EP2976790A1

EP2976790A1 - Photovoltaic module and method for producing a photovoltaic module

Info

Publication number: EP2976790A1
Application number: EP14709675.4A
Authority: EP
Inventors: Ricardo Ehrenpfordt; Mathias Bruendel; Frederik ANTE; Johannes Kenntner
Original assignee: Robert Bosch GmbH
Current assignee: Robert Bosch GmbH
Priority date: 2013-03-19
Filing date: 2014-03-13
Publication date: 2016-01-27
Also published as: US9917213B2; DE102013204814A1; US20160035909A1; CN105190907A; WO2014146962A1

Abstract

The invention relates to a photovoltaic module (100) having at least one solar cell (110). The at least one solar cell has an irradiation surface (135) for receiving light. The photovoltaic module is designed to provide a voltage. Furthermore, the photovoltaic module (100) comprises a carrier unit (150), which is arranged laterally offset from the solar cell (110) at least on one side, wherein a first surface of the carrier unit (150) is oriented flush with the irradiation surface (135) of the solar cell (110) within a predefined tolerance range. Finally, the photovoltaic module (100) comprises at least one electrical conductor (190), which contacts a carrier contact connection on a second surface (177) of the carrier unit (150) opposite the first surface (140) by means of a cell contact connection (185) of an electronic component (120, 125) on the solar cell (110) or the solar cell (110) in an electrically conductive manner, wherein the cell contact connection (185) is arranged on a contacting side of the solar cell (110) opposite the irradiation surface (135).

Description

Description title

Photovoltaic module and method for producing a photovoltaic module prior art

The present invention relates to a photovoltaic module, to a method for producing a photovoltaic module and to an apparatus for producing a photovoltaic module.

The integration of energy converters is currently a trend in the field of electronics packaging. Especially solar cells are in addition to thermoelectric transducers for the production of electrical energy, eg. B. for operating sensor modules used.

In recent years, the use of thin silicon substrates has continued to establish itself in the assembly and connection technology. Among other things, these offer advantages in terms of thermo-mechanical behavior and can be provided with through contacts and conductor tracks in a very fine pitch. Furthermore, methods for large-area encapsulation of semiconductor devices are available through the improvement of molding technology. In "Compression molding" surfaces of 300 mm diameter can be easily coated with polymers encapsulating materials.

In principle, two types of contacting of solar cells are possible. The cells most commonly produced today must be contacted from the front and back to make electrical contact (indicated by the silver conductor patterns on the front). There are also approaches for pure back-side contact, these are currently relatively little common. US 201 1/0169554 A1 discloses an integrated solar powered device.

Disclosure of the invention

Against this background, with the present invention, a photovoltaic module, further a method for producing a photovoltaic module and a device for producing a photovoltaic module according to the

Main claims presented. Advantageous embodiments emerge from the respective subclaims and the following description.

The approach presented here creates a photovoltaic module with the following

features:

at least one solar cell having an irradiation main surface (135) for receiving light, which is provided to provide a voltage;

a carrier unit which is arranged laterally offset from the solar cell, at least on a first side, wherein a first surface of the carrier unit is flush with the solar cell within a predefined tolerance range

Irradiation surface of the solar cell is aligned; and

at least one electrical conductor which electrically conductively contacts a carrier contact terminal on a second surface of the carrier unit opposite the first surface with a cell contact terminal of an electronic component on the solar cell or the solar cell, wherein the cell contact terminal is located on one of the

Irradiation surface opposite contacting side of the solar cell is arranged.

