EP3030833B1 - Led illumination module - Google Patents

Led illumination module Download PDF

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Publication number
EP3030833B1
EP3030833B1 EP14744513.4A EP14744513A EP3030833B1 EP 3030833 B1 EP3030833 B1 EP 3030833B1 EP 14744513 A EP14744513 A EP 14744513A EP 3030833 B1 EP3030833 B1 EP 3030833B1
Authority
EP
European Patent Office
Prior art keywords
cover
illumination module
led board
circuit board
module according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP14744513.4A
Other languages
German (de)
French (fr)
Other versions
EP3030833A1 (en
Inventor
Wolfgang Bechter
Wolfgang Rüf
Joachim Frick
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zumtobel Lighting GmbH Austria
Original Assignee
Zumtobel Lighting GmbH Austria
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zumtobel Lighting GmbH Austria filed Critical Zumtobel Lighting GmbH Austria
Publication of EP3030833A1 publication Critical patent/EP3030833A1/en
Application granted granted Critical
Publication of EP3030833B1 publication Critical patent/EP3030833B1/en
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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/16Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
    • F21V17/164Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting the parts being subjected to bending, e.g. snap joints
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/16Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/104Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening using feather joints, e.g. tongues and grooves, with or without friction
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/004Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by deformation of parts or snap action mountings, e.g. using clips
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00Globes; Bowls; Cover glasses
    • F21V3/02Globes; Bowls; Cover glasses characterised by the shape
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/06Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages the fastening being onto or by the lampholder
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00Point-like light sources
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00Planar light sources
    • F21Y2105/10Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Definitions

