Classifications

• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
  • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
  • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
  • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
  • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
  • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
  • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
  • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
  • G06K19/0772—Physical layout of the record carrier
  • G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
  • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
  • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
  • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
  • G06K19/07737—Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
  • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
  • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
  • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
  • G06K19/07743—External electrical contacts

Definitions

• the invention relates to a method for manufacturing an electrical / electronic device with a communication and / or power supply interface as well as the device obtained.
• the invention also relates to the manufacture of telecommunication modules for machines, in particular M2M (machine to machine) type, which can have different form factors.
• M2M machine to machine
• Such devices can be found, for example, in the form of smart card modules, with various form factors such as those of small electronic objects of micro-SD (Secure Digital in English) formats, Micro-SIM (Subscriber Identity). Module in English) or Plug-in SIM, Mini UICC (Universal Integrated Circuit Card in English).
• micro-SD Secure Digital in English
• Micro-SIM Subscriber Identity
• Mini UICC Universal Integrated Circuit Card in English
• SMD Surface Driver
• BGA Binary Grid Array English language
• These boxes include a power supply and / or communication interface including electrical contacts or antenna.
• These different objects, boxes, card, interface modules are interchangeable in this document and may be designated by the term device.
• the devices are particularly applicable in digital security, health, banking, telecommunications or identity control, physical and / or logical access control.
• the devices are generally assembled on the same support from a printed circuit substrate (PCB or "lead frame" presented on a master (or work) support film. in the form of a coil and on which are glued, welded and overmolded several housings.
• the master support film can be entirely metallic without film insulating dielectric support.
• the master support film is then a screen cut in the form of a ribbon ribbon defining a continuous string of communication interfaces and / or power supply.
• the separation of these molded housings requires a separation step that can be performed only by special cutting machine, according to any type of automatic cutting process (mechanical sawing, punching, laser, water jet). This step generates a large part of the manufacturing cost.
• the thickness or size of the current housings being constantly decreasing to facilitate greater integration in portable devices, phones, it is necessary for this purpose, to provide a more suitable manufacturing process or arrangement.
• the passage of the form factor 2FF (25 x 15mm 2 ) to 3FF (15 x 12 mm 2 ) and now 4FF (nano SIM) reduces the surface of the module to encircle and limits the surface sticking it in the SIM card body, the size of the components that can be integrated into the module.
• the inventors have considered the realization of the card (device) on the support film coil directly to the format of the smart card module which is usually embedded in a smart card body but they have to confront the problem of cutting the device out of the coil of modules.
• final formatting of the plastic of a card body is performed either at the time of injection of the card body, or by mechanical extraction / cutting of the card body after inserting the module. With the exception of punching, nothing is provided for cutting the device out of the coil.
• the document FR 2795 203 describes a method of manufacturing a module comprising a thin chip connected to a communication interface by welding through the chip.
• the module can be made on a continuous ribbon and surrounded by a precut or embrittlement.
• This module is not a finished product that can be used alone in a reader by an end user; it is intended to be transferred by adhesive on a support.
• a conventional precut around the module in the continuous ribbon facilitates subsequent separation. No manual separation is specifically provided to detach the module from the continuous ribbon.
• the invention aims to meet the aforementioned drawbacks of the miniaturization of smart devices and / or their size, the complexity and cost of their manufacture.
• the invention provides on the one hand to make at least one of the formats of the electronic chip device (housing / card / module) at the level of the coil of a master support film (leadframe), on the other hand perform the manual extraction of the device to one of the final formats on the reel.
• This operation seems to be done much like the manual extraction of a SIM card (SIM plug-in) from an ISO 7816 large format SIM card but at a very early stage of the card manufacturing process. The extraction takes place at the stage of the coil without having to manufacture a full-size large body of the SIM card and inserting the module into a card body.
• SIM plug-in SIM plug-in
• the invention thus makes it possible to eliminate several steps at the smart card manufacturer such as module insertion and pre-cuts in the card body for the extraction of the devices. It also makes it possible to carry out the step of customizing the devices at the level of the coil and thus to increase the rates.
• the subject of the invention is a method for manufacturing at least one electrical / electronic device comprising a support film with a communication interface, said method comprising the following steps:
• said device with its own carrier film being intended to be separated from the master support film
• the method is distinguished in that it comprises a step of forming a precut in the master support film around each device, said precut being adapted to allow manual separation of each device.
• the method is more suited to the miniaturization of devices and also has the advantage of being very convenient for distribution to the end customer at the point of sale.
