EP2973669A4 - Improved vjfet devices - Google Patents

Improved vjfet devices

Info

Publication number
EP2973669A4
EP2973669A4 EP14779991.0A EP14779991A EP2973669A4 EP 2973669 A4 EP2973669 A4 EP 2973669A4 EP 14779991 A EP14779991 A EP 14779991A EP 2973669 A4 EP2973669 A4 EP 2973669A4
Authority
EP
European Patent Office
Prior art keywords
improved
vjfet
devices
vjfet devices
improved vjfet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP14779991.0A
Other languages
German (de)
French (fr)
Other versions
EP2973669A1 (en
Inventor
Anup Bhalla
Peter Alexandrov
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
United Silicon Carbide Inc
Original Assignee
United Silicon Carbide Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by United Silicon Carbide Inc filed Critical United Silicon Carbide Inc
Publication of EP2973669A1 publication Critical patent/EP2973669A1/en
Publication of EP2973669A4 publication Critical patent/EP2973669A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/80—Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier
    • H01L29/808—Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier with a PN junction gate, e.g. PN homojunction gate
    • H01L29/8083—Vertical transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
    • H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
    • H01L29/0611—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices
    • H01L29/0615—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE]
    • H01L29/0619—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE] with a supplementary region doped oppositely to or in rectifying contact with the semiconductor containing or contacting region, e.g. guard rings with PN or Schottky junction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
    • H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
    • H01L29/0611—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices
    • H01L29/0615—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE]
    • H01L29/063—Reduced surface field [RESURF] pn-junction structures
    • H01L29/0634—Multiple reduced surface field (multi-RESURF) structures, e.g. double RESURF, charge compensation, cool, superjunction (SJ), 3D-RESURF, composite buffer (CB) structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table
    • H01L29/1608—Silicon carbide
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66053—Multistep manufacturing processes of devices having a semiconductor body comprising crystalline silicon carbide
    • H01L29/66068—Multistep manufacturing processes of devices having a semiconductor body comprising crystalline silicon carbide the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409—Unipolar field-effect transistors
    • H01L29/66893—Unipolar field-effect transistors with a PN junction gate, i.e. JFET
    • H01L29/66901—Unipolar field-effect transistors with a PN junction gate, i.e. JFET with a PN homojunction gate
    • H01L29/66909—Vertical transistors, e.g. tecnetrons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H01L29/1066—Gate region of field-effect devices with PN junction gate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
    • H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
    • H01L29/41725—Source or drain electrodes for field effect devices
    • H01L29/41766—Source or drain electrodes for field effect devices with at least part of the source or drain electrode having contact below the semiconductor surface, e.g. the source or drain electrode formed at least partially in a groove or with inclusions of conductor inside the semiconductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Composite Materials (AREA)
  • Junction Field-Effect Transistors (AREA)
EP14779991.0A 2013-03-15 2014-03-14 Improved vjfet devices Withdrawn EP2973669A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201361792141P 2013-03-15 2013-03-15
PCT/US2014/027915 WO2014165309A1 (en) 2013-03-15 2014-03-14 Improved vjfet devices

Publications (2)

Publication Number Publication Date
EP2973669A1 EP2973669A1 (en) 2016-01-20
EP2973669A4 true EP2973669A4 (en) 2016-11-09

Family

ID=51523659

Family Applications (1)

Application Number Title Priority Date Filing Date
EP14779991.0A Withdrawn EP2973669A4 (en) 2013-03-15 2014-03-14 Improved vjfet devices

Country Status (4)

