EP3144787A2 - Touch sensor and manufacturing method thereof - Google Patents
Touch sensor and manufacturing method thereof Download PDFInfo
- Publication number
- EP3144787A2 EP3144787A2 EP16182915.5A EP16182915A EP3144787A2 EP 3144787 A2 EP3144787 A2 EP 3144787A2 EP 16182915 A EP16182915 A EP 16182915A EP 3144787 A2 EP3144787 A2 EP 3144787A2
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- European Patent Office
- Prior art keywords
- substrate
- channels
- touch sensor
- groove
- forming
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- 238000004519 manufacturing process Methods 0.000 title claims description 22
- 239000000758 substrate Substances 0.000 claims abstract description 256
- 239000007788 liquid Substances 0.000 claims abstract description 41
- 239000000463 material Substances 0.000 claims description 40
- 238000000034 method Methods 0.000 claims description 19
- 125000006850 spacer group Chemical group 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 4
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 3
- 229910052733 gallium Inorganic materials 0.000 claims description 3
- 229910052738 indium Inorganic materials 0.000 claims description 3
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 3
- -1 polydimethylsiloxane Polymers 0.000 claims description 2
- 229920002635 polyurethane Polymers 0.000 claims description 2
- 239000004814 polyurethane Substances 0.000 claims description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 claims 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims 2
- 238000007599 discharging Methods 0.000 claims 1
- 230000035945 sensitivity Effects 0.000 description 9
- 230000006378 damage Effects 0.000 description 5
- 230000005496 eutectics Effects 0.000 description 3
- 239000006260 foam Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229910000846 In alloy Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011344 liquid material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0448—Details of the electrode shape, e.g. for enhancing the detection of touches, for generating specific electric field shapes, for enhancing display quality
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0283—Stretchable printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/101—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by casting or moulding of conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
Definitions
- Exemplary embodiments relate to a touch sensor and a manufacturing method thereof.
- a touch sensor is an input device which, when touched by a human hand or an object, is capable of recognizing the location of the touch.
- the usage and requirements for touch sensors are on the rise.
- a stretchable touch sensor capable of being used as an interface for a stretchable display has also been under development.
- Exemplary embodiments provide to a touch sensor and a method of manufacturing the same which form channels that cross each other on a stretchable substrate, where each of the channels includes a wedge having a round form. Because conductive liquid is injected into the channel, touch sensitivity may increase as a result of the wedge. In addition, because there are no bubbles in the channel, damage to the substrate may be prevented.
- An exemplary embodiment discloses a touch sensor including a stretchable first substrate having first channels extended in a first direction, a first conductive liquid injected into the first channels, a second stretchable substrate having second channels extended in a second direction crossing the first direction, and a second conductive liquid injected into the second channels.
- An exemplary embodiment also discloses a method for manufacturing a touch sensor including forming a first groove-formed substrate having first grooves, forming a first flat substrate, forming a first substrate having first channels corresponding to the first groove by attaching the first groove-formed substrate and the first flat substrate, and injecting a first conductive liquid into the first channels.
- an element or layer When an element or layer is referred to as being “on,” “connected to,” or “coupled to” another element or layer, it may be directly on, connected to, or coupled to the other element or layer or intervening elements or layers may be present. When, however, an element or layer is referred to as being “directly on,” “directly connected to,” or “directly coupled to” another element or layer, there are no intervening elements or layers present.
- X, Y, and Z and "at least one selected from the group consisting of X, Y, and Z” may be construed as X only, Y only, Z only, or any combination of two or more of X, Y, and Z, such as, for instance, XYZ, XYY, YZ, and ZZ.
- XYZ XYY
- YZ YZ
- ZZ ZZ
- first, second, etc. may be used herein to describe various elements, components, regions, layers, and/or sections, these elements, components, regions, layers, and/or sections should not be limited by these terms. These terms are used to distinguish one element, component, region, layer, and/or section from another element, component, region, layer, and/or section. Thus, a first element, component, region, layer, and/or section discussed below could be termed a second element, component, region, layer, and/or section without departing from the teachings of the present disclosure.
- Spatially relative terms such as “beneath,” “below,” “lower,” “above,” “upper,” and the like, may be used herein for descriptive purposes, and, thereby, to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the drawings.
- Spatially relative terms are intended to encompass different orientations of an apparatus in use, operation, and/or manufacture in addition to the orientation depicted in the drawings. For example, if the apparatus in the drawings is turned over, elements described as “below” or “beneath” other elements or features would then be oriented “above” the other elements or features.
- the exemplary term “below” can encompass both an orientation of above and below.
- the apparatus may be otherwise oriented (e.g., rotated 90 degrees or at other orientations), and, as such, the spatially relative descriptors used herein interpreted accordingly.
- exemplary embodiments are described herein with reference to sectional illustrations that are schematic illustrations of idealized exemplary embodiments and/or intermediate structures. As such, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, are to be expected. Thus, exemplary embodiments disclosed herein should not be construed as limited to the particular illustrated shapes of regions, but are to include deviations in shapes that result from, for instance, manufacturing. The regions illustrated in the drawings are schematic in nature and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to be limiting.
- FIGS. 1 to 3 are an exploded perspective view and two cross-sectional views illustrating a touch sensor in accordance with an exemplary embodiment.
- FIG. 1 is an exploded perspective view illustrating the touch sensor
- FIG. 2 is a cross-sectional view illustrating the touch sensor viewed along section lines A-A' and B-B' of FIG. 1
- FIG. 3 is a cross-sectional view illustrating the touch sensor viewed along section lines C-C' and D-D'.
- the touch sensor may include a first substrate 100, a second substrate 200, and a third substrate 300.
- the first substrate 100, the second substrate 200, and the third substrate 300 may have a thickness in the direction of a third direction which crosses both a first direction and a second direction.
- the first substrate 100, the second substrate 200, and the third substrate 300 are separately described for ease of illustration, but in fact, the first substrate 100 and the third substrate 300 may be adhered together, and the third substrate 300 and the second substrate 200 may be adhered together.
- the first substrate 100 may include first channels LC1 extending in the first direction, and a first conductive liquid may be inserted into the first channels LC 1.
- the second substrate 200 may include second channels LC2 extending in the second direction crossing the first direction, and second conductive liquid may be inserted into the second channels LC2.
- the third substrate 300 may be located between the first substrate 100 and the second substrate 200.
- the first substrate 100 and the third substrate 300 may be adhered together, and the third substrate 300 and the second substrate 200 may be adhered together.
- the first substrate 100, the second substrate 200, and the third substrate 300 may all be stretchable, and in accordance with an exemplary embodiment, the elastic modulus of the third substrate 300 may be lower than those of the first substrate 100 and the second substrate 200.
- the material making up the first substrate 100, the second substrate 200, and the third substrate 300 may be the same, and the elastic moduli of the first substrate 100, the second substrate 200, and the third substrate 300 may all be the same.
- the material making up at least one among the first substrate 100 to the third substrate 300 may include at least one of the groups made up of polydimethylsiloxame (PDMS) or polyurethane, so the first substrate 100, the second substrate 200, and the third substrate 300 may all be stretchable.
- Material making up at least one of the first conductive liquid or the second conductive liquid may include at least one from the group consisting of gallium (Ga) and indium (In).
- a eutectic gallium-indium alloy (Eutectic Ga-In, EGaIn), which is an alloy of eutectic method of gallium (Ga) and indium (In)
- EGaIn eutectic gallium-indium alloy
- the melting point of the alloy is lower than room temperature, making possible its use as the first conductive liquid or the second conductive liquid.
- the melting point is lower than 16° C, 12° C or 5° C.
- the first substrate 100, the second substrate 200, and the third substrate 300 will be explained in more detail with reference to FIGS. 2 and 3 .
- the first substrate 100 may include a first groove-formed substrate 100-H and a first flat substrate 100-F
- the second substrate 200 may include a second groove-formed substrate 200-H and a second flat substrate 200-F.
- first grooves may be formed on the first groove-formed substrate 100-H.
- the first flat substrate 100-F may be adhered to the first groove-formed substrate 100-H so that the first grooves are blocked from outside, and first holes may be formed on the first flat substrate 100-F.
- First electrodes may be inserted into the first holes.
- a first hole H1-a among all the first holes is shown as a representative of the first holes
- a first electrode EC1-a among all the first electrodes are shown as a representative of the first electrodes.
- the first electrode EC1-a may be arranged between the first flat substrate 100-F and the third substrate 300.
- at least one of the first electrodes for example the first electrode EC1-a, may be supplied with a pre-set voltage.
