EP2795658A1 - Homogeneous hipims coating method - Google Patents

Homogeneous hipims coating method

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Publication number
EP2795658A1
EP2795658A1 EP12812516.8A EP12812516A EP2795658A1 EP 2795658 A1 EP2795658 A1 EP 2795658A1 EP 12812516 A EP12812516 A EP 12812516A EP 2795658 A1 EP2795658 A1 EP 2795658A1
Authority
EP
European Patent Office
Prior art keywords
power
power pulse
pulse interval
generator
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP12812516.8A
Other languages
German (de)
French (fr)
Inventor
Siegfried Krassnitzer
Helmut Rudigier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oerlikon Surface Solutions AG Pfaeffikon
Original Assignee
Oerlikon Trading AG Truebbach
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oerlikon Trading AG Truebbach filed Critical Oerlikon Trading AG Truebbach
Publication of EP2795658A1 publication Critical patent/EP2795658A1/en
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3464—Operating strategies
    • H01J37/3467—Pulsed operation, e.g. HIPIMS
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3464—Sputtering using more than one target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3485—Sputtering using pulsed power to the target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3492—Variation of parameters during sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/542—Controlling the film thickness or evaporation rate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3417—Arrangements

Definitions

  • the present invention relates to a HIPIMS method with which homogeneous layers can be deposited over the height of a coating chamber.
  • the HIPIMS process is a physical coating process from the gas phase. More specifically, it is a magnetron-assisted sputtering method in which a very high discharge current density is imposed on the sputtering material-supplying target, so that a high electron density is generated in the plasma and the majority of the sputtered particles are ionized.
  • Power densities between 250W / cm2 and 2000W / cm2 are used and special demands are placed on the generator supplying the power. In particular, it is not possible to permanently affect such a performance on the target, as this would overheat and thus be damaged. The power must therefore be pulsed.
  • the very high, desired discharge densities occur and the target heats up.
  • the target can cool down again.
  • Pulse duration and pulse pause must be coordinated so that the average power applied to the target does not exceed a threshold value. For HIPIMS therefore generators are required, which are able to deliver pulsed very high performance.
  • the workpieces are often distributed over the entire usable coating height. Workpieces are both tools and other components. In many cases, it is important to coat the workpieces with the same layer thickness and with the same layers, whether at the top, in the middle or at the bottom. In particular, if, as in the HIPIMS process, plasmas and their density have a significant influence on the coating rate, this goal is difficult to achieve. One of the reasons for this is that the plasmas themselves are influenced by the surrounding environment, which can lead to different coating rates over the height of the coating chamber. Typically, DC sputtering attempts to compensate for this by adjusting the magnetic fields across the height.
  • the procedure is such that a PVD sputtering cathode comprising a first part cathode and a second part cathode is operated, wherein a maximum average power input is predetermined for the part cathodes and wherein the duration of the power pulse intervals are predetermined and the method comprises the following steps: a) Provision of a generator with a predetermined power output, preferably at least after switching on and after expiry of a power setup interval b) Turning on the generator c) Connecting the first part cathode to the generator, so that the The first partial cathode is supplied with power from the generator.
  • FIG. 1 shows a corresponding situation with 6 partial cathodes and 3 groups.
  • the object is now achieved by individually selecting the length of the individual power pulse intervals and thus achieving a desired coating thickness profile over the height of the coating chamber. That According to the invention, the magnetic fields are not adjusted over the height of the coating chamber, as usual, but the duration of the power pulse intervals. The same is shown in FIG. It can be seen that the power pulse interval connected to the first sub-cathode is significantly longer than the power pulse interval connected to the sub-cathode 5. Due to the longer power pulse interval, the average coating rate starting from the partial cathode 1 becomes longer than the average coating rate starting from the partial cathode 5.
  • the power pulse intervals of all the subcathodes are selected to be the same length, and so a first coating is made for calibration. Subsequently, the coating thicknesses are measured over the height of the coating chamber. If there are differences in the thicknesses, then where the layers are too small in comparison to the average thickness, the power pulse intervals are somewhat prolonged. Where the layers are too large compared to the average thickness, the power pulse intervals are somewhat shortened. By doing so, a balance is achieved, it being clear to the person skilled in the art that several iteration steps can be carried out to further improve the homogenization.

