EP3136510B1 - Improvement of the adhesion of connecting elements soldered to a metal substrate by means of soldering paste - Google Patents

Improvement of the adhesion of connecting elements soldered to a metal substrate by means of soldering paste Download PDF

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Publication number
EP3136510B1
EP3136510B1 EP15002499.0A EP15002499A EP3136510B1 EP 3136510 B1 EP3136510 B1 EP 3136510B1 EP 15002499 A EP15002499 A EP 15002499A EP 3136510 B1 EP3136510 B1 EP 3136510B1
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EP
European Patent Office
Prior art keywords
substrate
adhesion
connector element
soldered
connecting elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
EP15002499.0A
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German (de)
French (fr)
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EP3136510A1 (en
Inventor
Brigitta Funk
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Individual
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Individual
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Priority to EP15002499.0A priority Critical patent/EP3136510B1/en
Priority to DE202015107004.7U priority patent/DE202015107004U1/en
Publication of EP3136510A1 publication Critical patent/EP3136510A1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
    • H01R9/16—Fastening of connecting parts to base or case; Insulating connecting parts from base or case
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H01R4/028—Soldered or welded connections comprising means for preventing flowing or wicking of solder or flux in parts not desired

Definitions

  • the invention relates to the optimum shaping of connecting elements [ Fig. 1 ], which are soldered by means of a solder paste [a] on a metallic substrate [b].
  • Such fasteners are usually designed as screw [c] or connectors.
  • screw connections these are predominantly loaded with a torque [d], in the case of plug connections, however, usually with a tilting moment [e].
  • the load capacity depends directly on the quality of the solder joint, ie on the adhesion of the connecting element on the substrate.
  • soldering Another difficulty of soldering is that these connecting elements have a relatively large mass, therefore, the thermal energy expenditure for melting the solder paste is relatively high. If the solder joint is not supplied with sufficient thermal energy, so-called cold solder joints are formed which greatly reduce the adhesion of the connector to the substrate.
  • an SMD component which is soldered by means of solder paste on a printed circuit board.
  • the SMD component in this case comprises a foot portion and a tapered portion adjacent thereto with a smaller cross section, wherein the foot portion has a surface facing the substrate, which is soldered by means of the solder paste on the metallic substrate.
  • a pressfit component with a foot section known from the display.
  • SMD components are in the US 6,623,283 B1 or the DE 10 2012 021 323 A1 disclosed.
  • a fundamental disadvantage of the known SMD components is that the mechanical load capacity of the solder joint is severely limited, especially in a torsional load.
  • the aim of the present invention is to improve the adhesion and thus the mechanical strength of the soldered connection element in that the wettable surface is increased by appropriate shaping with the same base area and / or anchors are attached to the connecting element or on the substrate to the mechanical strength to increase.
  • the desired enlargement of the solderable surface is achieved by providing vertical grooves [k] on the periphery of the connecting element associated with the soldering surface.
  • the molten solder rises [I] on the flanks of the grooves [k], [h] and on the walls of the holes, thereby additionally increasing the effectively soldered surface and thus improving the adhesion of the connecting elements to the substrate [b] becomes.
  • grooves [h] and / or bores [i] on the solder side of the connecting element and / or on the substrate, it can additionally be achieved that the flux gases are collected and discharged to the outside, therefore no more disruptive gas bubbles can form, which would reduce the soldered surface.

Description

Beschreibungdescription

Die Erfindung bezieht sich auf die optimale Formgebung von Verbindungselementen [Fig. 1], welche mittels einer Lotpaste [a] auf ein metallisches Substrat [b] gelötet werden. Solche Verbindungselemente werden üblicherweise als Schraub- [c] oder Steckverbindungen ausgeführt. Bei Schraubverbindungen werden diese vorwiegend mit einem Drehmoment [d], bei Steckverbindungen hingegen meist mit einem Kippmoment [e] belastet. Die Belastbarkeit hängt direkt von der Qualiät der Lötverbindung ab, also von der Haftung des Verbindungselements auf dem Substrat.The invention relates to the optimum shaping of connecting elements [ Fig. 1 ], which are soldered by means of a solder paste [a] on a metallic substrate [b]. Such fasteners are usually designed as screw [c] or connectors. In the case of screw connections, these are predominantly loaded with a torque [d], in the case of plug connections, however, usually with a tilting moment [e]. The load capacity depends directly on the quality of the solder joint, ie on the adhesion of the connecting element on the substrate.

