EP2721912A1 - Dispositif réfrigérant, procédé pour sa fabrication et utilisation du dispositif - Google Patents
Dispositif réfrigérant, procédé pour sa fabrication et utilisation du dispositifInfo
- Publication number
- EP2721912A1 EP2721912A1 EP12738428.7A EP12738428A EP2721912A1 EP 2721912 A1 EP2721912 A1 EP 2721912A1 EP 12738428 A EP12738428 A EP 12738428A EP 2721912 A1 EP2721912 A1 EP 2721912A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- plates
- recesses
- adjacent
- range
- plane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/08—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
- F28F3/086—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning having one or more openings therein forming tubular heat-exchange passages
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20154—Heat dissipaters coupled to components
- H05K7/20163—Heat dissipaters coupled to components the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
- H05K7/20918—Forced ventilation, e.g. on heat dissipaters coupled to components the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
- F28F2255/12—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes expanded or perforated metal plate
Definitions
- the present invention relates to a device for cooling, their production and their use, which comprises a stack of at least two plates each with Ausneh ⁇ rules.
- the at least two plates are stacked in such a way over ⁇ each other such that a continuous cooling channels are formed for a cooling fluid through the recesses.
- the cooling fluid is passed through fixtures and tried a large surface area for cooling to testify he ⁇ .
- cooling devices with very fine structures are needed, which have a large overflow surface. All the more so because the heat transfer to air or other gases compared to liquids is low. The necessary fine structures are usually expensive to manufacture and thus very expensive.
- the plates with ribs and fins are also usually made of solid metal such as aluminum. This leads to a high weight of the cooling apparatus, a high material consumption and price as well as increased, but not maximum heat exchanging surface between the pre ⁇ device for cooling and for example the surrounding air.
- the herstel ⁇ development of the ribs and fins rangy running is very complex and expensive.
- Object of the present invention is to provide a device for cooling, their preparation and their use, which has a good heat transfer between the cooling fluid, eg air or water, and device to be cooled, eg electrical power component, with low Her ⁇ positioning effort and costs as well as reduced material expenditure and weight compared to known pin-fins.
- the cooling fluid eg air or water
- device to be cooled eg electrical power component
- the stated object is achieved with respect to the device for cooling with the features of claim 1, with regard to the method for producing the device with the features of claim 13 and with respect to the use of the device with the features of claim 15.
- Advantageous embodiments of the device according to the invention for cooling and the method for producing the device will become apparent from the respectively associated dependent subclaims.
- the characteristics of the adjacent Neten claims with each other and with features of a respective associated subclaim or preferably combined with Merk ⁇ paint several assigned subclaims.
- the cooling device according to the invention comprises a
- Stack of at least two plates each with recesses The at least two plates one above the other gesta ⁇ pelt that are formed by the recesses continuous cooling channels for a cooling fluid.
- the at least two plates with recesses are rolled expanded grids. By this is meant that these rolled expanded grids comprise and / or are identical to rolled expanded meshes.
- Rolled expanded metal mesh are easy and inexpensive to produce. In contrast to plates with punched-out recesses fall with expanded metal no waste parts. In Streckgit ⁇ tern be quickly and easily perforated by shearing large areas in plates, the recesses are formed as perfo ⁇ ration in the plates. In contrast to plates with ribs and fins comprises a stack of rolled Streckgit ⁇ tern on a larger surface area over which heat from a ⁇ exchange with a cooling fluid, for example air, can take place. The weight and material consumed is smaller with increased Oberflä ⁇ che. The cost and the cost of production are also lower.
- the device may comprise at least one base plate.
- the stack of at least two plates each with recesses mechanically and thermally to the device to be cooled, such as the electrical power component or component, be attached.
- the contact surface between ⁇ the device to be cooled and the device is formed for cooling in this case.
- the at least two plates may be metallically connected with each other and / or with the base plate.
- connections via, for example, thermal conductive adhesive are possible.
- the advantage of a metallic connection is the high mechanical and thermal stability and the good heat transfer via such a connection.
