EP3128230A1 - Heat sink for motor vehicle optical module - Google Patents

Heat sink for motor vehicle optical module Download PDF

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Publication number
EP3128230A1
EP3128230A1 EP16182418.0A EP16182418A EP3128230A1 EP 3128230 A1 EP3128230 A1 EP 3128230A1 EP 16182418 A EP16182418 A EP 16182418A EP 3128230 A1 EP3128230 A1 EP 3128230A1
Authority
EP
European Patent Office
Prior art keywords
heat sink
optical module
plate
limiting embodiment
motor vehicle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP16182418.0A
Other languages
German (de)
French (fr)
Other versions
EP3128230B1 (en
Inventor
José GARCIA CASTILLA
Vicente VALLEJO
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Valeo Iluminacion SA
Original Assignee
Valeo Iluminacion SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valeo Iluminacion SA filed Critical Valeo Iluminacion SA
Publication of EP3128230A1 publication Critical patent/EP3128230A1/en
Application granted granted Critical
Publication of EP3128230B1 publication Critical patent/EP3128230B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/19—Attachment of light sources or lamp holders
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F21S41/147—Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F21S41/151—Light emitting diodes [LED] arranged in one or more lines
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/49—Attachment of the cooling means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/30—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by reflectors
    • F21S41/32—Optical layout thereof
    • F21S41/36—Combinations of two or more separate reflectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/30—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by reflectors
    • F21S41/32—Optical layout thereof
    • F21S41/36—Combinations of two or more separate reflectors
    • F21S41/365—Combinations of two or more separate reflectors successively reflecting the light

Definitions

  • the present invention relates to a heat sink for an optical module for a motor vehicle.
  • a heat sink in particular for an optical module for a motor vehicle, is integrated in a lighting device.
  • the lighting device comprises a plurality of optical modules, each optical module comprising a reflector, a heat sink and one or more light sources.
  • the light sources are disposed on the heat sink vis-à-vis the reflector of each optical module, the assembly for producing a global light beam.
  • the heat sink is a part that is molded.
  • the heat sink has dissipation fins to increase the heat exchange surface. It thus makes it possible to evacuate the heat produced by the light sources.
  • the present invention aims to propose another embodiment of a heat sink for an optical module for a motor vehicle.
  • the heat sink may further comprise one or more additional characteristics among the following:
  • said angle is between 0 ° and 180 °.
  • said angle is equal to 90 °.
  • the plate is composed of a thermo-conductive material.
  • the thermally conductive material is metallic.
  • the plate is made of aluminum.
  • said heat sink further comprises a device for adjusting the optical module on a housing.
  • said heat sink further comprises a device for adjusting the optical module on a housing, said adjustment device comprises at least three adjustment tabs.
  • one end of a lateral portion comprises two adjustment tabs and one end of the other lateral part comprises a control tab.
  • said adjustment device comprises four adjustment tabs, and each end of a lateral portion comprises two adjustment tabs.
  • said heat sink further comprises at least one support tab of an optical surface of the optical module.
  • the support tongue is disposed at one end of the central portion.
  • said heat sink further comprises means for centering an optical surface of the optical module.
  • said heat sink further comprises tabs for fixing the optical surface of the optical module disposed on either side of the central portion.
  • said heat sink further comprises centering orifices of a printed circuit board.
  • the centering orifices are poka yoke type orifices.
  • the optical surface is a reflector or a lens.
  • said at least one light source is a semiconductor emitter chip.
  • a semiconductor emitter chip is part of a light emitting diode.
  • the optical module further comprises a printed circuit board adapted to be mounted on the heat sink and to receive said at least one light source.
  • a lighting device for a motor vehicle comprising a housing and at least one optical module according to any one of the preceding characteristics, said heat sink of the optical module being disposed on said housing.
  • said lighting device comprises a plurality of optical modules.
  • said lighting device is a projector.
  • the manufacturing method may further comprise one or more additional characteristics among the following:
  • the thermally conductive material is metallic. According to a non-limiting variant, the thermo-conductive material is aluminum.
  • said manufacturing method further comprises cutting and punching said plate to form a device for adjusting the optical module on a housing.
  • the adjustment device comprises at least three adjustment tabs.
  • the adjustment device comprises four adjustment tabs.
  • said manufacturing method further comprises cutting and stamping said plate to form at least one support tab of an optical surface of the optical module.
  • said manufacturing method further comprises punching said plate so as to form means for centering the optical surface of the optical module.
  • said manufacturing method further comprises cutting and punching said plate to form tabs for fixing the optical surface of the optical module.
  • said manufacturing method further comprises punching said plate so as to form centering holes of a printed circuit board adapted to be mounted on the heat sink and to receive said at least one light source.
  • the heat sink 10 for optical module 1 for a motor vehicle V according to the invention is described with reference to Figures 1 to 6 .
  • motor vehicle we mean any type of motorized vehicle.
  • the optical module 1 (described later) illustrated at figure 1 comprises the heat sink 10 and is integrated in a lighting device 3.
  • the lighting device 3 is a projector.
  • the motor vehicle V comprises a right projector and a left projector.
  • the heat sink 10 according to the invention is described in detail hereinafter with reference to Figures 2 to 6 .
  • the edge A1 is common to the central portion 101 and a lateral portion 102, the edge A2 is common to the central portion 101 and the other lateral portion 102.
  • the angle ⁇ is represented on the figure 3 which represents the unfolded heat sink 10.
  • said angle ⁇ is between 0 ° and 180 °. In a nonlimiting variant embodiment, said angle ⁇ is equal to 90 °. Such an angle is easy to obtain when folding the plate 100.
  • the plate 100 is made of a thermally conductive material. The material allows to evacuate the heat produced by the light sources 13 and the printed circuit board 11 (described later).
  • the material is such that it can be processed by a manufacturing process that includes cutting, bending, and punching and in a non-limiting embodiment the stamping.
  • thermo-conductive material is metallic.
  • the material is aluminum. This material makes it possible to obtain good thermal conductivity, in a nonlimiting example starting from 120 watts per meter-Kelvin (W ⁇ m -1 ⁇ K -1 ), unlike a molded heat sink with dissipation fins which does not allow to achieve a thermal conductivity of 90-120 W ⁇ m -1 ⁇ K -1 .
  • the light sources 13 are thus well cooled and their effectiveness is thus not degraded due to heat.
  • aluminum is a lightweight material that is easy to shape. It is thus possible to obtain up to 40% reduction in the weight of the heat sink 10 relative to a molded heat sink.
  • the material is copper or brass. These materials still have better thermal conductivity than aluminum but has a higher cost and a greater weight. With these materials other than aluminum, it is thus possible to obtain between 10 and 20% reduction in the weight of the heat sink 10 relative to a molded heat sink.
  • Their thermal conductivity is in a non-limiting example of 420 W ⁇ m -1 ⁇ K -1 .
  • the heat sink 10 makes it possible to receive at least one light source 13 and an optical surface 12, the assembly 10, 13 and 12 forming an optical module 1.
  • the light source 13 is either mounted directly on the heat sink 10 (assembly called “submount”), or mounted on the heat sink 10 by means of a printed circuit board 11.
  • the heat sink 10 is adapted to receive said printed circuit board 11 on which said light source 13 is disposed.
  • the optical module 1 is composed of elements 10, 11, 12 and 13.
  • the optical surface 12 is a reflector. In another non-limiting embodiment, the optical surface 12 is a lens. Thus, an optical surface 12 is the surface charged to reflect the individual light beam emitted by the light source (s) 13.
  • the reflector is taken as a non-limiting example.
  • the heat sink 10 further comprises an adjustment device 110 of the optical module 1 on a housing 2 of the projector 3.
  • the adjustment device 110 cooperates with a fastening system 210.
  • said adjustment device 110 comprises at least three adjustment tabs 110. As illustrated in FIG. figure 4 , these adjustment lugs 110 allow to receive adjustment screws 210 each cooperating with a spring 220.
  • the springs 220 make it possible to retain the adjustment screws 210 and thus prevent them from being unscrewed.
  • Adjustment screws 210 adjust the heat sink 10 and therefore the entire optical module 1 in a vertical direction and in a lateral direction.
  • a first screw serves as a fixed point
  • a second screw is used for lateral adjustment
  • the third screw is used for vertical adjustment.
  • the different optical modules 1 of the projector 3 can thus be adjusted relative to each other so that the overall light beam produced by all the light sources 13 when they cooperate with the reflectors 12 is adjusted according to the photometric function sought (described later).
  • the individual light beam produced by the light source (s) of each optical module 1 is thus adjusted relative to the individual light beam (s) adjacent thereto.
  • the adjustment device 110 comprises three adjustment tabs. One end of a lateral portion 102 of the plate 100 comprises two adjustment tabs 110 and one end of the other lateral portion 102 comprises a single adjustment tab 110.
  • the three adjustment screws 220 which cooperate with the three adjustment lugs 110 are screwed in two different adjustment modes so as to obtain a heatsink 10 referenced for the right headlight of the motor vehicle V and another heatsink 10 referenced for the left projector.
  • the adjusting device 110 has four adjustment tabs 110 and each end of a lateral portion 102 of the plate 100 comprises two adjustment tabs.
  • the four associated adjusting screws 220 are screwed in a single adjustment mode so as to obtain a heatsink 10 referenced for the right headlight of the motor vehicle V and also for the left headlight of the motor vehicle. This gives the same heat sink (and therefore only one optical module reference) set in position for the two projectors of the motor vehicle V.
  • the adjustment device 110 may comprise four adjustment lugs 110 but three adjustment screws only.
  • two heat sinks and thus two references of optical modules are set in position differently, one for each headlight of the motor vehicle V, as in the first embodiment.
  • the printed circuit board 11, said at least one light source 13 and the reflector 12 are fixed on the heat sink 10 in the following manner.
  • the heat sink 10 further comprises centering means 130 of a reflector 12 of the optical module 1.
  • These centering means 130 are disposed at one end of the central portion 101 of the plate 100 and form two rounded notches. They thus make it possible to center the reflector 12 on the heat sink 10 but also the printed circuit board 11.
  • the light source or sources 13 disposed on the printed circuit board 11 are thus centered with respect to the reflector 12.
  • the reflector 12 comprises two positioning pins 123 (illustrated on the figure 1 ) which thus fits into the two rounded notches 130.
  • said heat sink 10 further comprises fixing tabs 140 of a reflector 12 of the optical module 1 disposed on either side of the central portion 101.
  • the fastening lugs 140 comprise two orifices 141 and are thus adapted to receive two fastening screws 240 (illustrated in FIG. figure 4 ) which fit into the two orifices 141.
  • the reflector 12 comprises two threaded fixing hollow cylinders 124 (illustrated on FIG. figure 1 ) in which the fixing screws 240 are screwed.
  • said heat sink 10 further comprises centering orifices 150 of the printed circuit board 11 disposed on the central portion 101. These centering orifices 150 are of the poka type. yoke. These are keyed to position correctly the printed circuit board 11 on the heat sink 10.
  • the figure 5 illustrates the heat sink 10 with the printed circuit board 11. Note that the latter has centering orifices 115 corresponding to the centering orifices 150 of the heat sink 10. They are arranged opposite said centering orifices 150 when the circuit board printed 11 is well positioned on the heat sink 10.
  • the centering orifices 115 and 150 are adapted to receive a centering pin (not illustrated) of the reflector 12.
  • the reflector 12 is thus also correctly centered on the printed circuit board 11.
  • the printed circuit board 10 is thus sandwiched between the heat sink 10 and the reflector 12 and can thus no longer move because of these centering pins which cooperate with the centering orifices 115 and 150, but also because of the attachment of the reflector 12 to the heat sink 10 by means of two fastening lugs 140.
  • the printed circuit board 11 further comprises a connector 230 connected to a control and power supply unit (not shown) of the light sources 13.
  • said heat sink 10 further comprises at least one support tab 120 of a reflector 12 of the optical module 1.
  • the heat sink 10 comprises two support tabs 120.
  • the support tongue 120 is disposed at one end of the central portion 101.
  • the two support tongues 120 are disposed on the end opposite to that on which the centering notches 130.
  • a support tongue 120 has an L shape. Note that the (the) support tabs 120 also have a keying function. Thus, each support tongue may have a different slope for its L-shaped, according to the reflector 12 that the heat sink 10 must receive. Thus, each light beam produced by an optical module 1 will be well positioned relative to to the other adjacent light beams of the adjacent optical modules so as to obtain a global light beam adapted to the desired photometric function f1.
  • the reflector 12 comprises for this purpose a rib (not shown) cooperating with each support tongue 120.
  • the invention also relates to an optical module 1 for a motor vehicle V.
  • the optical module 1 is part of a lighting device 3 for a motor vehicle V, the lighting device 3 comprising a housing 2 and at least one module optical 1 described above.
  • the lighting device 3 is a projector.
  • the projector 3 comprises six optical modules 1.
  • the optical surface 12 shown in the non-limiting example is a reflector.
  • said optical module 1 comprises a single light source 13 and a single reflector 12.
  • a single light source 13 is disposed on the heat sink 10 (either directly or indirectly via the printed circuit board 11) and cooperates with the reflector 12 associated with the heat sink 10.
  • the optical module 1 further comprises a printed circuit board 11 adapted to be mounted on the heat sink 10 and to receive said at least one light source 13.
  • the printed circuit board 11 is glued to the plate 100 or screwed onto the plate 100 of the heat sink 10.
  • One or more light sources 13 is connected to a printed circuit board 11, also called PCB ("Printed Circuit Board” in English).
  • PCB printed Circuit Board
  • the light sources 13 are arranged on the printed circuit board 11.
  • the light sources 13 are fixed directly on the heat sink 10.
  • the light sources 14 are semiconductor emitter chips.
  • a semiconductor emitter chip is part of a light emitting diode.
  • Light-emitting diode means any type of light-emitting diode, whether in non-limiting examples of LEDs ("Light Emitting Diode”), OLEDs ("organic LEDs”), AMOLEDs (Active-Matrix-Organic LEDs), or FOLED (Flexible OLED).
  • LEDs Light Emitting Diode
  • OLEDs organic LEDs
  • AMOLEDs Active-Matrix-Organic LEDs
  • FOLED Fluorescence LEDs
  • the light beam is cut-off.
  • the photometric function is a so-called "low beam” function for producing a dipped beam.
  • the light beam is cut. It has two segments, one of which is horizontal and the other inclined.
  • the inclined segment forms an angle of 15 ° with respect to the horizontal segment.
  • three optical modules 1 will be used to produce the inclined segment of 15 °, namely to achieve a sub-function called "kink” in English, and the other three optical modules 1 will be used to to achieve the horizontal segment, namely to achieve a sub-function called "flat” in English.
  • the individual light beams produced by the light source (s) of each of the first three optical modules 1 will be aligned with each other (by adjusting the optical modules 1 by means of the adjustment device 110 as described above). so as to produce the inclined segment 15 °.
  • the individual light beams produced by the light source (s) of each of the last three optical modules 1 will be aligned with each other (by adjustment of the optical modules 1 by means of the adjustment device 110 as previously described). so to produce the horizontal segment.
  • the photometric function is a function called "high beam" to achieve a high beam.
  • the light beam has no cut.
  • the photometric function is a so-called "fog" function for producing a fog lamp.
  • the light beam is cut. It has two segments, one of which is horizontal and the other inclined.
  • the photometric function f1 is a DRL function ("Daytime Running Lamp" in English) for producing a daytime running light. In this case, the light beam has no cut.
  • the heat sink 10 for optical module 1 for a motor vehicle V is obtained by a manufacturing method P described hereinafter with reference to FIG. figure 7 said heat sink 10 comprising a folded plate 100.
  • the thermally conductive material is aluminum.
  • the sheet is thus an aluminum foil. It will be noted that the aluminum foil is obtained by extrusion.
  • said manufacturing method P further comprises the cutting and punching of said plate 100 (function illustrated in FIG. figure 7 DEC_POC (110)).
  • said manufacturing method P further comprises the punching of said plate 100 (function illustrated in FIG. figure 7 POC (130)).
  • said manufacturing method P further comprises the cutting and punching of said plate 100 (function illustrated in FIG. figure 7 DEC_POC (140)).
  • said manufacturing method P further comprises the punching of said plate 100 (function illustrated in FIG. figure 7 POC (150)).
  • said manufacturing method P further comprises the cutting and stamping of said plate 100 (function illustrated on the figure 7 DEC_EMB (120)).
  • the cutting operation of the aluminum foil is carried out first while the folding operation of the plate 100 is performed last.
  • the adjustment device 110 may be fixed (it is not necessary to have screws of setting 210 associated) so that all individual light beams are aligned with each other to form the horizontal overall light beam.
  • the centering means 130 are not notches, but centering tabs.