Furthermore, the approach presented here provides a method for producing a photovoltaic module, photovoltaic module having at least one solar cell having a main radiation surface (135) for receiving light, which is provided for providing a voltage, wherein the

Photovoltaic module has a carrier unit, which is arranged at least on a first side laterally offset from the solar cell, wherein a first

Surface of the carrier unit is aligned within a predefined tolerance range flush with the irradiation surface of the solar cell and wherein the Photovoltaic module at least one electrical conductor, the one

Carrier contact terminal on one of the first surface opposite the second surface of the carrier unit electrically contacted with a cell contact terminal of an electronic component on the solar cell or the solar cell, wherein the cell contact terminal on one of

Irradiation surface opposite contacting side of the solar cell is arranged, wherein the method comprises the following steps:

Providing the carrier unit and the solar cell;

Arranging the solar cell in relation to the carrier unit such that the

Carrier unit is at least on a first side laterally offset from the solar cell, and wherein the first surface of the carrier unit within the predefined tolerance range flush with the

Irradiation surface of the solar cell is aligned; and

electrically conductively connecting the cell contact terminal to the

Carrier contact connection to make the photovoltaic module.

Also, the approach presented here creates a device for producing a photovoltaic module, wherein the device has units which are designed to perform the steps of a method according to a variant presented here.

The present invention thus provides a device which is designed to implement or implement the steps of a variant of a method presented here in corresponding devices. Also through this

Embodiment of the invention in the form of a device, the object underlying the invention can be solved quickly and efficiently.

In the present case, a device can be understood as meaning an electrical device which processes sensor signals and outputs control and / or data signals in dependence thereon. The device may have an interface, which may be formed in hardware and / or software. In the case of a hardware-based embodiment, the interfaces can be part of a so-called system ASIC, for example, which contains a wide variety of functions of the device. However, it is also possible that the interfaces have their own, integrated

Circuits are or at least partially discrete components consist. In a software training, the interfaces may be software modules that are present, for example, on a microcontroller in addition to other software modules. Under a solar cell or photovoltaic cell is present an electronic

Component to understand which light, in particular sunlight z. B. in the wavelength range 200 to 1200 nm can convert into electrical energy. Under a main irradiation surface (135), a main surface of the

To understand solar cell, through which the light is incident into the solar cell to be converted at a converter layer into electrical energy. Under one

Carrier unit is to be understood, for example, a plate or a rigid element, which has electrical conductor tracks, which are designed for electrical contacting of structures or electronic components on or on the solar cell. For example, the carrier unit a

Be printed circuit board, which is designed to receive the solar cell. In this case, the carrier unit with respect to a light irradiation direction on the

Radiation main surface (135) be arranged laterally offset from the solar cell, so that a lateral edge of the solar cell adjacent or opposite to an edge of the carrier unit is arranged. The first surface of the

Carrier unit is flush with the within a predefined tolerance range

Irradiation surface of the solar cell aligned. Under a flush

Alignment of the first surface of the carrier unit within a

predefined tolerance range with respect to the irradiation surface can be understood as an orientation in which there is advantageously no step in a transition from the irradiation surface to the first surface, but at most a step between the first surface of the support unit and the irradiation surface whose height is not greater when

For example, 10 percent of the thickness of the carrier unit and / or the thickness of the solar cell. An electrical conductor can be understood as meaning an electrically conductive connection, such as a bonding wire, for transmitting the electrical energy obtained from the light to the carrier contact terminal or a meter signal of a physical size or a signal derived therefrom to the carrier contact terminal.

The approach presented here is based on the knowledge that photovoltaic modules can be produced very technically very simply and inexpensively, when the solar cell is aligned and connected to the carrier unit such that the first surface of the carrier unit is aligned flush with the irradiation surfaces of the solar cell within the predefined tolerance range. This results in the possibility of aligning and fixing individual or several solar cells, which are produced as a separate electronic component, directly adjacent to a carrier unit. For example, the solar cell can be inserted into a recess or opening of the carrier unit, for example a printed circuit board, and by means of a simple and

inexpensive wiring process. In this way, the photovoltaic module can be produced very technically very simple and inexpensive, which in addition to the solar cell as an electronic (semiconductor) device a

Carrier unit for mounting and for electrical contacting of the solar cell comprises. Particularly advantageous is an embodiment of the present invention in which the carrier unit laterally surrounds the solar cell on at least two sides, in particular wherein the carrier unit surrounds the solar cell in an annular manner. Such an embodiment of the present invention offers the advantage of a particularly secure mounting of the solar cell, at the same time by the

Embedding the solar cell in the carrier unit a particularly high protection of

Solar cell can be realized.