Abstract

The invention relates to a HIPIMS method by means of which homogeneous layers can be deposited over the height of a coating chamber. Two partial cathodes are used for said purpose. According to the invention, the length of the individual power pulse intervals applied to the partial cathodes is chosen individually and thus a required coating thickness profile over the height of the coating chamber is achieved.

Description

Homogenes HIPIMS-Beschichtungsverfahren  Homogeneous HIPIMS coating process
Die vorliegende Erfindung bezieht sich auf ein HIPIMS-Verfahren mit welchem über die Höhe einer Beschichtungskammer homogene Schichten abgeschieden werden können. Beim HIPIMS-Verfahren handelt es sich um ein physikalisches Beschichtungsverfahren aus der Gasphase. Genauer gesagt ist es ein Magnetron-unterstütztes Zerstäubungsverfahren bei dem das Zerstäubungsmaterial liefernde Target eine sehr hoher Entladungsstromdichte aufgezwungen wird, so dass im Plasma eine hohe Elektronendichte generiert wird und die Mehrheit der Zerstäubten Teilchen ionisiert werden. Dabei kommen Leistungsdichten zwischen 250W/cm2 und 2000W/cm2 zum Einsatz und an den die Leistung liefernden Generator sind somit besondere Anforderungen gestellt. Insbesondere ist es nicht möglich dauerhaft eine solche Leistung auf das Target einwirken zu lassen, da dieses überhitzen und somit Schaden nehmen würde. Die Leistung muss daher gepulst werden. Innerhalb des Leistungspulses kommt es zu den sehr hohen, gewünschten Entladungsdichten und das Target erhitzt sich. Während der Pulspause kann das Target wieder abkühlen. Pulsdauer und Pulspause müssen so aufeinander abgestimmt sein, dass die mittlere auf das Target eingebrachte Leistung nicht einen Schwellenwert übersteigt. Für HIPIMS werden daher Generatoren benötigt, welche in der Lage sind gepulst sehr hohe Leistungen abzugeben. The present invention relates to a HIPIMS method with which homogeneous layers can be deposited over the height of a coating chamber. The HIPIMS process is a physical coating process from the gas phase. More specifically, it is a magnetron-assisted sputtering method in which a very high discharge current density is imposed on the sputtering material-supplying target, so that a high electron density is generated in the plasma and the majority of the sputtered particles are ionized. Power densities between 250W / cm2 and 2000W / cm2 are used and special demands are placed on the generator supplying the power. In particular, it is not possible to permanently affect such a performance on the target, as this would overheat and thus be damaged. The power must therefore be pulsed. Within the power pulse, the very high, desired discharge densities occur and the target heats up. During the pulse break, the target can cool down again. Pulse duration and pulse pause must be coordinated so that the average power applied to the target does not exceed a threshold value. For HIPIMS therefore generators are required, which are able to deliver pulsed very high performance.
Wird das HIPIMS-Verfahren zur Beschichtung von Werkstücken eingesetzt, so sind die Werkstücke oftmals über die gesamte nutzbare Beschichtungshöhe verteilt. Mit Werkstücken sind sowohl Werkzeuge als auch andere Komponenten gemeint. In vielen Fällen ist es wichtig, auf den Werkstücken, egal ob oben, in der Mitte oder unten angeordnet, mit derselben Schichtdicke und mit denselben Schichten zu beschichten. Insbesondere wenn, wie beim HIPIMS-Verfahren, Plasmen und deren Dichte einen wesentlichen Einfluss auf die Beschichtungsrate haben, ist dieses Ziel nur schwer zu erreichen. Dies liegt unter anderem daran, dass die Plasmen selbst von dem sie umgebendem Umfeld beeinflusst werden, wodurch es über die Höhe der