EP2658698B1 - Potting method for lamp chain - Google Patents
Potting method for lamp chain Download PDFInfo
- Publication number
- EP2658698B1 EP2658698B1 EP11808612.3A EP11808612A EP2658698B1 EP 2658698 B1 EP2658698 B1 EP 2658698B1 EP 11808612 A EP11808612 A EP 11808612A EP 2658698 B1 EP2658698 B1 EP 2658698B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- potting
- groove
- fixing support
- printed circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004382 potting Methods 0.000 title claims description 81
- 238000000034 method Methods 0.000 title claims description 24
- 239000000463 material Substances 0.000 claims description 40
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- 229920002635 polyurethane Polymers 0.000 claims description 3
- 239000004814 polyurethane Substances 0.000 claims description 3
- 229920005749 polyurethane resin Polymers 0.000 claims description 3
- 230000000694 effects Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H17/00—Switches having flexible operating part adapted only for pulling, e.g. cord, chain
- H01H17/02—Details
- H01H17/06—Movable parts
- H01H17/08—Operating part, e.g. cord
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
- B29C41/02—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of definite length, i.e. discrete articles
- B29C41/20—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. moulding inserts or for coating articles
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
- F21S4/10—Lighting devices or systems using a string or strip of light sources with light sources attached to loose electric cables, e.g. Christmas tree lights
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1322—Encapsulation comprising more than one layer
Definitions
- the present invention relates to a potting method for a lamp chain.
- Flexible lamp chains are usually widely used in outdoor environments, such as building contour illumination and cove lighting. Generally this type of lamp chains is slim and flexible and then can be simply bent to any shape, and this type of lamp chains also meets IP65 requirement or higher IP levels for outdoor use. Actually, the structure of a flexible lamp chain is very simple. A flexible PCB is embedded into a flexible and transparent glue. However, the difficulty of making this type of flexible lamp chain lies in a potting process.
- the prior art discloses a method of making a flexible lamp chain, wherein, a potting material is directly potted in a flexible PCB board provided with an LED assembly, and the advantage lies in a simple process procedure and a low cost.
- the disadvantage is also very obvious, that is, the potting material may easily strip off the PCB board and the waterproof property is also poor.
- Another existing method for making the flexible lamp chain lies in placing a flexible PCB board in a receiving groove of a potting material and then potting the opening of the receiving groove.
- the object of the present invention is realized through the potting method according to the present invention, and the method comprises the following steps: a) providing a mold having a potting groove; b) providing a fixing support which is fixedly kept in the potting groove; c) fixedly keeping a printed circuit board provided with a light emitting assembly in the fixed support; d) potting a potting material into the potting groove and curing the potting material; and e) removing the mold.
- this method ensures that the printed circuit board will not be twisted in the potting groove, thereby obtaining a lamp chain with the printed circuit board evenly arranged therein after the potting.
- step a) the mold of the potting groove having a U-shape section contour is provided; and in step b) the fixing support consisting of multiple U-shape supports spaced apart is provided.
- the contour of the U-shape support matches the section contour of the potting groove, and the multiple U-shape supports can satisfactorily keep the printed circuit board evenly.
- the fixing support made of a flexible material is provided.
- the fixing support made of a material the same with the potting material is provided. After potting the potting groove with the potting material, the fixing support is made integral with the potting material, thereby obtaining very good waterproof effect.
- the fixing support made of a material similar to the potting material is provided.
- This material does not have aberration with respect to the potting material and is similar to the potting material in material characteristics, and then it can be better fused with the potting material. This obviously broadens the scope of the selection of the materials for making the fixing support.
- the fixing support is clamped in the potting groove.
- the width of the fixing support is slightly larger than the width of the opening of the potting groove, so that the fixing support can be fixedly arranged in the potting groove in a manner of the interference fit.
- the printed circuit board is clamped in the fixing support.
- the width of the printed circuit board is slightly larger than the width of the opening of the fixing support, so that the printed circuit board can be fixedly arranged in the opening of the fixing support in a manner of the interference fit.
