EP3019535A1 - Reaction resin composition and use thereof - Google Patents
Reaction resin composition and use thereofInfo
- Publication number
- EP3019535A1 EP3019535A1 EP14736840.1A EP14736840A EP3019535A1 EP 3019535 A1 EP3019535 A1 EP 3019535A1 EP 14736840 A EP14736840 A EP 14736840A EP 3019535 A1 EP3019535 A1 EP 3019535A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- resin composition
- reaction
- nitrogen
- composition according
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000006243 chemical reaction Methods 0.000 title claims abstract description 60
- 239000011342 resin composition Substances 0.000 title claims abstract description 42
- 229920005989 resin Polymers 0.000 claims abstract description 69
- 239000011347 resin Substances 0.000 claims abstract description 69
- 150000001875 compounds Chemical class 0.000 claims abstract description 44
- 239000003446 ligand Substances 0.000 claims abstract description 40
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical class [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims abstract description 36
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims abstract description 31
- 239000003999 initiator Substances 0.000 claims abstract description 20
- 230000002401 inhibitory effect Effects 0.000 claims abstract description 8
- 239000000203 mixture Substances 0.000 claims description 39
- -1 Cu(II) carboxylates Chemical class 0.000 claims description 36
- 239000010949 copper Substances 0.000 claims description 15
- 239000003085 diluting agent Substances 0.000 claims description 14
- 239000003112 inhibitor Substances 0.000 claims description 14
- 239000000945 filler Substances 0.000 claims description 12
- 229920001567 vinyl ester resin Polymers 0.000 claims description 12
- 239000000654 additive Substances 0.000 claims description 11
- 229910052757 nitrogen Inorganic materials 0.000 claims description 11
- 125000004433 nitrogen atom Chemical group N* 0.000 claims description 10
- 229920006337 unsaturated polyester resin Polymers 0.000 claims description 9
- 229910052799 carbon Inorganic materials 0.000 claims description 6
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 5
- 230000001590 oxidative effect Effects 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 230000000269 nucleophilic effect Effects 0.000 claims description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 4
- 229910052794 bromium Inorganic materials 0.000 claims description 2
- 229910052801 chlorine Inorganic materials 0.000 claims description 2
- 229910052740 iodine Inorganic materials 0.000 claims description 2
- 150000003510 tertiary aliphatic amines Chemical class 0.000 claims description 2
- 230000000996 additive effect Effects 0.000 claims 2
- 239000003960 organic solvent Substances 0.000 claims 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims 1
- 239000003638 chemical reducing agent Substances 0.000 abstract description 5
- 238000010276 construction Methods 0.000 abstract description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M acrylate group Chemical group C(C=C)(=O)[O-] NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 35
- 238000006116 polymerization reaction Methods 0.000 description 25
- 238000002156 mixing Methods 0.000 description 18
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 15
- 238000010560 atom transfer radical polymerization reaction Methods 0.000 description 13
- 239000004848 polyfunctional curative Substances 0.000 description 13
- 101710141544 Allatotropin-related peptide Proteins 0.000 description 12
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 11
- 150000001412 amines Chemical class 0.000 description 10
- 239000004570 mortar (masonry) Substances 0.000 description 10
- 150000003254 radicals Chemical class 0.000 description 10
- 150000002978 peroxides Chemical class 0.000 description 9
- 229920000642 polymer Polymers 0.000 description 9
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 8
- UKODFQOELJFMII-UHFFFAOYSA-N pentamethyldiethylenetriamine Chemical compound CN(C)CCN(C)CCN(C)C UKODFQOELJFMII-UHFFFAOYSA-N 0.000 description 8
- 239000002904 solvent Substances 0.000 description 8
- 229940106691 bisphenol a Drugs 0.000 description 7
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 7
- 239000000047 product Substances 0.000 description 7
- 238000003860 storage Methods 0.000 description 7
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 7
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 6
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 6
- 125000003118 aryl group Chemical group 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 230000009257 reactivity Effects 0.000 description 6
- 150000003839 salts Chemical class 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 239000001530 fumaric acid Substances 0.000 description 5
- 150000002440 hydroxy compounds Chemical class 0.000 description 5
- 238000010526 radical polymerization reaction Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- ROFVEXUMMXZLPA-UHFFFAOYSA-N Bipyridyl Chemical compound N1=CC=CC=C1C1=CC=CC=N1 ROFVEXUMMXZLPA-UHFFFAOYSA-N 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N Bisphenol F Natural products C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- HECLRDQVFMWTQS-UHFFFAOYSA-N Dicyclopentadiene Chemical compound C1C2C3CC=CC3C1C=C2 HECLRDQVFMWTQS-UHFFFAOYSA-N 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- LNWBFIVSTXCJJG-UHFFFAOYSA-N [diisocyanato(phenyl)methyl]benzene Chemical compound C=1C=CC=CC=1C(N=C=O)(N=C=O)C1=CC=CC=C1 LNWBFIVSTXCJJG-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 150000001298 alcohols Chemical class 0.000 description 4
- 239000004567 concrete Substances 0.000 description 4
- 239000000470 constituent Substances 0.000 description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 4
- 230000000977 initiatory effect Effects 0.000 description 4
- 229910052500 inorganic mineral Inorganic materials 0.000 description 4
- 239000012948 isocyanate Substances 0.000 description 4
- 150000002513 isocyanates Chemical class 0.000 description 4
- ZCSHNCUQKCANBX-UHFFFAOYSA-N lithium diisopropylamide Chemical compound [Li+].CC(C)[N-]C(C)C ZCSHNCUQKCANBX-UHFFFAOYSA-N 0.000 description 4
- 239000011707 mineral Substances 0.000 description 4
- 235000010755 mineral Nutrition 0.000 description 4
- 125000005474 octanoate group Chemical group 0.000 description 4
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 4
- 229920000570 polyether Polymers 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 3
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 3
