EP3257064A1 - Power supply system for a plasma process with redundant power supply - Google Patents
Power supply system for a plasma process with redundant power supplyInfo
- Publication number
- EP3257064A1 EP3257064A1 EP16703964.3A EP16703964A EP3257064A1 EP 3257064 A1 EP3257064 A1 EP 3257064A1 EP 16703964 A EP16703964 A EP 16703964A EP 3257064 A1 EP3257064 A1 EP 3257064A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- power supply
- power
- mode
- plasma process
- standby mode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32174—Circuits specially adapted for controlling the RF discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32018—Glow discharge
- H01J37/32045—Circuits specially adapted for controlling the glow discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32137—Radio frequency generated discharge controlling of the discharge by modulation of energy
- H01J37/32155—Frequency modulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32917—Plasma diagnostics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32917—Plasma diagnostics
- H01J37/32926—Software, data control or modelling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32917—Plasma diagnostics
- H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32917—Plasma diagnostics
- H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
- H01J37/32944—Arc detection
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J9/00—Circuit arrangements for emergency or stand-by power supply, e.g. for emergency lighting
- H02J9/04—Circuit arrangements for emergency or stand-by power supply, e.g. for emergency lighting in which the distribution system is disconnected from the normal source and connected to a standby source
- H02J9/06—Circuit arrangements for emergency or stand-by power supply, e.g. for emergency lighting in which the distribution system is disconnected from the normal source and connected to a standby source with automatic change-over, e.g. UPS systems
- H02J9/062—Circuit arrangements for emergency or stand-by power supply, e.g. for emergency lighting in which the distribution system is disconnected from the normal source and connected to a standby source with automatic change-over, e.g. UPS systems for AC powered loads
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/20—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers
- H03F3/21—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only
- H03F3/217—Class D power amplifiers; Switching amplifiers
- H03F3/2175—Class D power amplifiers; Switching amplifiers using analogue-digital or digital-analogue conversion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B70/00—Technologies for an efficient end-user side electric power management and consumption
- Y02B70/30—Systems integrating technologies related to power network operation and communication or information technologies for improving the carbon footprint of the management of residential or tertiary loads, i.e. smart grids as climate change mitigation technology in the buildings sector, including also the last stages of power distribution and the control, monitoring or operating management systems at local level
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B70/00—Technologies for an efficient end-user side electric power management and consumption
- Y02B70/30—Systems integrating technologies related to power network operation and communication or information technologies for improving the carbon footprint of the management of residential or tertiary loads, i.e. smart grids as climate change mitigation technology in the buildings sector, including also the last stages of power distribution and the control, monitoring or operating management systems at local level
- Y02B70/3225—Demand response systems, e.g. load shedding, peak shaving
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y04—INFORMATION OR COMMUNICATION TECHNOLOGIES HAVING AN IMPACT ON OTHER TECHNOLOGY AREAS
- Y04S—SYSTEMS INTEGRATING TECHNOLOGIES RELATED TO POWER NETWORK OPERATION, COMMUNICATION OR INFORMATION TECHNOLOGIES FOR IMPROVING THE ELECTRICAL POWER GENERATION, TRANSMISSION, DISTRIBUTION, MANAGEMENT OR USAGE, i.e. SMART GRIDS
- Y04S20/00—Management or operation of end-user stationary applications or the last stages of power distribution; Controlling, monitoring or operating thereof
- Y04S20/20—End-user application control systems
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y04—INFORMATION OR COMMUNICATION TECHNOLOGIES HAVING AN IMPACT ON OTHER TECHNOLOGY AREAS
- Y04S—SYSTEMS INTEGRATING TECHNOLOGIES RELATED TO POWER NETWORK OPERATION, COMMUNICATION OR INFORMATION TECHNOLOGIES FOR IMPROVING THE ELECTRICAL POWER GENERATION, TRANSMISSION, DISTRIBUTION, MANAGEMENT OR USAGE, i.e. SMART GRIDS
- Y04S20/00—Management or operation of end-user stationary applications or the last stages of power distribution; Controlling, monitoring or operating thereof
- Y04S20/20—End-user application control systems
- Y04S20/222—Demand response systems, e.g. load shedding, peak shaving
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y04—INFORMATION OR COMMUNICATION TECHNOLOGIES HAVING AN IMPACT ON OTHER TECHNOLOGY AREAS
- Y04S—SYSTEMS INTEGRATING TECHNOLOGIES RELATED TO POWER NETWORK OPERATION, COMMUNICATION OR INFORMATION TECHNOLOGIES FOR IMPROVING THE ELECTRICAL POWER GENERATION, TRANSMISSION, DISTRIBUTION, MANAGEMENT OR USAGE, i.e. SMART GRIDS
- Y04S20/00—Management or operation of end-user stationary applications or the last stages of power distribution; Controlling, monitoring or operating thereof
- Y04S20/20—End-user application control systems
- Y04S20/248—UPS systems or standby or emergency generators
Definitions
- the invention relates to a power supply system for a plasma process having a first power supply and a second identical or construction-type redundant power supply. Furthermore, the invention relates to a power supply for the supply of plasma processes.
