EP3123620A1 - Appareil de test pour une prise de communication à grande vitesse et ses procédés de fonctionnement - Google Patents

Appareil de test pour une prise de communication à grande vitesse et ses procédés de fonctionnement

Info

Publication number
EP3123620A1
EP3123620A1 EP15770310.9A EP15770310A EP3123620A1 EP 3123620 A1 EP3123620 A1 EP 3123620A1 EP 15770310 A EP15770310 A EP 15770310A EP 3123620 A1 EP3123620 A1 EP 3123620A1
Authority
EP
European Patent Office
Prior art keywords
trace
traces
adjacent
testing unit
pin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP15770310.9A
Other languages
German (de)
English (en)
Other versions
EP3123620A4 (fr
Inventor
Brett Robinson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sentinel Connector Systems Inc
Original Assignee
Sentinel Connector Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US14/223,364 external-priority patent/US9912448B2/en
Application filed by Sentinel Connector Systems Inc filed Critical Sentinel Connector Systems Inc
Publication of EP3123620A1 publication Critical patent/EP3123620A1/fr
Publication of EP3123620A4 publication Critical patent/EP3123620A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6473—Impedance matching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R31/00—Coupling parts supported only by co-operation with counterpart
    • H01R31/06—Intermediate parts for linking two coupling parts, e.g. adapter
    • H01R31/065—Intermediate parts for linking two coupling parts, e.g. adapter with built-in electric apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/38—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts
    • H01R24/40—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency
    • H01R24/50—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency mounted on a PCB [Printed Circuit Board]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/60—Contacts spaced along planar side wall transverse to longitudinal axis of engagement
    • H01R24/62—Sliding engagements with one side only, e.g. modular jack coupling devices
    • H01R24/64—Sliding engagements with one side only, e.g. modular jack coupling devices for high frequency, e.g. RJ 45
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09027—Non-rectangular flat PCB, e.g. circular
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector

