EP2954462A1 - Procédé de connexion d'un microcircuit à des zones conductrices accessibles dans un support - Google Patents
Procédé de connexion d'un microcircuit à des zones conductrices accessibles dans un supportInfo
- Publication number
- EP2954462A1 EP2954462A1 EP14701070.6A EP14701070A EP2954462A1 EP 2954462 A1 EP2954462 A1 EP 2954462A1 EP 14701070 A EP14701070 A EP 14701070A EP 2954462 A1 EP2954462 A1 EP 2954462A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- connection
- micromodule
- cavity
- periphery
- portions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
- G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
- G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Definitions
- the invention relates to a method of connecting a microcircuit to accessible conductive zones or tracks in a medium.
- the invention is directed to a method of connecting a micromodule comprising a microcircuit, to tracks conductors embedded or accessible in a card body or insert body.
- Smart cards are regulated in particular by the ISO 7816 standard.
- the invention can be used to connect keypads, displays, sensors equipping including multi-component cards.
- the invention may relate to electronic portable objects, for example memory cards such as SD (from Sandisk) or electronic passports, electronic keys, dual interface cards or hybrid cards (contact and contactless).
- memory cards such as SD (from Sandisk) or electronic passports, electronic keys, dual interface cards or hybrid cards (contact and contactless).
- US Patent 5,598,032 discloses a method of connecting a micromodule to an antenna formed in an inner layer of a support body.
- the antenna embedded in the body includes connection ends for connecting contact pads of the micromodule. These ends are accessible at the bottom of at least one cavity opening on the surface of the support body; They are connected by any means of connection to contact areas of the micromodule.
- connection means there are in particular springs tongues slid into connection wells or conductive glue filling these wells.
- a substrate having a face and defining at least one interconnection hole having an opening through the face and further defining a receiving cavity of a smart card module; an electrical circuit disposed within the substrate and including a terminal in the cavity; a chip card module received in the cavity having at least one metal contact pad comprising a metal tab extending in the interconnection hole filled with conductive material.
- the tab is formed by a contact pad cutout extending inwardly of the surface of the module and within a periphery of the contact pad.
- the method requires a step of depositing conductive material in the connection wells.
- the invention aims to solve the aforementioned drawbacks.
- the invention aims in particular to improve the reliability of connection of the module with conductive connection areas buried in a body support at least cost or with less manufacturing step.
- the invention thus seeks a stronger and / or more elastic electrical connection while maintaining a good aesthetic appearance of the module or maintaining the surface integrity of the contact pads.
- the invention provides for using a portion or folded outgrowth of the contact pads or a conductive portion of conductive pads of a micromodule, located outside the periphery of the contact pads to connect connecting surfaces buried in a support or located at a distance from the main surface of a support body.
- the folding takes place before insertion of the micromodule in a cavity or recess separating the contact pads (pads or tongues or conductive tracks), connection areas; The folding can continue during the insertion by crushing of the connection portions.
- the invention makes it possible to have contact pads on one side of the module thus reducing costs and manufacturing steps.
- the subject of the invention is therefore a method for connecting conductive pads of a micromodule to accessible connection areas of a support of a portable object, comprising the following steps of:
- PI first periphery
- micromodule comprising conductive pads on a front face delimited by a second periphery (P2) substantially corresponding to the first periphery (PI), connecting portions folded towards a rear face of the micromodule opposite to the front face,
- connection portions being made in electrical connection with their respective connection zone, said connection portions extending from the second periphery (P2) of the conductive areas and being configured in such a way that in the folded position, they exert a contact force against the connection zones when the micromodule has been inserted into the cavity,
- connection areas extending in said cavity perpendicular to a direction of insertion of the micromodule.
- At least one connecting portion is configured at a substantially right angle with respect to the surface of the micromodule so as to bend elastically at one insertion;
- At least one connecting portion is configured so as to form a zigzag or elastic spring and to deform elastically at the insertion;
- At least one connecting portion is configured to form an inclination towards the inside of the module and to deform elastically upon insertion;
- the filling fixes or glues only the end of the connection portions so as to preserve their elasticity;
- the filling material is a conductive material making electrical contact between only the end of said connection portions and said corresponding connection area.
- the invention also relates to a portable object comprising a cavity and a micromodule inserted in the cavity, said micromodule comprising conductive pads on a front face delimited by a second periphery (P2) and folded connection portions to a rear face of the opposite micromodule at the front face, said connection portions extending from the second periphery (P2) of the conductive pads and being configured to exert a contact force against the connection areas.
- a portable object comprising a cavity and a micromodule inserted in the cavity, said micromodule comprising conductive pads on a front face delimited by a second periphery (P2) and folded connection portions to a rear face of the opposite micromodule at the front face, said connection portions extending from the second periphery (P2) of the conductive pads and being configured to exert a contact force against the connection areas.
- connection areas extend in said cavity perpendicular to a direction of insertion of the micromodule into the cavity.
- Figure 1 illustrates a module of the prior art in top view
- Figure 2 illustrates a sectional view of the previous figure along B-B;
- Figure 3A is a perspective view of a chip card micromodule according to an embodiment of the invention.