Die grundsätzliche Problematik bei Lötungen von großflächigen Teilen besteht darin, dass das in der Lotpaste enthaltene Flussmittel beim Lötvorgang Gase bildet, die in nur sehr geringem Maße seitlich und dies meist explosionsartig entweichen können. Der Großteil der Gase sammelt sich in Form von Gasblasen [Fig.2, f] zwischen dem metallischen Substrat und dem Verbindungselement. Diese Gasblasen bewirken, dass die gelötete Kontaktfläche reduziert und somit naturgemäß die Haftung des auf dem metallischen Substrat gelöteten Verbindungselements verringert wird. Folglich reduziert sich wiederum die mechanische Belastbarkeit in Bezug auf das maximal anwendbare Dreh- und Kippmoment.The fundamental problem with soldering of large-area parts is that the flux contained in the solder paste during the soldering process forms gases that can escape sideways in a very small extent and this usually explosively. Most of the gases accumulate in the form of gas bubbles [ Fig.2 , f] between the metallic substrate and the connecting element. These gas bubbles cause the soldered contact surface to be reduced and thus, of course, the adhesion of the soldered onto the metallic substrate connecting element is reduced. Consequently, in turn reduces the mechanical load capacity with respect to the maximum applicable turning and tilting torque.

Eine weitere Schwierigkeit der Lötung besteht darin, dass diese Verbindungselemente eine relativ große Masse besitzen, daher der thermische Energieaufwand zum Schmelzen der Lotpaste relativ hoch ist. Wenn die Lötstelle nicht mit ausreichend thermischer Energie versorgt wird, dann entstehen sogenannte kalte Lötstellen, welche die Haftung des Verbindungselements auf dem Substrat stark verringern.Another difficulty of soldering is that these connecting elements have a relatively large mass, therefore, the thermal energy expenditure for melting the solder paste is relatively high. If the solder joint is not supplied with sufficient thermal energy, so-called cold solder joints are formed which greatly reduce the adhesion of the connector to the substrate.

Aus der Anzeige " Broxing PowerClamps" in Elektronik Journal, 1. Mai 2011 (2011-05-01), Seite 78, XP055249711 ist ein SMD-Bauelement bekannt, das mittels Lotpaste auf eine Leiterplatte gelötet wird. Das SMD-Bauelement umfasst dabei einen Fußabschnitt sowie einen daran angrenzenden verjüngten Abschnitt mit einem kleineren Querschnitt, wobei der Fußabschnitt eine dem Substrat zugewandte Fläche aufweist, die mittels der Lotpaste auf das metallische Substrat gelötet wird. Darüber hinaus ist aus der Anzeige ein Pressfit-Bauteil mit einem Fußabschnitt bekannt.From the ad " Broxing PowerClamps "in Electronics Journal, May 1, 2011 (2011-05-01), page 78, XP055249711 an SMD component is known which is soldered by means of solder paste on a printed circuit board. The SMD component in this case comprises a foot portion and a tapered portion adjacent thereto with a smaller cross section, wherein the foot portion has a surface facing the substrate, which is soldered by means of the solder paste on the metallic substrate. In addition, from the display a pressfit component with a foot section known.

Weitere SMD-Baueiemente sind in derFurther SMD components are in the USUS 6 623 2836,623,283 B1B1 oder deror the DEDE 10 2012 021 32310 2012 021 323 A1A1 offenbart.disclosed.