- the metallic compound may be a solder joint, a braze joint and / or a welded joint.
- the at least two plates can be arranged with their plane perpendicular to the plate plane of the base plate. This arrangement is particularly advantageous in air cooling, with a direction of air flow parallel to the Maisflä ⁇ surface between the device to be cooled and of the cooling apparatus.
- the at least two plates may alternatively be arranged with their plate plane parallel to the plate plane of the base plate. This is advantageous when cooling with water. By the arrangements, large turbulences of the cooling fluid are respectively achieved at the plates and thus a good heat ⁇ transition from the plates to the cooling fluid.
- the recesses of the at least two plates can form identical patterns.
- same can be regular
- Pattern may be formed with constant spacing between adjacent recesses along a direction in the plate plane. These patterns can be produced in a particularly simple and cost-effective manner with expanded metal meshes which, by subsequent over-rolling, maintain the flatness of the original metal sheet.
- the at least two plates may be attached one above the other ⁇ arranged that the patterns of adjacent plates are shifted from each other by half the distance between adjacent recesses along one direction in the plane of the plate.
- Characterized cooling channels along the plate plane over the recesses are formed, which are continuous through the plate package and along the plate plane by fluidically ⁇ can flow, and provide a large transfer surface area between the plates and the cooling fluid safely.
- the stack can comprise at least three plates with recesses on ⁇ , wherein the at least three plates above the other in such a way are arranged such that the patterns of adjacent plates are mutually displaced by a distance which is irregular or not repeated.
- This arrangement of plates one above the other is particularly easy to produce, since no alignment of the recesses of adjacent plates against each other is necessary.
- a disadvantage over the variant described above is that the diameter of the cooling channels may not be precisely defined or equal over the device along the plane of the plate. This can lead to non-uniform flow conditions, and thus also temperature distributions, due to differential heat exchange, and can lead to increased wear in the case of cooling with cooling fluids with particles if the particles have increased rates of constriction and lead to material removal.
- the plates may be stacked such that the patterns of adjacent plates are rotated relative to one another by an angle beta, in particular by an angle N times beta, where N is the numbered number of the Nth plate in the stack.
- the angle beta can have a value equal to or in the range of 90 °.
- the rotation of plates or their patterns against each other can have the same advantages as previously described for a displacement of the patterns of the plates against each other.
- N the natural number is given, which indicates which number of disk drives in ⁇ stack of, for example the first plate in contact with a base plate from ⁇ calculated, representing the N-th sheet.
- the shape of the recesses of the at least two plates may be the same. This makes a simple production possible with an expanded metal tool.
- the shape of the recesses may, in particular, essentially have the shape of a parallelogram. In essence, this means that at a parity two parallel straight lines cut rallelogramm two more pa ⁇ rallele straight line, and thereby enclose an acute angle Alpha.
- the angle may not be sharp, but rounded in shape a circle radius section or a straight piece ⁇ include, with a length H.
- Thighs of the parallelogram can be in the range of 91 ° to 170 °.
- the distance P of the centers of adjacent recesses may be in the range of 5 to 70 mm, wherein center point of the intersection of the diagonal is designated in a Pa ⁇ parallelogram.
- the distance B of adjacent boundaries of two adjacent recesses may be in the range of 0.4 times P, in particular with a value of the distance B in the range of 1 to 10 mm.
- At a distance B is the smallest width of webs in a plane between recesses referred to, which remain when rolling from the plate material.
- the distance H of two legs of the parallelogram can be in the range of less than 0.1 times P, in particular in the range of 5 to 20 mm.
- the shape of the recesses of the at least two plates may also have a circular shape.
- the distance P of the centers of adjacent recesses may be in the range of 5 to 70 mm.
- a center is given by a circular recess through the center of the circle.
- the distance B of adjacent boundaries of two adjacent recesses may be in the range of 0.4 times P, in particular with a value of the distance B in the range of 1 to 10 mm.