Beschichtungskammer zu unterschiedlichen Beschichtungsraten kommen kann. Üblicherweise wird beim DC-Sputtern versucht, dies durch die Anpassung der Magnetfelder über die Höhe ausgeglichen. Eingriffe in das Magnetsystem können aber lokal zu veränderten Plasmabedingungen führen, was wiederum zu unterschiedlichen Schichteigenschaften führt. Hohe Anforderungen an die Schichtdickenverteilung bedingen einen eingeschränkten Nutzungsbereich (und dadurch verringerte Wirtschaftlichkeit), da die Wirksamkeit der erwähnten Methode betreffend Verbesserung der Schichtdickenhomogenität beschränkt. Eine weitere Methode der If the HIPIMS process is used to coat workpieces, the workpieces are often distributed over the entire usable coating height. Workpieces are both tools and other components. In many cases, it is important to coat the workpieces with the same layer thickness and with the same layers, whether at the top, in the middle or at the bottom. In particular, if, as in the HIPIMS process, plasmas and their density have a significant influence on the coating rate, this goal is difficult to achieve. One of the reasons for this is that the plasmas themselves are influenced by the surrounding environment, which can lead to different coating rates over the height of the coating chamber. Typically, DC sputtering attempts to compensate for this by adjusting the magnetic fields across the height. However, interventions in the magnet system can locally lead to altered plasma conditions, which in turn leads to different layer properties. High demands on the layer thickness distribution require a limited range of use (and thus reduced economic efficiency), since the effectiveness of the mentioned method limits the improvement of the layer thickness homogeneity. Another method of
BESTÄTIGUNGSKOPIE Korrektur der Schichtdickenverteilung ist die Verwendung von Masken, was allerdings wenig praktikabel ist, falls sich die Beladung oder die Werkstückgeometrie ändert. CONFIRMATION COPY Correction of the layer thickness distribution is the use of masks, which, however, is not practical if the loading or the workpiece geometry changes.
Es wäre wünschenswert ein HIPIMS-Verfahren zur Verfügung zu haben, mit dem es in einfacher Weise möglich ist die Beschichtungsrate über die Höhe der Beschichtungskammer einzustellen und damit insbesondere eine homogene Beschichtung über die gesamte Kammerhöhe zu erreichen ohne nachteilige Beeinflussung der Plasmadichte und deren nachteiligen Auswirkungen auf die Schichteigenschaften. It would be desirable to have available a HIPIMS method with which it is possible in a simple manner to set the coating rate over the height of the coating chamber and thus in particular to achieve a homogeneous coating over the entire chamber height without adversely affecting the plasma density and its adverse effects the layer properties.
Dem liegt die Aufgabe der vorliegenden Erfindung zugrunde. This is the object of the present invention based.
Gemäss einem neuen Verfahren zur Bereitstellung von Leistungspulsen, welches im Rahmen einer anderen Patentanmeldung geschützt wird, wird so vorgegangen, dass eine PVD-Zerstäubungskathode, die eine erste Teilkathode und eine zweite Teilkathode umfasst betrieben wird, wobei für die Teilkathoden eine maximale mittlere Leistungsbeaufschlagung vorgegeben ist und wobei die Dauer der Leistungspulsintervalle vorgegeben werden und das Verfahren folgende Schritte umfasst a) Bereitstellen eines Generators mit vorgegebener vorzugsweise zumindest nach Anschalten und nach Ablauf eines Leistungsaufbauintervalls konstanter Leistungsabgabe b) Anschalten des Generators c) Anschluss der ersten Teilkathode an den Generator, so dass die erste Teilkathode mit Leistung vom Generator beaufschlagt wird