- Plasma processes that run in a plasma chamber and are used, for example, to treat semiconductor wafers are powered by a power supply.
- the power supply operates in a so-called normal operating mode in which it outputs the power in the desired form to the plasma.
- Plasma processes are very sensitive processes. If it interferes with the plasma process, it may cause damage to the wafer being treated in the plasma chamber.
- An unforeseen failure of one Power supply can make at least a whole wafer unusable. In addition, such a failure can block an entire production. This can cause great damage in a relatively short time.
- the object of the present invention is to provide a power supply and a power supply system, with which a greater process reliability can be achieved.
- a power supply system for a plasma process having a first power supply and a second identical or construction-like redundant power supply, wherein the first and second power supply are data-technologically connected via a data exchange connection and the first power supply is designed in a standby mode data from the second in the normal operating mode to obtain power supply, which are necessary to supply the previously supplied by the second power supply to the plasma process power in place of the second power supply to the plasma process.
- the other power supply can continue to accurately deliver power to the plasma process previously provided by the failed power supply, completely without or with minimal disruption. The faulty power supply can then be repaired or replaced without affecting the plasma process.
- the invention also includes a first power supply for supplying plasma processes which is designed to operate in a stand-by mode in which it produces less power at its output than in the normal operating mode and in a normal operating mode in which it provides an adjustable power generated at its output for supply of plasma processes, wherein the power supply is designed to receive in standby mode data from a second working in normal operating mode power supply, which are necessary to the previously supplied by the second power supply to the plasma process power instead of the second power supply to the plasma process.
- a power supply can be used as a redundant power supply in a power supply system as described above.
- the first power supply may be configured to be switched to the normal operating mode within a very short interruption time, wherein the interruption time may be less than 10 ps, in particular less than 1 s, and particularly preferably less than 0.2 s. Then, the plasma can be maintained further and is no longer disturbed, as occurs, for example, in a power supply interruption caused by a rejection and treatment.
- the frequency of an output signal of the power supply may be adjustable and the first power supply may be configured to provide an output signal of the same frequency as the output signal of the second power supply.
- the power supplies may be capable of operating in pulse mode at a pulse rate and pulse duration, particularly in pulsed mode between two power levels to pulses, and the first power supply may be configured to switch to the same pulse rate, pulse duration, and power level as the second after switching from standby mode to normal mode Supply power. In particular, it may be designed to continue to pulse synchronously.
- the second power supply can provide its concrete set values to the other power supply operating in standby so that it can rapidly power up to the power it needs and power the plasma process after a second power failure. The high demands of the semiconductor industry on repeatability can thus be met.
- At least one power supply may comprise a plurality of amplifiers and a combiner, the combiner combining the powers of the amplifiers connected thereto.
- Such designed power supplies are particularly robust. In particular, they are particularly good with power that is reflected at the plasma chamber.
- the power supplies may have a power output, wherein the power outputs of the power supplies are connected to a connector.
- a connector it is not necessary to connect the power supplies in parallel to a plasma chamber. It is only necessary to connect the connector to the plasma chamber.
- the connecting element can be designed as a matchbox (matching network) and / or combiner. Thus, it is particularly easy to switch from one power supply to the other power supply, without any difficulty in adapting.
- each power supply has an arc management.
- both power supplies may respond to the are, depending on which of the power supplies is currently operating in normal operation mode.
- adaptive readjusting detection thresholds changes in frequency or pulse rate or pulse rate as well as the important data when driving a joule mode are transmitted from one power supply to the other power supply, in particular such data is exchanged.