Abstract

La présente invention concerne un dissipateur thermique (10) pour module optique (1) pour véhicule automobile (V), caractérisé en ce que le dissipateur thermique (10) comprend une plaque pliée (100), ladite plaque (100) comprenant : - une partie centrale (101) adaptée pour recevoir au moins une source lumineuse (13) du module optique (1) et comprenant deux arêtes communes (A1, A2) avec deux parties latérales (102), les deux arêtes communes (A1, A2) formant des axes de pliage de ladite plaque (100) ; et - les deux parties latérales (102) formant chacune un angle (²) avec ladite partie centrale (101).The present invention relates to a heat sink (10) for an optical module (1) for a motor vehicle (V), characterized in that the heat sink (10) comprises a folded plate (100), said plate (100) comprising: a central part (101) adapted to receive at least one light source (13) of the optical module (1) and comprising two common edges (A1, A2) with two lateral parts (102), the two common edges (A1, A2 ) forming fold axes of said plate (100); and - The two side portions (102) each forming an angle (²) with said central portion (101).

Description

DOMAINE TECHNIQUE DE L'INVENTIONTECHNICAL FIELD OF THE INVENTION

La présente invention concerne un dissipateur thermique pour module optique pour véhicule automobile.The present invention relates to a heat sink for an optical module for a motor vehicle.

Elle trouve une application particulière mais non limitative dans les dispositifs d'éclairage, tels que des projecteurs de véhicule automobile.It finds a particular but non-limiting application in lighting devices, such as motor vehicle headlamps.

ARRIÈRE-PLAN TECHNOLOGIQUE DE L'INVENTIONBACKGROUND OF THE INVENTION

De manière connue de l'homme du métier, un dissipateur thermique, notamment pour module optique pour véhicule automobile, est intégré dans un dispositif d'éclairage. Le dispositif d'éclairage comprend une pluralité de modules optiques, chaque module optique comprenant un réflecteur, un dissipateur thermique et une ou plusieurs sources lumineuses.In a manner known to those skilled in the art, a heat sink, in particular for an optical module for a motor vehicle, is integrated in a lighting device. The lighting device comprises a plurality of optical modules, each optical module comprising a reflector, a heat sink and one or more light sources.

Les sources lumineuses sont disposées sur le dissipateur thermique en vis-à-vis du réflecteur de chaque module optique, l'ensemble permettant de produire un faisceau lumineux global.The light sources are disposed on the heat sink vis-à-vis the reflector of each optical module, the assembly for producing a global light beam.

Le dissipateur thermique est une pièce qui est moulée. Le dissipateur thermique comporte des ailettes de dissipation pour augmenter la surface d'échange thermique. Il permet ainsi d'évacuer la chaleur produite par les sources lumineuses.The heat sink is a part that is molded. The heat sink has dissipation fins to increase the heat exchange surface. It thus makes it possible to evacuate the heat produced by the light sources.

Dans ce contexte, la présente invention vise à proposer un autre mode de réalisation d'un dissipateur thermique pour module optique pour véhicule automobile.In this context, the present invention aims to propose another embodiment of a heat sink for an optical module for a motor vehicle.

DESCRIPTION GENERALE DE L'INVENTIONGENERAL DESCRIPTION OF THE INVENTION

A cette fin l'invention propose un dissipateur thermique pour module optique pour véhicule automobile, caractérisé en ce que le dissipateur thermique comprend une plaque pliée, ladite plaque comprenant :

  • une partie centrale adaptée pour recevoir au moins une source lumineuse du module optique et comprenant deux arêtes communes avec deux parties latérales, les deux arêtes communes formant des axes de pliage de ladite plaque ; et
  • les deux parties latérales formant chacune un angle avec ladite partie centrale.
To this end, the invention proposes a heat sink for an optical module for a motor vehicle, characterized in that the heat sink comprises a folded plate, said plate comprising:
  • a central portion adapted to receive at least one light source of the optical module and comprising two common edges with two lateral parts, the two common edges forming fold axes of said plate; and
  • the two lateral parts each forming an angle with said central portion.

