EP2848100A1 - Printed circuit board comprising a via - Google Patents

Printed circuit board comprising a via

Info

Publication number
EP2848100A1
EP2848100A1 EP12770294.2A EP12770294A EP2848100A1 EP 2848100 A1 EP2848100 A1 EP 2848100A1 EP 12770294 A EP12770294 A EP 12770294A EP 2848100 A1 EP2848100 A1 EP 2848100A1
Authority
EP
European Patent Office
Prior art keywords
printed circuit
circuit board
conductive layer
board
access structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP12770294.2A
Other languages
German (de)
French (fr)
Inventor
Jean-Marie Bariller
Keith VAN LIERE
Thomas Koepp
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Johnson Controls Automotive Electronics SAS
Original Assignee
Johnson Controls Automotive Electronics SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Johnson Controls Automotive Electronics SAS filed Critical Johnson Controls Automotive Electronics SAS
Publication of EP2848100A1 publication Critical patent/EP2848100A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2812—Checking for open circuits or shorts, e.g. solder bridges; Testing conductivity, resistivity or impedance
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2818—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP] using test structures on, or modifications of, the card under test, made for the purpose of testing, e.g. additional components or connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/099—Coating over pads, e.g. solder resist partly over pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3485—Application of solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres

Definitions

  • the present invention relates to a printed circuit board comprising at least one board with a printed circuit and a via and a probe access structure, which is in electrical contact with the via.
  • a printed circuit board comprising at least one board with a printed circuit and a via and a probe access structure, which is in electrical contact with the via, wherein one end region of the via is provided with a conductive layer which is in electrical contact with the probe access structure.
  • the present invention relates to a printed circuit board with at least one board on which a printed circuit is provided and a via, i.e. a through hole with a plated surface, which is electrically conductive.
  • the via may be provided at one board, for example to connect printed circuits on both surfaces of the board and/or can be an inter-board-connection, in case the inventive printed circuit board comprises a multitude of boards with printed circuits on one or both of its surfaces.
  • the via has a tube-like cross-section, more preferably with a circular diameter.
  • the via is made of an electrically conductive material, for example copper.
  • the via comprises in one, more preferably in both, of its end- region(s) a conductive pad, respectively.
  • the person skilled in the art understands that the present invention is not restricted to a certain PCB-techiiology, but applicable to all existing PCB technologies.
  • the amount of printed circuits is larger than two but has no upper limit.
  • the inner volume of the via is filled with a filling, more preferably with an electrically conductive or non conductive material.
  • one end region is provided with an electrically conductive layer, which is in electrical contact with the via.
  • the conductive layer covers the end region of the via at least partially.
  • the conductive layer is preferably connected to the conductive pad of the via.
  • the conductive layer is a plate, for example a copper-plate, which more preferably covers the inner cross section of the via.
  • the plate and the via both have a circular diameter and are both concentrically aligned.
  • the conductive layer is provided with a probe access structure, for example a- bead.
  • a probe can be electrically connected with this structure to examine the printed circuit on at least one board.
  • the bead is placed in the center of the conductive layer.
  • the bead has a convex shape.
  • Figure 1 shows the inventive printed circuit board.
  • Figure 2 shows the inventive printed circuit board connected to a probe.
  • Figure 1 shows the inventive printed circuit board 1 , which comprises at least two conductive layers for example printed circuits, on the top and bottom, but can contain additional internal conductive layers 4, which are separated by non conductive insulating material 3, respectively.
  • the conductive layers are electrically connected by a via 5, in the present case a through-hole in each board, in which a cylinder, made from an electrically conductive material, has been placed.
  • the cylinder comprises at both of its end regions 10 a conductive pad and its inner cross-section is preferably filled with a filling made from an electrically conductive or non-conductive material.
  • a conductive layer 7, here a plate, for example made of copper, has been placed.
  • a probe access structure 8 in the present case a bead, has been in place.
  • the bead is made of an electrically conductive material, for example leaded or non-leaded solder.
  • At least the top board is covered with a solder mask 2, whereas the probe access structure extends out of the solder mask 2.
  • the probe access structure 8 preferably has a convex shape. Since the probe access structure 8 is placed on the plate 7, which covers the inner cross-section of the via, the diameter of the via can be reduced and the via and the probe access structure 8 can be provided in the same region. Thus, an inventive printed circuit board with a very high density board can be accomplished.
  • Figure 2 shows the printed circuit board 1 according to figure 1.
  • the probe access structure 8 is in electrical contact with the probe 9.
  • the continuity between the boards can be checked.
  • non conductive material for example Epoxy and Glass tissue

