EP2815207B1 - Method for measuring the distance between two objects - Google Patents
Method for measuring the distance between two objects Download PDFInfo
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- EP2815207B1 EP2815207B1 EP13708671.6A EP13708671A EP2815207B1 EP 2815207 B1 EP2815207 B1 EP 2815207B1 EP 13708671 A EP13708671 A EP 13708671A EP 2815207 B1 EP2815207 B1 EP 2815207B1
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- 238000000034 method Methods 0.000 title claims description 53
- 239000013078 crystal Substances 0.000 claims description 21
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 19
- 229910052710 silicon Inorganic materials 0.000 claims description 19
- 239000010703 silicon Substances 0.000 claims description 19
- 230000011514 reflex Effects 0.000 claims description 9
- 239000011159 matrix material Substances 0.000 claims description 2
- 238000006073 displacement reaction Methods 0.000 claims 2
- 239000000155 melt Substances 0.000 description 19
- 238000005259 measurement Methods 0.000 description 15
- 230000003287 optical effect Effects 0.000 description 10
- 239000013598 vector Substances 0.000 description 10
- 239000011521 glass Substances 0.000 description 7
- 238000011156 evaluation Methods 0.000 description 6
- 241000196324 Embryophyta Species 0.000 description 5
- 230000003595 spectral effect Effects 0.000 description 4
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- 230000005457 Black-body radiation Effects 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 240000006240 Linum usitatissimum Species 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
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- 230000005855 radiation Effects 0.000 description 1
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Images
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/14—Measuring arrangements characterised by the use of optical techniques for measuring distance or clearance between spaced objects or spaced apertures
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
- C30B15/20—Controlling or regulating
- C30B15/22—Stabilisation or shape controlling of the molten zone near the pulled crystal; Controlling the section of the crystal
- C30B15/26—Stabilisation or shape controlling of the molten zone near the pulled crystal; Controlling the section of the crystal using television detectors; using photo or X-ray detectors
Definitions
- the invention relates to a method for optically measuring the distance between an object which differs optically substantially and an object which is optically substantially reflective by means of a light line using at least one light source and at least one light receiver.
- Optical distance measuring methods such as laser distance measurements by means of interference or transit time measurement, light-section method or other triangulation methods are known.
- the light source and in relation to the light receiver must be positioned in a certain way to obtain sufficiently strong, evaluable light signals that allow a distance measurement.
- Light-section methods are known as metrological methods for measuring the height profile of surfaces along a projected light line and are used industrially for many applications. They are based on the principle of triangulation. For this it is necessary that the light source, light receiver and test sample form a triangle. The greater the angle between the optical axes of the transmitting. and receiving optics, the greater the height resolution of the measuring arrangement.
- the projected onto an object line of light undergoes a deformation by the surface contour of the object, which is recorded and evaluated with a camera as a light receiver. The greater the angle between the light source and the light receiver, the stronger the deformation of the light line in the light receiver is visible.
- the known light-section method is also dependent on that the surface of the object to be measured has sufficiently light-scattering properties, so that a part of the incident light on the surface of the object is diffused to the receiving camera.
- the surface is specular or specular in some areas, the specular reflection on the surface dominates there. This mirror reflex is in space do not meet the receiver optics, so that no usable signal hits the receiver.
- the conventional optical distance measuring methods are not usable when one of the objects has a reflective surface, while the other object scatters the light, as is the case, for example, in crystal pulling systems for producing monocrystalline silicon crystals, so-called ingots, where the distance between an im Essentially scattering object, a funnel surrounding the ingot, and a substantially specular object, a hot silicon melt to be measured.
- the publication US 2004/0095584 A1 describes a method and apparatus for measuring the distance of a nozzle from a specular sheet metal part.
- a laser light line is projected parallel to the sheet metal part and parallel to the nozzle edge on the nozzle.
- the laser light line lies exclusively on the scattering object of the nozzle.
- the invention has for its object to provide a measuring method, with which it is possible to measure the distance between a substantially scattering and a substantially specular object even under difficult geometrical and lighting conditions, such as crystal pulling process, the distance between a substantially.
- the line of light includes both at least a portion of the diffusing and at least a portion of the specular article, and both the light scattered at the diffusing object and the specular reflected light of the light line is evaluated and evaluated to determine the distance, the scattering at the diffusing object After reflection, the light reflected on the object to be mirrored and the light reflected at the specular object are picked up and evaluated after scattering on the scattering object.
- the present inventive method it is not necessary for the light source, the light receiver and the test sample to form a triangle.
- the deformation of the light line, ie the light section is not measured through the surface contour of the test sample.
- the distance between the light source and the light receiver is very small, or even paraxial, which can be achieved, for example, by a beam splitter which superimposes the optical axes of the light source and the light receiver. In the paraxial case, the optical axes of light source and light receiver coincide.
- the light line appears in this case from the perspective of Light receiver always as a straight line, no matter how pronounced the height profile of the object is, on which the light line hits.
- the inventive method is based on the fact that additional reflections occur by reflection on the specular object, which can then be evaluated in the image recorded by the light receiver. These additional reflections continue to geometrically separate as the distance between the scattering object and the specular object increases.
- a particularly advantageous embodiment of the method according to the invention consists in that the scattering object has a chamfer on the edge of the end facing the specular article and that the light scattered thereon is recorded and evaluated. This results in geometrically defined reflections and specular reflections of the guideline at the chamfer, which then allow a precise evaluation of the light receiver detected image, such as a camera image.
- the wavelength recording range of the light receiver is limited depending on the wavelength range of the light source, preferably by means of a bandpass filter.
- a preferably narrow-band wavelength range of the light receiver in the short-wave spectral range below 550 nm with preferably high intensity of the light source in this wavelength range has particular advantages. It has been found in connection with these measures that a black body radiation of the specular object, such as in a hot silicon source, can be damped very effectively, thereby dominating the light evaluated for the measurement in comparison to the filtered out black body radiation, resulting in simpler and more accurate spacing. Results in measurements.
