EP3064834A1 - Heater and glow plug - Google Patents
Heater and glow plug Download PDFInfo
- Publication number
- EP3064834A1 EP3064834A1 EP14859213.2A EP14859213A EP3064834A1 EP 3064834 A1 EP3064834 A1 EP 3064834A1 EP 14859213 A EP14859213 A EP 14859213A EP 3064834 A1 EP3064834 A1 EP 3064834A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- ceramic body
- metal cap
- slit
- heater
- conductor layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 claims abstract description 85
- 229910052751 metal Inorganic materials 0.000 claims abstract description 77
- 239000002184 metal Substances 0.000 claims abstract description 77
- 238000010438 heat treatment Methods 0.000 claims abstract description 43
- 239000004020 conductor Substances 0.000 claims abstract description 36
- 239000000463 material Substances 0.000 description 23
- 229910000679 solder Inorganic materials 0.000 description 20
- 230000002093 peripheral effect Effects 0.000 description 12
- 229910052581 Si3N4 Inorganic materials 0.000 description 8
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- 230000008646 thermal stress Effects 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 230000007774 longterm Effects 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 229910052681 coesite Inorganic materials 0.000 description 2
- 238000002485 combustion reaction Methods 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910052906 cristobalite Inorganic materials 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000003350 kerosene Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229910052682 stishovite Inorganic materials 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 229910052905 tridymite Inorganic materials 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910020968 MoSi2 Inorganic materials 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910008814 WSi2 Inorganic materials 0.000 description 1
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000004323 axial length Effects 0.000 description 1
- QDWJUBJKEHXSMT-UHFFFAOYSA-N boranylidynenickel Chemical compound [Ni]#B QDWJUBJKEHXSMT-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- VQCBHWLJZDBHOS-UHFFFAOYSA-N erbium(III) oxide Inorganic materials O=[Er]O[Er]=O VQCBHWLJZDBHOS-UHFFFAOYSA-N 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 235000021180 meal component Nutrition 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 239000011224 oxide ceramic Substances 0.000 description 1
- 229910052574 oxide ceramic Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
- FIXNOXLJNSSSLJ-UHFFFAOYSA-N ytterbium(III) oxide Inorganic materials O=[Yb]O[Yb]=O FIXNOXLJNSSSLJ-UHFFFAOYSA-N 0.000 description 1
- RUDFQVOCFDJEEF-UHFFFAOYSA-N yttrium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[Y+3].[Y+3] RUDFQVOCFDJEEF-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/40—Heating elements having the shape of rods or tubes
- H05B3/42—Heating elements having the shape of rods or tubes non-flexible
- H05B3/48—Heating elements having the shape of rods or tubes non-flexible heating conductor embedded in insulating material
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F23—COMBUSTION APPARATUS; COMBUSTION PROCESSES
- F23Q—IGNITION; EXTINGUISHING-DEVICES
- F23Q7/00—Incandescent ignition; Igniters using electrically-produced heat, e.g. lighters for cigarettes; Electrically-heated glowing plugs
- F23Q7/001—Glowing plugs for internal-combustion engines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/027—Heaters specially adapted for glow plug igniters
Definitions
- the present invention relates to heaters for use in, for example, combustion vehicle heating systems, kerosene fan heaters, glow plugs for automobile engines, various sensors such as oxygen sensors, or measurement devices.
- the present invention also relates to glow plugs including the heaters.
- Patent Document 1 An example of heaters for use in combustion vehicle heating systems, kerosene fan heaters, glow plugs for automobile engines, various sensors such as oxygen sensors, or measurement devices is disclosed in, for example, Japanese Unexamined Utility Model Registration Application Publication No. 63-80456 (hereinafter referred to as Patent Document 1).
- the heater disclosed in Patent Document 1 includes a ceramic body including a heating resistor embedded therein, and a metal cap provided so as to cover an end of the ceramic body.
- the metal cap is electrically connected to the heating resistor, so that electric power can be supplied to the heating resistor by connecting a lead terminal to the metal cap. Thus, heat can be generated by the heater.
- the present invention has been made in light of the above-described problems, and an object of the present invention is to provide a heater in which thermal stress generated between a ceramic body and a metal cap can be reduced.
- a heater includes a rod-shaped ceramic body; a heating resistor embedded in the ceramic body; a conductor layer on at least a surface of the ceramic body at one end of the ceramic body, the conductor layer being electrically connected to the heating resistor; and a metal cap for external connection, the metal cap covering the one end of the ceramic body together with at least a portion of the conductor layer.
- the metal cap has a slit in a portion of an outer periphery of the metal cap, the slit extending from an outer region toward an inner region.
- Fig. 1 is a sectional view of a heater 10 according to the embodiment of the present invention.
- the heater 10 includes a ceramic body 1, a heating resistor 2 embedded in the ceramic body 1, and a metal cap 4 that covers one end of the ceramic body 1.
- a conductor layer 3 is provided on the one end of the ceramic body 1.
- the hatched area shows the region in which the conductor layer 3 is provided.
- the heating resistor 2 and the conductor layer 3 are electrically connected to each other by a lead portion 22.
- the ceramic body 1 is, for example, a rod-shaped component.
- a rod-shaped object is defined as an object that is long in a certain direction. Therefore, a plate-shaped object that is long in a certain direction may also be regarded as being rod-shaped.
- the ceramic body 1 has a tapered portion 11 at the one end thereof.
- the ceramic body 1 may be made of, for example, electrically insulating ceramics, such as oxide ceramics, nitride ceramics, or carbide ceramics. More specifically, alumina ceramics, silicon nitride ceramics, aluminum nitride ceramics, silicon carbide ceramics, etc., may be used.