According to a further embodiment of the present invention, an encapsulant mass may be provided which encloses at least the conductor and / or the second surface of the carrier unit and / or the

Contact side of the solar cell covers or covers. Under one

Encapsulation compound may be understood as a material which shields at least a part of the conductor, the second surface of the carrier unit and / or the contacting side of the solar cell from environmental influences, the encapsulation compound may be produced, for example, in a production step of the

Potting can be made with a potting compound. At the same time, a desired surface shape or structure can be realized by the formation of the encapsulant to at least partially create a housing for the photovoltaic module. Particularly advantageous is an embodiment of the present invention in which the cladding mass is arranged in at least one area between the solar cell and the carrier unit and thereby separates the solar cell from the carrier unit, in particular wherein the solar cell is laterally completely surrounded by the cladding mass. Such an embodiment of the present invention offers the advantage of a particularly secure attachment of the solar cell to the carrier unit.

In order to cause as little damage as possible when the photovoltaic module is further installed, according to a favorable embodiment of the present invention, the cladding mass may form a cladding mass surface which is aligned flush with the irradiation surface and the first surface. In this way, a flat surface can be achieved on a side of the photovoltaic module which extends from the first surface of the carrier unit via the envelope mass surface to the irradiation surface.

In order to ensure corrosion or otherwise damage to components of the photovoltaic module, according to a particularly advantageous embodiment of the present invention, the cladding mass may form a fluid-tight seal of a region between the second surface of the carrier unit, the conductor and the contacting surface.

According to another embodiment of the present invention, the carrier unit may be formed by a printed circuit board having a plurality of

Tracks for connecting different electronic

In particular, wherein at least one of the conductor tracks has or forms the carrier contact connection. Such an embodiment of the present invention offers the advantage that the carrier unit can be used both for the protection of the solar cell and for the electrical contacting of the solar cell. As a result of this multiple function of the carrier unit, a compact and space-saving design of the photovoltaic module can thus be achieved.

In order to ensure a particularly flexible further contacting of the photovoltaic module, according to a further embodiment of the present invention Invention, the carrier unit having at least one through-contact, the electrically contacted the carrier contact terminal on the second surface of the carrier unit with at least one further contact terminal on the first surface. Such an embodiment of the present invention has the advantage that the photovoltaic module is contacted electrically from any side itself, which significantly increases the possibility of using the photovoltaic module configured in this way.

Particularly advantageous is an embodiment of the present invention, wherein the solar cell further comprises an electronic component, which is designed to measure a physical size and / or to process an electrical signal, in particular wherein the electronic component to the

Contacting side of the solar cell is arranged. Such

Embodiment of the present invention has the advantage that already provided by the photovoltaic module, a further functionality such as the measurement of the physical size and the processing of an electrical signal, in particular, this further functionality is fed from electrical energy of the solar cell.

An advantage is also a computer program product with program code, which on a machine-readable carrier such as a semiconductor memory, a

Hard disk space or an optical storage can be stored and used to carry out the method according to one of the embodiments described above, when the program product is executed on a computer or a device.

The invention will now be described by way of example with reference to the accompanying drawings. Show it:

Fig. 1 is a photovoltaic module according to an embodiment of the

present invention;

Fig. 2 is a plan view of the photovoltaic module according to the in Fig.

1 illustrated embodiment of the present invention; 3 is a sectional view of a photovoltaic module according to another embodiment of the present invention;

4 is a plan view of the photovoltaic module according to the in Fig.

3 illustrated embodiment of the present invention;

5 A to E are sectional views of different manufacturing stages of a photovoltaic module according to an embodiment of the present invention;

6 is a sectional view of a photovoltaic module according to another embodiment of the present invention;

7A is a sectional view of a photovoltaic module according to another embodiment of the present invention;

7B is a sectional view of a photovoltaic module according to another embodiment of the present invention; Fig. 8 is a sectional view of a photovoltaic module according to another

Embodiment of the present invention; and

9 is a flowchart of an embodiment of the present invention

Invention as a method for producing a photovoltaic module.