- the first channel LC1-a is divided by a greater number, but for ease of illustration, the first channel LC1-a is divided by a smaller number.
- second grooves may be formed on the second groove-formed substrate 200-H.
- the second flat substrate 200-F may be adhered to the second groove-formed substrate 200-H so that the second grooves are blocked from outside, and second holes are formed on the second flat substrate 200-F.
- Second electrodes may be inserted into the second holes.
- a second hole H2-b among all the second holes is shown as a representative of the second holes
- a second electrode EC2-b among all the second electrodes is shown a representative of the second holes.
- the second electrode EC2-b may be arranged between the second flat substrate 200-F and the third substrate 300.
- the touch sensor described with reference to FIGS. 1 to 3 may detect touch in various ways. For example, when conductive material is touched, capacitance may be changed by the touch. Even when the same voltage is supplied by the first electrodes by changes in capacitance, levels of current or voltage measured by the second electrodes may be changed. In other words, a touch sensor in accordance with an exemplary embodiment may detect changes in current or voltage incurred by touch by conductive material. In addition or as an alternative, when pressure is applied to the touch sensor, the thickness T3 in the third direction of the point on the third substrate 300 on which the pressure is applied may be changed, and the gap between the first channels LC1 and the second channels LC2 may be changed.
- Capacitance may be changed due to changes in the gap, and thus, levels of current or voltage measured by the first electrodes and the second electrodes may be changed.
- a touch sensor in accordance with an exemplary embodiment may detect changes in current or voltage incurred by pressure.
- a touch sensor in accordance with an exemplary embodiment if it is lightly touched by conductive material and the capacitance is changed, or if, regardless of material, the thickness of the point on the third substrate 300 on which pressure is applied is changed by the pressure, the location of the touch, or the location of the point where the thickness has been changed, may be calculated.
- the second channel LC2-b may be divided by a greater number, but for ease of illustration, the second channel LC2-b is divided by a smaller number.
- FIGS. 4A, 4B , and 5 are plan views for describing an exemplary embodiment of a structure of the first channels and the second channels of the touch sensor of FIG. 1 .
- FIGS. 4A and 4B are plan views illustrating an exemplary embodiment of a structure of the first channels of the touch sensor shown in FIG. 1
- FIG. 5 is a plan view for illustrating an exemplary embodiment of a structure of the second channels of the touch sensor of FIG. 1 .
- the first channel LC1-a may include a plurality of straight channels and wedges, and for ease of illustration, only straight channels LC1-a-s-1 and LC1-a-s-2 and a wedge LC1-a-w-1 will be given as examples. Also, regarding the first channel LC1-(a+1), only the wedge LC1-(a+1)-w-2 will be explained.
- the straight channels LC1-a-s-1 and LC1-a-s-2 may extend in the second direction.
- the wedge LC1-a-w-1 of the first channel LC1-a and the wedge LC1-(a+1)-w-2 of the first channel LC1-(a+1), which are adjacent to each other, may be separated by a distance D.
- the wedge LC1-a-w-1 may be a first wedge
- the wedge LC1-a+1-w-2 may be a second wedge.
- the distance D may be equal to or greater than 150 ⁇ m and less than or equal to 200 ⁇ m. When the distance D is less than 150 ⁇ m, the distance between the side walls between the first channel LC1-a and the second channel LC1-(a+1) may become undesirably short, increasing the chance for the touch sensor to easily break. When the distance D is greater than 200 ⁇ m, the accuracy of the touch sensor may decrease.
- the wedge LC1-a-w-1 will be explained in more detail with reference to FIG. 6 .
- the second channel LC2-b may include multiple straight channels and wedges, but for ease of illustration, only straight channels LC2-b-s-1 and LC2-b-s-2 and wedges LC2-b-w-1 and LC2-b-w-2 will be given as examples.
- the straight channels LC2-b-s-1 and LC2-b-s-2 may extend in the first direction.
- FIG. 6 is a plan view for describing an exemplary embodiment of a structure of a wedge of the first channel shown in FIG. 4 .
- the straight channel LC1-a-s-1 may have a width in the first direction, and the width may be equal to or greater than 80 ⁇ m and less than or equal to 300 ⁇ m.
- the wedge LC1-a-w-1 may include a round part, and the round part may include an inner round portion R-I and an outer round portion R-O.
- the contact angle may be defined as the angle formed between a surface of a solid and a liquid when the liquid is in contact with the surface of the solid, and its value may be changed depending on the kind of conductive liquid and material making up the first substrate.
- slopes of the wedge LC1-a-w-1 may meet, forming an angle greater than 0 degrees (e.g., 22 to 45 degrees). If this angle is less than the contact angle between the first channels and the first conductive liquid, not all of the conductive liquid may be injected into the interface, and bubbles may be formed in the first channels. When bubbles are in the channels, the amount of the conductive liquid may decrease, leading to a reduced sensitivity to touch and possible destruction of the touch sensor due to the bubbles.
- slopes of the wedge LC1-a-w-1 may not meet forming an angle greater than 0 degrees.
- the inner contour of the wedge respective the wedge-shaped channel, at least at the narrow end may be continuous or steady, i.e. without any peak forming an angle.
- the wedge LC1-a-w-1 has an inner round portion R-I, the interface where the straight channels LC1-a-s-1 and LC1-a-s-2 and the wedge LC1-a-w-1 may not form an angle greater than 0 degrees (for example, 22 to 45 degrees).
- the inner contour of the wedge respective the wedge-shaped channel in the region connecting the straight channels opening out into the wedge may be continuous or steady, i.e. without any peak forming an angle. Therefore, all the conductive liquid may be injected into the interface, so no bubbles may form in the channels. All of the conductive liquid may be injected into the inner round portion R-I, and it may be injected into the outer round portion R-O when certain requirements for the radius of curvature (ROC) of the outer round portion R-O are met.
- ROC radius of curvature
- wedges with round shapes may be included, and conductive liquid may be injected into that channel, so sensitivity to touch may be improved by the wedge, but there may be no damage to the substrate as there are no bubbles in the channel.
- the wedge LC1-a-w-1 may have a length L in the second direction.
- the length L is less than 150 ⁇ m, channel resistance may increase causing RC delay to worsen, and when the length L is greater than 600 ⁇ m, the round part may become excessively large, causing channel sensitivity to decrease.
- the outer round portion R-O When the ROC is less than half of the width W of the straight channels LC1-a-s-1 and LC1-a-s-2, the outer round portion R-O may be excessively bent, which may cause all of the conductive liquid not to be injected into the outer round portion R-O, leading to the formation of bubbles. When there are bubbles present, the detecting sensitivity of the entire touch sensor may be decreased, and the touch sensor may be damaged.
- the ROC of the outer round portion R-O is greater than 63% of the width W of the straight channels LC1-a-s-1 and LC1-a-s-2, the outer round portion R-O may become too flat, the length of the channels may be increased, leading to an increase in resistance.
- the ROC of the outer round portion R-O may be expressed as the equation below: 0.5 ⁇ W ⁇ ROC ⁇ O ⁇ 0.63 ⁇ W (W: width of the straight channel LC1-a-s-1, ROC-O: ROC of the outer round portion R-O)
- FIGS. 7 to 17 are cross-sectional views for describing a method of manufacturing the touch sensor shown in FIG.1 .
- FIGS. 7 to 14 are cross-sectional views for describing a method of manufacturing the first substrate
- FIGS. 15 and 16 are cross-sectional views for describing a method of manufacturing the third substrate.
- a method of manufacturing the second substrate may be described with reference to FIGS. 7 to 14 .
- FIG. 7 illustrates steps in forming first protrusions P on a mold M.
- the shape of the first protrusions P may correspond to the shape of the first channels LC1 and the shape of the first grooves of the first groove-formed substrate 100-H, and the material making up the protrusions P may be a material that is photosensitive and stackable to a substantial thickness. For example, SU-8, etc., may be included.
- the mold M may take the shape of a container later in order to hold fluid.
- FIG. 8 illustrates a step in which material making up the first groove-formed substrate 100-H is injected into a mold M with the first protrusions P formed on it, is hardened, and forms the first groove-formed substrate 100-H.
- Material making up the first groove-formed substrate 100-H for example polydimetylsiloxane (PDMS), may flow and be included as a liquid, However, if heat, ultraviolet rays, etc. are applied, material making up the first groove-formed substrate 100-H may be hardened (curing).