Selon des modes de réalisation non limitatifs, le dissipateur thermique peut comporter en outre une ou plusieurs caractéristiques supplémentaires parmi les suivantes :According to non-limiting embodiments, the heat sink may further comprise one or more additional characteristics among the following:

Selon un mode de réalisation non limitatif, ledit angle est compris entre 0° et 180°.According to a non-limiting embodiment, said angle is between 0 ° and 180 °.

Selon un mode de réalisation non limitatif, ledit angle est égal à 90°.According to a non-limiting embodiment, said angle is equal to 90 °.

Selon un mode de réalisation non limitatif, la plaque est composée d'un matériau thermo-conducteur.According to a non-limiting embodiment, the plate is composed of a thermo-conductive material.

Selon un mode de réalisation non limitatif, le matériau thermo-conducteur est métallique.According to a non-limiting embodiment, the thermally conductive material is metallic.

Selon un mode de réalisation non limitatif, la plaque est en aluminium.According to a non-limiting embodiment, the plate is made of aluminum.

Selon un mode de réalisation non limitatif, ledit dissipateur thermique comprend en outre un dispositif de réglage du module optique sur un boîtier.According to a non-limiting embodiment, said heat sink further comprises a device for adjusting the optical module on a housing.

Selon un mode de réalisation non limitatif, ledit dissipateur thermique comprend en outre un dispositif de réglage du module optique sur un boîtier, ledit dispositif de réglage comprend au moins trois pattes de réglage.According to a non-limiting embodiment, said heat sink further comprises a device for adjusting the optical module on a housing, said adjustment device comprises at least three adjustment tabs.

Selon un mode de réalisation non limitatif, une extrémité d'une partie latérale comprend deux pattes de réglage et une extrémité de l'autre partie latérale comprend une patte de réglage.According to a non-limiting embodiment, one end of a lateral portion comprises two adjustment tabs and one end of the other lateral part comprises a control tab.

Selon un mode de réalisation non limitatif, ledit dispositif de réglage comprend quatre pattes de réglage, et chaque extrémité d'une partie latérale comprend deux pattes de réglage.According to a non-limiting embodiment, said adjustment device comprises four adjustment tabs, and each end of a lateral portion comprises two adjustment tabs.

Selon un mode de réalisation non limitatif, ledit dissipateur thermique comprend en outre au moins une languette de support d'une surface optique du module optique.According to a non-limiting embodiment, said heat sink further comprises at least one support tab of an optical surface of the optical module.

Selon un mode de réalisation non limitatif, la languette de support est disposée à une extrémité de la partie centrale.According to a non-limiting embodiment, the support tongue is disposed at one end of the central portion.

Selon un mode de réalisation non limitatif, ledit dissipateur thermique comprend en outre des moyens de centrage d'une surface optique du module optique.According to a non-limiting embodiment, said heat sink further comprises means for centering an optical surface of the optical module.

Selon un mode de réalisation non limitatif, ledit dissipateur thermique comprend en outre des pattes de fixation de la surface optique du module optique disposées de part et d'autre de la partie centrale.According to a non-limiting embodiment, said heat sink further comprises tabs for fixing the optical surface of the optical module disposed on either side of the central portion.

Selon un mode de réalisation non limitatif, ledit dissipateur thermique comprend en outre des orifices de centrage d'une carte à circuit imprimé. Les orifices de centrage sont des orifices de type poka yoke.According to a non-limiting embodiment, said heat sink further comprises centering orifices of a printed circuit board. The centering orifices are poka yoke type orifices.

Selon un mode de réalisation non limitatif, la surface optique est un réflecteur ou une lentille.According to a non-limiting embodiment, the optical surface is a reflector or a lens.

Selon un mode de réalisation non limitatif, ladite au moins une source lumineuse est une puce émettrice semi-conductrice.According to a non-limiting embodiment, said at least one light source is a semiconductor emitter chip.

Selon un mode de réalisation non limitatif, lequel une puce émettrice semi-conductrice fait partie d'une diode électroluminescente.According to a non-limiting embodiment, which a semiconductor emitter chip is part of a light emitting diode.

Il est également proposé un module optique pour véhicule automobile caractérisé en ce qu'il comprend :

  • le dissipateur thermique selon l'une quelconque des caractéristiques précédentes ;
  • au moins une surface optique adaptée pour être fixée sur le dissipateur thermique et pour coopérer avec au moins une source lumineuse ; et
  • ladite au moins une source lumineuse adaptée pour être disposée sur le dissipateur thermique.
It is also proposed an optical module for a motor vehicle characterized in that it comprises:
  • the heat sink according to any one of the preceding features;
  • at least one optical surface adapted to be fixed to the heat sink and to cooperate with at least one light source; and
  • said at least one light source adapted to be disposed on the heat sink.

Selon un mode de réalisation non limitatif, le module optique comprend en outre une carte à circuit imprimé adaptée pour être montée sur le dissipateur thermique et pour recevoir ladite au moins une source lumineuse.According to a non-limiting embodiment, the optical module further comprises a printed circuit board adapted to be mounted on the heat sink and to receive said at least one light source.

Il est également proposé un dispositif d'éclairage pour véhicule automobile comprenant un boîtier et au moins un module optique selon l'une quelconque des caractéristiques précédentes, ledit dissipateur thermique du module optique étant disposé sur ledit boîtier.It is also proposed a lighting device for a motor vehicle comprising a housing and at least one optical module according to any one of the preceding characteristics, said heat sink of the optical module being disposed on said housing.

Selon un mode de réalisation non limitatif, ledit dispositif d'éclairage comprend une pluralité de modules optiques.According to a non-limiting embodiment, said lighting device comprises a plurality of optical modules.

Selon un mode de réalisation non limitatif, ledit dispositif d'éclairage est un projecteur.According to a non-limiting embodiment, said lighting device is a projector.

Il est également proposé un procédé de fabrication d'un dissipateur thermique pour module optique d'un véhicule automobile, caractérisé en ce qu'il comprend :

  • le découpage d'une feuille d'un matériau thermo-conducteur pour former une plaque ;
  • le pliage de ladite plaque de sorte à former une partie centrale et deux parties latérales formant chacune un angle avec la partie centrale, ladite partie centrale étant adaptée pour recevoir au moins une source lumineuse du module optique.
There is also provided a method for manufacturing a heat sink for an optical module of a motor vehicle, characterized in that it comprises:
  • cutting a sheet of a thermally conductive material to form a plate;
  • folding said plate so as to form a central portion and two side portions each forming an angle with the central portion, said central portion being adapted to receive at least one light source of the optical module.

Selon des modes de réalisation non limitatifs, le procédé de fabrication peut comporter en outre une ou plusieurs caractéristiques supplémentaires parmi les suivantes :According to non-limiting embodiments, the manufacturing method may further comprise one or more additional characteristics among the following:

Selon un mode de réalisation non limitatif, le matériau thermo-conducteur est métallique. Selon une variante non limitative, le matériau thermo-conducteur est en aluminium.According to a non-limiting embodiment, the thermally conductive material is metallic. According to a non-limiting variant, the thermo-conductive material is aluminum.

Selon un mode de réalisation non limitatif, ledit procédé de fabrication comporte en outre le découpage et le poinçonnage de ladite plaque pour former un dispositif de réglage du module optique sur un boîtier.According to a non-limiting embodiment, said manufacturing method further comprises cutting and punching said plate to form a device for adjusting the optical module on a housing.

Selon un mode de réalisation non limitatif, le dispositif de réglage comporte au moins trois pattes de réglages.According to a non-limiting embodiment, the adjustment device comprises at least three adjustment tabs.

Selon une variante de réalisation non limitative, le dispositif de réglage comporte quatre pattes de réglages.According to a non-limiting embodiment variant, the adjustment device comprises four adjustment tabs.

Selon un mode de réalisation non limitatif, ledit procédé de fabrication comporte en outre le découpage et l'emboutissage de ladite plaque pour former au moins une languette de support d'une surface optique du module optique.According to a non-limiting embodiment, said manufacturing method further comprises cutting and stamping said plate to form at least one support tab of an optical surface of the optical module.

Selon un mode de réalisation non limitatif, ledit procédé de fabrication comporte en outre le poinçonnage de ladite plaque de sorte à former des moyens de centrage de la surface optique du module optique.According to a non-limiting embodiment, said manufacturing method further comprises punching said plate so as to form means for centering the optical surface of the optical module.

Selon un mode de réalisation non limitatif, ledit procédé de fabrication comporte en outre le découpage et le poinçonnage de ladite plaque pour former des pattes de fixation de la surface optique du module optique.According to a non-limiting embodiment, said manufacturing method further comprises cutting and punching said plate to form tabs for fixing the optical surface of the optical module.

Selon un mode de réalisation non limitatif, ledit procédé de fabrication comporte en outre le poinçonnage de ladite plaque de sorte à former des orifices de centrage d'une carte à circuit imprimé adaptée pour être montée sur le dissipateur thermique et pour recevoir ladite au moins une source lumineuse.According to a non-limiting embodiment, said manufacturing method further comprises punching said plate so as to form centering holes of a printed circuit board adapted to be mounted on the heat sink and to receive said at least one light source.

BREVE DESCRIPTION DES FIGURESBRIEF DESCRIPTION OF THE FIGURES

L'invention et ses différentes applications seront mieux comprises à la lecture de la description qui suit et à l'examen des figures qui l'accompagnent.