- the light receiver is a digital or matrix or line scan camera.
- the method according to the invention can be used particularly advantageously in connection with crystal pulling systems in which the essentially scattering object is a funnel surrounding an ingot and the object which essentially reflects is a hot silicon melt.
- Monocrystalline silicon wafers are required for the production of monocrystalline silicon solar cells.
- the most important method for producing these wafers is that a monocrystalline ingot is slowly drawn from a hot silicon melt, for example by means of the so-called Czochralsky crystal pulling method. Due to the slow crystal growth, this process usually takes several days. The crystal is then cut to size and then sawn into wafers with sawing machines, which are then further processed to produce the solar cells.
- the Czochralsky crystal pulling process is a sensitive process that often leads to structural breakage of the crystal. Then the drawing process has to be aborted and started again. Process instabilities can also lead to crystal diameter fluctuations or to a quality-reducing increased number of defects in the crystal. Or the crystal has to be pulled at a slow pull rate due to process instabilities.
- Fig. 1 shows a section of a Czochralsky crystal pulling system with safety container 8, hot silicon melt 3 in a crucible 7, which can be moved vertically by a lifting device 6, a monocrystal (ingot) 2 during the drawing process, a funnel 1, which surrounds the crystal 2 cylindrically symmetric and with its lower edge up to a free distance d of a few millimeters reaches the melt 3.
- a light source 4 and a receiving camera 5 are arranged as close as possible next to each other and look through the same sight glass 9.
- Fig. 2 shows the same arrangement in the direction obliquely from above. Shown here is a light line 10 projected by the light source 4 and received by the camera 5, which includes both the lower edge of the funnel 1 and the part of the silicon melt 2 adjoining the funnel edge. The light cones from the light source 4 and to the camera 5 are also shown.
- FIGS. 3 to 7 The light reflections occurring in this arrangement, which are received and evaluated by the camera are in the FIGS. 3 to 7 shown schematically.
- the optical axes of light source 4 and receiver 5 are paraxial with parallel opposite direction vectors L and K of transmitted (illuminating) and received (reflected) light beams, the transmitted light beams being parallel, narrow Light beam (light line) and only parallel light, which is backscattered or reflected back in the same direction as the transmission beam, is received by the receiving camera 5.
- the light line 10 the irradiation direction L and the direction of arrival K of the light, and the normal vector of the funnel 1 along the line of incidence of the light line 10, all in the Lying on the drawing plane.
- Fig. 3 the funnel 1, the silicon melt 3 with a reflective surface 11 can be seen.
- the funnel 1 encloses an angle ⁇ with the normal vector on the silicon melt 3 and has a free distance d from the surface 11 of the silicon melt 3.
- the parallel light beam irradiated from the direction L forms a line in the plane of the drawing.
- This continuous light line 10 is here represented by seven light beams 13, 14, 15, 16, 17, 18, 19 (from left to right), the distance from beam 13 to beam 19 indicating the length of the light line.
- the extension of the light line 10 is assumed to be negligibly small.
- the irradiation direction L encloses an angle ⁇ with the normal vector on the surface 11 of the silicon melt 3.
- Fig. 4 For example, the point of impact of beam 13 on the hopper 1 is shown at which the light is scattered in all directions. Therefore, a part of the light of the beams 13, 14, 15 is scattered in the direction of silicon melt 3 and reflected there mirroring.
- the components of the light reflected there, which is reflected in direction K, are the beams 20, 21, 22 in FIG Fig. 4 , They are received by the camera 5 and are therefore visible in the camera image.
- This beam path is referred to below as L-TS-K (light source funnel-melt camera).
- the Reflex L-STS-K can be used for the evaluation, it is less suitable than the three other reflections because it is attenuated in intensity by the two-fold specular reflection on the melt 3 and has more interference due to the double reflection ,
- the funnel 1 itself leads to a partial shading of this beam path when the distance d is small. Therefore, this beam path will be disregarded below.
- Fig. 5 If the funnel angle ⁇ is greater than ⁇ , the reflexes L-TS-K and L-ST-K vanish completely. This is in Fig. 5 to see. In Fig. 5 is ⁇ > ⁇ . The rays 18 and 19 are no longer incident on the funnel 1. Also, the rays 20 and 21, as in Fig. 4 are shaded by the funnel 1. A measurement is not possible in this case.
- the position of the sight glasses 9 and the funnel angles are predetermined by the plant constructor or by the operator of the drawing plants. As a rule, this limits the possible angle ranges for ⁇ and ⁇ very strongly and makes a measurement possibly even impossible. Then the arrangement according to the invention can not be used.
- this problem can be solved according to the invention in a particularly advantageous embodiment in that a vertical chamfer 12 is ground to the funnel 1 at the lower edge. This is in Fig. 6 and enlarged in Fig. 7 shown. In Fig. 7 only the beam paths over this chamfer 12 are shown.
- the arrangement with bevel 13 on the hopper 1 is particularly advantageous because it creates stable and favorable geometric conditions and brightness conditions and makes the arrangement independent of the funnel angle of the hopper 1 and the position of the sight glasses.
- Fig. 8 shows enlarged the section with the light line 10 off Fig. 2 , but now exactly from the line of sight of the camera 5.
- a section of the funnel 1 is shown.
- the light line 10 is rotated in an advantageous manner and the lower edge of the hopper 1 has a chamfer of width F.
- the mirror image FR of the chamfer F on the surface 11 of the melt 3 is also shown.
- the distance between F and FR is proportional to 2d, where d is the distance between funnel 1 and melt 3, which is measured with the measuring arrangement.
- the section 30 of the light line illuminates the chamfer F and can be seen directly in the camera image.
- the beam paths L-ST-K, L-TS-K and LTK are offset laterally in the camera image, the offset being proportional to the distance d measured with the arrangement.