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 3
- 150000008064 anhydrides Chemical class 0.000 description 3
- 235000019400 benzoyl peroxide Nutrition 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- ZSWFCLXCOIISFI-UHFFFAOYSA-N cyclopentadiene Chemical compound C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 150000002334 glycols Chemical class 0.000 description 3
- LVHBHZANLOWSRM-UHFFFAOYSA-N itaconic acid Chemical class OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 3
- 238000002372 labelling Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 3
- 229940117969 neopentyl glycol Drugs 0.000 description 3
- 150000002924 oxiranes Chemical class 0.000 description 3
- 239000004014 plasticizer Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 235000012239 silicon dioxide Nutrition 0.000 description 3
- 239000003381 stabilizer Substances 0.000 description 3
- 150000003623 transition metal compounds Chemical class 0.000 description 3
- 229920006305 unsaturated polyester Polymers 0.000 description 3
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 2
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- VSTXCZGEEVFJES-UHFFFAOYSA-N 1-cycloundecyl-1,5-diazacycloundec-5-ene Chemical compound C1CCCCCC(CCCC1)N1CCCCCC=NCCC1 VSTXCZGEEVFJES-UHFFFAOYSA-N 0.000 description 2
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical class C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- ODINCKMPIJJUCX-UHFFFAOYSA-N Calcium oxide Chemical compound [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N Furan Chemical compound C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 2
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- GKXVJHDEWHKBFH-UHFFFAOYSA-N [2-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC=C1CN GKXVJHDEWHKBFH-UHFFFAOYSA-N 0.000 description 2
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 150000001721 carbon Chemical group 0.000 description 2
- 150000001879 copper Chemical class 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 235000013312 flour Nutrition 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 229910021485 fumed silica Inorganic materials 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 238000011065 in-situ storage Methods 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- JCIVHYBIFRUGKO-UHFFFAOYSA-N lithium;2,2,6,6-tetramethylpiperidine Chemical compound [Li].CC1(C)CCCC(C)(C)N1 JCIVHYBIFRUGKO-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 239000011572 manganese Substances 0.000 description 2
- 125000005641 methacryl group Chemical group 0.000 description 2
- VMGSQCIDWAUGLQ-UHFFFAOYSA-N n',n'-bis[2-(dimethylamino)ethyl]-n,n-dimethylethane-1,2-diamine Chemical compound CN(C)CCN(CCN(C)C)CCN(C)C VMGSQCIDWAUGLQ-UHFFFAOYSA-N 0.000 description 2
- DWFKOMDBEKIATP-UHFFFAOYSA-N n'-[2-[2-(dimethylamino)ethyl-methylamino]ethyl]-n,n,n'-trimethylethane-1,2-diamine Chemical compound CN(C)CCN(C)CCN(C)CCN(C)C DWFKOMDBEKIATP-UHFFFAOYSA-N 0.000 description 2
- 125000005609 naphthenate group Chemical group 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 150000002923 oximes Chemical class 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- 150000002976 peresters Chemical class 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- YPFDHNVEDLHUCE-UHFFFAOYSA-N propane-1,3-diol Chemical compound OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 150000005839 radical cations Chemical class 0.000 description 2
- 239000002516 radical scavenger Substances 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- DJKGDNKYTKCJKD-BPOCMEKLSA-N (1s,4r,5s,6r)-1,2,3,4,7,7-hexachlorobicyclo[2.2.1]hept-2-ene-5,6-dicarboxylic acid Chemical compound ClC1=C(Cl)[C@]2(Cl)[C@H](C(=O)O)[C@H](C(O)=O)[C@@]1(Cl)C2(Cl)Cl DJKGDNKYTKCJKD-BPOCMEKLSA-N 0.000 description 1
- FZENGILVLUJGJX-NSCUHMNNSA-N (E)-acetaldehyde oxime Chemical compound C\C=N\O FZENGILVLUJGJX-NSCUHMNNSA-N 0.000 description 1
- FDFVVBKRHGRRFY-UHFFFAOYSA-N 1-hydroxy-2,2,5,5-tetramethylpyrrolidine Chemical compound CC1(C)CCC(C)(C)N1O FDFVVBKRHGRRFY-UHFFFAOYSA-N 0.000 description 1
- GVQKWFQBWZOJHV-UHFFFAOYSA-N 1-hydroxy-2,2,6,6-tetramethylpiperidin-1-ium-4-carboxylate Chemical compound CC1(C)CC(C(O)=O)CC(C)(C)N1O GVQKWFQBWZOJHV-UHFFFAOYSA-N 0.000 description 1
- CSGAUKGQUCHWDP-UHFFFAOYSA-N 1-hydroxy-2,2,6,6-tetramethylpiperidin-4-ol Chemical compound CC1(C)CC(O)CC(C)(C)N1O CSGAUKGQUCHWDP-UHFFFAOYSA-N 0.000 description 1
- KMEUSKGEUADGET-UHFFFAOYSA-N 1-hydroxy-2,2,6,6-tetramethylpiperidin-4-one Chemical compound CC1(C)CC(=O)CC(C)(C)N1O KMEUSKGEUADGET-UHFFFAOYSA-N 0.000 description 1
- VUZNLSBZRVZGIK-UHFFFAOYSA-N 2,2,6,6-Tetramethyl-1-piperidinol Chemical compound CC1(C)CCCC(C)(C)N1O VUZNLSBZRVZGIK-UHFFFAOYSA-N 0.000 description 1
- UWKQJZCTQGMHKD-UHFFFAOYSA-N 2,6-di-tert-butylpyridine Chemical compound CC(C)(C)C1=CC=CC(C(C)(C)C)=N1 UWKQJZCTQGMHKD-UHFFFAOYSA-N 0.000 description 1
- WFSMVVDJSNMRAR-UHFFFAOYSA-N 2-[2-(2-ethoxyethoxy)ethoxy]ethanol Chemical compound CCOCCOCCOCCO WFSMVVDJSNMRAR-UHFFFAOYSA-N 0.000 description 1
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- DXIJHCSGLOHNES-UHFFFAOYSA-N 3,3-dimethylbut-1-enylbenzene Chemical compound CC(C)(C)C=CC1=CC=CC=C1 DXIJHCSGLOHNES-UHFFFAOYSA-N 0.000 description 1
- GEPIUTWNBHBHIO-UHFFFAOYSA-N 3-carboxy-PROXYL Chemical compound CC1(C)CC(C(O)=O)C(C)(C)N1[O] GEPIUTWNBHBHIO-UHFFFAOYSA-N 0.000 description 1
- XOJWAAUYNWGQAU-UHFFFAOYSA-N 4-(2-methylprop-2-enoyloxy)butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCOC(=O)C(C)=C XOJWAAUYNWGQAU-UHFFFAOYSA-N 0.000 description 1
- CYQGCJQJIOARKD-UHFFFAOYSA-N 4-carboxy-TEMPO Chemical compound CC1(C)CC(C(O)=O)CC(C)(C)N1[O] CYQGCJQJIOARKD-UHFFFAOYSA-N 0.000 description 1
- IZSHZLKNFQAAKX-UHFFFAOYSA-N 5-cyclopenta-2,4-dien-1-ylcyclopenta-1,3-diene Chemical group C1=CC=CC1C1C=CC=C1 IZSHZLKNFQAAKX-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical class OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 description 1
- GAWIXWVDTYZWAW-UHFFFAOYSA-N C[CH]O Chemical group C[CH]O GAWIXWVDTYZWAW-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 229910021589 Copper(I) bromide Inorganic materials 0.000 description 1
- 229910021591 Copper(I) chloride Inorganic materials 0.000 description 1
- 238000005698 Diels-Alder reaction Methods 0.000 description 1
- 229920001174 Diethylhydroxylamine Polymers 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- JGFZNNIVVJXRND-UHFFFAOYSA-N N,N-diisopropylethylamine Substances CCN(C(C)C)C(C)C JGFZNNIVVJXRND-UHFFFAOYSA-N 0.000 description 1
