending arms 194 extending from the ejection device portion 184 that receive the fluid reservoir 110 and a portion of the body 102 of ejection device 100 therebetween.
- the body 102 may include a pair of notches 103 for receiving an inwardly-extending tab 196 of each respective downwardly-extending arm 194 to provide a secure engagement between adapter 180 and fluid ejection device 100.
- Inwardly-extending tabs 196 may have a tapered profile to facilitate sliding engagement into notches 103 of the body 102 of ejection device 100.
- adapter 180 may be configured for removal from fluid ejection device 100, for example, by prying downwardly-extending arms 194 away from the fluid ejection device 100 manually or with a tool to disengage inwardly-extending tabs 196 from notches 103.
- adapter 180 may include different features for engaging a portion of fluid ejection device 100, for example, a different number of downwardly-extending arms 194 and/or a different configuration of tabs 196.
- adapter 180 may include a sealing member 192 embedded within ejection device portion 184 and at least partially exposed to sealingly engage a portion of body 102 of fluid ejection device 100 upon coupling of adapter 180 and fluid ejection device 100.
- sealing member 192 may provide a degree of fluid sealing, e.g., inhibition or prevention of leakage of fluids from fluid reservoir 110.
- adapter 180 may incorporate a different fluid sealing component.
- interior tab 189 of ejection device portion 184 may be spring biased such that a user can couple fluid storage device 190 with fluid ejection device 100 by approximating the proper position of fluid reservoir 110 within the ejection device portion 184 of adapter 180 and confirming a proper coupling by the sound and/or vibration of the interior tab 189 entering the corresponding notch on fluid reservoir 110.
- interior tab 189 may include a release so that the adapter 180 may be uncoupled from fluid ejection device 100.
- fluid reservoir 110 may be coupled with adapter 180 in a different way, for example, a threaded coupling.
- ejection device portion 184 of adapter 180 may be adhered to fluid ejection device 100 or another portion thereof.
- adapter 180 may be integrally formed with fluid ejection device 100.
- Fluid ejection chip 130 is disposed along the body 102 of fluid ejection device 102 on an opposite side from fluid reservoir 110 and adapter 180 such that one or more nozzles 172 of fluid ejection chip 130 are exposed facing a target surface upon which one or more fluids are to be deposited, for example, a testing slide or petri dish.
- adapter 180, fluid reservoir 110, and fluid ejection chip 130 are aligned along an axis B extending through fluid ejection device 100 such that a substantially linear and unobstructed fluid path is defined between the opening 112 of fluid reservoir 110 and nozzles 172 of fluid ejection chip 130, as described further herein.
- a substantially linear and unobstructed fluid path may be defined between a top opening of adapter 180 and nozzles 172 of fluid ejection chip 130.
- fluids deposited into or through fluid reservoir 110 can be gravity fed to fluid ejection chip 130.
- fluid reservoir 110 may have a configuration such that a backpressure is provided to at least partially counteract the force of gravity on fluids deposited into fluid reservoir 110, e.g., to control a flow rate of fluid passing through fluid ejection device 100.
- FIG. 10 an enlarged cross-sectional view of a portion of fluid ejection device 100 is shown, including adapter 180 coupled with fluid reservoir 110, and fluid ejection chip 130 mounted to the body 102.
- Adapter 180 defines a hollow interior such that an interior passage 185 is provided in fluid communication with the interior fluid channel 114 of fluid reservoir 110. Accordingly, fluids deposited into adapter 180 may be directed into fluid reservoir 110, for example, through the influence of gravity, pressurization, and/or capillary action.
- adapter 180 may incorporate a fluid guide, for example, a funnel or other downwardly-oriented surface (not shown) to direct fluids into the opening 112 of fluid reservoir 110.
- a needle 186 is interiorly mounted within the interior passage 185 of the adapter 180, and extends upwardly through the storage device portion 182 of adapter 180, as shown. Needle 186 may be configured to engage a portion of fluid storage device 190, as described further herein. In embodiments, needle 186 may define an interior passage such that fluids can travel therethrough.
- a pair of sealing members 188 may be disposed about an exterior portion of adapter 180, for example, to aid in forming a substantially fluid tight seal between adapter 180 and fluid storage device 190 upon coupling, as described further herein.
- Sealing members 188 may be a pair of polymeric o-rings disposed about an outer surface of adapter 180.
- sealing members 188 may have a different configuration. In embodiments, a different number of sealing members may be provided.
- the interior fluid channel 114 may widen downwardly in the direction of body 102, along a vertical distance of, for example, about 5mm.
- the interior fluid channel 114 may widen from a narrowest interior diameter at opening 112 of, for example, between about 5mm and about 15mm, to a widest interior diameter of, for example, between about 15mm and about 25mm where the fluid reservoir 110 meets the body 102.
- interior fluid channel 114 may widen from an interior diameter of, for example, 10mm at the opening 112 to a diameter of, for example, 18mm at the widest portion of interior fluid channel 114.
- fluid reservoir 110 is dimensioned to accommodate a volume of fluid.
- fluid reservoir 110 may be dimensioned to accommodate, for example, between about 1.8 cm 3 of fluid and about 4.1 cm 3 of fluid.
- fluid reservoir 110 may be dimensioned to accommodate about 0.5 grams of a water-based fluid.
- body 102 includes an interior bore 108 upon which fluid reservoir 110 is disposed so that a fluid path is formed between the interior fluid channel 114 of the fluid reservoir 110 and the interior bore 108 of the body 102.
- Interior bore 108 may have a similar diameter to the interior diameter of the widest portion of fluid reservoir 110, for example, between about 15mm and about 25mm. In embodiments, interior bore 108 may have a different diameter.
- Fluid ejection chip 130 may be mounted to body 102 in a suitable fashion, for example, adhesion, molding, or ultrasonic welding.
- fluid ejection device 100 can be assembled by providing body 102 having fluid reservoir 110 and attaching fluid ejection chip 130 to a portion of body 102 such that an interior fluid path of the fluid ejection chip 130 is in fluid communication with the interior bore 108 of the body 102 and the interior fluid channel 114 of the fluid reservoir 110 to provide a substantially unobstructed fluid path.
- Fluid ejection chip 130 may include a substrate 140, a plurality of fluid ejector elements 150, a flow feature layer 160, and/or a nozzle layer 170. In embodiments, ejection chip 130 may have a different configuration.
- Substrate 140 may be formed of semiconductor and/or insulator materials, for example, silicon, silicon dioxide, sapphire, germanium, gallium arsenide, and/or indium phosphide, to name a few.
- a portion of the substrate 140 may be processed to form one or more fluid channels 144 in fluid communication with the interior bore 108 of the body 102.
- processing portions of a fluid ejection chip may include, for example, mechanical deformation such as grinding, chemical etching, or patterning desired structures with photoresist, to name a few.
- One or more ejector elements 150 may be disposed on the substrate 110.
- Ejector elements 150 may be comprised of one or more conductive and/or resistive materials so that when electrical power is supplied to the ejector elements 150, heat is caused to accumulate on and/or near the ejector elements 150 to eject fluid therefrom, as described further herein.
- ejector elements 150 may be configured as thermal ejection actuators.
- ejector elements 150 may be formed of more than one layered material, such as a heater stack that may include a resistive element, dielectric, and protective layer. The amount of heat generated by ejector elements 150 may be directly proportional to the amount of power supplied to the ejector elements 150.
- power may be supplied to ejector elements 150 such that a predetermined thermal profile is generated by ejector elements 150, for example, a series of electrical power pulses of constant or variable amplitude and/or duration to achieve intended performance.
- ejector elements 150 may have a different electrical power configuration, for example, with the use of a piezoelectric element.
- an ejector element having a different configuration may be used with fluid ejection chip 130, for example, an ejector element that ejects fluid through the transfer of kinetic energy such as an electroactive polymer (EAP).
- EAP electroactive polymer
- a flow feature layer 160 may be disposed over the substrate 140.
- Flow feature layer 160 may be disposed in a layered or otherwise generally planar abutting relationship with respect to substrate 140.
- Flow feature layer 160 may be formed of, for example, a polymeric material.
- Flow feature layer 160 may be processed such that one or more flow features 162 are formed along and/or within flow feature layer 160.
- flow features 162 may have geometry and/or dimensioning so that flow features 162 are configured to direct the flow of fluid through fluid ejection chip 130.
- a nozzle layer 170 may be disposed over the flow feature layer 160.
- nozzle layer 170 may be disposed in a layered relationship with flow feature layer 160.
- nozzle layer 170 may be formed of, for example, a polymeric material.
- Nozzle layer 170 may be processed such that nozzles 172 are provided along an exposed surface of nozzle layer 170 as exit apertures for fluid being ejected from fluid ejection chip 130. Accordingly, nozzles 172 may have geometry and/or dimensioning configured to direct the trajectory of fluid exiting fluid ejection chip 130. Accordingly, fluid ejection chip 130 defines an interior fluid volume for accommodating fluid.
- the various features of fluid ejection chip 130 described herein may be processed in a way so that a desired interior volume is achieved.
- Respective fluid channels 144, flow features 162, and/or nozzles 172 may collectively define one or more fluid paths within fluid ejector chip 130, such as fluid path F 1 and fluid path F 2 as shown, such that fluids can move from fluid reservoir 110, through fluid ejection chip 130, and exit through nozzles 172.
- fluid paths F 1 and F 2 are substantially devoid of obstructions such that the opportunity of fluids to pool, trap, or otherwise become blocked is substantially minimized.
- the interior passage 185 of adapter 180, the fluid channel 114 of fluid reservoir 110 and the interior bore 108 of body 102, together with fluid paths F 1 and F 2 , provide a substantially linear and unobstructed path through which fluids can flow so that substantially all of a fluid deposited into fluid reservoir 110 is ejected through nozzles 172.
- fluid ejector chip 130 can be provided such that a predetermined, discrete quantity of fluid is ejected onto a target surface while minimizing fluid waste due to the substantially linear and unobstructed fluid path provided by the interior configuration of fluid ejector chip 130.