- the light line 10 is not rotated, that is parallel to the mirror plane 26 (or 27), there is no lateral splitting.
- the irradiated light line and the beam paths 28, 29 and 30 are then unfavorably along a line and partially to each other for a measurement.
- the measuring principles according to the invention described here remain valid even if the light source 4 and the camera 5 are not paraxial or even if they are clearly spaced from each other and thus enclose a large angle. This is e.g. then the case when light source 4 and camera 5 are attached to two separate sight glasses of the system. However, the geometric conditions and the evaluation of the beam paths in the camera image then become more complex.
- the measuring principles according to the invention described here remain valid even if the camera 5 and the light source 4 do not work with parallel beams, but, for example, the illuminating light line 10 has a beam divergence in the plane of the line. This is the case, for example, when a laser with initially parallel beam is used as the light source 4 and this beam is then uniaxially widened to a diverging light line by means of a cylindrical lens.
- the measurement takes place in the short-wave spectral range, wherein the very intense and otherwise extremely disturbing thermal radiation of the silicon melt 3 is suppressed by a narrow-band bandpass filter in the camera 5.
- a narrow-band bandpass filter in the camera 5.
- this is a laser in the short-wave spectral range, preferably in the blue or violet spectral range, and a narrowband bandpass filter matching the laser wavelength used in the camera optics.
- a point of light scanning along a line can also be used.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
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- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Description
Die Erfindung betrifft ein Verfahren zum optischen Messen des Abstands zwischen einem optisch im Wesentlichen streuenden und einem optisch im Wesentlichen spiegelnden Gegenstand mittels einer Lichtlinie unter Verwendung wenigstens einer Lichtquelle und wenigstens einem Lichtempfänger.The invention relates to a method for optically measuring the distance between an object which differs optically substantially and an object which is optically substantially reflective by means of a light line using at least one light source and at least one light receiver.
Optische Abstands-Messverfahren, wie Laserabstandsmessungen mittels Interferenz oder Laufzeitmessung, Lichtschnittverfahren oder weitere Triangulationsverfahren sind bekannt. Um hierbei auswertbare Lichtsignale zu erhalten, muss die Lichtquelle und in Bezug hierzu der Lichtempfänger in bestimmter Weise positioniert werden, um ausreichend starke, auswertbare Lichtsignale zu erhalten, die eine Abstandsmessung ermöglichen.Optical distance measuring methods, such as laser distance measurements by means of interference or transit time measurement, light-section method or other triangulation methods are known. In order to obtain evaluable light signals in this case, the light source and in relation to the light receiver must be positioned in a certain way to obtain sufficiently strong, evaluable light signals that allow a distance measurement.
Lichtschnittverfahren sind als messtechnische Verfahren zur Messung des Höhenprofils von Oberflächen entlang einer projizierten Lichtlinie bekannt und für viele Anwendungen industriell im Einsatz. Sie basieren auf dem Prinzip der Triangulation. Hierfür ist es nötig, dass Lichtquelle, Lichtempfänger und Messprobe ein Dreieck bilden. Je größer der Winkel zwischen den optischen Achsen der Sende-. und Empfangsoptik ist, desto größer ist die Höhenauflösung der Messanordnung. Die auf einen Gegenstand projizierte Lichtlinie erfährt durch die Oberflächenkontur des Gegenstandes eine Deformation, welche mit einer Kamera als Lichtempfänger aufgenommen und ausgewertet wird. Je größer der Winkel zwischen Lichtquelle und dem Lichtempfänger ist, desto stärker ist die Verformung der Lichtlinie in dem Lichtempfänger sichtbar. Das bekannte Lichtschnittverfahren ist außerdem darauf angewiesen, dass die Oberfläche des zu vermessenden Gegenstandes hinreichend lichtstreuende Eigenschaften hat, so dass ein Teil des auf die Oberfläche des Gegenstands auftreffenden Lichts zur Empfangskamera diffus gestreut wird. Ist die Oberfläche jedoch spiegelnd oder in Teilbereichen spiegelnd, so dominiert dort der spiegelnde Glanzreflex an der Oberfläche. Dieser Spiegelreflex wird im All gemeinen nicht auf die Empfangsoptik treffen, so dass kein verwertbares Signal auf den Empfänger trifft.Light-section methods are known as metrological methods for measuring the height profile of surfaces along a projected light line and are used industrially for many applications. They are based on the principle of triangulation. For this it is necessary that the light source, light receiver and test sample form a triangle. The greater the angle between the optical axes of the transmitting. and receiving optics, the greater the height resolution of the measuring arrangement. The projected onto an object line of light undergoes a deformation by the surface contour of the object, which is recorded and evaluated with a camera as a light receiver. The greater the angle between the light source and the light receiver, the stronger the deformation of the light line in the light receiver is visible. The known light-section method is also dependent on that the surface of the object to be measured has sufficiently light-scattering properties, so that a part of the incident light on the surface of the object is diffused to the receiving camera. However, if the surface is specular or specular in some areas, the specular reflection on the surface dominates there. This mirror reflex is in space do not meet the receiver optics, so that no usable signal hits the receiver.
In einigen Anwendungsfällen ist die Anwendung dieser herkömmlichen Verfahren zur Bestimmung des Abstands zwischen zwei Gegenständen dann nicht möglicht, wenn aufgrund spezieller geometrischer Verhältnisse keine auswertbaren Signale oder nur unspezifische Signale zur Bestimmung des Abstands zwischen einem im Wesentlichen streuenden Gegenstands und einem im Wesentlichen spiegelnden Gegenstands zu erhalten sind.In some applications, the application of these conventional methods for determining the distance between two objects is not possible if due to specific geometrical conditions no evaluable signals or only non-specific signals for determining the distance between a substantially scattering object and a substantially specular object are.