- KYIMHWNKQXQBDG-UHFFFAOYSA-N N=C=O.N=C=O.CCCCCC Chemical compound N=C=O.N=C=O.CCCCCC KYIMHWNKQXQBDG-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000011398 Portland cement Substances 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 239000006004 Quartz sand Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- AWMVMTVKBNGEAK-UHFFFAOYSA-N Styrene oxide Chemical compound C1OC1C1=CC=CC=C1 AWMVMTVKBNGEAK-UHFFFAOYSA-N 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- DGEZNRSVGBDHLK-UHFFFAOYSA-N [1,10]phenanthroline Chemical compound C1=CN=C2C3=NC=CC=C3C=CC2=C1 DGEZNRSVGBDHLK-UHFFFAOYSA-N 0.000 description 1
- SYKNUAWMBRIEKB-UHFFFAOYSA-N [Cl].[Br] Chemical compound [Cl].[Br] SYKNUAWMBRIEKB-UHFFFAOYSA-N 0.000 description 1
- FYJKEHKQUPSJDH-UHFFFAOYSA-N [dimethyl-(trimethylsilylamino)silyl]methane;potassium Chemical compound [K].C[Si](C)(C)N[Si](C)(C)C FYJKEHKQUPSJDH-UHFFFAOYSA-N 0.000 description 1
- PXAJQJMDEXJWFB-UHFFFAOYSA-N acetone oxime Chemical compound CC(C)=NO PXAJQJMDEXJWFB-UHFFFAOYSA-N 0.000 description 1
- 150000001253 acrylic acids Chemical group 0.000 description 1
- 125000002015 acyclic group Chemical group 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 150000007824 aliphatic compounds Chemical class 0.000 description 1
- 150000004996 alkyl benzenes Chemical class 0.000 description 1
- 229920013820 alkyl cellulose Polymers 0.000 description 1
- 125000000746 allylic group Chemical group 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- MKSISPKJEMTIGI-LWTKGLMZSA-K aluminum (Z)-oxido-oxidoimino-phenylazanium Chemical compound [Al+3].[O-]\N=[N+](/[O-])c1ccccc1.[O-]\N=[N+](/[O-])c1ccccc1.[O-]\N=[N+](/[O-])c1ccccc1 MKSISPKJEMTIGI-LWTKGLMZSA-K 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 1
- 239000010428 baryte Substances 0.000 description 1
- 229910052601 baryte Inorganic materials 0.000 description 1
- 235000012216 bentonite Nutrition 0.000 description 1
- 125000001584 benzyloxycarbonyl group Chemical group C(=O)(OCC1=CC=CC=C1)* 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- 235000012255 calcium oxide Nutrition 0.000 description 1
- 239000011455 calcium-silicate brick Substances 0.000 description 1
- 239000002775 capsule Substances 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- 150000007942 carboxylates Chemical class 0.000 description 1
- 239000004359 castor oil Chemical class 0.000 description 1
- 235000019438 castor oil Nutrition 0.000 description 1
- 239000003518 caustics Substances 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- DJKGDNKYTKCJKD-UHFFFAOYSA-N chlorendic acid Chemical compound ClC1=C(Cl)C2(Cl)C(C(=O)O)C(C(O)=O)C1(Cl)C2(Cl)Cl DJKGDNKYTKCJKD-UHFFFAOYSA-N 0.000 description 1
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 1
- 229940018557 citraconic acid Drugs 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000008199 coating composition Substances 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 239000010431 corundum Substances 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-M crotonate Chemical compound C\C=C\C([O-])=O LDHQCZJRKDOVOX-NSCUHMNNSA-M 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 150000004292 cyclic ethers Chemical class 0.000 description 1
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 1
- 125000000058 cyclopentadienyl group Chemical group C1(=CC=CC1)* 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- FVCOIAYSJZGECG-UHFFFAOYSA-N diethylhydroxylamine Chemical compound CCN(O)CC FVCOIAYSJZGECG-UHFFFAOYSA-N 0.000 description 1
- JGUQDUKBUKFFRO-CIIODKQPSA-N dimethylglyoxime Chemical compound O/N=C(/C)\C(\C)=N\O JGUQDUKBUKFFRO-CIIODKQPSA-N 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000010433 feldspar Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Chemical class CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- 239000010438 granite Substances 0.000 description 1
- 239000010440 gypsum Substances 0.000 description 1
- 229910052602 gypsum Inorganic materials 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 230000026030 halogenation Effects 0.000 description 1
- 238000005658 halogenation reaction Methods 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 231100000206 health hazard Toxicity 0.000 description 1
- TZMQHOJDDMFGQX-UHFFFAOYSA-N hexane-1,1,1-triol Chemical compound CCCCCC(O)(O)O TZMQHOJDDMFGQX-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 238000005984 hydrogenation reaction Methods 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000543 intermediate Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 150000002697 manganese compounds Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- 229920000609 methyl cellulose Chemical class 0.000 description 1
- 235000010981 methylcellulose Nutrition 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- GKTNLYAAZKKMTQ-UHFFFAOYSA-N n-[bis(dimethylamino)phosphinimyl]-n-methylmethanamine Chemical compound CN(C)P(=N)(N(C)C)N(C)C GKTNLYAAZKKMTQ-UHFFFAOYSA-N 0.000 description 1
- WHIVNJATOVLWBW-UHFFFAOYSA-N n-butan-2-ylidenehydroxylamine Chemical compound CCC(C)=NO WHIVNJATOVLWBW-UHFFFAOYSA-N 0.000 description 1
- OLAPPGSPBNVTRF-UHFFFAOYSA-N naphthalene-1,4,5,8-tetracarboxylic acid Chemical compound C1=CC(C(O)=O)=C2C(C(=O)O)=CC=C(C(O)=O)C2=C1C(O)=O OLAPPGSPBNVTRF-UHFFFAOYSA-N 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 235000011837 pasties Nutrition 0.000 description 1
- 125000000286 phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- UYWQUFXKFGHYNT-UHFFFAOYSA-N phenylmethyl ester of formic acid Natural products O=COCC1=CC=CC=C1 UYWQUFXKFGHYNT-UHFFFAOYSA-N 0.000 description 1
- 125000005498 phthalate group Chemical class 0.000 description 1
- 150000003022 phthalic acids Chemical class 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229960005235 piperonyl butoxide Drugs 0.000 description 1
- 239000002986 polymer concrete Substances 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- IUBQJLUDMLPAGT-UHFFFAOYSA-N potassium bis(trimethylsilyl)amide Chemical compound C[Si](C)(C)N([K])[Si](C)(C)C IUBQJLUDMLPAGT-UHFFFAOYSA-N 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- ULWHHBHJGPPBCO-UHFFFAOYSA-N propane-1,1-diol Chemical compound CCC(O)O ULWHHBHJGPPBCO-UHFFFAOYSA-N 0.000 description 1
- 238000006479 redox reaction Methods 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 238000000518 rheometry Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000007127 saponification reaction Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229930195734 saturated hydrocarbon Natural products 0.000 description 1
- 150000003330 sebacic acids Chemical class 0.000 description 1