In the following description of favorable embodiments of the present invention are for the in the various figures

represented and similar elements acting the same or similar

Reference numeral used, wherein a repeated description of these elements is omitted.

Fig. 1 shows a photovoltaic module 100 according to an embodiment of the present invention. Here, the construction concept of the photovoltaic module in an exemplary variant of the invention in a sectional view

played. The photovoltaic module 100 includes a solar cell 1 10 (which may also be referred to as a photovoltaic cell or PV cell), wherein these Solar cell 1 10, for example, a in a sensor system 1 15 with, for example, a microelectronic mechanical sensor (MEMS) 120 and / or an ASIC evaluation circuit 125 integrated such that the incident light facing solar active side 135 (which can also be referred to as the irradiation side) of the PV cell 1 10 together with the bottom 140 (im

Also referred to below as the first surface) of a rewiring area (interposer) arranged next to the solar cell 110 as a carrier unit 150 is a lower housing end of a photovoltaic module 100

housing housing 155 forms. In this case, the first surface 140 of the carrier unit 150 in a common height level with the

Irradiation surface 135 of the solar cell 1 10 aligned. Under a

common height level can be considered in this case, for example, an arrangement of the first surface 140 with respect to the irradiation surface 135, in which a step of a transition between the irradiation surface 135 to the first surface 140 as small as possible or not present, but at most 10 percent of a thickness of the support unit 155th or the solar cell 1 is 10.

The carrier unit 155 may in the present case be referred to as an "interposer", in which case a carrier unit 155 is an area or a component which converts the "FinePitch" contacts of, inter alia, silicon chips into the "coarser" pitch of the board contacts. In the embodiment shown in Fig. 1, the interposer, d. H. the support unit 150, annularly around the solar cell 1 10 and closes this laterally completely, which will become more apparent from the Fig. 2 described in more detail below. Of the

Area 160 between solar cell 1 10 and Interposer 150 is with a

Envelope mass 165 (which may also be referred to as a molding compound or molding compound) filled. For example, the interposer 150 may be a printed circuit board (also known in the art as PCB (Printed Circuit Board)). The interposer 150 contains metallized vias 170 for the electrical connection between metallic contact surfaces 175 on the underside (first surface 140) and top (second surface 177) of the carrier unit 150. These metallic contact surfaces 175 of the carrier unit 150 may be referred to as a carrier contact terminal, since they have a Contacting the carrier unit 150 of the

Solar cell 1 10 and vice versa allow. Alternatively, the interposer 150 Also in Fig. 1, not shown, metal contacts on the outer edge (or on one of the solar cell 1 10 opposite edge) included, which are generated for example by arranging the vias 170 in a sawing line. The solar cell 1 10 and possibly other components 120 and 125, which on a back or contacting side 183 of the solar cell 1 10 applied and contactable via a cell contact terminal 185 (which is electrically isolated from the solar cell 1 10) are contacted with each other or to the interposer 150 by means of at least one electrical conductor 190 below

Using a wire bonding process or contacted using FC technologies (FC = flip-chip). The Drahtbondkontakte 190 which are drawn to the Interposer 150 extend over the mold or envelope mass 165 filled area between Interposer 150 and PV cell 1 10. The embodiment shown in FIG. 1 shows the direct contacting of devices 120 and 125 with each other or directly to the interposer ring 150 and a contacting of an ASIC 125 as

Evaluation. The PV cell backside (i.e., the contacting side) and the devices 120 and 125 thereon and the interposer region 150 are of the molding compound / molding compound, i. H. covered by the wrapping mass 165 (at least partially).

