EP3266763A4 - Diazadienyl compound, raw material for forming thin film, method for producing thin film, and diazadiene compound - Google Patents
Diazadienyl compound, raw material for forming thin film, method for producing thin film, and diazadiene compound Download PDFInfo
- Publication number
- EP3266763A4 EP3266763A4 EP16761428.8A EP16761428A EP3266763A4 EP 3266763 A4 EP3266763 A4 EP 3266763A4 EP 16761428 A EP16761428 A EP 16761428A EP 3266763 A4 EP3266763 A4 EP 3266763A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- thin film
- compound
- raw material
- diazadiene
- diazadienyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 150000001875 compounds Chemical class 0.000 title 2
- 239000010409 thin film Substances 0.000 title 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000002994 raw material Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C251/00—Compounds containing nitrogen atoms doubly-bound to a carbon skeleton
- C07C251/02—Compounds containing nitrogen atoms doubly-bound to a carbon skeleton containing imino groups
- C07C251/04—Compounds containing nitrogen atoms doubly-bound to a carbon skeleton containing imino groups having carbon atoms of imino groups bound to hydrogen atoms or to acyclic carbon atoms
- C07C251/06—Compounds containing nitrogen atoms doubly-bound to a carbon skeleton containing imino groups having carbon atoms of imino groups bound to hydrogen atoms or to acyclic carbon atoms to carbon atoms of a saturated carbon skeleton
- C07C251/08—Compounds containing nitrogen atoms doubly-bound to a carbon skeleton containing imino groups having carbon atoms of imino groups bound to hydrogen atoms or to acyclic carbon atoms to carbon atoms of a saturated carbon skeleton being acyclic
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
- C23C16/18—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metallo-organic compounds
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45553—Atomic layer deposition [ALD] characterized by the use of precursors specially adapted for ALD
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45555—Atomic layer deposition [ALD] applied in non-semiconductor technology
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F15/00—Compounds containing elements of Groups 8, 9, 10 or 18 of the Periodic Table
- C07F15/06—Cobalt compounds
- C07F15/065—Cobalt compounds without a metal-carbon linkage
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Vapour Deposition (AREA)
- Electrodes Of Semiconductors (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Inorganic Compounds Of Heavy Metals (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015044993A JP6465699B2 (en) | 2015-03-06 | 2015-03-06 | Diazadienyl compound, raw material for thin film formation, method for producing thin film, and diazadiene compound |
PCT/JP2016/054116 WO2016143456A1 (en) | 2015-03-06 | 2016-02-12 | Diazadienyl compound, raw material for forming thin film, method for producing thin film, and diazadiene compound |
Publications (3)
Publication Number | Publication Date |
---|---|
EP3266763A1 EP3266763A1 (en) | 2018-01-10 |
EP3266763A4 true EP3266763A4 (en) | 2018-11-07 |
EP3266763B1 EP3266763B1 (en) | 2020-01-01 |
Family
ID=56876492
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP16761428.8A Active EP3266763B1 (en) | 2015-03-06 | 2016-02-12 | Diazadienyl compound, raw material for forming thin film, method for producing thin film, and diazadiene compound |
Country Status (8)
Country | Link |
---|---|
US (1) | US20180037540A1 (en) |
EP (1) | EP3266763B1 (en) |
JP (1) | JP6465699B2 (en) |
KR (1) | KR102441169B1 (en) |
CN (1) | CN107428677B (en) |
IL (1) | IL254192B (en) |
TW (1) | TWI678355B (en) |
WO (1) | WO2016143456A1 (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6735163B2 (en) | 2016-06-22 | 2020-08-05 | 株式会社Adeka | Vanadium compound, thin film forming raw material, and thin film manufacturing method |
JP2018035072A (en) * | 2016-08-29 | 2018-03-08 | 株式会社Adeka | Diazadienyl compound, raw material for forming thin film, and method for producing thin film |
WO2018187781A2 (en) * | 2017-04-07 | 2018-10-11 | Applied Materials, Inc. | Metal precursors with modified diazabutadiene ligands for cvd and ald applications and methods of use |
US10106893B1 (en) | 2017-04-07 | 2018-10-23 | Applied Materials, Inc. | Iridium precursors for ALD and CVD thin film deposition and uses thereof |
KR102474876B1 (en) * | 2017-06-15 | 2022-12-07 | 삼성전자주식회사 | Tungsten precursor and Method of forming a tungsten-containing layer using the same |
US10174423B2 (en) * | 2017-06-28 | 2019-01-08 | L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude | Niobium-containing film forming compositions and vapor deposition of Niobium-containing films |