- the ceramic body 1 is preferably made of a silicon nitride ceramic. Silicon nitride ceramics are advantageous in that silicon nitride, which is the main component, is strong, tough, highly insulative, and highly resistant to heat.
- the ceramic body 1 made of a silicon nitride ceramic may be obtained by, for example, mixing silicon nitride, which is the main component, with 5 to 15 mass% of a rare earth element oxide, such as Y 2 O 3 , Yb 2 O 3 , or Er 2 O 3 , which serves as a sintering additive, 0.5 to 5 mass% of Al 2 O 3 , and SiO 2 so that the content of SiO 2 in the sintered body is 1.5 to 5 mass%; forming the mixture into a predetermined shape; and performing hot-press firing at 1650°C to 1780°C.
- a rare earth element oxide such as Y 2 O 3 , Yb 2 O 3 , or Er 2 O 3
- the length of the ceramic body 1 is set to, for example, 20 to 50 mm, and the diameter of the ceramic body 1 is set to, for example, 2.5 to 5 mm.
- the length of the ceramic body 1 is about 20 to 50 mm and the diameter of the ceramic body 1 is about 3 mm
- the length of the tapered portion 11 may be set to 0.1 to 3 mm
- the diameter of the end surface of the tapered portion 11 may be set to 1 to 2.9 mm.
- the ceramic body 1 is made of a silicon nitride ceramic and the heating resistor 2 is made of molybdenum (Mo) or tungsten (W), MoSi 2 or WSi 2 , for example, is preferably mixed and dispersed in the ceramic body 1.
- Mo molybdenum
- W tungsten
- MoSi 2 or WSi 2 for example, is preferably mixed and dispersed in the ceramic body 1.
- the coefficient of thermal expansion of the silicon nitride ceramic which is the base material, can be set to a value close to the coefficient of thermal expansion of the heating resistor 2, and the durability of the heater 10 can be increased.
- the heating resistor 2 is a resistor for generating heat, and generates heat when a current flows therethrough.
- the heating resistor 2 is embedded in the ceramic body 1.
- the heating resistor 2 includes a heating portion 21, which is a portion that mainly generates heat, and lead portions 22 that are connected to the heating portion 21.
- the heating portion 21 of the heating resistor 2 is provided at the other end of the ceramic body 1.
- the heating portion 21 has a folded shape, and both ends thereof are connected to the lead portions 22.
- the heating portion 21 having the folded shape generates a maximum amount of heat in a central region of the folded portion.
- the distance from the front end of the heating portion 21 to the rear end of the heating resistor 2 in the length direction of the ceramic body 1 is set to, for example, 2 to 10 mm.
- the lead portions 22 are components for electrically connecting the heating portion 21 to an external power supply. One end of each lead portion 22 extends to a surface of the ceramic body 1, and the other end is connected to the heating portion 21. The lead portions 22 are separately connected to both ends of the heating portion 21. One of the lead portions 22 extends to an end surface of the ceramic body 1 at the one end thereof. In Fig. 2 , the location at which the lead portion 22 extends to the end surface of the ceramic body 1 at the one end thereof is shown by the broken line. The other lead portion 22 extends to an outer peripheral surface of the ceramic body 1 in a region near the one end thereof.
- the heating resistor 2 may be made be made of a material having, for example, a carbide, nitride, or silicide of W, Mo, titanium (Ti) or the like as the main component.
- the heating resistor 2 may contain the same material as the material of the ceramic body 1, so that the ceramic body 1 and the heating resistor 2 have coefficients of thermal expansion that are close to each other.
- the heating portion 21 has a high resistance, and generates a maximum amount of heat in a region around the folded portion.
- the resistance per unit length of the lead portions 22 is set to a value smaller than that of the heating portion 21 by, for example, making the content of the material of the ceramic body 1 in the lead portions 22 smaller than that in the heating portion 21, or making the cross section of the lead portions 22 larger than that of the heating portion 21.
- the conductor layer 3 is a component for electrically connecting the heating resistor 2 to an external electrode.
- the conductor layer 3 is provided on the one end of the ceramic body 1. More specifically, the conductor layer 3 is provided on the end surface of the ceramic body 1 and a portion of the outer peripheral surface of the tapered portion 11.
- the conductor layer 3 is electrically connected to the heating resistor 2 by the corresponding lead portion 22.
- the conductor layer 3 includes a metallized layer and a plating layer stacked on the metallized layer.
- the metallized layer may be, for example, a metallized layer containing silver, copper, and titanium, or a metallized layer containing gold, nickel, and palladium (Pd).
- the plating layer may be, for example, a nickel boron plating layer, a gold plating layer, or a nickel plating layer.
- the thickness of the metallized layer may be set to, for example, about 20 to 40 ⁇ m.
- the thickness of the plating layer is preferably greater than or equal to, for example, 1 ⁇ m.
- the metal cap 4 is a meal component including a bottom portion 41 and a side portion 42.
- the metal cap 4 may be made of, for example, a metal material such as a stainless steel or an iron-nickel-cobalt (Fe-Ni-Co) alloy. In particular, from the viewpoint of thermal expansion, an iron-nickel-cobalt (Fe-Ni-Co) alloy is preferably used.
- the metal cap 4 is a component for strongly connecting the conductor layer 3 to the external electrode.
- the metal cap 4 is arranged so as to cover the one end of the ceramic body 1 and at least a portion of the conductor layer 3, and is electrically connected to the conductor layer 3.
- the metal cap 4 has a shape corresponding to the tapered shape of the ceramic body 1.
- the bottom portion 41 has the shape of a substantially circular plate.