FIG. 2 shows a plan view of the photovoltaic module according to the exemplary embodiment of the present invention shown in FIG. 1. FIG. 2 is a view of the embodiment of the present invention shown in FIG. 1. The PV cell 1 10 is surrounded annularly by the interposer 150. At the bottom 140 of the interposer 150 are metallized

Contact surfaces 175 arranged, which can serve, among other things, the contacting of the system or the photovoltaic module 100 by soldering. The area 160 between the PV cell 110 and Interposerring 150 is filled by molding compound / molding compound 165. Shown is a single system of a photovoltaic module 100. However, the invention can according to a particularly favorable

Embodiment in use (for example, of many individual systems in the array) executed and isolated in the last process step after the mold or a casting of the coating mass 165 by, for example, by sawing. In summary, the first shown in Figures 1 and 2

Note that for the simple, robust and especially small-scale integration of solar cells as energy converters in electronic systems such as sensor modules currently only a few conceivable concepts for

To be available. Complex processes such as Mold-Via technology,

Redistribution through lithographic processes, embedding technology is not yet mature and very costly. In addition, the integration of solar cells is subject to special challenges. Thus, an opening to the solar active side (i.e., the irradiation side) of the PV cell 110 is desirable. In addition, edges of the solar cells 1 10 should be protected and electrical conduction paths 175 and 190 can be rewired both laterally and vertically. A high potential, especially with regard to low costs for the assembly and connection technology represent design concepts that are largely based on standard processes, as used, inter alia, for the housing of electronic circuits, worldwide.

An important aspect of the present invention can be seen to provide a construction and contacting concept for a photovoltaic module 100 with solar cells 1 10 in electronic systems and a way for a

To provide a method for producing the photovoltaic module 100, said photovoltaic module 100 at least one rewiring area 150 (which is also referred to as an interposer or carrier unit), which contains contact surfaces 175 for electrical and / or mechanical contacting and further at least one solar cell. 1 10, which is in particular connected to at least one electronic component 120 or 125. The photovoltaic module 100 conveniently comprises an interposer 150 or a carrier unit, which is arranged at least one side next to the solar cell 1 10, wherein

For example, a bottom 140 of the interposer 150 with the solar active side (irradiation side 135) of the PV cell 1 10 a common lower

Form conclusion, d. H. form a common housing surface of a housing 155 conveniently on a height level.

In particular, the interposer 150 may extend annularly around the PV cell 110 and enclose it laterally. Also, the photovoltaic module 100 and the solar cell 1 10, the carrier unit 150 and the electrical conductor 190th be covered at least partially by a molding compound 165. In this case, the molding compound 165 at least on the non-solar active side 135th

(Irradiation side) of the PV cell 1 10 that at least one further component 120 and 125 and the interposer 150 extend, wherein the molding compound 165, the area 160 between Interposer 150 and solar cell 1 10 fills such that at the solar active side 135 circulating around the PV cell 1 10 a

largely flat area results. Also, the electrical

Contact surfaces 175 of the interposer 150 at the top 177 are contacted via standard AVT contacting technologies, which proves to be particularly cost-effective. For this purpose, for example, the contact surfaces 175 can be metallized by means of a wire bonding method (that is, the cell connection contacts 185) on the PV cell rear side 183

(Contacting side) or the at least one electronic component 120 or 125 be contacted. Also, the Interposer 150 electrical

Through contacts 175 containing the contact surfaces 175 at the top

177 electrically conductively connect to the contact surfaces 175 on the underside 140 of the interposer 150.

The approach exemplified here allows the realization of some advantages. For example, it should be mentioned here that an introduction of the PV cell

1 10 using standard AVT technologies (ie, standardized loading), which is particularly cost-effective. Also, electrical contacts to the rewiring area 150 may be via standard AVT technologies (including, but not limited to wire bonding), and edge protection for the solar cell 110 may be accomplished very easily by molding compound 165.

Also, vias 170 to the electrical contact pads 175 on the bottom surface 140 of the system 100 via standard technologies of the

Printed circuit board (Durchkontaktierungsherstellung) are formed. At the same time a high reliability of the photovoltaic module 100 is ensured by known material interfaces. Also, a high

Design freedom, for example, due to a rewiring in the

Circuit board 150 and can be achieved via known and inexpensive printed circuit board processes. At the same time edge contacts or Lands can be realized. Also, a standard AVT process sequence (eg, a loading, wire bonding, Molden or the like done). Furthermore, standard processes allow low costs and standard materials (e.g. Thermoset, copper, molding compound, silicon or the like). Also, an interaction of the materials on temperature and aging is known, so that a lifetime of the photovoltaic module can be precisely set or estimated.