Country Link
US (1) US8860098B2 (en)
EP (1) EP2973669A4 (en)
CN (1) CN105190852B (en)
WO (1) WO2014165309A1 (en)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10103240B2 (en) * 2010-04-30 2018-10-16 Alpha And Omega Semiconductor Incorporated Lateral super junction device with high substrate-gate breakdown and built-in avalanche clamp diode
JP6471508B2 (en) * 2015-01-19 2019-02-20 富士電機株式会社 Semiconductor device
US10396215B2 (en) 2015-03-10 2019-08-27 United Silicon Carbide, Inc. Trench vertical JFET with improved threshold voltage control
JP6441190B2 (en) * 2015-09-11 2018-12-19 株式会社東芝 Manufacturing method of semiconductor device
JP6448513B2 (en) * 2015-11-16 2019-01-09 株式会社東芝 Semiconductor device
EP3391417A1 (en) * 2015-12-15 2018-10-24 General Electric Company Edge termination designs for silicon carbide super-junction power devices
US9502522B1 (en) * 2016-02-29 2016-11-22 Chongqing Pingwei Enterprise Co., Ltd. Mass production process of high voltage and high current Schottky diode with diffused design
US10243039B2 (en) * 2016-03-22 2019-03-26 General Electric Company Super-junction semiconductor power devices with fast switching capability
US11075264B2 (en) * 2016-05-31 2021-07-27 Cree, Inc. Super junction power semiconductor devices formed via ion implantation channeling techniques and related methods
DE102016112970B3 (en) * 2016-07-14 2017-08-31 Infineon Technologies Austria Ag Method of making a superjunction device
DE102017115412A1 (en) 2016-07-14 2018-01-18 Infineon Technologies Austria Ag Process for producing a superconducting device
DE102016115758B3 (en) * 2016-08-25 2018-03-01 Infineon Technologies Austria Ag Semiconductor device containing a superjunction structure
EP3510637A4 (en) * 2016-09-09 2020-04-15 United Silicon Carbide Inc. Trench vertical jfet with improved threshold voltage control
US10861931B2 (en) * 2016-12-08 2020-12-08 Cree, Inc. Power semiconductor devices having gate trenches and buried edge terminations and related methods
US10263070B2 (en) * 2017-06-12 2019-04-16 Alpha And Omega Semiconductor (Cayman) Ltd. Method of manufacturing LV/MV super junction trench power MOSFETs
US10333005B2 (en) * 2017-09-06 2019-06-25 Semiconductor Components Industries, Llc Merged P-intrinsic-N (PIN) Schottky diode
JP6870547B2 (en) * 2017-09-18 2021-05-12 株式会社デンソー Semiconductor devices and their manufacturing methods
US10672775B2 (en) * 2018-05-25 2020-06-02 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor device having strap cell
US10636660B2 (en) * 2018-09-28 2020-04-28 General Electric Company Super-junction semiconductor device fabrication
US11233157B2 (en) * 2018-09-28 2022-01-25 General Electric Company Systems and methods for unipolar charge balanced semiconductor power devices
US10957759B2 (en) * 2018-12-21 2021-03-23 General Electric Company Systems and methods for termination in silicon carbide charge balance power devices
JP7292175B2 (en) * 2019-10-16 2023-06-16 株式会社東芝 semiconductor equipment
JP7472477B2 (en) * 2019-12-02 2024-04-23 富士電機株式会社 METHOD FOR MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SILICON CARBIDE SUBSTRATE
EP3940788A1 (en) 2020-07-16 2022-01-19 Infineon Technologies AG Semiconductor device with complementarily doped regions and method of manufacturing
US11563322B2 (en) * 2020-09-14 2023-01-24 Infineon Technologies Ag RC snubber
CN113054000A (en) * 2021-03-15 2021-06-29 无锡新洁能股份有限公司 Super junction type field effect transistor and manufacturing method thereof
US11955567B2 (en) * 2022-02-16 2024-04-09 Leap Semiconductor Corp. Wide-band gap semiconductor device and method of manufacturing the same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001196602A (en) * 2000-01-12 2001-07-19 Hitachi Ltd Electrostatic induction transistor
EP1542270A1 (en) * 2002-07-24 2005-06-15 Sumitomo Electric Industries, Ltd. Vertical junction field effect transistor and method for fabricating the same
US20070267664A1 (en) * 2006-05-22 2007-11-22 Kabushiki Kaisha Toshiba Semiconductor device and method of manufacturing the same
US20080290403A1 (en) * 2007-05-24 2008-11-27 Kabushiki Kaisha Toshiba Semiconductor apparatus

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4851694B2 (en) * 2004-08-24 2012-01-11 株式会社東芝 Manufacturing method of semiconductor device
US20090166722A1 (en) 2007-12-28 2009-07-02 Alpha & Omega Semiconductor, Ltd: High voltage structures and methods for vertical power devices with improved manufacturability
US8575695B2 (en) * 2009-11-30 2013-11-05 Alpha And Omega Semiconductor Incorporated Lateral super junction device with high substrate-drain breakdown and built-in avalanche clamp diode

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001196602A (en) * 2000-01-12 2001-07-19 Hitachi Ltd Electrostatic induction transistor
EP1542270A1 (en) * 2002-07-24 2005-06-15 Sumitomo Electric Industries, Ltd. Vertical junction field effect transistor and method for fabricating the same
US20070267664A1 (en) * 2006-05-22 2007-11-22 Kabushiki Kaisha Toshiba Semiconductor device and method of manufacturing the same
US20080290403A1 (en) * 2007-05-24 2008-11-27 Kabushiki Kaisha Toshiba Semiconductor apparatus

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2014165309A1 *

Also Published As

Publication number Publication date
WO2014165309A1 (en) 2014-10-09
EP2973669A1 (en) 2016-01-20
CN105190852B (en) 2018-09-11
US20140264477A1 (en) 2014-09-18
US8860098B2 (en) 2014-10-14
CN105190852A (en) 2015-12-23

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