  • the invention relates to a lighting module with an LED board (LED: light-emitting diode) for generating a light and a translucent cover.
  • LED light-emitting diode
  • the term "lighting module” should be understood here as a light-emitting unit having a light source for generating the light and which is configured to be mechanically attached to the operation of a support member of a lighting device and electrically connected to the power supply of the light source to the support element to become.
  • the design is such that this unit or the lighting module with ease of use can also be reversibly removed from the support element, for example, to exchange it for another lighting module.
  • the term “light brick” can also be used here.
  • the light source is formed by an LED board, wherein the connection between the LED board and the cover is made using a heat sink comparatively expensive.
  • a luminaire module unit with a circuit carrier is known, are arranged on the LEDs.
  • a cover is provided which can be connected by means of connecting elements latching with the circuit carrier.
  • the invention has for its object to provide an improved lighting module, which is characterized in particular with particularly good optical properties by a simplified structure.
  • a lighting module which has an LED board for generating a light, as well as a light-permeable cover, which is arranged such that the light at least partially passes through the cover.
  • the cover is arranged on the LED board held only via a latching connection.
  • the construction of the lighting module is thereby significantly simplified; on a cooling plate can be omitted.
  • the LED board can directly serve as a carrier for the cover.
  • the number of components or components that make up the lighting module can thus be reduced.
  • tolerance-related deviations from nominal dimensions with respect to the LED board and the cover can be kept smaller; In this way, the relative arrangement between the, serving as a light source LED board on the one hand and an optical element for influencing the light generated by the LED board on the other hand can be set very precisely, which also determines the optical effect of the optical element particularly precisely as a result is.
  • the cover is cup-shaped, so that it has a bottom portion and a side wall portion, wherein the latching connection is designed to be attacking on the side wall portion.
  • This refinement makes it possible to achieve that an interior of the lighting module is formed or limited only by the LED board on the one hand and the cover on the other hand. In this interior, at least one LED of the LED board can be well protected.
  • a light emission surface of the illumination module is preferably formed by the bottom region of the cover, such that the light at least partially leaves the illumination module through it.
  • the LED board edge on a gradation can advantageously serve as an attack surface for the latching connection.
  • the gradation of the LED board is circumferentially formed circumferentially in an annular closed shape.
  • the gradation can also be achieved, in particular, that latching elements which are formed on the cover do not project beyond the level of a surface of the LED board which is opposite to the at least one LED.
  • the illumination module can be arranged in a particularly suitable manner with respect to a heat transfer to arrange a planar surface in a contacting manner.
  • Manufacturing technology advantageous is the gradation produced by milling.
  • the LED board in a central region has a thickness of more than 1 mm. In this way, it is particularly suitable as a stable support element the cover. If the LED board is formed by a metal core board, it has particularly good heat conduction properties. This is advantageous with respect to the removal of heat, which is formed during operation of the lighting module of the at least one LED of the LED board.
  • the latching connection has latching elements which are formed on the cover, wherein the latching elements are arranged behind the LED circuit board.
  • the locking elements are formed in the form of snappers or projections. As a result, an easy handling during assembly of the lighting module is supported.
  • the illumination module is designed such that the locking elements are arranged behind the LED board such that they are arranged only contacting the gradation.
  • the design may be such that the LED board has a boundary surface through which an outer surface of the lighting module is formed, the cover being arranged such that it does not penetrate a plane defined by the boundary surface. In this way, it can be particularly suitably achieved that the locking elements do not protrude beyond that surface of the LED board, which is opposite to the at least one LED.
  • the cover may have a boundary surface such that the boundary surface of the LED board and the boundary surface of the cover lie in said plane. In this way, it can be achieved that the LED board does not appear immediately visible to a viewer of the lighting module when he looks at the cover.
  • the lighting module further comprises an optical element for influencing the light, which is preferably arranged such that the LED board is arranged to support the optical element.
  • an optical element for influencing the light which is preferably arranged such that the LED board is arranged to support the optical element. This achieves that the relative position between the optical element and the LED board can be set particularly precisely. In this way, the optical effect of the optical element can be determined particularly accurately.
  • the illumination module is preferably designed such that the optical element is within a region enclosed by the side wall region is arranged.
  • the lighting module can be made very compact.
  • Fig. 1 shows a perspective sketch of a lighting module according to the invention.
  • the lighting module has an LED board 1, as well as a translucent cover 2.
  • the cover 2 may for example consist of plastic.
  • the LED board 1 is in a separated form in cross section in Fig. 3 outlined.
  • the LED board 1 has at least one LED 3 for generating a light.
  • the term "LED board” is intended here to designate the corresponding board with the at least one LED 3 arranged thereon.
  • Fig. 4 the separated LED board 1 is sketched in perspective.
  • the illumination module is designed to be mechanically attached to a carrier element (not shown in the figures) of a luminaire device for operation and to be electrically connected to the power supply of the at least one LED with this carrier element.
  • the lighting module can in particular have a plug 5.
  • the LED board 1 is preferably plate-shaped and has a surface or boundary surface 15, and a further boundary surface 16 parallel thereto, wherein the at least one LED 3 is arranged on the further boundary surface 16, in particular only on the further boundary surface 16.
  • the boundary surface 15 is preferably designed plan.
  • the boundary surface 15 may be provided to contact a likewise planar contact region of the carrier element of the luminaire device in a planar manner when the illumination module is mechanically attached to the carrier element of the luminaire device for operation.
  • the plug 5 rises beyond the boundary surface 15, wherein on the support element of the lamp device, a correspondingly corresponding socket is formed.
  • the LED board 1 may have a corresponding passage opening 12.
  • Fig. 2 shows a cross section through the lighting module.
  • the lighting module is designed in such a way, or the cover 2 is arranged such that the light generated by the LED board 1 at least partially, in particular at least predominantly passes through the cover 2.
  • cover 2 is cup-shaped, so that it has a bottom portion 23 and a side wall portion 24.
  • the cover 2 can be shaped, at least in a first approximation, to define a cuboid shape, wherein a first rectangular area of the cuboid is described by the bottom area 23 and four further rectangular areas of the cuboid are described by the sidewall area 24 are that connect to that rectangular area, which is described by the bottom portion 23.
  • the side wall region 24 can thus be designed in particular circumferential, wherein the LED board 1 is arranged in the region of, in this way formed by the side wall portion 24 opening, in particular this opening is arranged covering. Accordingly, the bottom portion 23 of the cover 2 can be made about as large as the LED board. 1
  • a light emission surface 22 of the illumination module is formed by the bottom region 23 of the cover 2 such that the light which is generated by the LED circuit board 1 at least partially leaves the illumination module through it.
  • the light emitting surface 22 may be formed flat;
  • the illumination module can be designed so that the light emission surface 22 is oriented parallel to the boundary surface 15 of the LED board 1.
  • the cover 2 is arranged on the LED board 1 only held via a latching connection. This is advantageous because in this way it is possible to dispense with a separate component which serves for holding the LED board 1 or for holding the cover 2.
  • the lighting module is designed such that the latching connection acts directly between the LED board 1 on the one hand and the cover 2 on the other hand, ie without the involvement of another component.
  • the lighting module is designed so that both the LED board 1, as well as the cover 2 form outer surfaces of the lighting module.
  • the boundary surface 15 of the LED board 1 forms an outer surface of the illumination module.
  • the latching connection has latching elements 21, which are formed on the cover 2, wherein the latching elements 21, the LED board 1 are arranged engaging behind.
  • the locking elements 21 are formed on the side wall portion 24 of the cover 2.
  • the locking elements 21 are formed in the form of snappers or projections.
  • the cover 2 can be particularly easily assembled with the LED board 1.
  • the latching connection can be designed such that it can no longer be opened without destroying it.
  • the cover 2 a particular annular on the side wall portion 24 peripherally formed support shoulder 27 which serves to support the LED board 1 and holds the cover 2 in cooperation with the locking elements 21 relative to the LED board 1 in position.
  • the LED board 1 is inserted into the opening formed by the side wall portion 24 of the cover 2 until it touches the edge shoulder around the support shoulder 27 and the locking elements 21 engage around the LED board 1 snapping or engage behind.
  • the LED board 1 - without the at least one LED 3 measured - a thick board, so that they have a particularly suitable stability for holding the Cover 2 has.
  • the LED board 1 - without the at least one LED 3 measured - in a central region have a thickness d of more than 1 mm.
  • the LED board 1 is designed to serve as a carrier of the entire lighting module.
  • the LED board 1 is formed by a metal core board, for example, an aluminum-metal core board.
  • a metal core board for example, an aluminum-metal core board.
  • heat which is generated during operation of the illumination module by the at least one LED 3 of the LED board 1 is suitable for the boundary surface 15 of the LED board 1 and thus for an outer surface or surface the lighting module is passed.
  • the LED board 1 can form in this way, so to speak, a heat sink of the lighting module.
  • the LED board 1 on the edge side or on its peripheral region a gradation 11.
  • the gradation 11 of the LED board 1 can be circumferentially formed in annularly closed form, as exemplified in Fig. 4 indicated.
  • the corner regions of the LED board 1 are formed, including the gradation 11 is preferably rounded.
  • Fig. 3 shows the gradation 11 is formed in particular on that side of the LED board 1, which is opposite to the at least one LED 3.
  • the gradation 11 thus directly adjoins the boundary surface 15 of the LED board 1.
  • a particularly suitable attack surface for the latching connection is formed.
  • grading 11 that - as out Fig. 2 shows - the cover 2 does not extend beyond a plane E out, which is defined by the boundary surface 15 of the LED board 1.
  • the design is such that the locking elements 21 are arranged only the gradation 11 contacting.
  • the illumination module can be mechanically attached to the support element of the luminaire device in such a way that the boundary surface 15 of the LED circuit board 1 flatly contacts a planar surface region of this support element and thus a particularly suitable heat dissipation is achieved.
  • the design is further such that the cover 2 has a boundary surface 25, such that the boundary surface 15 of the LED board 1 and the boundary surface 25 of the cover 5 lie in the plane E.
  • the boundary surface 25 of the cover 2 may in particular be formed by an edge region of the cover 2 formed by the side wall region 24. In other words, it can thus be provided that the boundary surface 15 of the LED board 1, which can be regarded as a "back side" of the LED board 1, is flush with this edge region of the cover 2.
  • the illumination module also has an optical element 4 for influencing the light.
  • the optical element 4 can be arranged such that the LED board 1 is arranged supportingly on the optical element 4. As a result, a planned relative arrangement between the LED board 1 and the optical element 4 can be maintained particularly accurately.
  • the optical element 4 can be designed, for example, to change the direction of the light generated by the LED board 4. Accordingly, the optical element 4 may be disposed between the LED board 1 on the one hand and the bottom portion 23 of the cover 2 on the other hand.
  • the optical element 4 may comprise a lens element, for example in the form of a lens cluster, with which at least part of the light is influenced;
  • the optical element 4 may comprise an optically scattering element, with which at least a part of the light or optionally a further part of the light is influenced.
  • the optical element 4 may be arranged in the interior of the lighting module, which is formed on the one hand by the LED board 1 and on the other hand by the cup-shaped cover 2.
  • the design may be such that the optical element 4 is disposed within a region enclosed by the sidewall region 24 of the cover 2.
  • the at least one LED 3 of the LED board 1 with respect to the optical element 4 and against the cover 2 is arranged very precisely.
  • the optical element 4 is arranged in the pot-shaped cover 2 inserted.
  • the LED board 1 also has at least one recess 14, which is designed as a point of attack for a holding element for the mechanical support of the lighting module to the support element of the lighting device. Apart from the passage opening 12 for the plug 5 and the at least one recess 14, the LED board 1 no recess.