- the method according to the invention for producing a device described above comprises that the recesses in the expanded gratings are respectively produced by local shearing.
- the webs can be flat-rolled between the recesses in the plate plane.
- the webs can be set up perpendicular to the plate plane. This can limit the arrangement of the plates as stacks with small points of contact, hindering the transport of heat across the plates. In order to reduce or eliminate such problems, a processing step of flat rolling can be useful.
- the device according to the invention may comprise, for cooling purposes, a fluid flowing air or water through the cooling channels.
- a fluid flowing air or water may be used as the cooling fluid flowing through the at least two boards.
- the air can then flow conveniently parallel to the plate plane.
- water which flows through the at least two plates
- the water can then also conveniently flow parallel to the plate plane and sweep a lot of plate area.
- FIG. 1 is a plan view of a plate 3 with parallelogram-shaped recesses 5 of a device 1 according to the invention for cooling, and
- FIG. 2 shows a schematic sectional view through an exemplary embodiment of a device 1 according to the invention for cooling, with the plates of the plate stack 2 arranged perpendicular to the base plate 6, and FIG
- Fig. 3 is a schematic sectional view through another
- Embodiment of a device according to the invention 1 for cooling arranged with the plates of the plate stack 2 parallel to the base plate 6, and
- FIG. 4 is an oblique view of two plates 3, 4 of an inventive device 1 for cooling according to the embodiment of FIG. 2, and
- FIG. 5 is a plan view of the arrangement of the two plates 3, 4 corresponding to FIG. 4th
- Fig. 1 shows a plan view of a plate 3 with wesentli ⁇ chen parallelogram-shaped recesses 5 of a device 1 according to the invention for cooling.
- the plate 3 is a rolled expanded grid with webs 9 and recesses 5 produced by shearing, wherein the webs 9 are flat-rolled and lie in one plane of the plate.
- the plate plane is in Fig. 1, the plane of the drawing.
- the expanded metal 3 can be made, for example, from a metal sheet such as an aluminum sheet, a steel sheet, a galvanized sheet or a CuNiFe sheet.
- the sheet metal typically has a thickness not Darge ⁇ presented in Fig. 1 in the region of a few mm.
- the recesses 5 are the same in shape and give a regular pattern, which results from each other by the parallelogram shape and the distance P of the centers of the recesses 5.
- a center point of a parallelogram results from the intersection of the diagonal of the parallelogram, which connect the vertices together.
- the distance P of the centers of adjacent recesses is in the range of 5 to 70 mm, for example 5 mm.
- the webs 9 have a width B in the range of 0.4 times P, in particular 1 to 10 mm. At a value P equal to 5 mm results in a value B of 2 mm.
- the recesses 5 are only substantially parallelogram. At two opposite lying intersection points 10, 10 'of a recess 5 is formed no tip, but a straight portion of the length H is inserted, which is parallel to a diagonal of the parallelogram.
- the straight portion includes with the adjacent angle of the parallelogram Schen- an angle Alfa, which lies in the range from 91 ° Be ⁇ to 170 °. In the embodiment of Fig. 1, the angle alpha is 170 °.
- the straight portion has ei ⁇ NEN value H to 0.1 times P, in particular in the range 5 to 20 mm. At a value P of 5 mm, H is equal to 0.5 mm.
- Fig. 1 the sake of clarity, no second Plat ⁇ run 4 of the panel stack 2 located.
- the second plate 4 may be arranged under the first plate 3, rotated with a pattern by the angle beta, beta is insbeson ⁇ particular 90 °. This means that the parallelogram, which is given by the recess 5 of the underlying plate 4, is rotated by 90 ° relative to the recess 5 of the first plate 3.
- FIG. 2 shows a schematic sectional view through an exemplary embodiment of a device 1 according to the invention for cooling, with a plurality of the previously described plates 3 arranged in a plate stack 2.
- the plates 3, 4 are arranged perpendicular to a base plate 6.
- the expanded metal or plates 3, 4 are with their plate plane, which corresponds to the drawing plane in FIG. 1, perpendicular to the base plate 6 and the drawing plane of FIG.