Beispielsweise sind die herkömmlichen optischen Abstandsmessverfahren nicht verwendbar, wenn einer der Gegenstände eine spiegelnde Oberfläche aufweist, während der andere Gegenstand das Licht streut, wie dies beispielsweise bei Kristallziehanlagen zur Herstellung monokristalliner Siliziumkristalle, sogenannter Ingots, der Fall ist, bei denen der Abstand zwischen einem im Wesentlichen streuenden Gegenstand, einem den Ingot umgebenden Trichter, und einem im Wesentlichen spiegelnden Gegenstand, einer heißen Siliziumschmelze, gemessen werden soll.For example, the conventional optical distance measuring methods are not usable when one of the objects has a reflective surface, while the other object scatters the light, as is the case, for example, in crystal pulling systems for producing monocrystalline silicon crystals, so-called ingots, where the distance between an im Essentially scattering object, a funnel surrounding the ingot, and a substantially specular object, a hot silicon melt to be measured.
Aus den Druckschriften
Die Druckschrift
Der Erfindung liegt die Aufgabe zugrunde, ein Messverfahren anzugeben, mit dem es auch unter schwierigen geometrischen und lichttechnischen Gegebenheiten, wie beispielsweise bei Kristallziehverfahren, möglich ist, den Abstand zwischen einem im Wesentlichen streuenden und einem im Wesentlichen spiegelnden Gegenstand genau zu messen.The invention has for its object to provide a measuring method, with which it is possible to measure the distance between a substantially scattering and a substantially specular object even under difficult geometrical and lighting conditions, such as crystal pulling process, the distance between a substantially.
Diese Aufgabe wird erfindungsgemäß mit einem Verfahren nach Anspruch 1 gelöst. Vorteilhafte Weiterbildungen der Erfindung sind Gegenstand der abhängigen Ansprüche. Die Lichtlinie schließt sowohl wenigstens einen Bereich des streuenden als auch wenigstens einen Bereich des spiegelnden Gegenstands ein und sowohl das am streuenden Gegenstand gestreute als auch das am spiegelnden Gegenstand gespiegelte Licht der Lichtlinie wird aufgenommen und zur Bestimmung des Abstands ausgewertet, wobei das am streuenden Gegenstand gestreute Licht nach Spiegelung am spiegelnden Gegenstand und das am spiegelnden Gegenstand gespiegelte Licht nach Streuung am streuenden Gegenstand aufgenommen und ausgewertet wird.This object is achieved by a method according to claim 1. Advantageous developments of the invention are the subject of the dependent claims. The line of light includes both at least a portion of the diffusing and at least a portion of the specular article, and both the light scattered at the diffusing object and the specular reflected light of the light line is evaluated and evaluated to determine the distance, the scattering at the diffusing object After reflection, the light reflected on the object to be mirrored and the light reflected at the specular object are picked up and evaluated after scattering on the scattering object.
Beim hier vorliegenden, erfindungsgemäßen Verfahren ist es im Gegensatz zu bekannten Lichtschnittverfahren, welche auf dem Prinzip der Triangulation beruhen, nicht notwendig, dass Lichtquelle, Lichtempfänger und Messprobe ein Dreieck bilden. Es wird bei dem erfindungsgemäßen Verfahren nicht die Verformung der Lichtlinie, also des Lichtschnitts, durch die Oberflächenkontur der Messprobe vermessen. Es ist im Gegenteil sogar vorteilhaft, wenn der Abstand zwischen Lichtquelle und Lichtempfänger sehr klein ist, oder diese sogar paraxial sind, was z.B. durch einen Strahlteiler erzielt werden kann, der die optischen Achsen der Lichtquelle und des Lichtempfängers überlagert. Im paraxialen Fall fallen die optischen Achsen von Lichtquelle und Lichtempfänger zusammen. Die Lichtlinie erscheint in diesem Fall aus der Perspektive des Lichtempfängers immer als Gerade, egal wie ausgeprägt das Höhenprofil des Gegenstandes ist, auf das die Lichtlinie auftrifft. Das erfindungsgemäße Verfahren beruht darauf, dass durch Spiegelung am spiegelnden Gegenstand zusätzliche Reflexe auftreten, die dann im vom Lichtempfänger aufgenommenen Bild ausgewertet werden können. Diese zusätzlichen Reflexe trennen sich geometrisch umso weiter auf, je größer der Abstand des streuenden Gegenstands vom spiegelnden Gegenstand ist.In contrast to known light-slit methods, which are based on the principle of triangulation, in the present inventive method it is not necessary for the light source, the light receiver and the test sample to form a triangle. In the method according to the invention, the deformation of the light line, ie the light section, is not measured through the surface contour of the test sample. On the contrary, it is even advantageous if the distance between the light source and the light receiver is very small, or even paraxial, which can be achieved, for example, by a beam splitter which superimposes the optical axes of the light source and the light receiver. In the paraxial case, the optical axes of light source and light receiver coincide. The light line appears in this case from the perspective of Light receiver always as a straight line, no matter how pronounced the height profile of the object is, on which the light line hits. The inventive method is based on the fact that additional reflections occur by reflection on the specular object, which can then be evaluated in the image recorded by the light receiver. These additional reflections continue to geometrically separate as the distance between the scattering object and the specular object increases.
Eine besonders vorteilhafte Ausführungsform des erfindungsgemäßen Verfahrens besteht darin, dass der streuende Gegenstand am Rand des dem spiegelnden Gegenstand zugewandten Endes eine Fase aufweist und dass das daran gestreute Licht aufgenommen und ausgewertet wird. Dadurch ergeben sich geometrisch definierte Reflexe und Spiegelreflexe der Leitlinie an der Fase, welche dann eine präzise Auswertung des vom Lichtempfänger ermittelten Bildes, beispielsweise eines Kamerabildes, erlauben.A particularly advantageous embodiment of the method according to the invention consists in that the scattering object has a chamfer on the edge of the end facing the specular article and that the light scattered thereon is recorded and evaluated. This results in geometrically defined reflections and specular reflections of the guideline at the chamfer, which then allow a precise evaluation of the light receiver detected image, such as a camera image.