- PDMS polydimetylsiloxane
- the first groove-formed substrate 100-H may be formed by putting the material making up the first groove-formed substrate 100-H into a mold M with the shape of a container and with the first protrusions P formed on it and hardening using the eternal environment (heat, ultraviolet rays, etc.). In other words, it may be hardened as the first grooves corresponding to the first protrusions P are formed.
- FIG. 9 illustrates a step in which the first groove-formed substrate 100-H is detached from the mold M. Applying external force onto the first groove-formed substrate 100-H may separate the mold M from the first groove-formed substrate 100-H, and the protrusions from the first groove-formed substrate 100-H.
- the steps shown in FIGS. 7 to 9 may correspond to the steps of forming the first groove-formed substrate 100-H.
- the first grooves H of the first groove-formed substrate 100-H may correspond to the shape of the first protrusions P, and the thickness TH in the third direction of the first grooves H may correspond to the height in the third direction of the first channels LC 1.
- FIG. 10 illustrates a step in which liquid material making up the first flat substrate 100-F is poured into the mold M and is hardened.
- Material making up the first flat substrate 100-F may possess the same characteristics as material making up the first groove-formed substrate 100-H. Thus, repeated description may be omitted.
- the first flat substrate 100-F may be formed by pouring the material making up the first flat substrate 100-F into the mold M having the shape of a container and by hardening it by the external environment (heat, ultraviolet rays, etc.) Because the surface of the mold M touching material making up the first groove-formed substrate does not have any protrusions or grooves, the first flat substrate 100-F may have a flat shape.
- FIG. 11 illustrates a step in which the first flat substrate 100-F is detached from the mold M. Just like in the case of the first groove-formed substrate 100-H, application of external force onto the first flat substrate 100-F may separate the mold M and the first flat substrate 100-F.
- the steps shown in FIGS. 10 and 11 may correspond to the step in which the first flat substrate is formed.
- FIG. 12 illustrates a first adherence step in which the first groove-formed substrate 100-H and the first flat substrate 100-F are adhered together to form the first substrate with the first channels formed on it.
- the first groove-formed substrate 100-H and the first flat substrate 100-F may be arranged in such a way that they are touching each other, applied heat to, and adhered together. Or the surface of the first groove-formed substrate 100-H which is to be attached and the surface of the first flat substrate 100-F which is to be attached may be applied with material making up the first groove-formed substrate 100-H before it is hardened.
- the material making up the first groove-formed substrate 100-H may be hardened, and the first groove-formed substrate 100-H and the first flat substrate 100-F may be adhered together.
- the surfaces of the first groove-formed substrate 100-H and the first flat substrate 100-F may be oxygen plasma-treated, and the first groove-formed substrate 100-H and the first flat substrate 100-F may be arranged in such a way that they are touching each other.
- the first channels LC1 may be formed by the first groove-formed substrate 100-H and the first flat substrate 100-F being adhered together.
- FIG. 13 illustrates a step in which first holes and temporary holes are formed in the first channels LC1, and first electrodes are inserted into the first holes.
- the first holes and the temporary holes may be formed in the first channels, and the first electrodes may be inserted into the first holes. Because only the a th first channel LC1-a is shown in FIG. 13 , only a first hole H1-a among all the first holes is shown, only a temporary hole HT-a among all the temporary holes is shown, and only a first electrode EC1-a among all the first electrodes is shown in the figure. Also, in accordance with an exemplary embodiment, the temporary holes may not be formed. In FIG. 13 , the first electrode EC1-a may not be fixed with respect to the first substrate 100. In addition, tubes (not shown) may be inserted into the first and temporary holes to inject the first conductive liquid into or to take air out of the first channels LC1. In this case, the first electrode EC1-a may be provided within one of the tubes.
- FIG. 14 illustrates a step in which the first conductive liquid is injected into the first channels through the first holes and gas is taken out of the first channels through the temporary holes.
- the first conductive liquid from one of the tubes inserted into the first hole H1-a may be injected into the first channel LC1-a.
- the air existent in the first channel LC1-a may be taken out of the first channel LC1-a through one (not shown) of the tubes inserted into the temporary hole HT-a.
- no air may be left in the first channels LC1, making preventing the lowering of the sensitivity of the touch sensor and damage to the touch sensor due to bubbles.
- FIGS. 15 and 16 illustrate a method of manufacturing the third substrate.
- FIG. 15 illustrates a step in which liquefied material making up the third substrate 300 is poured into the mold and hardened. Since this is very similar to the step described with reference to FIG. 10 , in which liquefied material making up the first flat substrate 100-F is poured and hardened is very similar, the description thereof will be omitted.
- Material making up the third substrate 300 and capable of being included in fluid may be put into a mold M with the shape of a container and hardened by the external environment (heat, ultraviolet rays, etc.) to form the third substrate 300.
- the elastic modulus of the third substrate 300 may be lower than those of the first substrate 100 and the second substrate 200.
- the material making up the third substrate 300 for example, PDMS
- the material making up the third substrate 300 may be poured into the mold M and stirred around to form foam.
- other material for example, water
- Hardening material with foam formed may lead to the formation of a porous third substrate 300.
- FIG. 16 illustrates a step in which the third substrate 300 is separated from the mold M.
- the mold M and the third substrate 300 may be separated by applying external force to the third substrate 300.
- FIG. 17 illustrates a third adhesion step in which the first substrate and the third substrate are adhered together.
- the first substrate 100 and the third substrate 300 may be adhered together through the methods described with reference to FIG. 12 .
- the first and the temporary holes may be isolated from outside by the third substrate 300. In other words, the first conductive liquid injected into the first channels LC1 may not come outside.
- the third substrate 300 and the second substrate 200 may be adhered together through the methods described with reference to FIG. 12 .
- the second holes may be isolated from outside by the third substrate 300.
- the second conductive liquid injected into the second channels LC2 may not come outside.
- the touch sensor shown in FIGS. 1 to 3 may be obtained. It may be desirable for the first channels LC1 to extend in the first direction and for the second channels LC2 to extend in the second direction which crosses the first direction. If the third substrate 300 and the second substrate 200 are adhered together, the touch sensor described with reference to FIGS. 1 to 3 may be completed.
- FIG. 18 is a cross-sectional view for describing illustrates a touch sensor in accordance with another exemplary embodiment.
- the touch sensor may include a first substrate 100', a second substrate 200', and a third substrate 300'.
- the third substrate 300' of the touch sensor shown in FIG. 18 unlike the one shown in FIG. 2 and FIG. 3 , may include protrusions 300-p'.
- the degree that the protrusions 300-p' are deformed may be greater than a degree of deformation of the a th first channel LC1-a', in the case a pressure is applied to the touch sensor. Therefore, the risk of a short circuit due to blockage in channels may decrease as the degree to which the first channels LC1-a' are deformed is reduced when the pressure is applied.
- FIG. 19 is cross-sectional views for describing a method of manufacturing the first flat substrate of the touch sensor of FIG. 18 .
- protrusions P' may be formed on the mold M, and the material making up the first flat substrate 100-F' and which may belong to liquid may be injected and hardened.
- Grooves may be formed on the first flat substrate 100-F', and the shape of the grooves may correspond to the protrusions P'.
- FIG. 20 and FIG. 21 illustrate how to manufacture the third substrate of the touch sensor of FIG. 18 .
- FIG. 20 illustrates a step in which material making up the third substrate 300' is injected between molds M2' and M3' with grooves formed on them and hardened to form the third substrate.
- the material making up the third substrate 300' may be injected among a fixing mold M1' and molds M2' and M3' with grooves H' formed on them. Thereafter, when forming the third substrate 300' by hardening the material, the protrusions corresponding to the grooves H' may be formed on the third substrate 300'.
- FIG. 21 illustrates a step in which the third substrate 300' is separated from the molds M2' and M3'. As described with reference to FIG. 9 , due to applying external force upon the third substrate 300', the third substrate 300' may be separated from the molds M1', M2', and M3'.
- a third substrate with protrusions 300-p' formed on it there are other methods which may be employed to form a third substrate with protrusions 300-p' formed on it.
- grooves may be formed after manufacturing the third substrate.
- FIG. 22 is a cross-sectional view for describing a touch sensor in accordance with another exemplary embodiment.
- the first groove-formed substrate 100-H" may include spacers Sp1-a" and Sp2-a". Because the spacers Sp2-a” and Sp2-a” restrict the deformation of the first channels LC1-a", short-circuiting of channels due to excessive applied pressure may be prevented. Also, when pressure is applied to the touch sensor, the amount of change in the thickness of the third substrate 300" may be greater than that of change in the thickness of the first substrate 100" or the second substrate 200". Therefore, the gap between the first channels and the second channels may greatly be changed. Thus the sensitivity to changes in the level of current of voltage incurred by pressure may be increased compared to the touch sensor shown in FIG. 1 .