- the height of the U-shape support is made to be less than or equal to the depth of the potting groove, so that, after the potting process, the U-shape support will not protrude from the surface of the lamp chain, and this will not destroy the appearance of the lamp chain.
- step c) the depth of the opening of the U-shape support is made to be greater than the thickness of the printed circuit board, which ensures that the potting material can completely cover the printed circuit board, thereby achieving fine waterproof performance.
- the potting material is epoxy resin, polyurethane modified epoxy resin and polyurethane resin.
- Figure 1 is a schematic view of the mold according to the present invention. Seen from Figure 1 , the mold 1 comprises a potting groove 2, and fixing supports designed in U-shape supports 6 and made of a flexible material are arranged in the potting groove 2 spaced apart from each other.
- U-shape supports 6 are fixedly kept in the potting groove 2, which is realized by a design that the width of the U-shape support 6 is slightly larger than the width of the potting groove 2, and in this situation, as the U-shape support 6 is made of a flexible material, and its elasticity allows the U-shape supports 6 to be clamped in the potting groove, that is, they are clamped in the potting groove in a manner of interference fit, this ensures that the U-shape supports 6 will not move with respect to the mold 1. Also, seen from Figure 1 , the height of the U-shape support 6 is smaller than or equal to the depth of the potting groove 2, so that the U-shape supports 6 will not protrude out from the potting material after the potting material is potted.
- FIG. 2 is a schematic view of the mold according to the present invention, and being different from Figure 1 , the U-shape support 6 is provided with a printed circuit board 4, and multiple LED modules as light emitting assemblies 3 are provided on the printed circuit board 4. Seen from Figure 2 , the printed circuit board is fixedly clamped in the U-shape supports 6, which is realized by a design that the width of the opening of the U-shape support 6 is slightly smaller than the width of the printed circuit board 4, and in this situation, the printed circuit board 4 is clamped in the potting groove in a manner of interference fit, this ensures that the printed circuit board 4 will not move with respect to the U-shape supports 6.
- a potting material is potted into the potting groove 2, such as epoxy resin, polyurethane modified epoxy resin and polyurethane resin, and the mold is removed after curing the potting material to obtain a finished lamp chain.
- FIG. 3 is a flow chart of the potting method according to the present invention.
- a mold 1 having a potting groove 2 is provided; in step b), a fixing support is provided, that is, multiple U-shape supports 6, which are fixedly kept in the potting groove 2; in step c), a printed circuit board 4 provided with a light emitting assembly 3 is fixedly kept in the U-shape supports 6; in step d), a potting material 5 is potted into the potting groove 2 and cured; and in step e), the mold 1 is removed to obtain a finished lamp chain.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Packaging Frangible Articles (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Description
- The present invention relates to a potting method for a lamp chain.
- Flexible lamp chains are usually widely used in outdoor environments, such as building contour illumination and cove lighting. Generally this type of lamp chains is slim and flexible and then can be simply bent to any shape, and this type of lamp chains also meets IP65 requirement or higher IP levels for outdoor use. Actually, the structure of a flexible lamp chain is very simple. A flexible PCB is embedded into a flexible and transparent glue. However, the difficulty of making this type of flexible lamp chain lies in a potting process.
- The prior art discloses a method of making a flexible lamp chain, wherein, a potting material is directly potted in a flexible PCB board provided with an LED assembly, and the advantage lies in a simple process procedure and a low cost. However, the disadvantage is also very obvious, that is, the potting material may easily strip off the PCB board and the waterproof property is also poor. Another existing method for making the flexible lamp chain lies in placing a flexible PCB board in a receiving groove of a potting material and then potting the opening of the receiving groove. This advantage of this making method lies in a low cost, use of less potting material and waterproof property, and while the disadvantage is that the PCB board per se cannot be arranged evenly in the receiving groove, and thus the PCB board is arranged twisted in the finished flexible lamp chain and is not beautiful in appearance. The most conventional method is to directly package the PCB using a potting material, which achieves fine waterproof effect, however, this still cannot arrange the PCB board evenly in the flexible lamp chain.