- FIG. 12 a cross-sectional view of adapter 180 and an upper portion of fluid ejection device 100 are shown coupled with fluid storage device 190.
- Fluid storage device 190 comprises an interior reservoir 230 and a fluid coupling portion 220 extending downwardly therefrom.
- Interior reservoir 230 is an interior volume of fluid storage device 190 at least partially occupied by a fluid retaining membrane 232, e.g., a bag or enclosed film, within which a quantity of fluid is held.
- Fluid retaining membrane 232 may be provided, so that fluids disposed within the fluid retaining membrane 232 are isolated, from example, from air, other environmental conditions, or contaminants, to name a few. Fluid retaining membrane 232 may provide a measure of protection against fluid leakage from fluid storage device 190 in addition to the walls surrounding interior reservoir 230.
- fluid storage device 190 may be provided such that fluid retaining membrane 232 and fluid stored therewithin may be removable from fluid storage device 190, e.g., so that fluid storage device 190 is configured as a modular component.
- a biasing member 234 may be disposed between two plates 236 extending along the interior surface of fluid retaining membrane 232. Biasing member 234 may urge plates 236 outward, e.g., away from one another, such that an at least partial negative pressure environment, e.g., a backpressure, is generated within fluid retaining membrane 232 such that fluids disposed within fluid retaining membrane 232 do not, for example, drool, drip, leak, flow too quickly, or otherwise exhibit unintended characteristics.
- a fluid backpressure mechanism of this type is disclosed in U.S. Patent Application Publication No. 2013/0342618 , the entire contents of which are incorporated by reference herein.
- Fluid coupling portion 220 defines a fitting recess 222 configured to interengage adapter 180, and an interior chamber 224 that is in fluid communication with the interior of fluid retaining membrane 232, e.g., through a fluid connections such as a tube or a valve such as a septum (not shown).
- a seal 226 is disposed along a downward-facing side of interior chamber 224, and maintains a substantially fluid-tight barrier between the interior chamber 224 of fluid coupling portion 220 and a surrounding environment.
- Seal 226 may be a deformable member, for example, a polymeric member such as an elastomer. In this regard, seal 226 may be at least partially reconfigurable, as described further herein.
- fitting recess 222 of fluid coupling portion 220 receives at least a portion of storage device portion 182 of adapter 180. Accordingly, at least a portion of storage device portion 182 may be disposed within fitting recess 222 between an outer wall of fluid coupling portion 220 and an outer wall of interior chamber 224 of fluid coupling portion 220.
- storage device portion 182 of adapter 180 and/or fitting recess 222 of fluid coupling portion 220 may have a tapered configuration and may interengage via a press fit or threaded coupling, e.g., a Luer-type fitting.
- Sealing members 188 of adapter 180 may additionally become disposed within fitting recess 222, and may pressibly engage the walls of fluid coupling portion 220 to assist in maintaining a substantially fluid-tight barrier between fluid coupling portion 220 and a surrounding environment, e.g., to prevent leakage.
- storage device 190 and adapter 180 may interengage in a different type of coupling, for example, a threaded engagement, a tab and notch (clicking) arrangement, or snap fit, to name a few.
- needle 186 may penetrate and extend through seal 226 of fluid coupling portion 220 such that the substantially fluid-tight barrier provided by seal 226 is breached in a controlled manner.
- needle 186 may penetrate and dilate a portion of seal 226 such that fluids from fluid retaining member 222 can flow around needle 186 and into fluid reservoir 110 through adapter 180.
- needle 186 may define an interior passage such that upon penetration of seal 226 by needle 186, fluids from fluid retaining member 222 can enter the interior passage of needle 186 and flow through adapter 180 toward fluid reservoir 110.
- seal 226 may revert to a condition prior to penetration by needle 186, e.g., in a condition maintaining a substantially fluid-tight barrier between fluid coupling portion 220 and a surrounding environment. Accordingly, a dilation or puncture of seal 226 by needle 186 may contract upon withdrawal of needle 186.
- seal 226 may have a resilient configuration, e.g., as in an elastomeric member.
- seal 226 may further incorporate one or more one-way sealing mechanisms, such as a valve.
- fluid storage device 190 presents a device for the storage and/or release of fluids that may be configured for multiple uses, e.g., repeated instances of penetration of seal 226 by needle 186 and subsequent re-establishment of seal 226 upon withdrawal of needle 186.
- fluid storage device 190 presents a re-usable component such that fluid storage device 190 may be used with multiple fluid ejection devices 100.
- fluid ejection device 100 may be suitable for use with, for example, relatively small quantities of fluid and accordingly may have a compact configuration.
- fluid ejection device 100 may minimize manufacturing time and costs such that fluid ejection device 100 can be produced as a disposable device, e.g., a one-time use device, while fluid storage device 190 can be re-used until depleted of fluids so that no excess fluids need be discarded. It may be desirable to use a disposable printhead design in a number of fields of application such as medical and laboratory testing, for example, to avoid sample contamination.
- Fluid ejection system 2000 includes a fluid ejection printer 300 that is configured to interoperate with fluid ejection system 1000 ( FIG. 7 ). Accordingly, printer 300 may be configured to receive at least a portion of fluid ejection device 100. While printer 300 is shown coupled with fluid ejection device 100 and adapter 180 for clarity, it will be understood that fluid storage device 190 ( FIG. 7 ) may be coupled with adapter 180 on printer 300 as described herein. In embodiments, fluid ejection printer 300 may receive a differently-configured fluid ejection device.
- testing surface T which may be, for example, a group of test tubes or an array of recessed reservoirs into which fluid can be deposited.
- testing surface T may be, for example, a testing slide or petri dish.
- testing surface T may be provided on a portion of fluid ejection printer 200.
- Fluid ejection printer 300 includes a housing 302 and at least one carrier 310 for receiving a portion of fluid ejection device 100.
- carrier 310 may include an interior recess for receiving a portion of fluid ejection device 100 and/or may present a surface suitable for coupling with fluid ejection device 100, for example, a clip, clamp, or tab structure, to name a few.
- Carrier 310 may also include an electrically conductive portion (not shown) for contacting and supplying electrical power through the electrical connector 120 ( FIG. 10 ) of fluid ejection device 100, e.g., from an internal power source or an electrical power supply line. In this regard, carrier 310 provides a physical and electrical interface between fluid ejection device 100 and fluid ejection printer 200.
- carrier 310 may be movable with respect to fluid ejection printer 300 along a series of rails with which carrier 310 is directly and/or indirectly slidable. As shown, carrier 310 may be slidably movable along a pair of lateral rails 312, which are each in turn slidably movable along a pair of lengthwise rails 314. In this regard, carrier 310 may be movable along a two-dimensional plane parallel to the testing surface T, e.g., an x-y grid.
- Fluid ejection printer 300 may also include a controller 304 for effecting various electrically-powered functions, for example, firing of ejection actuators 150 ( FIG. 11 ) of fluid ejection device 100.
- controller 304 may include or be electronically coupled with one or more processors that can read instructions from non-transitory computer memory. Electrically powered functions of fluid ejection printer 300 may be actuated manually by a user through an interface 316 , which may be, for example, buttons, knobs, toggles, and/or capacitive touchscreens, to name a few.
- a user may insert or otherwise mount fluid ejection device 100 to carrier 310 of fluid ejection printer 300.
- a quantity of fluid may then be deposited into the fluid reservoir 110 of fluid ejection device 100, for example, from fluid storage device 190 ( FIG. 7 ) or directly into adapter 180 or fluid reservoir 110 with a pipette or dropper.
- a quantity of fluid may be deposited into fluid reservoir 110 by an automated device, for example, a portion of fluid ejection printer 300.
- the quantity of fluid that can be accommodated in fluid ejection device 100 depends upon the interior volume of the fluid reservoir 110, the volume of the interior bore 108 of body 102, and the interior volume of the fluid ejection chip 130.
- one or more electrical power pulses can be provided to fluid actuators 150 to cause flash vaporization and ejection of droplets of fluid from nozzles 172.
Landscapes
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Description
- This invention is related to fluid ejection devices, and in particular, to fluid ejection devices that minimize fluid waste.
- In some applications, discrete quantities of fluid are deposited onto a surface, for example, pharmaceutical applications, chemical applications, industrial applications, and medical testing applications, to name a few. Accordingly, fluids may be transported from a fluid reservoir and applied to a target surface with a fluid applicator, such as, for example, a pipette or fluid dropper.
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US 2008/309740 A1 discloses a fluid supply tank for a micro-fluid ejection head and a method for improving operation of a micro-fluid ejection device. The fluid supply tank has a body portion for holding a fluid to be ejected. The body portion includes a fluid exit port on an exit end thereof and a cover on an opposing end thereof. An internal vent conduit is disposed in the tank between the exit end and the cover for air removal adjacent to the exit port. - An object of the present invention is to provide a fluid ejection device for depositing predetermined quantities of fluid onto a target surface.
- Another object of the present invention is to provide a fluid ejection device for ejecting a predetermined quantity of fluid while minimizing any remainder fluid to be stored in the fluid ejection device so that fluid waste is minimized.
- In exemplary embodiments of the present invention, a fluid ejection device having the features of
claim 1 is provided. - In embodiments, the interior passage of the fluid reservoir, the interior bore of the body, and the one or more interior fluid paths are adapted to gravity feed the fluid to the fluid ejection chip upon entry into the interior passage of the fluid reservoir.
- In embodiments, at least a portion of the fluid reservoir protrudes from the body.
- In embodiments, the one or more fluid ejection actuators are thermal ejection actuators.
- In embodiments, the fluid ejection chip comprises a substrate, a flow feature layer disposed over the substrate, and a nozzle layer disposed over the flow feature layer.