- FIGS. 23 and 24 are cross-sectional views illustrating some of the methods to manufacture the first groove-formed substrate of the touch sensor of FIG. 22 .
- FIG. 23 illustrates a step in which material making up the first groove-formed substrate 100-H" is injected and hardened to form the first groove-formed substrate 100-H".
- FIG. 23 is mostly identical to FIG. 8 . It is different only in that first protrusions P" are not formed in the part corresponding to the spacers A-sp1" and A-sp2".
- FIG. 24 illustrates a step in which a first groove-formed substrate 100-H" is separated from a mold M".
- FIG. 24 is similar to FIG. 9 , and differs only in that spacers SP1-a" and SP2-a" are formed.
- Exemplary embodiments provide a touch sensor and a method of manufacturing the same which form channels that cross each other on a stretchable substrate, each of the channels including a wedge having a round form. Because a conductive liquid is injected into the channel, touch sensitivity may increase due to the wedge, but because there are no bubbles in the channel, damage to the substrate may be prevented.
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Abstract
Description
- Exemplary embodiments relate to a touch sensor and a manufacturing method thereof.
- A touch sensor is an input device which, when touched by a human hand or an object, is capable of recognizing the location of the touch. Along with the advances in the development of smart devices, the usage and requirements for touch sensors are on the rise.
- Recently studies have been underway on flexible displays and stretchable displays. A stretchable touch sensor capable of being used as an interface for a stretchable display has also been under development.
- The above information disclosed in this Background section is only for enhancement of understanding of the background of the inventive concept, and, therefore, it may contain information that does not form the prior art that is already known in this country to a person of ordinary skill in the art.
- Exemplary embodiments provide to a touch sensor and a method of manufacturing the same which form channels that cross each other on a stretchable substrate, where each of the channels includes a wedge having a round form. Because conductive liquid is injected into the channel, touch sensitivity may increase as a result of the wedge. In addition, because there are no bubbles in the channel, damage to the substrate may be prevented.
- Additional aspects will be set forth in the detailed description which follows, and, in part, will be apparent from the disclosure, or may be learned by practice of the inventive concept.
- An exemplary embodiment discloses a touch sensor including a stretchable first substrate having first channels extended in a first direction, a first conductive liquid injected into the first channels, a second stretchable substrate having second channels extended in a second direction crossing the first direction, and a second conductive liquid injected into the second channels.
- An exemplary embodiment also discloses a method for manufacturing a touch sensor including forming a first groove-formed substrate having first grooves, forming a first flat substrate, forming a first substrate having first channels corresponding to the first groove by attaching the first groove-formed substrate and the first flat substrate, and injecting a first conductive liquid into the first channels.
- The foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the claimed subject matter.
- The accompanying drawings, which are included to provide a further understanding of the inventive concept, and are incorporated in and constitute a part of this specification, illustrate exemplary embodiments of the inventive concept, and, together with the description, serve to explain principles of the inventive concept.
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FIG. 1 ,FIG. 2, and FIG. 3 are a perspective exploded view and two cross-sectional views illustrating a touch sensor in accordance with an exemplary embodiment. -
FIG. 4A, FIG. 4B , andFIG. 5 are plan views illustrating an exemplary embodiment of a structure of first channels and second channels of the touch sensor shown inFIG. 1 . -
FIG. 6 is a plan view illustrating an exemplary embodiment of a structure of a wedge of the first channel shown inFIG. 4 . -
FIG. 7, FIG. 8, FIG. 9 ,FIG. 10, FIG. 11, FIG. 12 ,FIG. 13, FIG. 14, FIG. 15 ,FIG. 16, and FIG. 17 are cross-sectional views for describing a method of manufacturing the touch sensor shown inFIG. 1 . -
FIG. 18 is a cross-sectional view for describing a touch sensor in accordance with another exemplary embodiment. -
FIG. 19 is cross-sectional views for describing a method of manufacturing a first flat substrate among the touch sensor shown inFIG. 18 . -
FIG. 20 and FIG. 21 are cross-sectional views for describing a method of manufacturing a third substrate among the touch sensor shown inFIG. 18 . -
FIG. 22 is a cross-sectional view for describing a touch sensor in accordance with another exemplary embodiment. -
FIG. 23 and FIG. 24 are cross-sectional views for describing a method of manufacturing the first groove-formed substrate of the touch sensor shown inFIG. 22 . - In the following description, for the purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of various exemplary embodiments. It is apparent, however, that various exemplary embodiments may be practiced without these specific details or with one or more equivalent arrangements. In other instances, well-known structures and devices are shown in block diagram form in order to avoid unnecessarily obscuring various exemplary embodiments.
- In the accompanying figures, the size and relative sizes of layers, films, panels, regions, etc., may be exaggerated for clarity and descriptive purposes. Also, like reference numerals denote like elements.
- When an element or layer is referred to as being "on," "connected to," or "coupled to" another element or layer, it may be directly on, connected to, or coupled to the other element or layer or intervening elements or layers may be present. When, however, an element or layer is referred to as being "directly on," "directly connected to," or "directly coupled to" another element or layer, there are no intervening elements or layers present. For the purposes of this disclosure, "at least one of X, Y, and Z" and "at least one selected from the group consisting of X, Y, and Z" may be construed as X only, Y only, Z only, or any combination of two or more of X, Y, and Z, such as, for instance, XYZ, XYY, YZ, and ZZ. Like numbers refer to like elements throughout. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
- Although the terms first, second, etc. may be used herein to describe various elements, components, regions, layers, and/or sections, these elements, components, regions, layers, and/or sections should not be limited by these terms. These terms are used to distinguish one element, component, region, layer, and/or section from another element, component, region, layer, and/or section. Thus, a first element, component, region, layer, and/or section discussed below could be termed a second element, component, region, layer, and/or section without departing from the teachings of the present disclosure.
- Spatially relative terms, such as "beneath," "below," "lower," "above," "upper," and the like, may be used herein for descriptive purposes, and, thereby, to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the drawings. Spatially relative terms are intended to encompass different orientations of an apparatus in use, operation, and/or manufacture in addition to the orientation depicted in the drawings. For example, if the apparatus in the drawings is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. Furthermore, the apparatus may be otherwise oriented (e.g., rotated 90 degrees or at other orientations), and, as such, the spatially relative descriptors used herein interpreted accordingly.
- The terminology used herein is for the purpose of describing particular embodiments and is not intended to be limiting. As used herein, the singular forms, "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. Moreover, the terms "comprises," "comprising," "includes," and/or "including," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, components, and/or groups thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
- Various exemplary embodiments are described herein with reference to sectional illustrations that are schematic illustrations of idealized exemplary embodiments and/or intermediate structures. As such, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, are to be expected. Thus, exemplary embodiments disclosed herein should not be construed as limited to the particular illustrated shapes of regions, but are to include deviations in shapes that result from, for instance, manufacturing. The regions illustrated in the drawings are schematic in nature and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to be limiting.
- Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure is a part. Terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense, unless expressly so defined herein.