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

The present invention relates to a printed circuit board (1) comprising at. least one board with a printed circuit and a via (5) and a probe access structure (8), which is in electrical contact with the via (5), wherein one end region (10) of the via (5) is provided with a conductive layer (7) which is in electrical contact with the probe access structure (8).

Description

PRINTED CIRCUIT BOARD COMPRISING A VIA
The present invention relates to a printed circuit board comprising at least one board with a printed circuit and a via and a probe access structure, which is in electrical contact with the via.
Such printed circuit boards are known from the state of the art, for example US 7,518,384 B2. The printed circuit board disclosed in this reference has, however, the disadvantage, that the via is rather space-consuming.
It was therefore the scope of the present invention to provide a printed circuit board that does not comprise the deficiencies according to the state of the art.
That problem is solved with a printed circuit board comprising at least one board with a printed circuit and a via and a probe access structure, which is in electrical contact with the via, wherein one end region of the via is provided with a conductive layer which is in electrical contact with the probe access structure.
The present invention relates to a printed circuit board with at least one board on which a printed circuit is provided and a via, i.e. a through hole with a plated surface, which is electrically conductive. The via may be provided at one board, for example to connect printed circuits on both surfaces of the board and/or can be an inter-board-connection, in case the inventive printed circuit board comprises a multitude of boards with printed circuits on one or both of its surfaces. Preferably, the via has a tube-like cross-section, more preferably with a circular diameter. The via is made of an electrically conductive material, for example copper. In a preferred embodiment, the via comprises in one, more preferably in both, of its end- region(s) a conductive pad, respectively.
The person skilled in the art understands that the present invention is not restricted to a certain PCB-techiiology, but applicable to all existing PCB technologies. The amount of printed circuits is larger than two but has no upper limit.
In a preferred embodiment, the inner volume of the via is filled with a filling, more preferably with an electrically conductive or non conductive material. According to the present invention, one end region is provided with an electrically conductive layer, which is in electrical contact with the via. The conductive layer covers the end region of the via at least partially. Preferably, there is an adhesive bond between the conductive layer and the via. The conductive layer is preferably connected to the conductive pad of the via. In a preferred embodiment, the conductive layer is a plate, for example a copper-plate, which more preferably covers the inner cross section of the via. Preferably, the plate and the via both have a circular diameter and are both concentrically aligned.
Furthermore, the conductive layer is provided with a probe access structure, for example a- bead. A probe can be electrically connected with this structure to examine the printed circuit on at least one board. Preferably, the bead is placed in the center of the conductive layer. Preferably, the bead has a convex shape.
The invention is now explained according to figures 1 and 2. These explanations do not limit the scope of protection.
Figure 1 shows the inventive printed circuit board.
Figure 2 shows the inventive printed circuit board connected to a probe.
Figure 1 shows the inventive printed circuit board 1 , which comprises at least two conductive layers for example printed circuits, on the top and bottom, but can contain additional internal conductive layers 4, which are separated by non conductive insulating material 3, respectively. The conductive layers are electrically connected by a via 5, in the present case a through-hole in each board, in which a cylinder, made from an electrically conductive material, has been placed. The cylinder comprises at both of its end regions 10 a conductive pad and its inner cross-section is preferably filled with a filling made from an electrically conductive or non-conductive material. At one of the end regions, a conductive layer 7, here a plate, for example made of copper, has been placed. Between the conductive layer 7 and the end region 10 of the via an adhesive, electrically conductive bond is provided. At the center of the conductive layer, a probe access structure 8, in the present case a bead, has been in place. The bead is made of an electrically conductive material, for example leaded or non-leaded solder. At least the top board is covered with a solder mask 2, whereas the probe access structure extends out of the solder mask 2. The probe access structure 8 preferably has a convex shape. Since the probe access structure 8 is placed on the plate 7, which covers the inner cross-section of the via, the diameter of the via can be reduced and the via and the probe access structure 8 can be provided in the same region. Thus, an inventive printed circuit board with a very high density board can be accomplished.
Figure 2 shows the printed circuit board 1 according to figure 1. The probe access structure 8 is in electrical contact with the probe 9. Thus, for example, the continuity between the boards can be checked.
List of reference signs:
1 printed circuit board
2 solder mask
3 non conductive material, for example Epoxy and Glass tissue
4 internal conductive layer, copper, printed circuit
5 via
6 filling
· ·· layer, conductive layer
8 probe access structure
9 probe
10 end region of the via