Description

Die Erfindung betrifft ein Beleuchtungsmodul mit einer LED-Platine (LED: Licht emittierende Diode) zur Erzeugung eines Lichts sowie einer lichtdurchlässigen Abdeckung.The invention relates to a lighting module with an LED board (LED: light-emitting diode) for generating a light and a translucent cover.

Unter der Bezeichnung "Beleuchtungsmodul" soll hier eine Licht abgebende Einheit verstanden sein, die eine Lichtquelle zur Erzeugung des Lichts aufweist und die dazu ausgestaltet ist, zum Betrieb mechanisch an einem Trägerelement einer Leuchtenvorrichtung angebracht zu werden und zur Stromversorgung der Lichtquelle mit dem Trägerelement elektrisch verbunden zu werden. Dabei ist die Gestaltung so, dass diese Einheit bzw. das Beleuchtungsmodul unter einfacher Handhabung auch wieder reversibel von dem Trägerelement abgenommen werden kann, beispielsweise, um es gegen ein anderes Beleuchtungsmodul auszutauschen. Synonym zu dem Begriff "Beleuchtungsmodul" kann hier auch die Bezeichnung "Lichtbaustein" verwendet werden.The term "lighting module" should be understood here as a light-emitting unit having a light source for generating the light and which is configured to be mechanically attached to the operation of a support member of a lighting device and electrically connected to the power supply of the light source to the support element to become. The design is such that this unit or the lighting module with ease of use can also be reversibly removed from the support element, for example, to exchange it for another lighting module. Synonymous with the term "lighting module", the term "light brick" can also be used here.

Aus dem Stand der Technik ist ein Beleuchtungsmodul bekannt, dessen Lichtquelle durch eine LED-Platine gebildet ist, wobei die Verbindung zwischen der LED-Platine und der Abdeckung unter Nutzung eines Kühlblechs vergleichsweise aufwändig gestaltet ist.From the prior art, a lighting module is known, the light source is formed by an LED board, wherein the connection between the LED board and the cover is made using a heat sink comparatively expensive.

Aus der EP 2 273 184 A1 ist eine Leuchte mit einer LED-Platine und einer Abdeckung bekannt, bei der die Abdeckung über eine Rastverbindung an der LED-Platine gehalten ist. Die Rastverbindung weist dabei an der Abdeckung ausgebildete Rastelemente auf.From the EP 2 273 184 A1 a luminaire with an LED board and a cover is known in which the cover is held via a latching connection to the LED board. The latching connection has latching elements formed on the cover.

Aus der DE 20 2009 009 802 U1 ist eine Leuchten-Moduleinheit mit einem Schaltungsträger bekannt, auf dem LEDs angeordnet sind. Außerdem ist ein Abdeckelement vorgesehen, das mittels Verbindungselementen rastend mit dem Schaltungsträger verbunden werden kann.From the DE 20 2009 009 802 U1 a luminaire module unit with a circuit carrier is known, are arranged on the LEDs. In addition, a cover is provided which can be connected by means of connecting elements latching with the circuit carrier.

Weitere Leuchtvorrichtungen mit einer LED-Platine und einer Abdeckung sind aus den Schriften EP 2 421 039 A1 , EP 2 400 478 A2 und US 2012/0281403 A1 bekannt.Other lighting devices with an LED board and a cover are from the writings EP 2 421 039 A1 . EP 2 400 478 A2 and US 2012/0281403 A1 known.

Der Erfindung liegt die Aufgabe zugrunde, ein verbessertes Beleuchtungsmodul anzugeben, das sich insbesondere bei besonders guten optischen Eigenschaften durch einen vereinfachten Aufbau auszeichnet.The invention has for its object to provide an improved lighting module, which is characterized in particular with particularly good optical properties by a simplified structure.

Diese Aufgabe wird gemäß der Erfindung mit dem in dem unabhängigen Anspruch genannten Gegenstand gelöst. Besondere Ausführungsarten der Erfindung sind in den abhängigen Ansprüchen angegeben.This object is achieved according to the invention with the object mentioned in the independent claim. Particular embodiments of the invention are indicated in the dependent claims.

Gemäß der Erfindung ist ein Beleuchtungsmodul vorgesehen, das eine LED-Platine zur Erzeugung eines Lichts aufweist, sowie eine lichtdurchlässige Abdeckung, die derart angeordnet ist, dass das Licht zumindest teilweise die Abdeckung durchsetzt. Dabei ist die Abdeckung an der LED-Platine lediglich über eine Rastverbindung gehalten angeordnet.According to the invention, a lighting module is provided, which has an LED board for generating a light, as well as a light-permeable cover, which is arranged such that the light at least partially passes through the cover. In this case, the cover is arranged on the LED board held only via a latching connection.

Der Aufbau des Beleuchtungsmoduls ist hierdurch signifikant vereinfacht; auf ein Kühlblech kann verzichtet werden. Die LED-Platine kann unmittelbar als Träger für die Abdeckung dienen. Gegenüber dem Stand der Technik lässt sich somit die Anzahl der Bauteile bzw. Komponenten, aus denen das Beleuchtungsmodul besteht, reduzieren. Im Weiteren lässt sich dadurch erzielen, dass Toleranz-bedingte Abweichungen von Sollmaßen mit Bezug auf die LED-Platine und die Abdeckung kleiner gehalten werden können; auf diese Weise lässt sich die Relativanordnung zwischen der, als Lichtquelle dienenden LED-Platine einerseits und einem optischen Element zur Beeinflussung des von der LED-Platine erzeugten Lichts andererseits besonders genau festlegen, wodurch in der Folge auch die optische Wirkung des optischen Elements besonders präzise bestimmbar ist.The construction of the lighting module is thereby significantly simplified; on a cooling plate can be omitted. The LED board can directly serve as a carrier for the cover. Compared to the prior art, the number of components or components that make up the lighting module can thus be reduced. Furthermore, it can be achieved that tolerance-related deviations from nominal dimensions with respect to the LED board and the cover can be kept smaller; In this way, the relative arrangement between the, serving as a light source LED board on the one hand and an optical element for influencing the light generated by the LED board on the other hand can be set very precisely, which also determines the optical effect of the optical element particularly precisely as a result is.

Vorzugsweise ist die Abdeckung topfförmig gestaltet, so dass sie einen Bodenbereich und einen Seitenwandbereich aufweist, wobei die Rastverbindung an dem Seitenwandbereich angreifend gestaltet ist. Durch diese Ausgestaltung lässt sich erzielen, dass ein Innenraum des Beleuchtungsmoduls lediglich von der LED-Platine einerseits und der Abdeckung andererseits gebildet bzw. begrenzt ist. In diesem Innenraum kann gut geschützt wenigstens eine LED der LED-Platine angeordnet sein. Durch den Bodenbereich der Abdeckung ist dabei weiterhin vorzugsweise eine Lichtabstrahlfläche des Beleuchtungsmoduls gebildet, derart, dass durch sie hindurch das Licht zumindest teilweise das Beleuchtungsmodul verlässt.Preferably, the cover is cup-shaped, so that it has a bottom portion and a side wall portion, wherein the latching connection is designed to be attacking on the side wall portion. This refinement makes it possible to achieve that an interior of the lighting module is formed or limited only by the LED board on the one hand and the cover on the other hand. In this interior, at least one LED of the LED board can be well protected. In this case, a light emission surface of the illumination module is preferably formed by the bottom region of the cover, such that the light at least partially leaves the illumination module through it.