- In embodiments, the fluid reservoir comprises a wall and one or more fluid control surfaces disposed along an interior surface of the wall. The interior fluid paths are axially aligned such that the fluid is gravity fed to the fluid ejection chip upon entry into the interior passage of the fluid reservoir. The one or more fluid control surfaces are disposed along the interior passage of the fluid reservoir, and the fluid adheres to the one or more fluid control surfaces.
- In embodiments, the one or more fluid control surfaces protrude from the annular wall of the fluid reservoir.
- In embodiments, the one or more fluid control surfaces are recessed into the annular wall of the fluid reservoir.
- In embodiments, the fluid ejection device further comprises an adapter coupled with the fluid reservoir and defining the interior passage in fluid communication with the interior passage of the fluid reservoir, wherein the adapter that interengages a fluid storage device such that a quantity of fluid can be transferred from fluid storage device into fluid ejection device for ejection onto a target surface.
- In embodiments, the adapter comprises a needle for penetrating a portion of the fluid storage device.
- In embodiments, the needle comprises an interior channel for fluid communication with the fluid storage device.
- In exemplary embodiments of the present invention, a method of forming a fluid ejection device having the features of claim 11 is provided.
- In embodiments, the interior fluid channel of the fluid reservoir, the interior fluid path, the interior bore, and the interior fluid channel together providing a fluid path that is substantially devoid of obstructions.
- In embodiments, the fluid ejection chip comprises one or more fluid ejection actuators.
- In embodiments, the fluid ejection chip is attached to the body such that the interior fluid path of the fluid ejection chip is axially aligned with the interior fluid channel of the fluid reservoir.
- In embodiments, the method further comprises the step of extending at least partially through the body and defining an interior fluid channel in fluid communication with the interior bore of the body. The fluid reservoir comprises an annular wall and one or more fluid control surfaces disposed along an interior surface of the annular wall.
- In embodiments, the method further comprises the step of coupling an adapter to the fluid reservoir, the fluid reservoir that couples with a fluid storage device.
- In exemplary embodiments of the present invention, a fluid ejection system is disclosed comprising a fluid ejection printer and a fluid ejection device. The fluid ejection printer comprises a housing and at least one of an internal power source or one or more electrical contacts in electrical communication with an external power source. The fluid ejection device comprises a body defining an interior bore, a fluid reservoir, a fluid ejection chip, and an electrical connector in electrical communication with the fluid ejection printer so that power is supplied from the fluid ejection printer to the fluid ejection chip. The fluid reservoir defines an interior passage that receives a fluid, and is in fluid communication with the interior bore of the body. The fluid ejection chip is coupled with the body and comprises one or more fluid ejection actuators. The fluid ejection chip has one or more interior fluid paths in fluid communication with the interior bore of the body to cause ejection of the fluid upon activation of the one or more fluid ejection actuators.
- In embodiments, the interior passage of the fluid reservoir, the interior bore of the body, and the one or more interior fluid paths are substantially devoid of obstructions such that the fluid is gravity fed to the fluid ejection chip upon entry into the interior passage of the fluid reservoir.
- In embodiments, the fluid reservoir comprises a wall and one or more fluid control surfaces disposed along an interior surface of the wall. The interior fluid paths are axially aligned such that the fluid is gravity fed to the fluid ejection chip upon entry into the interior passage of the fluid reservoir. The one or more fluid control surfaces are disposed along the interior passage of the fluid reservoir so that the fluid adheres to the one or more fluid control surfaces.
- In embodiments, the adapter is coupled with the fluid reservoir and defines an interior passage in fluid communication with the interior passage of the fluid reservoir.
- Other features and advantages of embodiments of the invention will become readily apparent from the following detailed description, the accompanying drawings and the appended claims.
- The fluid ejection device according to the present invention can deposit predetermined quantities of fluid onto a target surface.
- The features and advantages of exemplary embodiments of the present invention will be more fully understood with reference to the following, detailed description when taken in conjunction with the accompanying figures, wherein:
- [
fig.1]FIG. 1 is a top view of a fluid ejection device according to anexemplary embodiment 1 of the present invention; - [
fig.2]FIG. 2 is a bottom view of the fluid ejection device ofFIG. 1 ; - [
fig.3]FIG. 3 is a side view of the fluid ejection device ofFIG. 1 ; - [
fig.4]FIG. 4 is an enlarged cross-sectional view taken along the line A-A inFIG. 3 ; - [
fig.5]FIG. 5 is a top view of a fluid ejection system including the fluid ejection device ofFIG. 1 according to anexemplary embodiment 1 of the present invention; - [
fig.6A]FIG. 6A is an enlarged cross-sectional view taken along the line A-A inFIG. 3 ; - [
fig.6B]FIG. 6B is an enlarged cross-sectional view taken along the line A-A inFIG. 3 according to an exemplary embodiment 2 of the present invention; - [
fig.6C]FIG. 6C is an enlarged cross-sectional view taken along the line A-A inFIG. 3 according to an exemplary embodiment 2 of the present invention; - [
fig.6D]FIG. 6D is an enlarged cross-sectional view taken along the line A-A inFIG. 3 according to an exemplary embodiment 2 of the present invention; - [
fig.6E]FIG. 6E is an enlarged cross-sectional view taken along the line A-A inFIG. 3 according to an exemplary embodiment 2 of the present invention; - [
fig.7]FIG. 7 is a side, parts-separated view of a fluid ejection system according to an exemplary embodiment 3 of the present invention; - [
fig.8]FIG. 8 is a side view of a fluid ejection device and an adapter of the fluid ejection system ofFIG. 7 ; - [
fig.9]FIG. 9 is a top view of the fluid ejection device and adapter ofFIG. 7 ; - [
fig.10]FIG. 10 is a bottom view of the fluid ejection device and adapter ofFIG. 7 ; - [
fig.11]FIG. 11 is an enlarged cross-sectional view of the fluid ejection device and adapter ofFIG. 7 ; - [
fig.12]FIG. 12 is an enlarged cross-sectional view of a top portion of the fluid ejection device and adapter ofFIG. 7 shown coupled with a fluid storage device; and [fig.13]FIG. 13 is a top view of a fluid ejection system including the fluid ejection device ofFIG. 7 according to an exemplary embodiment 3 of the present invention. - The headings used herein are for organizational purposes only and are not meant to be used to limit the scope of the description or the claims. As used throughout this application, the words "may" and "can" are used in a permissive sense (i.e., meaning having the potential to), rather than the mandatory sense (i.e., meaning must). Similarly, the words "include," "including," and "includes" mean including but not limited to. To facilitate understanding, like reference numerals have been used, where possible, to designate like elements common to the figures.
- Referring to
FIG. 1, FIG. 2 , andFIG. 3 , a fluid ejection device according to an exemplary embodiment of the present invention is illustrated, and is generally designated 100.Fluid ejection device 100 includes abody 102 along which afluid reservoir 110, anelectrical connector 120, and afluid ejection chip 130 are disposed. -
Body 102 may be an elongate member that includes auser engagement portion 104 and anejection portion 106.User engagement portion 104 may include a surface feature 105 (e.g., a knob, bump, or ledge) to provide a user or grasping tool with a recognizable and easily-grasped region for handlingfluid ejection device 100. -
Ejection portion 106 includesfluid reservoir 110,fluid ejection chip 130, and at least a portion ofelectrical connector 120, as described further herein.Body 102 may be formed of one or more suitable materials for applications described herein, for example, glass, polymeric materials, and composite materials, to name a few. In embodiments,user engagement portion 104 and/orejection portion 106 may have different configurations. - As shown,
electrical connector 120 extends along a portion ofbody 102 and is in electrical communication withfluid ejection chip 130 via one ormore bond pads 122.Electrical connector 120 may be a tab automated bonded (TAB) circuit that includes electrical conductors (not shown) that can contact a portion of a fluid ejection system to provide electrical power forfluid ejection chip 130, as described further herein. In embodiments,electrical connector 120 may have a different configuration, for example, a configuration in whichelectrical connector 120 is interiorly disposed along at least a portion ofbody 102. -
Fluid reservoir 110, as shown, protrudes from the surface ofbody 102 and presents anopening 112 into an interior fluid channel 114 (FIG. 4 ) extending throughfluid reservoir 110.Fluid reservoir 110 may have a hollow, dome-shaped profile, as shown.Fluid reservoir 110 may be a separable component that is coupled tobody 102, for example, by adhesion, welding, or mechanical coupling, to name a few. In embodiments,fluid reservoir 110 may be integrally formed withbody 102. In embodiments,fluid reservoir 110 may have a different configuration, for example, a configuration in whichfluid reservoir 110 is flush or recessed with thebody 102 offluid ejection device 100 and/or a configuration in whichfluid reservoir 110 is not a curved structure. -
Fluid ejection chip 130 is disposed along thebody 102 offluid ejection device 102 on an opposite side fromfluid reservoir 110 such that one ormore nozzles 172 offluid ejection chip 130 are exposed facing a target surface upon which one or more fluids are to be deposited, for example, a testing slide or petri dish. As shown,fluid reservoir 110 andfluid ejection chip 130 are aligned along an axis B extending throughfluid ejection device 100 such that a substantially linear and unobstructed fluid path is defined between the opening 112 offluid reservoir 110 andnozzles 172 offluid ejection chip 130, as described further herein. In this regard, fluids deposited intofluid reservoir 110 can be gravity fed tofluid ejection chip 130. In embodiments,fluid reservoir 110 may have a configuration such that a backpressure is provided to at least partially counteract the force of gravity on fluids deposited intofluid reservoir 110, e.g., to control a flow rate of fluid passing throughfluid ejection device 100. - Turning to
FIG. 4 , an enlarged cross-sectional view of a portion offluid ejection device 100 is shown, includingfluid reservoir 110 andfluid ejection chip 130. - As shown, the