- the side portion 42 is shaped such that the side portion 42 is substantially annular in in cross section perpendicular to the axial length direction of the ceramic body 1, and such that the side portion 42 expands as the distance from the bottom portion 41 increases.
- the metal cap 4 is attached to the ceramic body 1 such that the bottom portion 41 faces the one end of the ceramic body 1 and the side portion 42 covers part of the tapered portion 11.
- the metal cap 4 has a slit 43 formed in a portion of the outer periphery of the metal cap 4.
- the slit 43 extends from an outer region, that is, the rim, toward an inner region, that is, the central region. More specifically, the slit 43 extends from the bottom edge of the side portion 42 toward the center of the bottom portion 41. Accordingly, when the thermal expansion of the metal cap 4 occurs, the metal cap 4 can be deformed such that the width of the slit 43 decreases. Thus, the difference between the amount of thermal expansion of the metal cap 4 and the amount of thermal expansion of the ceramic body 1 can be reduced. This leads to a reduction in the thermal stress generated between the metal cap 4 and the ceramic body 1. As a result, the long-term reliability of the heater 10 can be improved.
- the inclination angle ⁇ of the inner peripheral surface of the side portion 42 of the metal cap 4 is greater than the inclination angle ⁇ of the tapered portion 11.
- the inclination angle ⁇ shows how much the inner peripheral surface of the side portion 42 is inclined with respect to the plane including the inner surface of the bottom portion 41.
- the inclination angle ⁇ shows how much the outer peripheral surface of the tapered portion 11 is inclined with respect to a plane perpendicular to the axial direction of the ceramic body 1.
- the inclination angle ⁇ is greater than the inclination angle ⁇ , when the metal cap 4 is attached to the tapered portion 11, the bottom surface of the side portion 42 of the metal cap 4 comes into contact with the tapered portion 11, and a gap can be provided between the inner surface of the bottom portion 41 of the metal cap 4 and a portion of the conductor layer 3 that is provided on the end surface of the tapered portion 11.
- the inclination angle ⁇ of the inner peripheral surface of the side portion 42 may be set to, for example 40° to 80°.
- the inclination angle ⁇ of the tapered portion 11 may be set to, for example, 45° to 75°.
- the solder material 7 is omitted to simplify the drawings.
- the metal cap 4 is formed such that the slit 43 extends to the center of the metal cap 4.
- the slit 43 extends from the bottom edge of the side portion 42 of the metal cap 4 to the central region of the bottom portion 41. Accordingly, the thermal expansion of the bottom portion 41 in the circumferential direction can be reduced in a balanced manner, so that a change in the shape of the bottom portion 41 after the thermal expansion from that before the thermal expansion can be reduced. Accordingly, the thermal stress generated in the metal cap 4 can be further reduced.
- the slit 43 is formed such that the slit 43 has a circular-hole-shaped end portion in the central region.
- a slit having such a shape is also regarded as a single slit 43.
- the slit 43 may, of course, instead be formed so as to have a constant width to the center of the bottom portion 41, or such that the width thereof changes at an intermediate position.
- the inner diameter of the bottom portion 41 may be set to about 1.5 to 2 mm, and the thickness of the bottom portion 41 may be set to about 0.1 to 0.5 mm.
- the inner diameter of the side portion 42 at the bottom end thereof may be set to about 1.5 to 2.5 mm, the thickness of the side portion 42 may be set to about 0.1 to 0.5 mm, and the height of the side portion 42 may be set to 1 to 1.2 mm.
- the length of the slit 43 may be set to 1 to 2 mm.
- the heater 10 further includes a lead terminal 5 having an end portion connected to the conductor layer 3.
- the lead terminal 5 is a component for electrically connecting the metal cap 4 and the conductor layer 3 to the external electrode.
- the lead terminal 5 is made of, for example, a metal material such as nickel or a stainless steel.
- the terminal 5 is a linear component, and the end portion thereof is disposed in the slit 43 in the metal cap 4 and bonded to the metal cap 4. Accordingly, the metal cap 4 and the lead terminal 5 can be more strongly bonded together than in the case where the lead terminal 5 is bonded to the outer surface of the bottom portion 41 of the metal cap 4.
- the above-described solder material 7 spreads over a portion of the slit 43 that is formed in the bottom portion 41, and surrounds the lead terminal 5.
- the solder material 7 spreads not only in the portion of the slit 43 that is formed in the bottom portion 41 but also to the region outside the bottom portion 41.
- the portion of the solder material 7 that spreads to the region outside the bottom portion 41 surrounds the end portion of the lead terminal 5. Accordingly, the metal cap 4 and the lead terminal 5 can be more strongly bonded together.
- the width of the end portion of the slit 43 is greater than the width of a portion of the slit 43 that extends from the outer region toward the inner region. More specifically, the end portion of the slit 43 has a circular shape in plan view at the central region of the bottom portion 41 of the metal cap 4, and the diameter (width) of the end portion of the slit 43 is greater than the width of the portion of the slit 43 that extends from the outer region toward the inner region. Accordingly, when the metal cap 4 and the lead terminal 5 are bonded together while the lead terminal 5 is disposed in the end portion of the slit 43, the risk that the lead terminal 5 will be shifted to the portion of the slit 43 that extends from the outer region toward the inner region can be reduced.
- the lead terminal 5 may have a diameter that is greater than the width of the portion of the slit 43 that extends from the outer region toward the inner region and smaller than the diameter (width) of the end portion of the slit 43. In this case, the risk that the lead terminal 5 will be shifted to the portion of the slit 43 that extends from the outer region toward the inner region can be further reduced.