Erfindungsgemäß weist die LED-Platine randseitig eine Abstufung auf. Diese Abstufung kann vorteilhaft als Angriffsfläche für die Rastverbindung dienen. Vorzugsweise ist dabei die Abstufung der LED-Platine randseitig umlaufend in ringförmig geschlossener Form ausgebildet. Durch die Abstufung lässt sich insbesondere auch erzielen, dass Rastelemente, die an der Abdeckung ausgebildet sind, nicht über das Niveau einer Oberfläche der LED-Platine, die der wenigstens einen LED gegenüberliegt, überstehen. Hierdurch lässt sich das Beleuchtungsmodul besonders geeignet mit Bezug auf einen Wärmeübergang eine plane Fläche kontaktierend anordnen.According to the invention, the LED board edge on a gradation. This gradation can advantageously serve as an attack surface for the latching connection. Preferably, the gradation of the LED board is circumferentially formed circumferentially in an annular closed shape. The gradation can also be achieved, in particular, that latching elements which are formed on the cover do not project beyond the level of a surface of the LED board which is opposite to the at least one LED. As a result, the illumination module can be arranged in a particularly suitable manner with respect to a heat transfer to arrange a planar surface in a contacting manner.

Herstellungstechnisch vorteilhaft ist dabei die Abstufung durch ein Fräsen hergestellt.Manufacturing technology advantageous is the gradation produced by milling.

Vorzugsweise weist die LED-Platine in einem mittleren Bereich eine Stärke von mehr als 1 mm auf. Auf diese Weise eignet sie sich besonders gut als stabiles Trägerelement der Abdeckung. Wenn die LED-Platine durch eine Metallkernplatine gebildet ist, weist sie besonders gute Wärmeleiteigenschaften auf. Dies ist vorteilhaft mit Bezug auf den Abtransport einer Wärme, die bei einem Betrieb des Beleuchtungsmoduls von der wenigstens einen LED der LED-Platine gebildet wird.Preferably, the LED board in a central region has a thickness of more than 1 mm. In this way, it is particularly suitable as a stable support element the cover. If the LED board is formed by a metal core board, it has particularly good heat conduction properties. This is advantageous with respect to the removal of heat, which is formed during operation of the lighting module of the at least one LED of the LED board.

Erfindungsgemäß weist die Rastverbindung Rastelemente auf, die an der Abdeckung ausgebildet sind, wobei die Rastelemente die LED-Platine hintergreifend angeordnet sind. Hierdurch ist eine geeignete, stabile Halterung der Abdeckung an der LED-Platine ermöglicht. Vorzugsweise sind die Rastelemente in Form von Schnappern bzw. Vorsprüngen gebildet. Hierdurch ist eine einfache Handhabung beim Zusammenbau des Beleuchtungsmoduls unterstützt.According to the invention, the latching connection has latching elements which are formed on the cover, wherein the latching elements are arranged behind the LED circuit board. As a result, a suitable, stable mounting of the cover on the LED board is possible. Preferably, the locking elements are formed in the form of snappers or projections. As a result, an easy handling during assembly of the lighting module is supported.

Erfindungsgemäß ist das Beleuchtungsmodul derart gestaltet, dass die Rastelemente die LED-Platine derart hintergreifend angeordnet sind, dass sie lediglich die Abstufung kontaktierend angeordnet sind. Insbesondere kann die Gestaltung derart sein, dass die LED-Platine eine Begrenzungsfläche aufweist, durch die eine Außenfläche des Beleuchtungsmoduls gebildet ist, wobei die Abdeckung derart angeordnet ist, dass sie eine, durch die Begrenzungsfläche festgelegte Ebene nicht durchsetzt. Auf diese Weise lässt sich besonders geeignet erzielen, dass die Rastelemente nicht über diejenige Oberfläche der LED-Platine überstehen, die der wenigstens einen LED gegenüberliegt.According to the illumination module is designed such that the locking elements are arranged behind the LED board such that they are arranged only contacting the gradation. In particular, the design may be such that the LED board has a boundary surface through which an outer surface of the lighting module is formed, the cover being arranged such that it does not penetrate a plane defined by the boundary surface. In this way, it can be particularly suitably achieved that the locking elements do not protrude beyond that surface of the LED board, which is opposite to the at least one LED.

Insbesondere kann dabei die Abdeckung eine Begrenzungsfläche aufweisen, derart, dass die Begrenzungsfläche der LED-Platine und die Begrenzungsfläche der Abdeckung in der genannten Ebene liegen. Auf diese Weise lässt sich erzielen, dass die LED-Platine einem Betrachter des Beleuchtungsmoduls nicht unmittelbar sichtbar erscheint, wenn er auf die Abdeckung blickt.In particular, the cover may have a boundary surface such that the boundary surface of the LED board and the boundary surface of the cover lie in said plane. In this way, it can be achieved that the LED board does not appear immediately visible to a viewer of the lighting module when he looks at the cover.

Vorzugsweise weist das Beleuchtungsmodul weiterhin ein optisches Element zur Beeinflussung des Lichts auf, das vorzugsweise derart angeordnet ist, dass die LED-Platine sich an dem optischen Element abstützend angeordnet ist. Hierdurch wird erzielt, dass sich die Relativposition zwischen dem optischen Element und der LED-Platine besonders präzise festlegen lässt. Auf diese Weise lässt sich die optische Wirkung des optischen Elements besonders genau bestimmen.Preferably, the lighting module further comprises an optical element for influencing the light, which is preferably arranged such that the LED board is arranged to support the optical element. This achieves that the relative position between the optical element and the LED board can be set particularly precisely. In this way, the optical effect of the optical element can be determined particularly accurately.

Vorzugsweise ist das Beleuchtungsmodul dabei derart gestaltet, dass das optische Element innerhalb eines, von dem Seitenwandbereich umschlossenen Bereichs angeordnet ist. Hierdurch lässt sich das Beleuchtungsmodul besonders kompakt gestalten.In this case, the illumination module is preferably designed such that the optical element is within a region enclosed by the side wall region is arranged. As a result, the lighting module can be made very compact.