interior fluid channel 114 may widen downwardly in the direction ofbody 102, along a vertical distance of, for example, about 5mm. In this regard, theinterior fluid channel 114 may widen from a narrowest interior diameter at opening 112 of, for example, between about 5mm and about 15mm, to a widest interior diameter of, for example, between about 15mm and about 25mm where thefluid reservoir 110 meets thebody 102. In embodiments,interior fluid channel 114 may widen from an interior diameter of, for example, 10mm at theopening 112 to a diameter of, for example, 18mm at the widest portion of interiorfluid channel 114. - In this regard,
fluid reservoir 110 is dimensioned to accommodate a volume of fluid. In embodiments,fluid reservoir 110 may be dimensioned to accommodate, for example, between about 1.8 cm3 of fluid and about 4.1 cm3 of fluid. In embodiments,fluid reservoir 110 may be dimensioned to accommodate about 0.5 grams of a water-based fluid. - As shown,
body 102 includes aninterior bore 108 upon whichfluid reservoir 110 is disposed so that a fluid path is formed between theinterior fluid channel 114 of thefluid reservoir 110 and the interior bore 108 of thebody 102. Interior bore 108 may have a similar diameter to the interior diameter of the widest portion offluid reservoir 110, for example, between about 15mm and about 25mm. In embodiments,interior bore 108 may have a different diameter. -
Fluid ejection chip 130 may be mounted tobody 102 in a suitable fashion, for example, adhesion, molding, or ultrasonic welding. In this regard,fluid ejection device 100 can be assembled by providingbody 102 havingfluid reservoir 110 and attachingfluid ejection chip 130 to a portion ofbody 102 such that an interior fluid path of thefluid ejection chip 130 is in fluid communication with the interior bore 108 of thebody 102 and theinterior fluid channel 114 of thefluid reservoir 110 to provide a substantially unobstructed fluid path. -
Fluid ejection chip 130 may include asubstrate 140, a plurality of fluidejector elements 150, aflow feature layer 160, and/or anozzle layer 170. In embodiments,ejection chip 130 may have a different configuration. -
Substrate 140 may be formed of semiconductor and/or insulator materials, for example, silicon, silicon dioxide, sapphire, germanium, gallium arsenide, and/or indium phosphide, to name a few. A portion of thesubstrate 140 may be processed to form one or morefluid channels 144 in fluid communication with the interior bore 108 of thebody 102. As described herein, processing portions of a fluid ejection chip may include, for example, mechanical deformation such as grinding, chemical etching, or patterning desired structures with photoresist, to name a few. - One or more
ejector elements 150 may be disposed on thesubstrate 110.Ejector elements 150 may be comprised of one or more conductive and/or resistive materials so that when electrical power is supplied to theejector elements 150, heat is caused to accumulate on and/or near theejector elements 150 to eject fluid therefrom, as described further herein. In this regard,ejector elements 150 may be configured as thermal ejection actuators. In embodiments,ejector elements 150 may be formed of more than one layered material, such as a heater stack that may include a resistive element, dielectric, and protective layer. The amount of heat generated byejector elements 150 may be directly proportional to the amount of power supplied to theejector elements 150. In embodiments, power may be supplied toejector elements 150 such that a predetermined thermal profile is generated byejector elements 150, for example, a series of electrical power pulses of constant or variable amplitude and/or duration to achieve intended performance. In embodiments,ejector elements 150 may have a different electrical power configuration, for example, with the use of a piezoelectric element. In embodiments, an ejector element having a different configuration may be used withfluid ejection chip 130, for example, an ejector element that ejects fluid through the transfer of kinetic energy such as an electroactive polymer (EAP). - A
flow feature layer 160 may be disposed over thesubstrate 140.Flow feature layer 160 may be disposed in a layered or otherwise generally planar abutting relationship with respect tosubstrate 140.Flow feature layer 160 may be formed of, for example, a polymeric material.Flow feature layer 160 may be processed such that one or more flow features 162 are formed along and/or withinflow feature layer 160. In embodiments, flow features 162 may have geometry and/or dimensioning so that flow features 162 are configured to direct the flow of fluid throughfluid ejection chip 130. - A
nozzle layer 170 may be disposed over theflow feature layer 160. In embodiments,nozzle layer 170 may be disposed in a layered relationship withflow feature layer 160. In embodiments,nozzle layer 170 may be formed of, for example, a polymeric material.Nozzle layer 170 may be processed such thatnozzles 172 are provided along an exposed surface ofnozzle layer 170 as exit apertures for fluid being ejected fromfluid ejection chip 130. Accordingly,nozzles 172 may have geometry and/or dimensioning configured to direct the trajectory of fluid exitingfluid ejection chip 130. Accordingly,fluid ejection chip 130 defines an interior fluid volume for accommodating fluid. The various features offluid ejection chip 130 described herein may be processed in a way so that a desired interior volume is achieved. - Respective
fluid channels 144, flow features 162, and/ornozzles 172 may collectively define one or more fluid paths withinfluid ejector chip 130, such as fluid path F1 and fluid path F2 as shown, such that fluids can move fromfluid reservoir 110, throughfluid ejection chip 130, and exit throughnozzles 172. As described herein, fluid paths F1 and F2 are substantially devoid of obstructions (open) such that the opportunity of fluids to pool, trap, or otherwise become blocked is substantially minimized. Accordingly, thefluid channel 114 offluid reservoir 110 and the interior bore 108 ofbody 102, together with fluid paths F1 and F2, provide a substantially linear and unobstructed path through which fluids can flow so that substantially all of a fluid deposited intofluid reservoir 110 is ejected throughnozzles 172. Further, by providing afluid reservoir 110 having a desired interior volume,fluid ejector chip 130 can be provided such that a predetermined, discrete quantity of fluid is ejected onto a target surface while minimizing fluid waste due to the substantially linear and unobstructed fluid path provided by the interior configuration offluid ejector chip 130. -
Fluid ejection device 100 as described herein is suitable for use with, for example, relatively small quantities of fluid and accordingly may have a compact configuration. In this regard,fluid ejection device 100 may minimize manufacturing time and costs such thatfluid ejection device 100 can be produced as a disposable device, e.g., a one-time use device. It may be desirable to use a disposable printhead design in a number of fields of application such as medical and laboratory testing, for example, to avoid sample contamination. - Turning now to
FIG. 5 , a fluid ejection system according to an exemplary embodiment of the present invention is generally designated 1000.Fluid ejection system 1000 includes afluid ejection printer 200 which is configured to receive at least a portion offluid ejection device 100. In embodiments,fluid ejection printer 200 may receive a differently-configured fluid ejection device. Also shown is a testing surface T which may be, for example, a group of test tubes or an array of recessed reservoirs into which fluid can be deposited. In embodiments, testing surface T may be, for example, a testing slide or petri dish. In embodiments, testing surface T may be provided on a portion offluid ejection printer 200. -
Fluid ejection printer 200 includes ahousing 202 and at least onecarrier 210 for receiving a portion offluid ejection device 100. In this regard,carrier 210 may include an interior recess for receiving a portion offluid ejection device 100 and/or may present a surface suitable for coupling withfluid ejection device 100, for example, a clip, clamp, or tab structure, to name a few. -
Carrier 210 may also include an electrically conductive portion (not shown) for contacting and supplying electrical power through the electrical connector 120 (FIG. 3 ) offluid ejection device 100, e.g., from an internal power source or an electrical power supply line. In this regard,carrier 210 provides a physical and electrical interface betweenfluid ejection device 100 andfluid ejection printer 200. - In embodiments,
carrier 210 may be movable with respect tofluid ejection printer 200 along a series of rails with whichcarrier 210 is directly and/or indirectly slidable. As shown,carrier 210 may be slidably movable along a pair oflateral rails 212, which are each in turn slidably movable along a pair oflengthwise rails 214. In this regard,carrier 210 may be movable along a two-dimensional plane parallel to the testing surface T, e.g., an x-y grid. -
Fluid ejection printer 200 may also include acontroller 204 for effecting various electrically-powered functions, for example, firing of ejection actuators 150 (FIG. 4 ) offluid ejection device 100. Accordingly,controller 204 may include or be electronically coupled with one or more processors that can read instructions from non-transitory computer memory. Electrically powered functions offluid ejection printer 200 may be actuated manually by a user through aninterface 216, which may be, for example, buttons, knobs, toggles, and/or capacitive touchscreens, to name a few. - Referring to
FIGS. 4 and5 , in use, a user may insert or otherwise mountfluid ejection device 100 tocarrier 210 offluid ejection printer 200. A quantity of fluid may then be deposited into thefluid reservoir 110 offluid ejection device 100, for example, with a pipette or dropper. In embodiments, a quantity of fluid may be deposited intofluid reservoir 110 by an automated device, for example, a portion offluid ejection printer 200. The quantity of fluid that can be accommodated influid ejection device 100 depends upon the interior volume of thefluid reservoir 110, the volume of theinterior bore 108 ofbody 102, and the interior volume of thefluid ejection chip 130. - Upon depositing fluid into the
fluid ejection device 100, one or more electrical power pulses can be provided tofluid actuators 150 to cause flash vaporization and ejection of droplets of fluid fromnozzles 172. - Referring to
FIG. 6A , an enlarged cross-sectional view of a portion offluid ejection device 100 is shown, includingfluid reservoir 110 andfluid ejection chip 130. -
Annular wall 112A, as shown, has anexterior surface 112a and aninterior surface 112b. Accordingly, an interior diameter offluid reservoir 110 can be measured between two diametrically opposed points on theinterior surface 112b ofannular wall 112A. The interior diameter offluid reservoir 110 may widen from a narrowest point at the top ofannular wall 112A of, for example, between about 5mm and 10mm, to a widest point at the bottom ofannular wall 112A of, for example, between about 15mm and about 25mm. In embodiments,fluid reservoir 110 may have an interior diameter that widens from 10mm at the top ofannular wall 112A to 18mm at the bottom ofannular wall 112A. A height offluid reservoir 110 can be measured between a vertically highest point and a vertically lowest point ofannular wall 112A.Fluid reservoir 110 may have a height of, for example, between about 3mm and about 10mm. In embodiments,fluid reservoir 110 may have a height of 5mm. In embodiments,fluid reservoir 110 may be dimensioned to accommodate, for example, between about 1.8 cm3 of fluid and about 4.1 cm3 of fluid. In embodiments,fluid reservoir 110 may be dimensioned to accommodate about 0.5 grams of a water-based fluid. In this regard, the interior diameter and height offluid reservoir 110 can be selected to provide a desired interior volume. In embodiments,fluid reservoir 110 may have a different configuration, e.g., an elliptical profile, a rectangular profile, a triangular profile, or a tapered profile such as a conical profile, to name a few. - As shown,