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FIGS. 1 to 3 are an exploded perspective view and two cross-sectional views illustrating a touch sensor in accordance with an exemplary embodiment.FIG. 1 is an exploded perspective view illustrating the touch sensor;FIG. 2 is a cross-sectional view illustrating the touch sensor viewed along section lines A-A' and B-B' ofFIG. 1 ; andFIG. 3 is a cross-sectional view illustrating the touch sensor viewed along section lines C-C' and D-D'. - Referring to
FIG. 1 , the touch sensor may include afirst substrate 100, asecond substrate 200, and athird substrate 300. Thefirst substrate 100, thesecond substrate 200, and thethird substrate 300 may have a thickness in the direction of a third direction which crosses both a first direction and a second direction. Thefirst substrate 100, thesecond substrate 200, and thethird substrate 300 are separately described for ease of illustration, but in fact, thefirst substrate 100 and thethird substrate 300 may be adhered together, and thethird substrate 300 and thesecond substrate 200 may be adhered together. Thefirst substrate 100 may include first channels LC1 extending in the first direction, and a first conductive liquid may be inserted into thefirst channels LC 1. Thesecond substrate 200 may include second channels LC2 extending in the second direction crossing the first direction, and second conductive liquid may be inserted into the second channels LC2. Thethird substrate 300 may be located between thefirst substrate 100 and thesecond substrate 200. Thefirst substrate 100 and thethird substrate 300 may be adhered together, and thethird substrate 300 and thesecond substrate 200 may be adhered together. Thefirst substrate 100, thesecond substrate 200, and thethird substrate 300 may all be stretchable, and in accordance with an exemplary embodiment, the elastic modulus of thethird substrate 300 may be lower than those of thefirst substrate 100 and thesecond substrate 200. Alternatively, the material making up thefirst substrate 100, thesecond substrate 200, and thethird substrate 300 may be the same, and the elastic moduli of thefirst substrate 100, thesecond substrate 200, and thethird substrate 300 may all be the same. The material making up at least one among thefirst substrate 100 to thethird substrate 300 may include at least one of the groups made up of polydimethylsiloxame (PDMS) or polyurethane, so thefirst substrate 100, thesecond substrate 200, and thethird substrate 300 may all be stretchable. Material making up at least one of the first conductive liquid or the second conductive liquid may include at least one from the group consisting of gallium (Ga) and indium (In). Particularly, if a eutectic gallium-indium alloy (Eutectic Ga-In, EGaIn), which is an alloy of eutectic method of gallium (Ga) and indium (In), is used, a liquid state with low resistivity may be maintained at room temperature because the melting point of the alloy is lower than room temperature, making possible its use as the first conductive liquid or the second conductive liquid. Especially, the melting point is lower than 16° C, 12° C or 5° C. - The
first substrate 100, thesecond substrate 200, and thethird substrate 300 will be explained in more detail with reference toFIGS. 2 and 3 . Thefirst substrate 100 may include a first groove-formed substrate 100-H and a first flat substrate 100-F, and thesecond substrate 200 may include a second groove-formed substrate 200-H and a second flat substrate 200-F. - Referring to
FIG. 2 , first grooves may be formed on the first groove-formed substrate 100-H. A detailed explanation of the first groove-formed substrate 100-H will be given with reference toFIG. 9 . The first flat substrate 100-F may be adhered to the first groove-formed substrate 100-H so that the first grooves are blocked from outside, and first holes may be formed on the first flat substrate 100-F. First electrodes may be inserted into the first holes. For ease of illustration, it may be assumed that the actual locations of A and A' within the device correspond to the locations ofB and B', and that only ath (where a is a natural number) first channel LC1-a among all first channels are shown here. Therefore, inFIG. 2 , a first hole H1-a among all the first holes is shown as a representative of the first holes, and a first electrode EC1-a among all the first electrodes are shown as a representative of the first electrodes. The first electrode EC1-a may be arranged between the first flat substrate 100-F and thethird substrate 300. When the touch sensor is driven, at least one of the first electrodes, for example the first electrode EC1-a, may be supplied with a pre-set voltage. When the first substrate ofFIG. 1 is sectioned along A-A', the first channel LC1-a is divided by a greater number, but for ease of illustration, the first channel LC1-a is divided by a smaller number. - Referring to
FIG. 3 , second grooves may be formed on the second groove-formed substrate 200-H. The second flat substrate 200-F may be adhered to the second groove-formed substrate 200-H so that the second grooves are blocked from outside, and second holes are formed on the second flat substrate 200-F. Second electrodes may be inserted into the second holes. For ease of illustration, it may be assumed that the actual locations of C and C' within the device correspond to the locations of D and D', and that only bth (where b is a natural number) second channel LC2-b among all second channels is shown here. Therefore, inFIG. 3 , a second hole H2-b among all the second holes is shown as a representative of the second holes, and a second electrode EC2-b among all the second electrodes is shown a representative of the second holes. The second electrode EC2-b may be arranged between the second flat substrate 200-F and thethird substrate 300. - The touch sensor described with reference to
FIGS. 1 to 3 may detect touch in various ways. For example, when conductive material is touched, capacitance may be changed by the touch. Even when the same voltage is supplied by the first electrodes by changes in capacitance, levels of current or voltage measured by the second electrodes may be changed. In other words, a touch sensor in accordance with an exemplary embodiment may detect changes in current or voltage incurred by touch by conductive material. In addition or as an alternative, when pressure is applied to the touch sensor, the thickness T3 in the third direction of the point on thethird substrate 300 on which the pressure is applied may be changed, and the gap between the first channels LC1 and the second channels LC2 may be changed. Capacitance may be changed due to changes in the gap, and thus, levels of current or voltage measured by the first electrodes and the second electrodes may be changed. In other words, a touch sensor in accordance with an exemplary embodiment may detect changes in current or voltage incurred by pressure. When a touch sensor in accordance with an exemplary embodiment is used, if it is lightly touched by conductive material and the capacitance is changed, or if, regardless of material, the thickness of the point on thethird substrate 300 on which pressure is applied is changed by the pressure, the location of the touch, or the location of the point where the thickness has been changed, may be calculated. When thesecond substrate 200 shown inFIG. 1 is sectioned along D-D', the second channel LC2-b may be divided by a greater number, but for ease of illustration, the second channel LC2-b is divided by a smaller number. -
FIGS. 4A, 4B , and5 are plan views for describing an exemplary embodiment of a structure of the first channels and the second channels of the touch sensor ofFIG. 1 .FIGS. 4A and 4B are plan views illustrating an exemplary embodiment of a structure of the first channels of the touch sensor shown inFIG. 1 , andFIG. 5 is a plan view for illustrating an exemplary embodiment of a structure of the second channels of the touch sensor ofFIG. 1 . - In
FIGS. 4A and 4B , only two neighboring first channels among all the first channels are shown for ease of illustration. The first channel LC1-a may include a plurality of straight channels and wedges, and for ease of illustration, only straight channels LC1-a-s-1 and LC1-a-s-2 and a wedge LC1-a-w-1 will be given as examples. Also, regarding the first channel LC1-(a+1), only the wedge LC1-(a+1)-w-2 will be explained. The straight channels LC1-a-s-1 and LC1-a-s-2 may extend in the second direction. In addition, the wedge LC1-a-w-1 of the first channel LC1-a and the wedge LC1-(a+1)-w-2 of the first channel LC1-(a+1), which are adjacent to each other, may be separated by a distance D. The wedge LC1-a-w-1 may be a first wedge, and the wedge LC1-a+1-w-2 may be a second wedge. The distance D may be equal to or greater than 150µm and less than or equal to 200µm. When the distance D is less than 150µm, the distance between the side walls between the first channel LC1-a and the second channel LC1-(a+1) may become undesirably short, increasing the chance for the touch sensor to easily break. When the distance D is greater than 200µm, the accuracy of the touch sensor may decrease. The wedge LC1-a-w-1 will be explained in more detail with reference toFIG. 6 . - In
FIG. 5 , only the second channel LC2-b among all the second channels is shown for ease of illustration. The second channel LC2-b may include multiple straight channels and wedges, but for ease of illustration, only straight channels LC2-b-s-1 and LC2-b-s-2 and wedges LC2-b-w-1 and LC2-b-w-2 will be given as examples. The straight channels LC2-b-s-1 and LC2-b-s-2 may extend in the first direction. -
FIG. 6 is a plan view for describing an exemplary embodiment of a structure of a wedge of the first channel shown inFIG. 4 . - In
FIG. 6 , only straight channels LC1-a-s-1 and LC1-a-s-2 and a wedge LC1-a-w-1 are shown. The straight channel LC1-a-s-1 may have a width in the first direction, and the width may be equal to or greater than 80µm and less than or equal to 300µm. The wedge LC1-a-w-1 may include a round part, and the round part may include an inner round portion R-I and an outer round portion R-O. The contact angle may be defined as the angle formed between a surface of a solid and a liquid when the liquid is in contact with the surface of the solid, and its value may be changed depending on the kind of conductive liquid and material making up the first substrate. When the wedge LC1-a-w-1 does not have an outer round portion R-O, slopes of the wedge LC1-a-w-1 may meet, forming an angle greater than 0 degrees (e.g., 22 to 45 degrees). If this angle is less than the contact angle between the first channels and the first conductive liquid, not all of the conductive liquid may be injected into the interface, and bubbles may be formed in the first channels. When bubbles are in the channels, the amount of the conductive liquid may decrease, leading to a reduced sensitivity to touch and possible destruction of the touch sensor due to the bubbles. However, as a wedge LC1-a-w-1 has an outer round portion R-O, slopes of the wedge LC1-a-w-1 may not meet forming an angle greater than 0 degrees. In other words, the inner contour of the wedge respective the wedge-shaped channel, at least at the narrow end, may be continuous or steady, i.e. without any peak forming an angle. In addition, because the wedge LC1-a-w-1 has an inner round portion R-I, the interface where the straight channels LC1-a-s-1 and LC1-a-s-2 and the wedge LC1-a-w-1 may not form an angle greater than 0 degrees (for example, 22 to 45 degrees). Again in other words, the inner contour of the wedge respective the wedge-shaped channel in the region connecting the straight channels opening out into the wedge may be continuous or steady, i.e. without any peak forming an angle. Therefore, all the conductive liquid may be injected into the interface, so no bubbles may form in the channels. All of the conductive liquid may be injected into the inner round portion R-I, and it may be injected into the outer round portion R-O when certain requirements for the radius of curvature (ROC) of the outer round portion R-O are met. In other words, wedges with round shapes may be included, and conductive liquid may be injected into that channel, so sensitivity to touch may be improved by the wedge, but there may be no damage to the substrate as there are no bubbles in the channel. - The wedge LC1-a-w-1 may have a length L in the second direction. When the length L is less than 150µm, channel resistance may increase causing RC delay to worsen, and when the length L is greater than 600µm, the round part may become excessively large, causing channel sensitivity to decrease.