Die Erfindung wird im Folgenden anhand eines Ausführungsbeispiels und mit Bezug auf die Zeichnungen näher erläutert. Es zeigen:

Fig. 1
eine Skizze eines erfindungsgemäßen Beleuchtungsmoduls,
Fig. 2
einen Querschnitt durch das Beleuchtungsmodul,
Fig. 3
einen Querschnitt durch die separierte LED-Platine des Beleuchtungsmoduls und
Fig. 4
eine perspektivische Skizze der separierten LED-Platine.
The invention is explained in more detail below with reference to an embodiment and with reference to the drawings. Show it:
Fig. 1
a sketch of a lighting module according to the invention,
Fig. 2
a cross section through the lighting module,
Fig. 3
a cross section through the separated LED board of the lighting module and
Fig. 4
a perspective sketch of the separated LED board.

Fig. 1 zeigt eine perspektivische Skizze eines erfindungsgemäßen Beleuchtungsmoduls. Das Beleuchtungsmodul weist eine LED-Platine 1 auf, sowie eine lichtdurchlässige Abdeckung 2. Die Abdeckung 2 kann beispielsweise aus Kunststoff bestehen. Fig. 1 shows a perspective sketch of a lighting module according to the invention. The lighting module has an LED board 1, as well as a translucent cover 2. The cover 2 may for example consist of plastic.

Die LED-Platine 1 ist in separierter Form im Querschnitt in Fig. 3 skizziert. Die LED-Platine 1 weist zur Erzeugung eines Lichts insbesondere wenigstens eine LED 3 auf. Mit dem Ausdruck "LED-Platine" soll hier die entsprechende Platine mit der wenigstens einen darauf angeordneten LED 3 bezeichnet sein. In Fig. 4 ist die separierte LED-Platine 1 perspektivisch skizziert.The LED board 1 is in a separated form in cross section in Fig. 3 outlined. The LED board 1 has at least one LED 3 for generating a light. The term "LED board" is intended here to designate the corresponding board with the at least one LED 3 arranged thereon. In Fig. 4 the separated LED board 1 is sketched in perspective.

Das Beleuchtungsmodul ist dazu ausgestaltet, zum Betrieb mechanisch an einem (in den Figuren nicht gezeigten) Trägerelement einer Leuchtenvorrichtung angebracht zu werden und zur Stromversorgung der wenigstens einen LED mit diesem Trägerelement elektrisch verbunden zu werden. Für diese elektrische Verbindung kann das Beleuchtungsmodul insbesondere einen Stecker 5 aufweisen.The illumination module is designed to be mechanically attached to a carrier element (not shown in the figures) of a luminaire device for operation and to be electrically connected to the power supply of the at least one LED with this carrier element. For this electrical connection, the lighting module can in particular have a plug 5.

Die LED-Platine 1 ist vorzugsweise plattenförmig und weist eine Oberfläche bzw. Begrenzungsfläche 15 auf, sowie eine hierzu parallele weitere Begrenzungsfläche 16, wobei die wenigstens eine LED 3 auf der weiteren Begrenzungsfläche 16, insbesondere lediglich auf der weiteren Begrenzungsfläche 16 angeordnet ist.The LED board 1 is preferably plate-shaped and has a surface or boundary surface 15, and a further boundary surface 16 parallel thereto, wherein the at least one LED 3 is arranged on the further boundary surface 16, in particular only on the further boundary surface 16.

Die Begrenzungsfläche 15 ist vorzugsweise plan gestaltet. Die Begrenzungsfläche 15 kann dafür vorgesehen sein, einen ebenfalls planen Anlagebereich des Trägerelements der Leuchtenvorrichtung flächig zu kontaktieren, wenn das Beleuchtungsmodul zum Betrieb mechanisch an dem Trägerelement der Leuchtenvorrichtung angebracht wird bzw. ist.The boundary surface 15 is preferably designed plan. The boundary surface 15 may be provided to contact a likewise planar contact region of the carrier element of the luminaire device in a planar manner when the illumination module is mechanically attached to the carrier element of the luminaire device for operation.

Beim Ausführungsbeispiel erhebt sich der Stecker 5 über die Begrenzungsfläche 15 hinaus, wobei an dem Trägerelement der Leuchtenvorrichtung eine entsprechend korrespondierende Buchse ausgebildet ist. Zur Anordnung des Steckers 5 kann die LED-Platine 1 eine entsprechende Durchführungsöffnung 12 aufweisen.In the exemplary embodiment, the plug 5 rises beyond the boundary surface 15, wherein on the support element of the lamp device, a correspondingly corresponding socket is formed. For the arrangement of the plug 5, the LED board 1 may have a corresponding passage opening 12.

Fig. 2 zeigt einen Querschnitt durch das Beleuchtungsmodul. Das Beleuchtungsmodul ist derart gestaltet, bzw. die die Abdeckung 2 ist derart angeordnet, dass das von der LED-Platine 1 erzeugte Licht zumindest teilweise, insbesondere zumindest überwiegend die Abdeckung 2 durchsetzt. Fig. 2 shows a cross section through the lighting module. The lighting module is designed in such a way, or the cover 2 is arranged such that the light generated by the LED board 1 at least partially, in particular at least predominantly passes through the cover 2.

Vorzugsweise ist Abdeckung 2 topfförmig gestaltet, so dass sie einen Bodenbereich 23 und einen Seitenwandbereich 24 aufweist. Insbesondere kann die Abdeckung 2 - wie aus den Figuren beispielhaft hervorgeht - zumindest in erster Näherung so geformt sein, dass sie eine Quaderform festlegt, wobei durch den Bodenbereich 23 eine erste Rechteckfläche des Quaders beschrieben ist und durch den Seitenwandbereich 24 vier weitere Rechteckflächen des Quaders beschrieben sind, die sich an diejenige Rechteckfläche anschließen, die durch den Bodenbereich 23 beschrieben ist.Preferably, cover 2 is cup-shaped, so that it has a bottom portion 23 and a side wall portion 24. In particular, as is apparent from the figures, the cover 2 can be shaped, at least in a first approximation, to define a cuboid shape, wherein a first rectangular area of the cuboid is described by the bottom area 23 and four further rectangular areas of the cuboid are described by the sidewall area 24 are that connect to that rectangular area, which is described by the bottom portion 23.