- the shape of the end portion is not limited to this. More specifically, the end portion of the slit 43 may instead have a polygonal shape, such as a rectangular shape. Alternatively, the end portion of the slit 43 may have, for example, an elliptical shape or an oval shape. When the end portion of the slit 43 has a polygonal shape, the length of the longest one of the diagonal lines that connect the corners may be regarded as the width. When the end portion of the slit 43 has an elliptical shape or an oval shape, the length of the major axis may be regarded as the width.
- the solder material 7 may be applied such that the solder material 7 spreads over the portion of the slit 43 that is formed in the bottom portion 41 but does not spread into a portion of the slit 43 that is formed in the side portion 42.
- the metal cap 4 and the lead terminal 5 can be strongly bonded together while the thermal stress generated between the metal cap 4 and the ceramic body 1 is suppressed.
- the solder material 7 may be applied such that the solder material 7 spreads not only over a portion of the conductor layer 3 provided on the end surface of the ceramic body 1 but also over a portion of the conductor layer 3 provided on a portion of the outer peripheral surface of the tapered portion 11.
- the portion of the conductor layer 3 provided on a portion of the outer peripheral surface of the tapered portion 11 may be bonded to the side portion 42 of the metal cap 4. In this case, the metal cap 4 and the lead terminal 5 can be more strongly bonded together.
- the metal cap 4 includes the bottom portion 41 and the side portion 42, and the conductor layer 3 is located on a surface of the ceramic body 1 in a region closer to the bottom portion 41 of the metal cap 4 than the open end of the side portion 42 is. More specifically, the end of the side portion 42 of the metal cap 4 opposite the end at which the bottom portion 41 is provided is in contact with the outer peripheral surface of the tapered portion 11, and the conductor layer 3 is provided on the outer peripheral surface of the tapered portion 11 in a region closer to the end surface of the ceramic body 1 than a portion of the outer peripheral surface of the tapered portion 11 that is in contact with the side portion 42 is.
- the conductor layer 3 may be arranged such that the conductor layer 3 is not provided on a portion of the outer peripheral surface of the tapered portion 11 that is in contact with the side portion 42. Accordingly, when the conductor layer 3 and the metal cap 4 are bonded together with the solder material 7, the solder material 7 may be easily introduced into the space between the conductor layer 3 and the metal cap 4.
- one lead portion 22 of the heating resistor 2 extends to the end surface of the ceramic body 1 at the one end thereof.
- the region to which the lead portion 22 extends overlaps the slit 43, and the lead terminal 5 is placed in the slit 43.
- the lead terminal 5 is located so as to overlap the region to which the lead portion 22 extends. Accordingly, the lead portion 22 and the lead terminal 5 may be arranged near each other, so that the length of the path along which the electricity flows between the lead portion 22 and the lead terminal 5 can be reduced. As a result, unnecessary resistance between the lead portion 22 and the lead terminal 5 can be reduced.
- a glow plug 100 includes the above-described heater 10 and a cylindrical metal member 6 attached to the heater 10 at the tapered-portion-11 side of the heater 10.
- the metal member 6 is a component for holding the ceramic body 1.
- the metal member 6 is a cylindrical component, and is provided so as to surround the one end of the ceramic body 1. In other words, the ceramic body 1 is inserted in the metal member 6.
- the metal member 6 is electrically connected to the other lead portion 22 that extends to the region near the one end of the ceramic body 1.
- the metal member 6 is made of, for example, a stainless steel or an iron-nickel-cobalt (Fe-Ni-Co) alloy.
- the metal member 6 and the ceramic body 1 are bonded together with a solder material (not shown).
- the solder material is provided so as to surround the end portion of the ceramic body 1.
- the solder material is provided in the form of a layer over the entire circumference of the end portion of the ceramic body 1. Accordingly, the metal member 6 and the ceramic body 1 are strongly bonded together.
- the solder material 7 and the solder material with which the metal member 6 and the ceramic body 1 are bonded together may be, for example, silver-copper (Ag-Cu) solder, Ag solder, or Cu solder containing 5 to 30 mass% of glass component.
- the glow plug 100 according to the present embodiment includes the heater 10 in which the thermal stress generated between the metal cap 4 and the ceramic body 1 is reduced, and therefore the long-term reliability of the heater 10 is increased. As a result, the long-term reliability of the glow plug 100 is increased.
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
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- General Engineering & Computer Science (AREA)
- Resistance Heating (AREA)
Abstract
Description
- The present invention relates to heaters for use in, for example, combustion vehicle heating systems, kerosene fan heaters, glow plugs for automobile engines, various sensors such as oxygen sensors, or measurement devices. The present invention also relates to glow plugs including the heaters.
- An example of heaters for use in combustion vehicle heating systems, kerosene fan heaters, glow plugs for automobile engines, various sensors such as oxygen sensors, or measurement devices is disclosed in, for example, Japanese Unexamined Utility Model Registration Application Publication No. 63-80456 (hereinafter referred to as Patent Document 1). The heater disclosed in
Patent Document 1 includes a ceramic body including a heating resistor embedded therein, and a metal cap provided so as to cover an end of the ceramic body. The metal cap is electrically connected to the heating resistor, so that electric power can be supplied to the heating resistor by connecting a lead terminal to the metal cap. Thus, heat can be generated by the heater. - However, in the heater disclosed in
Patent Document 1, thermal stress may be generated between the ceramic body and the metal cap, which are made of different materials. Therefore, there is a problem that it is difficult to improve the long-term reliability of the heater in heat cycles. - The present invention has been made in light of the above-described problems, and an object of the present invention is to provide a heater in which thermal stress generated between a ceramic body and a metal cap can be reduced.