d) Trennung des Generators von der ersten Teilkathode nach Ablauf eines vorgegebenen der ersten Teilkathode entsprechenden ersten Leistungspulsintervalls e) Anschluss der zweiten Teilkathode an den Generator so dass die zweite Teilkathode mit Leistung vom Generator beaufschlagt wird f) Trennung des Generators von der zweiten Teilkathode nach Ablauf eines vorgegebenen der zweiten Teilkathode entsprechenden zweiten Leistungspulsintervalls wobei das erste Leistungspulsintervall zeitlich vor dem zweiten Leistungspulsintervall beginnt und das erste Leistungspulsintervall zeitlich vor dem zweiten Leistungspulsintervall endet, und wobei die Schritte d) und e) so ausgeführt werden dass sich erstes Leistungspulsintervall und zweites Leistungspulsintervall zeitlich überlappen und alle Leistungspulsintervalle zusammen eine erste Gruppe bilden, so dass die Leistungsabgabe vom Generator durchgehend ohne Unterbrechung vom Anfang des ersten Leistungspulsintervalls bis zum Ende des zweiten Leistungspulsintervalls bestehen bleibt und es nicht zu einem zweiten Leistungsaufbauintervall kommt. Sind über die Höhe der Beschichtungskammer mehr als zwei Teilkathoden vorgesehen, so kann sich eine Gruppe aus mehr als zwei Leistungspulsintervallen zusammensetzten. Im Verfahren werden dann so viele Gruppen hintereinander geschalten, wie es den einzelnen Teilkathoden bezüglich Temperatureintrag zugemutet werde kann. Es schliesst sich dann eine Pause an. Figur 1 zeigt eine entsprechende Situation mit 6 Teilkathoden und 3 Gruppen. According to a new method for the provision of power pulses, which is protected in the context of another patent application, the procedure is such that a PVD sputtering cathode comprising a first part cathode and a second part cathode is operated, wherein a maximum average power input is predetermined for the part cathodes and wherein the duration of the power pulse intervals are predetermined and the method comprises the following steps: a) Provision of a generator with a predetermined power output, preferably at least after switching on and after expiry of a power setup interval b) Turning on the generator c) Connecting the first part cathode to the generator, so that the The first partial cathode is supplied with power from the generator. d) Separation of the generator from the first partial cathode after the expiration of a predetermined first power pulse interval corresponding to the first partial cathode. e) Connection of the second partial cathode to the generator r) so that the second part of the cathode is supplied with power from the generator f) separation of the generator from the second partial cathode after a predetermined second second cathode corresponding second power pulse interval wherein the first power pulse interval begins before the second power pulse interval and the first power pulse interval in time before the second power pulse interval ends, and wherein steps d) and e) are performed such that the first power pulse interval and the second power pulse interval overlap in time and all power pulse intervals together form a first group such that the power output from the generator remains continuously uninterrupted from the beginning of the first power pulse interval to the end of the second power pulse interval and there is no second power setup interval. If more than two partial cathodes are provided over the height of the coating chamber, then a group may consist of more than two power pulse intervals. In the process, then as many groups are connected in series, as it can be expected of the individual partial cathodes with respect to temperature entry. It then concludes a break. FIG. 1 shows a corresponding situation with 6 partial cathodes and 3 groups.