Der Seitenwandbereich 24 kann also insbesondere umlaufend gestaltet sein, wobei im Bereich der, auf diese Weise durch den Seitenwandbereich 24 gebildeten Öffnung die LED-Platine 1 angeordnet ist, insbesondere diese Öffnung abdeckend angeordnet ist. Dementsprechend kann der Bodenbereich 23 der Abdeckung 2 etwa so groß gestaltet sein wie die LED-Platine 1.The side wall region 24 can thus be designed in particular circumferential, wherein the LED board 1 is arranged in the region of, in this way formed by the side wall portion 24 opening, in particular this opening is arranged covering. Accordingly, the bottom portion 23 of the cover 2 can be made about as large as the LED board. 1

Durch den Bodenbereich 23 der Abdeckung 2 ist beim Ausführungsbeispiel eine Lichtabstrahlfläche 22 des Beleuchtungsmoduls gebildet, derart, dass durch sie hindurch das Licht, das von der LED-Platine 1 erzeugt ist, zumindest teilweise das Beleuchtungsmodul verlässt. Die Lichtabstrahlfläche 22 kann plan ausgebildet sein; insbesondere kann das Beleuchtungsmodul so gestaltet sein, dass die Lichtabstrahlfläche 22 parallel zu der Begrenzungsfläche 15 der LED-Platine 1 orientiert ist.In the exemplary embodiment, a light emission surface 22 of the illumination module is formed by the bottom region 23 of the cover 2 such that the light which is generated by the LED circuit board 1 at least partially leaves the illumination module through it. The light emitting surface 22 may be formed flat; In particular, the illumination module can be designed so that the light emission surface 22 is oriented parallel to the boundary surface 15 of the LED board 1.

Die Abdeckung 2 ist an der LED-Platine 1 lediglich über eine Rastverbindung gehalten angeordnet. Dies ist vorteilhaft, weil auf diese Weise auf ein gesondertes Bauteil verzichtet werden kann, das zur Halterung der LED-Platine 1 bzw. zur Halterung der Abdeckung 2 dient. Insbesondere ist das Beleuchtungsmodul derart gestaltet, dass die Rastverbindung unmittelbar zwischen der LED-Platine 1 einerseits und der Abdeckung 2 andererseits wirkt, also ohne die Beteiligung eines weiteren Bauteils.The cover 2 is arranged on the LED board 1 only held via a latching connection. This is advantageous because in this way it is possible to dispense with a separate component which serves for holding the LED board 1 or for holding the cover 2. In particular, the lighting module is designed such that the latching connection acts directly between the LED board 1 on the one hand and the cover 2 on the other hand, ie without the involvement of another component.

Beim Ausführungsbeispiel ist das Beleuchtungsmodul so gestaltet, dass sowohl die LED-Platine 1, als auch die Abdeckung 2 Außenflächen des Beleuchtungsmoduls bilden. Insbesondere bildet die Begrenzungsfläche 15 der LED-Platine 1 eine Außenfläche des Beleuchtungsmoduls.In the embodiment, the lighting module is designed so that both the LED board 1, as well as the cover 2 form outer surfaces of the lighting module. In particular, the boundary surface 15 of the LED board 1 forms an outer surface of the illumination module.

Vorzugsweise weist die Rastverbindung Rastelemente 21 auf, die an der Abdeckung 2 ausgebildet sind, wobei die Rastelemente 21 die LED-Platine 1 hintergreifend angeordnet sind. Vorzugsweise sind die Rastelemente 21 am Seitenwandbereich 24 der Abdeckung 2 ausgebildet.Preferably, the latching connection has latching elements 21, which are formed on the cover 2, wherein the latching elements 21, the LED board 1 are arranged engaging behind. Preferably, the locking elements 21 are formed on the side wall portion 24 of the cover 2.

Vorzugsweise sind die Rastelemente 21 in Form von Schnappern bzw. Vorsprüngen gebildet. Hierdurch lässt sich die Abdeckung 2 besonders einfach mit der LED-Platine 1 zusammenbauen.Preferably, the locking elements 21 are formed in the form of snappers or projections. As a result, the cover 2 can be particularly easily assembled with the LED board 1.

Die Rastverbindung kann derart gestaltet sein, dass sie sich nicht mehr zerstörungsfrei öffnen lässt.The latching connection can be designed such that it can no longer be opened without destroying it.

Wie beim Ausführungsbeispiel der Fall und beispielsweise aus Fig. 2 zu entnehmen, kann die Abdeckung 2 eine insbesondere ringförmig am Seitenwandbereich 24 umlaufend ausgebildete Auflageschulter 27 aufweisen, die zur Auflage der LED-Platine 1 dient und die in Zusammenwirkung mit den Rastelementen 21 die Abdeckung 2 gegenüber der LED-Platine 1 in Position hält. Zum Zusammenbau kann dementsprechend vorgesehen sein, dass die LED-Platine 1 in die durch den Seitenwandbereich 24 der Abdeckung 2 gebildete Öffnung eingesetzt wird, bis sie randseitig ringsum die Auflageschulter 27 kontaktiert und die Rastelemente 21 die LED-Platine 1 einschnappend umgreifen bzw. hintergreifen.As in the embodiment of the case and for example Fig. 2 can be seen, the cover 2 a particular annular on the side wall portion 24 peripherally formed support shoulder 27 which serves to support the LED board 1 and holds the cover 2 in cooperation with the locking elements 21 relative to the LED board 1 in position. For assembly can accordingly be provided that the LED board 1 is inserted into the opening formed by the side wall portion 24 of the cover 2 until it touches the edge shoulder around the support shoulder 27 and the locking elements 21 engage around the LED board 1 snapping or engage behind.

Vorzugsweise ist die LED-Platine 1 - ohne die wenigstens eine LED 3 gemessen - eine dicke Platine, so dass sie eine besonders geeignete Stabilität zur Halterung der Abdeckung 2 aufweist. Insbesondere kann die LED-Platine 1 - ohne die wenigstens eine LED 3 gemessen - in einem mittleren Bereich eine Stärke d von mehr als 1 mm aufweisen. Vorzugsweise ist die LED-Platine 1 dazu ausgelegt, als Träger des gesamten Beleuchtungsmoduls zu dienen.Preferably, the LED board 1 - without the at least one LED 3 measured - a thick board, so that they have a particularly suitable stability for holding the Cover 2 has. In particular, the LED board 1 - without the at least one LED 3 measured - in a central region have a thickness d of more than 1 mm. Preferably, the LED board 1 is designed to serve as a carrier of the entire lighting module.

Weiterhin vorzugsweise ist die LED-Platine 1 durch eine Metallkernplatine gebildet, beispielsweise eine Aluminium-Metallkernplatine. Auf diese Weise lässt sich insbesondere erzielen, dass eine Wärme, die bei einem Betrieb des Beleuchtungsmoduls durch die wenigstens eine LED 3 der LED-Platine 1 erzeugt wird, geeignet auf die Begrenzungsfläche 15 der LED-Platine 1 und damit auf eine Außenfläche bzw. Oberfläche des Beleuchtungsmoduls geleitet wird. Die LED-Platine 1 kann auf diese Weise sozusagen einen Kühlkörper des Beleuchtungsmoduls bilden.Further preferably, the LED board 1 is formed by a metal core board, for example, an aluminum-metal core board. In this way, it can be achieved, in particular, that heat which is generated during operation of the illumination module by the at least one LED 3 of the LED board 1 is suitable for the boundary surface 15 of the LED board 1 and thus for an outer surface or surface the lighting module is passed. The LED board 1 can form in this way, so to speak, a heat sink of the lighting module.