- When the ROC is less than half of the width W of the straight channels LC1-a-s-1 and LC1-a-s-2, the outer round portion R-O may be excessively bent, which may cause all of the conductive liquid not to be injected into the outer round portion R-O, leading to the formation of bubbles. When there are bubbles present, the detecting sensitivity of the entire touch sensor may be decreased, and the touch sensor may be damaged. When the ROC of the outer round portion R-O is greater than 63% of the width W of the straight channels LC1-a-s-1 and LC1-a-s-2, the outer round portion R-O may become too flat, the length of the channels may be increased, leading to an increase in resistance. As a result, the sensitivity of the touch sensor may be decreased. In other words, to provide a preferable embodiment, the ROC of the outer round portion R-O may be expressed as the equation below:
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FIGS. 7 to 17 are cross-sectional views for describing a method of manufacturing the touch sensor shown inFIG.1 .FIGS. 7 to 14 are cross-sectional views for describing a method of manufacturing the first substrate, andFIGS. 15 and16 are cross-sectional views for describing a method of manufacturing the third substrate. A method of manufacturing the second substrate may be described with reference toFIGS. 7 to 14 . -
FIG. 7 illustrates steps in forming first protrusions P on a mold M. The shape of the first protrusions P may correspond to the shape of the first channels LC1 and the shape of the first grooves of the first groove-formed substrate 100-H, and the material making up the protrusions P may be a material that is photosensitive and stackable to a substantial thickness. For example, SU-8, etc., may be included. The mold M may take the shape of a container later in order to hold fluid. -
FIG. 8 illustrates a step in which material making up the first groove-formed substrate 100-H is injected into a mold M with the first protrusions P formed on it, is hardened, and forms the first groove-formed substrate 100-H. Material making up the first groove-formed substrate 100-H, for example polydimetylsiloxane (PDMS), may flow and be included as a liquid, However, if heat, ultraviolet rays, etc. are applied, material making up the first groove-formed substrate 100-H may be hardened (curing). The first groove-formed substrate 100-H may be formed by putting the material making up the first groove-formed substrate 100-H into a mold M with the shape of a container and with the first protrusions P formed on it and hardening using the eternal environment (heat, ultraviolet rays, etc.). In other words, it may be hardened as the first grooves corresponding to the first protrusions P are formed. -
FIG. 9 illustrates a step in which the first groove-formed substrate 100-H is detached from the mold M. Applying external force onto the first groove-formed substrate 100-H may separate the mold M from the first groove-formed substrate 100-H, and the protrusions from the first groove-formed substrate 100-H. The steps shown inFIGS. 7 to 9 may correspond to the steps of forming the first groove-formed substrate 100-H. The first grooves H of the first groove-formed substrate 100-H may correspond to the shape of the first protrusions P, and the thickness TH in the third direction of the first grooves H may correspond to the height in the third direction of thefirst channels LC 1. -
FIG. 10 illustrates a step in which liquid material making up the first flat substrate 100-F is poured into the mold M and is hardened. Material making up the first flat substrate 100-F may possess the same characteristics as material making up the first groove-formed substrate 100-H. Thus, repeated description may be omitted. The first flat substrate 100-F may be formed by pouring the material making up the first flat substrate 100-F into the mold M having the shape of a container and by hardening it by the external environment (heat, ultraviolet rays, etc.) Because the surface of the mold M touching material making up the first groove-formed substrate does not have any protrusions or grooves, the first flat substrate 100-F may have a flat shape. -
FIG. 11 illustrates a step in which the first flat substrate 100-F is detached from the mold M. Just like in the case of the first groove-formed substrate 100-H, application of external force onto the first flat substrate 100-F may separate the mold M and the first flat substrate 100-F. The steps shown inFIGS. 10 and 11 may correspond to the step in which the first flat substrate is formed. -
FIG. 12 illustrates a first adherence step in which the first groove-formed substrate 100-H and the first flat substrate 100-F are adhered together to form the first substrate with the first channels formed on it. The first groove-formed substrate 100-H and the first flat substrate 100-F may be arranged in such a way that they are touching each other, applied heat to, and adhered together. Or the surface of the first groove-formed substrate 100-H which is to be attached and the surface of the first flat substrate 100-F which is to be attached may be applied with material making up the first groove-formed substrate 100-H before it is hardened. When heat or ultraviolet rays are applied, the material making up the first groove-formed substrate 100-H may be hardened, and the first groove-formed substrate 100-H and the first flat substrate 100-F may be adhered together. Alternatively, when material making up the first groove-formed substrate 100-H and material making up the first flat substrate 100-F are the same, the surfaces of the first groove-formed substrate 100-H and the first flat substrate 100-F may be oxygen plasma-treated, and the first groove-formed substrate 100-H and the first flat substrate 100-F may be arranged in such a way that they are touching each other. When the oxygen plasma-treated surfaces of the first groove-formed substrate 100-H and the first flat surface 100-F touch each other, the first groove-formed substrate 100-H and the first flat substrate 100-F may be adhered together. The first channels LC1 may be formed by the first groove-formed substrate 100-H and the first flat substrate 100-F being adhered together. -
FIG. 13 illustrates a step in which first holes and temporary holes are formed in the first channels LC1, and first electrodes are inserted into the first holes. The first holes and the temporary holes may be formed in the first channels, and the first electrodes may be inserted into the first holes. Because only the ath first channel LC1-a is shown inFIG. 13 , only a first hole H1-a among all the first holes is shown, only a temporary hole HT-a among all the temporary holes is shown, and only a first electrode EC1-a among all the first electrodes is shown in the figure. Also, in accordance with an exemplary embodiment, the temporary holes may not be formed. InFIG. 13 , the first electrode EC1-a may not be fixed with respect to thefirst substrate 100. In addition, tubes (not shown) may be inserted into the first and temporary holes to inject the first conductive liquid into or to take air out of the first channels LC1. In this case, the first electrode EC1-a may be provided within one of the tubes. -
FIG. 14 illustrates a step in which the first conductive liquid is injected into the first channels through the first holes and gas is taken out of the first channels through the temporary holes. For ease of illustration, explanations only regarding the first channel LC1-a among all the first channels LC1 will be given. The first conductive liquid from one of the tubes inserted into the first hole H1-a may be injected into the first channel LC1-a. Concurrently, the air existent in the first channel LC1-a may be taken out of the first channel LC1-a through one (not shown) of the tubes inserted into the temporary hole HT-a. When using this method, no air may be left in the first channels LC1, making preventing the lowering of the sensitivity of the touch sensor and damage to the touch sensor due to bubbles. -
FIGS. 15 and16 illustrate a method of manufacturing the third substrate. -
FIG. 15 illustrates a step in which liquefied material making up thethird substrate 300 is poured into the mold and hardened. Since this is very similar to the step described with reference toFIG. 10 , in which liquefied material making up the first flat substrate 100-F is poured and hardened is very similar, the description thereof will be omitted. Material making up thethird substrate 300 and capable of being included in fluid may be put into a mold M with the shape of a container and hardened by the external environment (heat, ultraviolet rays, etc.) to form thethird substrate 300. In accordance with an exemplary embodiment, even when the material making up thefirst substrate 100, thesecond substrate 200, and thethird substrate 300 may be the same, as thethird substrate 300 is porous, the elastic modulus of thethird substrate 300 may be lower than those of thefirst substrate 100 and thesecond substrate 200. Particularly, the material making up the third substrate 300 (for example, PDMS) may be poured into the mold M and stirred around to form foam. In order to form foam, other material (for example, water) may additionally be injected into the mold M. Hardening material with foam formed may lead to the formation of a porousthird substrate 300. -
FIG. 16 illustrates a step in which thethird substrate 300 is separated from the mold M. As in the case of the first groove-formed substrate 100-H, the mold M and thethird substrate 300 may be separated by applying external force to thethird substrate 300. -