fluid reservoir 110 includes a number offluid control surfaces 116 disposed circumferentially around theinterior surface 112b of theannular wall 112A.Fluid control surfaces 116 may protrude at least partially into theinterior fluid channel 114 such thatfluid control surfaces 116 are disposed along a path that a fluid travels as it passes throughfluid ejection device 100.Fluid control surfaces 116 may have a rounded rectangular profile in cross-section, as shown, or may have a different cross-sectional profile, as described further herein. In embodiments,fluid control surfaces 116 may integrally formed with the wall offluid reservoir 110, e.g., may be molded with or cut from theannular wall 112A offluid reservoir 110. In embodiments,fluid control surfaces 116 may be affixed to the interior wall offluid reservoir 110, e.g., as an o-ring or circumferential clip. -
Fluid control surfaces 116 are configured to contact and engage, e.g., through an adhesion between the fluid and thefluid control surface 116, fluids passing through theinterior fluid channel 114. As shown, fluids passing byfluid control surfaces 116 may adhere to thefluid control surfaces 116 at points of contact such that surface tension is generated across the fluid. In the exemplary embodiment shown, the outer perimeter of a volume of fluid passing throughfluid ejection device 100 may adhere tofluid control surfaces 116 such that, as the bulk of the fluid volume continues to advance downwardly due to the effects of gravity, the outer periphery of the volume of fluid experiences a drag force such that a meniscus M is formed. Although the meniscus M is shown inFIG. 6A as being concave, the meniscus may have a convex formation depending on the liquid-control surface interface. - In this regard,
fluid control surfaces 116 impart the fluid with a capillary action to at least partially counteract the weight of fluid passing throughfluid reservoir 110 such that the speed, e.g., the flow rate, of fluid passing through interiorfluid channel 114 may be slowed. Accordingly,fluid control surfaces 116 may exert backpressure on a fluid passing throughfluid reservoir 110 as a degree of control on a fluid that is to be ejected fromfluid ejection device 110. For example,fluid control surfaces 116 may minimize or prevent a fluid passing through interiorfluid channel 114 from undesired behavior, such as drooling or dripping, before deliberate ejection byfluid chip 130, as described further herein. Such a measure of control byfluid control surfaces 116 on fluids passing throughfluid reservoir 110 may contribute to minimizing waste with respect to fluids used with fluid ejection device 100 (FIG. 1 ). - Turning now to
FIG. 6B , an alternative embodiment of the present invention is illustrated in cross-section, in which a number offluid control surfaces 116B are disposed along the interior surface of anannular wall 112B of afluid reservoir 110B. As shown,fluid control surface 116B have a curvate, e.g., rounded or dome-shaped, cross-sectional profile. - Referring to
FIG. 6C , another alternative embodiment of the present invention is illustrated, in which a number offluid control surfaces 116C are disposed along the interior surface of anannular wall 112C of afluid reservoir 110C. As shown,fluid control surfaces 116C have a pointed, e.g., wedge-shaped or triangular-shaped, cross-sectional profile. - Turning to
FIG. 6D , another alternative embodiment of the present invention is illustrated, in which a number offluid control surfaces 116D are disposed along the interior surface of anannular wall 112D of afluid reservoir 110D. As shown, engagingsurfaces 116C have an upwardly turned hook-shaped cross-sectional profile. - Referring to
FIG. 6E , an alternative embodiment of the present invention is illustrated, in which a number offluid control surfaces 116E are formed along theannular wall 112E of afluid reservoir 110E. As shown,fluid control surfaces 116E do not protrude into the interior fluid path 114E offluid reservoir 110E, but instead are recessed within theannular wall 112E offluid reservoir 110E, e.g., by cutting or through inset molding offluid reservoir 110E. - It will be understood that fluid reservoirs described herein in embodiments of the present invention may have different surface configurations, e.g., shape, texture, and/or material composition, such that a desired amount of backpressure is provided to a fluid passing therethrough. In embodiments, fluid control surfaces disposed along a fluid reservoir may have a different configuration, for example, a jagged, barbed, ridged, ribbed, or knurled cross-sectional profile, to name a few. In embodiments, fluid control surfaces disposed along a fluid reservoir may be continuous or may have one or more discontinuities therealong. In embodiments, a fluid reservoir may be treated, e.g., lined or coated, with a material to provide a desired flow rate of fluid passing therethrough, for example, a hydrophilic material. In embodiments, a fluid reservoir may contain additional fluid control surfaces, for example, a lip, ridge, and/or adhesive seam formed along the location at which the fluid reservoir and a fluid ejection device body meet.
- Referring back to
FIG. 6A ,body 102 offluid ejection device 100 includes aninterior bore 108 upon whichfluid reservoir 110 is disposed so that a fluid path is formed between theinterior fluid channel 114 of thefluid reservoir 110 and the interior bore 108 of thebody 102. As shown,interior bore 108 may have a similar diameter to the interior diameter of the widest portion offluid reservoir 110, for example, between about 15mm and about 25mm. In embodiments,interior bore 108 may have a different diameter. - Referring to
FIG. 7 andFIG. 8 , a fluid ejection system according to an exemplary embodiment 3 of the present invention is illustrated, and is generally designated 1000.Fluid ejection system 1000 includes afluid ejection device 100 and afluid storage device 190. As described herein,fluid ejection device 100 is configured for coupling withfluid storage device 190 via anadapter 180 so that a quantity of fluid can be transferred from fluid storage device intofluid ejection device 100 for ejection onto a target surface. -
Fluid ejection device 100 includes abody 102 along which afluid reservoir 110, anelectrical connector 120, and afluid ejection chip 130 are disposed. -
Body 102 may be an elongate member that includes auser engagement portion 104 and anejection portion 106.User engagement portion 104 may include a surface feature 105 (e.g., a knob, bump, or ledge) to provide a user or grasping tool with a recognizable and easily-grasped region for handlingfluid ejection device 100. -
Ejection portion 106 includesfluid reservoir 110,fluid ejection chip 130, and at least a portion ofelectrical connector 120, as described further herein.Body 102 may be formed of one or more suitable materials for applications described herein, for example, glass, polymeric materials, and composite materials, to name a few. In embodiments,user engagement portion 104 and/orejection portion 106 may have different configurations. - Still referring to
FIG. 7 andFIG. 8 , and referring additionally toFIG. 9 andFIG. 10 ,electrical connector 120 extends along a portion ofbody 102 and is in electrical communication withfluid ejection chip 130 via one ormore bond pads 122.Electrical connector 120 may be a tab automated bonded (TAB) circuit that includes electrical conductors (not shown) that can contact a portion of a fluid ejection system to provide electrical power forfluid ejection chip 130, as described further herein. In embodiments,electrical connector 120 may have a different configuration, for example, a configuration in whichelectrical connector 120 is interiorly disposed along at least a portion ofbody 102. -
Fluid reservoir 110, as shown, protrudes from the surface ofbody 102 and presents anopening 112 into an interior fluid channel 114 (FIG. 11 ) extending throughfluid reservoir 110.Fluid reservoir 110 may have a hollow, dome-shaped profile, as shown.Fluid reservoir 110 may be a separable component that is coupled tobody 102, for example, by adhesion, welding, or mechanical coupling, to name a few. In embodiments,fluid reservoir 110 may be integrally formed withbody 102. In embodiments,fluid reservoir 110 may have a different configuration, for example, a configuration in whichfluid reservoir 110 is flush or recessed with thebody 102 offluid ejection device 100 and/or a configuration in whichfluid reservoir 110 is not a curved structure. - Still referring to
FIG. 7 ,FIG. 8 ,FIG. 9 , andFIG. 10 ,adapter 180 is provided having astorage device portion 182 and anejection device portion 184.Storage device portion 182 is configured for coupling withfluid storage device 190, as described further herein.Ejection device portion 184 may be configured for coupling with thebody 102 offluid ejection device 100. Accordingly,ejection device portion 184 ofadapter 180 may define aninterior chamber 112 dimensioned to at least partially receivefluid reservoir 110.Interior chamber 112 may have a profile similar tofluid reservoir 110 or may have a different configuration. As shown,ejection device portion 184 may include a pair of downwardly extendingarms 194 extending from theejection device portion 184 that receive thefluid reservoir 110 and a portion of thebody 102 ofejection device 100 therebetween. Thebody 102 may include a pair ofnotches 103 for receiving an inwardly-extendingtab 196 of each respective downwardly-extendingarm 194 to provide a secure engagement betweenadapter 180 andfluid ejection device 100. Inwardly-extendingtabs 196, as shown, may have a tapered profile to facilitate sliding engagement intonotches 103 of thebody 102 ofejection device 100. In embodiments,adapter 180 may be configured for removal fromfluid ejection device 100, for example, by prying downwardly-extendingarms 194 away from thefluid ejection device 100 manually or with a tool to disengage inwardly-extendingtabs 196 fromnotches 103. In embodiments,adapter 180 may include different features for engaging a portion offluid ejection device 100, for example, a different number of downwardly-extendingarms 194 and/or a different configuration oftabs 196. - Tolerances of the
ejection device portion 184 ofadapter 180, e.g., dimensions of downwardly-extendingarms 194 and/or inwardly extendingtabs 196, as well as the position ofnotches 103 ofbody 102 offluid ejection device 100, may be such that theadapter 180 exerts a downward, compressive force uponfluid reservoir 110 upon coupling withfluid ejection device 100. As shown,adapter 180 may include a sealingmember 192 embedded withinejection device portion 184 and at least partially exposed to sealingly engage a portion ofbody 102 offluid ejection device 100 upon coupling ofadapter 180 andfluid ejection device 100. In this regard, sealingmember 192 may provide a degree of fluid sealing, e.g., inhibition or prevention of leakage of fluids fromfluid reservoir 110. In embodiments,adapter 180 may incorporate a different fluid sealing component. - For engaging a corresponding notch along an exterior portion of