Wie beim Ausführungsbeispiel der Fall, weist vorzugsweise die LED-Platine 1 randseitig bzw. an ihrem Umfangsbereich eine Abstufung 11 auf. Insbesondere kann die Abstufung 11 der LED-Platine 1 randseitig umlaufend in ringförmig geschlossener Form ausgebildet sein, wie beispielhaft in Fig. 4 angedeutet. Die Eckbereiche der LED-Platine 1 sind dabei einschließlich der Abstufung 11 vorzugsweise abgerundet ausgebildet.As in the embodiment of the case, preferably, the LED board 1 on the edge side or on its peripheral region a gradation 11. In particular, the gradation 11 of the LED board 1 can be circumferentially formed in annularly closed form, as exemplified in Fig. 4 indicated. The corner regions of the LED board 1 are formed, including the gradation 11 is preferably rounded.

Wie beispielsweise aus Fig. 3 hervorgeht, ist die Abstufung 11 insbesondere auf derjenigen Seite der LED-Platine 1 ausgebildet, die der wenigstens einen LED 3 gegenüberliegt. Die Abstufung 11 schließt sich somit unmittelbar an die Begrenzungsfläche 15 der LED-Platine 1 an.Like, for example Fig. 3 shows the gradation 11 is formed in particular on that side of the LED board 1, which is opposite to the at least one LED 3. The gradation 11 thus directly adjoins the boundary surface 15 of the LED board 1.

Durch die Abstufung 11 ist eine besonders gut geeignete Angriffsfläche für die Rastverbindung gebildet. Insbesondere lässt sich durch die Abstufung 11 erzielen, dass sich - wie aus Fig. 2 hervorgeht - die Abdeckung 2 nicht über eine Ebene E hinaus erstreckt, die durch die Begrenzungsfläche 15 der LED-Platine 1 festgelegt ist. Beim Ausführungsbeispiel ist dabei die Gestaltung derart, dass die Rastelemente 21 lediglich die Abstufung 11 kontaktierend angeordnet sind. Hierdurch lässt sich erzielen, dass sich das Beleuchtungsmodul zum Betrieb derart mechanisch an dem Trägerelement der Leuchtenvorrichtung anbringen lässt, dass die Begrenzungsfläche 15 der LED-Platine 1 flächig einen planen Oberflächenbereich dieses Trägerelements kontaktiert und so eine besonders geeignete Wärmeabfuhr erzielt wird.Due to the gradation 11 a particularly suitable attack surface for the latching connection is formed. In particular, can be achieved by grading 11 that - as out Fig. 2 shows - the cover 2 does not extend beyond a plane E out, which is defined by the boundary surface 15 of the LED board 1. In the embodiment, the design is such that the locking elements 21 are arranged only the gradation 11 contacting. In this way, it can be achieved that the illumination module can be mechanically attached to the support element of the luminaire device in such a way that the boundary surface 15 of the LED circuit board 1 flatly contacts a planar surface region of this support element and thus a particularly suitable heat dissipation is achieved.

Wie aus Fig. 2 andeutungsweise hervorgeht, ist beim Ausführungsbeispiel die Gestaltung weiterhin derart, dass die Abdeckung 2 eine Begrenzungsfläche 25 aufweist, derart, dass die Begrenzungsfläche 15 der LED-Platine 1 und die Begrenzungsfläche 25 der Abdeckung 5 in der Ebene E liegen. Die Begrenzungsfläche 25 der Abdeckung 2 kann insbesondere durch einen, durch den Seitenwandbereich 24 gebildeten Kantenbereich der Abdeckung 2 gebildet sein. Mit anderen Worten kann also vorgesehen sein, dass die Begrenzungsfläche 15 der LED-Platine 1, die als eine "Rückseite" der LED-Platine 1 aufgefasst werden kann, bündig mit diesem Kantenbereich der Abdeckung 2 abschließt.How out Fig. 2 Suggestively, in the embodiment, the design is further such that the cover 2 has a boundary surface 25, such that the boundary surface 15 of the LED board 1 and the boundary surface 25 of the cover 5 lie in the plane E. The boundary surface 25 of the cover 2 may in particular be formed by an edge region of the cover 2 formed by the side wall region 24. In other words, it can thus be provided that the boundary surface 15 of the LED board 1, which can be regarded as a "back side" of the LED board 1, is flush with this edge region of the cover 2.

Auf diese Weise lässt sich erzielen, dass ein Betrachter des Beleuchtungsmoduls - wenn Letzteres mit der Begrenzungsfläche 15 das Trägerelement der Leuchtenvorrichtung kontaktierend angeordnet ist - nicht direkt auf die LED-Platine 1 blickt, wenn er das Beleuchtungsmodul betrachtet.In this way it can be achieved that a viewer of the lighting module - if the latter is arranged in contact with the boundary surface 15, the support element of the lighting device - does not look directly at the LED board 1 when viewing the lighting module.

Zur Herstellung einer LED-Platine ist aus dem Stand der Technik bekannt, das Platinen-Material zu ritzen und anschließend zu brechen. Im Unterschied hierzu ist zur Herstellung der LED-Platine 1 des hier beschriebenen Beleuchtungsmoduls vorzugsweise vorgesehen, die Abstufung 11 durch ein Fräsen herzustellen, insbesondere mit einem Stufenfräser.To produce an LED board, it is known from the prior art to score the board material and then to break it. In contrast, for producing the LED board 1 of the illumination module described here, it is preferably provided to produce the gradation 11 by milling, in particular with a step milling cutter.

Weiterhin vorzugsweise weist das Beleuchtungsmodul außerdem ein optisches Element 4 zur Beeinflussung des Lichts auf. Das optische Element 4 kann dabei derart angeordnet sein, dass die LED-Platine 1 sich an dem optischen Element 4 abstützend angeordnet ist. Hierdurch lässt sich eine vorgesehene Relativanordnung zwischen der LED-Platine 1 und dem optischen Element 4 besonders genau einhalten.Furthermore, preferably, the illumination module also has an optical element 4 for influencing the light. The optical element 4 can be arranged such that the LED board 1 is arranged supportingly on the optical element 4. As a result, a planned relative arrangement between the LED board 1 and the optical element 4 can be maintained particularly accurately.

