EP3232268A4 - Solder resist composition and covered printed wiring board - Google Patents
Solder resist composition and covered printed wiring board Download PDFInfo
- Publication number
- EP3232268A4 EP3232268A4 EP14907967.5A EP14907967A EP3232268A4 EP 3232268 A4 EP3232268 A4 EP 3232268A4 EP 14907967 A EP14907967 A EP 14907967A EP 3232268 A4 EP3232268 A4 EP 3232268A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- wiring board
- printed wiring
- resist composition
- solder resist
- covered printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 title 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
- G03F7/322—Aqueous alkaline compositions
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2081—Compound repelling a metal, e.g. solder
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2014/006160 WO2016092598A1 (en) | 2014-12-10 | 2014-12-10 | Solder resist composition and covered printed wiring board |
Publications (3)
Publication Number | Publication Date |
---|---|
EP3232268A1 EP3232268A1 (en) | 2017-10-18 |
EP3232268A4 true EP3232268A4 (en) | 2018-01-03 |
EP3232268B1 EP3232268B1 (en) | 2019-05-08 |
Family
ID=56106852
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP14907967.5A Not-in-force EP3232268B1 (en) | 2014-12-10 | 2014-12-10 | Solder resist composition and covered printed wiring board |
Country Status (7)
Country | Link |
---|---|
US (1) | US10317796B2 (en) |
EP (1) | EP3232268B1 (en) |
JP (1) | JP6368380B2 (en) |
KR (1) | KR101975430B1 (en) |
CN (1) | CN107003610B (en) |
TW (1) | TWI621914B (en) |
WO (1) | WO2016092598A1 (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016092596A1 (en) * | 2014-12-10 | 2016-06-16 | 互応化学工業株式会社 | Liquid solder resist composition and coated printed wiring board |
CN105517648B (en) | 2014-12-10 | 2017-06-20 | 互应化学工业株式会社 | Liquid solder mask agent composition and coated printed substrate |
JP6447557B2 (en) * | 2016-03-24 | 2019-01-09 | 日亜化学工業株式会社 | Method for manufacturing light emitting device |
CN110611020A (en) * | 2018-06-15 | 2019-12-24 | 中华映管股份有限公司 | Light emitting element |
JP7197924B2 (en) * | 2018-08-27 | 2022-12-28 | 互応化学工業株式会社 | Photosensitive resin composition, dry film, and printed wiring board |
JP7444537B2 (en) | 2018-12-27 | 2024-03-06 | デンカ株式会社 | Method for manufacturing a phosphor substrate, method for manufacturing a light emitting substrate, and method for manufacturing a lighting device |
JP7165473B2 (en) * | 2018-12-27 | 2022-11-04 | 太陽インキ製造株式会社 | Curable resin composition, dry film and cured product using the same, and electronic component having the same |
KR102398123B1 (en) * | 2020-06-10 | 2022-05-17 | 한국다이요잉크 주식회사 | Solder resist resin composition, solder resist structure, dry film, and printed wiring board |
JP2022071500A (en) * | 2020-10-28 | 2022-05-16 | 矢崎総業株式会社 | Corrosion-proof material, electric wire with terminal, and wire harness |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010060702A1 (en) * | 2008-11-03 | 2010-06-03 | Basf Se | Photoinitiator mixtures |
JP2011227343A (en) * | 2010-04-21 | 2011-11-10 | Goo Chemical Co Ltd | Solder resist composition and print circuit board |
EP2781530A1 (en) * | 2011-11-15 | 2014-09-24 | Goo Chemical Co., Ltd. | Carboxyl-containing resin, resin composition for use in solder resist, and manufacturing process for carboxyl-containing resin |
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DE3375894D1 (en) * | 1982-10-25 | 1988-04-14 | Sony Corp | Cover film for sublimation transfer process hard copy |
JPH0756336A (en) * | 1993-06-07 | 1995-03-03 | Ajinomoto Co Inc | Resin composition |
US20020102077A1 (en) * | 1995-08-01 | 2002-08-01 | Szum David M. | Protective materials for optical fibers which do not substantially discolor |
US6238840B1 (en) * | 1997-11-12 | 2001-05-29 | Hitachi Chemical Company, Ltd. | Photosensitive resin composition |
US6756165B2 (en) * | 2000-04-25 | 2004-06-29 | Jsr Corporation | Radiation sensitive resin composition for forming barrier ribs for an EL display element, barrier rib and EL display element |
JP4705311B2 (en) * | 2000-09-14 | 2011-06-22 | 互応化学工業株式会社 | UV curable resin composition and photo solder resist ink containing the composition |