fluid reservoir 110. In embodiments, interior tab 189 ofejection device portion 184 may be spring biased such that a user can couplefluid storage device 190 withfluid ejection device 100 by approximating the proper position offluid reservoir 110 within theejection device portion 184 ofadapter 180 and confirming a proper coupling by the sound and/or vibration of the interior tab 189 entering the corresponding notch onfluid reservoir 110. In embodiments, interior tab 189 may include a release so that theadapter 180 may be uncoupled fromfluid ejection device 100. In embodiments,fluid reservoir 110 may be coupled withadapter 180 in a different way, for example, a threaded coupling. In embodiments,ejection device portion 184 ofadapter 180 may be adhered tofluid ejection device 100 or another portion thereof. In embodiments,adapter 180 may be integrally formed withfluid ejection device 100. -
Fluid ejection chip 130 is disposed along thebody 102 offluid ejection device 102 on an opposite side fromfluid reservoir 110 andadapter 180 such that one ormore nozzles 172 offluid ejection chip 130 are exposed facing a target surface upon which one or more fluids are to be deposited, for example, a testing slide or petri dish. As shown,adapter 180,fluid reservoir 110, andfluid ejection chip 130 are aligned along an axis B extending throughfluid ejection device 100 such that a substantially linear and unobstructed fluid path is defined between the opening 112 offluid reservoir 110 andnozzles 172 offluid ejection chip 130, as described further herein. In embodiments, a substantially linear and unobstructed fluid path may be defined between a top opening ofadapter 180 andnozzles 172 offluid ejection chip 130. In this regard, fluids deposited into or throughfluid reservoir 110 can be gravity fed tofluid ejection chip 130. In embodiments,fluid reservoir 110 may have a configuration such that a backpressure is provided to at least partially counteract the force of gravity on fluids deposited intofluid reservoir 110, e.g., to control a flow rate of fluid passing throughfluid ejection device 100. - Turning to
FIG. 10 , an enlarged cross-sectional view of a portion offluid ejection device 100 is shown, includingadapter 180 coupled withfluid reservoir 110, andfluid ejection chip 130 mounted to thebody 102. -
Adapter 180, as shown, defines a hollow interior such that aninterior passage 185 is provided in fluid communication with theinterior fluid channel 114 offluid reservoir 110. Accordingly, fluids deposited intoadapter 180 may be directed intofluid reservoir 110, for example, through the influence of gravity, pressurization, and/or capillary action. In embodiments,adapter 180 may incorporate a fluid guide, for example, a funnel or other downwardly-oriented surface (not shown) to direct fluids into theopening 112 offluid reservoir 110. - A
needle 186 is interiorly mounted within theinterior passage 185 of theadapter 180, and extends upwardly through thestorage device portion 182 ofadapter 180, as shown.Needle 186 may be configured to engage a portion offluid storage device 190, as described further herein. In embodiments,needle 186 may define an interior passage such that fluids can travel therethrough. - A pair of sealing
members 188 may be disposed about an exterior portion ofadapter 180, for example, to aid in forming a substantially fluid tight seal betweenadapter 180 andfluid storage device 190 upon coupling, as described further herein. Sealingmembers 188 may be a pair of polymeric o-rings disposed about an outer surface ofadapter 180. In embodiments, sealingmembers 188 may have a different configuration. In embodiments, a different number of sealing members may be provided. - Still referring to
FIG. 10 , theinterior fluid channel 114 may widen downwardly in the direction ofbody 102, along a vertical distance of, for example, about 5mm. In this regard, theinterior fluid channel 114 may widen from a narrowest interior diameter at opening 112 of, for example, between about 5mm and about 15mm, to a widest interior diameter of, for example, between about 15mm and about 25mm where thefluid reservoir 110 meets thebody 102. In embodiments,interior fluid channel 114 may widen from an interior diameter of, for example, 10mm at theopening 112 to a diameter of, for example, 18mm at the widest portion of interiorfluid channel 114. - In this regard,
fluid reservoir 110 is dimensioned to accommodate a volume of fluid. In embodiments,fluid reservoir 110 may be dimensioned to accommodate, for example, between about 1.8 cm3 of fluid and about 4.1 cm3 of fluid. In embodiments,fluid reservoir 110 may be dimensioned to accommodate about 0.5 grams of a water-based fluid. - As shown,
body 102 includes aninterior bore 108 upon whichfluid reservoir 110 is disposed so that a fluid path is formed between theinterior fluid channel 114 of thefluid reservoir 110 and the interior bore 108 of thebody 102. Interior bore 108 may have a similar diameter to the interior diameter of the widest portion offluid reservoir 110, for example, between about 15mm and about 25mm. In embodiments,interior bore 108 may have a different diameter. -
Fluid ejection chip 130 may be mounted tobody 102 in a suitable fashion, for example, adhesion, molding, or ultrasonic welding. In this regard,fluid ejection device 100 can be assembled by providingbody 102 havingfluid reservoir 110 and attachingfluid ejection chip 130 to a portion ofbody 102 such that an interior fluid path of thefluid ejection chip 130 is in fluid communication with the interior bore 108 of thebody 102 and theinterior fluid channel 114 of thefluid reservoir 110 to provide a substantially unobstructed fluid path. -
Fluid ejection chip 130 may include asubstrate 140, a plurality of fluidejector elements 150, aflow feature layer 160, and/or anozzle layer 170. In embodiments,ejection chip 130 may have a different configuration. -
Substrate 140 may be formed of semiconductor and/or insulator materials, for example, silicon, silicon dioxide, sapphire, germanium, gallium arsenide, and/or indium phosphide, to name a few. A portion of thesubstrate 140 may be processed to form one or morefluid channels 144 in fluid communication with the interior bore 108 of thebody 102. As described herein, processing portions of a fluid ejection chip may include, for example, mechanical deformation such as grinding, chemical etching, or patterning desired structures with photoresist, to name a few. - One or more
ejector elements 150 may be disposed on thesubstrate 110.Ejector elements 150 may be comprised of one or more conductive and/or resistive materials so that when electrical power is supplied to theejector elements 150, heat is caused to accumulate on and/or near theejector elements 150 to eject fluid therefrom, as described further herein. In this regard,ejector elements 150 may be configured as thermal ejection actuators. In embodiments,ejector elements 150 may be formed of more than one layered material, such as a heater stack that may include a resistive element, dielectric, and protective layer. The amount of heat generated byejector elements 150 may be directly proportional to the amount of power supplied to theejector elements 150. In embodiments, power may be supplied toejector elements 150 such that a predetermined thermal profile is generated byejector elements 150, for example, a series of electrical power pulses of constant or variable amplitude and/or duration to achieve intended performance. In embodiments,ejector elements 150 may have a different electrical power configuration, for example, with the use of a piezoelectric element. In embodiments, an ejector element having a different configuration may be used withfluid ejection chip 130, for example, an ejector element that ejects fluid through the transfer of kinetic energy such as an electroactive polymer (EAP). - A
flow feature layer 160 may be disposed over thesubstrate 140.Flow feature layer 160 may be disposed in a layered or otherwise generally planar abutting relationship with respect tosubstrate 140.Flow feature layer 160 may be formed of, for example, a polymeric material.Flow feature layer 160 may be processed such that one or more flow features 162 are formed along and/or withinflow feature layer 160. In embodiments, flow features 162 may have geometry and/or dimensioning so that flow features 162 are configured to direct the flow of fluid throughfluid ejection chip 130. - A
nozzle layer 170 may be disposed over theflow feature layer 160. In embodiments,nozzle layer 170 may be disposed in a layered relationship withflow feature layer 160. In embodiments,nozzle layer 170 may be formed of, for example, a polymeric material.Nozzle layer 170 may be processed such thatnozzles 172 are provided along an exposed surface ofnozzle layer 170 as exit apertures for fluid being ejected fromfluid ejection chip 130. Accordingly,nozzles 172 may have geometry and/or dimensioning configured to direct the trajectory of fluid exitingfluid ejection chip 130. Accordingly,fluid ejection chip 130 defines an interior fluid volume for accommodating fluid. The various features offluid ejection chip 130 described herein may be processed in a way so that a desired interior volume is achieved. - Respective
fluid channels 144, flow features 162, and/ornozzles 172 may collectively define one or more fluid paths withinfluid ejector chip 130, such as fluid path F1 and fluid path F2 as shown, such that fluids can move fromfluid reservoir 110, throughfluid ejection chip 130, and exit throughnozzles 172. As described herein, fluid paths F1 and F2 are substantially devoid of obstructions such that the opportunity of fluids to pool, trap, or otherwise become blocked is substantially minimized. Accordingly, theinterior passage 185 ofadapter 180, thefluid channel 114 offluid reservoir 110 and the interior bore 108 ofbody 102, together with fluid paths F1 and F2, provide a substantially linear and unobstructed path through which fluids can flow so that substantially all of a fluid deposited intofluid reservoir 110 is ejected throughnozzles 172. Further, by providing afluid reservoir 110 having a desired interior volume,fluid ejector chip 130 can be provided such that a predetermined, discrete quantity of fluid is ejected onto a target surface while minimizing fluid waste due to the substantially linear and unobstructed fluid path provided by the interior configuration offluid ejector chip 130. - Turning now to
FIG. 12 , a cross-sectional view ofadapter 180 and an upper portion offluid ejection device 100 are shown coupled withfluid storage device 190. -
Fluid storage device 190, as shown, comprises aninterior reservoir 230 and a fluid coupling portion 220 extending downwardly therefrom.Interior reservoir 230 is an interior volume offluid storage device 190 at least partially occupied by afluid retaining membrane 232, e.g., a bag or enclosed film, within which a quantity of fluid is held.Fluid retaining membrane 232 may be provided, so that fluids disposed within thefluid retaining membrane 232 are isolated, from example, from air, other environmental conditions, or contaminants, to name a few.Fluid retaining membrane 232 may provide a measure of protection against fluid leakage fromfluid storage device 190 in addition to the walls surroundinginterior reservoir 230. In embodiments,fluid storage device 190 may be provided such thatfluid retaining membrane 232 and fluid stored therewithin may be removable fromfluid storage device 190, e.g., so thatfluid storage device 190 is configured as a modular component. - As shown, a biasing
