EP3146797A1 - Resistive heating curing device for resin materials - Google Patents

Resistive heating curing device for resin materials

Info

Publication number
EP3146797A1
EP3146797A1 EP14892343.6A EP14892343A EP3146797A1 EP 3146797 A1 EP3146797 A1 EP 3146797A1 EP 14892343 A EP14892343 A EP 14892343A EP 3146797 A1 EP3146797 A1 EP 3146797A1
Authority
EP
European Patent Office
Prior art keywords
curing device
curing
resin material
resistive heating
heating element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP14892343.6A
Other languages
German (de)
French (fr)
Other versions
EP3146797A4 (en
Inventor
Anette JÄRNETEG
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Saab AB
Original Assignee
Saab AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Saab AB filed Critical Saab AB
Publication of EP3146797A1 publication Critical patent/EP3146797A1/en
Publication of EP3146797A4 publication Critical patent/EP3146797A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/0266—Local curing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
    • H05B3/34—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater flexible, e.g. heating nets or webs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
    • H05B3/34—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater flexible, e.g. heating nets or webs
    • H05B3/36—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater flexible, e.g. heating nets or webs heating conductor embedded in insulating material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C2035/0211—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould resistance heating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
    • B29C70/28—Shaping operations therefor
    • B29C70/54—Component parts, details or accessories; Auxiliary operations, e.g. feeding or storage of prepregs or SMC after impregnation or during ageing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/011—Heaters using laterally extending conductive material as connecting means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/014—Heaters using resistive wires or cables not provided for in H05B3/54