Ein grundsätzlicher Nachteil der bekannten SMD-Bauelemente besteht darin, dass die mechanische Belastbarkeit der Lötverbindung insbesondere bei einer Torsionsbelastung stark limitiert ist.A fundamental disadvantage of the known SMD components is that the mechanical load capacity of the solder joint is severely limited, especially in a torsional load.

Ziel der vorliegenden Erfindung ist es, die Haftung und somit die mechanische Belastbarkeit des gelöteten Verbindungselements dadurch zu verbessern, dass die benetzbare Oberfläche durch entsprechende Formgebung bei gleichbleibender Grundfläche vergrößert wird und/oder Verankerungen am Verbindungselement oder auf dem Substrat angebracht werden, um die mechanische Belastbarkeit zu erhöhen.The aim of the present invention is to improve the adhesion and thus the mechanical strength of the soldered connection element in that the wettable surface is increased by appropriate shaping with the same base area and / or anchors are attached to the connecting element or on the substrate to the mechanical strength to increase.

Gemäß der Erfindung wird die gewünschte Vergrößerung der lötbaren Oberfläche dadurch erreicht, dass an dem der Lötfläche zugeordneten Umfang des Verbindungselements vertikale Rillen [k] angebracht werden.According to the invention, the desired enlargement of the solderable surface is achieved by providing vertical grooves [k] on the periphery of the connecting element associated with the soldering surface.

Beim Lötprozess steigt an den Flanken der Rillen [k],[h] und an den Wandungen der Bohrungen das geschmolzene Lötmittel hoch [I], wodurch sich die effektiv gelötete Oberfläche zusätzlich erhöht und somit die Haftung der Verbindungselemente auf dem Substrat [b] verbessert wird.In the soldering process, the molten solder rises [I] on the flanks of the grooves [k], [h] and on the walls of the holes, thereby additionally increasing the effectively soldered surface and thus improving the adhesion of the connecting elements to the substrate [b] becomes.

Durch Anbringung von Rillen [h] und/oder Bohrungen [i] auf der Lötseite des Verbindungselements und/oder auf dem Substrat, kann zusätzlich erreicht werden, dass die Flussmittelgase gesammelt und nach außen abgeleitet werden, sich daher keine störenden Gasblasen mehr bilden können, welche die gelötete Oberfläche verringern würden.By attaching grooves [h] and / or bores [i] on the solder side of the connecting element and / or on the substrate, it can additionally be achieved that the flux gases are collected and discharged to the outside, therefore no more disruptive gas bubbles can form, which would reduce the soldered surface.

Die zusätzliche Anbringung von Verankerungen [m], die im gleichen Lötprozess von der Lotpaste [a1] benetzt werden, bewirkt, dass die mechanische Belastbarkeit weiter um ein Vielfaches erhöht wird. Diese Verankerungen [m] können sowohl am Verbindungselement [Fig. 5] als auch am Substrat [b] angebracht werden und reichen in entsprechende Vertiefungen des Substrats [o] und/oder des Verbindungselements selbst.