- FIG. 3B is a longitudinal sectional view along A-A of the micromodule of the previous figure
- FIG. 4A illustrates the micromodule of the preceding figure with its folded connection portions according to a first embodiment
- FIG. 4B illustrates the smart card micromodule of the preceding figure after insertion into a card body cavity
- FIG. 5A illustrates a chip card micromodule with its folded connection portions according to a second embodiment
- Figure 5B illustrates the micromodule of the previous figure after insertion into a card body cavity
- FIG. 5C illustrates a partial view of the micromodule of the preceding figure after a different insertion and connection in a card body cavity.
- a chip card type module 100 includes contact pads 9 within a zone of contact pads or peripheral P2.
- This dummy line device P2 designates the overall shape of the contact pads and does not include a concave part. This line corresponds substantially to the periphery of the receiving cavity (upper plane of the cavity) of the module.
- the module is embedded in a card body 1. It includes legs J extending from a substantially central area of the contact pad to a connection area 3a, 3b through wells. Each leg J formed inside a contact pad 9 by a cut D of the latter.
- the cut J of the contact pad is oriented at 90 ° with respect to the main surface of the module.
- Holes corresponding to each cut D appear on the surface of the module and the smart card 100.
- the legs J penetrate into a conductive material filling the wells and in contact with the connection areas (without directly connecting the connection areas). The legs are entirely taken in the conductive material and do not directly connect the connection areas but through the conductive material.
- the invention relates to a method for connecting conductive pads 10 of a micromodule (2) to connection zones 3a, 3b embedded or accessible in a support 1 of a portable object 100.
- the portable object is a smart card 100 comprising a support body 1 (here a card body), an antenna 3, and a micromodule 2 embedded in a cavity 11 of the support body.
- the portable object may in particular be a multi-component card including a display and / or a keyboard and / or a sensor. It can be an electronic passport or an intelligent electronic key.
- the method comprises a step of supplying or producing a body of the portable object 1 comprising a cavity 11 for receiving the micromodule and connection zones 3a, 3b accessible in said cavity.
- the cavity opens out on the surface of the body and is delimited on the surface of the body by a first periphery,
- a body of the smart card is made with a cavity 11 here at two levels and connection pads 3a, 3b of a radiofrequency antenna 3 buried in the card body.
- the card is for example obtained by lamination of sheets or overmoulding of an electrical / electronic circuit, in particular supported by a sheet.
- the cavity defines a first periphery PI or a periphery of the largest cavity opening on the surface of the body of the object.
- the cavity PI and / or openings 5a, 5b allowing access to the connection areas 3a, 3b of the antenna circuit 3 can be achieved in particular by machining or during overmolding by using a core occupying the cavity and / or openings.
- the card body comprises one or more holes (s) or recess (s) 5a, 5b which allow access to the connection areas 3a, 3b of the antenna 3 from outside the body.
- the antenna 3 is buried in the card body and comprises connection areas 3a, 3B accessible from outside the card body 1.
- the method also comprises a step of producing a micromodule 2 comprising electrical contact pads 10 on a front face delimited by a second periphery P2 substantially corresponding to or slightly smaller than the first periphery PI, connecting portions bent towards a face back of the micromodule opposite to the front face.
- the micromodule 2 here comprises an integrated microcircuit 8.
- the micromodule here is substantially in accordance with the smart card micromodules. Here it comprises a coating E, chip connections 6 to the different contacts or contact pads.
- the module is here of simple type.
- the contact pads or conductors are formed on one side of the module including etching or against-bonding metallizations. The side intended to connect a contact terminal is provided with these contact pads 10.
- contact or conductive pads 9 define a first periphery P2 intended to delimit the visible surface of contacts once the module inserted into a card body.
- Contact pads 9 include metal extensions (portions, tabs, connection tabs) extending from the pads 9. For example, to connect an antenna, two extensions are sufficient. For a more complex object such as a multi-component card, several extensions of ranges may be necessary.
- the micromodule here comprises contact pads 11 on the upper surface. Alternatively, the pads may be under a support substrate.
- the beach portions 10 may be supported by an insulating dielectric film.
- the folding can be carried out so that the conductive face of the portion is oriented substantially in a direction from the front face to the rear face of the module.
- connection portions that extend from the first periphery of the contact pads are configured so that in the folded position they can exert an elastic contact force against the connection areas after insertion into the cavity.
- At least one portion 10 is configured at a substantially right angle with respect to the surface of the micromodule so as to bend slightly elastically at the insertion. Deformation can be elastic or plastic and elastic so as to maintain a certain holding force of the electrical contact.
- the method also comprises a step of inserting and connecting the module in the cavity, the connection portions being electrically connected to their respective connection zone (3a, 3b).
- the micromodule after having the folded portions is encased conventionally in the cavity 11 of the card body and fixed with, for example, a thermo-adhesive layer G, cyanoacrylate glue, etc. . as shown in Figure 4B.
- connection portions extend from the first periphery of the contact pads; These portions may be configured to have elasticity in a direction substantially perpendicular to the main surface of the contact pads.
