EP3174617A1 - Sensor, filter element comprising a sensor and use of said type of filter element - Google Patents
Sensor, filter element comprising a sensor and use of said type of filter elementInfo
- Publication number
- EP3174617A1 EP3174617A1 EP15745425.7A EP15745425A EP3174617A1 EP 3174617 A1 EP3174617 A1 EP 3174617A1 EP 15745425 A EP15745425 A EP 15745425A EP 3174617 A1 EP3174617 A1 EP 3174617A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- sensor
- chip
- sensor chip
- filter element
- sensor according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000012528 membrane Substances 0.000 claims description 30
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 14
- 229910052710 silicon Inorganic materials 0.000 claims description 14
- 239000010703 silicon Substances 0.000 claims description 14
- 230000005540 biological transmission Effects 0.000 claims description 12
- 238000001914 filtration Methods 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 9
- 238000007789 sealing Methods 0.000 claims description 6
- 238000011144 upstream manufacturing Methods 0.000 claims description 6
- 238000005516 engineering process Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 238000010276 construction Methods 0.000 claims description 3
- 238000009423 ventilation Methods 0.000 claims description 3
- 239000010425 asbestos Substances 0.000 claims description 2
- 238000001035 drying Methods 0.000 claims description 2
- 239000000383 hazardous chemical Substances 0.000 claims description 2
- 239000003595 mist Substances 0.000 claims description 2
- 239000003921 oil Substances 0.000 claims description 2
- 238000007591 painting process Methods 0.000 claims description 2
- 229910052895 riebeckite Inorganic materials 0.000 claims description 2
- 239000002245 particle Substances 0.000 description 6
- 238000009434 installation Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 238000005273 aeration Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000002440 industrial waste Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
- B81C1/0023—Packaging together an electronic processing unit die and a micromechanical structure die
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0061—Packages or encapsulation suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D46/00—Filters or filtering processes specially modified for separating dispersed particles from gases or vapours
- B01D46/42—Auxiliary equipment or operation thereof
- B01D46/44—Auxiliary equipment or operation thereof controlling filtration
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/008—MEMS characterised by an electronic circuit specially adapted for controlling or driving the same
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
- G01L9/0073—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a semiconductive diaphragm
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0264—Pressure sensors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/01—Suspended structures, i.e. structures allowing a movement
- B81B2203/0127—Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2207/00—Microstructural systems or auxiliary parts thereof
- B81B2207/01—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS
- B81B2207/012—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS the micromechanical device and the control or processing electronics being separate parts in the same package
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2207/00—Microstructural systems or auxiliary parts thereof
- B81B2207/07—Interconnects
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
- B81C2201/0128—Processes for removing material
- B81C2201/013—Etching
- B81C2201/0132—Dry etching, i.e. plasma etching, barrel etching, reactive ion etching [RIE], sputter etching or ion milling
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
- G01L2009/0066—Mounting arrangements of diaphragm transducers; Details thereof, e.g. electromagnetic shielding means
- G01L2009/0069—Mounting arrangements of diaphragm transducers; Details thereof, e.g. electromagnetic shielding means the transducer being mounted on a flexible element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Definitions
- the invention relates to a sensor, a filter element with a sensor and a use of a filter element with a sensor.
- a disadvantage of the known filter elements is that the sensors are often made relatively large in order to detect and evaluate one or more physical variables.
- the production of such filter elements is relatively expensive.
- larger sensors are difficult to mount on filter elements.
- the detection of very small pressure differences in the range 10 - 500 Pa is possible in the prior art only with relatively large sensors and requires a lot of space.
- the connection of such a relatively large sensor to a filter element is quite difficult and expensive.
- contacting such a sensor is often done by cables. The latter is above all not worthwhile, because a handling of cables is cumbersome and of
- the invention is therefore based on the object, a cost-effective
- Specify filter element which has a compact sensor.
- a 180 nm technology can be used to arrange electronics and a membrane on a sensor chip. This allows the compact design of the sensor chip and thus of the functional volume.
- the electronic chip could have a plurality of analog and / or digital interfaces with which different sensor chips can be evaluated. As a result, a single electronic chip can be combined with various sensors or sensor chips.
- the sensor chip with a transducer element and / or the sensor chip with a transducer element and a sensor front end could be used in their entirety in a 180 nm CMOS technology, in particular for detecting a Differential pressure in the range 10 - 500 Pa with a resolution of 5 Pa, be made. As a result, pressures can be measured accurately and efficiently.