- 230000001235 sensitizing effect Effects 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- WRIKHQLVHPKCJU-UHFFFAOYSA-N sodium bis(trimethylsilyl)amide Chemical compound C[Si](C)(C)N([Na])[Si](C)(C)C WRIKHQLVHPKCJU-UHFFFAOYSA-N 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- 238000010186 staining Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 125000001302 tertiary amino group Chemical group 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- ITMCEJHCFYSIIV-UHFFFAOYSA-M triflate Chemical compound [O-]S(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-M 0.000 description 1
- 235000021081 unsaturated fats Nutrition 0.000 description 1
- 229930195735 unsaturated hydrocarbon Natural products 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 150000003738 xylenes Chemical class 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F122/00—Homopolymers of compounds having one or more unsaturated aliphatic radicals each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides or nitriles thereof
- C08F122/10—Esters
- C08F122/1006—Esters of polyhydric alcohols or polyhydric phenols, e.g. ethylene glycol dimethacrylate
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B40/00—Processes, in general, for influencing or modifying the properties of mortars, concrete or artificial stone compositions, e.g. their setting or hardening ability
- C04B40/06—Inhibiting the setting, e.g. mortars of the deferred action type containing water in breakable containers ; Inhibiting the action of active ingredients
- C04B40/0666—Chemical plugs based on hydraulic hardening materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F4/00—Polymerisation catalysts
- C08F4/40—Redox systems
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
Definitions
- the present invention relates to a radically curable reaction resin composition
- a radically curable reaction resin composition comprising a resin component and an initiator system comprising an initiator and a catalyst system capable of in-situ forming a transition metal complex as a catalyst.
- reactive resin compositions based on unsaturated polyester resins, vinyl ester resins or epoxy resins as adhesives and adhesives has long been known. These are two-component systems, one component containing the resin mixture and the other containing the curing agent. Other common ingredients such as fillers, accelerators, stabilizers, solvents including reactive solvents (reactive diluents) may be included in one and / or the other component. By mixing the two components, the reaction is then initiated to form a cured product.
- the mortar compounds which are to be used in chemical fastening technology are complex systems to which special requirements are placed, such as, for example, the viscosity of the mortar composition, hardening and curing in a relatively broad temperature range, usually -10 ° C. to + 40 ° C. , the inherent strength of the hardened mass, adhesion to different substrates and environmental conditions, load values, creep resistance and the like.
- Organic, curable two-component reaction resin compositions based on curable epoxy resins and amine curing agents are used as adhesives, filler fillers for crack filling and, inter alia, for securing construction elements such as anchor rods, concrete iron (rebars), screws and the like in boreholes.
- Such mortar compositions are known, for example, from EP 1 475 412 A2, DE 198 32 669 A1 and DE 10 2004 008 464 A1.
- a disadvantage of the known epoxy-based mortar compositions lies in the use of often considerable amounts of caustic amines as hardeners, such as xylylenediamine (XDA), in particular m-xylylenediamine (mXDA; 1,3-benzenedimethanamine), and / or on aromatic alcohol compounds, such as free ones Phenols, eg Bisphenol A, which may pose a health hazard to the user.
- XDA xylylenediamine
- mXDA m-xylylenediamine
- 1,3-benzenedimethanamine 1,3-benzenedimethanamine
- Phenols eg Bisphenol A
- Radically curable systems in particular systems curable at room temperature, require so-called free-radical initiators, also called initiators, so that the radical polymerization can be initiated.
- free-radical initiators also called initiators
- free-radical initiators also called initiators
- the hardener composition described in the publication EP 1586569 A1 comprising a perester as a hardener and a metal compound as an accelerator enforced.
- These hardener compositions allow rapid and fairly complete curing even at very low temperatures down to -30 ° C.
- these systems are robust in terms of mixing ratios of resin and hardener.
- these known hardener compositions are disadvantageous in that they must contain significant amounts of peroxide, which is problematic because peroxide-containing products must be labeled as sensitizing in some countries from a concentration of 1%, such as dibenzoyl peroxide in some countries.
- a peroxide-free hardener composition for free-radically polymerizable compounds which contains a 1, 3-dicarbonyl compound as a hardener and a manganese compound as an accelerator and their use for reaction resin compositions based on free-radically curable compounds.
- This system tends However, to undercut certain conditions, not enough, which can lead to a reduced performance of the cured material, especially for use as an anchor mass, so that although an application for dowel masses in general is possible, but not for those applications where reliably right high load values are required.
- ATRP process atom transfer radical polymerization
- ATRP process atom transfer radical polymerization
- a transition metal compound is reacted with a compound having a transferable atomic group.
- the transferable atomic group is transferred to the transition metal compound, whereby the metal is oxidized.
- a radical is formed which adds to ethylenically unsaturated groups.
- the ATRP has long been of scientific interest and is essentially used to specifically control the properties of polymers and adapt them to the desired applications. These include control of particle size, structure, length, weight and weight distribution of polymers. Accordingly, the structure of the polymer, the molecular weight and the molecular weight distribution can be controlled. As a result, the ATRP is increasingly gaining economic interest.
- US Pat. Nos. 5,807,937 and 5,763,548 describe (co) polymers prepared by ATRP and useful for a variety of applications, such as dispersants and surfactants.
- the ATRP process has not been used to carry out on-site polymerization, such as on-site, under the conditions prevailing there, as is the case for structural use, e.g. Mortar, adhesive and dowel masses is required.