Das optische Element 4 kann beispielsweise dazu ausgebildet sein, das Licht, das von der LED-Platine 4 erzeugt ist, in seinem Richtungsverhalten zu verändern. Dementsprechend kann das optische Element 4 zwischen der LED-Platine 1 einerseits und dem Bodenbereich 23 der Abdeckung 2 andererseits angeordnet sein.The optical element 4 can be designed, for example, to change the direction of the light generated by the LED board 4. Accordingly, the optical element 4 may be disposed between the LED board 1 on the one hand and the bottom portion 23 of the cover 2 on the other hand.

Beispielsweise kann das optische Element 4 ein Linsenelement, beispielsweise in Form eine Linsenclusters, aufweisen, mit dem zumindest ein Teil des Lichts beeinflusst wird; alternativ oder zusätzlich kann das optische Element 4 ein optisch streuendes Element aufweisen, mit dem zumindest ein Teil des Lichts bzw. gegebenenfalls ein weiterer Teil des Lichts beeinflusst wird.For example, the optical element 4 may comprise a lens element, for example in the form of a lens cluster, with which at least part of the light is influenced; Alternatively or additionally, the optical element 4 may comprise an optically scattering element, with which at least a part of the light or optionally a further part of the light is influenced.

Wie im Ausführungsbeispiel der Fall, kann das optische Element 4 in dem Innenraum des Beleuchtungsmoduls angeordnet sein, der einerseits durch die LED-Platine 1 und andererseits durch die topfförmige Abdeckung 2 gebildet ist. Insbesondere kann die Gestaltung derart sein, dass das optische Element 4 innerhalb eines, von dem Seitenwandbereich 24 der Abdeckung 2 umschlossenen Bereichs angeordnet ist.As in the exemplary embodiment of the case, the optical element 4 may be arranged in the interior of the lighting module, which is formed on the one hand by the LED board 1 and on the other hand by the cup-shaped cover 2. In particular, the design may be such that the optical element 4 is disposed within a region enclosed by the sidewall region 24 of the cover 2.

Durch die insgesamt geringe Anzahl an Bauteilen und die damit verbundenen geringen Toleranzen lässt sich erzielen, dass die wenigstens eine LED 3 der LED-Platine 1 gegenüber dem optischen Element 4 und gegenüber der Abdeckung 2 besonders präzise angeordnet ist.Due to the overall small number of components and the associated small tolerances can be achieved that the at least one LED 3 of the LED board 1 with respect to the optical element 4 and against the cover 2 is arranged very precisely.

Beim Ausführungsbeispiel ist das optische Element 4 in die topfförmige Abdeckung 2 eingelegt angeordnet.In the embodiment, the optical element 4 is arranged in the pot-shaped cover 2 inserted.

Beim Ausführungsbeispiel weist die LED-Platine 1 außerdem noch wenigstens eine Ausnehmung 14 auf, die als Angriffspunkt für ein Halteelement zur mechanischen Halterung des Beleuchtungsmoduls an dem Trägerelement der Leuchtenvorrichtung gestaltet ist. Abgesehen von der Durchführungsöffnung 12 für den Stecker 5 und die wenigstens eine Ausnehmung 14 weist die LED-Platine 1 keine Vertiefung auf.In the exemplary embodiment, the LED board 1 also has at least one recess 14, which is designed as a point of attack for a holding element for the mechanical support of the lighting module to the support element of the lighting device. Apart from the passage opening 12 for the plug 5 and the at least one recess 14, the LED board 1 no recess.

Claims (12)

  1. An illumination module having
    - a LED circuit board (1) for generating a light,
    - a light permeable cover (2), which is arranged such that the light at least partially penetrates the cover (2),
    wherein the cover (2) is arranged on the LED circuit board (1) held only by means of a latching connection,
    wherein the latching connection has latching elements (21) which are formed on the cover (2),
    characterized in
    that the LED circuit board (1) has a gradation (11) on the edge side, wherein the latching elements (21) are arranged engaging behind the LED circuit board (1), in such a manner that they are arranged contacting only the gradation (11).
  2. An illumination module according to Claim 1,
    in which the cover (2) is designed to be pot-shaped, so that it has a bottom area (23) and a side wall area (24), wherein the latching connection is designed so as to engage on the side wall area (24).
  3. An illumination module according to Claim 2,
    in which a light radiation surface (22) of the illumination module is formed by the bottom area (23) of the cover (2) in such a manner that through it the light at least partially leaves the illumination module.
  4. An illumination module according to any one of the preceding claims,
    in which the gradation (11) of the LED circuit board (1) is formed circumferentially on the edge side in a ring-shaped closed form.
  5. An illumination module according to any one of the preceding claims,
    in which the gradation (11) is produced by a milling.
  6. An illumination module according to any one of the preceding claims,
    in which the LED circuit board (1) in a middle area has a thickness (d) of more than 1 mm.
  7. An illumination module according to any one of the preceding claims,
    in which the LED circuit board (1) is formed by a metal core circuit board.
  8. An illumination module according to any one of the preceding claims,
    in which the latching elements (21) are formed in the form of latches or projections.
  9. An illumination module according to any one of the preceding claims,
    in which the LED circuit board (1) has a limiting surface (15), by which the outer surface of the illumination module is formed, wherein the cover (2) is arranged in such a manner that it does not penetrate a plane (E) defined by the limiting surface (15).
  10. An illumination module according to Claim 9,
    in which the cover (2) has a limiting surface (25), in such a manner that the limiting surface (15) of the LED circuit board (1) and the limiting surface (25) of the cover (5) are situated in the plane (E).
  11. An illumination module according to any one of the preceding claims, furthermore having
    - an optical element (4) for influencing the light,
    which is preferably arranged in such a manner that the LED circuit board (1) is arranged so as to be supported on the optical element (4).
  12. An illumination module according to Claim 2 or a claim dependent on Claim 2 and Claim 11,
    which is designed in such a manner that the optical element (4) is arranged within an area surrounded by the side wall area (24).
EP14744513.4A 2013-07-23 2014-07-23 Led illumination module Active EP3030833B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE202013103294.8U DE202013103294U1 (en) 2013-07-23 2013-07-23 LED lighting module
PCT/EP2014/065796 WO2015011179A1 (en) 2013-07-23 2014-07-23 Led illumination module

Publications (2)

Publication Number Publication Date
EP3030833A1 EP3030833A1 (en) 2016-06-15
EP3030833B1 true EP3030833B1 (en) 2017-05-31

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EP14744513.4A Active EP3030833B1 (en) 2013-07-23 2014-07-23 Led illumination module

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US (1) US20160195247A1 (en)
EP (1) EP3030833B1 (en)
AT (1) AT14368U1 (en)
DE (1) DE202013103294U1 (en)
WO (1) WO2015011179A1 (en)

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Also Published As

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US20160195247A1 (en) 2016-07-07
AT14368U1 (en) 2015-09-15
EP3030833A1 (en) 2016-06-15
DE202013103294U1 (en) 2014-10-27
WO2015011179A1 (en) 2015-01-29

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