- the scope of the invention also includes a method for operating a plasma process in a plasma chamber with the method steps:
- Standby mode b. Operating a second power supply in a normal operating mode and powering a plasma process in a plasma chamber; c. Monitoring at least one parameter of the second power supply; d. Transition from standby mode of the first power supply to a normal operating mode and powering the plasma process in the plasma chamber when monitoring the parameter of the second power supply detects a predetermined event.
- the first power supply preferably does not generate power at its output, or at most a power that is many times lower than the power that is generated when operating the power supply in the normal operating mode.
- the predetermined event may be the detection of the failure of the second power supply. It may also be the detection of an impending failure of the second power supply. It can also be one or more of the following events or upcoming events:
- the monitoring of the parameter can be done in the second power supply.
- the monitoring of the parameter can be done alternatively or additionally in the first power supply.
- the first and second power supplies may each be arranged therefor.
- the monitoring of the parameter can be done alternatively or additionally in a higher-level control.
- the detection of the predetermined event can take place in the second power supply.
- the detection of the predetermined event may alternatively or additionally take place in the first power supply.
- the first and second power supplies may each be arranged therefor.
- the detection of the predetermined event may alternatively or additionally be done in a higher-level control.
- the second power supply can be turned off upon detection of the given event. This may be necessary in particular if the detection of the given event does not concern the failure of the second power supply but only the expected or imminent failure.
- Transition from Standby to Normal Mode may result in momentary interrupts. These may typically be as long as they occur during arc treatment. Typically, these breaks may be less than 10 ps, more preferably less than 1 ps, and more preferably less than 0.2 s.
- Arc detection thresholds the frequency of the output signal, the pulse rate of the output signal, the pulse rate of the output signal, target power, desired current or voltage from the second power supply to the first power supply are given and the first power supply can adjust their values accordingly.
- the first and second power supplies can be matched and calibrated.
- the power supplies may be mutually exclusive before the start of the plasma process
- DC link voltages of the first power supply operated in standby mode can be tracked according to the DC link voltages of the second power supply. Thus, it can be ensured that from the standby power supply after switching from standby mode to normal mode of operation of this power supply, almost the same power is supplied as by the second power supply.
- Current chokes of the first power supply operated in standby mode can be pre-fed with one current.
- Energy storage, in particular capacitors, which are provided for an arc treatment can be pre-charged.
- anything that may take time but that does not result in a load on the standby power supply may be turned on and adjusted.
- AC sources of the power supplies can be synchronized. This can also be done in calibration mode. All measures contribute to ensuring that the power supply operated in standby mode can take over the power supply of the plasma process virtually without interruption.
- the method steps described can be used in particular in one of the power supply systems with the features described above.
- the first and the second power supply for carrying out the method may in particular be power supplies with the properties described above.
- Fig. 1 is a schematic representation of a power supply system
- Fig. 2 is a schematic representation of a power supply
- Fig. 3 is a flowchart for explaining the inventive
- the first power supply 2 is first operated in a standby mode. It is designed to produce less power in standby mode at its output 8 than in normal mode operation. In a normal operating mode, it can generate an adjustable power at its output 8 for supplying the plasma process in the plasma chamber 5. In standby mode, it can receive data from the second power supply 3 operating in the normal operating mode. In particular, it may receive data necessary to supply, within a brief interruption described above, after the detection of the predetermined event, the power previously supplied by the second power supply 3 to the plasma process at the location of the second power supply 3 to the plasma process.
- the second power supply 3 also has an output 9, at which power can be output. Both power supplies 2, 3 are connected to a connecting element 10, which is designed as a coupler and / or as an impedance matching network. Power may be supplied from the first power supply 2 or the second power supply 3 to the plasma chamber 5 via the connection element 10, depending on which of the power supplies 2, 3 operates in the normal operating mode.
- the first power supply is switched on from standby mode so that it can take over the power supply of the plasma chamber 5.
- An uninterruptible power supply or an uninterrupted changeover from the power supply 3 to the power supply 2 is ensured by the fact that data is constantly being transmitted via the data exchange system. Connection 4 are exchanged. Thus, numerous parameters and setpoints can be tracked in the first power supply 2 so that it can directly take over the power supply without further adjustments when it is turned on.
- the second power supply 9 can either be exchanged, switched off or operated in a standby mode.