- the requirements which are placed on the polymerizable compositions in these applications namely initiation of the polymerization in the temperature range between -10 ° C and + 60 ° C, inorganically filled compositions, adjustment of a gel time with subsequent rapid and complete polymerization of the resin component, the packaging as one-component or multi-component systems and the other known requirements for the hardened mass, are so far not considered in the extensive literature on ATRP.
- a disadvantage of an initiator system analogous to the ATRP is that this system is relatively complex, since several compounds are required to form the actually reactive species, which react with each other and may be adversely affected by others in the composition in which the initiator system is to be used , This makes the formulation of a system, especially a shelf-stable system, very difficult.
- the invention is therefore based on the object to provide a reaction resin composition for mortar systems of the type described above, which mentioned Disadvantages of the known systems does not have, which can be assembled as a two-component system, which is in particular storage-stable and cold-curing.
- the inventor has surprisingly found that the object can be achieved by using simplified ATRP-like initiator systems as radical initiator and for the above-described reaction resin compositions based on free-radically polymerizable compounds.
- Cold-curing means that the polymerization, also referred to herein as “curing”, of the two curable compounds at room temperature without additional energy input, such as by heat, by the curing agents contained in the reaction resin compositions, optionally in the presence of accelerators are started can and also show sufficient for the intended applications curing; - "reaction-inhibiting separated, that a separation between compounds or components is achieved such that a reaction with each other can take place only when the compounds or components are brought about by mixing with each other; a reaction-inhibiting separation is also conceivable by (micro) encapsulation of one or more compounds or components;
- Polymerization inhibitor also referred to herein as an “inhibitor” a compound capable of inhibiting the polymerization reaction (curing) and serving to avoid the polymerization reaction and thus unwanted premature polymerization of the radically polymerizable compound during storage (often as a stabilizer and serving to retard the start of the polymerization reaction immediately after the addition of the curing agent; to achieve the purpose of storage stability, the inhibitor is usually used in such small amounts that the gel time is not affected; in order to influence the time of the start of the polymerization reaction, the inhibitor is usually used in amounts such that the gel time is affected;
- the time of the curing phase of the resin corresponds to the gel time, in which the temperature of the resin increases from + 25 ° C to + 35 ° C; this corresponds approximately to the period in which the fluidity or viscosity of the resin is still in such a range that the reaction resin or the reaction resin composition can still be easily processed or processed;
- Tewo-component system means a system comprising two separate components, generally a resin component and a hardener component that curing of the resin component takes place only after the mixing of the two components;
- Multicomponent system means a system comprising three or more components stored separately, so that curing of the resin component takes place only after mixing of all the components;
- radically polymerizable compounds can be polymerized with a combination of certain compounds, such as are used in part for the initiation of ATRP.
- methacrylates in the presence of copper (II) salts and amine ligands with ⁇ - ⁇ atoms spontaneously polymerize at room temperature and that this polymerization can be inhibited by radical scavengers.
- the inventor has succeeded, without the need for the ATRP presence of an initiator and without the use of copper (L) salts, or reducing agents to in situ from copper (II) salts to produce copper (L) salts, at room temperature to initiate a radical polymerization.
- a first aspect of the invention is a reaction resin composition
- a reaction resin composition comprising a resin component containing a radically polymerizable compound and an initiator system comprising a cupric salt and a nitrogen-containing ligand, wherein the cupric salt and the nitrogen -containing ligands are reaction-inhibiting, separated from each other, characterized in that the oxidizing copper (II) cation has a redox potential greater than that of the nitrogen-containing ligand to generate a radical from the nitrogen-containing ligand. It is thus possible to provide a reaction resin composition which is cold-curing and which is packaged in particular as a two-component or multicomponent system and is storage-stable.
- compositions which are free of peroxides and critical amine compounds and thus no longer subject to labeling. Furthermore, the compositions no longer contain phlegmatizing agents which function as plasticizers in the cured mass.
- Another advantage of the invention is that the composition, when formulated as a two-component system, allows any ratio of the two components to one another, wherein the initiator system is homogeneously dissolved in the components, so that only a low concentration thereof is required , The composition also has the advantage that the initiator system has fewer constituents than the components of the initiator system usually required for the ATRP and therefore is simpler and in particular less susceptible to interference.
- the initiator system comprises a copper (II) salt and a nitrogen-containing ligand (also referred to herein as the amine ligand).
- a copper (II) salt and a nitrogen-containing ligand also referred to herein as the amine ligand.
- these are chosen so that under the present reaction conditions, i. basic environment by the nitrogen-containing ligands and optionally contained in the composition mineral aggregates, which often also lead to an alkaline environment, and reaction at ambient temperature, a redox reaction between the copper (II) salt and the nitrogen of the nitrogen-containing ligand takes place , as a result of which radical cations, more precisely A / radical cations, are formed.
- the copper (II) cation of the copper (II) salt must be able to participate in a one-electron redox process and should be able to reversibly increase its coordination number by one. Furthermore, it must be capable of oxidizing the nitrogen atom of the amine ligand to a nitrogen radical cation. Its redox potential must therefore be greater than that of the nitrogen atom of the amine ligand. This depends, on the one hand, on whether a solvent is used for the copper (II) salt and, on the other, on the nature of the solvent, i. which influence the solvent has on the redox potentials of the copper (II) cation and the nitrogen atom, if one is used. Furthermore, the solubility of the copper (II) salt in the reaction resin and / or the reactive diluents, if present, has an influence on the redox potential of the copper (II) cation.
- N-alkyl radical a proton in ⁇ -position is cleaved from the N-alkyl radical to form free-radical derived products therefrom, such as an N-alkyl radical.
- These radical secondary products can then trigger the polymerization and therefore act as the actual initiator.
- the ligand advantageously contributes to the solubility of the copper salt in the radically polymerizable compound to be used, as long as the copper salt itself is not yet sufficiently soluble, and is capable of adjusting the redox potential of the copper in terms of reactivity and halogen transfer.
- Suitable copper (II) salts are those which are soluble in the radically polymerizable compound used or a solvent optionally added to the resin mixture, such as a reactive diluent.
- Suitable nitrogen-containing ligands are amines which can be oxidized by copper (II) at room temperature and have readily abstractable hydrogen atoms on the ⁇ -carbon atom to the nitrogen, and have tertiary amino groups, such as tertiary aliphatic amines having hydrogen atoms on the ⁇ -carbon atom to the nitrogen atom , Preferred is a nitrogen-containing ligand containing two or more nitrogen atoms.
- suitable nitrogen-containing ligands having hydrogen atoms on the ⁇ -carbon atom to the nitrogen atom are e.g. Ethylenediaminotetraacetat (EDTA), N, N-dimethyl-N ', N'-bis (2-dimethylaminoethyl) ethylenediamine (Me6TREN), or N, N, N', N ", N" -pentamethyldiethylenetriamine (PMDETA) and its higher and lower homologs.