Definitions

  • the present disclosure relates to a testing framework of a network connection jack used to connect a network cable to a device.
  • a registered jack is a standardized physical interface for connecting telecommunications and data equipment.
  • the RJ standardized physical interface includes both jack construction and wiring pattern.
  • a commonly used RJ standardized physical interface for data equipment is the RJ45 physical network interface, also referred to as an RJ45 jack.
  • the RJ45 jack is widely used for local area networks such as those implementing the Institute of Electrical and Electronic Engineers (IEEE) 802.3 Ethernet protocol.
  • the RJ45 jack is described in various standards, including one that is promulgated by the American National Standards Institute (ANSI)/Telecommunications Industry Association (TIA) in ANSI/TIA-1096-A.
  • All electrical interface components such as cables and jacks, including the RJ45 jack, not only resist the initial flow of electrical current, but also oppose any change to it. This property is referred to as reactance.
  • reactance Two relevant types of reactance are inductive reactance and capacitive reactance. Inductive reactance may be created, for example, based on a movement of current through a cable that resists, which causes a magnetic field that induces a voltage in the cable.
  • Capacitive reactance is created by an electrostatic charge that appears when electrons from two opposing surfaces are placed close together.
  • the various components of a communications circuit preferably have matching impedances. If not, a load with one impedance value will reflect or echo part of a signal being carried by a cable with a different impedance level, causing signal failures. For this reason, data communication equipment designer and manufacturers, such as cable vendors, design and test their cables to verify that impedance values, as well as resistance and capacitance levels, of the cables comply with certain performance parameters.
  • the RJ45 jack is also a significant component in nearly every communications circuit, however, jack manufacturers have not provided the same level of attention to its performance. Thus, although problems related to existing RJ45 jacks are well documented in tests and their negative impact on high frequency signal lines is understood, the industry seems reluctant to address the issues for this important component of the physical layer. Consequently, there is a need for an improved high speed jack
  • One embodiment of the present invention discloses a testing unit that includes a substrate, a plurality of vias located in the substrate, a plurality of pin traces having a height and a width and each extending from a respective via towards an edge of the substrate, a plurality of end traces having a height and a width with each end trace extending from an end of a respective pin trace towards the edge of the substrate, a plurality of branch traces having a height and a width and each extending from a side of a respective pin trace, and a plurality of traces extending from the end of a respective end trace, branch trace or pin trace to the edge of the substrate where each end trace is adjacent to a respective branch trace, each end trace is adjacent to a respective branch trace on one side and a pin trace on the opposite side, and each pin trace is adjacent to another pin trace on one side.
  • each pin trace is separated from each trace by a first distance.
  • each end trace is separated from each trace by a second distance.
  • each branch trace is separated from the adjacent end trace by a third distance.
  • adjacent pin traces are separated by a forth distance.
  • the testing unit includes a grounding plane in the substrate that is separated from each trace by a distance.
  • the height and width of adjacent traces and a distance separating adjacent traces are adjusted such that the adjacent traces are magnetically coupled.
  • the inductance and capacitance of each trace is adjusted by adjusting the first distance between the grounding plane and each trace.
  • the height and width of adjacent end traces and branch traces are adjusted such that the end traces are magnetically coupled to adjacent branch traces.
  • the substrate is RO XT8100, Rogers material.
  • the capacitance of each trace is adjusted to between approximately 0.51 picofarads (pF) to approximately 2pf.
  • the testing unit includes a second ground plane positioned between the first ground plane and a surface of the substrate opposite the surface of the substrate having the plurality of traces.
  • the inductance and capacitance of each trace is adjusted by adjusting a distance between the first ground plane and second ground plane and a distance between the first ground plane and each trace.
  • a pin of an RJ 45 jack is connected to each via.
  • an end of each trace is coupled to a connection unit.
  • connection unit is an RJ 45 connector.
  • the height and width of adjacent pin traces and a distance separating adjacent pin traces are adjusted such that the adjacent pin traces are magnetically coupled.
  • the height and width of adjacent end traces and branch traces and the distance separating adjacent end traces and branch traces are adjusted such that the adjacent end traces and branch traces are magnetically coupled.
  • each end trace and branch trace are adjusted by adjusting the distance between the grounding plane and each end trace and each branch trace.
  • the inductance and capacitance of each pin trace is adjusted along the length of the trace by adjusting the predetermined distance between the grounding plane and each end trace.
  • Another embodiment of the present invention includes a method of testing a high speed communication jack including the steps of adjusting the capacitance and inductance of adjacent traces along the length of each adjacent trace by modifying a distance between each adjacent trace and a ground plane embedded in the substrate, adjusting the height, width and separation distance of adjacent traces on a substrate such that two adjacent traces are magnetically coupled, transmitting a signal from a first signal generator across each adjacent trace to a high speed communication jack, transmitting the signal from the high speed communication jack across a cable, receiving the signal at a signal receiving device, and comparing the received signal with the transmitted signal to determine the differences in the signal.