Definitions

  • the present invention relates to a curing device according to the preamble of claim 1.
  • the present invention also relates to a method for curing a resin material by adding heat to a resin material by using the curing device.
  • the curing of resin materials is a common occurrence in both home and industrial environments of today. Said curing can relate to paints, glues and shim materials. As the curing process can take a long time and thus require better planning and/or higher costs there is a desire to lower the amount of time required for said curing.
  • the curing of resin materials is also dependent on temperature with higher temperatures yielding shorter curing times.
  • said object may be placed in an oven or similar temperature controllable closed compartment.
  • the use of heat guns is another easy solution to add heat to a desired location but the fluctuations in the applied heat are large and not easy to have control over.
  • the objects adjacent to the resin are also affected by the heat which can cause problems in the process. As heat expands materials and especially metals, excessive heat can ruin the final product due to a heat treatment.
  • the resistive heating elements are manufactured into desired shapes to be fitted into for example moulds where polymer material is being inserted.
  • the shaped resistive heaters prevent the liquid polymer to change phase prematurely when it is inserted in said mould.
  • the heaters must however be manufactured into the desired shape beforehand making the solution less flexible than desired.
  • the device also consists of multiple layers making it harder to manufacture into thin shapes. With the increasing demands for quality and precision in today's industry the tolerances of industrial applications are thus of a higher importance as well.
  • the alignment of two or more objects in respect to each other is of high importance as a bad fit between said objects may lead to failure of components through for example mechanisms such as vibrations or crevice corrosion.
  • a way of avoiding crevices and improving alignment of objects about to be assembled to each other is to use shim materials.
  • a shim material is a resin type of material that is applied to at least one of the surfaces of the assembly in a fixture to restrict movement. The shim is then left to cure and when the curing is complete the surfaces to be assembled have a better fit in regards to each other. Shim materials and its uses improves the mechanical properties of manufactured devices and machines but they have a shortcoming when it comes to the curing as it is a very time consuming process. The curing can take up to 9 hours which can affect a manufacturing process or an assembly line and thus increasing costs of the production and the final product.
  • the purpose of the present invention relates to a curing device defined in the introduction, the curing device is characterized by the features of the characterizing part of claim 1.
  • the purpose of the present invention relates to a curing device adapted for curing a resin material by adding heat to the resin material, wherein the curing device comprises; a resistive heating element, a first surface, a second surface, a first edge and a second edge.
  • the curing device is characterized in that it is flexible.
  • the said first surface of the curing device is adapted to be temporary attached to at least one object during curing.
  • the curing device When in use the curing device can locally apply heat to an adjacent resin material in a controlled manner.
  • An advantageous feature of the invention is therefore that heat can be added to a resin making it cure faster, while at the same time excess heat to surrounding objects is avoided.
  • the device is flexible another advantage of the invention is that it is can be applied to objects of various sizes and shapes without manufacturing a specific shape for a specific object.
  • the said second surface is a non-stick surface.
  • the curing device may comprise at least one layer of composite material.
  • the curing device may comprise at least two layers.
  • the curing device has a uniform thickness.
  • the resistive heating element comprises carbon fibres.
  • the thickness of the curing device is less than 2 mm and preferably less than 0.5 mm.
  • the curing device comprises at least two electrodes arranged to said edges. This has the effect that the electrical current through the curing device in use will be distributed in a uniform manner.
  • the curing device comprises at least one temperature sensor. This has the advantage that the temperature can be monitored and controlled during usage of the curing device.
  • An advantageous feature of the invention is that the curing device is adapted for curing shim materials.
  • the curing device is adapted for usage in the aircraft industry.
  • the present invention also relates to a method for curing a resin material by adding heat to a resin material by using the curing device.
  • Figure 1 shows a perspective view of a curing device according to a first embodiment of the present invention.
  • Figure 2 shows a cross section view of a curing device according to a first embodiment of the present invention.
  • Figure 3a shows a perspective view of a curing device arrangement in the shape of a roll according to another embodiment of the invention.
  • Figure 3b-e shows a top view of curing devices with various geometries according to embodiments of the invention.
  • Figure 4 shows a cross section view of a curing device according to yet another embodiment of the invention.
  • Figure 5 shows a cross section view of a curing device according to an embodiment of the invention.