- the transducer element could be designed as a transistor or resistor on a silicon membrane. As a result, a very reliable arrangement is created.
- the electronics chip and the sensor chip could be arranged side by side on a circuit board. As a result, a very flat structure is realized.
- the electronic chip and the sensor chip could be electrically conductively connected to one another by bonding wires.
- the electronics chip and the sensor chip can be placed very close to each other. The usage of
- Bonding wires allow easy fabrication because the bonding wires are mounted on the sides of the chips facing away from the board.
- the electronic chip and the sensor chip could be electrically conductively connected to one another by a flip-chip connection using contact bumps, namely so-called "bumps.” This contacting makes sense when electrical devices, namely, in particular
- Oxide layers which are arranged on a silicon substrate, facing a circuit board and facing away from the pure silicon side of the silicon substrate of the circuit board.
- the sensor chip could include a membrane and electronic devices.
- the sensor chip may consist of a silicon substrate, is arranged on and / or in the electronics.
- the sensor chip can be constructed very compact. It is even conceivable that the membrane only consists of one
- the sensor chip could comprise a silicon substrate in which a membrane is etched, which is free of electronic devices and / or oxide layers except for transducer elements.
- Transducer elements are preferably designed as n- or p-doped regions on and / or in the membrane. By etching the membrane also a compact structure of the sensor chip is generated, as an intrinsic in the
- Silicon substrate existing material is used as a membrane.
- the membrane is therefore designed as a silicon membrane.
- Electronics or oxide layers with a thickness of about 10 m could be etched away until reaching the Sliziumsubstrats, on the other hand up to 500 ⁇ depth is etched into the silicon substrate into to create the membrane.
- the electronics chip and the sensor chip could be arranged on a circuit board in which a passage is formed, wherein the passage is the only fluid-conducting access to a volume which is formed by the circuit board, the sensor chip and a sealing ring surrounding the sensor chip or sealed , wherein the volume is a first
- Membrane surface facing a membrane A second membrane surface which faces the first membrane surface faces the atmosphere or another volume fluid-tightly separated from the volume.
- the functional volume in the literal sense of this document is formed only by the sums of the extensions of the electronic chips and sensor chips in each case in the x, y and z directions.
- the bonding wires, the Greierhügel and / or parts of a Abdichtkranzes contribute nothing to the functional volume or increase this not.
- the bonding wires, the Druckierhügel and Parts of the sealing ring protrude beyond the functional volume.
- a part of the Abdichtkranzes, which is arranged between an electronic chip and sensor chip, has to be disregarded in the total extension of the functional volume in the x, y or z direction. Decisive are only the dimensions of the electronic chips and sensor chips as such in the respective directions. In Fig. 5, the calculation or detection of the extensions x and z
- a filter element according to the invention comprises a base body, wherein a sensor of the type described here is arranged on the base body.
- the main body could comprise a filter medium, which is a
- Outflow side in the range 10 - 500 Pa is detectable. This allows
- the sensor chip could have a resolution of 5 Pa against this background.
- the sensor chip could have a resolution that ranges from 1 Pa to less than 5 Pa.
- the sensor chip could have a resolution that is greater than 5 Pa to 10 Pa.
- Laser printers emit particles that are harmful to health as fine dust
- Filter elements are deposited.
- the filter elements settle by a particle storage and must be replaced regularly, the change time depends heavily on the use of the device, such as the type of prints and the paper used. Because of this, a change in fixed time or counting intervals does not make sense. Thus, monitoring of the condition of a filter element is required. This can be done in particular by measuring a pressure difference. Usual sensors for pressure difference measurement must be installed in the device.
- connection of the sensor to a device electronics is required. This connection usually takes place via a cable. Cabling is too uncomfortable to use a filter element in a laser printer that requires a simple, layman-friendly replacement.
- a filter element is used with a sensor that allows wireless energy and / or data transmission, in or on a laser printer, a room air cleaner, a motor vehicle, agricultural and / or construction machine.
- filter elements with integrated sensor and wireless energy and data transmission,
- a filter element with a sensor having an energy and / or
- Data transmission with or without cable allowed could be used for building ventilation, in hospitals, in hygiene relevant areas, in gas turbines, in
- Compressors used for aeration of industrial processes in drying processes in the food industry, in surface engineering, in painting processes, for filtering industrial waste air, for filtering asbestos removal, for filtering oil mist or for filtering hazardous substances.