member 234 may be disposed between twoplates 236 extending along the interior surface offluid retaining membrane 232.Biasing member 234 may urgeplates 236 outward, e.g., away from one another, such that an at least partial negative pressure environment, e.g., a backpressure, is generated withinfluid retaining membrane 232 such that fluids disposed withinfluid retaining membrane 232 do not, for example, drool, drip, leak, flow too quickly, or otherwise exhibit unintended characteristics. An example of a fluid backpressure mechanism of this type is disclosed inU.S. Patent Application Publication No. 2013/0342618 , the entire contents of which are incorporated by reference herein. - Fluid coupling portion 220, as shown, defines a
fitting recess 222 configured tointerengage adapter 180, and aninterior chamber 224 that is in fluid communication with the interior offluid retaining membrane 232, e.g., through a fluid connections such as a tube or a valve such as a septum (not shown). Aseal 226 is disposed along a downward-facing side ofinterior chamber 224, and maintains a substantially fluid-tight barrier between theinterior chamber 224 of fluid coupling portion 220 and a surrounding environment.Seal 226 may be a deformable member, for example, a polymeric member such as an elastomer. In this regard,seal 226 may be at least partially reconfigurable, as described further herein. - As shown,
fitting recess 222 of fluid coupling portion 220 receives at least a portion ofstorage device portion 182 ofadapter 180. Accordingly, at least a portion ofstorage device portion 182 may be disposed withinfitting recess 222 between an outer wall of fluid coupling portion 220 and an outer wall ofinterior chamber 224 of fluid coupling portion 220. In embodiments,storage device portion 182 ofadapter 180 and/orfitting recess 222 of fluid coupling portion 220 may have a tapered configuration and may interengage via a press fit or threaded coupling, e.g., a Luer-type fitting. Sealingmembers 188 ofadapter 180 may additionally become disposed withinfitting recess 222, and may pressibly engage the walls of fluid coupling portion 220 to assist in maintaining a substantially fluid-tight barrier between fluid coupling portion 220 and a surrounding environment, e.g., to prevent leakage. In embodiments,storage device 190 andadapter 180 may interengage in a different type of coupling, for example, a threaded engagement, a tab and notch (clicking) arrangement, or snap fit, to name a few. - Upon coupling of
fluid storage device 190 andadapter 180 as described above,needle 186 may penetrate and extend throughseal 226 of fluid coupling portion 220 such that the substantially fluid-tight barrier provided byseal 226 is breached in a controlled manner. In embodiments,needle 186 may penetrate and dilate a portion ofseal 226 such that fluids fromfluid retaining member 222 can flow aroundneedle 186 and intofluid reservoir 110 throughadapter 180. In embodiments,needle 186 may define an interior passage such that upon penetration ofseal 226 byneedle 186, fluids fromfluid retaining member 222 can enter the interior passage ofneedle 186 and flow throughadapter 180 towardfluid reservoir 110. - Upon uncoupling of
fluid ejection device 100 andfluid storage device 190, e.g., upon withdrawal ofneedle 186 ofadapter 180 fromseal 226 of fluid coupling portion 220 offluid storage device 190,seal 226 may revert to a condition prior to penetration byneedle 186, e.g., in a condition maintaining a substantially fluid-tight barrier between fluid coupling portion 220 and a surrounding environment. Accordingly, a dilation or puncture ofseal 226 byneedle 186 may contract upon withdrawal ofneedle 186. In this regard,seal 226 may have a resilient configuration, e.g., as in an elastomeric member. In embodiments,seal 226 may further incorporate one or more one-way sealing mechanisms, such as a valve. - Accordingly,
fluid storage device 190 presents a device for the storage and/or release of fluids that may be configured for multiple uses, e.g., repeated instances of penetration ofseal 226 byneedle 186 and subsequent re-establishment ofseal 226 upon withdrawal ofneedle 186. In this regard,fluid storage device 190 presents a re-usable component such thatfluid storage device 190 may be used with multiplefluid ejection devices 100. - As described herein,
fluid ejection device 100 may be suitable for use with, for example, relatively small quantities of fluid and accordingly may have a compact configuration. In this regard,fluid ejection device 100 may minimize manufacturing time and costs such thatfluid ejection device 100 can be produced as a disposable device, e.g., a one-time use device, whilefluid storage device 190 can be re-used until depleted of fluids so that no excess fluids need be discarded. It may be desirable to use a disposable printhead design in a number of fields of application such as medical and laboratory testing, for example, to avoid sample contamination. - Turning now to
FIG. 13 , a fluid ejection system according to an exemplary embodiment of the present invention is generally designated 2000.Fluid ejection system 2000 includes afluid ejection printer 300 that is configured to interoperate with fluid ejection system 1000 (FIG. 7 ). Accordingly,printer 300 may be configured to receive at least a portion offluid ejection device 100. Whileprinter 300 is shown coupled withfluid ejection device 100 andadapter 180 for clarity, it will be understood that fluid storage device 190 (FIG. 7 ) may be coupled withadapter 180 onprinter 300 as described herein. In embodiments,fluid ejection printer 300 may receive a differently-configured fluid ejection device. Also shown is a testing surface T which may be, for example, a group of test tubes or an array of recessed reservoirs into which fluid can be deposited. In embodiments, testing surface T may be, for example, a testing slide or petri dish. In embodiments, testing surface T may be provided on a portion offluid ejection printer 200. -
Fluid ejection printer 300 includes ahousing 302 and at least onecarrier 310 for receiving a portion offluid ejection device 100. In this regard,carrier 310 may include an interior recess for receiving a portion offluid ejection device 100 and/or may present a surface suitable for coupling withfluid ejection device 100, for example, a clip, clamp, or tab structure, to name a few. -
Carrier 310 may also include an electrically conductive portion (not shown) for contacting and supplying electrical power through the electrical connector 120 (FIG. 10 ) offluid ejection device 100, e.g., from an internal power source or an electrical power supply line. In this regard,carrier 310 provides a physical and electrical interface betweenfluid ejection device 100 andfluid ejection printer 200. - In embodiments,
carrier 310 may be movable with respect tofluid ejection printer 300 along a series of rails with whichcarrier 310 is directly and/or indirectly slidable. As shown,carrier 310 may be slidably movable along a pair oflateral rails 312, which are each in turn slidably movable along a pair oflengthwise rails 314. In this regard,carrier 310 may be movable along a two-dimensional plane parallel to the testing surface T, e.g., an x-y grid. -
Fluid ejection printer 300 may also include acontroller 304 for effecting various electrically-powered functions, for example, firing of ejection actuators 150 (FIG. 11 ) offluid ejection device 100. Accordingly,controller 304 may include or be electronically coupled with one or more processors that can read instructions from non-transitory computer memory. Electrically powered functions offluid ejection printer 300 may be actuated manually by a user through aninterface 316 , which may be, for example, buttons, knobs, toggles, and/or capacitive touchscreens, to name a few. - Referring to
FIGS. 11 and12 , in use, a user may insert or otherwise mountfluid ejection device 100 tocarrier 310 offluid ejection printer 300. A quantity of fluid may then be deposited into thefluid reservoir 110 offluid ejection device 100, for example, from fluid storage device 190 (FIG. 7 ) or directly intoadapter 180 orfluid reservoir 110 with a pipette or dropper. In embodiments, a quantity of fluid may be deposited intofluid reservoir 110 by an automated device, for example, a portion offluid ejection printer 300. The quantity of fluid that can be accommodated influid ejection device 100 depends upon the interior volume of thefluid reservoir 110, the volume of theinterior bore 108 ofbody 102, and the interior volume of thefluid ejection chip 130. - Upon depositing fluid into the
fluid ejection device 100, one or more electrical power pulses can be provided tofluid actuators 150 to cause flash vaporization and ejection of droplets of fluid fromnozzles 172. -
- 100:
- fluid ejection device
- 102:
- body
- 103:
- notch
- 104:
- user engagement portion
- 105:
- surface feature
- 106:
- ejection portion
- 108:
- interior bore
- 110,110A, 110B, 110C, 110D, 110E:
- fluid reservoir
- 112:
- opening
- 112A,112B,112C,112D,112E:
- annular wall
- 112a:
- exterior surface
- 112b:
- interior surface
- 114:
- interior fluid channel
- 116,116B,116C,116D,116E:
- fluid control surface
- 120:
- electrical connector
- 122:
- bond pad
- 130:
- fluid ejection chip
- 140:
- substrate
- 144:
- fluid channel
- 150:
- ejector element
- 160:
- flow feature layer
- 162:
- flow feature
- 170:
- nozzle layer
- 172:
- nozzle
- 180:
- adapter
- 182:
- storage device portion
- 184:
- ejection device portion
- 185:
- interior passage
- 186:
- needle
- 188,192:
- sealing member
- 190:
- fluid storage device
- 194:
- downwardly-extending arm
- 196:
- inwardly-extending tab
- 200,300:
- fluid ejection printer
- 202,302:
- housing
- 204,304:
- controller
- 210,310:
- carrier
- 212,312:
- lateral rails
- 214,314:
- lengthwise rails
- 216,316:
- interface
- 220:
- fluid coupling portion
- 222:
- fitting recess
- 224:
- interior chamber
- 226:
- seal
- 230:
- interior reservoir
- 232:
- fluid retaining membrane
- 234:
- biasing member
- 236:
- plate
- 1000,2000:
- fluid ejection system
Claims (14)
- A fluid ejection device (100) comprising:a body (102) defining an interior bore (108);a fluid reservoir (110,110A,110B,110C,110D,110E) forming an interior passage (185) that receives a fluid, the interior passage (185) in fluid communication with the interior bore (108) of the body (102); anda fluid ejection chip (130) coupled with the body (102) and comprising one or more fluid ejection actuators (150), the fluid ejection chip (130) having one or more interior fluid paths in fluid communication with the interior bore (108) of the body (102) to cause ejection of the fluid upon activation of the one or more fluid ejection actuators (150),characterized in that the fluid reservoir (110,110A,110B,110C,110D,110E) comprises a wall and one or more fluid control surfaces (116,116B,116C,116D,116E) disposed along an interior surface of the wall,wherein the one or more interior fluid paths are axially aligned and are adapted to gravity feed the fluid to the fluid ejection chip (130) upon entry into the interior passage (185) of the fluid reservoir (110,110A,110B,110C,110D,110E), andwherein the one or more fluid control surfaces (116,116B,116C,116D,116E) are disposed along the interior passage (185) of the fluid reservoir (110,110A,110B,110C,110D,110E), and the fluid adheres to the one or more fluid control surfaces (116,116B,116C,116D,116E) at points of contact such that surface tension is generated across the fluid.