• the precut is performed so as to leave straps connecting each location of the device with the master support film;
• the straps or bridges have thinning or weakening provided on the side of the device;
• the straps are attached to the housing by a section of film-support between 0.02 mm 2 and 0.2 mm 2
• the straps are attached to the housing by a section of film-support between 0.02 mm 2 and 0.2 mm 2 for each of the shoulder straps. This corresponds to about a strap width of 200 mm to 2 mm where the shoulder straps must come off for a support film thickness of 110 ym for example.
• the master support film (1) comprises a thermosetting polymer matrix of epoxy with glass fibers
• Each strap can be broken by rotational movement or torsion of the material of the strap at its predetermined zone / line of rupture obtained manually by tilting and / or rotation of the device around an axis passing through the ramp and / or a master film-support plane.
• the invention also relates to the corresponding device obtained.
• the subject of the invention is a master film-support coil comprising electronic devices obtained by the method.
• the coil may comprise or be associated with a frame for assistance in the manual separation of the devices.
• the invention is a manual extraction devices very practical because it may not use a tool capable of slicing, stamping, to perform a net shear including punching, sawing the master film-support (leadframe). At most, it can provide an extraction assistance support with recess corresponding to the size of the device to serve as support during the extraction of the roller device through the recess.
• FIGS. 1A-1E illustrate a method of manufacturing an electrical / electronic device according to a preferred embodiment of the invention
• FIG. 2 illustrates a master support film at an elementary stage after cutting and similar to FIG. 1B;
• FIG. 3 illustrates an enlarged view of a device of the invention isolated from the master support film of FIG. 1C or 2;
• FIGS. 3A, 3B, 3C respectively illustrate an enlarged view of a strap taken from the device of FIG. 3, a section AA of FIG. 3 and a side view in section BB of FIG. 3B;
• FIGS. 3D and 3E illustrate two embodiments of pre-cuts, thinning or bracing of braces;
• FIG. 4 illustrates a mold that can be used to overmold the devices
• FIG. 5 illustrates a partial cross-sectional view of a device of FIG. 1B connected to its master support film subjected to separation forces
• FIG. 6 illustrates a view of a device of the invention separated from the master support film of FIG. 5 following the application of separation forces
• FIGS. 7 and 8 illustrate an optional means of assisting the separation of the devices from their master support film; in front view and in cross-section along C-C;
• FIG. 9 and 10 respectively illustrate a device obtained according to the preferred embodiment of the invention with insulating support film (dielectric) and without insulating support film under the interface.
• the method comprises a step of supplying or realizing a plurality of electrical / electronic devices 1A-4A on a master support film 1.
• the interface may comprise at least one set of measurements including conductive tracks or tracks that can form in particular electrical contacts or a radio frequency antenna of any kind (UHF, RF).
• a master support film (or main or working film) is produced in the form of a coil support film 1 comprising a row of interfaces 1A with electrical contacts 10 in two rows.
• This is a "lead frame” type ribbon with lateral drive ports 2.
• the interfaces are connected to current leads 3 for grounding or to allow metallization.
• the interfaces or sets of electrical contacts are those of a chip card compliant with a standard. This is a set of contacts for SIM card with 6 electrical contacts in accordance with ISO 7816. These contacts are etched and supported by an insulating support film 1 (or 7 after cutting). The support film 7 is an extract (or subset) of the master support film.
• the 6-contact interface can be replaced by a radiofrequency antenna interface.
• a radiofrequency antenna interface it can be made flat in the form of spiral or other pattern including UHF, etc.
• the device may comprise at least one integrated circuit chip connected or not to the communication interface / contact or antenna power supply and / or points / interconnecting tracks.
• a conductive grid electrically on the insulating support to form electrical contacts and / or tracks and / or at least one antenna.
• the grid or each interface may be supported and held in place relative to the other interfaces by a removable insulating tape / film fixed in particular on or outside the outer face of the electrical contacts 10 or electrical test zones. / customization.
• the interfaces may also remain provisionally attached to the master backing film after complete cutting around their location by an added joint member, for example a seal placed in the cutting gap (without a shoulder strap).
• the method comprises a step of forming at least one pre-cut 5, embrittlement or predetermined break zone in the master support film around each device.
• Pre-cut, embrittlement or predetermined area of break is adapted or configured to allow at least manual separation / extraction of each device from its location 4.
• Each interface 1A or set of electrical contact pads 10 supported by the master coil tape may be intended to be delimited or surrounded by a precut 5.