Fig. 3 shows a sectional view of a photovoltaic module according to another embodiment of the present invention. In this case, the interposer 150 is arranged on one side next to the PV cell 110. The region 160 between solar cell 1 10 and interposer 150 is filled with molding compound / molding compound 165. In addition, the PV cell 1 10 laterally completely surrounded with molding compound 165. 4 shows a plan view (solar active side) of the photovoltaic module according to the embodiment of the present invention shown in FIG. 3. Fig. 5 A to E show sectional views of different

Manufacturing stages of a photovoltaic module 100 according to a

Embodiment of the present invention. In the subfigures of FIG. 5, therefore, a manufacturing method and a method for implementing the embodiment of the invention using the example of the described in Fig. 1 photovoltaic module 100 is shown. At the beginning of the process, as shown in FIG.

5A, the interposer 150 or an array arrangement of many interposers 150 at the interposer bottom 140 with a temporary carrier foil 500 z. B. occupied by lamination or sticking. Alternatively, it may be a carrier film 500, which already in the production with

Rewiring areas 150 is provided. The carrier film 500 spans the placement region of the PV cell 1 10. The PV cell 1 10 is replaced by z. B.

Sticking by means of a mounter on the carrier film 500 applied so that a manufacturing stage of the photovoltaic module 100 is achieved, as shown in Fig. 5B. In the next process step, whose manufacturing stage for the photovoltaic module 100 is shown in FIG. 5C, the

Components (eg bare the chips 120, 125, SMD housing, BGA, LGA, further printed circuit boards (PCB), further printed circuit boards with other populated chips, etc.) on the PV cell back 183 equipped and z. B. by gluing or soldering (the solder contacts in Fig. 5C are not shown) mechanically or in the case of soldering under certain circumstances also using electrical conductors

190 electrically contacted. Furthermore, the components 120 and the PV cell 1 10 with each other, the Interposerring 150 and the solar cell rear side by wire bonding with electrical conductors 190 are electrically contacted. Thus, it is also conceivable to arrange several PV cells 1 10 side by side on the carrier film 500 and interconnect via wire bonds 190 in parallel or in series.

After a molding step, in which the PV cells rear side, the components 120 and 125 arranged on the rear side, and the rear side 140 of the interposer 177 (second surface) are covered (at least partially) with a potting compound 165, the carrier film 500 is peeled off or replaced. The result of this manufacturing step or the process of withdrawing the

Carrier film 500 is shown in FIG. 5D. This stripping can be carried out, inter alia, mechanically or by a thermal process step. In addition, it is possible to keep certain areas free of potting compound 165, for example as media access for pressure sensors. The photovoltaic module 100 produced in this way is in the (except for the media access) in the

Fig. 5E shown.

As an alternative to the direct contacting of components 120 and 125 to the interposer ring 150, the PV cell rear side 183 can also

Redistribution layers 600, which allow the electronic

To apply components 120 and 125 from the arrangement more flexible and to contact the rewiring or the carrier unit 150. Such

Embodiment of a photovoltaic module of the present invention is shown as a sectional view in FIG. 6. Via a conductor track guide 600, the signals of the electronic components 10 and 125 then to further z. B. placed near the interposer 150 contact surface 185 out and contacted via wire bonds 190 to the interposer 150. The rewiring or the interconnects 600 for the rewiring can, for. B. done by lithographic processes.