  • the high speed communication jack is a RJ 45 communication jack.
  • the substrate is RO XT8100, Rogers material.
  • the capacitance of each adjacent trace is adjusted to between approximately 0.51 picofarads (pF) to approximately 2pF.
  • FIG. 1 illustrates a testing unit for a high speed communication jack
  • FIG. 2 illustrates a matching portion of the testing unit of FIG. 1,
  • FIG. 3 is a schematic diagram of the testing unit of FIG. 1 ;
  • FIG. 4 depicts a diagram of the circuit formed in the testing unit of FIG. 1;
  • FIG. 5 depicts one embodiment of a testing unit for a high speed communication jack
  • FIG. 6 depicts one embodiment of the connection of two testing unit s for high speed connection j acks .
  • FIG. 1 illustrates a testing unit 100 for a high speed communication jack.
  • the testing unit 100 or testing framework, includes a pin connection portion 102 that is configured to affix to a high speed communication jack such as, but not limited to, a RJ 45 communication jack.
  • Traces 104, 106, 108, 110, 112, 114, 116 and 118 extend radially from the pin connection portion 102 to the outer edge of the testing unit 100.
  • the end of each trace 104, 106, 108, 110 112, 114, 116 and 118 terminates at the edge of the testing unit 100 to allow for the connection of a communication unit (not shown).
  • the connection units 120, 122, 124, 126, 128, 130, 132 and 134 may be any type of connector including, but not limited to a RJ 45 connector.
  • FIG. 2 depicts a blown up view of the connection portion 102.
  • the connection portion 102 includes vias 202, 204, 206, 208, 210, 212, 214, and 216 that are sized to engage the pins of a high speed communication jack.
  • Pin traces 218, 220, 222, 224, 226, 228, 230 and 232 extend radially from the vias 202, 204, 206, 208, 210, 212, 214, and 216 towards the traces 104, 106, 108, 110, 112, 114, 116 and 118.
  • Each pin trace 218, 220, 222, 224, 226, 228, 230 and 232 is matched to an adjacent pin trace 218, 220, 222, 224, 226, 228, 230 or 232.
  • pin trace 218 is matched to pin trace 220
  • pin trace 222 is match with pin trace 224
  • pin trace 226 is matched to pin trace 228
  • pin trace 230 is matched to pin trace 232.
  • Each pin trace 218, 220, 222, 224, 226, 228, 230 and 232 and 234 has a length (L), a height (H) and a width (W), and is separated from an adjacent pin trace by a distance (S).
  • each pin trace 218, 220, 222, 224, 226, 228, 230 and 232 is approximately 35 mils. By adjusting the length, height and width of adjacent pin traces, the inductance of adjacent pin traces can be matched.
  • the end of each pin trace 218, 220, 222, 224, 226, 228, 230 and 232 is separated from a respective trace 102, 104, 106, 108, 110, 112 or 114 by a predetermined distance (Se).
  • Branch traces 234, 236, 238 and 240 extend from one side of a respective pin trace 218, 222, 226 and 232.
  • End traces 242, 244, 246, and 248 extend from the end of each pin trace 220, 224, 228 and 230 towards the respective matched pin such that the end trace 242, 244, 246 and 248 is substantially parallel to the corresponding branch trace 234, 236, 238 and 240 and is positioned between the end of each pin trace 218, 220, 222, 224, 226, 228, 230 or 232 and the end of each trace 102, 104, 106, 108, 110, 112 or 114.
  • the end traces 242, 244, 246 and 248 and branch traces 234, 236, 238 and 240 are separated from the ends of each respective trace 102, 104, 106, 108, 110, 112 or 114 by the predetermined distance Se.
  • the distance Se is constant along the length of the end trace 236, 238, 240, 242, 244, 246, 248 or 250.
  • the distance Se varies along the length of the end trace 236, 238, 240, 242, 244, 246, 248 or 250.
  • Each branch trace 234, 236, 238 and 240 and each end trace 242, 244, 246 and 248 has a length (L), width (W) and height (H).
  • each branch trace 234, 236, 238 and 240 and each end trace 242, 244, 246 and 248 in conjunction with the separation distance Se By adjusting the length, height and width of each branch trace 234, 236, 238 and 240 and each end trace 242, 244, 246 and 248 in conjunction with the separation distance Se, different inductive and conductive configurations can be achieved. By matching the conductive and inductive patterns of two adjacent traces, the traces can be magnetically coupled.
  • the width of each branch trace 234, 236, 238 and 240 may be approximately 35 mils.
  • the width of each end trace 242, 244, 246 and 248 may be approximately 10 mils.
  • FIG. 3 depicts a cut away view of the connection portion 102.
  • the connection portion 102 includes a top surface 302.
  • the traces 218, 220, 234 and 242 are positioned on the top surface 304 and a first grounding trace 306 and a second grounding trace 308 are positioned in the dielectric layers below the top surface with the first grounding trace 306 being separated from the top surface 302 by a first dielectric layer having a height HI .
  • the second grounding trace 308 is separated from the first grounding trace 306 by a second dielectric layer 310 having a second height H2.
  • each trace 218, 220, 234 and 242 can be adjusted by modifying the length, width and height of each trace 218, 220, 234 and 242.
  • the adjacent traces can be magnetically coupled to one another eliminating crosstalk or noise.
  • the dielectric layers are made from a material having a dielectric constant greater than 3.0 such as, but not limited to, RO XT8100, ROGERS Material, or any other material capable of isolating a high frequency electrical signal.
  • FIG. 4 depicts a diagram of the circuit formed in the testing unit 100.
  • the schematic includes the connection portion 402, an input stimulus 404, a RJ 45 high speed communication jack 406 and a output load 408.
  • the RJ 45 jack 406 includes internal traces 410 and 412 that are connected to pins 414 and 416 which engage vias 418 and 420.