Erfindungsgemäss wird nun die Aufgabe dadurch gelöst, dass die Länge der einzelnen Leistungspulsintervalle individuell gewählt wird und so ein gewünschtes Beschichtungsdickenprofil über die Höhe der Beschichtungskammer erreicht wird. D.h. erfindungsgemäss wird nicht, wie sonst üblich, die Magnetfelder über die Höhe der Beschichtungskammer angepasst, sondern die Dauer der Leistungspulsintervalle. Entsprechendes ist in der Figur 1 gezeigt. Sichtbar ist, dass das mit der ersten Teilkathode verbundene Leistungspulsintervall deutlich länger ist als das mit der Teilkathode 5 verbundene Leistungspulsintervall. Aufgrund des längeren Leistungspulsintervalls wird die mittlere Beschichtungsrate ausgehend von der Teilkathode 1 länger als die mittlere Beschichtungsrate ausgehend von der Teilkathode 5. According to the invention, the object is now achieved by individually selecting the length of the individual power pulse intervals and thus achieving a desired coating thickness profile over the height of the coating chamber. That According to the invention, the magnetic fields are not adjusted over the height of the coating chamber, as usual, but the duration of the power pulse intervals. The same is shown in FIG. It can be seen that the power pulse interval connected to the first sub-cathode is significantly longer than the power pulse interval connected to the sub-cathode 5. Due to the longer power pulse interval, the average coating rate starting from the partial cathode 1 becomes longer than the average coating rate starting from the partial cathode 5.
In der Praxis kann beispielsweise so vorgegangen werden, dass zunächst die Leistungspulsintervalle sämtlicher Teilkathoden gleich lang gewählt werden und so eine erste Beschichtung zur Kalibierung vorgenommen wird. Anschliessend werden die Beschichtungsdicken über die Höhe der Beschichtungskammer vermessen. Zeigen sich Unterschiede in den Dicken so werden dort, wo die Schichten im Vergleich zur mittleren Dicke zu gering sind die Leistungspulsintervalle etwas verlängert. Dort wo die Schichten im Vergleich zur mittleren Dicke zu gross sind werden die Leistungspulsintervalle etwas verkürzt. Durch dieses Vorgehen wird ein Ausgleich erzielt, wobei dem Fachmann klar ist, dass mehrere Iterationsschritte zur weiteren Verbesserung der Homogenisierung durchgeführt werden können. In practice, for example, it is possible to proceed in such a way that initially the power pulse intervals of all the subcathodes are selected to be the same length, and so a first coating is made for calibration. Subsequently, the coating thicknesses are measured over the height of the coating chamber. If there are differences in the thicknesses, then where the layers are too small in comparison to the average thickness, the power pulse intervals are somewhat prolonged. Where the layers are too large compared to the average thickness, the power pulse intervals are somewhat shortened. By doing so, a balance is achieved, it being clear to the person skilled in the art that several iteration steps can be carried out to further improve the homogenization.
Die Erfindung wurde anhand der Homogenisierung der Schichtdicken über die Höhe der Beschichtungskammer erläutert. Sie sollte allerdings auch so verstanden werden, dass wenn ein insbesondere auch von der Homogenisierung abweichendes Schichdickenprofil erzielt werden soll, die erfindungsgemässen Massnahmen mutatis mutandis angewandt werden können. The invention was explained on the basis of the homogenization of the layer thicknesses over the height of the coating chamber. However, it should also be understood that if a particular from the homogenization deviating Schichdickenprofil is to be achieved, the measures according to the invention can be applied mutatis mutandis.