- the second power supply 3 may be identical.
- the power supply 2 can be connected to a power supply network.
- a mains rectifier 11 which generates an intermediate circuit voltage at its output.
- amplifiers 12, 13 are connected to the intermediate circuit voltage, the outputs of which lead to a combiner 14, which is connected to the output 8.
- the amplifiers 12, 13 may be controlled via a controller 15.
- a monitoring device 16 may be connected, which monitors at least one parameter of the second power supply and checks whether a predetermined event is present.
- an arc management 17 may be provided which has energy store 18. Further energy stores 18a, 18b can also be provided outside the arc management.
- Such an energy store can be designed as a current choke 18b.
- the method according to the invention will be explained with reference to FIG.
- step 21 a first power supply 2 in a standby mode and a second power supply 3 in a normal operating mode for powering a plasma process in a plasma chamber 5 are operated.
- step 22 a parameter of the second power supply is monitored.
- step 23 it is decided whether a predetermined event is detected during the monitoring of the parameter. If such an event is detected, then following step Y, in step 24, the first power supply is switched from the standby mode to a normal mode of operation to power the plasma process in the plasma chamber. If no such event is detected in step 23, then following the path N in step 22 the second power supply parameter is again monitored.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Power Engineering (AREA)
- Business, Economics & Management (AREA)
- Emergency Management (AREA)
- Plasma Technology (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102015202317.6A DE102015202317A1 (en) | 2015-02-10 | 2015-02-10 | Power supply system for a plasma process with redundant power supply |
PCT/EP2016/052698 WO2016128384A1 (en) | 2015-02-10 | 2016-02-09 | Power supply system for a plasma process with redundant power supply |
Publications (1)
Publication Number | Publication Date |
---|---|
EP3257064A1 true EP3257064A1 (en) | 2017-12-20 |
Family
ID=55349821
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP16703964.3A Withdrawn EP3257064A1 (en) | 2015-02-10 | 2016-02-09 | Power supply system for a plasma process with redundant power supply |
Country Status (4)
Country | Link |
---|---|
US (1) | US10176970B2 (en) |
EP (1) | EP3257064A1 (en) |
DE (1) | DE102015202317A1 (en) |
WO (1) | WO2016128384A1 (en) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
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DE102015202317A1 (en) * | 2015-02-10 | 2016-08-11 | TRUMPF Hüttinger GmbH + Co. KG | Power supply system for a plasma process with redundant power supply |
US11031804B2 (en) * | 2017-11-06 | 2021-06-08 | Nxp B.V. | Power controller |
US10555412B2 (en) | 2018-05-10 | 2020-02-04 | Applied Materials, Inc. | Method of controlling ion energy distribution using a pulse generator with a current-return output stage |
US10896808B2 (en) * | 2018-07-25 | 2021-01-19 | Lam Research Corporation | Maintenance mode power supply system |
US11476145B2 (en) | 2018-11-20 | 2022-10-18 | Applied Materials, Inc. | Automatic ESC bias compensation when using pulsed DC bias |
WO2020154310A1 (en) | 2019-01-22 | 2020-07-30 | Applied Materials, Inc. | Feedback loop for controlling a pulsed voltage waveform |
US11508554B2 (en) | 2019-01-24 | 2022-11-22 | Applied Materials, Inc. | High voltage filter assembly |
US11462389B2 (en) | 2020-07-31 | 2022-10-04 | Applied Materials, Inc. | Pulsed-voltage hardware assembly for use in a plasma processing system |
US11798790B2 (en) | 2020-11-16 | 2023-10-24 | Applied Materials, Inc. | Apparatus and methods for controlling ion energy distribution |
US11901157B2 (en) | 2020-11-16 | 2024-02-13 | Applied Materials, Inc. | Apparatus and methods for controlling ion energy distribution |
US11495470B1 (en) | 2021-04-16 | 2022-11-08 | Applied Materials, Inc. | Method of enhancing etching selectivity using a pulsed plasma |