  • la figure 1 représente un éclaté d'un dispositif d'éclairage comprenant une pluralité de modules optiques pour véhicule automobile comprenant chacun un dissipateur thermique selon un mode de réalisation non limitatif de l'invention ;
  • la figure 2 représente un dissipateur thermique pour le dispositif d'éclairage de la figure 1 selon un mode de réalisation non limitatif de l'invention ;
  • la figure 3 représente le dissipateur thermique de la Fig. 2 déplié ;
  • la figure 4 représente le dissipateur thermique de la Fig. 2 ou 3 avec un système de fixation qui coopère avec un dispositif de réglage du dissipateur thermique ;
  • la figure 5 représente le dissipateur thermique des Fig. 2 à 4 avec une carte à circuit imprimé sur laquelle est disposée une source lumineuse ;
  • la figure 6 représente le dissipateur thermique des Fig. 2 à 5 ledit dissipateur thermique comportant en outre des languettes de support ;
  • la figure 7 est organigramme d'un procédé de fabrication du dissipateur thermique des figures 2 à 6 selon un mode de réalisation non limitatif.
The invention and its various applications will be better understood by reading the following description and examining the figures that accompany it.
  • the figure 1 represents an explosion of a lighting device comprising a plurality of optical modules for a motor vehicle each comprising a heat sink according to a non-limiting embodiment of the invention;
  • the figure 2 represents a heat sink for the lighting device of the figure 1 according to a non-limiting embodiment of the invention;
  • the figure 3 represents the heat sink of the Fig. 2 unfolded;
  • the figure 4 represents the heat sink of the Fig. 2 or 3 with a fastening system which cooperates with a device for adjusting the heat sink;
  • the figure 5 represents the heat sink of the Fig. 2 to 4 with a printed circuit board on which is disposed a light source;
  • the figure 6 represents the heat sink of the Fig. 2 to 5 said heat sink further comprising support tabs;
  • the figure 7 is a flowchart of a process for manufacturing the heat sink of Figures 2 to 6 according to a non-limiting embodiment.

DESCRIPTION DE MODES DE REALISATION DE L'INVENTIONDESCRIPTION OF EMBODIMENTS OF THE INVENTION

Les éléments identiques, par structure ou par fonction, apparaissant sur différentes figures conservent, sauf précision contraire, les mêmes références.Identical elements, structure or function, appearing in different figures retain, unless otherwise specified, the same references.

Le dissipateur thermique 10 pour module optique 1 pour véhicule automobile V selon l'invention est décrit en référence aux figures 1 à 6.The heat sink 10 for optical module 1 for a motor vehicle V according to the invention is described with reference to Figures 1 to 6 .

Par véhicule automobile, on entend tout type de véhicule motorisé.By motor vehicle, we mean any type of motorized vehicle.

Le module optique 1 (décrit plus loin) illustré à la figure 1 comprend le dissipateur thermique 10 et est intégré dans un dispositif d'éclairage 3. Dans un exemple non limitatif pris dans la suite de la description, le dispositif d'éclairage 3 est un projecteur. On notera que le véhicule automobile V comporte un projecteur droit et un projecteur gauche.The optical module 1 (described later) illustrated at figure 1 comprises the heat sink 10 and is integrated in a lighting device 3. In a non-limiting example taken in the following description, the lighting device 3 is a projector. It will be noted that the motor vehicle V comprises a right projector and a left projector.

Le dissipateur thermique 10 selon l'invention est décrit en détail ci-après en référence aux figures 2 à 6.The heat sink 10 according to the invention is described in detail hereinafter with reference to Figures 2 to 6 .

Tel qu'illustré sur la figure 2, le dissipateur thermique 10 comprend une plaque pliée 100, ladite plaque 100 comprenant :

  • une partie centrale 101 adaptée pour recevoir au moins une source lumineuse 13 du module optique 1 et comprenant deux arêtes communes A1, A2 avec deux parties latérales 102, les deux arêtes communes formant des axes de pliage de ladite plaque 100 ; et
  • les deux parties latérales 102 formant chacune un angle β avec ladite partie centrale 101. L'angle β est appelé angle de pliage.
As illustrated on the figure 2 the heat sink 10 comprises a folded plate 100, said plate 100 comprising:
  • a central portion 101 adapted to receive at least one light source 13 of the optical module 1 and comprising two common edges A1, A2 with two side portions 102, the two common edges forming fold axes of said plate 100; and
  • the two lateral portions 102 each forming an angle β with said central portion 101. The angle β is called the folding angle.

L'arête A1 est commune à la partie centrale 101 et à une partie latérale 102, l'arête A2 est commune à la partie centrale 101 et à l'autre partie latérale 102.The edge A1 is common to the central portion 101 and a lateral portion 102, the edge A2 is common to the central portion 101 and the other lateral portion 102.

L'angle β est représenté sur la figure 3 qui représente le dissipateur thermique 10 déplié.The angle β is represented on the figure 3 which represents the unfolded heat sink 10.

Dans un mode de réalisation non limitatif, ledit angle β est compris entre 0° et 180°. Dans une variante de réalisation non limitative, ledit angle β est égal à 90°. Un tel angle est facile à obtenir lorsque l'on plie la plaque 100.In a non-limiting embodiment, said angle β is between 0 ° and 180 °. In a nonlimiting variant embodiment, said angle β is equal to 90 °. Such an angle is easy to obtain when folding the plate 100.

Le fait que la plaque 100 soit pliée permet :

  • d'utiliser un procédé de fabrication simple et peu coûteux comparé à un procédé de fabrication par moulage ;
  • d'obtenir un dissipateur thermique plus léger et donc un dispositif d'éclairage plus léger. La réduction de poids permet une diminution de la consommation de carburant utilisée par le véhicule automobile V;
  • d'obtenir un meilleur état de surface qu'avec une pièce moulée. Ainsi, il n'est pas nécessaire de ré-usiner ou de reprendre la plaque contrairement à une pièce moulée. Il suffit juste de la frapper. Il est en effet nécessaire d'avoir un bon état de surface pour déposer par la suite un adhésif thermique ou une colle thermique pour coller notamment la carte à circuit imprimé 11 (décrite plus loin). Le fait d'obtenir un meilleur état de surface permet de poser moins de colle. De plus, cela permet également d'avoir un meilleur contact entre la plaque 100 et la carte à circuit imprimé 11 qui est disposée sur ladite plaque 100 et par conséquent d'obtenir un meilleur échange thermique entre les deux éléments et donc une meilleure évacuation de chaleur. La carte à circuit imprimé 11 évacue en effet la chaleur par contact avec la plaque 100.
The fact that the plate 100 is folded allows:
  • to use a simple and inexpensive manufacturing process compared to a manufacturing method by molding;
  • to obtain a lighter heat sink and therefore a lighter lighting device. The reduction in weight allows a reduction in the fuel consumption used by the motor vehicle V;
  • to obtain a better surface finish than with a molded part. Thus, it is not necessary to re-machine or resume the plate unlike a molded part. Just hit her. It is indeed necessary to have a good surface condition to subsequently deposit a thermal adhesive or a thermal glue to paste in particular the printed circuit board 11 (described later). The fact of obtaining a better surface state makes it possible to apply less glue. In addition, this also allows a better contact between the plate 100 and the printed circuit board 11 which is disposed on said plate 100 and therefore to obtain a better heat exchange between the two elements and therefore a better evacuation of heat. The printed circuit board 11 effectively evacuates the heat by contact with the plate 100.

Dans un mode de réalisation non limitatif, la plaque 100 est composée d'un matériau thermo-conducteur. Le matériau permet d'évacuer la chaleur produite par les sources lumineuses 13 et la carte à circuit imprimé 11 (décrites plus loin).In a non-limiting embodiment, the plate 100 is made of a thermally conductive material. The material allows to evacuate the heat produced by the light sources 13 and the printed circuit board 11 (described later).

Le matériau est tel qu'il peut être transformé par un procédé de fabrication qui comprend le découpage, le pliage, et le poinçonnage et dans un mode de réalisation non limitatif l'emboutissage.The material is such that it can be processed by a manufacturing process that includes cutting, bending, and punching and in a non-limiting embodiment the stamping.

Dans une variante de réalisation non limitative, le matériau thermo-conducteur est métallique.In a non-limiting embodiment variant, the thermo-conductive material is metallic.

Dans un mode de réalisation non limitatif de cette variante, le matériau est en aluminium. Ce matériau permet d'obtenir une bonne conductivité thermique, dans un exemple non limitatif à partir de 120 watt par mètre-kelvin (W·m-1·K-1), contrairement à un dissipateur thermique moulé avec ailettes de dissipation qui ne permet d'obtenir une conductivité thermique que de 90-120 W·m-1·K-1. Les sources lumineuses 13 sont ainsi bien refroidies et leur efficacité n'est ainsi pas dégradée du fait de la chaleur.In a non-limiting embodiment of this variant, the material is aluminum. This material makes it possible to obtain good thermal conductivity, in a nonlimiting example starting from 120 watts per meter-Kelvin (W · m -1 · K -1 ), unlike a molded heat sink with dissipation fins which does not allow to achieve a thermal conductivity of 90-120 W · m -1 · K -1 . The light sources 13 are thus well cooled and their effectiveness is thus not degraded due to heat.

De plus, l'aluminium est un matériau léger et facile à façonner. On peut ainsi obtenir jusqu'à 40% de réduction du poids du dissipateur thermique 10 par rapport à un dissipateur thermique moulé.In addition, aluminum is a lightweight material that is easy to shape. It is thus possible to obtain up to 40% reduction in the weight of the heat sink 10 relative to a molded heat sink.

Dans d'autres modes de réalisation non limitatifs, le matériau est en cuivre ou en laiton. Ces matériaux présentent encore une meilleure conductivité thermique que l'aluminium mais présente un coût plus important et un poids plus important. Avec ces matériaux autres que l'aluminium, on peut ainsi obtenir entre 10 et 20% de réduction du poids du dissipateur thermique 10 par rapport à un dissipateur thermique moulé.In other non-limiting embodiments, the material is copper or brass. These materials still have better thermal conductivity than aluminum but has a higher cost and a greater weight. With these materials other than aluminum, it is thus possible to obtain between 10 and 20% reduction in the weight of the heat sink 10 relative to a molded heat sink.

Leur conductivité thermique est dans un exemple non limitatif de 420 W·m-1·K-1.Their thermal conductivity is in a non-limiting example of 420 W · m -1 · K -1 .