- A heater according to an aspect of the present invention includes a rod-shaped ceramic body; a heating resistor embedded in the ceramic body; a conductor layer on at least a surface of the ceramic body at one end of the ceramic body, the conductor layer being electrically connected to the heating resistor; and a metal cap for external connection, the metal cap covering the one end of the ceramic body together with at least a portion of the conductor layer. The metal cap has a slit in a portion of an outer periphery of the metal cap, the slit extending from an outer region toward an inner region.
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Fig. 1 is a sectional view of a heater and a glow plug according to an embodiment of the present invention. -
Fig. 2 is a perspective view of an end of a ceramic body and a conductor layer included in the heater illustrated inFig. 1 . -
Fig. 3 is a perspective view of a metal cap included in the heater illustrated inFig. 1 . -
Fig. 4 is an enlarged perspective view of a region around the metal cap in the heater illustrated inFig. 1 . -
Fig. 5 is an enlarged sectional view of the region around the metal cap in the heater illustrated inFig. 1 . - A heater according to an embodiment of the present invention will be described with reference to the drawings.
Fig. 1 is a sectional view of aheater 10 according to the embodiment of the present invention. As illustrated inFig. 1 , theheater 10 includes aceramic body 1, aheating resistor 2 embedded in theceramic body 1, and ametal cap 4 that covers one end of theceramic body 1. Although not illustrated inFig. 1 , as illustrated inFig. 2 , aconductor layer 3 is provided on the one end of theceramic body 1. InFig. 2 , the hatched area shows the region in which theconductor layer 3 is provided. Theheating resistor 2 and theconductor layer 3 are electrically connected to each other by alead portion 22. - The
ceramic body 1 is, for example, a rod-shaped component. Herein, a rod-shaped object is defined as an object that is long in a certain direction. Therefore, a plate-shaped object that is long in a certain direction may also be regarded as being rod-shaped. Theceramic body 1 has atapered portion 11 at the one end thereof. Theceramic body 1 may be made of, for example, electrically insulating ceramics, such as oxide ceramics, nitride ceramics, or carbide ceramics. More specifically, alumina ceramics, silicon nitride ceramics, aluminum nitride ceramics, silicon carbide ceramics, etc., may be used. In particular, theceramic body 1 is preferably made of a silicon nitride ceramic. Silicon nitride ceramics are advantageous in that silicon nitride, which is the main component, is strong, tough, highly insulative, and highly resistant to heat. - The
ceramic body 1 made of a silicon nitride ceramic may be obtained by, for example, mixing silicon nitride, which is the main component, with 5 to 15 mass% of a rare earth element oxide, such as Y2O3, Yb2O3, or Er2O3, which serves as a sintering additive, 0.5 to 5 mass% of Al2O3, and SiO2 so that the content of SiO2 in the sintered body is 1.5 to 5 mass%; forming the mixture into a predetermined shape; and performing hot-press firing at 1650°C to 1780°C. In the case where theceramic body 1 is rod-shaped, the length of theceramic body 1 is set to, for example, 20 to 50 mm, and the diameter of theceramic body 1 is set to, for example, 2.5 to 5 mm. When the length of theceramic body 1 is about 20 to 50 mm and the diameter of theceramic body 1 is about 3 mm, the length of thetapered portion 11 may be set to 0.1 to 3 mm, and the diameter of the end surface of thetapered portion 11 may be set to 1 to 2.9 mm. - When the
ceramic body 1 is made of a silicon nitride ceramic and theheating resistor 2 is made of molybdenum (Mo) or tungsten (W), MoSi2 or WSi2, for example, is preferably mixed and dispersed in theceramic body 1. In this case, the coefficient of thermal expansion of the silicon nitride ceramic, which is the base material, can be set to a value close to the coefficient of thermal expansion of theheating resistor 2, and the durability of theheater 10 can be increased. - The
heating resistor 2 is a resistor for generating heat, and generates heat when a current flows therethrough. Theheating resistor 2 is embedded in theceramic body 1. Theheating resistor 2 includes aheating portion 21, which is a portion that mainly generates heat, and leadportions 22 that are connected to theheating portion 21. Theheating portion 21 of theheating resistor 2 is provided at the other end of theceramic body 1. Theheating portion 21 has a folded shape, and both ends thereof are connected to thelead portions 22. Theheating portion 21 having the folded shape generates a maximum amount of heat in a central region of the folded portion. The distance from the front end of theheating portion 21 to the rear end of theheating resistor 2 in the length direction of theceramic body 1 is set to, for example, 2 to 10 mm. - The
lead portions 22 are components for electrically connecting theheating portion 21 to an external power supply. One end of eachlead portion 22 extends to a surface of theceramic body 1, and the other end is connected to theheating portion 21. Thelead portions 22 are separately connected to both ends of theheating portion 21. One of thelead portions 22 extends to an end surface of theceramic body 1 at the one end thereof. InFig. 2 , the location at which thelead portion 22 extends to the end surface of theceramic body 1 at the one end thereof is shown by the broken line. Theother lead portion 22 extends to an outer peripheral surface of theceramic body 1 in a region near the one end thereof. - The
heating resistor 2 may be made be made of a material having, for example, a carbide, nitride, or silicide of W, Mo, titanium (Ti) or the like as the main component. Theheating resistor 2 may contain the same material as the material of theceramic body 1, so that theceramic body 1 and theheating resistor 2 have coefficients of thermal expansion that are close to each other. Theheating portion 21 has a high resistance, and generates a maximum amount of heat in a region around the folded portion. The resistance per unit length of thelead portions 22 is set to a value smaller than that of theheating portion 21 by, for example, making the content of the material of theceramic body 1 in thelead portions 22 smaller than that in theheating portion 21, or making the cross section of thelead portions 22 larger than that of theheating portion 21. - The