  • Figure 6 shows a cross section view of a curing device according to another embodiment of the invention.
  • Figure 7 shows a cross section view of a curing device according to yet another embodiment of the invention.
  • Figure 1 shows a perspective view of a curing device 2 according to a first embodiment of the present invention.
  • the curing device 2 is adapted for curing a resin material 4 wherein the resin material 4 can comprise epoxy, glue, and paint or preferably shim materials.
  • the curing device 2 comprises a resistive heating element 6 through which heat can be added to the resin material 4 by the means of resistive heating when a current is applied to the resistive heating element 6.
  • the resistive heating elements may comprise carbon fibres or metallic materials such as copper.
  • the curing device 2 further comprises a first surface 8 and a second surface 10 wherein said surfaces 8, 10 are parallel in respect to each other.
  • the curing device 2 thus has a uniform thickness T.
  • the curing device 2 further comprise a first edge 12 and a second edge 14 positioned adjacent to both said surfaces 12, 14.
  • the edges 12, 14 comprise at least two electrodes 22 adapted for receiving the electrical current to the resistive heating element 6.
  • the embodiment of the curing device 2 shown in figure 1 is further shown when in use and is arranged between a first object 16 and a resin material 4.
  • the curing device 2 is flexible which makes the second surface 10 and the surface of the resin material 4 parallel to the object 16.
  • the resin material 4 is further arranged towards a second object 24 on the opposite side of the curing device 2.
  • the second object 24 may have an uneven surface compared to the surface of the first object 16.
  • the surfaces of the first object 16 and the second object 24 will be parallel due to the uniform thickness T of the curing device 2.
  • the surfaces 12, 14 of the curing device 2 extend along the surface of the object 16 in such a way that the resin material 4 is in contact with solely the curing device 2 and not the object 16.
  • the curing device 2 may have at least one temperature sensor 17 arranged to the curing device.
  • the temperature sensor is adapted for measuring the temperature of the curing device 2 when operated.
  • the temperature sensor 17 is further arranged in such a way that the temperature of the resin material 4 can be monitored when the curing device 2 is being operated.
  • Figure 3a shows a perspective view of a curing device 2 arrangement in the shape of a roll according to a second embodiment of the invention.
  • the curing device arrangement can then produce curing devices 2 of desired sizes by rolling out the curing device arrangement and cut at a preferred length.
  • the curing device 2 may however be manufactured into sheets of various predetermined sizes or shapes preferred for particular applications.
  • Figure 3b-e shows a top view over examples of various forms for the curing device 2, such as a square, parallelogram, a hexagon and a rectangle.
  • Figure 4 shows a cross section view of a curing device 2 according to another embodiment of the invention.
  • the curing device 2 comprises two layers. At least one of the layers comprises a composite material which comprises carbon fibres.
  • Figure 5 shows a cross section view of a curing device 2 according to yet another embodiment of the invention.
  • the curing device 2 may comprise one layer with the multiple characteristics of the curing device 2.
  • Figure 6 shows a cross section view of a curing device according to yet another embodiment of the invention.
  • the curing device 2 may comprise several layers wherein at least one layer is electrically conductive.
  • the conductive layer thus functions as the resistive heating element 6.
  • the resistive heating element 6 may comprise a metal material such as copper.
  • Figure 7 shows a cross section view of a curing device according to yet another embodiment of the invention.
  • the curing device 2 comprises one composite layer with a resistive heating element 6 embedded in the layer in the shape or a wire, a coil or similar arrangement.
  • the resistive heating element 6 may comprise a metal material such as copper.
  • the curing device 2 when operated holds a distinct temperature dependent of the current applied to the curing device 2.
  • the temperature can therefore be controlled to be within a range desired for specific applications but not put out excessive heat to adjacent objects.
  • the temperature may be set in the range of 35-60°C and preferably in the range of 40-55°C for usage with shim materials.
  • the uniform thickness T is less than 2 mm and preferably less than 0.5 mm.
  • the uniform thickness T may even be as thin as 0.1 mm or less.
  • the curing device 2 is adapted for curing shim materials. According to an aspect of the invention the curing device 2 is adapted for usage within the aircraft industry, preferably for curing shim materials or other resin materials 4.
  • the present invention also relates to a method of using the curing device 2 for curing of resin materials 4.
  • the method comprises the following steps; applying the curing device 2 with the first surface 8 against a surface of a first object 16; positioning the resin material 4 between the curing device 2 and an end surface of a second object 24; curing the resin material 4 by adding heat to the curing device 2 by means of resistive heating; and removing the curing device 2 from the cured resin material 4.
  • said method is adapted for curing shim materials.
  • said method is adapted for usage in the aircraft industry.