On notera que le dissipateur thermique 10 ne comporte pas d'ailettes de dissipation. La plaque 100 pliée comporte en effet un évidement. Cela apporte les avantages suivants :

  • le dissipateur thermique 10 est plus léger ;
  • cela permet d'avoir un important volume sous la plaque pliée 100 pour la circulation de l'air. Il y a donc moins de condensation qui se produit ;
  • cela améliore la circulation de l'air notamment dans le cas de l'utilisation d'un ventilateur ; et
  • il est possible de faire passer un faisceau de connexion dans l'espace laissé disponible sous la plaque pliée 100.
It will be noted that the heat sink 10 does not have dissipation fins. The folded plate 100 has indeed a recess. This brings the following benefits:
  • the heatsink 10 is lighter;
  • this allows to have a large volume under the folded plate 100 for the air circulation. There is therefore less condensation that occurs;
  • this improves air circulation especially in the case of the use of a fan; and
  • it is possible to pass a connecting beam in the space left available under the folded plate 100.

Le dissipateur thermique 10 permet de recevoir au moins une source lumineuse 13 et une surface optique 12, l'ensemble 10, 13 et 12 formant un module optique 1.The heat sink 10 makes it possible to receive at least one light source 13 and an optical surface 12, the assembly 10, 13 and 12 forming an optical module 1.

La source lumineuse 13 est soit montée directement sur le dissipateur thermique 10 (montage appelé en anglais « submount »), soit montée sur le dissipateur thermique 10 au moyen d'une carte à circuit imprimé 11. Dans ce dernier cas, dans un mode de réalisation non limitatif, le dissipateur thermique 10 est adapté pour recevoir ladite carte à circuit imprimé 11 sur laquelle est disposée ladite source lumineuse 13. Dans ce cas, le module optique 1 est composé des éléments 10, 11, 12 et 13.The light source 13 is either mounted directly on the heat sink 10 (assembly called "submount"), or mounted on the heat sink 10 by means of a printed circuit board 11. In the latter case, in a mode of non-limiting embodiment, the heat sink 10 is adapted to receive said printed circuit board 11 on which said light source 13 is disposed. In this case, the optical module 1 is composed of elements 10, 11, 12 and 13.

Dans un mode de réalisation non limitatif, la surface optique 12 est un réflecteur. Dans un autre mode de réalisation non limitatif, la surface optique 12 est une lentille. Ainsi, une surface optique 12 est la surface chargée de refléter le faisceau lumineux individuel émis par la (les) source(s) lumineuse(s) 13.In a non-limiting embodiment, the optical surface 12 is a reflector. In another non-limiting embodiment, the optical surface 12 is a lens. Thus, an optical surface 12 is the surface charged to reflect the individual light beam emitted by the light source (s) 13.

Dans la suite de la description, le réflecteur est pris comme exemple non limitatif.In the remainder of the description, the reflector is taken as a non-limiting example.

Tel qu'illustré sur les figures 2 à 6, dans un mode de réalisation non limitatif, le dissipateur thermique 10 comprend en outre un dispositif de réglage 110 du module optique 1 sur un boîtier 2 du projecteur 3. Le dispositif de réglage 110 coopère avec un système de fixation 210.As illustrated on Figures 2 to 6 , in a non-limiting embodiment, the heat sink 10 further comprises an adjustment device 110 of the optical module 1 on a housing 2 of the projector 3. The adjustment device 110 cooperates with a fastening system 210.

Dans un mode de réalisation non limitatif, ledit dispositif de réglage 110 comprend au moins trois pattes de réglage 110. Tel qu'illustré sur la figure 4, ces pattes de réglage 110 permettent de recevoir des vis de réglage 210 chacune coopérant avec un ressort 220.In a non-limiting embodiment, said adjustment device 110 comprises at least three adjustment tabs 110. As illustrated in FIG. figure 4 , these adjustment lugs 110 allow to receive adjustment screws 210 each cooperating with a spring 220.

Les ressorts 220 permettent de retenir les vis de réglage 210 et évite ainsi qu'elles ne se dévissent.The springs 220 make it possible to retain the adjustment screws 210 and thus prevent them from being unscrewed.

Les vis de réglage 210 permettent de régler le dissipateur thermique 10 et par conséquent l'ensemble du module optique 1 selon une direction verticale et selon une direction latérale. Ainsi, une première vis sert de point fixe, une deuxième vis est utilisée pour le réglage latéral, et la troisième vis sert pour le réglage vertical.Adjustment screws 210 adjust the heat sink 10 and therefore the entire optical module 1 in a vertical direction and in a lateral direction. Thus, a first screw serves as a fixed point, a second screw is used for lateral adjustment, and the third screw is used for vertical adjustment.

Les différents modules optiques 1 du projecteur 3 peuvent ainsi être réglés les uns par rapport aux autres de sorte que le faisceau lumineux global produit par l'ensemble des sources lumineuses 13 lorsqu'elles coopèrent avec les réflecteurs 12 soit ajusté en fonction de la fonction photométrique recherchée (décrite plus loin). Le faisceau lumineux individuel produit par la(les) source(s) lumineuse(s) de chaque module optique 1 est ainsi ajusté par rapport au(x) faisceau(x) lumineux individuel qui lui est adjacent.The different optical modules 1 of the projector 3 can thus be adjusted relative to each other so that the overall light beam produced by all the light sources 13 when they cooperate with the reflectors 12 is adjusted according to the photometric function sought (described later). The individual light beam produced by the light source (s) of each optical module 1 is thus adjusted relative to the individual light beam (s) adjacent thereto.

Dans une première variante de réalisation non limitative, le dispositif de réglage 110 comporte trois pattes de réglage. Une extrémité d'une partie latérale 102 de la plaque 100 comprend deux pattes de réglage 110 et une extrémité de l'autre partie latérale 102 comprend une seule patte de réglage 110.In a first non-limiting embodiment, the adjustment device 110 comprises three adjustment tabs. One end of a lateral portion 102 of the plate 100 comprises two adjustment tabs 110 and one end of the other lateral portion 102 comprises a single adjustment tab 110.

Dans ce cas, les trois pattes de réglage 110 sont disposées sur le dissipateur thermique 10 :

  • selon un premier mode de sorte à obtenir un dissipateur thermique 10 référencé pour le projecteur droit du véhicule automobile V. Deux pattes de réglage 110 sont disposées sur une première partie latérale 102 et une patte de réglage est disposée sur la deuxième partie latérale 102 ;
  • selon un deuxième mode de sorte à obtenir un dissipateur thermique 10 référencé pour le projecteur gauche du véhicule automobile V. En miroir du premier mode, une patte de réglage 110 est disposée sur la première partie latérale 102 et deux pattes de réglage 110 sont disposées sur la deuxième partie latérale 102.
In this case, the three adjustment lugs 110 are arranged on the heat sink 10:
  • according to a first mode so as to obtain a heatsink referenced 10 for the right headlight of the motor vehicle V. Two adjustment lugs 110 are disposed on a first lateral portion 102 and a control lug is disposed on the second lateral portion 102;
  • according to a second mode so as to obtain a heatsink 10 referenced for the left headlight of the motor vehicle V. In the mirror of the first mode, an adjustment lug 110 is disposed on the first lateral portion 102 and two adjustment lugs 110 are arranged on the second lateral part 102.

Ainsi, les trois vis de réglage 220 qui coopèrent avec les trois pattes de réglages 110 sont vissées selon deux modes de réglage différents de sorte à obtenir un dissipateur thermique 10 référencé pour le projecteur droit du véhicule automobile V et un autre dissipateur thermique 10 référencé pour le projecteur gauche. On a ainsi deux références de dissipateurs thermiques différents (et donc deux références de modules optiques) réglés en position chacun pour un des deux projecteurs du véhicule automobile V.Thus, the three adjustment screws 220 which cooperate with the three adjustment lugs 110 are screwed in two different adjustment modes so as to obtain a heatsink 10 referenced for the right headlight of the motor vehicle V and another heatsink 10 referenced for the left projector. There are thus two different references of heat sinks (and therefore two references of optical modules) set in position each for one of the two projectors of the motor vehicle V.

Dans une deuxième variante de réalisation non limitative, le dispositif de réglage 110 comporte quatre pattes de réglage 110 et chaque extrémité d'une partie latérale 102 de la plaque 100 comprend deux pattes de réglages. Dans ce cas, les quatre vis de réglage 220 associées sont vissées selon un unique mode de réglage de sorte à obtenir un dissipateur thermique 10 référencé pour le projecteur droit du véhicule automobile V et également pour le projecteur gauche du véhicule automobile. On obtient ainsi un même dissipateur thermique (et donc une seule référence de module optique) réglé en position pour les deux projecteurs du véhicule automobile V.In a second non-limiting embodiment, the adjusting device 110 has four adjustment tabs 110 and each end of a lateral portion 102 of the plate 100 comprises two adjustment tabs. In this case, the four associated adjusting screws 220 are screwed in a single adjustment mode so as to obtain a heatsink 10 referenced for the right headlight of the motor vehicle V and also for the left headlight of the motor vehicle. This gives the same heat sink (and therefore only one optical module reference) set in position for the two projectors of the motor vehicle V.

On notera que dans une autre variante de réalisation non limitative, le dispositif de réglage 110 peut comporter quatre pattes de réglage 110 mais trois vis de réglage uniquement. Dans ce cas, on obtient deux dissipateurs thermiques (et donc deux références de modules optiques) réglés en position différemment, un pour chaque projecteur du véhicule automobile V, comme dans le premier mode de réalisation.Note that in another non-limiting embodiment, the adjustment device 110 may comprise four adjustment lugs 110 but three adjustment screws only. In this case, two heat sinks (and thus two references of optical modules) are set in position differently, one for each headlight of the motor vehicle V, as in the first embodiment.

La carte à circuit imprimé 11, ladite au moins une source lumineuse 13 et le réflecteur 12 sont fixés sur le dissipateur thermique 10 de la manière suivante.The printed circuit board 11, said at least one light source 13 and the reflector 12 are fixed on the heat sink 10 in the following manner.

Afin de centrer le réflecteur 12 sur le dissipateur thermique 10, dans un mode de réalisation non limitatif, le dissipateur thermique 10 comprend en outre des moyens de centrage 130 d'un réflecteur 12 du module optique 1. Ces moyens de centrage 130 sont disposés à une extrémité de la partie centrale 101 de la plaque 100 et forment deux encoches arrondies. Elles permettent ainsi de centrer le réflecteur 12 sur le dissipateur thermique 10 mais également la carte à circuit imprimé 11. La ou les sources lumineuses 13 disposées sur la carte à circuit imprimé 11 sont ainsi centrées par rapport au réflecteur 12. On notera que le réflecteur 12 comprend deux pions de positionnement 123 (illustrées sur la figure 1) qui s'insère ainsi dans les deux encoches arrondies 130.In order to center the reflector 12 on the heat sink 10, in a non-limiting embodiment, the heat sink 10 further comprises centering means 130 of a reflector 12 of the optical module 1. These centering means 130 are disposed at one end of the central portion 101 of the plate 100 and form two rounded notches. They thus make it possible to center the reflector 12 on the heat sink 10 but also the printed circuit board 11. The light source or sources 13 disposed on the printed circuit board 11 are thus centered with respect to the reflector 12. It will be noted that the reflector 12 comprises two positioning pins 123 (illustrated on the figure 1 ) which thus fits into the two rounded notches 130.

