EP3025397B1 - System consisting of a printed circuit board and tubular casing - Google Patents

System consisting of a printed circuit board and tubular casing Download PDF

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Publication number
EP3025397B1
EP3025397B1 EP14742152.3A EP14742152A EP3025397B1 EP 3025397 B1 EP3025397 B1 EP 3025397B1 EP 14742152 A EP14742152 A EP 14742152A EP 3025397 B1 EP3025397 B1 EP 3025397B1
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EP
European Patent Office
Prior art keywords
circuit board
printed circuit
contact surface
contact
casing
Prior art date
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EP14742152.3A
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German (de)
French (fr)
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EP3025397A1 (en
Inventor
Martin Zebhauser
Rainer BIPPUS
Holger BROSCH
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rosenberger Hochfrequenztechnik GmbH and Co KG
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Rosenberger Hochfrequenztechnik GmbH and Co KG
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Publication of EP3025397A1 publication Critical patent/EP3025397A1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
    • H01R9/03—Connectors arranged to contact a plurality of the conductors of a multiconductor cable, e.g. tapping connections
    • H01R9/05—Connectors arranged to contact a plurality of the conductors of a multiconductor cable, e.g. tapping connections for coaxial cables
    • H01R9/0515—Connection to a rigid planar substrate, e.g. printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6591—Specific features or arrangements of connection of shield to conductive members
    • H01R13/6594—Specific features or arrangements of connection of shield to conductive members the shield being mounted on a PCB and connected to conductive members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/38—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts
    • H01R24/40—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency
    • H01R24/50—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency mounted on a PCB [Printed Circuit Board]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2107/00—Four or more poles

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  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Multi-Conductor Connections (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Description

Die Erfindung betrifft ein System aus einer Leiterplatte und einem mit der Leiterplatte verbundenen, rohrförmigen Mantel, insbesondere Leiter. Insbesondere betrifft die Erfindung ein solches System, bei dem der Mantel, insbesondere als Außenleiter, einen oder mehrere Innenleiter einer gemantelten und insbesondere geschirmten Einfach- oder Mehrfachleitung (z.B. Koaxialleitung) umgibt.The invention relates to a system comprising a printed circuit board and a tubular jacket connected to the printed circuit board, in particular conductors. In particular, the invention relates to such a system in which the jacket, in particular as outer conductor, surrounds one or more inner conductors of a sheathed and in particular shielded single or multiple line (for example coaxial line).

Derartige Systeme sind Teil einer Vielzahl von Vorrichtungen, in denen Hochfrequenzsignale übertragen und verarbeitet werden (z.B. Multimediageräte). Der oder die für die Hochfrequenzsignalübertragung vorgesehenen Innenleiter der geschirmten Einfach- oder Mehrfachleitungen sind mit definierten Leiterbahnen der Leiterplatte elektrisch leitend verbunden, während der Außenleiter (Mantel) als Schirmung für die Innenleiter dient und dazu regelmäßig mit einem an Masse angeschlossenen Kontaktbereich der Leiterplatte elektrisch leitend verbunden ist. Die Verbindungen zwischen den Innen- und Außenleitern und den entsprechenden Kontaktbereichen der Leiterplatte kann dabei form-, kraft- oder stoffschlüssig erfolgen. Für eine stoffschlüssige Verbindung wird vielfach gelötet, wobei bei dem Verlöten großflächiger Kontaktflächen aus Kostengründen punktuelle oder abschnittsweise Lötstellen realisiert werden.Such systems are part of a variety of devices in which radio frequency signals are transmitted and processed (eg, multimedia devices). The one or more of the high-frequency signal transmission inner conductor of the shielded single or multiple lines are electrically connected to defined tracks of the circuit board, while the outer conductor (sheath) serves as a shield for the inner conductor and regularly electrically connected to a connected to ground contact area of the circuit board is. The connections between the inner and outer conductors and the corresponding contact areas of the printed circuit board can be positive, positive or cohesive. For a cohesive connection is often soldered, with the soldering large contact surfaces for cost reasons are selectively or partially solder joints realized.