- a filter element in the sense of this description is a device or arrangement for separating particles or gaseous substances from a fluid, wherein particles may be solids or liquid droplets and wherein the fluid may be liquid or gaseous.
- these may be filter elements with a folded filter medium made of paper or nonwoven fabric, fillings or foam structures.
- the main body can be configured as a bellows, as a flat filter medium, as a frame or as another component of the filter element.
- the sensor can therefore be located anywhere on the filter element.
- Fig. 1 shows a filter element with a folded filter medium, wherein the
- Fiiterelement is associated with a sensor
- Fig. 2 is a schematic view of the sensor, wherein the sensor has only two chips, namely an electronic chip and a sensor chip, which are interconnected, and a
- Fig. 3 is a schematic view of the sensor chip 4 is a schematic view of the electronic chip
- Fig. 5 is a schematic view of the sensor chip and the
- Fig. 7 is a schematic transparent view of a sensor chip from above, which is arranged on a circuit board , where several
- Fig. 1 shows a filter element 1a, comprising a base body 1, wherein the base body 1, a sensor 2 is arranged.
- FIG. 2 shows that the sensor 2 has at least one electronic chip 4 and at least one sensor chip 5, which are located within one
- Functional volume 3 are arranged, which is at most 4 to 5 mm at most 2 to 3 mm wide and at most 0.5 to 0.8 mm high.
- the distance x is 5 mm
- the distance y is 3 mm
- the distance z is 0.8 mm.
- the electronics chip 4 has a plurality of analog and / or digital interfaces with which various sensor chips can be evaluated.
- By means of the electronic chip 4 and the sensor chip 5 is a wireless energy and / or data transmission. This can be done via a radio interface or via a non-pluggable connection of contacts.
- the electronics chip 4 and the sensor chip 5 are arranged on a circuit board 6, which has a larger base area than the functional volume 3.
- the main body 1 comprises a folded filter medium 7, which is a
- the sensor chip 5 On the upstream side 8 and a downstream side 9, wherein the sensor chip 5 is so high resolution that a pressure difference between the upstream side 8 and outflow side 9 in the range 10 - 500 Pa can be detected.
- the sensor chip 5 has a resolution of 5 Pa.
- the filter medium 7 is made of a nonwoven fabric. However, paper can also be used as the filter medium.
- the filter element 1 a may have glued edge strips. The edge strips can be one
- the filter element 1 a can be configured as a combination filter.
- a combination filter filters particles and gaseous substances.
- the sensor chip 5 makes it possible to detect a differential pressure in the range 10 - 500 Pa.
- the sensor chip 5 can either consist of only one transducer element 10, which converts a pressure change into an electrical signal, or of a transducer element 10 with a sensor front end 11.
- the sensor chip 5 with a transducer element 10 and / or the sensor chip 5 with a transducer element 10 and a sensor front-end 1 1 is manufactured in its entirety in a 180 nm CMOS technology.
- the sensor front end 11 could have an electronics or be configured as such.
- the transducer element 10 could be designed as a transistor or as a resistor on a silicon membrane.
- Fig. 4 shows a schematic view of the electronic chip 4.
- Electronic chip 4 comprises analog and / or digital interfaces for connection to further sensors 12 or to further sensor chips.
- Electronics chip 4 comprises a sensor front end 13.
- the electronics chip 4 comprises a microcontroller for signal processing 14.
- the electronics chip 4 comprises a memory 15.
- the electronics chip 4 comprises an RFID front end 16 for a contactless supply and / or for supply via a contact connection , 5 shows with reference to a further sensor 2 'that the electronics chip 4' and the sensor chip 5 'are arranged side by side on a circuit board 6'.
- the electronics chip 4 'and the sensor chip 5' are connected to one another in an electrically conductive manner by bonding wires 17.
- 6 shows, by means of a further sensor 2 ", that the electronic chip 4" and the sensor chip 5 "are connected to one another in an electrically conductive manner by a flip-chip connection using contacting bumps 18, namely so-called" bumps ".
- the sensor chip 5 ', 5 comprises a membrane 19', 19” and electronic devices 20 ', 20 “which may comprise oxide layers.