Vorteilhaft ist es darüber hinaus, die Lichtlinie schräg zur Vertikalen zu verdrehen. Dadurch sind die auftretenden Reflexe und Spiegelreflexe horizontal zueinander versetzt und erleichtern die Auswertung des vom Lichtempfänger ermittelten Bildes durch diese geometrische Trennung.It is also advantageous to rotate the light line obliquely to the vertical. As a result, the occurring reflections and mirror reflections are offset from one another horizontally and facilitate the evaluation of the image determined by the light receiver through this geometric separation.
Sehr vorteilhaft ist es gemäß einer weiteren Ausführungsform der Erfindung, wenn die Lichtquelle Licht in einem vorgegebenen Wellenbereich, vorzugsweise in einem violetten, blauen und/oder grünen Wellenlängenbereich emittiert. Vorteilhafterweise wird dabei der Wellenlängen-Aufnahmebereich des Lichtempfängers in Abhängigkeit vom Wellenlängenbereich des von der Lichtquelle, vorzugsweise mittels eines Bandpassfilters, begrenzt. Ein vorzugsweise schmalbandiger Wellenlängenbereich des Lichtempfängers im kurzwelligen Spektralbereich unterhalb 550 nm bei vorzugsweise hoher Intensität der Lichtquelle in diesem Wellenlängenbereich hat besondere Vorteile. Es wurde in Zusammenhang mit diesen Maßnahmen festgestellt, dass eine Schwarzkörperstrahlung des spiegelnden Gegenstands, wie etwa bei einer heißen Siliziumquelle, sehr effektiv gedämpft werden kann und dadurch das für die Messung ausgewertete Licht im Vergleich zur ausgefilterten Schwarzkörperstrahlung dominiert, was zu einfacheren und genaueren Abstands-Messergebnissen führt.It is very advantageous according to a further embodiment of the invention, when the light source emits light in a predetermined wavelength range, preferably in a violet, blue and / or green wavelength range. Advantageously, the wavelength recording range of the light receiver is limited depending on the wavelength range of the light source, preferably by means of a bandpass filter. A preferably narrow-band wavelength range of the light receiver in the short-wave spectral range below 550 nm with preferably high intensity of the light source in this wavelength range has particular advantages. It has been found in connection with these measures that a black body radiation of the specular object, such as in a hot silicon source, can be damped very effectively, thereby dominating the light evaluated for the measurement in comparison to the filtered out black body radiation, resulting in simpler and more accurate spacing. Results in measurements.
Vorzugsweise ist der Lichtempfänger eine Digital- bzw. Matrix oder Zeilenkamera.Preferably, the light receiver is a digital or matrix or line scan camera.
Um nicht nur den Abstand, sondern auch die Schieflage zwischen den streuenden und spiegelnden Gegenständen zu ermitteln, ist es vorteilhaft, den Abstand an wenigstens zwei zwischen den Gegenständen gewählten Stellen zu bestimmen.In order to determine not only the distance but also the skew between the scattering and reflecting objects, it is advantageous to determine the distance to at least two locations selected between the objects.
Das erfindungsgemäße Verfahren ist besonders vorteilhaft in Zusammenhang mit Kristallziehanlagen anwendbar, bei denen der im Wesentlichen streuende Gegenstand ein einen Ingot umgebender Trichter und der im Wesentlichen spiegelnde Gegenstand eine heiße Siliziumschmelze ist.The method according to the invention can be used particularly advantageously in connection with crystal pulling systems in which the essentially scattering object is a funnel surrounding an ingot and the object which essentially reflects is a hot silicon melt.
Zur Herstellung von monokristallinen Siliziumsolarzellen werden monokristalline Siliziumwafer benötigt. Das wichtigste Verfahren zur Herstellung dieser Wafer besteht darin, dass ein monokristalliner Ingot beispielsweise mittels des sogenannten Czochralsky-Kristallziehverfahrens langsam aus einer heißen Siliziumschmelze gezogen wird. Durch das langsame Kristallwachstum dauert dieser Prozess üblicherweise mehrere Tage. Anschließend wird der Kristall zugeschnitten und dann mit Sägemaschinen in Wafer zersägt, die dann zur Herstellung der Solarzellen weiterverarbeitet werden.Monocrystalline silicon wafers are required for the production of monocrystalline silicon solar cells. The most important method for producing these wafers is that a monocrystalline ingot is slowly drawn from a hot silicon melt, for example by means of the so-called Czochralsky crystal pulling method. Due to the slow crystal growth, this process usually takes several days. The crystal is then cut to size and then sawn into wafers with sawing machines, which are then further processed to produce the solar cells.
Der Czochralsky-Kristallziehprozess ist ein empfindlicher Prozess, bei dem es häufig zum Strukturbruch des Kristalls kommt. Dann muss der Ziehprozess abgebrochen und von neuem begonnen werden. Auch kann es durch Prozessinstabilitäten zu Durchmesserschwankungen des Kristalls oder zu einer qualitätsmindernden erhöhten Anzahl von Fehlstellen im Kristall kommen. Oder der Kristall muss aufgrund von Prozessinstabilitäten mit einer niedrigen Ziehgeschwindigkeit gezogen werden.The Czochralsky crystal pulling process is a sensitive process that often leads to structural breakage of the crystal. Then the drawing process has to be aborted and started again. Process instabilities can also lead to crystal diameter fluctuations or to a quality-reducing increased number of defects in the crystal. Or the crystal has to be pulled at a slow pull rate due to process instabilities.