Claims

Claims:
1. Printed circuit board (1 ) comprising at. least one board with a printed circuit and a via (5) and a probe access structure (8), which is in electrical contact with the via, characterized in that one end region (10) of the via (5) is provided with a conductive layer (7) which is in electrical contact with the probe access structure.
2. Printed circuit board (1 ) according to claim 1 , characterized in that the via has a tubelike diameter.
3. Printed circuit board (1) according to claim 1 or 2, characterized in that a conductive pad is provided at the end region of the via (5).
4. Printed circuit board (1) according to claims 2 or 3, characterized in that the inner diameter of the via' is at least partially filled with a filling.
5. Printed circuit board (1) according to claim 4, characterized in that the filling is a conductive or non conductive material.
6. Printed circuit board (1 ) according to one of the preceding claims, characterized in that the conductive layer is a plate (7).
7. Printed circuit board (1) according to one of the preceding claims, characterized in that there is an adhesive bond between the conductive layer and the via.
8. Printed circuit board (1) according to one of the preceding claims, characterized in that the bead is placed in the center of the conductive layer.
EP12770294.2A 2012-05-07 2012-05-07 Printed circuit board comprising a via Withdrawn EP2848100A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2012/036764 WO2013169222A1 (en) 2012-05-07 2012-05-07 Printed circuit board comprising a via

Publications (1)

Publication Number Publication Date
EP2848100A1 true EP2848100A1 (en) 2015-03-18

Family

ID=47010705

Family Applications (1)

Application Number Title Priority Date Filing Date
EP12770294.2A Withdrawn EP2848100A1 (en) 2012-05-07 2012-05-07 Printed circuit board comprising a via

Country Status (3)

Country Link
EP (1) EP2848100A1 (en)
CN (1) CN104584697A (en)
WO (1) WO2013169222A1 (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000138104A (en) * 1998-08-26 2000-05-16 Yazaki Corp Inspection structure of circuit protection element
US20050285253A1 (en) * 2004-06-24 2005-12-29 Kumamoto Takashi Forming buried via hole substrates
US7518384B2 (en) 2005-01-31 2009-04-14 Agilent Technologies, Inc. Method and apparatus for manufacturing and probing test probe access structures on vias
US20070068701A1 (en) * 2005-09-26 2007-03-29 Microsoft Corporation Air trapped circuit board test pad via
JP2010010611A (en) * 2008-06-30 2010-01-14 Toshiba Corp Printed circuit board and electronic equipment

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO2013169222A1 *

Also Published As

Publication number Publication date
WO2013169222A1 (en) 2013-11-14
CN104584697A (en) 2015-04-29

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