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Thermal Sciences (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

The present invention relates to a curing device (2) adapted for curing a resin material (4) by adding heat to the resin material (4). The curing device (2) comprises; a resistive heating element (6),a first surface (8),a second surface (10),a first edge (12), and a second edge (14). The curing device (2) is flexible. The first surface (8) of the curing device (2) is adapted to be temporary attached to at least one first object (16) during said curing.

Description

RESISTIVE HEATING CURING DEVICE FOR RESIN MATERIALS
TECHNICAL FIELD
The present invention relates to a curing device according to the preamble of claim 1. The present invention also relates to a method for curing a resin material by adding heat to a resin material by using the curing device.
TECHNICAL BACKGROUND
The curing of resin materials is a common occurrence in both home and industrial environments of today. Said curing can relate to paints, glues and shim materials. As the curing process can take a long time and thus require better planning and/or higher costs there is a desire to lower the amount of time required for said curing.
The curing of resin materials is also dependent on temperature with higher temperatures yielding shorter curing times. For smaller objects exposed of resin materials that are to be cured, said object may be placed in an oven or similar temperature controllable closed compartment. The use of heat guns is another easy solution to add heat to a desired location but the fluctuations in the applied heat are large and not easy to have control over. The objects adjacent to the resin are also affected by the heat which can cause problems in the process. As heat expands materials and especially metals, excessive heat can ruin the final product due to a heat treatment.
[US2004149733] relates to resistive heaters and their uses. The resistive heating elements are manufactured into desired shapes to be fitted into for example moulds where polymer material is being inserted. The shaped resistive heaters prevent the liquid polymer to change phase prematurely when it is inserted in said mould. The heaters must however be manufactured into the desired shape beforehand making the solution less flexible than desired. The device also consists of multiple layers making it harder to manufacture into thin shapes. With the increasing demands for quality and precision in today's industry the tolerances of industrial applications are thus of a higher importance as well. In the field of assembly, be it welding, gluing, bolting or other methods, the alignment of two or more objects in respect to each other is of high importance as a bad fit between said objects may lead to failure of components through for example mechanisms such as vibrations or crevice corrosion.
A way of avoiding crevices and improving alignment of objects about to be assembled to each other is to use shim materials. A shim material is a resin type of material that is applied to at least one of the surfaces of the assembly in a fixture to restrict movement. The shim is then left to cure and when the curing is complete the surfaces to be assembled have a better fit in regards to each other. Shim materials and its uses improves the mechanical properties of manufactured devices and machines but they have a shortcoming when it comes to the curing as it is a very time consuming process. The curing can take up to 9 hours which can affect a manufacturing process or an assembly line and thus increasing costs of the production and the final product.
It is a general object to eliminate drawbacks with prior art curing devices and processes for curing resin material. Further, there is a need for a device and a method for improving forced curing of resin materials. Yet an object is to provide a more defined and controlled heating during curing without fluctuations and to avoid excess heat to surrounding objects. An additional object is to find a curing device that result in a less time-consuming curing process and a cost efficient manufacturing.
SUMMARY OF THE INVENTION
The purpose of the present invention relates to a curing device defined in the introduction, the curing device is characterized by the features of the characterizing part of claim 1.
The purpose of the present invention relates to a curing device adapted for curing a resin material by adding heat to the resin material, wherein the curing device comprises; a resistive heating element, a first surface, a second surface, a first edge and a second edge. The curing device is characterized in that it is flexible. The said first surface of the curing device is adapted to be temporary attached to at least one object during curing.
When in use the curing device can locally apply heat to an adjacent resin material in a controlled manner. An advantageous feature of the invention is therefore that heat can be added to a resin making it cure faster, while at the same time excess heat to surrounding objects is avoided. As the device is flexible another advantage of the invention is that it is can be applied to objects of various sizes and shapes without manufacturing a specific shape for a specific object. Preferably, the said second surface is a non-stick surface.
This has the effect that the resin material easily can be removed from the second surface after curing.
The curing device may comprise at least one layer of composite material.
This has the effect that the curing device can be handled in a more effective way since the curing device solely includes a single integrated component to be releasably attached and removed before and after curing.
The curing device may comprise at least two layers.
This has the effect that the curing device constitutes of a module system that can be flexibly handled. The attachment to an object can be made stronger.
According to one aspect of the invention the curing device has a uniform thickness.
This has the effect that objects arranged next to the curing device when used will not change their orientation in respect to each other.
According to yet a further aspect of the invention the resistive heating element comprises carbon fibres.
This has the effect that the resistive heating provided by the curing device can be distributed and controlled in an effective manner.
An advantageous feature of the invention is that the thickness of the curing device is less than 2 mm and preferably less than 0.5 mm.
This has the effect that the curing device is viable to use in very small crevices and for arrangements consisting of several components that are tightly fitted to each other. According to one aspect of the invention the curing device comprises at least two electrodes arranged to said edges. This has the effect that the electrical current through the curing device in use will be distributed in a uniform manner.
According to a further aspect of the invention the curing device comprises at least one temperature sensor. This has the advantage that the temperature can be monitored and controlled during usage of the curing device.
An advantageous feature of the invention is that the curing device is adapted for curing shim materials.
This has the advantage that shim procedures in industrial applications can have a shortened curing time.
According to yet a further aspect of the invention the curing device is adapted for usage in the aircraft industry.