Für den Kristallziehprozess ist es besonders wichtig, in der Czochralsky-Anlage thermisch stabile Verhältnisse der heißen Siliziumschmelze und des Luftraums über der Schmelze während des Ziehprozesses zu gewährleisten. Dies ist wichtig, um einen Strukturbruch des Monokristalls zu verhindern, sowie um die Ziehgeschwindigkeit des Kristalls maximieren zu können und um einen möglichst konstanten Durchmesser des Ingots über die Höhe zu bekommen. Zur Erzielung einer verbesserten Stabilität der Temperaturverteilung in der Czochralsky -Anlage werden meist trichterförmige Einsätze verwendet, die den Ingot zylindersymmetrisch umschließen und die mit der Unterkante des Trichters möglichst nahe an die Schmelze heranreichen. Die Kontrolle des Abstandes der Trichterunterkante von der Schmelze ist dabei ein wichtiger Prozessparameter. Es ist jedoch schwierig diesen Abstand präzise zu kontrollieren und zu regeln. Dieser Abstand sollte sehr klein sein, ohne die Schmelze zu berühren und er sollte während des Ziehprozesses konstant gehalten, oder eventuell sogar während des Ziehprozesses in einer vordefinierten Weise verändert werden. Für die Einhaltung der gewünschten Abstände zwischen Trichter und Schmelze bzw. der Abstandsregelung ist das erfindungsgemäße Verfahren besonders gut geeignet.For the crystal pulling process, it is particularly important to ensure thermally stable conditions of the hot silicon melt and the air space above the melt during the drawing process in the Czochralsky plant. This is important in order to prevent a break in the structure of the monocrystal, in order to be able to maximize the pulling speed of the crystal and to obtain as constant a diameter of the ingot as possible over the height. In order to achieve an improved stability of the temperature distribution in the Czochralsky plant mostly funnel-shaped inserts are used, which surround the ingot cylindrically symmetric and which reach with the lower edge of the funnel as close as possible to the melt. The control of the distance of the lower edge of the funnel from the melt is an important Process parameters. However, it is difficult to precisely control and regulate this distance. This distance should be very small without touching the melt and should be kept constant during the drawing process, or possibly even changed in a predefined manner during the drawing process. For the maintenance of the desired distances between funnel and melt or the distance control method of the invention is particularly well suited.
Mit den herkömmlichen optischen Messverfahren ist die Abstandsmessung deshalb schwierig, weil lediglich ein Einblick über Schaugläser aus ungünstiger Perspektive von schräg oben, noch dazu in einem sehr steilen Winkel, in die Kammer mit der Schmelze möglich ist, und weil die hohen Temperaturen und das Eigenleuchten der Schmelze bei ca. 1500°C eine optische Messung enorm erschweren. Mit dem erfindungsgemäßen Verfahren werden diese Schwierigkeit und Einschränkungen überwunden.With the conventional optical measuring methods, the distance measurement is difficult, because only an insight on sight glasses from an unfavorable perspective from obliquely above, even at a very steep angle, in the chamber with the melt is possible, and because the high temperatures and the self-luminous Melting at about 1500 ° C make an optical measurement enormously difficult. With the method according to the invention, this difficulty and limitations are overcome.
Das erfindungsgemäße Verfahren sowie dessen Vorteile wird bzw. werden nachfolgend anhand einer Kristallziehanlage als Ausführungsbeispiel im Einzelnen erläutert. Es zeigen:
- Fig. 1
- eine schematische Querschnittsdarstellung einer Czochralsky-Kristallziehanlage;
- Fig. 2
- die in
Fig. 1 dargestellte Anlage in perspektivischer Darstellung; - Fig. 3 bis 5
- schematische Lichtstrahlverläufe zur Erläuterung des erfindungsgemäßen Verfahrens;
- Fig. 6
- Strahlenverläufe im Falle einer besonderen Ausführungsform, bei der der Rand des streuenden Gegenstands, im vorliegenden Fall des Trichters, eine Fase aufweist;
- Fig. 7
- eine vergrößerte Darstellung der in
Fig. 6 gezeigten Ausführungsform mit schematischen Strahlverläufen; und - Fig. 8
- einen vergrößerten Ausschnitt aus
Fig. 2 in Blickrichtung des Lichtempfängers.
- Fig. 1
- a schematic cross-sectional view of a Czochralsky crystal pulling system;
- Fig. 2
- in the
Fig. 1 illustrated plant in perspective view; - Fig. 3 to 5
- schematic light beam courses for explaining the method according to the invention;
- Fig. 6
- Beam paths in the case of a particular embodiment in which the edge of the scattering article, in the present case of the funnel, has a chamfer;
- Fig. 7
- an enlarged view of in
Fig. 6 shown embodiment with schematic beam paths; and - Fig. 8
- an enlarged section
Fig. 2 in the direction of the light receiver.
Die bei dieser Anordnung auftretenden Lichtreflexe, die von der Kamera empfangen und ausgewertet werden, sind in den
Außerdem ist vereinfachend angenommen, dass die Lichtlinie 10, die Einstrahlrichtung L und die Empfangsrichtung K des Lichts, sowie der Normalenvektor des Trichters 1 entlang der Auftrefflinie der Lichtlinie 10, allesamt in der Zeichnungsebene liegen. Dies ist in
Senkrecht zur Zeichnungsebene ist die Ausdehnung der Lichtlinie 10 als vernachlässigbar klein angenommen. Die Einstrahlrichtung L schließt einen Winkel β mit dem Normalenvektor auf die Oberfläche 11 der Siliziumschmelze 3 ein.Perpendicular to the plane of the drawing, the extension of the
In den
In
Wie aus
- L-T-K (Lichtquelle-Trichter-Kamera)
- L-ST-K (Lichtquelle-Schmelze-Trichter-Kamera)
- L-TS-K (Lichtquelle-Trichter-Schmelze-Kamera)
- L-STS-K (Lichtquelle-Schmelze-Trichter-Schmelze-Kamera)
- LTK (light source funnel camera)
- L-ST-K (Light Source Melt Funnel Camera)
- L-TS-K (Light Source Funnel Melting Camera)
- L-STS-K (Light Source Melt Funnel Melting Camera)
Dabei kann der Reflex L-STS-K zwar für die Auswertung herangezogen werden, ist jedoch hierfür weniger geeignet als die drei anderen Reflexe, da er durch die zweimalige Spiegelreflexion an der Schmelze 3 in der Intensität abgeschwächt ist und durch die doppelte Spiegelung mehr Störungen hat. Außerdem führt der Trichter 1 selbst zu einer teilweisen Abschattung dieses Strahlgangs, wenn der Abstand d klein ist. Daher wird dieser Strahlengang im Folgenden außer acht gelassen.Although the Reflex L-STS-K can be used for the evaluation, it is less suitable than the three other reflections because it is attenuated in intensity by the two-fold specular reflection on the
Im Folgenden werden die geometrischen Eigenschaften und die Intensitätseigenschaften der drei Strahlengänge L-T-K, L-ST-K, L-TS-K betrachtet.