Afin de fixer le réflecteur 12 sur le dissipateur thermique 10, ledit dissipateur thermique 10 comprend en outre des pattes de fixation 140 d'un réflecteur 12 du module optique 1 disposées de part et d'autre de la partie centrale 101. Dans un mode de réalisation non limitatif, les pattes de fixation 140 comprennent deux orifices 141 et sont ainsi adaptées pour recevoir deux vis de fixation 240 (illustrées à la figure 4) qui s'insèrent dans les deux orifices 141. On notera que le réflecteur 12 comprend deux cylindres creux filetés de fixation 124 (illustrées sur la figure 1) dans lesquels les vis de fixation 240 sont vissées.In order to fix the reflector 12 on the heat sink 10, said heat sink 10 further comprises fixing tabs 140 of a reflector 12 of the optical module 1 disposed on either side of the central portion 101. non-limiting embodiment, the fastening lugs 140 comprise two orifices 141 and are thus adapted to receive two fastening screws 240 (illustrated in FIG. figure 4 ) which fit into the two orifices 141. It will be noted that the reflector 12 comprises two threaded fixing hollow cylinders 124 (illustrated on FIG. figure 1 ) in which the fixing screws 240 are screwed.

On notera que le fait de dissocier par des moyens différents le centrage et la fixation du réflecteur 12 sur le dissipateur thermique 10 permet d'obtenir au niveau mécanique une fixation robuste contrairement à des moyens de fixation qui serviraient également de centrage.It will be noted that the fact of dissociating by different means the centering and the fixing of the reflector 12 on the heat sink 10 makes it possible to obtain at the mechanical level a robust attachment in contrast to fixing means which would also serve as centering.

Afin de positionner la carte à circuit imprimé 11 sur le dissipateur thermique 10, ledit dissipateur thermique 10 comprend en outre des orifices de centrage 150 de la carte à circuit imprimé 11 disposés sur la partie centrale 101. Ces orifices de centrage 150 sont de type poka yoke. Ce sont des détrompeurs qui permettent de positionner correctement la carte à circuit imprimé 11 sur le dissipateur thermique 10.In order to position the printed circuit board 11 on the heat sink 10, said heat sink 10 further comprises centering orifices 150 of the printed circuit board 11 disposed on the central portion 101. These centering orifices 150 are of the poka type. yoke. These are keyed to position correctly the printed circuit board 11 on the heat sink 10.

La figure 5 illustre le dissipateur thermique 10 avec la carte à circuit imprimé 11. On notera que cette dernière comporte des orifices de centrage 115 correspondant aux orifices de centrage 150 du dissipateur thermique 10. Ils sont disposés en regard desdits orifices de centrage 150 lorsque la carte à circuit imprimé 11 est bien positionnée sur le dissipateur thermique 10.The figure 5 illustrates the heat sink 10 with the printed circuit board 11. Note that the latter has centering orifices 115 corresponding to the centering orifices 150 of the heat sink 10. They are arranged opposite said centering orifices 150 when the circuit board printed 11 is well positioned on the heat sink 10.

Les orifices de centrage 115 et 150 sont adaptés pour recevoir un pion de centrage (non illustré) du réflecteur 12. Le réflecteur 12 est ainsi également correctement centré sur la carte à circuit imprimé 11. La carte à circuit imprimé 10 est ainsi prise en sandwich entre le dissipateur thermique 10 et le réflecteur 12 et ne peut ainsi plus bouger du fait de ces pions de centrage qui coopèrent avec les orifices de centrage 115 et 150, mais également du fait de la fixation du réflecteur 12 sur le dissipateur thermique 10 au moyen des deux pattes de fixation 140.The centering orifices 115 and 150 are adapted to receive a centering pin (not illustrated) of the reflector 12. The reflector 12 is thus also correctly centered on the printed circuit board 11. The printed circuit board 10 is thus sandwiched between the heat sink 10 and the reflector 12 and can thus no longer move because of these centering pins which cooperate with the centering orifices 115 and 150, but also because of the attachment of the reflector 12 to the heat sink 10 by means of two fastening lugs 140.

La carte à circuit imprimé 11 comporte en outre un connecteur 230 relié à une unité de commande et d'alimentation (non illustré) des sources lumineuses 13.The printed circuit board 11 further comprises a connector 230 connected to a control and power supply unit (not shown) of the light sources 13.

Selon un mode de réalisation non limitatif, ledit dissipateur thermique 10 comprend en outre au moins une languette de support 120 d'un réflecteur 12 du module optique 1. Dans l'exemple illustré sur la figure 6, le dissipateur thermique 10 comprend deux languettes de support 120.According to a non-limiting embodiment, said heat sink 10 further comprises at least one support tab 120 of a reflector 12 of the optical module 1. In the example illustrated in FIG. figure 6 the heat sink 10 comprises two support tabs 120.

Dans un mode de réalisation non limitatif, la languette de support 120 est disposée à une extrémité de la partie centrale 101. Dans l'exemple illustré, les deux languettes de support 120 sont disposées sur l'extrémité opposée à celle sur laquelle sont disposées les encoches de centrage 130.In a non-limiting embodiment, the support tongue 120 is disposed at one end of the central portion 101. In the illustrated example, the two support tongues 120 are disposed on the end opposite to that on which the centering notches 130.

Dans un mode de réalisation non limitatif, une languette de support 120 a une forme en L. On notera que la (les) languettes de support 120 on également une fonction de détrompeur. Ainsi, chaque languette de support peut comporter une pente différente pour sa forme en L, selon le réflecteur 12 que le dissipateur thermique 10 doit recevoir. Ainsi, chaque faisceau lumineux produit par un module optique 1 sera bien positionnée par rapport aux autres faisceaux lumineux adjacents des modules optiques adjacents de sorte à obtenir un faisceau lumineux global adapté à la fonction photométrique f1 recherchée.In a non-limiting embodiment, a support tongue 120 has an L shape. Note that the (the) support tabs 120 also have a keying function. Thus, each support tongue may have a different slope for its L-shaped, according to the reflector 12 that the heat sink 10 must receive. Thus, each light beam produced by an optical module 1 will be well positioned relative to to the other adjacent light beams of the adjacent optical modules so as to obtain a global light beam adapted to the desired photometric function f1.

On notera que le réflecteur 12 comporte à cet effet une nervure (non illustrée) coopérant avec chaque languette de support 120.Note that the reflector 12 comprises for this purpose a rib (not shown) cooperating with each support tongue 120.

L'invention a également pour objet un module optique 1 pour véhicule automobile V. Le module optique 1 fait partie d'un dispositif d'éclairage 3 pour véhicule automobile V, le dispositif d'éclairage 3 comprenant un boîtier 2 et au moins un module optique 1 décrit précédemment. Dans un exemple non limitatif, le dispositif d'éclairage 3 est un projecteur.The invention also relates to an optical module 1 for a motor vehicle V. The optical module 1 is part of a lighting device 3 for a motor vehicle V, the lighting device 3 comprising a housing 2 and at least one module optical 1 described above. In a non-limiting example, the lighting device 3 is a projector.

Dans l'exemple illustré sur la figure 1, le projecteur 3 comporte six modules optiques 1.In the example shown on the figure 1 , the projector 3 comprises six optical modules 1.

Le module optique 1 comprend :

  • le dissipateur thermique 10 décrit précédemment ;
  • au moins une surface optique 12 adaptée pour être fixée sur le dissipateur thermique 10 et pour coopérer avec au moins une source lumineuse 13 ; et
  • ladite au moins une source lumineuse 13 adaptée pour être disposée sur le dissipateur thermique 10.
The optical module 1 comprises:
  • the heat sink 10 previously described;
  • at least one optical surface 12 adapted to be fixed on the heat sink 10 and to cooperate with at least one light source 13; and
  • said at least one light source 13 adapted to be disposed on the heat sink 10.

La surface optique 12 représentée dans l'exemple non limitatif est un réflecteur.The optical surface 12 shown in the non-limiting example is a reflector.

Dans un mode de réalisation non limitatif tel qu'illustré sur la figure 1, ledit module optique 1 comporte une unique source lumineuse 13 et un unique réflecteur 12. Ainsi, une seule source lumineuse 13 est disposée sur le dissipateur thermique 10 (soit directement, soit indirectement via la carte à circuit imprimé 11) et coopère avec le réflecteur 12 associé au dissipateur thermique 10.In a non-limiting embodiment as illustrated on the figure 1 , said optical module 1 comprises a single light source 13 and a single reflector 12. Thus, a single light source 13 is disposed on the heat sink 10 (either directly or indirectly via the printed circuit board 11) and cooperates with the reflector 12 associated with the heat sink 10.

Dans un mode de réalisation non limitatif, illustré sur la figure 1, le module optique 1 comprend en outre une carte à circuit imprimé 11 adaptée pour être montée sur le dissipateur thermique 10 et pour recevoir ladite au moins une source lumineuse 13.In a non-limiting embodiment, illustrated on the figure 1 , the optical module 1 further comprises a printed circuit board 11 adapted to be mounted on the heat sink 10 and to receive said at least one light source 13.

Dans un mode de réalisation non limitatif, la carte à circuit imprimé 11 est collée sur la plaque 100 ou vissée sur la plaque 100 du dissipateur thermique 10.In a non-limiting embodiment, the printed circuit board 11 is glued to the plate 100 or screwed onto the plate 100 of the heat sink 10.

Une ou plusieurs sources lumineuses 13 est connectée à une carte à circuit imprimé 11, appelée également carte PCB (« Printed Circuit Board» en anglais).One or more light sources 13 is connected to a printed circuit board 11, also called PCB ("Printed Circuit Board" in English).