FIG. 17 illustrates a third adhesion step in which the first substrate and the third substrate are adhered together. When material making up thefirst substrate 100 and thethird substrate 300 is the same, thefirst substrate 100 and thethird substrate 300 may be adhered together through the methods described with reference toFIG. 12 . The first and the temporary holes may be isolated from outside by thethird substrate 300. In other words, the first conductive liquid injected into the first channels LC1 may not come outside. - After
FIG. 17 , thethird substrate 300 and thesecond substrate 200 may be adhered together through the methods described with reference toFIG. 12 . The second holes may be isolated from outside by thethird substrate 300. In other words, the second conductive liquid injected into the second channels LC2 may not come outside. After the adhesion of thethird substrate 300 and thesecond substrate 200, the touch sensor shown inFIGS. 1 to 3 may be obtained. It may be desirable for the first channels LC1 to extend in the first direction and for the second channels LC2 to extend in the second direction which crosses the first direction. If thethird substrate 300 and thesecond substrate 200 are adhered together, the touch sensor described with reference toFIGS. 1 to 3 may be completed. -
FIG. 18 is a cross-sectional view for describing illustrates a touch sensor in accordance with another exemplary embodiment. The touch sensor may include a first substrate 100', a second substrate 200', and a third substrate 300'. The third substrate 300' of the touch sensor shown inFIG. 18 , unlike the one shown inFIG. 2 and FIG. 3 , may include protrusions 300-p'. When the elastic modulus of the third substrate 300' is lower than those of the first substrate 100' and the second substrate 200', and when the third substrate 300' includes protrusions 300-p', the degree that the protrusions 300-p' are deformed may be greater than a degree of deformation of the ath first channel LC1-a', in the case a pressure is applied to the touch sensor. Therefore, the risk of a short circuit due to blockage in channels may decrease as the degree to which the first channels LC1-a' are deformed is reduced when the pressure is applied. -
FIG. 19 is cross-sectional views for describing a method of manufacturing the first flat substrate of the touch sensor ofFIG. 18 . UnlikeFIG. 10 , protrusions P' may be formed on the mold M, and the material making up the first flat substrate 100-F' and which may belong to liquid may be injected and hardened. Grooves may be formed on the first flat substrate 100-F', and the shape of the grooves may correspond to the protrusions P'. -
FIG. 20 and FIG. 21 illustrate how to manufacture the third substrate of the touch sensor ofFIG. 18 . -
FIG. 20 illustrates a step in which material making up the third substrate 300' is injected between molds M2' and M3' with grooves formed on them and hardened to form the third substrate. The material making up the third substrate 300' may be injected among a fixing mold M1' and molds M2' and M3' with grooves H' formed on them. Thereafter, when forming the third substrate 300' by hardening the material, the protrusions corresponding to the grooves H' may be formed on the third substrate 300'. -
FIG. 21 illustrates a step in which the third substrate 300' is separated from the molds M2' and M3'. As described with reference toFIG. 9 , due to applying external force upon the third substrate 300', the third substrate 300' may be separated from the molds M1', M2', and M3'. - In addition to the methods described above, there are other methods which may be employed to form a third substrate with protrusions 300-p' formed on it. For example, as described with reference to
FIGS. 15 and16 , grooves may be formed after manufacturing the third substrate. -
FIG. 22 is a cross-sectional view for describing a touch sensor in accordance with another exemplary embodiment. In a touch sensor with reference toFIG. 22 , the first groove-formed substrate 100-H" may include spacers Sp1-a" and Sp2-a". Because the spacers Sp2-a" and Sp2-a" restrict the deformation of the first channels LC1-a", short-circuiting of channels due to excessive applied pressure may be prevented. Also, when pressure is applied to the touch sensor, the amount of change in the thickness of thethird substrate 300" may be greater than that of change in the thickness of thefirst substrate 100" or thesecond substrate 200". Therefore, the gap between the first channels and the second channels may greatly be changed. Thus the sensitivity to changes in the level of current of voltage incurred by pressure may be increased compared to the touch sensor shown inFIG. 1 . -
FIGS. 23 and 24 are cross-sectional views illustrating some of the methods to manufacture the first groove-formed substrate of the touch sensor ofFIG. 22 . -
FIG. 23 illustrates a step in which material making up the first groove-formed substrate 100-H" is injected and hardened to form the first groove-formed substrate 100-H".FIG. 23 is mostly identical toFIG. 8 . It is different only in that first protrusions P" are not formed in the part corresponding to the spacers A-sp1" and A-sp2". -
FIG. 24 illustrates a step in which a first groove-formed substrate 100-H" is separated from a mold M".FIG. 24 is similar toFIG. 9 , and differs only in that spacers SP1-a" and SP2-a" are formed. - Exemplary embodiments provide a touch sensor and a method of manufacturing the same which form channels that cross each other on a stretchable substrate, each of the channels including a wedge having a round form. Because a conductive liquid is injected into the channel, touch sensitivity may increase due to the wedge, but because there are no bubbles in the channel, damage to the substrate may be prevented.
- Although certain exemplary embodiments and implementations have been described herein, other embodiments and modifications will be apparent from this description. Accordingly, the inventive concept is not limited to such embodiments, but rather to the broader scope of the presented claims and various obvious modifications and equivalent arrangements.
Claims (20)
- A touch sensor comprising:a first stretchable substrate (100, 100', 100") comprising first channels (LC1, LC1-a, LC1-a', LC1-a") extended in a first direction;a first conductive liquid injected into the first channels (LC1, LC1-a, LC1-a', LC1-a");a second stretchable substrate (200, 200', 200") comprising second channels (LC2, LC2 b) extended in a second direction crossing the first direction; anda second conductive liquid injected into the second channels (LC2, LC2-b).
- The touch sensor as claimed in claim 1, wherein:at least one of the first channels (LC1, LC1-a, LC1-a', LC1-a") or the second channels (LC2, LC2-b) comprises straight lines and wedges, and at least one of the wedges comprises a round part;the round part comprises an inner round portion (R-I) and an outer round portion (R-O); and
- The touch sensor as claimed in claim 1 or 2, wherein:two adjacent first channels among the first channels (LC1, LC1-a, LC1-a', LC1-a") comprise a first wedge (LC1-a-w-1) and a second wedge (LC1-(a+1)-w-2), respectively;the first wedge (LC1-a-w-1) and the second wedge (LC1-(a+1)-w-2) are adjacent to each other;at least one of a length (L) in the second direction of the first wedge (LC1-a-w-1) and the second wedge (LC1-(a+1)-w-2) is greater than or equal to 150µm and less than or equal to 600µm; anda distance (D) between the first wedge (LC1-a-w-1) and the second wedge (LC1-(a+1)-w-2) is greater than or equal to 150µm and less than or equal to 200µm.
- The touch sensor as claimed in one of claims 1 to 3, wherein the touch sensor further comprises:first electrodes (EC1-a) inserted into first holes formed at one end of the first channels (LC1, LC1-a, LC1-a', LC1-a"); andsecond electrodes (EC2-a) inserted into second holes formed at one end of the second channels (LC2, LC2-b),wherein the touch sensor is adapted such thatwhen a voltage having a preset level is supplied to at least one of the first channels (LC1, LC1-a, LC1-a', LC1-a");at least one level of current or voltage among the second electrodes (EC2-a) is changed due to a change in capacitance when a conductive material touches the touch sensor; anda touch position is detected based on the change in level of the current or voltage.
- The touch sensor as claimed in claim 4, wherein:the touch sensor further comprises a third stretchable substrate (300, 300', 300") disposed between the first stretchable substrate (100, 100', 100") and the second stretchable substrate (200, 200', 200"); andthe third substrate (300, 300', 300") blocks the first holes and the second holes from outside.
- The touch sensor as claimed in claim 5, wherein:the third stretchable substrate (300, 300', 300") has a thickness in a third direction crossing the first direction and the second direction; and the touch sensor is adapted such thatwhen an external force is applied to the touch sensor, the capacitance between the first conductive liquid and the second conductive liquid changes as a result of the change in the thickness, the level of current or voltage measured by the first electrodes (EC1-a) or the second electrodes (EC2-a) is changed as a result of the change in the capacitance, and the touch position is detected based on the change in the level of the current or voltage.