- EDTA Ethylenediaminotetraacetat
- Me6TREN N-dimethyl-N ', N'-bis (2-dimethylaminoethyl) ethylenediamine
- PMDETA e.g., N, N', N ", N" -pentamethyldiethylenetriamine
- the reaction resin composition has a significantly greater reactivity shows, ie hardens faster and hardens better when the nitrogen-containing ligand is used in excess.
- the reaction resin composition regardless of the amount used, shows a significantly greater reactivity when the ligand is a nitrogen-containing compound having primary amino groups.
- the nitrogen-containing ligand may be used either alone or as a mixture of two or more thereof.
- Suitable bases are known to those skilled in the field of organic synthesis.
- DIPEA 1,8-diazabicycloundec-7-ene
- LDA lithium diisopropylamide
- silicon-based amides such as sodium and Potassium hexamethyldisilazane (NaHMDS and KHMDS), lithium 2,2,6,6-tetramethylpiperidine (LiTMP), sodium and potassium ferf
- Suitable free-radically polymerizable compounds according to the invention are ethylenically unsaturated compounds, compounds having carbon-carbon triple bonds and thiol-Yn / En resins, as known to the person skilled in the art.
- ethylenically unsaturated compounds comprising styrene and derivatives thereof, (meth) acrylates, vinyl esters, unsaturated polyesters, vinyl ethers, allyl ethers, itaconates, dicyclopentadiene compounds and unsaturated fats, of which in particular unsaturated polyester resins and vinyl ester resins are suitable and
- unsaturated polyester resins and vinyl ester resins are suitable and
- vinyl ester resins are most preferred because of their hydrolytic resistance and excellent mechanical properties.
- Suitable unsaturated polyesters which can be used in the resin composition of the present invention are classified into the following categories as represented by M. Malik et al. in JMS - Rev. Macromol. Chem. Phys., C40 (2 and 3), p.139-165 (2000):
- ortho resins these are based on phthalic anhydride, maleic anhydride or fumaric acid and glycols, such as 1,2-propylene glycol, ethylene glycol, diethylene glycol,
- Triethylene glycol 1, 3-propylene glycol, dipropylene glycol, tripropylene glycol, neopentyl glycol or hydrogenated bisphenol-A;
- Iso resins These are prepared from isophthalic acid, maleic anhydride or fumaric acid and glycols. These resins may contain higher levels of reactive diluents than the ortho resins;
- bisphenol A fumarates these are based on ethoxylated bisphenol-A and fumaric acid;
- HET acid resins hexachloro-endo-methylene-tetrahydrophthalic acid resins: resins obtained from chlorine-bromine-containing anhydrides or phenols in the production of unsaturated polyester resins.
- DCPD resins can be distinguished as unsaturated polyester resins.
- the class of DCPD resins is obtained either by modification of one of the above resin types by Diels-Alder reaction with cyclopentadiene, or alternatively by a first reaction of a dicarboxylic acid, e.g. Maleic acid with dicyclopentadienyl and then by a second reaction, the usual preparation of an unsaturated polyester resin, the latter being referred to as a DCPD maleated resin.
- a dicarboxylic acid e.g. Maleic acid with dicyclopentadienyl
- the unsaturated polyester resin preferably has a molecular weight Mn in the range of 500 to 10,000 daltons, more preferably in the range of 500 to 5000, and even more preferably in the range of 750 to 4000 (according to ISO 13885-1).
- the unsaturated polyester resin has an acid value in the range of 0 to 80 mg KOH / g resin, preferably in the range of 5 to 70 mg KOH / g resin (according to ISO 21 14-2000). If a DCPD resin is used as unsaturated polyester resin used, the acid value is preferably 0 to 50 mg KOH / g resin.
- vinyl ester resins are oligomers, prepolymers or polymers having at least one (meth) acrylate end group, so-called (meth) acrylate-functionalized resins, including urethane (meth) acrylate resins and epoxy (meth) acrylates.
- Vinyl ester resins which have unsaturated groups only in the terminal position are obtained, for example, by reaction of epoxide oligomers or polymers (eg bisphenol A digylcidyl ether, epoxides of the phenol novolak type or epoxide oligomers based on tetrabromobisphenol A) with, for example (Meth) acrylic acid or (meth) acrylamide.
- Preferred vinyl ester resins are (meth) acrylate-functionalized resins and resins obtained by reacting an epoxy oligomer or polymer with methacrylic acid or methacrylamide, preferably with methacrylic acid. Examples of such compounds are known from the publications US 3 297 745 A, US 3 772 404 A, US 4 618 658 A, GB 2 217 722 A1, DE 37 44 390 A1 and DE 41 31 457 A1.
- vinyl ester resin Particularly suitable and preferred as the vinyl ester resin are (meth) acrylate-functionalized resins, e.g. by reaction of di- and / or higher-functional isocyanates with suitable acrylic compounds, optionally with the participation of hydroxy compounds which contain at least two hydroxyl groups, as described, for example, in DE 3940309 A1.
- isocyanates it is possible to use aliphatic (cyclic or linear) and / or aromatic di- or higher-functional isocyanates or prepolymers thereof.
- the use of such compounds serves to increase the wettability and thus the improvement of the adhesion properties.
- tolylene diisocyanate (TDI), diisocyanatodiphenylmethane (MDI) and polymeric diisocyanatodiphenylmethane (pMDl) to increase chain stiffening and hexane diisocyanate (HDI) and isophorone diisocyanate (IPDI), which have the flexibility can be named, among which polymeric diisocyanatodiphenylmethane (pMDl) is very particularly preferred
- Acrylic acids and acrylic acid substituted on the hydrocarbon radical such as methacrylic acid, hydroxyl-containing esters of acrylic or methacrylic acid with polyhydric alcohols, pentaerythritol tri (meth) acrylate, glycerol di (meth) acrylate, such as trimethylolpropane di (meth) acrylate,
- Neopentylglycol mono (meth) acrylate suitable.