Claims

Ansprüche claims
1. Verfahren zur physikalischen Beschichtung aus der Gasphase mittels Zerstäuben in einer evakuierten Beschichtungskammer, insbesondere mittels HIPI S, umfassend die Schritte: a) Bereitstellen eines Generators mit vorgegebener vorzugsweise zumindest nach Anschalten und nach Ablauf eines Leistungsaufbauintervalls konstanter1. A method for physical coating from the gas phase by means of sputtering in an evacuated coating chamber, in particular by HIPI S, comprising the steps: a) providing a generator with predetermined preferably at least after switching on and after a power build-up interval constant
, Leistungsabgabe b) Anschalten des Generators c) Anschluss der ersten Teilkathode an den Generator, so dass die erste Teilkathode mit Leistung vom Generator beaufschlagt wird d) Trennung des Generators von der ersten Teilkathode nach Ablauf eines vorgegebenen der ersten Teilkathode entsprechenden ersten Leistungspulsintervalls e) Anschluss der zweiten Teilkathode an den Generator so dass die zweite Teilkathode mit Leistung vom Generator beaufschlagt wird f) Trennung des Generators von der zweiten Teilkathode nach Ablauf eines vorgegebenen der zweiten Teilkathode entsprechenden zweiten Leistungspulsintervalls; dadurch gekennzeichnet, dass die Länge des einen Leistungspulsintervalls derart an die Länge des anderen Leistungspulsintervalls angepasst wird, dass die aus der Beschichtung resultierende Schicht über die Höhe der Beschichtungskammer eine vorgegebene Schichtdickenverteilung aufweist. C) Connection of the first part cathode to the generator so that the first part cathode is supplied with power from the generator d) Separation of the generator from the first part cathode after a predetermined first power pulse interval corresponding to the first part cathode e) Connection the second part cathode to the generator so that the second part cathode is supplied with power from the generator f) separation of the generator from the second part cathode after the expiry of a predetermined second power pulse interval corresponding to the second part cathode; characterized in that the length of the one power pulse interval is adapted to the length of the other power pulse interval such that the layer resulting from the coating has a predetermined layer thickness distribution over the height of the coating chamber.
2. Verfahren nach Anspruch 1 , dadurch gekennzeichnet, dass als vorgegebene Schichtdickenverteilung eine homogene Schichtdickenverteilung gewählt wird. 2. The method according to claim 1, characterized in that a homogeneous layer thickness distribution is selected as the predetermined layer thickness distribution.
3. Verfahren nach einem der Ansprüche 1 und 2, dadurch gekennzeichnet, dass das erste Leistungspulsintervall zeitlich vor dem zweiten Leistungspulsintervall beginnt und das erste Leistungspulsintervall zeitlich vor dem zweiten Leistungspulsintervall endet, und wobei die Schritte d) und e) so ausgeführt werden dass sich erstes Leistungspulsintervall und zweites Leistungspulsintervall zeitlich überlappen und alle Leistungspulsintervalle zusammen eine erste Gruppe bilden, so dass die Leistungsabgabe vom Generator durchgehend ohne Unterbrechung vom Anfang des ersten Leistungspulsintervalls bis zum Ende des zweiten Leistungspulsintervalls bestehen bleibt und es nicht zu einem zweiten Leistungsaufbauintervall kommt. 3. The method according to any one of claims 1 and 2, characterized in that the first power pulse interval begins before the second power pulse interval and the first power pulse interval ends before the second power pulse interval, and wherein steps d) and e) are carried out so that first Overlap in time pulse power interval and second power pulse interval and all power pulse intervals together form a first group, so that the power output from the generator continuously without interruption from the beginning of first power pulse interval until the end of the second power pulse interval remains and it does not come to a second power setup interval.
4. Verfahren nach einem der vorangehenden Ansprüche, dadurch gekennzeichnet, dass mehr als zwei Teilkathoden verwendet werden und die Schritte c) bis f) analog auf diese angewendet werden. 4. The method according to any one of the preceding claims, characterized in that more than two partial cathodes are used and the steps c) to f) are applied analogously to these.
5. Verfahren nach einem der vorangehenden Ansprüche, dadurch gekennzeichnet, dass zumindest die relative Länge der Leistungspulsintervalle mittels einer der Beschichtung vorgängigen Kalibrationsbeschichtung ermittelt wird. 5. The method according to any one of the preceding claims, characterized in that at least the relative length of the power pulse intervals is determined by means of a coating of the previous calibration coating.
EP12812516.8A 2011-12-21 2012-11-23 Homogeneous hipims coating method Withdrawn EP2795658A1 (en)

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TW202340495A (en) 2019-02-11 2023-10-16 美商應用材料股份有限公司 Physical vapor deposition methods

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KR20140116102A (en) 2014-10-01

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