Für bestimmte Anwendungen kann es erforderlich sein, die Verbindung zwischen der Leiterplatte und der Koaxialleitung abzudichten, um insbesondere ein Vordringen von Feuchtigkeit bis zu den Innenleitern und deren Kontaktstellen mit den Leiterbahnen der Leiterplatte oder auch ein Eindringen von Feuchtigkeit über die Kontaktstellen in ein den Außenleiter umgebendes Gehäuse zu vermeiden. Hierzu wird regelmäßig ein separates Dichtelement, beispielsweise ein herkömmlicher O-Ring eingesetzt, der im Kontaktbereich zwischen der Leiterplatte und dem Außenleiter angeordnet wird. Diese Art der Abdichtung ist mit relativ hohen Kosten verbunden, die nicht nur in den Bauteilkosten für das Dichtelement begründet sind, sondern auch aus der relativ aufwändigen Montage des Systems resultieren.For certain applications, it may be necessary to seal the connection between the printed circuit board and the coaxial line, in particular a penetration of moisture up to the inner conductors and their contact points with the conductor tracks of the printed circuit board or moisture through the contact points in a surrounding the outer conductor Avoid housing. For this purpose, a separate sealing element, for example, a conventional O-ring is used regularly, which is arranged in the contact region between the circuit board and the outer conductor. This type of sealing is associated with relatively high costs, which are not only due to the component costs for the sealing element, but also result from the relatively complex assembly of the system.

Die EP 1 187 268 A2 offenbart ein koaxial aufgebautes Verbindermodul zur Installation an einer Leiterplatte. Zur Verbindung mit der Leiterplatte ist an dem vorderen Ende eines rohrförmigen Mantels eine Masseklemme angepresst. Die Masseklemme weist zwei nach unten vorstehende Ausläufer auf. Diese Ausläufer dienen zum Befestigen und zum Kontaktieren an der Leiterplatte. Dazu werden die Ausläufer in Einführlöcher der Leiterplatte eingeführt und bspw. verlötet.The EP 1 187 268 A2 discloses a coaxial connector module for installation on a printed circuit board. For connection to the printed circuit board, a ground terminal is pressed against the front end of a tubular jacket. The ground terminal has two downwardly projecting extensions. These extensions serve to attach and to contact the circuit board. For this purpose, the extensions are inserted into insertion holes of the circuit board and, for example, soldered.

Die US 5,116,245 offenbart ein koaxial aufgebautes Verbindungsmodul, das zur Installation an einer Leiterplatte ausgebildet ist. Zur Anbringung an der Leiterplatte werden Befestigungsbügel in Kontaktlöcher der Leiterplatte eingeführt und dort an einen Masseleiter angelötet. Die Befestigungsbügel sind nicht Teil einer ringförmigen Kontaktfläche, sondern stehen beabstandet von einer solchen Fläche in Richtung der Leiterplatte als Befestigungselemente vor.The US 5,116,245 discloses a coaxially constructed interconnect module configured for installation on a printed circuit board. For attachment to the circuit board mounting bracket are inserted into contact holes of the circuit board and soldered there to a ground conductor. The mounting brackets are not part of an annular contact surface, but are spaced from such a surface in the direction of the circuit board as fastening elements.

Die WO 98/43323 A1 offenbart einen Koaxialverbinder zum Verbinden von zwei Leiterplatten. Der Koaxialverbinder weist ein erstes und ein zweites Anschlusselement auf. Das erste Anschlusselement weist einen axial elastisch verschiebbaren Innenkontakt auf, der direkt eine Leiterbahn auf einer der Leiterplatten kontaktiert. Das zweite Kontaktstück weist ein Leiterteil auf, das auf der Leiterbahn zum Steckverbinden mit einem ersten Außenleiter-Anschlusselement ausgebildet ist.The WO 98/43323 A1 discloses a coaxial connector for connecting two circuit boards. The coaxial connector has a first and a second connection element. The first connection element has an axially elastically displaceable inner contact which directly contacts a conductor track on one of the printed circuit boards. The second contact piece has a Ladder part, which is formed on the conductor for plugging with a first outer conductor connection element.

