EP2752867A4 - Adhesive sheet for immobilizing imprint mold, imprint device, and imprint method - Google Patents

Adhesive sheet for immobilizing imprint mold, imprint device, and imprint method

Info

Publication number
EP2752867A4
EP2752867A4 EP12827231.7A EP12827231A EP2752867A4 EP 2752867 A4 EP2752867 A4 EP 2752867A4 EP 12827231 A EP12827231 A EP 12827231A EP 2752867 A4 EP2752867 A4 EP 2752867A4
Authority
EP
European Patent Office
Prior art keywords
imprint
immobilizing
adhesive sheet
mold
imprint mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP12827231.7A
Other languages
German (de)
French (fr)
Other versions
EP2752867A1 (en
EP2752867B1 (en
Inventor
Satoshi Uehara
Takanori Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Soken Kagaku KK
Soken Chemical and Engineering Co Ltd
Original Assignee
Soken Kagaku KK
Soken Chemical and Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Soken Kagaku KK, Soken Chemical and Engineering Co Ltd filed Critical Soken Kagaku KK
Publication of EP2752867A1 publication Critical patent/EP2752867A1/en
Publication of EP2752867A4 publication Critical patent/EP2752867A4/en
Application granted granted Critical
Publication of EP2752867B1 publication Critical patent/EP2752867B1/en
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/002—Component parts, details or accessories; Auxiliary operations
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0017—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor for the production of embossing, cutting or similar devices; for the production of casting means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B29C2059/023—Microembossing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/04—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing using rollers or endless belts
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C09J2301/1242—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape the opposite adhesive layers being different
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
EP12827231.7A 2011-08-31 2012-08-27 Adhesive sheet for immobilizing imprint mold, imprint device, and imprint method Not-in-force EP2752867B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011189115 2011-08-31
PCT/JP2012/071540 WO2013031710A1 (en) 2011-08-31 2012-08-27 Adhesive sheet for immobilizing imprint mold, imprint device, and imprint method

Publications (3)

Publication Number Publication Date
EP2752867A1 EP2752867A1 (en) 2014-07-09
EP2752867A4 true EP2752867A4 (en) 2015-04-15
EP2752867B1 EP2752867B1 (en) 2019-01-02

Family

ID=47756199

Family Applications (1)

Application Number Title Priority Date Filing Date
EP12827231.7A Not-in-force EP2752867B1 (en) 2011-08-31 2012-08-27 Adhesive sheet for immobilizing imprint mold, imprint device, and imprint method

Country Status (8)

Country Link
US (1) US20140191431A1 (en)
EP (1) EP2752867B1 (en)
JP (1) JP5699218B2 (en)
KR (1) KR20140058598A (en)
CN (1) CN103748659B (en)
DK (1) DK2752867T3 (en)
TW (1) TWI580590B (en)
WO (1) WO2013031710A1 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103769996B (en) * 2012-10-25 2017-03-01 三芳化学工业股份有限公司 The manufacture method of adsorption gasket, lapping device and adsorption gasket
CN105555895B (en) * 2014-04-22 2017-10-27 日东电工株式会社 Bonding sheet
JP6318840B2 (en) * 2014-05-19 2018-05-09 大日本印刷株式会社 Manufacturing method of substrate for imprint mold
TWI663472B (en) * 2014-07-25 2019-06-21 日商綜研化學股份有限公司 Manufacturing method of fine structure
JP6341448B2 (en) * 2014-09-19 2018-06-13 大日本印刷株式会社 Inspection method of bonded body for nanoimprint, inspection apparatus and manufacturing method thereof
KR102281850B1 (en) 2015-02-25 2021-07-26 삼성디스플레이 주식회사 Touch sensor, manufacturing method thereof and display device including the same
WO2016148118A1 (en) * 2015-03-17 2016-09-22 綜研化学株式会社 Manufacturing method for relief pattern forming body and imprint apparatus
DE102015009982A1 (en) * 2015-07-31 2017-02-02 Giesecke & Devrient Gmbh Embossing stamp for the nanoimprint lithography
KR101780547B1 (en) * 2015-07-31 2017-09-22 삼성에스디아이 주식회사 Adhesive film for polarizing plate, polarizing plate comprising the same and optical display apparatus comprising the same
JP6965969B2 (en) * 2015-12-03 2021-11-10 大日本印刷株式会社 Imprint mold
KR102231628B1 (en) * 2016-05-16 2021-03-23 가부시키가이샤 데라오카 세이사쿠쇼 Adhesive composition and adhesive tape
US20180304577A1 (en) 2017-04-24 2018-10-25 Reed Quinn High strength adhesive tape
JP6856799B1 (en) * 2019-12-06 2021-04-14 積水化学工業株式会社 Silicone-based graft copolymers, adhesive compositions and adhesive tapes
JP2024099967A (en) * 2023-01-13 2024-07-26 デクセリアルズ株式会社 Method for manufacturing optical member, imprinting mold, and optical member