conductor layer 3 is a component for electrically connecting theheating resistor 2 to an external electrode. Theconductor layer 3 is provided on the one end of theceramic body 1. More specifically, theconductor layer 3 is provided on the end surface of theceramic body 1 and a portion of the outer peripheral surface of thetapered portion 11. Theconductor layer 3 is electrically connected to theheating resistor 2 by thecorresponding lead portion 22. Theconductor layer 3 includes a metallized layer and a plating layer stacked on the metallized layer. The metallized layer may be, for example, a metallized layer containing silver, copper, and titanium, or a metallized layer containing gold, nickel, and palladium (Pd). The plating layer may be, for example, a nickel boron plating layer, a gold plating layer, or a nickel plating layer. The thickness of the metallized layer may be set to, for example, about 20 to 40 µm. The thickness of the plating layer is preferably greater than or equal to, for example, 1 µm. - The
metal cap 4 is a meal component including abottom portion 41 and aside portion 42. Themetal cap 4 may be made of, for example, a metal material such as a stainless steel or an iron-nickel-cobalt (Fe-Ni-Co) alloy. In particular, from the viewpoint of thermal expansion, an iron-nickel-cobalt (Fe-Ni-Co) alloy is preferably used. Themetal cap 4 is a component for strongly connecting theconductor layer 3 to the external electrode. Themetal cap 4 is arranged so as to cover the one end of theceramic body 1 and at least a portion of theconductor layer 3, and is electrically connected to theconductor layer 3. Themetal cap 4 has a shape corresponding to the tapered shape of theceramic body 1. More specifically, thebottom portion 41 has the shape of a substantially circular plate. Theside portion 42 is shaped such that theside portion 42 is substantially annular in in cross section perpendicular to the axial length direction of theceramic body 1, and such that theside portion 42 expands as the distance from thebottom portion 41 increases. Themetal cap 4 is attached to theceramic body 1 such that thebottom portion 41 faces the one end of theceramic body 1 and theside portion 42 covers part of the taperedportion 11. - As illustrated in
Figs. 3 and4 , themetal cap 4 has aslit 43 formed in a portion of the outer periphery of themetal cap 4. Theslit 43 extends from an outer region, that is, the rim, toward an inner region, that is, the central region. More specifically, theslit 43 extends from the bottom edge of theside portion 42 toward the center of thebottom portion 41. Accordingly, when the thermal expansion of themetal cap 4 occurs, themetal cap 4 can be deformed such that the width of theslit 43 decreases. Thus, the difference between the amount of thermal expansion of themetal cap 4 and the amount of thermal expansion of theceramic body 1 can be reduced. This leads to a reduction in the thermal stress generated between themetal cap 4 and theceramic body 1. As a result, the long-term reliability of theheater 10 can be improved. - In addition, as illustrated in
Fig. 5 , the inclination angle α of the inner peripheral surface of theside portion 42 of themetal cap 4 is greater than the inclination angle β of the taperedportion 11. Herein, the inclination angle α shows how much the inner peripheral surface of theside portion 42 is inclined with respect to the plane including the inner surface of thebottom portion 41. The inclination angle β shows how much the outer peripheral surface of the taperedportion 11 is inclined with respect to a plane perpendicular to the axial direction of theceramic body 1. - Since the inclination angle α is greater than the inclination angle β, when the
metal cap 4 is attached to the taperedportion 11, the bottom surface of theside portion 42 of themetal cap 4 comes into contact with the taperedportion 11, and a gap can be provided between the inner surface of thebottom portion 41 of themetal cap 4 and a portion of theconductor layer 3 that is provided on the end surface of the taperedportion 11. By placing asolder material 7 in this gap, as illustrated inFig. 5 , themetal cap 4 and theconductor layer 3 can be strongly bonded to each other. The inclination angle α of the inner peripheral surface of theside portion 42 may be set to, for example 40° to 80°. The inclination angle β of the taperedportion 11 may be set to, for example, 45° to 75°. InFigs. 1 and4 , thesolder material 7 is omitted to simplify the drawings. - The
metal cap 4 is formed such that theslit 43 extends to the center of themetal cap 4. In other words, theslit 43 extends from the bottom edge of theside portion 42 of themetal cap 4 to the central region of thebottom portion 41. Accordingly, the thermal expansion of thebottom portion 41 in the circumferential direction can be reduced in a balanced manner, so that a change in the shape of thebottom portion 41 after the thermal expansion from that before the thermal expansion can be reduced. Accordingly, the thermal stress generated in themetal cap 4 can be further reduced. - In the
heater 10 according to the present embodiment, theslit 43 is formed such that theslit 43 has a circular-hole-shaped end portion in the central region. A slit having such a shape is also regarded as asingle slit 43. Theslit 43 may, of course, instead be formed so as to have a constant width to the center of thebottom portion 41, or such that the width thereof changes at an intermediate position. - With regard to the dimensions of the
metal cap 4, when the diameter of theceramic body 1 is about 3 mm, for example, the inner diameter of thebottom portion 41 may be set to about 1.5 to 2 mm, and the thickness of thebottom portion 41 may be set to about 0.1 to 0.5 mm. In addition, the inner diameter of theside portion 42 at the bottom end thereof may be set to about 1.5 to 2.5 mm, the thickness of theside portion 42 may be set to about 0.1 to 0.5 mm, and the height of theside portion 42 may be set to 1 to 1.2 mm. The length of theslit 43 may be set to 1 to 2 mm. - The
heater 10 further includes alead terminal 5 having an end portion connected to theconductor layer 3. Thelead terminal 5 is a component for electrically connecting themetal cap 4 and theconductor layer 3 to the external electrode. Thelead terminal 5 is made of, for example, a metal material such as nickel or a stainless steel. Theterminal 5 is a linear component, and the end portion thereof is disposed in theslit 43 in themetal cap 4 and bonded to themetal cap 4. Accordingly, themetal cap 4 and thelead terminal 5 can be more strongly bonded together than in the case where thelead terminal 5 is bonded to the outer surface of thebottom portion 41 of themetal cap 4. The above-describedsolder material 7 spreads over a portion of theslit 43 that is formed in thebottom portion 41, and surrounds thelead terminal 5. - In the
heater 10 illustrated inFig. 5 , thesolder material 7 spreads not only in the portion of theslit 43 that is formed in thebottom portion 41 but also to the region outside thebottom portion 41. The portion of thesolder material 7 that spreads to the region outside thebottom portion 41 surrounds the end portion of thelead terminal 5. Accordingly, themetal cap 4 and thelead terminal 5 can be more strongly bonded together. - The width of the end portion of the