CN111936664A (en) * | 2018-03-19 | 2020-11-13 | 应用材料公司 | Method for depositing a coating on an aerospace component |
US11440929B2 (en) * | 2018-06-19 | 2022-09-13 | Versum Materials Us, Llc | Bis(diazadiene)cobalt compounds, method of making and method of use thereof |
TW202010746A (en) * | 2018-06-30 | 2020-03-16 | 美商應用材料股份有限公司 | TiN-containing precursors and methods of depositing tin-containing films |
US11473198B2 (en) | 2019-01-25 | 2022-10-18 | Applied Materials, Inc. | Homoleptic lanthanide deposition precursors |
CN111254412A (en) * | 2020-03-27 | 2020-06-09 | 江苏迈纳德微纳技术有限公司 | Atomic layer deposition technology and method for preparing iridium film |
US20220259734A1 (en) * | 2021-02-16 | 2022-08-18 | Applied Materials, Inc. | Reducing Agents for Atomic Layer Deposition |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8796483B2 (en) * | 2010-04-01 | 2014-08-05 | President And Fellows Of Harvard College | Cyclic metal amides and vapor deposition using them |
US9353437B2 (en) * | 2010-11-17 | 2016-05-31 | Up Chemical Co., Ltd. | Diazadiene-based metal compound, method for preparing same and method for forming a thin film using same |
US9206507B2 (en) * | 2011-09-27 | 2015-12-08 | L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude | Nickel bis diazabutadiene precursors, their synthesis, and their use for nickel containing films depositions |
JP2014534952A (en) * | 2011-09-27 | 2014-12-25 | レール・リキード−ソシエテ・アノニム・プール・レテュード・エ・レクスプロワタシオン・デ・プロセデ・ジョルジュ・クロード | Tungsten diazabutadiene molecules, their synthesis and their use in the deposition of tungsten-containing films |
JP5901327B2 (en) | 2012-02-09 | 2016-04-06 | キヤノン株式会社 | Developing device, process cartridge, and image forming apparatus |
JP5842687B2 (en) * | 2012-03-15 | 2016-01-13 | 宇部興産株式会社 | Cobalt film forming raw material and method for producing cobalt-containing thin film using the raw material |
JP5825169B2 (en) * | 2012-03-27 | 2015-12-02 | 宇部興産株式会社 | Method for producing cobalt-containing thin film |
US9187511B2 (en) * | 2012-05-01 | 2015-11-17 | L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude | Titanium-aluminum alloy deposition with titanium-tetrahydroaluminate bimetallic molecules |
CN106232611A (en) * | 2013-10-28 | 2016-12-14 | 赛孚思科技有限公司 | Comprise the metal complex of amide groups imine ligands |
US9236292B2 (en) * | 2013-12-18 | 2016-01-12 | Intel Corporation | Selective area deposition of metal films by atomic layer deposition (ALD) and chemical vapor deposition (CVD) |
-
2015
- 2015-03-06 JP JP2015044993A patent/JP6465699B2/en active Active
-
2016
- 2016-02-12 US US15/555,215 patent/US20180037540A1/en not_active Abandoned
- 2016-02-12 EP EP16761428.8A patent/EP3266763B1/en active Active
- 2016-02-12 WO PCT/JP2016/054116 patent/WO2016143456A1/en active Application Filing
- 2016-02-12 CN CN201680013777.9A patent/CN107428677B/en active Active
- 2016-02-12 KR KR1020177027683A patent/KR102441169B1/en active IP Right Grant
- 2016-02-23 TW TW105105312A patent/TWI678355B/en active
-
2017
- 2017-08-28 IL IL254192A patent/IL254192B/en active IP Right Grant
Non-Patent Citations (3)
Title |
---|
HANS-WERNER FRIIHAUF ET AL: "KOORDINATION VON 1,4-DIAZA-WDIENEN (DAD) AN CARBONYLDIEISEN FRAGMENTE III *. UNSYMMETRISCH SUBSTITUIERTE DIAZABUTADIENE UND 'H- NMR-SPEKTROSKOPISCHE IDENTIFIZlERUNG DER REGIOISOMEREN (DAD)F%(CO),KOMPLEXE VON t-Bu-N=CH-CH=N-i-Pr", JOURNAL OF ORGANOMETALLIC CHEMISTRY, 1 January 1986 (1986-01-01), pages 183 - 193, XP055511449, Retrieved from the Internet <URL:https://ac.els-cdn.com/0022328X86800092/1-s2.0-0022328X86800092-main.pdf?_tid=3c61c9d2-7b77-411f-b998-c048b632d860&acdnat=1538422606_d93a4f7ef3cdb4e0fa933e8fdd5404c7> [retrieved on 20181001] * |
MASAHIKO OCHIAI ET AL: "Reactions of a Platinum(III) Dimeric Complex with Alkynes in Water: Novel Approach to [alpha]-Aminoketone, [alpha]-Iminoketone, and [alpha],[beta]-Diimine via Ketonyl-Pt(III) Dinuclear Complexes", JOURNAL OF THE AMERICAN CHEMICAL SOCIETY, vol. 126, no. 8, 1 March 2004 (2004-03-01), US, pages 2536 - 2545, XP055511437, ISSN: 0002-7863, DOI: 10.1021/ja0302634 * |
See also references of WO2016143456A1 * |
Also Published As
Publication number | Publication date |
---|---|
IL254192B (en) | 2020-07-30 |
KR102441169B1 (en) | 2022-09-06 |
CN107428677A (en) | 2017-12-01 |
CN107428677B (en) | 2022-04-05 |
KR20170127492A (en) | 2017-11-21 |
EP3266763A1 (en) | 2018-01-10 |
JP6465699B2 (en) | 2019-02-06 |
WO2016143456A1 (en) | 2016-09-15 |
TW201704200A (en) | 2017-02-01 |
US20180037540A1 (en) | 2018-02-08 |
IL254192A0 (en) | 2017-10-31 |
EP3266763B1 (en) | 2020-01-01 |
TWI678355B (en) | 2019-12-01 |
JP2016164131A (en) | 2016-09-08 |
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