US11948780B2 (en) | 2021-05-12 | 2024-04-02 | Applied Materials, Inc. | Automatic electrostatic chuck bias compensation during plasma processing |
US11791138B2 (en) | 2021-05-12 | 2023-10-17 | Applied Materials, Inc. | Automatic electrostatic chuck bias compensation during plasma processing |
US11967483B2 (en) | 2021-06-02 | 2024-04-23 | Applied Materials, Inc. | Plasma excitation with ion energy control |
US20220399185A1 (en) | 2021-06-09 | 2022-12-15 | Applied Materials, Inc. | Plasma chamber and chamber component cleaning methods |
US11810760B2 (en) | 2021-06-16 | 2023-11-07 | Applied Materials, Inc. | Apparatus and method of ion current compensation |
US11569066B2 (en) | 2021-06-23 | 2023-01-31 | Applied Materials, Inc. | Pulsed voltage source for plasma processing applications |
US11776788B2 (en) | 2021-06-28 | 2023-10-03 | Applied Materials, Inc. | Pulsed voltage boost for substrate processing |
US11476090B1 (en) | 2021-08-24 | 2022-10-18 | Applied Materials, Inc. | Voltage pulse time-domain multiplexing |
US12106938B2 (en) | 2021-09-14 | 2024-10-01 | Applied Materials, Inc. | Distortion current mitigation in a radio frequency plasma processing chamber |
US11694876B2 (en) | 2021-12-08 | 2023-07-04 | Applied Materials, Inc. | Apparatus and method for delivering a plurality of waveform signals during plasma processing |
US11972924B2 (en) | 2022-06-08 | 2024-04-30 | Applied Materials, Inc. | Pulsed voltage source for plasma processing applications |
US12111341B2 (en) | 2022-10-05 | 2024-10-08 | Applied Materials, Inc. | In-situ electric field detection method and apparatus |
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CH599702A5 (en) | 1974-09-27 | 1978-05-31 | Siemens Ag | |
DE20221791U1 (en) * | 2002-12-23 | 2007-11-08 | Hüttinger Elektronik GmbH & Co. KG | Modular power supply |
US9214909B2 (en) * | 2005-07-29 | 2015-12-15 | Mks Instruments, Inc. | High reliability RF generator architecture |
EP1753011B1 (en) * | 2005-08-13 | 2012-10-03 | HÜTTINGER Elektronik GmbH + Co. KG | Method for providing control signals for high frequency power generators |
EP1783904B1 (en) * | 2005-10-17 | 2008-04-16 | HÜTTINGER Elektronik GmbH + Co. KG | HF plasma supply system |
ATE448562T1 (en) | 2006-11-23 | 2009-11-15 | Huettinger Elektronik Gmbh | METHOD FOR DETECTING AN ARC DISCHARGE IN A PLASMA PROCESS AND ARC DISCHARGE DETECTION DEVICE |
DE102006057529B4 (en) * | 2006-12-06 | 2012-04-12 | Hüttinger Elektronik Gmbh + Co. Kg | Control device, power supply system and method |
DE102011076404B4 (en) * | 2011-05-24 | 2014-06-26 | TRUMPF Hüttinger GmbH + Co. KG | A method of impedance matching the output impedance of a high frequency power supply arrangement to the impedance of a plasma load and high frequency power supply arrangement |
DE102011080035A1 (en) * | 2011-07-28 | 2013-01-31 | Hüttinger Elektronik Gmbh + Co. Kg | Method and device for protecting passive components connected to a high frequency generator |
JP6049047B2 (en) | 2011-09-30 | 2016-12-21 | Necスペーステクノロジー株式会社 | Redundant amplifier and switching method thereof |
JP6629071B2 (en) | 2012-12-18 | 2020-01-15 | トゥルンプフ ヒュッティンガー ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー コマンディートゲゼルシャフトTRUMPF Huettinger GmbH + Co. KG | Method for generating high-frequency power and power supply system with power converter for supplying power to a load |
DE102015202317A1 (en) * | 2015-02-10 | 2016-08-11 | TRUMPF Hüttinger GmbH + Co. KG | Power supply system for a plasma process with redundant power supply |
-
2015
- 2015-02-10 DE DE102015202317.6A patent/DE102015202317A1/en active Pending
-
2016
- 2016-02-09 WO PCT/EP2016/052698 patent/WO2016128384A1/en active Application Filing
- 2016-02-09 EP EP16703964.3A patent/EP3257064A1/en not_active Withdrawn
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2017
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WO2016128384A1 (en) | 2016-08-18 |
DE102015202317A1 (en) | 2016-08-11 |
US10176970B2 (en) | 2019-01-08 |
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