Dokument DE-B3-102010016578 ist als nächstliegender Stand der Technik betrachtet und offenbart ein System aus einer Leiterplatte und einem mit der Leiterplatte verbundenen rohrförmigen Mantel.document DE-B3-102010016578 is considered to be the closest prior art and discloses a system of a printed circuit board and a tubular jacket connected to the printed circuit board.

Ausgehend von diesem Stand der Technik lag der Erfindung die Aufgabe zugrunde, eine Möglichkeit zur kostengünstigen Abdichtung der Verbindung einer Leiterplatte mit einer ummantelten und insbesondere geschirmten Leitung anzugeben.Based on this prior art, the present invention seeks to provide a way to inexpensively seal the connection of a circuit board with a sheathed and especially shielded cable.

Diese Aufgabe wird durch ein System gemäß dem unabhängigen Anspruch 1 gelöst. Vorteilhafte Ausgestaltungen des erfindungsgemäßen Systems sind Gegenstand der abhängigen Ansprüche und ergeben sich aus der nachfolgenden Beschreibung der Erfindung.This object is achieved by a system according to independent claim 1. Advantageous embodiments of the system according to the invention are the subject of the dependent claims and will become apparent from the following description of the invention.

Der Erfindung liegt der Gedanke zugrunde, die Verbindung zwischen der Leiterplatte und einem rohrförmigen Mantel, insbesondere einem Außenleiter einer geschirmten Einfach- oder Mehrfachleitung, durch Löten auszubilden und die Lötverbindung derart auszubilden, dass diese gleichzeitig zur Abdichtung des Verbindungsbereichs dienen kann. Dazu ist erforderlich, dass der verlötete Verbindungsbereich vollumfänglich bezüglich des Querschnitts des Mantels vorgesehen und zudem so großflächig ausgebildet ist, dass mittels des in den Kontaktzwischenraum zwischen der Leiterplatte und dem Mantel eingebrachten Lots ein ausreichende Dichtwirkung erzielt werden kann.The invention is based on the idea to form the connection between the circuit board and a tubular jacket, in particular an outer conductor of a shielded single or multiple line, by soldering and form the solder joint such that it can simultaneously serve to seal the connection area. For this purpose, it is necessary for the soldered connection region to be provided completely with respect to the cross section of the jacket and, moreover, to be of such a large surface area that a sufficient sealing effect can be achieved by means of the solder introduced into the contact gap between the printed circuit board and the jacket.

Dementsprechend ist ein System aus einer Leiterplatte und einem vorzugsweise mit der Leiterplatte elektrisch leitend verbundenen, rohrförmigen (und vorzugsweise elektrisch leitfähigem) Mantel, insbesondere Leiter, erfindungsgemäß dadurch gekennzeichnet, dass der Mantel die Leiterplatte stirnseitig mit einer flächigen, geschlossen ringförmigen (z.B. kreisringförmigen, quadratischen, rechteckigen, etc.) Kontaktfläche kontaktiert und die Leiterplatte mit dem Mantel vollumfänglich (bevorzugt vollflächig) entlang der Kontaktfläche eine Lötverbindung bildend verlötet ist, wobei die Lötverbindung eine Abdichtung gegen ein Eindringen von Feuchtigkeit in dem von dem Mantel ausgebildeten Hohlraum bildet.Accordingly, a system comprising a printed circuit board and a tubular (and preferably electrically conductive) sheath, in particular a conductor, which is preferably electrically conductively connected to the printed circuit board is inventively characterized in that the sheath has the face side with a flat, closed annular (eg annular, square , rectangular, etc.) contacted contact surface and the circuit board with the jacket fully (preferably full-surface) along the contact surface soldered forming a connection, wherein the solder joint forms a seal against ingress of moisture in the cavity formed by the shell.