- the portions are preferably dimensioned with a greater length than the depth of the wells 5b, 5a so as to be slightly curved in particular by buckling during the insertion.
- An insertion tool can exert in this operation a force on the entire surface of the module for elastic and / or plastic bonding and deformation of the connection portions (jambes 10).
- the module is in accordance with that of FIG. 4A, with the difference that the tabs or connecting portions 10 have a much greater length than previously.
- at least one portion 10 is configured to form a zigzag or resilient spring and / or elastically deform at one insertion.
- At least one portion Prior to the insertion, at least one portion may be folded, configured so as to form an inclination towards the inside of the module (towards the center of the module) and to deform at least elastically at one insertion.
- the zigzag (or several folds on a connecting portion) can be formed before insertion including before or after the folding of the portions to the rear face of the module.
- the method may comprise a step of at least partial filling of each recess (5a, 5b) by a glue or conductive resin or not.
- the adhesive / resin serves to fix the portion in the elastic connection position against the connection areas. If necessary, contrary to FIG. 5D, only the bottom of the wells can be filled with glue / resin. Thus, a large intermediate portion of the connection portion 10 is free of movement between its end in contact with the connection area and its connection to the external surface contact area of the module at the peripheral line.
- the module here has several connection portions in particular for connecting one or more multi-component card circuit (s), in other embodiments, it may comprise only two portions of connections for example at the C4 ranges, C8 according to ISO 7816 to connect an antenna.
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP14701070.6A EP2954462A1 (fr) | 2013-02-07 | 2014-01-21 | Procédé de connexion d'un microcircuit à des zones conductrices accessibles dans un support |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP13305150.8A EP2765536A1 (fr) | 2013-02-07 | 2013-02-07 | Procédé de connexion d'un microcircuit à des zones conductrices accessibles dans un support |
EP14701070.6A EP2954462A1 (fr) | 2013-02-07 | 2014-01-21 | Procédé de connexion d'un microcircuit à des zones conductrices accessibles dans un support |
PCT/EP2014/051146 WO2014122009A1 (fr) | 2013-02-07 | 2014-01-21 | Procede de connexion d'un microcircuit a des zones conductrices accessibles dans un support |
Publications (1)
Publication Number | Publication Date |
---|---|
EP2954462A1 true EP2954462A1 (fr) | 2015-12-16 |
Family
ID=47843208
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP13305150.8A Withdrawn EP2765536A1 (fr) | 2013-02-07 | 2013-02-07 | Procédé de connexion d'un microcircuit à des zones conductrices accessibles dans un support |
EP14701070.6A Withdrawn EP2954462A1 (fr) | 2013-02-07 | 2014-01-21 | Procédé de connexion d'un microcircuit à des zones conductrices accessibles dans un support |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP13305150.8A Withdrawn EP2765536A1 (fr) | 2013-02-07 | 2013-02-07 | Procédé de connexion d'un microcircuit à des zones conductrices accessibles dans un support |
Country Status (2)
Country | Link |
---|---|
EP (2) | EP2765536A1 (fr) |
WO (1) | WO2014122009A1 (fr) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3030087B1 (fr) * | 2014-12-11 | 2018-04-20 | Idemia France | Module pour cartes a microcircuit, cartes a microcircuit comprenant un tel module et procede de fabrication |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2590051B1 (fr) * | 1985-11-08 | 1991-05-17 | Eurotechnique Sa | Carte comportant un composant et micromodule a contacts de flanc |
WO1995011135A1 (fr) * | 1993-10-18 | 1995-04-27 | Oki Electric Industry Co., Ltd. | Module a circuit integre et porteur de donnees pourvu d'un tel module |
FR2716281B1 (fr) | 1994-02-14 | 1996-05-03 | Gemplus Card Int | Procédé de fabrication d'une carte sans contact. |
FR2724477B1 (fr) * | 1994-09-13 | 1997-01-10 | Gemplus Card Int | Procede de fabrication de cartes sans contact |
US5671525A (en) * | 1995-02-13 | 1997-09-30 | Gemplus Card International | Method of manufacturing a hybrid chip card |
US5856912A (en) | 1997-03-04 | 1999-01-05 | Motorola Inc. | Microelectronic assembly for connection to an embedded electrical element, and method for forming same |
EP2450837A1 (fr) * | 2010-11-04 | 2012-05-09 | Gemalto SA | Procédé d'interconnexion par ressort de plage conductrice avec un contact électrique et dispositif correspondant |
-
2013
- 2013-02-07 EP EP13305150.8A patent/EP2765536A1/fr not_active Withdrawn
-
2014
- 2014-01-21 WO PCT/EP2014/051146 patent/WO2014122009A1/fr active Application Filing
- 2014-01-21 EP EP14701070.6A patent/EP2954462A1/fr not_active Withdrawn
Non-Patent Citations (2)
Title |
---|
None * |
See also references of WO2014122009A1 * |
Also Published As
Publication number | Publication date |
---|---|
EP2765536A1 (fr) | 2014-08-13 |
WO2014122009A1 (fr) | 2014-08-14 |
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