This creates an advantageous financial situation for the manufacturing of aircrafts.
The present invention also relates to a method for curing a resin material by adding heat to a resin material by using the curing device.
BRIEF DESCRIPTION OF FIGURES
The invention will be further described with reference to the accompanying drawings.
Figure 1 shows a perspective view of a curing device according to a first embodiment of the present invention. Figure 2 shows a cross section view of a curing device according to a first embodiment of the present invention.
Figure 3a shows a perspective view of a curing device arrangement in the shape of a roll according to another embodiment of the invention.
Figure 3b-e shows a top view of curing devices with various geometries according to embodiments of the invention. Figure 4 shows a cross section view of a curing device according to yet another embodiment of the invention.
Figure 5 shows a cross section view of a curing device according to an embodiment of the invention.
Figure 6 shows a cross section view of a curing device according to another embodiment of the invention. Figure 7 shows a cross section view of a curing device according to yet another embodiment of the invention.
DETAILED DESCRIPTIONS OF THE INVENTION
Herein embodiments of the invention will be described in detail with reference to the appended drawings. For clarity the drawings are not made to scale.
References made in the patent claims are not meant to be viewed upon as a restriction to the scope of the claims but only to make the invention easier to understand.
As will be perceived the invention can be modified in various obvious ways without derailing from the scope of the claims. Thus the drawings should be viewed upon as illustrative in their nature and not restrictive. Figure 1 shows a perspective view of a curing device 2 according to a first embodiment of the present invention. The curing device 2 is adapted for curing a resin material 4 wherein the resin material 4 can comprise epoxy, glue, and paint or preferably shim materials. The curing device 2 comprises a resistive heating element 6 through which heat can be added to the resin material 4 by the means of resistive heating when a current is applied to the resistive heating element 6. The resistive heating elements may comprise carbon fibres or metallic materials such as copper.
The curing device 2 further comprises a first surface 8 and a second surface 10 wherein said surfaces 8, 10 are parallel in respect to each other. The curing device 2 thus has a uniform thickness T. The curing device 2 further comprise a first edge 12 and a second edge 14 positioned adjacent to both said surfaces 12, 14. The edges 12, 14 comprise at least two electrodes 22 adapted for receiving the electrical current to the resistive heating element 6. The embodiment of the curing device 2 shown in figure 1 is further shown when in use and is arranged between a first object 16 and a resin material 4. The curing device 2 is flexible which makes the second surface 10 and the surface of the resin material 4 parallel to the object 16. The resin material 4 is further arranged towards a second object 24 on the opposite side of the curing device 2. The second object 24 may have an uneven surface compared to the surface of the first object 16. When the resin material 4 have cured and the resin material is fully adhered to the second object 24 the surfaces of the first object 16 and the second object 24 will be parallel due to the uniform thickness T of the curing device 2.
As shown in figure 1 and figure 2 the surfaces 12, 14 of the curing device 2 extend along the surface of the object 16 in such a way that the resin material 4 is in contact with solely the curing device 2 and not the object 16.
As also shown in figure 2 the curing device 2 may have at least one temperature sensor 17 arranged to the curing device. The temperature sensor is adapted for measuring the temperature of the curing device 2 when operated. The temperature sensor 17 is further arranged in such a way that the temperature of the resin material 4 can be monitored when the curing device 2 is being operated.
Figure 3a shows a perspective view of a curing device 2 arrangement in the shape of a roll according to a second embodiment of the invention. The curing device arrangement can then produce curing devices 2 of desired sizes by rolling out the curing device arrangement and cut at a preferred length. The curing device 2 may however be manufactured into sheets of various predetermined sizes or shapes preferred for particular applications. Figure 3b-e shows a top view over examples of various forms for the curing device 2, such as a square, parallelogram, a hexagon and a rectangle. Figure 4 shows a cross section view of a curing device 2 according to another embodiment of the invention. The curing device 2 comprises two layers. At least one of the layers comprises a composite material which comprises carbon fibres.
Figure 5 shows a cross section view of a curing device 2 according to yet another embodiment of the invention. The curing device 2 may comprise one layer with the multiple characteristics of the curing device 2. Figure 6 shows a cross section view of a curing device according to yet another embodiment of the invention. The curing device 2 may comprise several layers wherein at least one layer is electrically conductive. The conductive layer thus functions as the resistive heating element 6. The resistive heating element 6 may comprise a metal material such as copper.
Figure 7 shows a cross section view of a curing device according to yet another embodiment of the invention. The curing device 2 comprises one composite layer with a resistive heating element 6 embedded in the layer in the shape or a wire, a coil or similar arrangement. The resistive heating element 6 may comprise a metal material such as copper.
According to another embodiment of the invention the curing device 2 when operated holds a distinct temperature dependent of the current applied to the curing device 2. The temperature can therefore be controlled to be within a range desired for specific applications but not put out excessive heat to adjacent objects. As an example the temperature may be set in the range of 35-60°C and preferably in the range of 40-55°C for usage with shim materials.
According to yet another embodiment of the invention the uniform thickness T is less than 2 mm and preferably less than 0.5 mm. The uniform thickness T may even be as thin as 0.1 mm or less.
According to yet another aspect of the invention the curing device 2 is adapted for curing shim materials. According to an aspect of the invention the curing device 2 is adapted for usage within the aircraft industry, preferably for curing shim materials or other resin materials 4.
According to another aspect, the present invention also relates to a method of using the curing device 2 for curing of resin materials 4. The method comprises the following steps; applying the curing device 2 with the first surface 8 against a surface of a first object 16; positioning the resin material 4 between the curing device 2 and an end surface of a second object 24; curing the resin material 4 by adding heat to the curing device 2 by means of resistive heating; and removing the curing device 2 from the cured resin material 4. According to yet another aspect of the method, said method is adapted for curing shim materials. According to further aspect of the method, said method is adapted for usage in the aircraft industry.