  • the vias 418 and 410 are electrically connected to the pin traces 422 and 424 on the testing unit 100.
  • the inductance at various points along the pin traces 422 and 424 and traces are represented by inductors PCB 3 and 4 and via 3 and 4.
  • the inductance of each trace is changed by adjusting the height HI of the dielectric layer under the pin traces and the height H2 between the second grounding trace 306 and first grounding trace 304 under each trace.
  • the inductance and capacitance of the branch traces and end traces are represented by capacitors C8 and CIO and inductors LI and L5.
  • the capacitors C8 and CIO are adjusted by changing the height, width and length of the end traces and branch traces in conjunction with the distance between the end traces 242, 244, 246 and 248 and branch traces 234, 236, 238 and 240.
  • the inductance of the branch traces 234, 236, 238 and 240 and end traces 242, 244, 246 and 248 are changed by adjusting the height HI of the dielectric layer under the end or branch trace traces and the height H2 between the second grounding trace 306 and first grounding trace 304 under each end or branch trace.
  • the capacitors created by the traces, including the pin traces, end traces and branch traces, and the grounding traces 304 and 306 are sized between approximately 0.51 picofarads (pF) to approximately 2pf.
  • the top and bottom surfaces of the unit 100 may be covered in a plastic insulating layer to further enhance the operation of the circuit. In one embodiment, signals are driven through the line using between approximately 4mW of power and 20mW of power.
  • FIG. 5 depicts one embodiment of a testing unit for a high speed communication jack.
  • the testing unit 500 includes a high speed communication jack 502 connected to the connection portion 102 of the testing unit 500 may be a RJ type connector, Universal Serial Bus (USB) connector and jack, Fire-wire (1394) connector and jack, HDMI (High-Definition Multimedia Interface) connector and jack, D-subminiature type connector and jack, ribbon type connector or jack, or any other connector or jack receiving a high speed communication signal.
  • the high speed communication jack 502 is connected to the connection portion 102 such that each pin on the high speed communication jack 502 corresponds to one of the vias 202, 204, 206, 208, 210, 212, 214 and 216.
  • the high speed communications jack 502 may be configured such that pairs of pins are magnetically coupled together.
  • Each trace 104, 106, 108, 110, 112, 114, 116 and 118 extends from the connection portion 102 to the connection units 120, 122, 124, 126, 128, 130, 132 and 134.
  • the connection units 120, 122, 124, 126, 128, 130, 132 and 134 are configured such that a cable having a connector, such as a RJ 45 connector, can be removably attached to each of the connection units 120, 122, 124, 126, 128, 130, 132 and 134.
  • connection units 120, 122, 124, 126, 128, 130, 132 and 134 transmit signals from the cable connected to the connection unit 120, 122, 124, 126, 128, 130, 132 and 134 and the associated trace 104, 106, 108, 110, 112, 114, 116 or 118 connected to the connection unit 104, 106, 108, 110, 112, 114, 116 and 118 .
  • the connection units 104, 106, 108, 110, 112, 114, 116 and 118 are affixed to a connection plate 504 that extends around the periphery of the testing unit 502.
  • the connection plate 504 may be made of metal, such as steel, or plastic.
  • connection units 104, 106, 108, 110, 112, 114, 116 and 118 are affixed to the side surface of the connection plate 504 such that the central axis of the connection unit 104, 106, 108, 110, 112, 114, 116 or 118 is substantially parallel to the surface of the testing unit 500.
  • FIG. 6 depicts a schematic representation of the testing units connected together across a network.
  • a first testing unit 602 is connected to a second testing unit 604 by a cable 606 connected to the high speed communication jack on each of the testing unit 602 and 604.
  • the cable 606 may be a communication cable such as an Ethernet cable, a category 5, 6, or 7 cable, a serial cable, a Fire-wire cable, a USB cable or any other type of communication cable.
  • the cable 606 includes connectors (not shown) to allow the cable 606 to be removably connected to the high speed communication jacks.
  • the high speed communication jack on the first testing unit 602 is the same type of high speed communication jack as the second testing unit 604.
  • the high speed communication jack on the first testing unit 602 is a different type than the high speed communication jack on the second testing unit 604.
  • the cable can be of any length including, but not limited to, 3 feet, 6, feet, 10 feet, 12 feet, 15 feet or 20 feet.
  • connection units 104, 106, 108, 110, 112, 114, 116 or 118 each connect to a signal transmission and receiving unit 610 and 612 via cables coupled to the connection units 104, 106, 108, 110, 112, 114, 116 or 118 on one end and to the signal transmission and receiving units 610 and 612 on the opposite end.
  • the signal transmission and receiving unit 610 transmits a signal from the first testing unit 602 to the second testing unit 604 via the high speed connection jacks on the first and second testing units 602 and 604.
  • the second testing unit 604 Upon receiving the signal, the second testing unit 604 transmits the signal to the signal transmission and receiving unit 612.
  • the signal transmission and receiving unit 612 transmits a new signal back to the signal transmission and receiving unit 610 over the cable 608. In one embodiment, the signal transmission and receiving unit 612 transmits a second signal to the signal transmission and receiving unit 612 that is based on the signal previously transmitted by the signal transmission and receiving unit 610. In another embodiment, the signal transmission and receiving unit 612 transmits a second signal to the signal transmission and receiving unit 610 that is substantially identical to the signal previously transmitted by the signal transmission and receiving unit 610.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Manufacturing Of Electrical Connectors (AREA)