- The touch sensor as claimed in claim 5 or 6, wherein:a material forming at least one ofthe first stretchable substrate (100, 100', 100") to the third substrate (300, 300', 300") comprises at least one from a group consisting of polydimethylsiloxane (PDMS) or polyurethane; anda material forming at least one of the first conductive liquid or the second conductive liquid includes at least one from a group consisting of gallium (Ga) or indium (In).
- The touch sensor as claimed in one of claims 5 to 7, wherein:an elastic modulus of the third substrate (300, 300', 300") is lower than an elastic modulus of the first substrate (100, 100', 100") and an elastic modulus of the second substrate (200, 200', 200"); andthe third substrate (300, 300', 300") is porous.
- The touch sensor as claimed in one of claims 5 to 8, wherein the third substrate (300, 300', 300") comprises a protrusion (300-p') facing the first substrate (100, 100', 100") and/or the second substrate (200, 200', 200").
- The touch sensor as claimed in one of claims 4 to 9, wherein:the first stretchable substrate (100, 100', 100") comprises:a first groove-formed substrate (100-H, 100-H', 100-H") comprising first grooves that are a portion ofthe first channels (LC1, LC1-a, LC1-a', LC1-a"); anda first flat substrate (100-F, 100-F', 100-F") attached to the first groove-formed substrate (100-H, 100-H', 100-H") and configured to block the first grooves from outside and comprising the first holes; andthe second substrate (200, 200', 200") comprises:a second groove-formed substrate (200-H, 200-H', 200-H") comprising second grooves that are a portion of the second channels (LC2, LC2-b); anda second flat substrate (200-F, 200-F', 200-F") attached to the second groove-formed substrate (200-H, 200-H', 200-H") and configured to block the second grooves from outside and comprising the second holes.
- The touch sensor as claimed in claim 10, wherein at least one of the first groove-formed substrate (100-H, 100-H', 100-H") and the second groove-formed substrate (200-H, 200-H', 200-H") further comprises a spacer (Sp1-a", Sp2-a") configured to restrict deforming ofthe first channels (LC1, LC1-a, LC1-a', LC1-a") or the second channels (LC2, LC2-b).
- A method for manufacturing a touch sensor, the method comprising:forming a first groove-formed substrate (100-H, 100-H', 100-H") comprising first grooves;forming a first flat substrate (100-F, 100-F', 100-F");forming a first substrate (100, 100', 100") comprising first channels (LC1, LC1-a, LC1-a', LC1-a") corresponding to the first groove by attaching the first groove-formed substrate (100-H, 100-H', 100-H") and the first flat substrate (100-F, 100-F', 100-F"); andinjecting a first conductive liquid into the first channels (LC1, LC1-a, LC1-a', LC1-a").
- The method as claimed in claim 12, wherein:at least one of the first channels (LC1, LC1-a, LC1-a', LC1-a") comprises straight lines and wedges, each of the wedges comprising a round part;the round part comprises an inner round portion (R-I) and an outer round portion (R-O); and
- The method as claimed in claim 12 or 13, wherein the forming of the first groove-formed substrate (100-H, 100-H', 100-H") comprises:forming the first groove-formed substrate (100-H, 100-H', 100-H");forming first protrusions (P) on a mold;injecting a material forming the first groove-formed substrate (100-H, 100-H', 100-H") into the mold comprising the first protrusions (P);forming the first groove-formed substrate (100-H, 100-H', 100-H") by hardening the injected material; andseparating the first groove-formed substrate (100-H, 100-H', 100-H") and the mold,wherein a shape of the first protrusions (P) corresponds to the first grooves.
- The method as claimed in one of claims 12 to 15, further comprising:forming a second groove-formed substrate (200-H, 200-H', 200-H") comprising second grooves;forming a second flat substrate (200-F, 200-F', 200-F");forming a second substrate (200, 200', 200") comprising second channels (LC2, LC2-b) corresponding to the second groove by attaching the second groove-formed substrate (200-H, 200-H', 200-H") and the second flat substrate (200-F, 200-F', 200-F");injecting a second conductive liquid into the second channels (LC2, LC2-b); andfixing the first substrate (100, 100', 100") onto the second substrate (200, 200', 200"), wherein, in the fixing, the first channels (LC1, LC1-a, LC1-a', LC1-a") and the second channels (LC2, LC2-b) are fixed such that the first channels (LC1, LC1-a, LC1-a', LC1-a") extend in a first direction and the second channels (LC2, LC2-b) extend in a second direction crossing the first direction.
- The method as claimed in claim 15, wherein:the fixing comprises:forming a third substrate (300, 300', 300");attaching the first substrate (100, 100', 100") and the third substrate (300, 300', 300"); andattaching the third substrate (300, 300', 300") and the second substrate (200, 200', 200"); andthe third substrate (300, 300', 300") has a thickness in a third direction crossing the first direction and the second direction.
- The method as claimed in claim 16, wherein the forming of the third substrate (300, 300', 300") comprises:injecting a material forming the third substrate (300, 300', 300") into a mold and forming bubbles;forming the third substrate (300, 300', 300") by hardening the material; andseparating the third substrate (300, 300', 300") from the mold.
- The method as claimed in claim 16, wherein the forming of the third substrate (300, 300', 300") comprises:injecting a material forming the third substrate (300, 300', 300") between molds comprising grooves;forming the third substrate (300, 300', 300") by hardening the material; andseparating the third substrate (300, 300', 300") from the molds.
- The method as claimed in one of claims 16 to 18, wherein the injecting of the first conductive liquid comprises:forming first holes at one end of the first channels (LC1, LC1-a, LC1-a', LC1-a"), forming temporary holes at the other end of the first channels (LC1, LC1-a, LC1-a', LC1-a"), and inserting first electrodes (EC1-a) into the first holes; andinjecting the first conductive liquid into the first channels (LC1, LC1-a, LC1-a', LC1-a") through the first holes and discharging gas in the first channels (LC1, LC1-a, LC1-a', LC1-a") through the temporary holes.
- The method as claimed in claim 19, wherein, in the attaching of the first substrate (100, 100', 100") and the third substrate (300, 300', 300"), the first holes are blocked from outside by the third substrate (300, 300', 300").
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US (2) | US10558303B2 (en) |
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KR102594615B1 (en) | 2017-12-13 | 2023-10-30 | 삼성디스플레이 주식회사 | An input sensing unit and a display device including the same |
CN109326221B (en) * | 2018-09-25 | 2021-09-28 | 上海天马微电子有限公司 | Display device and tactile feedback display method for display device |
CN109638043A (en) * | 2018-12-03 | 2019-04-16 | 武汉华星光电半导体显示技术有限公司 | Flexible Organic Light Emitting Diode (OLED) display base plate and preparation method thereof |
US11017915B2 (en) * | 2019-01-23 | 2021-05-25 | Carnegie Mellon University | Stretchable electronics and methods of making the same |
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DE202007005237U1 (en) | 2006-04-25 | 2007-07-05 | Philipp, Harald, Southampton | Touch-sensitive position sensor for use in control panel, has bus bars arranged at distance to substrate, and detection region with units that are arranged at distance by non-conductive openings such that current flows into region |
US20140152611A1 (en) | 2012-06-01 | 2014-06-05 | Tactus Technology, Inc. | User interface |
KR20130141344A (en) * | 2010-04-19 | 2013-12-26 | 택투스 테크놀로지, 아이엔씨. | Method of actuating a tactile interface layer |
JP5606242B2 (en) * | 2010-09-24 | 2014-10-15 | 株式会社ジャパンディスプレイ | Display device |
US9228822B2 (en) * | 2011-01-24 | 2016-01-05 | President And Fellows Of Harvard College | Non-differential elastomer curvature sensor |
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US9239346B2 (en) * | 2012-01-28 | 2016-01-19 | The Regents Of The University Of California | Systems for providing electro-mechanical sensors |
KR101585934B1 (en) | 2013-04-03 | 2016-01-15 | 어보브반도체 주식회사 | Capacitive type touch panel |
WO2015048530A1 (en) * | 2013-09-26 | 2015-04-02 | Tactus Technology, Inc. | Touch sensor |
KR102199213B1 (en) | 2014-03-03 | 2021-01-07 | 삼성디스플레이 주식회사 | Touch panel and display apparatus including the same |
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US20200174600A1 (en) | 2020-06-04 |
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