EP2710628A4 - Thermal interface materials and methods for processing the same - Google Patents

Thermal interface materials and methods for processing the same

Info

Publication number
EP2710628A4
EP2710628A4 EP12785480.0A EP12785480A EP2710628A4 EP 2710628 A4 EP2710628 A4 EP 2710628A4 EP 12785480 A EP12785480 A EP 12785480A EP 2710628 A4 EP2710628 A4 EP 2710628A4
Authority
EP
European Patent Office
Prior art keywords
methods
processing
same
thermal interface
interface materials
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP12785480.0A
Other languages
German (de)
French (fr)
Other versions
EP2710628A2 (en
Inventor
Karen J Bruzda
Richard F Hill
Brian Jones
Michael D Craig
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Laird Technologies Inc
Original Assignee
Laird Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Laird Technologies Inc filed Critical Laird Technologies Inc
Publication of EP2710628A2 publication Critical patent/EP2710628A2/en
Publication of EP2710628A4 publication Critical patent/EP2710628A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F2013/005—Thermal joints
    • F28F2013/006—Heat conductive materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
EP12785480.0A 2011-05-19 2012-05-17 Thermal interface materials and methods for processing the same Withdrawn EP2710628A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/111,735 US20120292005A1 (en) 2011-05-19 2011-05-19 Thermal interface materials and methods for processing the same
PCT/US2012/038280 WO2012158876A2 (en) 2011-05-19 2012-05-17 Thermal interface materials and methods for processing the same

Publications (2)

Publication Number Publication Date
EP2710628A2 EP2710628A2 (en) 2014-03-26
EP2710628A4 true EP2710628A4 (en) 2015-04-08

Family

ID=47174063

Family Applications (1)

Application Number Title Priority Date Filing Date
EP12785480.0A Withdrawn EP2710628A4 (en) 2011-05-19 2012-05-17 Thermal interface materials and methods for processing the same

Country Status (7)

Country Link
US (1) US20120292005A1 (en)
EP (1) EP2710628A4 (en)
JP (1) JP2014514755A (en)
KR (1) KR101523009B1 (en)
CN (1) CN103548123A (en)
TW (1) TWI499753B (en)
WO (1) WO2012158876A2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10068830B2 (en) 2014-02-13 2018-09-04 Honeywell International Inc. Compressible thermal interface materials
KR102554661B1 (en) 2016-03-08 2023-07-13 허니웰 인터내셔널 인코포레이티드 phase change material
US11041103B2 (en) 2017-09-08 2021-06-22 Honeywell International Inc. Silicone-free thermal gel
US11072706B2 (en) 2018-02-15 2021-07-27 Honeywell International Inc. Gel-type thermal interface material
US11373921B2 (en) 2019-04-23 2022-06-28 Honeywell International Inc. Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing
CN111995991B (en) * 2020-07-27 2022-01-18 深圳陶陶科技有限公司 Thermal interface material and preparation method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050016714A1 (en) * 2003-07-09 2005-01-27 Chung Deborah D.L. Thermal paste for improving thermal contacts
US20050256241A1 (en) * 2004-05-11 2005-11-17 International Business Machines Corporation Thermal interface adhesive and rework
US20060275608A1 (en) * 2005-06-07 2006-12-07 General Electric Company B-stageable film, electronic device, and associated process
US20110038124A1 (en) * 2008-04-21 2011-02-17 Honeywell International Inc. Thermal interconnect and interface materials, methods of production and uses thereof

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5323293A (en) * 1992-12-18 1994-06-21 International Business Machines Corporation Arrangement for placing central processors and memory in a cryo cooled chamber
US5323818A (en) * 1993-04-28 1994-06-28 International Business Machines Corporation Apparatus and process for dispensing thermal paste into a thermal conduction module cold plate
JP2002037359A (en) * 2000-07-21 2002-02-06 Dow Corning Toray Silicone Co Ltd Paste discharging container
US6616471B2 (en) * 2001-09-21 2003-09-09 Intel Corporation Integrated horizontal cam lever for zero-insertion force (ZIF) socket actuation
JP3674864B2 (en) * 2003-03-25 2005-07-27 忠素 玉井 Vacuum processing equipment
US20070268668A1 (en) * 2006-05-19 2007-11-22 I-Ming Lin Kind of superconductive heat cooler package of vacuum used in computer CPU (Central Processing Unit)
US7445727B2 (en) * 2006-09-08 2008-11-04 Cpumate Inc. Thermal interface material compound and method of fabricating the same
JP4735528B2 (en) * 2006-12-21 2011-07-27 株式会社デンソー Cooling structure for in-vehicle electronic equipment
US7954236B2 (en) * 2007-02-08 2011-06-07 Lundell Manufacturing Corporation Method of assembling a sealed thermal interface
US7851906B2 (en) * 2007-03-26 2010-12-14 Endicott Interconnect Technologies, Inc. Flexible circuit electronic package with standoffs
US8636931B2 (en) * 2007-05-18 2014-01-28 International Business Machines Corporation Vacuum extrusion method of manufacturing a thermal paste
TW200914371A (en) * 2007-06-01 2009-04-01 Gt Solar Inc Processing of fine silicon powder to produce bulk silicon
JP5177089B2 (en) * 2008-07-30 2013-04-03 東レ株式会社 Polyarylene sulfide resin composition, polyarylene sulfide resin composition tablet and molded product obtained therefrom
JP5161745B2 (en) * 2008-12-03 2013-03-13 パナソニック株式会社 LED unit manufacturing method
CN101906288B (en) * 2009-06-02 2013-08-21 清华大学 Thermal interface material, electronic device with same and preparation method
JP2011040565A (en) * 2009-08-11 2011-02-24 Fuji Electric Systems Co Ltd Thermal conductive sheet, semiconductor device using the same, and method of manufacturing the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050016714A1 (en) * 2003-07-09 2005-01-27 Chung Deborah D.L. Thermal paste for improving thermal contacts
US20050256241A1 (en) * 2004-05-11 2005-11-17 International Business Machines Corporation Thermal interface adhesive and rework
US20060275608A1 (en) * 2005-06-07 2006-12-07 General Electric Company B-stageable film, electronic device, and associated process
US20110038124A1 (en) * 2008-04-21 2011-02-17 Honeywell International Inc. Thermal interconnect and interface materials, methods of production and uses thereof

Also Published As

Publication number Publication date
JP2014514755A (en) 2014-06-19
TW201314163A (en) 2013-04-01
US20120292005A1 (en) 2012-11-22
KR101523009B1 (en) 2015-05-26
EP2710628A2 (en) 2014-03-26
CN103548123A (en) 2014-01-29
TWI499753B (en) 2015-09-11
WO2012158876A2 (en) 2012-11-22
KR20140021668A (en) 2014-02-20
WO2012158876A3 (en) 2013-03-21

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Legal Events

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PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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17P Request for examination filed

Effective date: 20131209

AK Designated contracting states

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Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20150310

RIC1 Information provided on ipc code assigned before grant

Ipc: F28F 13/00 20060101AFI20150304BHEP

Ipc: H01L 23/42 20060101ALI20150304BHEP

Ipc: H01L 23/373 20060101ALI20150304BHEP

17Q First examination report despatched

Effective date: 20151014

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20160607