  • In den Fig. 1 und 2 bedeuten:
    [a]
    Lotpaste
    [b]
    metallisches Substrat
    [c]
    Schraubverbindung
    [d]
    Drehmoment
    [e]
    Kippmament
    [f]
    Gasblasen
  • In Fig. 3 bedeutet:
    [g]
    Massereduzierung durch Verjüngung
    [h]
    Rillen auf der Lötseite des Verbindungselements
    [i]
    Bohrungen auf der Lötseite des Verbindungselements
    [k]
    Rillen am Umfang des Verbindungselements
  • In Fig.4 bedeutet:
    [b]
    Metallisches Substrat
    [k]
    Rillen am Umfang des Verbindungselements
    [l]
    hochgestiegenes Lötmittel
  • In Fig.5 bedeutet:
    [a]
    Lötmittel zwischen Verbindungselement und Substrat
    [a1]
    Lötmittel auf der Verankerung
    [m]
    Verankerung
    [o]
    Vertiefung im Substrat
The additional attachment of anchors [m], which are wetted in the same soldering process by the solder paste [a1], causes the mechanical load capacity is further increased many times. These anchorages [m] can be attached both to the connecting element [ Fig. 5 ] as well as on the substrate [b] and extend into corresponding recesses of the substrate [o] and / or the connecting element itself.
  • In the Fig. 1 and 2 mean:
    [A]
    solder paste
    [B]
    metallic substrate
    [C]
    screw
    [D]
    torque
    [E]
    Kippmament
    [F]
    gas bubbles
  • In Fig. 3 means:
    [G]
    Mass reduction by rejuvenation
    [H]
    Grooves on the solder side of the connecting element
    [I]
    Holes on the solder side of the connecting element
    [K]
    Grooves on the circumference of the connecting element
  • In Figure 4 means:
    [B]
    Metallic substrate
    [K]
    Grooves on the circumference of the connecting element
    [L]
    raised solder
  • In Figure 5 means:
    [A]
    Solder between connecting element and substrate
    [A1]
    Solder on the anchorage
    [M]
    anchoring
    [O]
    Deepening in the substrate

Claims (4)

  1. Connector element (c) which is configured to be soldered on a metallic substrate (b) by means of a solder paste (a), comprising a foot portion having a surface facing the substrate (b), which is soldered on the metallic substrate (b) by means of the solder paste (a), characterized in that it is provided with grooves (k) which are located on a lateral peripheral surface and extend in a longitudinal direction of the connector element (c) until the edge of the surface facing the substrate (b), so that the molten solder paste (a) can rise on the connector element (c) and, as a consequence, the adhesion of the connector element (c) on the substrate (b) is increased.
  2. Connector element (c) according to claim 1, characterized in that it comprises anchors (m) adapted to be inserted into openings of the substrate (b).
  3. Connector element (c) according to claim 2, characterized in that the anchors (m) are dimensioned so that they are shorter than the thickness of the substrate (b) in an inserted state.
  4. Connector element (c) according to one of the preceding claims, characterized in that it comprises a thread or a plug connector.
EP15002499.0A 2015-08-24 2015-08-24 Improvement of the adhesion of connecting elements soldered to a metal substrate by means of soldering paste Active EP3136510B1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP15002499.0A EP3136510B1 (en) 2015-08-24 2015-08-24 Improvement of the adhesion of connecting elements soldered to a metal substrate by means of soldering paste
DE202015107004.7U DE202015107004U1 (en) 2015-08-24 2015-12-22 Improve the adhesion of fasteners soldered to a metallic substrate by means of a solder paste

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP15002499.0A EP3136510B1 (en) 2015-08-24 2015-08-24 Improvement of the adhesion of connecting elements soldered to a metal substrate by means of soldering paste

Publications (2)

Publication Number Publication Date
EP3136510A1 EP3136510A1 (en) 2017-03-01
EP3136510B1 true EP3136510B1 (en) 2019-08-21

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Application Number Title Priority Date Filing Date
EP15002499.0A Active EP3136510B1 (en) 2015-08-24 2015-08-24 Improvement of the adhesion of connecting elements soldered to a metal substrate by means of soldering paste

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EP (1) EP3136510B1 (en)
DE (1) DE202015107004U1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019104318C5 (en) 2019-02-20 2023-06-22 Auto-Kabel Management Gmbh Electrical conductor and method for producing an electrical conductor

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6623283B1 (en) * 2000-03-08 2003-09-23 Autosplice, Inc. Connector with base having channels to facilitate surface mount solder attachment
EP1720387A1 (en) * 2005-05-03 2006-11-08 Franz Broch High current terminal with press fit portion
DE102012021323B4 (en) * 2012-10-31 2020-12-10 Mtconnectivity Power2Pcb Gmbh Method for producing an electrical connection element

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
None *

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Publication number Publication date
EP3136510A1 (en) 2017-03-01
DE202015107004U1 (en) 2016-02-18

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