Fig. 7 shows a sectional view of a photovoltaic module 100 according to another embodiment of the present invention. The solar active side 135 of the PV cell 1 10 can be protected by protective layers 700, protective films or protective lacquers. These can extend laterally as far as the interposer ring 150 or its underside 140 and can be metallized to isolate them

Contact surfaces 175 are used. In the solar active side 135 (Irradiation side), the protective layer 700 is made corresponding optically transparent, as shown in Fig. 7B. Furthermore, the protective layer 700 may also be the carrier film 500 according to the description of the manufacturing method in the subfigures of FIG. 5. Furthermore, the rewiring layer 600 may itself contain a rewiring in order, inter alia, to make electrical contact with the solar active side 135

(Front side contacting) of the PV cell 1 10 to ensure. When using a mechanically robust and load-bearing protective layer 700 / protective film in the version with Interposerring 150 may be used as an alternative to potting 165 a metal or plastic lid, which with the Interposerring

150 mechanically fixed and the area of the PV cell rear side 183 projects beyond and covers. If necessary, through holes in the metal lid are possible as media access. FIG. 8 shows a sectional illustration of a photovoltaic module 100 according to a further exemplary embodiment of the present invention as an alternative to

Contacting of the interposer 150 to the PV cell rear side 183 or components 120 or 125 arranged there may be executed Molddurchkontakte 800 spanning the filled with molding compound 165 area 160 between the PV cell 1 10 and interposer 150. The connection of

Mold through contacts 800 on one of the solar cell 1 10 and / or the support unit 150 opposite Moldoberseite 810 of the potting compound 165 via conductor tracks 820 can also be used in the execution of contact surfaces

Contacting other systems are used (Package to Package).

FIG. 9 shows a flow diagram of an embodiment of the present invention as a method 900 for producing a photovoltaic module 100. The photovoltaic module comprises at least one solar cell which has a solar cell

Radiation main surface (135) for receiving light, which is intended to provide a voltage, wherein the photovoltaic module a

Carrier unit, which is arranged laterally offset at least on a first side to the solar cell, wherein a first surface of the carrier unit within a predefined tolerance range flush with the

Irradiation surface of the solar cell is aligned. The photovoltaic module further comprises at least one electrical conductor, the one

Carrier contact connection on one of the first surface opposite second surface of the carrier unit electrically contacted with a cell contact terminal of an electronic component to the solar cell or the solar cell, wherein the cell contact terminal on one of

Irradiation surface opposite contacting side of the solar cell is arranged. The method 900 includes a step 910 of providing the carrier unit and the solar cell. Furthermore, the method 900 comprises a step 920 of arranging the solar cell with respect to the carrier unit, such that the carrier unit is arranged laterally offset from the solar cell at least on a first side, and the first surface of the carrier unit is flush with the irradiation surface of the carrier unit within the predefined tolerance range Solar cell is aligned. Finally, the method 900 includes a step 930 of electrically connecting the cell contact terminal to the carrier contact terminal to make the photovoltaic module.

The embodiments described and shown in the figures are chosen only by way of example. Different embodiments may be combined together or in relation to individual features. Also, an embodiment can be supplemented by features of another embodiment.

Furthermore, method steps according to the invention can be repeated as well as carried out in a sequence other than that described.

If an exemplary embodiment comprises a "and / or" link between a first feature and a second feature, then this is to be read so that the embodiment according to one embodiment, both the first feature and the second feature and according to another embodiment either only first feature or only the second feature.

Claims

claims

1 . Photovoltaic module (100) with the following features:

at least one solar cell (110) having an irradiation surface (135) for receiving light, which is provided to provide a voltage;

at least one carrier unit (150) which is arranged laterally offset from the solar cell (110) at least on a first side, wherein a first surface of the carrier unit (150) is flush with the irradiation surface (135) of the solar cell (110) within a predefined tolerance range ) is aligned; and

at least one electrical conductor (190) having a

Carrier contact connection on one of the first surface (140)

opposite second surface (177) of the carrier unit (150) with a cell contact terminal (185) of an electronic

Device (120, 125) to the solar cell (1 10) or the solar cell (1 10) electrically conductively contacted, wherein the cell contact terminal (185) on one of the irradiation surface (135) opposite

Contacting side of the solar cell (1 10) is arranged.

2. Photovoltaic module (100) according to claim 1, characterized in that the carrier unit (150) laterally surrounds the solar cell (1 10) on at least two sides, in particular wherein the carrier unit (150) surrounds the solar cell (1 10) annularly.