Dans un premier mode de réalisation non limitatif, les sources lumineuses 13 sont disposées sur la carte à circuit imprimé 11.In a first non-limiting embodiment, the light sources 13 are arranged on the printed circuit board 11.

Dans un deuxième mode de réalisation non limitatif, les sources lumineuses 13 sont fixées directement sur le dissipateur thermique 10.In a second non-limiting embodiment, the light sources 13 are fixed directly on the heat sink 10.

On notera que l'on peut également avoir une combinaison de ces deux modes.Note that one can also have a combination of these two modes.

Dans un mode de réalisation non limitatif, les sources lumineuses 14 sont des puces émettrices semi-conductrices.In a non-limiting embodiment, the light sources 14 are semiconductor emitter chips.

Dans une variante de réalisation non limitative, une puce émettrice semiconductrice fait partie d'une diode électroluminescente.In a non-limiting embodiment, a semiconductor emitter chip is part of a light emitting diode.

Par diode électroluminescente, on entend tout type de diodes électroluminescentes, que ce soit dans des exemples non limitatifs des LED (« Light Emitting Diode »), des OLED (« organic LED »), des AMOLED (Active-Matrix-Organic LED), ou encore des FOLED (Flexible OLED).Light-emitting diode means any type of light-emitting diode, whether in non-limiting examples of LEDs ("Light Emitting Diode"), OLEDs ("organic LEDs"), AMOLEDs (Active-Matrix-Organic LEDs), or FOLED (Flexible OLED).

Le couplage de l'ensemble des faisceaux lumineux des sources lumineuses 13 des différents modules optiques 1 du projecteur 3 avec les différents réflecteurs 12 produit un faisceau lumineux global adapté en fonction d'une fonction photométrique f1 recherchée.The coupling of all the light beams of the light sources 13 of the different optical modules 1 of the projector 3 with the different reflectors 12 produces a global light beam adapted as a function of a desired photometric function f1.

Dans un mode de réalisation non limitatif, le faisceau lumineux est à coupure.In a non-limiting embodiment, the light beam is cut-off.

Dans une première variante de réalisation non limitative, la fonction photométrique est une fonction dite « low beam » pour réaliser un feu de croisement. Dans ce cas, le faisceau lumineux est à coupure. Il comporte deux segments dont l'un est horizontal et l'autre incliné. Selon la règlementation en vigueur, le segment incliné forme un angle de 15° par rapport au segment horizontal. Ainsi, dans un exemple non limitatif, trois modules optiques 1 vont être utilisés pour réaliser le segment incliné de 15°, à savoir pour réaliser une sous-fonction appelée « kink »en anglais, et les trois autres modules optiques 1 vont être utilisés pour réaliser le segment horizontal, à savoir pour réaliser une sous-fonction appelée « flat »en anglais.In a first non-limiting embodiment, the photometric function is a so-called "low beam" function for producing a dipped beam. In this case, the light beam is cut. It has two segments, one of which is horizontal and the other inclined. According to the regulations in force, the inclined segment forms an angle of 15 ° with respect to the horizontal segment. Thus, in a nonlimiting example, three optical modules 1 will be used to produce the inclined segment of 15 °, namely to achieve a sub-function called "kink" in English, and the other three optical modules 1 will be used to to achieve the horizontal segment, namely to achieve a sub-function called "flat" in English.

Les faisceaux lumineux individuels produit par la(les) source(s) lumineuse(s) de chacun des trois premiers modules optiques 1 vont être alignés entre eux (par réglage des modules optiques 1 au moyen du dispositif de réglage 110 comme décrit précédemment) de sorte à produire le segment incliné 15°. Les faisceaux lumineux individuels produit par la(les) source(s) lumineuse(s) de chacun des trois derniers modules optiques 1 vont être alignés entre eux (par réglage des modules optiques 1 au moyen du dispositif de réglage 110 comme décrit précédemment) de sorte à produire le segment horizontal.The individual light beams produced by the light source (s) of each of the first three optical modules 1 will be aligned with each other (by adjusting the optical modules 1 by means of the adjustment device 110 as described above). so as to produce the inclined segment 15 °. The individual light beams produced by the light source (s) of each of the last three optical modules 1 will be aligned with each other (by adjustment of the optical modules 1 by means of the adjustment device 110 as previously described). so to produce the horizontal segment.

Dans une deuxième variante de réalisation non limitative, la fonction photométrique est une fonction dite « high beam » pour réaliser un feu de route. Dans ce cas, le faisceau lumineux ne comporte aucune coupure.In a second variant of non-limiting embodiment, the photometric function is a function called "high beam" to achieve a high beam. In this case, the light beam has no cut.

Dans une troisième variante de réalisation non limitative, la fonction photométrique est une fonction dite « fog » pour réaliser un feu de brouillard. Dans ce cas, le faisceau lumineux est à coupure. Il comporte deux segments dont l'un est horizontal et l'autre incliné.In a third non-limiting embodiment, the photometric function is a so-called "fog" function for producing a fog lamp. In this case, the light beam is cut. It has two segments, one of which is horizontal and the other inclined.

Dans une quatrième variante de réalisation non limitative, la fonction photométrique f1 est une fonction DRL (« Daytime Running Lamp » en anglais) pour réaliser un feu diurne. Dans ce cas, le faisceau lumineux ne comporte aucune coupure.In a fourth non-limiting embodiment, the photometric function f1 is a DRL function ("Daytime Running Lamp" in English) for producing a daytime running light. In this case, the light beam has no cut.

Le dissipateur thermique 10 pour module optique 1 pour véhicule automobile V est obtenu par un procédé de fabrication P décrit ci-après en référence à la figure 7, ledit dissipateur thermique 10 comprenant une plaque pliée 100.The heat sink 10 for optical module 1 for a motor vehicle V is obtained by a manufacturing method P described hereinafter with reference to FIG. figure 7 said heat sink 10 comprising a folded plate 100.

Le procédé de fabrication P comporte :

  • le découpage d'une feuille d'un matériau thermo-conducteur pour former une plaque 100 (fonction illustrée sur la figure 7 DEC(11)) ;
  • le pliage de ladite plaque 100 de sorte à former une partie centrale 101 et deux parties latérales 102 formant chacune un angle β avec la partie centrale 101, ladite partie centrale 101 étant adaptée pour recevoir au moins une source lumineuse 13 du module optique 1 (fonction illustrée sur la figure 7 PLIE(100, 101, 102, β)).
The manufacturing method P comprises:
  • cutting a sheet of a thermally conductive material to form a plate 100 (function illustrated in FIG. figure 7 DEC (11));
  • folding said plate 100 so as to form a central portion 101 and two lateral portions 102 each forming an angle β with the central portion 101, said central portion 101 being adapted to receive at least one light source 13 of the optical module 1 (function illustrated on the figure 7 PLIE (100, 101, 102, β)).

Dans un mode de réalisation non limitatif, le matériau thermo-conducteur est en aluminium. La feuille est ainsi une feuille d'aluminium. On notera que la feuille d'aluminium est obtenue par extrusion.In a non-limiting embodiment, the thermally conductive material is aluminum. The sheet is thus an aluminum foil. It will be noted that the aluminum foil is obtained by extrusion.

Afin de former le dispositif de réglage 110 du module optique 1 sur un boîtier 2 décrit précédemment, dans un mode de réalisation non limitatif, ledit procédé de fabrication P comporte en outre le découpage et le poinçonnage de ladite plaque 100 (fonction illustrée sur la figure 7 DEC_POC(110)).In order to form the adjustment device 110 of the optical module 1 on a housing 2 described above, in a non-limiting embodiment, said manufacturing method P further comprises the cutting and punching of said plate 100 (function illustrated in FIG. figure 7 DEC_POC (110)).

Afin de former les moyens de centrage 130 du réflecteur 12 du module optique 1 décrits précédemment, dans un mode de réalisation non limitatif, ledit procédé de fabrication P comporte en outre le poinçonnage de ladite plaque 100 (fonction illustrée sur la figure 7 POC(130)).In order to form the centering means 130 of the reflector 12 of the optical module 1 described above, in a non-limiting embodiment, said manufacturing method P further comprises the punching of said plate 100 (function illustrated in FIG. figure 7 POC (130)).

Afin de former des pattes de fixation 140 du réflecteur 12 du module optique 1 décrites précédemment, dans un mode de réalisation non limitatif, ledit procédé de fabrication P comporte en outre le découpage et le poinçonnage de ladite plaque 100 (fonction illustrée sur la figure 7 DEC_POC(140)).In order to form fastening lugs 140 of the reflector 12 of the optical module 1 previously described, in a non-limiting embodiment, said manufacturing method P further comprises the cutting and punching of said plate 100 (function illustrated in FIG. figure 7 DEC_POC (140)).

Afin de former les orifices de centrage 150 de la carte à circuit imprimé 11 décrits précédemment, dans un mode de réalisation non limitatif, ledit procédé de fabrication P comporte en outre le poinçonnage de ladite plaque 100 (fonction illustrée sur la figure 7 POC(150)).In order to form the centering orifices 150 of the printed circuit board 11 described above, in a non-limiting embodiment, said manufacturing method P further comprises the punching of said plate 100 (function illustrated in FIG. figure 7 POC (150)).

Afin de former au moins une languette de support 120 d'un réflecteur 3 du module optique 1 décrite précédemment, dans un mode de réalisation non limitatif, ledit procédé de fabrication P comporte en outre le découpage et l'emboutissage de ladite plaque 100 (fonction illustrée sur la figure 7 DEC_EMB(120)).In order to form at least one support tongue 120 of a reflector 3 of the optical module 1 described above, in a non-limiting embodiment, said manufacturing method P further comprises the cutting and stamping of said plate 100 (function illustrated on the figure 7 DEC_EMB (120)).

On notera que l'ensemble de ces opérations peut se faire au moyen d'outils à la suite ou sur des postes séparés.It should be noted that all these operations can be done by means of tools in succession or on separate stations.

On notera également que les opérations pour former les éléments 110 à 150 du dissipateur thermique 10 peuvent être effectuées dans n'importe quel ordre.Note also that the operations to form the elements 110 to 150 of the heat sink 10 can be performed in any order.

L'opération de découpage de la feuille d'aluminium est effectuée elle en premier tandis que l'opération de pliage de la plaque 100 est effectuée elle en dernier.The cutting operation of the aluminum foil is carried out first while the folding operation of the plate 100 is performed last.