Um eine für eine gute Dichtwirkung ausreichend große Kontaktfläche zu erhalten kann es vorteilhaft sein, dass die Stärke der Kontaktfläche größer als die Wandstärke des Mantels in einem von der Kontaktfläche beabstandeten Abschnitt ist. Insbesondere kann vorgesehen sein, dass die Stärke der Kontaktfläche größer als die Normalwandstärke, d.h. diejenige Wandstärke, die der Mantel entlang des größten Teils seiner Länge aufweist, ist. Um dies zu erreichen kann beispielsweise vorgesehen sein, dass der Mantel an seinem kontaktseitigen Ende mit einer Verdickung ausgebildet ist, die beispielsweise als umlaufender Absatz ausgebilde t sein kann. Dabei muss der Absatz nicht einteilig mit dem (Rest-)Mantel ausgebildet sein. Alternativ kann auch vorgesehen sein, dass der Mantel an seinem kontaktseitigen Ende z.B. die Normalwandstärke aufweist und zur Vergrößerung der Kontaktfläche ein Endabschnitt radial nach außen weisend (insbesondere um 90°) umgebogen wird. Für eine ausreichende gute Dichtwirkung kann vorzugsweise vorgesehen sein, dass die Stärke der ringförmigen Kontaktfläche mindestens 0,3 mm beträgt. Neben einer ausreichend guten Dichtwirkung kann durch eine Vergrößerung der Kontaktfläche auch eine Erhöhung der Festigkeit der durch das Verlöten erzielten mechanischen Verbindung zwischen der Leiterplatte und dem Mantel realisiert werden.In order to obtain a sufficiently large contact surface for a good sealing effect, it may be advantageous for the thickness of the contact surface to be greater than the wall thickness of the jacket in a section spaced from the contact surface. In particular, it may be provided that the thickness of the contact surface is greater than the normal wall thickness, i. that wall thickness that the shell has along most of its length is. To achieve this, for example, be provided that the jacket is formed at its contact-side end with a thickening, which can be formed, for example, as a circumferential paragraph t. The heel does not have to be formed integrally with the (residual) jacket. Alternatively, it can also be provided that the jacket at its contact-side end, e.g. has the normal wall thickness and to increase the contact surface an end portion facing radially outward (in particular by 90 °) is bent. For a sufficient good sealing effect can preferably be provided that the thickness of the annular contact surface is at least 0.3 mm. In addition to a sufficiently good sealing effect can be realized by increasing the contact surface and an increase in the strength of the achieved by soldering mechanical connection between the circuit board and the jacket.

Die erfindungsgemäße Art zur Abdichtung der Verbindung zwischen einer Leiterplatte und einem rohrförmigen Mantel kann insbesondere dann vorteilhaft eingesetzt werden, wenn der Mantel (mindestens) einen Innenleiter umgibt. Dies kann insbesondere gelten, wenn der oder die Innenleiter zur Übertragung von Hochfrequenzsignalen vorgesehen sind und daher besondere Anforderungen, insbesondere hinsichtlich des Korrosionsschutzes, an die Kontaktstellen zwischen den Innenleiter und den dazugehörigen Kontaktbereichen der Leiterplatte gestellt werden. Dabei kann der Mantel insbesondere elektrisch leitfähig und weiterhin bevorzugt als Leiter ausgebildet sein. Der Mantel kann somit als Schirmung und insbesondere als Außenleiter für die Innenleiter dienen.The inventive type for sealing the connection between a printed circuit board and a tubular jacket can be used advantageously in particular when the jacket (at least) surrounds an inner conductor. This may apply in particular if the one or more Inner conductor for the transmission of high-frequency signals are provided and therefore special requirements, in particular with regard to the corrosion protection, are made to the contact points between the inner conductor and the associated contact areas of the circuit board. In this case, the sheath may in particular be electrically conductive and furthermore preferably designed as a conductor. The jacket can thus serve as a shield and in particular as an outer conductor for the inner conductor.

Der Mantel kann vorzugsweise vollständig aus einem geeigneten Metall ausgebildet sein. Dadurch kann dieser ohne weiteres die vorzugsweise vorgesehene elektrisch Leitfähigkeit aufweisen und zudem auch problemlos verlötbar sein.The jacket may preferably be formed entirely from a suitable metal. As a result, it can easily have the preferably provided electrical conductivity and, moreover, can also be soldered without difficulty.

Beispielsweise kann der Mantel zumindest teilweise aus Kunststoff ausgebildet sein. Die Lötfähigkeit und gegebenenfalls die Leitfähigkeit kann dann beispielsweise mittels einer metallischen (Teil-)Beschichtung erzielt werden.For example, the jacket may be at least partially made of plastic. The solderability and optionally the conductivity can then be achieved, for example, by means of a metallic (partial) coating.