- hydroxy compounds are suitable dihydric or higher alcohols, such as derivatives of ethylene or propylene oxide, such as ethanediol, di- or triethylene glycol, propanediol, dipropylene glycol, other diols, such as 1, 4-butanediol, 1, 6-hexanediol, Neopentylglycol, diethanolamine, further bisphenol A or F or their ethox / propoxylation and / or hydrogenation or halogenation products, higher alcohols such as glycerol, trimethylolpropane, hexanetriol and pentaerythritol, hydroxyl-containing polyethers, for example oligomers of aliphatic or aromatic oxiranes and / or higher cyclic ethers, such as ethylene oxide, propylene oxide, styrene oxide and furan, polyethers containing aromatic structural units in the main chain, such as those of bisphenol A or F
- hydroxy compounds having aromatic structural units for chain-stiffening the resin hydroxy compounds containing unsaturated structural units, such as fumaric acid, for increasing the crosslinking density
- hydroxy compounds containing unsaturated structural units such as fumaric acid
- branched or star-shaped hydroxy compounds in particular trihydric or higher alcohols and / or polyethers or polyesters, and the like Structural units containing, branched or star-shaped urethane (meth) acrylates to achieve lower viscosity of the resins or their solutions in reactive diluents and higher reactivity and crosslinking density.
- the vinyl ester resin preferably has a molecular weight Mn in the range of 500 to 3000 daltons, more preferably 500 to 1500 daltons (according to ISO 13885-1).
- the vinyl ester resin has an acid value in the range of 0 to 50 mg KOH / g resin, preferably in the range of 0 to 30 mg KOH / g resin (according to ISO 21 14
- the resin may contain other reactive groups that can be polymerized with a free-radical initiator, such as peroxides, for example, reactive groups derived from itaconic acid, citraconic acid and allylic groups, and the like.
- the reaction resin composition contains further low-viscosity, free-radically polymerizable compounds as reactive diluents for the radically polymerizable compound in order to adjust its viscosity if necessary.
- the resin mixture contains as reactive diluents a (meth) acrylic ester, more preferably (meth) acrylic esters are selected from the group consisting of hydroxypropyl (meth) acrylate, propanediol-1, 3-di (meth) acrylate, butanediol-1, 2nd di (meth) acrylate, trimethylolpropane tri (meth) acrylate, 2-ethylhexyl (meth) acrylate, phenylethyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, ethyltriglycol (meth) acrylate, N, N-dimethylaminoethyl (meth) acrylate, N, N-dimethylaminomethyl (meth) acrylate, butanedio
- the reaction resin composition further contains an inhibitor.
- an inhibitor both for the storage stability of the radically polymerizable compound and thus also of the resin component and for adjusting the gel time, the free-radically polymerizable compounds commonly used as inhibitors stable radicals, such as A / -Oxyl radicals are suitable, as are known in the art.
- Phenolic inhibitors which are usually used conventionally in radically curable resin compositions, can not be used here since the inhibitors would react as a reducing agent with the copper (II) salt, which would adversely affect the storage stability and the gel time.
- a / -Oxyl radicals for example, those can be used as described in DE 199 56 509 A1.
- Suitable stable A / oxyl radicals can be chosen from 1-oxyl-2,2,6,6-tetramethylpiperidine, 1-oxyl-2,2,6,6-tetramethylpiperidin-4-ol (also referred to as TEMPOL).
- 1-Oxyl-2,2,6,6-tetramethylpiperidin-4-one also referred to as TEMPON
- 1-oxyl-2,2,6,6-tetramethyl-4-carboxy-piperidine also as 4-carboxy -TEMPO
- 1 -Oxyl-2,2,5,5-tetramethylpyrrolidine 1 -Oxy 1-2,2,5,5-tetramethyl-3-carboxy-pyrrolidine (also referred to as 3-carboxy-PROXYL)
- aluminum N-nitrosophenylhydroxylamine, diethylhydroxylamine are selected.
- N-oxyl compounds are oximes, such as acetaldoxime, acetone oxime, methyl ethyl ketoxime, Salicyloxime, benzoxime, glyoximes, dimethylglyoxime, acetone-0- (benzyloxycarbonyl) oxime, or indoline nitroxide radicals, such as 2,3-dihydro-2,2-diphenyl-3- (phenylimino) -1H-indole-1-oxylnitroxide, or ⁇ -phosphorylated nitroxide radicals, such as 1- (diethoxyphosphinyl) -2,2-dimethylpropyl-1, 1-dimethylmethyl-nitroxide, and the like.
- oximes such as acetaldoxime, acetone oxime, methyl ethyl ketoxime, Salicyloxime, benzoxime, glyoximes, dimethylglyoxime, acetone-0- (benzyloxycarbonyl) oxime
- the reaction resin composition may further contain inorganic additives such as fillers and / or other additives.
- Fillers are customary fillers, preferably mineral or mineral-like fillers, such as quartz, glass, sand, quartz sand, quartz flour, porcelain, corundum, ceramics, talc, silicic acid (eg fumed silica), silicates, clay, titanium dioxide, chalk, barite , Feldspar, basalt, aluminum hydroxide, granite or sandstone, polymeric fillers such as thermosets, hydraulically hardenable fillers such as gypsum, quicklime or cement (eg Tonerd- or Portland cement), metals such as aluminum, carbon black, furthermore wood, mineral or organic fibers, or the like, or mixtures of two or more thereof, which may be added as a powder, in a granular form or in the form of shaped articles, use.
- mineral or mineral-like fillers such as quartz, glass, sand, quartz sand, quartz flour, porcelain, corundum, ceramics, talc, silicic acid (eg fumed silica), silicates,
- the fillers may be in any form, for example as a powder or flour, or as a shaped body, for.
- a powder or flour or as a shaped body, for.
- the globular, inert substances spherical form
- Conceivable additives are thixotropic agents, such as optionally organically aftertreated fumed silica, bentonites, alkyl and methylcelluloses, castor oil derivatives or the like, plasticizers, such as phthalic or sebacic acid esters, stabilizers, antistatic agents, thickeners, flexibilizers, curing catalysts, rheology aids, wetting agents, coloring additives, such as dyes or in particular pigments, for example for different staining of the components for better control of their mixing, or the like, or mixtures of two or more thereof possible.
- non-reactive diluents may be present, such as lower alkyl ketones, e.g.
- metal scavengers in the form of surface modified fumed silicas may be included in the reaction resin composition.
- the constituents of the reaction resin composition are spatially arranged so that the cupric salt and the at least one nitrogen-containing ligand are present separately, i. in each case a component arranged separately from one another. This prevents that the formation of the reactive species, namely the reactive alkyl radical and thus the polymerization of the radically polymerizable compound already begins during storage.
- a preferred embodiment relates to a two-component system comprising a reaction resin composition comprising a radically polymerizable compound, a copper (II) salt, a nitrogen-containing ligand, an inhibitor, optionally at least one reactive diluent and optionally inorganic additives.
- a reaction resin composition comprising a radically polymerizable compound, a copper (II) salt, a nitrogen-containing ligand, an inhibitor, optionally at least one reactive diluent and optionally inorganic additives.