Bien entendu la description de l'invention n'est pas limitée aux modes de réalisation décrits ci-dessus.Of course, the description of the invention is not limited to the embodiments described above.

Ainsi, dans un autre mode de réalisation non limitatif, dans le cas où le faisceau lumineux global produit par les modules optiques 1 est totalement horizontal, le dispositif de réglage 110 peut être fixe (il n'est pas nécessaire d'avoir des vis de réglage 210 associées) de sorte que tous les faisceaux lumineux individuels sont alignés entre eux pour former le faisceau lumineux global horizontal.Thus, in another non-limiting embodiment, in the case where the overall light beam produced by the optical modules 1 is completely horizontal, the adjustment device 110 may be fixed (it is not necessary to have screws of setting 210 associated) so that all individual light beams are aligned with each other to form the horizontal overall light beam.

Ainsi, dans un autre mode de réalisation non limitatif, les moyens de centrage 130 ne sont pas des encoches, mais des pattes de centrage.Thus, in another non-limiting embodiment, the centering means 130 are not notches, but centering tabs.

Ainsi, l'invention décrite présente notamment les avantages suivants :

  • elle permet de réduire le poids du dissipateur thermique 10 et donc du dispositif d'éclairage ;
  • elle permet d'augmenter le rendement thermique pour évacuer la chaleur. La conductivité thermique du dissipateur thermique est plus élevée ;
  • elle permet de ne plus utiliser d'ailettes de dissipation. Ainsi, le dissipateur thermique nécessite moins de surface d'échange thermique (que celui avec des ailettes de dissipation) pour un rendement thermique plus élevé.
  • le dissipateur thermique 10 sert de support pour fixer les autres éléments du module optique 1, à savoir les sources lumineuses 13, la carte à circuit imprimé 11, le réflecteur 12 ;
  • le fait que le dissipateur thermique soit composé d'une plaque pliée et non plus d'une pièce moulée facilite l'usinage dudit dissipateur thermique ;
  • elle permet d'obtenir un dissipateur thermique 10 plus léger avec une meilleure performance thermique.
Thus, the invention described has the following advantages:
  • it reduces the weight of the heat sink 10 and therefore the lighting device;
  • it increases the thermal efficiency to evacuate the heat. The thermal conductivity of the heat sink is higher;
  • it allows to no longer use dissipation fins. Thus, the heat sink requires less heat exchange area (than that with dissipating fins) for a higher thermal efficiency.
  • the heat sink 10 serves as a support for fixing the other elements of the optical module 1, namely the light sources 13, the printed circuit board 11, the reflector 12;
  • the fact that the heat sink consists of a folded plate and no longer a molded part facilitates the machining of said heat sink;
  • it provides a lighter heat sink 10 with better thermal performance.

Claims (15)

Dissipateur thermique (10) pour module optique (1) pour véhicule automobile (V), caractérisé en ce que le dissipateur thermique (10) comprend une plaque pliée (100), ladite plaque (100) comprenant : - une partie centrale (101) adaptée pour recevoir au moins une source lumineuse (13) du module optique (1) et comprenant deux arêtes communes (A1, A2) avec deux parties latérales (102), les deux arêtes communes (A1, A2) formant des axes de pliage de ladite plaque (100) ; et - les deux parties latérales (102) formant chacune un angle (β) avec ladite partie centrale (101). Heat sink (10) for an optical module (1) for a motor vehicle (V), characterized in that the heat sink (10) comprises a folded plate (100), said plate (100) comprising: a central part (101) adapted to receive at least one light source (13) of the optical module (1) and comprising two common edges (A1, A2) with two lateral parts (102), the two common edges (A1, A2 ) forming fold axes of said plate (100); and - The two side portions (102) each forming an angle (β) with said central portion (101). Dissipateur thermique (10) selon la revendication 1, dans lequel ledit angle (β) est compris entre 0° et 180°.The heat sink (10) of claim 1, wherein said angle (β) is between 0 ° and 180 °. Dissipateur thermique (10) selon la revendication 1 ou la revendication 2, dans lequel ledit angle (β) est égal à 90°.The heat sink (10) of claim 1 or claim 2, wherein said angle (β) is 90 °. Dissipateur thermique (10) selon l'une quelconque des revendications précédentes 1 à 3, dans lequel la plaque (100) est composée d'un matériau thermo-conducteur.Heat sink (10) according to any one of the preceding claims 1 to 3, wherein the plate (100) is made of a thermally conductive material. Dissipateur thermique (10) selon l'une quelconque des revendications précédentes 1 à 4, dans lequel la plaque (100) est en aluminium.Heat sink (10) according to any one of the preceding claims 1 to 4, wherein the plate (100) is made of aluminum. Dissipateur thermique (10) selon l'une quelconque des revendications précédentes 1 à 5, dans lequel ledit dissipateur thermique (10) comprend en outre un dispositif de réglage (110) du module optique (1) sur un boîtier (2), ledit dispositif de réglage (110) comprenant au moins trois pattes de réglage (110).Heat sink (10) according to any one of the preceding claims 1 to 5, wherein said dissipator thermal device (10) further comprises an adjustment device (110) of the optical module (1) on a housing (2), said adjustment device (110) comprising at least three adjustment tabs (110). Dissipateur thermique (10) selon l'une quelconque des revendications précédentes 1 à 6, dans lequel ledit dissipateur thermique (10) comprend en outre des moyens de centrage (130) d'une surface optique (12) du module optique (1).Heat sink (10) according to any one of the preceding claims 1 to 6, wherein said heat sink (10) further comprises centering means (130) of an optical surface (12) of the optical module (1). Dissipateur thermique (10) selon l'une quelconque des revendications précédentes 1 à 7, dans lequel ledit dissipateur thermique (10) comprend en outre des pattes de fixation (140) de la surface optique (12) du module optique (1) disposées de part et d'autre de la partie centrale (101).A heat sink (10) as claimed in any one of the preceding claims 1 to 7, wherein said heat sink (10) further comprises tabs (140) for attaching the optical surface (12) of the optical module (1) both sides of the central part (101). Dissipateur thermique (10) selon l'une quelconque des revendications précédentes 1 à 8, dans lequel ledit dissipateur thermique (10) comprend en outre des orifices de centrage (150) d'une carte à circuit imprimé (11).The heat sink (10) of any one of the preceding claims 1 to 8, wherein said heat sink (10) further comprises centering orifices (150) of a printed circuit board (11). Dissipateur thermique (10) selon l'une quelconque des revendications précédentes 7 à 9, dans lequel la surface optique (12) est un réflecteur ou une lentille.Heat sink (10) according to any one of the preceding claims 7 to 9, wherein the optical surface (12) is a reflector or a lens. Module optique (1) pour véhicule automobile (V) caractérisé en ce qu'il comprend : - le dissipateur thermique (10) selon l'une quelconque des revendications précédentes 1 à 10 ; - au moins une surface optique (12) adaptée pour être fixée sur le dissipateur thermique (10) et pour coopérer avec au moins une source lumineuse (13) ; et - ladite au moins une source lumineuse (13) adaptée pour être disposée sur le dissipateur thermique (10). Optical module (1) for a motor vehicle (V), characterized in that it comprises: the heat sink (10) according to any one of the preceding claims 1 to 10; at least one optical surface adapted to be fixed on the heat sink and to cooperate with at least one light source; and said at least one light source (13) adapted to be disposed on the heat sink (10). Module optique (1) selon la revendication 11, selon lequel le module optique (1) comprend en outre une carte à circuit imprimé (11) adaptée pour être montée sur le dissipateur thermique (10) et pour recevoir ladite au moins une source lumineuse (13).Optical module (1) according to claim 11, wherein the optical module (1) further comprises a printed circuit board (11) adapted to be mounted on the heat sink (10) and to receive said at least one light source ( 13). Dispositif d'éclairage (3) pour véhicule automobile (V) comprenant un boîtier (2) et au moins un module optique (1) selon la revendication 11 ou la revendication 12, le dissipateur thermique (10) du module optique (1) étant disposé sur ledit boîtier (2).Lighting device (3) for a motor vehicle (V) comprising a housing (2) and at least one optical module (1) according to claim 11 or claim 12, the heat sink (10) of the optical module (1) being disposed on said housing (2). Dispositif d'éclairage (3) selon la revendication 13, dans lequel ledit dispositif d'éclairage (3) est un projecteur.A lighting device (3) according to claim 13, wherein said lighting device (3) is a projector. Procédé de fabrication (P) d'un dissipateur thermique (10) pour module optique (1) pour véhicule automobile (V), caractérisé en ce que ledit procédé de fabrication (P) comprend : - le découpage d'une feuille d'un matériau thermo-conducteur pour former une plaque (100) ; - le pliage de ladite plaque (100) de sorte à former une partie centrale (101) et deux parties latérales (102) formant chacune un angle (β) avec la partie centrale (101), ladite partie centrale (101) étant adaptée pour recevoir au moins une source lumineuse (13) du module optique (1). A manufacturing method (P) of a heat sink (10) for an optical module (1) for a motor vehicle (V), characterized in that said manufacturing method (P) comprises: - cutting a sheet of a thermally conductive material to form a plate (100); - folding said plate (100) so as to form a central portion (101) and two lateral portions (102) each forming an angle (β) with the central portion (101), said central portion (101) being adapted to receiving at least one light source (13) of the optical module (1).
EP16182418.0A 2015-08-06 2016-08-02 Heat sink for motor vehicle optical module Active EP3128230B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1557586A FR3039885B1 (en) 2015-08-06 2015-08-06 HEAT SINK FOR MOTOR VEHICLE OPTICAL MODULE

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EP3128230A1 true EP3128230A1 (en) 2017-02-08
EP3128230B1 EP3128230B1 (en) 2020-03-11

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EP (1) EP3128230B1 (en)
CN (1) CN106439669A (en)
FR (1) FR3039885B1 (en)

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Also Published As

Publication number Publication date
US10378712B2 (en) 2019-08-13
EP3128230B1 (en) 2020-03-11
FR3039885A1 (en) 2017-02-10
CN106439669A (en) 2017-02-22
FR3039885B1 (en) 2022-06-24
US20170045194A1 (en) 2017-02-16

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