- The fluid ejection device of claim 1, wherein the interior passage (185) of the fluid reservoir (110,110A,110B,110C,110D,110E), the interior bore (108) of the body (102), and the one or more interior fluid paths are adapted to gravity feed the fluid to the fluid ejection chip (130) upon entry into the interior passage (185) of the fluid reservoir (110,110A,110B,110C,110D,110E).
- The fluid ejection device of claim 2, wherein at least a portion of the fluid reservoir (110,110A,110B,110C,110D,110E) protrudes from the body (102).
- The fluid ejection device of claim 2, wherein the one or more fluid ejection actuators (150) are thermal ejection actuators.
- The fluid ejection device of claim 2, wherein the fluid ejection chip (130) comprises a substrate (140), a flow feature layer (160) disposed over the substrate (140), and a nozzle layer disposed over the flow feature layer (160).
- The fluid ejection device of any one of claims 1 to 5, wherein the one or more fluid control surfaces (116,116B,116C,116D,116E) protrude from an annular wall (112A) of the fluid reservoir (110,110A,110B,110C,110D,110E).
- The fluid ejection device of any one of claims 1 to 5, wherein the one or more fluid control surfaces (116,116B,116C,116D,116E) are recessed into an annular wall (112A) of the fluid reservoir (110,110A,110B,110C,110D,110E).
- The fluid ejection device of claim 1, further comprising:
an adapter (180) coupled with the fluid reservoir (110,110A,110B,110C,110D,110E) and forming the interior passage (185) in fluid communication with the interior passage (185) of the fluid reservoir (110,110A,110B,110C,110D,110E), wherein the adapter (180) that interengages a fluid storage device (190) such that a quantity of fluid can be transferred from fluid storage device into fluid ejection device (100) for ejection onto a target surface. - The fluid ejection device of claim 8, wherein the adapter (180) comprises a needle (186) for penetrating a portion of the fluid storage device (190).
- The fluid ejection device of claim 9, wherein the needle (186) comprises an interior channel (141) for fluid communication with the fluid storage device (190).
- A method of forming a fluid ejection device (100), comprising:providing an elongate body (102) comprising an engagement portion (104) and an ejection portion (106) and defining an interior bore (108), the ejection portion (106) comprising a fluid reservoir (110,110A,110B,110C,110D,110E) defining an interior fluid channel (114); andattaching a fluid ejection chip (130) to the body (102) to have fluid communication between an interior fluid path of the fluid ejection chip (130) and the interior bore (108) of the body (102), characterized inproviding the fluid reservoir (110,110A,110B,110C,110D,110E) with a wall and one or more fluid control surfaces (116,116B,116C,116D,116E) disposed along an interior surface of the wall,axially aligning the interior fluid channel (114) such that a fluid is gravity fed to the fluid ejection chip (130) upon entry into an interior passage (185) of the fluid reservoir (110,110A,110B,110C,110D,110E), anddisposing the one or more fluid control surfaces (116,116B,116C,116D,116E) along the interior passage (185) of the fluid reservoir (110,110A,110B,110C,110D,110E), the fluid adhering to the one or more fluid control surfaces (116,116B,116C,116D,116E).
- The method of claim 11, wherein the interior fluid channel (114) of the fluid reservoir (110,110A,110B,110C,110D,110E), the interior fluid path, the interior bore (108), and the interior fluid channel (114) together providing a fluid path that is substantially devoid of obstructions.
- The method of claim 12, wherein the fluid ejection chip (130) comprises one or more fluid ejection actuators (150).
- The method of claim 12, wherein the fluid ejection chip (130) is attached to the body (102) such that the interior fluid path of the fluid ejection chip (130) is axially aligned with the interior fluid channel (114) of the fluid reservoir (110,110A,110B,110C,110D,110E).
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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US14/672,662 US9889651B2 (en) | 2015-03-30 | 2015-03-30 | Fluid ejection device for depositing a discrete quantity of fluid onto a surface |
US14/672,688 US9586399B2 (en) | 2015-03-30 | 2015-03-30 | Fluid ejection device for depositing a discrete quantity of fluid onto a surface |
US14/672,672 US9701126B2 (en) | 2015-03-30 | 2015-03-30 | Fluid ejection device |
PCT/JP2016/001756 WO2016157867A1 (en) | 2015-03-30 | 2016-03-25 | Fluid ejection device, method of forming fluid ejection device and fluid ejection system |
Publications (3)
Publication Number | Publication Date |
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EP3277430A1 EP3277430A1 (en) | 2018-02-07 |
EP3277430A4 EP3277430A4 (en) | 2018-11-14 |
EP3277430B1 true EP3277430B1 (en) | 2022-03-09 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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EP16771755.2A Active EP3277430B1 (en) | 2015-03-30 | 2016-03-25 | Fluid ejection device, method of forming fluid ejection device and fluid ejection system |
Country Status (4)
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EP (1) | EP3277430B1 (en) |
JP (1) | JP6773042B2 (en) |
CN (1) | CN107530717B (en) |
WO (1) | WO2016157867A1 (en) |
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JP4110815B2 (en) * | 2002-03-29 | 2008-07-02 | 株式会社日立製作所 | Liquid application method and apparatus |
JP2004066092A (en) * | 2002-08-06 | 2004-03-04 | Fuji Photo Film Co Ltd | Discharge head, coating device, and coating method |
US7449283B2 (en) * | 2002-09-24 | 2008-11-11 | Sharp Kabushiki Kaisha | Producing method of electrostatic sucking type liquid jetting head, producing method of nozzle plate, driving method of electrostatic sucking type liquid jetting head, electrostatic sucking type liquid jetting apparatus and liquid jetting apparatus |
JP4218949B2 (en) * | 2002-09-24 | 2009-02-04 | コニカミノルタホールディングス株式会社 | Electrostatic suction type liquid discharge head manufacturing method, nozzle plate manufacturing method, electrostatic suction type liquid discharge head driving method, and electrostatic suction type liquid discharge device |
US6902256B2 (en) * | 2003-07-16 | 2005-06-07 | Lexmark International, Inc. | Ink jet printheads |
US7344234B2 (en) * | 2004-01-21 | 2008-03-18 | Fuji Xerox Co., Ltd. | Print head pressure control architectures |
US7543913B2 (en) * | 2005-04-07 | 2009-06-09 | Lexmark International, Inc. | Printhead systems having multiple ink chambers with balanced and short ink paths |
JP4688033B2 (en) * | 2005-12-20 | 2011-05-25 | 富士フイルム株式会社 | Manufacturing method of electrical wiring components |
JP4973293B2 (en) * | 2006-05-19 | 2012-07-11 | セイコーエプソン株式会社 | Ink cartridge and printing apparatus |
KR20070122072A (en) * | 2006-06-23 | 2007-12-28 | 삼성전자주식회사 | Ink suppling apparatus and image forming apparatus having the same |
KR20080060003A (en) * | 2006-12-26 | 2008-07-01 | 삼성전자주식회사 | Method for manufacturing ink-jet print head |
US7938523B2 (en) * | 2007-06-13 | 2011-05-10 | Lexmark International, Inc. | Fluid supply tank ventilation for a micro-fluid ejection head |
JP5332293B2 (en) * | 2008-04-25 | 2013-11-06 | セイコーエプソン株式会社 | Droplet discharge head and method of manufacturing droplet discharge head |
WO2010044788A1 (en) * | 2008-10-15 | 2010-04-22 | Hewlett-Packard Development Company, L.P. | Fluid ejection cartridge |
JP5381201B2 (en) * | 2009-03-18 | 2014-01-08 | セイコーエプソン株式会社 | Liquid column body of liquid tank, liquid tank and droplet discharge device |
JP4859258B2 (en) * | 2009-05-08 | 2012-01-25 | キヤノン株式会社 | Recording device |
JP2012086370A (en) * | 2010-10-15 | 2012-05-10 | Seiko Epson Corp | Liquid ejection head unit |
JP2013063559A (en) * | 2011-09-16 | 2013-04-11 | Ricoh Co Ltd | Inkjet recording device |
JP2013107232A (en) * | 2011-11-18 | 2013-06-06 | Seiko Epson Corp | Liquid jet head |
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CN107530717B (en) | 2020-09-01 |
EP3277430A4 (en) | 2018-11-14 |
EP3277430A1 (en) | 2018-02-07 |
CN107530717A (en) | 2018-01-02 |
JP6773042B2 (en) | 2020-10-21 |
JP2018514368A (en) | 2018-06-07 |
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