- the A component, the copper (II) salt and in a second component, the B component, and the nitrogen-containing ligand wherein the two components are stored separately, to a reaction of the constituents with each other to prevent it from mixing.
- the radically polymerizable compound, the inhibitor, the reactive diluent and the inorganic additives are distributed to the A and B components.
- the reaction resin composition may be contained in a cartridge, a container, a capsule or a foil bag, which comprises two or more chambers which are separate from each other and in which the cupric salt and the nitrogen-containing ligand are contained in a reaction-inhibiting manner, be included.
- the reaction resin composition according to the invention is used primarily in the construction sector, for example for the repair of concrete, as polymer concrete, as a coating composition based on synthetic resin or as a cold-curing road marking.
- Particularly suitable for the chemical attachment of anchoring elements, such as anchors, rebars, screws and the like, in boreholes use, especially in boreholes in various substrates, especially mineral substrates, such as those based on concrete, aerated concrete, brickwork, sand-lime brick, sandstone, Natural stone and the like.
- the use of the above-defined reactive resin mortar composition for building comprises curing the composition by mixing the copper (II) salt with the reducing agent or the copper (II) salt with the reducing agent and the ligand.
- the copper (II) salt is mixed with the ligand and optionally the base together with the reaction resin and optionally further constituents as mentioned above, the mixture is introduced into the borehole Thread anchor rod, inserted the rebar, the threaded sleeve or the screw in the mixture in the well and cured the mixture.
- This example shows that an ATRP modified system of the present invention, under simple conditions, i. without further component, which positively influence the reaction and without temperature increase, spontaneously polymerized and therefore suitable as a reaction resin composition.
- a first component was obtained by mixing 0.5 g of Cu (II) octoate and 7.5 g of BDDMA.
- a second component was obtained by mixing 0.6 g of PMDETA and 7.5 g of BDDMA.
- Example 2 Analogously to Example 2, an A component and a B component were prepared, with the difference that for the A component Cu (II) naphthenate was used instead of the Cu (II) octoate.
- a first component was obtained by mixing 0.6 g of Cu (II) naphthenate and 15 g of BDDMA.
- a second component was obtained by mixing 1.2 g of PMDETA and 15 g of BDDMA.
- the two components were mixed, with gelling of the mixture observed after about 11 minutes and the temperature of the mixture rising to 60 ° C.
- Example 4 was repeated by analogously preparing an A component and a B component, with the B component now also being admixed with 0.12 g of 1,8-diazabicycloundec-7-ene (DBU).
- DBU 1,8-diazabicycloundec-7-ene
- An A component and a B component were prepared analogously to Example 4, with the difference that 1 g of 2,2'-bipyridine (bipy) were used instead of the 1.2 g PMDETA.
- a first component (A component) was prepared by mixing 0.75 g of Cu (II) octoate and 15 g of BDDMA and a second component (B component) by mixing 1.7 g of hexamethyltriethylenetetramine (HMTETA) and 15 g of BDDMA produced.
- a component was prepared by mixing 0.75 g of Cu (II) octoate and 15 g of BDDMA and a second component (B component) by mixing 1.7 g of hexamethyltriethylenetetramine (HMTETA) and 15 g of BDDMA produced.
- HMTETA hexamethyltriethylenetetramine
- the mixture gelled after about 6 minutes.
- the polymerization can be slowed to a standstill by the addition of a stable A / Oxyl radical and accelerate by the addition of a strong, non-nucleophilic base, so that it is possible to control the reactivity and adjust the choice of additives.
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Abstract
Description
Claims
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EP14736840.1A EP3019535A1 (en) | 2013-07-09 | 2014-07-09 | Reaction resin composition and use thereof |
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EP13175672.8A EP2824117A1 (en) | 2013-07-09 | 2013-07-09 | Reaction resin composition and its use |
PCT/EP2014/064676 WO2015004171A1 (en) | 2013-07-09 | 2014-07-09 | Reaction resin composition and use thereof |
EP14736840.1A EP3019535A1 (en) | 2013-07-09 | 2014-07-09 | Reaction resin composition and use thereof |
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EP14736840.1A Withdrawn EP3019535A1 (en) | 2013-07-09 | 2014-07-09 | Reaction resin composition and use thereof |
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EP (2) | EP2824117A1 (en) |
JP (1) | JP6391688B2 (en) |
CN (1) | CN105358585A (en) |
AU (1) | AU2014289287A1 (en) |
CA (1) | CA2916830A1 (en) |
RU (1) | RU2016103948A (en) |
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PL3313896T3 (en) * | 2015-06-26 | 2020-03-31 | Fischerwerke Gmbh & Co. Kg | Aldimines and ketimines as initiators in hardener systems and corresponding resin compositions for uses including fixing technology |
DE102015118134A1 (en) | 2015-10-23 | 2017-04-27 | Fischerwerke Gmbh & Co. Kg | Aldimines and ketimines as initiators in hardener systems and corresponding resin compositions, among others for fastening technology |
EP3184499A1 (en) * | 2015-12-21 | 2017-06-28 | HILTI Aktiengesellschaft | Reaction resin composition, multi-component system and its use |
US11518834B2 (en) | 2019-01-02 | 2022-12-06 | Polynt Composites USA, Inc. | Radically polymerizable compositions |
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- 2014-07-09 AU AU2014289287A patent/AU2014289287A1/en not_active Abandoned
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"HOUBEN-WEYL", 1 January 1987, article H. LOGEMANN: "Polymerisation durch radikalische initiierung", pages: 52, XP055516778 * |
See also references of WO2015004171A1 * |
SUN YAN ET AL: "CuSO4-catalyzed self-initiated radical polymerization of 2-(N,N-dimethylamino) ethyl methacrylate as an intrinsically reducing inimer", CHINESE JOURNAL OF POLYMER SCIENCE, ZHONGGUO HUAXUEHUI, CN, vol. 31, no. 8, 29 June 2013 (2013-06-29), pages 1161 - 1172, XP035348519, ISSN: 0256-7679, [retrieved on 20130629], DOI: 10.1007/S10118-013-1317-5 * |
Also Published As
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RU2016103948A3 (en) | 2018-04-26 |
RU2016103948A (en) | 2017-08-14 |
WO2015004171A1 (en) | 2015-01-15 |
CN105358585A (en) | 2016-02-24 |
CA2916830A1 (en) | 2015-01-15 |
JP6391688B2 (en) | 2018-09-19 |
AU2014289287A1 (en) | 2016-01-21 |
US20160168286A1 (en) | 2016-06-16 |
JP2016525162A (en) | 2016-08-22 |
EP2824117A1 (en) | 2015-01-14 |
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