• Pre-cut can be achieved by a partial peripheral recess of a few microns to a few millimeters in the master ribbon.
• FIGS. 1B, 1C a recess of a few millimeters (1-2 mm) around the location 4 of the device has been made, in particular by punching, laser, etc. with the exception of certain places defining shoulder straps 6.
• Figure 1C illustrates a bottom view of the previous figure.
• the straps are preferably configured (Fig. 3A) so as to concentrate the separation / breaking stresses at the point where they want to break. They can be placed all around the device. They are preferably of small width / section to facilitate the manual separation of the device. There are in the example three in number spread on three sides of the SIM card so as to create a pivot effect facilitating the manual extraction of the device.
• the master support film (leadframe) is pre-cut during its manufacture or at the end of its manufacture before assembly (postponement and connection of the chip ).
• Pre-cuts can be preferably as in the example, after lamination, etching and metallization of the copper.
• pre-cut recesses can also be used to short-circuit current leads 3 for metallizing the metal contacts of ISO contacts, which minimizes cost impact for the film manufacturer.
• this pre-cut can serve as a barrier for the resin in the case where the assembly process would use a resin distribution as would be the case with extended fiberglass reinforced glass pellet technology; In this case, use a peelable film on the contact side so that the resin does not pass through the pre-cuts of the support film that form the mini-card to prevent pollution equipment.
• the surface metallizations of the interfaces are carried out using current lead tracks, it can be ensured that these tracks have a configuration facilitating their cutting or separation during the extraction of the devices with respect to the film. -Main support.
• the tracks may, for example, have a form of necking, or precut or reduction of section where they are to be cut.
• the pre-cuts can also be done at the same time as the perforations of the weld sinks in the dielectric and therefore before lamination of the copper, so take advantage of a single punching or punching tool.
• each device can be maintained by a single strap or two or three or four; They can be wide, for example extending over a third or all of a device side.
• the cut can be total around the device while it is replaced in its location 4 by jamming, gluing or other;
• the cutting can be very fine, especially by laser or punching.
• a filling / adhering material for example a wax, silicone seal
• the precut may include embrittlement all around the location 4 of the device.
• the embrittlement can be of any type, for example, thinning of thickness all around the final contour 4 of the device or part of this contour, micro-perforations including laser, pre-punching, symmetrical or asymmetrical thinning on a face or the two opposite faces of the support film.
• the pre-cut 5 is made so as to leave braces / bridges / other temporary junctions 6 connecting each device 2A-4A or housing 5A with the master support film 1. It is noted here illustrated, that the junction of the device 2A-4A to the master support film 1 only takes place according to this first preferred embodiment by strap material 6 of the master support film.
• the invention also provides separate added junctions of the master support film (seal, film, adhesive tape ...)
• the shoulder strap 6 has a rupture zone 8 corresponding to an area where its width is the narrowest.
• the width of the ramp is narrowing towards the device to a line 8 from which the ramp extends to the device 2A widening.
• the narrowest width of the ramp defines a predetermined break line 8.
• the shoulder strap is preferably configured to be broken at least manually, for example by simply pressing the fingers or pressing a finger of one hand on the device, while the ribbon or support film can be held with the other hand.
• the shoulder straps preferably have a narrower shape that is to say narrower at the place where it is desired to break than in the rest of the ramp.
• the necking is carried out so that the mechanical stress transmitted by the pressure of the finger on the device substantially in the center of one of its main surfaces S concentrates directly at the narrowing point of smaller width and / or thickness of the ramp.
• Each master support film 1 comprises at least one preferred zone of rupture / necking 8 located as close as possible to the final contour / location 4 of each device illustrated below.
• the rupture zone 8 is provided so that the periphery or overall contour 4 of the device is not affected / exceeded. This outline not to be exceeded can indeed be standardized.
• connection of the straps to the location of each device may comprise a recessed area towards the inside of the housing location.
• the shoulder straps comprise a zone / line of weakening or predetermined rupture which is located closer to the final contour 4 of the device.
• the gap or shrinkage "R” does not exceed 0.5 mm or preferably 0.1 mm.
• the width of the ramp in the breaking zone (therefore the narrowest) is between about 200 microns and 2 mm.
• the straps can have a residual section of 0.02 mm 2 to 0.2 mm 2 for each of the straps. These sections correspond to approximately a strap width of 200 ⁇ m to 2 mm at the point where the shoulder straps must come off for a thickness of film support 1 of 110 ym for example, but which could also be 50 to 200 ym thick.