- the cooling fluid eg air
- the expanded metal of the plate stack 2 are mechanical and thermally connected to the opposite side to the side 12 of the base plate 6. This connection can be made by soldering, brazing, or welding metallic, whereby a good heat transfer through the connection is given.
- the cooling fluid flow 8 flows through the stack 2 of expanded meshes, wherein, depending on the arrangement of the expanded mesh or plates 3, 4 one above the other, the flow is swirled.
- a surface of the expanded metal mesh 3, 4 is covered with cooling fluid and there is a heat exchange from the device to be cooled, via the base plate 6, the expanded metal mesh of the stack 2 to the cooling fluid instead. This results in a removal of heat, i. a cooling of the device to be cooled.
- a cooling device 1 according to the invention, corresponding to Fig. 2, with only one plate stack 2 with a direction of stacking perpendicular to the plane of the base plate 6.
- This arrangement is preferably combined with a liquid cooling fluid, e.g. Water operated, but can also be with a gaseous cooling fluid such. Air operated.
- Fig. 3 the plates 3, 4 of the disk stack 2 with ih ⁇ rer plate plane as Darge ⁇ up as drawing plane in FIG. 1, is disposed parallel to the base plate 6.
- stacked expanded metal 3, 4 does not flows against or through flows vertically but horizontally.
- Depending on the type of fluid and - speed and required cooling capacity is a pre ⁇ direction to choose for 2 or 3..
- Fig. 4 is an oblique view of two plates of he ⁇ inventive device 1 for cooling according to the embodiment of Fig. 2 in detail.
- the fluid flow 8 is perpendicular to the plate plane 3, 4.
- Plates 3, 4 are fixed to the plate plane of the base plate 6 at this mechanically and thermally conductive.
- the base plate 6 is in a longitudinal section Darge ⁇ represents.
- the expanded metal meshes 3, 4 with their patterns of the recesses 5 are arranged one above the other displaced relative to one another.
- Fig. 5 for better clarity shown with their dimensions for an up ⁇ view to this arrangement.
- the expanded metal 3 is displaced so against the pattern of the recesses 5 of the expanded metal 4 disposed such that the Ver ⁇ shift a length 1/2 P corresponds to, ie P equal to 5 mm has a value of 2.5 mm, in a direction perpendicular to the plane of the base plate 6.
- the arranged above it, not shown in Fig. 5 expanded metal grid of the stack 2 can be moved with sei ⁇ nem pattern by the same value in the same or in the opposite direction. The result is the same overall pattern at a glance.
- a stacking of the further expanded mesh in the stack 2 is analogous.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
L'invention concerne un dispositif réfrigérant (1), sa fabrication et son utilisation, le dispositif comprenant un empilement (2) composé d'au moins deux plaques (3, 4) respectivement pourvues de cavités (5). Les au moins deux plaques (3, 4) sont empilées de telle manière que des canaux de refroidissement pour un fluide frigorigène, traversant les cavités (5), sont formés. Les au moins deux plaques (3, 4) comportant des cavités (5) se présentent sous la forme de métal déployé laminé (3, 4).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE201110079634 DE102011079634A1 (de) | 2011-07-22 | 2011-07-22 | Vorrichtung zum Kühlen und Verfahren zu deren Herstellung sowie Verwendung der Vorrichtung |
PCT/EP2012/063693 WO2013013995A1 (fr) | 2011-07-22 | 2012-07-12 | Dispositif réfrigérant, procédé pour sa fabrication et utilisation du dispositif |
Publications (1)
Publication Number | Publication Date |
---|---|
EP2721912A1 true EP2721912A1 (fr) | 2014-04-23 |
Family
ID=46579002