Abstract

La présente invention concerne une unité d'essai comprenant un substrat, une pluralité de trous d'interconnexion située dans le substrat, une pluralité de traces de broche ayant une hauteur et une largeur et s'étendant chacune à partir d'un trou d'interconnexion respectif vers un bord du substrat, une pluralité de traces d'extrémité ayant une hauteur et une largeur avec chaque trace d'extrémité s'étendant depuis une extrémité d'une trace de broche respective vers le bord du substrat, une pluralité de traces de branchement ayant une hauteur et une largeur et s'étendant chacune à partir d'un côté d'une trace de broche respective, une pluralité de traces s'étendant depuis l'extrémité d'une trace d'extrémité respective, de trace de branchement ou de trace de broche jusqu'au bord du substrat, où chaque trace d'extrémité est adjacente à une trace de branchement respective.
EP15770310.9A 2014-03-24 2015-03-23 Appareil de test pour une prise de communication à grande vitesse et ses procédés de fonctionnement Withdrawn EP3123620A4 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/223,364 US9912448B2 (en) 2012-02-13 2014-03-24 Testing apparatus for a high speed communications jack and methods of operating the same
PCT/US2015/022029 WO2015148386A1 (fr) 2014-03-24 2015-03-23 Appareil de test pour une prise de communication à grande vitesse et ses procédés de fonctionnement

Publications (2)

Publication Number Publication Date
EP3123620A1 true EP3123620A1 (fr) 2017-02-01
EP3123620A4 EP3123620A4 (fr) 2018-03-14

Family

ID=54196269

Family Applications (1)

Application Number Title Priority Date Filing Date
EP15770310.9A Withdrawn EP3123620A4 (fr) 2014-03-24 2015-03-23 Appareil de test pour une prise de communication à grande vitesse et ses procédés de fonctionnement

Country Status (11)

Country Link
EP (1) EP3123620A4 (fr)
JP (1) JP2017514268A (fr)
KR (1) KR20160137572A (fr)
CN (1) CN106233543A (fr)
AU (1) AU2015236376A1 (fr)
CA (1) CA2943341A1 (fr)
IL (1) IL247579A0 (fr)
MX (1) MX2016011644A (fr)
PH (1) PH12016501870A1 (fr)
RU (1) RU2016141147A (fr)
WO (1) WO2015148386A1 (fr)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6379157B1 (en) * 2000-08-18 2002-04-30 Leviton Manufacturing Co., Inc. Communication connector with inductive compensation
US6980007B1 (en) * 2002-06-07 2005-12-27 Marvell International Ltd. Cable tester with insertion loss and return loss estimators
US6960919B2 (en) * 2003-12-19 2005-11-01 Avo Multi-Amp Corporation Measurement connector for test device
US8259906B2 (en) * 2008-09-22 2012-09-04 Centurylink Intellectual Property Llc System and method for testing a DSL and POTS connection
US8395393B2 (en) * 2010-02-02 2013-03-12 Raytheon Company Cable test method
US8637987B2 (en) * 2011-08-09 2014-01-28 Micron Technology, Inc. Semiconductor assemblies with multi-level substrates and associated methods of manufacturing
US8858266B2 (en) * 2012-02-13 2014-10-14 Sentinel Connector Systems, Inc. High speed communication jack

Also Published As

Publication number Publication date
KR20160137572A (ko) 2016-11-30
CA2943341A1 (fr) 2015-10-01
EP3123620A4 (fr) 2018-03-14
JP2017514268A (ja) 2017-06-01
IL247579A0 (en) 2016-11-30
CN106233543A (zh) 2016-12-14
PH12016501870A1 (en) 2017-01-09
MX2016011644A (es) 2016-12-14
AU2015236376A1 (en) 2016-09-15
RU2016141147A (ru) 2018-04-24
WO2015148386A1 (fr) 2015-10-01

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