• the ramp may comprise thinning in thickness to this predetermined zone or line of rupture 8 (shown in dashed lines) to further facilitate the manual break straps. It is therefore possible to locally thin the straps in their areas of smaller width, although this is only an option compared to the preferred method. Thinning can be done, for example, by mechanical milling or punching.
• the master support film may comprise a thinning 8 in particular V-shaped on each of its opposite faces.
• the ramp is thinned here by about 50%
• the master support film may comprise thinning / embrittlement 8 in the form of perforation (s) 8A over the entire thickness of the support film.
• perforation can also be partial on the thickness.
• the residual section of the ramp at the point 8 of necking is here reduced by 50
• the master support film comprises a reduction in thickness on one side only on the side of the electrical contact pads.
• the residual section can be reduced for example by 50%.
• the module is completely cut and the method comprises a step (possible at different stages), temporary gluing of a means holding adhesive in position of each device on the master support film.
• This means may be a film, tape (s), adhesive wire (s), wax, silicone gasket or other to temporarily hold each device in place.
• This holding means is preferably fixed on the side of the face carrying the electrical contacts 10.
• each device manually from the master support film.
• this has the advantage of partially or completely protecting the contacts during the different subsequent steps of the process.
• the film may include a window in front of each electrical contact pad to allow access for electrical customization.
• This adhesive holding means (removable or repositionable) can be placed before or after the complete cutting of the devices.
• the holding straps are here made of the master support film, so as to allow the various subsequent manufacturing operations such as transport, manipulation of the device on the tape and separation.
• the straps are made by adding material that may comprise a film, son, a tape, an adhesive seal, a silicone seal described above.
• the master-support films of the preceding modes it is possible to temporarily fix the master-support films of the preceding modes, entirely or almost cut with respect to the devices 2A, 4A, on an adhesive tape placed on the outer face of the interfaces. It may contain the devices made after the steps of FIG. 1B, 1C, 1D or 1E or (with or without a dielectric support film under the metallizations and with or without a metal or dielectric strap).
• braces present we can cut the straps locally, including metal, by mechanical cutting, laser, or with another non-manual cutting tool.
• the interfaces remain in place in their location 4 as maintained by the adhesive tape.
• the complex thus formed can remain as delivered to the customer (operator) or the master support film can be removed leaving the devices on the adhesive tape.
• the adhesive backing film may be cut locally under the dielectric or metal strap that has been mechanically severed, each interface being otherwise maintained by the added adhesive means.
• the straps are configured to break at a force of 5 to 30 Newtons.
• the support film 1 may comprise a suitable fragile material at the breakup. It can include fragile fibers.
• the material of the dielectric of the carrier film (leadframe) and therefore straps to break is chosen specifically for its properties to rupture brittle during separation / extraction;
• the master support film may have a thickness of between approximately 50 and 150 ⁇ m.
• a composite of brittle fibers is selected in a resin matrix. More specifically, the nature of the film is preferably a thermosetting polymer matrix, for example epoxy with glass fibers. Thus, a high modulus Young material is obtained which will be more brittle than a single polymer with high modulus.
• a ductile metallic material such as copper constituting the straps is not preferred because it could more easily break manually, cleanly and without deformation according to specified dimensions.
• FIG. 1D the transfer and connection of an integrated circuit chip 9 to the support (or possibly to the conductive elements or through an opening in the support film 7) is carried out.
• FIG. 1E the final dimension of the device or casing 4A is then molded with an insulating overmolding material 20 and a mold M as illustrated in FIG. 4 described above.
• a mold M is used, comprising a first lower part DMI for supporting the master support film 1 comprising the devices 3A in the stage illustrated in FIG. 1D, comprising the connected chips.
• the mold comprises a corresponding second upper part DMS having a plurality of molding cavities (EM) corresponding in size and shape to the bodies of the objects / housings / devices to be obtained.
• EM molding cavities
• the mold DMS, DMI is closed again following displacement (F) of the upper part DMS against the lower part DMI and against the substrate 5.
• a plurality of molding spaces (EM) corresponding to the molding cavities CM is defined above the master support film 1 and the plurality of electronic chips 9.
• the mold comprises in a known manner (not shown) one or several point (s) of injection of material into each molding cavity (EM), for example on the walls of each cavity corresponding to a slice of the objects or rear face (opposite the face carrying the contacts 10).
• the upper part DMS of the mold moves away (0) from the lower part to open the mold, the support or substrate 5 being held on the lower part DMI of the mold in particular by suction.