slit 43 is greater than the width of a portion of theslit 43 that extends from the outer region toward the inner region. More specifically, the end portion of theslit 43 has a circular shape in plan view at the central region of thebottom portion 41 of themetal cap 4, and the diameter (width) of the end portion of theslit 43 is greater than the width of the portion of theslit 43 that extends from the outer region toward the inner region. Accordingly, when themetal cap 4 and thelead terminal 5 are bonded together while thelead terminal 5 is disposed in the end portion of theslit 43, the risk that thelead terminal 5 will be shifted to the portion of theslit 43 that extends from the outer region toward the inner region can be reduced. Thelead terminal 5 may have a diameter that is greater than the width of the portion of theslit 43 that extends from the outer region toward the inner region and smaller than the diameter (width) of the end portion of theslit 43. In this case, the risk that thelead terminal 5 will be shifted to the portion of theslit 43 that extends from the outer region toward the inner region can be further reduced. - Although the end portion of the
slit 43 has a circular shape in the present embodiment, the shape of the end portion is not limited to this. More specifically, the end portion of theslit 43 may instead have a polygonal shape, such as a rectangular shape. Alternatively, the end portion of theslit 43 may have, for example, an elliptical shape or an oval shape. When the end portion of theslit 43 has a polygonal shape, the length of the longest one of the diagonal lines that connect the corners may be regarded as the width. When the end portion of theslit 43 has an elliptical shape or an oval shape, the length of the major axis may be regarded as the width. - The
solder material 7 may be applied such that thesolder material 7 spreads over the portion of theslit 43 that is formed in thebottom portion 41 but does not spread into a portion of theslit 43 that is formed in theside portion 42. In this case, themetal cap 4 and thelead terminal 5 can be strongly bonded together while the thermal stress generated between themetal cap 4 and theceramic body 1 is suppressed. - The
solder material 7 may be applied such that thesolder material 7 spreads not only over a portion of theconductor layer 3 provided on the end surface of theceramic body 1 but also over a portion of theconductor layer 3 provided on a portion of the outer peripheral surface of the taperedportion 11. In addition, the portion of theconductor layer 3 provided on a portion of the outer peripheral surface of the taperedportion 11 may be bonded to theside portion 42 of themetal cap 4. In this case, themetal cap 4 and thelead terminal 5 can be more strongly bonded together. - The
metal cap 4 includes thebottom portion 41 and theside portion 42, and theconductor layer 3 is located on a surface of theceramic body 1 in a region closer to thebottom portion 41 of themetal cap 4 than the open end of theside portion 42 is. More specifically, the end of theside portion 42 of themetal cap 4 opposite the end at which thebottom portion 41 is provided is in contact with the outer peripheral surface of the taperedportion 11, and theconductor layer 3 is provided on the outer peripheral surface of the taperedportion 11 in a region closer to the end surface of theceramic body 1 than a portion of the outer peripheral surface of the taperedportion 11 that is in contact with theside portion 42 is. In other words, theconductor layer 3 may be arranged such that theconductor layer 3 is not provided on a portion of the outer peripheral surface of the taperedportion 11 that is in contact with theside portion 42. Accordingly, when theconductor layer 3 and themetal cap 4 are bonded together with thesolder material 7, thesolder material 7 may be easily introduced into the space between theconductor layer 3 and themetal cap 4. - As described above, one
lead portion 22 of theheating resistor 2 extends to the end surface of theceramic body 1 at the one end thereof. The region to which thelead portion 22 extends overlaps theslit 43, and thelead terminal 5 is placed in theslit 43. Also, thelead terminal 5 is located so as to overlap the region to which thelead portion 22 extends. Accordingly, thelead portion 22 and thelead terminal 5 may be arranged near each other, so that the length of the path along which the electricity flows between thelead portion 22 and thelead terminal 5 can be reduced. As a result, unnecessary resistance between thelead portion 22 and thelead terminal 5 can be reduced. - Referring to
Fig. 1 again, aglow plug 100 according to the present embodiment includes the above-describedheater 10 and acylindrical metal member 6 attached to theheater 10 at the tapered-portion-11 side of theheater 10. - The
metal member 6 is a component for holding theceramic body 1. Themetal member 6 is a cylindrical component, and is provided so as to surround the one end of theceramic body 1. In other words, theceramic body 1 is inserted in themetal member 6. Themetal member 6 is electrically connected to theother lead portion 22 that extends to the region near the one end of theceramic body 1. Themetal member 6 is made of, for example, a stainless steel or an iron-nickel-cobalt (Fe-Ni-Co) alloy. - The
metal member 6 and theceramic body 1 are bonded together with a solder material (not shown). The solder material is provided so as to surround the end portion of theceramic body 1. In other word, the solder material is provided in the form of a layer over the entire circumference of the end portion of theceramic body 1. Accordingly, themetal member 6 and theceramic body 1 are strongly bonded together. - The
solder material 7 and the solder material with which themetal member 6 and theceramic body 1 are bonded together may be, for example, silver-copper (Ag-Cu) solder, Ag solder, or Cu solder containing 5 to 30 mass% of glass component. Theglow plug 100 according to the present embodiment includes theheater 10 in which the thermal stress generated between themetal cap 4 and theceramic body 1 is reduced, and therefore the long-term reliability of theheater 10 is increased. As a result, the long-term reliability of theglow plug 100 is increased. -
- 1
- ceramic body
- 11
- tapered portion
- 2
- heating resistor
- 21
- heating portion
- 22
- lead portion
- 3
- conductor layer
- 4
- metal cap
- 41
- bottom portion
- 42
- side portion
- 43
- slit
- 5
- lead terminal
- 6
- metal member
- 7
- solder material
- 10
- heater
- 100
- glow plug
Claims (7)
- A heater comprising a rod-shaped ceramic body; a heating resistor embedded in the ceramic body; a conductor layer on at least a surface of the ceramic body at one end of the ceramic body, the conductor layer being electrically connected to the heating resistor; and a metal cap for external connection, the metal cap covering the one end of the ceramic body together with at least a portion of the conductor layer,
wherein the metal cap has a slit in a portion of an outer periphery of the metal cap, the slit extending from an outer region toward an inner region. - The heater according to Claim 1, wherein an end portion of the slit reaches a center of the metal cap.