Claims

Claims
1. A curing device (2) adapted for curing a resin material (4) by adding heat to the resin material (4), wherein the curing device (2) comprises;
a resistive heating element (6),
a first surface (8),
a second surface (10),
a first edge (12), and
a second edge (14),
the curing device (2) is characterized in that the curing device (2) is flexible, the said first surface (8) of the curing device (2) is adapted to be temporary attached to at least one first object (16) during said curing.
A curing device (2) according to claim 1 , characterized in that the said second surface (10) is a non-stick surface.
A curing device (2) according to claim 1 , characterized in that the curing device (2) comprises at least one layer of composite material.
A curing device (2) according to claim 1 or 2, characterized in that the curing device (2) comprises at least two layers (18, 20).
A curing device (2) according to any preceding claim, characterized in that the curing device (2) has a uniform thickness (T).
A curing device (2) according to any of the preceding claims, characterized in that the resistive heating element (6) comprises carbon fibres.
A curing device (2) according to any of the preceding claims, characterized in that the thickness (T) of the curing device (2) is less than 2 mm and preferably less than 0.5 mm.
8. A curing device (2) according to any of the preceding claims, characterized in that the curing device (2) comprises at least two electrodes (22) arranged to said edges (12, 14).
9. A curing device (2) according to any of the preceding claims, characterized in that the curing device (2) comprises at least one temperature sensor (17).
10. A curing device (2) according to any of the preceding claims, characterized in that the curing device (2) is adapted for curing shim materials.
1 1. A curing device (2) according to any of the preceding claims, characterized in that the curing device (2) is adapted for usage in the aircraft industry.
12. A curing device (2) according to any of the preceding claims, characterized in that the resin material (4) is provided at an end surface of a second object (24), and that the resin material (4) is temporary arranged on the second surface (10) of the curing device (2) during curing.
13. A method for curing a resin material (4) by adding heat to a resin material (4) by using a curing device (2) according to any of the preceding claims 1-12, wherein the method comprises the following steps:
-applying the curing device (2) with the first surface (8) against a surface of one object; -positioning the resin material (4) between the curing device (2) and an end surface of a second object (24);
-curing the resin material (4) by adding heat to the curing device (2) by means of resistive heating; and
-removing the curing device (2) from the cured resin material (4).
14. A method according to claim 13 wherein the method is characterized in that the method is adapted for curing shim materials.
15. A method according to any of the preceding claims 13 and 14 wherein the method is characterized in that the method is adapted for usage in the aircraft industry.
EP14892343.6A 2014-05-23 2014-05-23 Resistive heating curing device for resin materials Withdrawn EP3146797A4 (en)

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PCT/SE2014/050639 WO2015178815A1 (en) 2014-05-23 2014-05-23 Resistive heating curing device for resin materials

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