- L-T-K: Die Intensität des in
die Kamera 5 zurückgestreuten Signals wird durch die Streueigenschaften der Trichteroberfläche bestimmt. Wie inFig. 4 zu sehen ist, sind die Abstände der einlaufenden Strahlen 13, 14, 15 identisch mit den Abständen der indie Kamera 5 zurückgestreuten Strahlen. Die Strahlenbündel liegen aufeinander. Daher gibt es keine perspektivische Kompression oder Expansion des empfangenen Strahlenbündels gegenüber dem beleuchtenden Strahlenbündel. Sowohl das beleuchtende, als auch das empfangene Strahlenbündel schließen einen Winkel β + α mit dem Trichter 1 ein. - L-TS-K: Der Winkel des gestreuten Lichts mit dem Trichter 1 ist β - α, also sehr flach. Daher ist das zur Kamera reflektierte Lichtbündel perspektivisch um den Faktor sin(β-α)/sin(β+α) komprimiert, es erscheint im Kamerabild also verkürzt. Dies ist in
Fig. 4 daran zu sehen, dass die Strahlen 20, 21, 22 deutlich dichter beieinander liegen, als die Strahlen 13, 14, 15. - L-ST-K: Das Licht trifft nach Reflexion an
der Oberfläche 11der Schmelze 3 auf den Trichter 1 und schließt ebenfalls einen Winkel β - α mit dem Trichter 1 ein. Das unter dem Winkel β + α indie Kamera 5 gestreute Licht ist daher um den Faktor sin(β+α)/sin(β-α) perspektivisch verlängert. Dies ist inFig. 3 an den weit auseinander liegenden Auftreffpunkten der ander Oberfläche 11der Schmelze 3 reflektierten Strahlen 18 und 19 auf dem Trichter 1 zu sehen. Dadurch erscheint dieses Linienstück im Kamerabild perspektivisch verlängert und dadurch seine Strahldichte bzw. Helligkeit im Kamerabild erheblich abgeschwächt.
- LTK: The intensity of the signal backscattered in the
camera 5 is determined by the scattering properties of the funnel surface. As inFig. 4 can be seen, the distances of the incoming rays 13, 14, 15 are identical to the distances of the backscattered into thecamera 5 rays. The bundles of rays lie on each other. Therefore, there is no perspective compression or expansion of the received beam with respect to the illuminating beam. Both the illuminating and the received beams include an angle β + α with the hopper 1. - L-TS-K: The angle of the scattered light with the funnel 1 is β - α, thus very flat. Therefore, the light beam reflected to the camera is perspectively compressed by the factor sin (β-α) / sin (β + α), so it appears shortened in the camera image. This is in
Fig. 4 to see that the beams 20, 21, 22 are significantly closer together than the beams 13, 14, 15. - L-ST-K: The light strikes the funnel 1 after reflection on the
surface 11 of themelt 3 and likewise encloses an angle β-α with the funnel 1. The light scattered into thecamera 5 at the angle β + α is therefore extended in perspective by the factor sin (β + α) / sin (β-α). This is inFig. 3 to see at the widely spaced impact points of reflected at thesurface 11 of themelt 3 rays 18 and 19 on the hopper 1. As a result, this line piece in the camera image appears to be extended in perspective and thus considerably attenuates its radiance or brightness in the camera image.