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000017284A1 (en) * 1998-09-17 2000-03-30 Nitta Corporation Workpiece retainer and method for attaching/detaching workpiece by using the same
US6398892B1 (en) * 1998-08-26 2002-06-04 Lintec Corporation Method of using pressure sensitive adhesive double coated sheet
US20040241434A1 (en) * 2003-06-02 2004-12-02 Tomoo Yamaguchi Pressure-sensitive adhesive double-coated sheet
WO2011016148A1 (en) * 2009-08-07 2011-02-10 ニッタ株式会社 Adhesive sheet for fixing mold, and adhesive tape for fixing mold, and process for producing fine structure

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4871631A (en) * 1987-10-21 1989-10-03 Basf Aktiengesellschaft Adhesively securable multilayer relief plate for flexographic printing
DE202004009995U1 (en) * 2004-06-25 2004-09-30 Henkel Kgaa Adhesive tape with a polyurethane foam backing
DE202004009994U1 (en) * 2004-06-25 2004-09-30 Henkel Kgaa Adhesive tape with a polyacrylate foam backing
TWI286828B (en) * 2004-11-12 2007-09-11 Mitsui Chemicals Inc Film-shaped adhesive and semiconductor package using the same
JP4875357B2 (en) * 2005-12-19 2012-02-15 リンテック株式会社 Double-sided adhesive tape
WO2009063847A1 (en) * 2007-11-16 2009-05-22 Taica Coporation Transparent pressure-sensitive adhesive product for optical use, transparent pressure-sensitive adhesive laminates for optical use and process for production of the same
JP2010270188A (en) * 2009-05-20 2010-12-02 Nitto Denko Corp Adhesive sheet for pattern transfer and pattern transfer method
JP5463087B2 (en) * 2009-06-22 2014-04-09 ニッタ株式会社 Microstructure manufacturing method
WO2011004818A1 (en) * 2009-07-06 2011-01-13 リンテック株式会社 Energy ray-curable pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet for inspecting stampers

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6398892B1 (en) * 1998-08-26 2002-06-04 Lintec Corporation Method of using pressure sensitive adhesive double coated sheet
WO2000017284A1 (en) * 1998-09-17 2000-03-30 Nitta Corporation Workpiece retainer and method for attaching/detaching workpiece by using the same
US20040241434A1 (en) * 2003-06-02 2004-12-02 Tomoo Yamaguchi Pressure-sensitive adhesive double-coated sheet
WO2011016148A1 (en) * 2009-08-07 2011-02-10 ニッタ株式会社 Adhesive sheet for fixing mold, and adhesive tape for fixing mold, and process for producing fine structure

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2013031710A1 *

Also Published As

Publication number Publication date
KR20140058598A (en) 2014-05-14
US20140191431A1 (en) 2014-07-10
CN103748659A (en) 2014-04-23
EP2752867A1 (en) 2014-07-09
TWI580590B (en) 2017-05-01
CN103748659B (en) 2016-08-24
EP2752867B1 (en) 2019-01-02
TW201321211A (en) 2013-06-01
JP5699218B2 (en) 2015-04-08
JPWO2013031710A1 (en) 2015-03-23
WO2013031710A1 (en) 2013-03-07
DK2752867T3 (en) 2019-03-04

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