• the molded cases can be ejected from the cavities (EM) or compartments of the mold during the ascent (0) of the upper part of the mold;
• the invention can provide sliding ejectors (15) in the upper part of the mold DMS above the housings and against their rear face, through each mold cavity (EM), to extract the housings from their cavity.
• the invention thus makes it possible to produce the master support film 1 comprising a series of manually extractable electronic devices 4A as illustrated in FIG. 1E.
• the device obtained comprises a support film 7 supporting the contact pads 10.
• it comprises break marks Ml positioned at the shoulder straps. These marks may include part of the configuration of the straps favoring a necking or concave cut.
• the configuration can define two "V" on either side of the broken material at line 8. If necessary, the configuration at the broken zone may comprise a portion of the optional thinning configurations illustrated in FIGS. 3b-3E (partial holes 8A, inclined slice of support film 8, groove shoulder 8B)
• the device does not include the support film 7 under the contact pads.
• the master support film was a cut metal strip (or grid).
• the device may also comprise M2 mechanical cutting marks such as the cut-off marks of the current leads 3, arranged similarly to the preceding figure but located substantially at the level of the metallizations 10.
• the method then comprises the step of separating the device from the master support film 1 as illustrated below.
• Figure 5 illustrates a master support film in cross section. A device 2A is shown here, but this diagram can also be applied to devices 4A of a more advanced master support film of FIG. 1F (with its body molded in dotted lines).
• the straps are defined so that a force F applied substantially to the center of the device on a surface S equal for example to half the surface of the device, causes the breaking of at least one strap.
• the master support film is preferably on a counter-support F2 at the level of straps, outside and near the contour of the device, for example 3 mm contour 4.
• the counter-support may be formed by at least one finger or an assistance frame 27 of FIG.
• a force F of about 5 to 30 (even 50) Newton is necessary to break these straps manually and thus remove the SIM from the support film (leadframe).
• This force can be characterized by carrying out a test where a section S rod above moves and records the support force in the center of the SIM until breakage of the straps.
• the invention may provide an extraction force ranging from 4 to 15 Newton or 4 to 10 Newton.
• the force needed to break straps as formed in ABS plastic body SIM card and extract a mini SIM under similar conditions is of the order of 17 Newton in the case of a format SIM card 4FF.
• a force F1 is applied to the edge of the device 2A, 4A near a strap (at a distance of 1-2 mm from the recess 5).
• a force F2 against-reaction or support is applied as previously on the other side of the master support film outside the contour of the device and close (1-3 mm).
• the force to be applied on a ramp until it breaks is of the order of 3 to 5 Newton.
• Each point of application of force F1 and counter-support F2 can be carried out on a surface of about 4 mm2 facing and near the ramp.
• the separation of a device 2A-5A can be achieved by means of a manual counter-support device and, if appropriate, a separation pressure centering device on one or more zones of the device (central, side) or in the vicinity of the straps or directly over them.
• Figures 7 and 8 illustrate an optional means 21 for assisting in manual separation of devices 4A, 4B.
• This means can be placed permanently (or adjoining) on the string or coil of devices of the master support film 1. It may comprise a base 22 defining a support frame around the location of each device to be extracted. It can be metal or plastic.
• the base 22 comprises two frames or windows 26. Each frame is preferably positioned against the master support film on the interface side 10 (the other opposite side is possible).
• this window base (s) makes it possible to serve as a bearing surface and to concentrate the manual force transmitted by the finger (s) (thumb) on the molded body towards the less wide zones of the shoulder straps and thus facilitate the breakage of these.
• the window base (s) can thus help the operator at the point of sale to extract the SIM.
• the separating means 21 may comprise another frame 23 placed on the other side of the master support film comprising an opening 27 for each device (here two).
• This second frame is positioned on the other side of the support film so as to sandwich and pinch the support-master film 1 substantially around a pair 4A cards to extract on a contour passing near the shoulder straps or passing on the shoulder straps preferably.
• the intermediate device 2A is extracted but it can also be a device 4A completed.
• the current feed tracks 3 can reach the edge of the device.
• the device may comprise M1 marks corresponding to the residual portion of the ramp after separation.
• the Ml mark may comprise concave portions 24 or "V" on either side of the broken zone 25.
• the card 4A made with an insulating support under the contact pads 10, can comprise, after separation by rupture, a mark Ml corresponding to each strap and located at the level of the dielectric film 7.