- the sensor chip 5', 5" comprises one each Silicon substrate 21 ', 21 ", in which a membrane 19', 19” is etched, which is except for transducer elements 10 ', 10 "free of electronic devices or oxide layers.
- the electronic chip 4 ', 4 "and the sensor chip 5', 5" are arranged on a board 6 ', 6 ", in which a passage 6'a, 6" a is formed, wherein the passage 6'a, 6 "a the only fluid-conducting access to a volume 22 ', 22 "is formed by the circuit board 6', 6", the sensor chip 5 ', 5 “and a sealing ring 23', 23” which surrounds the sensor chip 5 ', 5 ", wherein the volume 22 ', 22 "faces a first membrane surface 19'a, 19" a of the membrane 19', 19 ".
- the electronic chip 4 ', 4" is glued.
- the electronics chip 4 ', 4 " also has electronic devices 20', 20".
- the volume 22 ', 22 " is sealed only by the circuit board 6', 6", the sensor chip 5 ', 5 "and the sealing ring 23', 23", which surrounds the sensor chip 5 ', 5 "on two different sides the membrane 19 ', 19 "prevail
- the Abdichtkranz 23 ', 23 preferably consists of a potting compound, which can also flow into a small gap sealing. 7 shows, in a transparent view, that the contact mounds 18 surround a membrane 19 "The contact mounds 18 must be mounted so precisely that the sensor chip 5" or the membrane 19 "
- An interface between the sensor chip 5, 5 ', 5 "and the electronics chip 4, 4', 4" can be located in the functional volume 3.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Power Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
- Micromachines (AREA)
- Filtering Of Dispersed Particles In Gases (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102014011247 | 2014-08-01 | ||
PCT/EP2015/066877 WO2016016085A1 (en) | 2014-08-01 | 2015-07-23 | Sensor, filter element comprising a sensor and use of said type of filter element |
Publications (1)
Publication Number | Publication Date |
---|---|
EP3174617A1 true EP3174617A1 (en) | 2017-06-07 |
Family
ID=53719772
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP15745425.7A Withdrawn EP3174617A1 (en) | 2014-08-01 | 2015-07-23 | Sensor, filter element comprising a sensor and use of said type of filter element |
EP15741540.7A Withdrawn EP3174826A1 (en) | 2014-08-01 | 2015-07-23 | Sensor |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP15741540.7A Withdrawn EP3174826A1 (en) | 2014-08-01 | 2015-07-23 | Sensor |
Country Status (8)
Country | Link |
---|---|
US (2) | US9863829B2 (en) |
EP (2) | EP3174617A1 (en) |
JP (2) | JP2017525956A (en) |
KR (2) | KR20170036081A (en) |
CN (2) | CN106796151A (en) |
CA (2) | CA2956864A1 (en) |
RU (2) | RU2664690C1 (en) |
WO (2) | WO2016016085A1 (en) |
Families Citing this family (5)
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CN106796151A (en) | 2014-08-01 | 2017-05-31 | 卡尔·弗罗伊登伯格公司 | The application of sensor, the filter element including sensor and such filter element |
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- 2015-07-23 EP EP15745425.7A patent/EP3174617A1/en not_active Withdrawn
- 2015-07-23 KR KR1020177005437A patent/KR20170036081A/en not_active Application Discontinuation
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Also Published As
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CN106796151A (en) | 2017-05-31 |
US9863829B2 (en) | 2018-01-09 |
EP3174826A1 (en) | 2017-06-07 |
CA2956867A1 (en) | 2016-02-04 |
KR20170039700A (en) | 2017-04-11 |
WO2016016078A1 (en) | 2016-02-04 |
JP2017528701A (en) | 2017-09-28 |
KR20170036081A (en) | 2017-03-31 |
CN106794983A (en) | 2017-05-31 |
RU2664690C1 (en) | 2018-08-21 |
JP2017525956A (en) | 2017-09-07 |
WO2016016085A1 (en) | 2016-02-04 |
RU2665341C1 (en) | 2018-08-29 |
US20170219448A1 (en) | 2017-08-03 |
CA2956864A1 (en) | 2016-02-04 |
US20170217763A1 (en) | 2017-08-03 |
US10189701B2 (en) | 2019-01-29 |
CA2956867C (en) | 2020-07-28 |
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