Die Erfindung wird nachfolgend anhand eines in den Zeichnungen dargestellten Ausführungsbeispiels näher erläutert. In den Zeichnungen zeigt:

Fig. 1:
ein erfindungsgemäßes System in einer ersten perspektivischen Ansicht;
Fig. 2:
das System in einer zweiten perspektivischen Ansicht; und
Fig. 3:
das System in einem perspektivischen Längsschnitt.
The invention will be explained in more detail with reference to an embodiment shown in the drawings. In the drawings shows:
Fig. 1:
a system according to the invention in a first perspective view;
Fig. 2:
the system in a second perspective view; and
3:
the system in a perspective longitudinal section.

Das in den Fig. 1 bis 3 dargestellte erfindungsgemäße System umfasst eine Leiterplatte 1 und eine mit der Leiterplatte 1 verbundene, geschirmte Mehrfachleitung. Die Mehrfachleitung umfasst einen (elektrisch leitfähigen) rohrförmigen Außenleiter 2 mit kreisringförmiger Querschnittsfläche. Innerhalb des Außenleiters 2 sind mehrere, konkret vier (elektrisch leitfähige) Innenleiter 3 in quadratischer Anordnung positioniert. Die Innenleiter 3 sind dabei jeweils in einer Aufnahmeöffnung eines Isolationselements 4 gehalten. Dadurch werden die Innenleiter 3 sowohl innerhalb des Außenleiters 2 lagefixiert als auch elektrisch von dem Außenleiter 2 und den jeweils anderen Innenleitern 3 isoliert.That in the Fig. 1 to 3 illustrated inventive system comprises a printed circuit board 1 and connected to the circuit board 1, a shielded multiple line. The multiple line comprises an (electrically conductive) tubular outer conductor 2 with an annular cross-sectional area. Within the outer conductor 2, a plurality of, specifically four (electrically conductive) inner conductor 3 are positioned in a square arrangement. The inner conductors 3 are each held in a receiving opening of an insulating element 4. As a result, the inner conductors 3 are fixed in position both within the outer conductor 2 and also electrically isolated from the outer conductor 2 and the respective other inner conductors 3.

Die Innenleiter 3 ragen mit ihren kontaktseitigen Endabschnitten durch Durchgangsöffnungen der Leiterplatte 1 und kontaktieren auf der der Mehrfachleitung beabstandeten Seite mit jeweils zugeordneten Kontaktbereichen von Leiterbahnen der Leiterplatte 1. Dabei kann auch vorgesehen sein, die Innenleiter 3 mit den Kontaktbereichen zu verlöten.The inner conductors 3 protrude with their contact-side end portions through through holes of the printed circuit board 1 and contact on the multi-line spaced side with respectively associated contact areas of printed conductors of the printed circuit board 1. It can also be provided to solder the inner conductor 3 to the contact areas.

Der Außenleiter 2 kontaktiert einen hierfür vorgesehenen Kontaktbereich der Leiterplatte 1 stirnseitig mit einer flächigen, geschlossen kreisringförmigen Kontaktfläche. Die mechanische Verbindung zwischen dem Außenleiter 2 und dem dazugehörigen Kontaktbereich der Leiterplatte 1 wird durch Verlöten erreicht, wozu in bekannter Weise aufgeschmolzenes Lot in den zwischen der Kontaktfläche des Außenleiters 2 und dem Kontaktbereich der Leiterplatte 1 ausgebildeten Kontaktspalt eingebracht wird.The outer conductor 2 contacts a contact region of the printed circuit board 1 provided for this purpose with a flat, closed annular contact surface. The mechanical connection between the outer conductor 2 and the associated contact region of the printed circuit board 1 is achieved by soldering, for which, in a known manner, molten solder is introduced into the contact gap formed between the contact surface of the outer conductor 2 and the contact region of the printed circuit board 1.