• Each mark may be associated or accompanied by a profile corresponding to a thinning or stress concentration according to one of the weakening means of Figures 3A-3E.
• the devices or housings 4A here have the form of mini cards 4A, 4B with electrical contacts 10 flush with their main surface.
• the molding material or resin constituting the insulating body 20 of the card or device comprises a face that may lie at the same external level as the contact pads 10 for the device 4B. It may be useful to extract an electrical device or module at an unfinished intermediate stage, for example as the devices 2A-3A (FIGS 1B, 1D) including in particular a communication interface and / or power supply and / or interconnection 10 to perform subsequent assembly operations in a machine accepting a module format after cutting.
• the invention makes it possible to eliminate the step of separating the device internally;
• the manufacture of mini-SIM cards is considerably simplified, especially since in the current method with module encarte miniaturization makes this separation step more and more critical and complex.
• the coil format of the devices offers a very economical delivery package to the customer. It's a string of mini-cards in roll that the mobile operator separates manually to sell to the customer.
• the roller may be associated with the frames 26 and / or 27 mounted on the tape automatically to facilitate the separation of the devices.
• These frames can be assembled together and / or slide along the Y axis perpendicular to the surface of the ribbons to pinch the support film. The assembled assembly is slidable along the master support film 1.
• the master backing film 1 is determined with a plurality of devices 24, 4A; However, the invention can be applied to a master support film comprising a single device.
• the carrier film may also be in the form of a carrier film plate having a plurality of devices rather than a film reel.
• metal braces has disadvantages (copper deforms and does not break as well as straps film).
• the invention may nevertheless consider it, for example for a less rigorous use of the devices or non-standardized result.
• metal straps is the same idea of the invention is to extract the devices manually directly from the master film support (lead frame) it is entirely metallic or with insulating dielectric support film.
• Embodiments which may include, for the most part, at least one sling are described below.
• metal extending a contact pad and may have a shape substantially as in Figure 3B in top view. Although this is not the preferred mode of the invention because of the difficulties of manual separation of copper.
• the invention could be applied to an entirely metallic master support film without insulating support film. If necessary, a greater withdrawal R may be provided for possible burrs at metal shoulder straps and / or predetermined lines of rupture more elaborate / calibrated.
• straps can be provided whose arrangement and configuration around the device allows a rotation of the device around the strap (metal or not). It would therefore be a rotational movement for example in one direction and in the opposite opposite that would allow a breakage of the material of the strap (metal or other) exceeding the elastic limit of the material (as an alternating manual movement for a break of a wire).
• the invention can provide at least one metal shoulder strap and two points or provisional holding bridges easily detachable as for example, two points of silicone adhesive (or other similar adhesive means mentioned above) arranged around the device to define a plane passing through the points and the strap.
• two metal straps arranged, in particular on the sides are retained. distinct from the device preferably substantially facing one another (on a fictitious line perpendicular to the sides). If necessary, a third adhesive holding point is disposed on a separate side of the two previous ones.
• the shoulder straps can be arranged and configured to allow a break of strap (small or wider) by a manual rotation of the device around an axis passing through each ramp concerned.
• the axis of rotation may correspond substantially to a line of attachment of the device 24, 4A to the master support film 1 being parallel to an edge of the device.
• the invention can therefore generally provide at least one metal strap broken by movement (especially manual) of rotation or torsion of the material of the strap by tilting and / or rotation of the device in particular at its predetermined zone / line of rupture around a fictitious axis passing through the ramp and / or a plane of the master support film.
• the device comprising at least one strap capable of being broken by rotation or torsion (in particular alternating), can be held in place in the master support film by at least this strap on the one hand and by jamming at the level of at least one other side of the device on the other hand.
• the master media film reel containing a plurality of finished devices may be packaged with a polymer tape, paper or other protective material and / or or holding coiled at the same time interposed (preferably) on the contact pads, between the wound devices and which can help keep the devices in place.
• This ribbon can be slightly adhesive.

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• Engineering & Computer Science (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Physics & Mathematics (AREA)
• General Physics & Mathematics (AREA)
• Theoretical Computer Science (AREA)
• Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

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Publications (1)

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• 2012
  • 2012-11-30 EP EP12306500.5A patent/EP2738714A1/de not_active Withdrawn
• 2013
  • 2013-11-26 EP EP13799258.2A patent/EP2926299A1/de not_active Ceased
  • 2013-11-26 WO PCT/EP2013/074753 patent/WO2014083002A1/fr active Application Filing

Non-Patent Citations (2)

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