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP12738428.7A Withdrawn EP2721912A1 (fr) | 2011-07-22 | 2012-07-12 | Dispositif réfrigérant, procédé pour sa fabrication et utilisation du dispositif |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP2721912A1 (fr) |
DE (1) | DE102011079634A1 (fr) |
WO (1) | WO2013013995A1 (fr) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10036258B2 (en) | 2012-12-28 | 2018-07-31 | United Technologies Corporation | Gas turbine engine component having vascular engineered lattice structure |
US10018052B2 (en) | 2012-12-28 | 2018-07-10 | United Technologies Corporation | Gas turbine engine component having engineered vascular structure |
US10094287B2 (en) | 2015-02-10 | 2018-10-09 | United Technologies Corporation | Gas turbine engine component with vascular cooling scheme |
DE102015215570A1 (de) | 2015-08-14 | 2017-02-16 | Siemens Aktiengesellschaft | Kühlkörper für eine elektronische Komponente und Verfahren zu deren Herstellung |
US10077664B2 (en) | 2015-12-07 | 2018-09-18 | United Technologies Corporation | Gas turbine engine component having engineered vascular structure |
US10221694B2 (en) | 2016-02-17 | 2019-03-05 | United Technologies Corporation | Gas turbine engine component having vascular engineered lattice structure |
US10774653B2 (en) | 2018-12-11 | 2020-09-15 | Raytheon Technologies Corporation | Composite gas turbine engine component with lattice structure |
DE102019205383A1 (de) * | 2019-04-15 | 2020-10-15 | Vitesco Technologies Germany Gmbh | Kühler zur Kühlung einer Elektronikschaltung, Leistungselektronikvorrichtung mit einem Kühler |
DE102021115881A1 (de) | 2021-06-18 | 2022-12-22 | Ineratec Gmbh | Multilagenreaktor mit mehreren Strukturlagen |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5193611A (en) * | 1989-05-04 | 1993-03-16 | The Secretary Of State For Trade And Industry In Her Britannic Majesty's Government Of The United Kingdom Of Great Britain And Northern Ireland | Heat exchangers |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4359181A (en) * | 1978-05-25 | 1982-11-16 | John Chisholm | Process for making a high heat transfer surface composed of perforated or expanded metal |
IT1286374B1 (it) * | 1995-12-19 | 1998-07-08 | Merloni Termosanitari Spa | Dispositivo per lo scambio di calore e/o materia |
US6386278B1 (en) * | 1998-08-04 | 2002-05-14 | Jurgen Schulz-Harder | Cooler |
US6171357B1 (en) * | 1999-01-04 | 2001-01-09 | Eci Telecom Ltd. | Air filter |
DE10244805A1 (de) * | 2002-09-26 | 2004-04-08 | Sma Regelsysteme Gmbh | Offenporig poröser Kühlkörper eines Wärmetauschers |
AU2004263669B2 (en) * | 2003-08-06 | 2008-07-31 | Brembana & Rolle S.P.A. | Expanded metal |
US20090321045A1 (en) * | 2008-06-30 | 2009-12-31 | Alcatel-Lucent Technologies Inc. | Monolithic structurally complex heat sink designs |
EP2486359A2 (fr) * | 2009-09-29 | 2012-08-15 | Siemens Aktiengesellschaft | Procédé de fabrication d'une plaque de refroidissement et dispositif fabriqué selon ce procédé |
-
2011
- 2011-07-22 DE DE201110079634 patent/DE102011079634A1/de not_active Ceased
-
2012
- 2012-07-12 EP EP12738428.7A patent/EP2721912A1/fr not_active Withdrawn
- 2012-07-12 WO PCT/EP2012/063693 patent/WO2013013995A1/fr active Application Filing
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5193611A (en) * | 1989-05-04 | 1993-03-16 | The Secretary Of State For Trade And Industry In Her Britannic Majesty's Government Of The United Kingdom Of Great Britain And Northern Ireland | Heat exchangers |
Non-Patent Citations (1)
Title |
---|
See also references of WO2013013995A1 * |
Also Published As
Publication number | Publication date |
---|---|
DE102011079634A1 (de) | 2013-01-24 |
WO2013013995A1 (fr) | 2013-01-31 |
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