EP1253155A1 (en) * | 2001-04-27 | 2002-10-30 | Ucb S.A. | Photo-initiator compositions |
CN100568581C (en) * | 2002-01-25 | 2009-12-09 | 富士胶片株式会社 | Produce the method for image component, the equipment and the image component of production image component |
CA2537810C (en) * | 2003-09-04 | 2012-12-18 | Human Genetic Signatures Pty Ltd | Nucleic acid detection assay |
WO2006126567A1 (en) * | 2005-05-24 | 2006-11-30 | Mitsubishi Chemical Corporation | Phosphor and use thereof |
JP2007178459A (en) * | 2005-12-26 | 2007-07-12 | Fujifilm Corp | Pattern-forming material, pattern-forming device, and pattern forming method |
JP2008107511A (en) * | 2006-10-25 | 2008-05-08 | Kaneka Corp | Curable composition |
JP4994923B2 (en) * | 2007-04-06 | 2012-08-08 | 太陽ホールディングス株式会社 | Black solder resist composition and cured product thereof |
JP2009014936A (en) | 2007-07-03 | 2009-01-22 | Hitachi Chem Co Ltd | Photosensitive resin composition, photosensitive element, method for producing resist pattern and method for producing printed wiring board |
JP2013539072A (en) * | 2010-09-16 | 2013-10-17 | エルジー・ケム・リミテッド | Photosensitive resin composition, dry film solder resist and circuit board |
JP5830323B2 (en) * | 2010-09-21 | 2015-12-09 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーRohm and Haas Electronic Materials LLC | Improved method for stripping hot melt etching resist from semiconductors. |
JP5788008B2 (en) * | 2010-09-24 | 2015-09-30 | マニトワック・フードサービス・カンパニーズ・エルエルシー | System and method for providing energy savings to a remote beverage system |
JP5666868B2 (en) * | 2010-09-30 | 2015-02-12 | 互応化学工業株式会社 | Resin composition for solder resist and printed wiring board |
JP5785810B2 (en) | 2011-07-28 | 2015-09-30 | 住友化学株式会社 | Colored curable resin composition |
JP5814691B2 (en) * | 2011-08-11 | 2015-11-17 | 互応化学工業株式会社 | Resin resin composition |
JP5875821B2 (en) * | 2011-09-30 | 2016-03-02 | 太陽インキ製造株式会社 | Photosensitive resin composition, cured film thereof and printed wiring board |
US8703385B2 (en) * | 2012-02-10 | 2014-04-22 | 3M Innovative Properties Company | Photoresist composition |
US9583669B2 (en) * | 2012-08-16 | 2017-02-28 | Sun Chemical Corporation | Inkjet printable etch resist |
US10655034B2 (en) * | 2014-07-29 | 2020-05-19 | Ofs Fitel, Llc | UV-curable silsesquioxane-containing write-through optical fiber coatings for fabrication of optical fiber Bragg gratings, and fibers made therefrom |
CN105517648B (en) * | 2014-12-10 | 2017-06-20 | 互应化学工业株式会社 | Liquid solder mask agent composition and coated printed substrate |
-
2014
- 2014-12-10 JP JP2016563293A patent/JP6368380B2/en active Active
- 2014-12-10 CN CN201480083930.6A patent/CN107003610B/en active Active
- 2014-12-10 KR KR1020177015863A patent/KR101975430B1/en active IP Right Grant
- 2014-12-10 US US15/531,461 patent/US10317796B2/en not_active Expired - Fee Related
- 2014-12-10 WO PCT/JP2014/006160 patent/WO2016092598A1/en active Application Filing
- 2014-12-10 EP EP14907967.5A patent/EP3232268B1/en not_active Not-in-force
- 2014-12-29 TW TW103146120A patent/TWI621914B/en active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010060702A1 (en) * | 2008-11-03 | 2010-06-03 | Basf Se | Photoinitiator mixtures |
JP2011227343A (en) * | 2010-04-21 | 2011-11-10 | Goo Chemical Co Ltd | Solder resist composition and print circuit board |
EP2781530A1 (en) * | 2011-11-15 | 2014-09-24 | Goo Chemical Co., Ltd. | Carboxyl-containing resin, resin composition for use in solder resist, and manufacturing process for carboxyl-containing resin |
Non-Patent Citations (1)
Title |
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See also references of WO2016092598A1 * |
Also Published As
Publication number | Publication date |
---|---|
KR101975430B1 (en) | 2019-05-07 |
EP3232268A1 (en) | 2017-10-18 |
JPWO2016092598A1 (en) | 2017-04-27 |
KR20170083112A (en) | 2017-07-17 |
CN107003610A (en) | 2017-08-01 |
TWI621914B (en) | 2018-04-21 |
WO2016092598A1 (en) | 2016-06-16 |
US10317796B2 (en) | 2019-06-11 |
TW201621460A (en) | 2016-06-16 |
JP6368380B2 (en) | 2018-08-01 |
EP3232268B1 (en) | 2019-05-08 |
CN107003610B (en) | 2020-05-19 |
US20170269477A1 (en) | 2017-09-21 |
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