- The heater according to Claim 1 or 2, wherein a width of an end portion of the slit is greater than a width of a portion of the slit that extends from the outer region toward the inner region.
- The heater according to any one of Claims 1 to 3, further comprising a lead terminal including an end portion connected to the conductor layer, the end portion of the lead terminal being located in the slit and bonded to the metal cap.
- The heater according to Claim 4, wherein the heating resistor extends to an end surface of the ceramic body at the one end, and a portion of the heating resistor that extends to the end surface overlaps the slit.
- The heater according to any one of Claims 1 to 5, wherein the metal cap includes a bottom portion and a side portion, and the conductor layer is located on a surface of the ceramic body in a region closer to the bottom portion of the metal cap than an open end of the side portion is.
- A glow plug comprising the heater according to any one of Claims 1 to 6, and a cylindrical metal member attached to the heater at the one-end side of the heater.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013223073 | 2013-10-28 | ||
PCT/JP2014/078675 WO2015064598A1 (en) | 2013-10-28 | 2014-10-28 | Heater and glow plug |
Publications (3)
Publication Number | Publication Date |
---|---|
EP3064834A1 true EP3064834A1 (en) | 2016-09-07 |
EP3064834A4 EP3064834A4 (en) | 2017-06-21 |
EP3064834B1 EP3064834B1 (en) | 2018-07-18 |
Family
ID=53004199
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP14859213.2A Active EP3064834B1 (en) | 2013-10-28 | 2014-10-28 | Heater and glow plug |
Country Status (3)
Country | Link |
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EP (1) | EP3064834B1 (en) |
JP (1) | JP6075810B2 (en) |
WO (1) | WO2015064598A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6668690B2 (en) | 2015-11-06 | 2020-03-18 | 株式会社デンソー | Ceramic glow plug |
JPWO2019003777A1 (en) * | 2017-06-29 | 2019-12-12 | 京セラ株式会社 | heater |
JP2019133762A (en) | 2018-01-29 | 2019-08-08 | 京セラ株式会社 | heater |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60216126A (en) * | 1984-04-12 | 1985-10-29 | Ngk Spark Plug Co Ltd | Two-wire type ceramic glow plug |
JPS60165682U (en) * | 1984-04-12 | 1985-11-02 | 日本特殊陶業株式会社 | Double insulation type ceramic glow plug |
JPH0443721Y2 (en) * | 1985-04-17 | 1992-10-15 | ||
JPH037734Y2 (en) * | 1986-11-10 | 1991-02-26 | ||
JP3121860B2 (en) * | 1991-06-06 | 2001-01-09 | 京セラ株式会社 | Ceramic heater |
EP0635993B1 (en) * | 1993-07-20 | 2000-05-17 | TDK Corporation | Ceramic heater |
JPH07103478A (en) * | 1993-10-04 | 1995-04-18 | Nippondenso Co Ltd | Glow plug |
JPH07167434A (en) * | 1993-12-15 | 1995-07-04 | Nippondenso Co Ltd | Glow plug |
JP2005315447A (en) * | 2004-04-27 | 2005-11-10 | Kyocera Corp | Ceramic heater and glow plug |
KR101195918B1 (en) * | 2008-01-29 | 2012-10-30 | 쿄세라 코포레이션 | Ceramic heater and glow plug |
DE102009048643B4 (en) * | 2009-09-30 | 2013-11-28 | Borgwarner Beru Systems Gmbh | Glow plug and method for connecting a pin made of a functional ceramic with a metal sleeve |
-
2014
- 2014-10-28 EP EP14859213.2A patent/EP3064834B1/en active Active
- 2014-10-28 WO PCT/JP2014/078675 patent/WO2015064598A1/en active Application Filing
- 2014-10-28 JP JP2015545249A patent/JP6075810B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JPWO2015064598A1 (en) | 2017-03-09 |
EP3064834A4 (en) | 2017-06-21 |
WO2015064598A1 (en) | 2015-05-07 |
EP3064834B1 (en) | 2018-07-18 |
JP6075810B2 (en) | 2017-02-08 |
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