3. Photovoltaic module (100) according to one of the preceding claims, characterized by an encapsulation compound (165) which encloses at least the conductor (190) and / or the second surface (177) of

Carrier unit (150) and / or the contacting side (183) of the solar cell (1 10) covers or covers. Photovoltaic module (100) according to claim 3, characterized in that the wrapping mass (165) in at least one region (160) between the solar cell (1 10) and the carrier unit (150) is arranged and thereby the solar cell (1 10) of the support unit (150), in particular wherein the solar cell (1 10) laterally completely separated from the

Envelope mass (165) is surrounded.

A photovoltaic module (100) according to claim 4, characterized in that the cladding mass (165) forms a cladding mass surface which is aligned flush with the irradiation surface (135) and the first surface (140) of the carrier unit (150).

The photovoltaic module (100) according to one of the preceding claims 3 to 5, characterized in that the cladding mass (165) provides a fluid tight seal of a region between the second surface (177) of the carrier unit (150), the conductor (190) and the contacting surface (183).

Photovoltaic module (100) according to one of the preceding claims 3 to 6, characterized in that the envelope mass (165) has at least one through contact (800), by means of which an electrically conductive contacting of the at least one carrier contact terminal (175) and / or the cell contact terminal (185) is possible.

Photovoltaic module (100) according to one of the preceding claims, characterized in that the carrier unit (150) by a

Printed circuit board is formed, which has a plurality of conductor tracks for connecting different electronic components, in particular wherein at least one of the conductor tracks has or forms the carrier contact connection (175).

Photovoltaic module (100) according to one of the preceding claims, characterized in that the carrier unit (150) has at least one through-contact (175) which connects the carrier contact connection (175) on the second surface (177) of the carrier unit (150) with at least one another contact terminal (175) on the first surface (140) contacted electrically conductive.

0. Photovoltaic module (100) according to one of the preceding claims, characterized in that the solar cell (1 10) further comprises

electronic component (120, 125), which is designed to measure a physical quantity and / or to process an electrical signal, in particular wherein the electronic component (120, 125) on the contacting side (183) of the solar cell (1 10) is arranged.

1 . Photovoltaic module (100) according to one of the preceding claims, characterized in that the irradiation surface (135) of the

Solar cell is covered by a carrier film (500, 700), in particular wherein the carrier film (500, 700) in the region of the irradiation surface (135) is transparent to light in the optically visible wavelength range, and / or wherein the first surface (140) and / or a carrier contact terminal (175) is covered by a carrier foil (500, 700).

2. Method (900) for producing a photovoltaic module (100), wherein the photovoltaic module (100) has at least one solar cell (110) which has an irradiation main surface (135) for receiving light, which is provided for providing a voltage wherein the photovoltaic module (100) has a carrier unit (150) which is arranged laterally offset at least on a first side to the solar cell (1 10), wherein a first surface of the carrier unit (150) within a predefined tolerance range flush with the insolation surface (135) of the solar cell (1 10) is aligned and wherein the photovoltaic module (100) at least one electrical conductor (190) having a carrier contact terminal (175) on one of the first surface opposite the second surface of the carrier unit (150) a cell contact terminal (185) of an electronic component to the solar cell (1 10) or the solar cell (1 10) electrically conductively contacted, where at the cell contact terminal (185) on one of the irradiation surface (135) opposite

Contacting the solar cell (1 10) is arranged, wherein the

Method (900) comprising the following steps: Providing the carrier unit (150) and the solar cell (110);

Arranging the solar cell (110) in relation to the carrier unit (150) in such a way that the carrier unit (150) is arranged laterally offset from the solar cell (110) at least on a first side, and wherein the first surface of the carrier unit (150) is inside of the predefined

Tolerance range is aligned flush with the irradiation surface (135) of the solar cell (1 10); and

electrically connecting the cell contact terminal (185) to the carrier contact terminal (175) to form the photovoltaic module.

13. A device for producing a photovoltaic module (100), wherein the

Device comprises units which are designed to perform the steps of a method (900) according to one of claims 1 to 9.