Die Lötverbindung dient gleichzeitig als Abdichtung, um ein Eindringen von Feuchtigkeit in den von dem Außenleiter 2 ausgebildeten Hohlraum zu vermeiden. Um eine ausreichende Dichtwirkung zu erreichen ist vorgesehen, das Verlöten vollumfänglich entlang der geschlossen kreisringförmigen Kontaktfläche vorzunehmen. Zudem ist die Wandstärke im Bereich der Kontaktfläche größer gewählt, als die Normalwandstärke des Außenleiters 2. Hierzu ist der kontaktseitige Endabschnitt des Außenleiters 2 außenseitig mit einem umlaufenden Absatz 5 versehen, durch den eine Durchmesservergrößerung mit damit einhergehender Vergrößerung der Querschnittsfläche erzielt wird.The solder joint serves as a seal to prevent ingress of moisture into the space formed by the outer conductor 2 cavity. In order to achieve a sufficient sealing effect is provided to carry out the soldering fully along the closed annular contact surface. In addition, the wall thickness in the area of the contact surface is chosen to be greater than the normal wall thickness of the outer conductor 2. For this purpose, the contact-side end portion of the outer conductor 2 is provided on the outside with a peripheral shoulder 5, by which an increase in diameter is achieved with concomitant enlargement of the cross-sectional area.

Claims (4)

  1. System consisting of a printed circuit board (1) and a tubular casing connected to the printed circuit board, characterised in that the casing makes contact with the printed circuit board (1) with a flat, closed annular contact surface and the printed circuit board (1) is soldered together with the casing along the contact surface, around its entire periphery, forming a soldered connection, said soldered connection forming a seal preventing moisture from penetrating into the cavity formed by the outer conductor.
  2. System according to claim 1, characterised in that the casing is designed as a conductor which is connected to the printed circuit board in an electrically conductive manner.
  3. System according to claim 1 or 2, characterised in that the wall thickness of the casing is greater in the region of the contact surface than in a section located at a distance from the contact surface.
  4. System according to one of the preceding claims, characterised in that the casing surrounds at least one inner conductor (3).
EP14742152.3A 2013-07-24 2014-07-15 System consisting of a printed circuit board and tubular casing Active EP3025397B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE202013006662U DE202013006662U1 (en) 2013-07-24 2013-07-24 System of circuit board and tubular jacket
PCT/EP2014/001934 WO2015010776A1 (en) 2013-07-24 2014-07-15 System consisting of a printed circuit board and tubular casing

Publications (2)

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EP3025397A1 EP3025397A1 (en) 2016-06-01
EP3025397B1 true EP3025397B1 (en) 2018-03-07

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US (1) US20160285179A1 (en)
EP (1) EP3025397B1 (en)
JP (1) JP2016525777A (en)
KR (1) KR20160034941A (en)
CN (1) CN105409063A (en)
CA (1) CA2917354A1 (en)
DE (1) DE202013006662U1 (en)
TW (1) TWM491977U (en)
WO (1) WO2015010776A1 (en)

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Publication number Priority date Publication date Assignee Title
DE102014118175A1 (en) * 2014-12-09 2016-06-09 Connaught Electronics Ltd. Camera for a motor vehicle with a connecting device, which is designed as a surface-mounted component, and motor vehicle
DE102017115914B3 (en) * 2017-07-14 2018-10-31 HARTING Electronics GmbH Printed circuit board connector with a screen element

Citations (2)

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Publication number Priority date Publication date Assignee Title
US4679723A (en) * 1985-02-19 1987-07-14 U.S. Philips Corporation Method of soldering the outer sleeve of a coaxial cable connector to a housing
DE102010016578B3 (en) * 2010-04-22 2011-10-27 Ept Gmbh Device for sealing printed circuit board plug connector opposite to printed circuit board surface area, has two gaskets arranged at side of frame and sealingly connected with printed circuit board surface area

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KR20160034941A (en) 2016-03-30
EP3025397A1 (en) 2016-06-01
CN105409063A (en) 2016-03-16
CA2917354A1 (en) 2015-01-29
TWM491977U (en) 2014-12-11
US20160285179A1 (en) 2016-09-29
JP2016525777A (en) 2016-08-25
WO2015010776A1 (en) 2015-01-29
DE202013006662U1 (en) 2013-08-08

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