Je geringer die Winkeldifferenz β - α ist, desto ungünstiger sind also die geometrischen Verhältnisse und die Intensitätsverhältnisse für die Messung. Die perspektivische Kompression und Expansion von L-TS-K und von L-ST-K nehmen für kleine Werte β - α zu, und ihre Helligkeitsunterschiede im Kamerabild nehmen dann ebenfalls zu, was die Anforderungen an den Dynamikbereich der Kamera 5 erhöht.The smaller the angular difference β - α, the less favorable are the geometric conditions and the intensity ratios for the measurement. The perspective compression and expansion of L-TS-K and L-ST-K increase for small values β-α, and their brightness differences in the camera image then also increase, which increases the demands on the dynamic range of the
Ist der Trichterwinkel α größer als β, so verschwinden die Reflexe L-TS-K und L-ST-K ganz. Dies ist in
In der Praxis sind durch den Anlagenbauer oder durch den Betreiber der Ziehanlagen die Position der Schaugläser 9 und der Trichterwinkel vorgegeben. Dies schränkt die möglichen Winkelbereiche für α und β in der Regel sehr stark ein und macht eine Messung ggf. sogar unmöglich. Dann kann die erfindungsgemäße Anordnung nicht verwendet werden. Diese Problematik kann aber erfindungsgemäß in einer besonders vorteilhaften Ausführung dadurch behoben werden, dass an den Trichter 1 an der unteren Kante eine vertikale Fase 12 angeschliffen ist. Diese ist in
Für eine Auswertung der Strahlengänge L-T-K, L-ST-K und L-TS-K im Kamerabild ist es nötig, dass diese Strahlengänge im Kamerabild getrennt sind. In den
Die hier beschriebenen erfindungsgemäßen Messprinzipien bleiben auch dann gültig, wenn die Lichtquelle 4 und die Kamera 5 nicht paraxial sind oder wenn sie sogar deutlich voneinander beabstandet sind und damit einen großen Winkel einschließen. Dies ist z.B. dann der Fall, wenn Lichtquelle 4 und Kamera 5 an zwei getrennten Schaugläsern der Anlage angebracht werden. Die geometrischen Verhältnisse und die Auswertung der Strahlengänge im Kamerabild werden dann jedoch komplexer.The measuring principles according to the invention described here remain valid even if the light source 4 and the
Die hier beschriebenen erfindungsgemäßen Messprinzipien bleiben weiterhin auch dann gültig, wenn die Kamera 5 und die Lichtquelle 4 nicht mit parallelen Strahlen arbeiten, sondern beispielsweise die beleuchtende Lichtlinie 10 eine Strahldivergenz in der Ebene der Linie aufweist. Dies ist beispielsweise dann der Fall, wenn als Lichtquelle 4 ein Laser mit zunächst parallelem Strahl verwendet wird und dieser Strahl dann mittels einer Zylinderlinse einachsig zu einer divergierenden Lichtlinie aufgeweitet wird.The measuring principles according to the invention described here remain valid even if the
In einer vorteilhaften erfindungsgemäßen Ausführungsform erfolgt die Messung im kurzwelligen Spektralbereich, wobei die sehr intensive und andernfalls außerordentlich störende Wärmestrahlung der Siliziumschmelze 3 durch einen schmalbandigen Bandpassfilter in der Kamera 5 unterdrückt wird. Vorteilhafterweise wird hierfür ein Laser im kurzwelligen Spektralbereich, vorzugsweise im blauen oder violetten Spektralbereich, und ein zur Laserwellenlänge passender schmalbandiger Bandpassfilter in der Kameraoptik verwendet.In an advantageous embodiment of the invention, the measurement takes place in the short-wave spectral range, wherein the very intense and otherwise extremely disturbing thermal radiation of the
Erfindungsgemäß kann statt der Lichtlinie auch ein entlang einer Linie scannender Lichtpunkt verwendet werden.According to the invention, instead of the light line, a point of light scanning along a line can also be used.
Das erfindungsgemäße Verfahren wurde zuvor am Beispiel einer Kristallziehanlage beschrieben. Die Anwendung des erfindungsgemäßen Verfahrens ist jedoch nicht auf dieses Anwendungsbeispiel beschränkt, sondern auch in zahlreichen weiteren Anwendungsfällen zur Bestimmung der freien Abstände von wenigstens zwei Gegenständen unter speziellen und komplizierten geometrischen und anwendungstechnischen Verhältnissen mit Vorteil einsetzbar.The process according to the invention has been described above using the example of a crystal pulling apparatus. However, the application of the method according to the invention is not limited to this application example, but can also be used advantageously in numerous other applications for determining the free distances of at least two objects under special and complicated geometrical and applicational conditions.
Claims (10)
- Method for optically measuring the distance (d) between a substantially scattering object (1, T) and a substantially reflecting object (3, S) by means of a line of light (10) using at least one light source (4) and at least one light receiver (5), wherein the line of light (10) includes at least one region of the scattering object (1) and also at least one region of the reflecting object (3), characterized in that both a part-section of the line of light (10), which is firstly scattered at the scattering object (1) and thereafter is reflected at the reflecting object (3) (light path light source L - funnel T - melt S - camera K), is captured, then a part-section of the line of light (10), which is firstly reflected at the reflecting object (3) and thereafter scattered at the scattering object (1) (light path light source L - melt S - funnel T - camera K), is captured, and a part-section of the line of light (10), which is scattered at the scattering object (1) (light path light source L - funnel T - camera K) is captured, wherein the three part-sections are imaged displaced to each other in the light receiver (5), and this displacement which is proportional to the distance (d), is determined.
- Method in accordance with claim 1, characterized in that the scattering object (1) has a chamfer (12) at the edge of the end thereof facing the reflecting object, and the light scattered thereat is captured.
- Method in accordance with claim 1 or 2, characterized in that the line of light (10) is rotated horizontally to each other to the displacement of the occurring reflexes and mirror reflexes.
- Method in accordance with any of the preceding claims, characterized in that the light source (4) emits light in a given wavelength range, preferably in a violet, blue and/or green wavelength range.
- Method in accordance with claim 4, characterized in that the wavelength capture range of the light receiver (5) is limited in dependence on the wavelength range of the light delivered by the light source, preferably by means of a bandpass filter.
- Method in accordance with claim 4 or 5, characterized in that the wavelength capture range of the light receiver (5) lies in a preferably narrow wavelength range smaller than 550 nm.
- Method in accordance with any of the preceding claims, characterized in that a linear scanning light spot is used as the line of light (10).
- Method in accordance with any of the preceding claims, characterized in that the light receiver (5) is a digital or matrix camera or a line camera.
- Method in accordance with any of the preceding claims, characterized in that the distance between the scattering (1) and the reflecting object (3) is determined at at least two different positions for the purposes of determining an inclination.
- Method in accordance with any of the preceding claims, characterized in that the scattering object (1) is a funnel surrounding an ingot and the reflecting object (3) is a hot silicon melt in a crystal pulling plant.
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DE102012003114.9A DE102012003114B4 (en) | 2012-02-16 | 2012-02-16 | METHOD OF MEASURING THE DISTANCE BETWEEN TWO OBJECTS |
PCT/EP2013/000457 WO2013120625A1 (en) | 2012-02-16 | 2013-02-15 | Method for measuring the distance between two objects |
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