US 5 931 577 A discloses further relevant prior art. - Hence, it is an object of the present invention to provide an improved potting method for a lamp chain, and the lamp chain made using this method has a good appearance, the printed circuit board provided in the lamp chain is arranged evenly in the finished lamp chain, and also, this lamp chain has fine waterproof performance.
- The object of the present invention is realized through the potting method according to the present invention, and the method comprises the following steps: a) providing a mold having a potting groove; b) providing a fixing support which is fixedly kept in the potting groove; c) fixedly keeping a printed circuit board provided with a light emitting assembly in the fixed support; d) potting a potting material into the potting groove and curing the potting material; and e) removing the mold. In this method, as the printed circuit board is fixedly kept in the fixing support and the fixing support is fixedly kept in the potting groove, this ensures that the printed circuit board will not be twisted in the potting groove, thereby obtaining a lamp chain with the printed circuit board evenly arranged therein after the potting. According to the present invention, in step a), the mold of the potting groove having a U-shape section contour is provided; and in step b) the fixing support consisting of multiple U-shape supports spaced apart is provided. The contour of the U-shape support matches the section contour of the potting groove, and the multiple U-shape supports can satisfactorily keep the printed circuit board evenly.
- As put forward in a preferable design according to the present invention, in step b), the fixing support made of a flexible material is provided. Preferably, in step b), the fixing support made of a material the same with the potting material is provided. After potting the potting groove with the potting material, the fixing support is made integral with the potting material, thereby obtaining very good waterproof effect.
- Preferably, in step b), the fixing support made of a material similar to the potting material is provided. This material does not have aberration with respect to the potting material and is similar to the potting material in material characteristics, and then it can be better fused with the potting material. This obviously broadens the scope of the selection of the materials for making the fixing support.
- Preferably, in step b), the fixing support is clamped in the potting groove. Advantageously, the width of the fixing support is slightly larger than the width of the opening of the potting groove, so that the fixing support can be fixedly arranged in the potting groove in a manner of the interference fit.
- Preferably, in step c), the printed circuit board is clamped in the fixing support. Advantageously, the width of the printed circuit board is slightly larger than the width of the opening of the fixing support, so that the printed circuit board can be fixedly arranged in the opening of the fixing support in a manner of the interference fit.
- Preferably, in step b), the height of the U-shape support is made to be less than or equal to the depth of the potting groove, so that, after the potting process, the U-shape support will not protrude from the surface of the lamp chain, and this will not destroy the appearance of the lamp chain.
- As put forward in a preferable design according to the present invention, in step c), the depth of the opening of the U-shape support is made to be greater than the thickness of the printed circuit board, which ensures that the potting material can completely cover the printed circuit board, thereby achieving fine waterproof performance.
- Preferably, the potting material is epoxy resin, polyurethane modified epoxy resin and polyurethane resin.
- The accompanying drawings constitute a part of the description and are used to provide further understanding of the present invention. Such accompanying drawings illustrate the embodiments of the present invention and are used to describe the principles of the present invention together with the description. In the accompanying drawings the same components are represented using the same reference signs. As shown in the drawings:
-
Figure 1 is a schematic view of the mold according to the present invention provided with a fixing support therein; -
Figure 2 is a schematic view of the mold according to the present invention provided with a fixing support and a printed circuit board therein; and -
Figure 3 is flow chart of the potting method according to the present invention. -
Figure 1 is a schematic view of the mold according to the present invention. Seen fromFigure 1 , themold 1 comprises apotting groove 2, and fixing supports designed in U-shape supports 6 and made of a flexible material are arranged in thepotting groove 2 spaced apart from each other. These U-shape supports 6 are fixedly kept in thepotting groove 2, which is realized by a design that the width of the U-shapesupport 6 is slightly larger than the width of thepotting groove 2, and in this situation, as the U-shapesupport 6 is made of a flexible material, and its elasticity allows the U-shape supports 6 to be clamped in the potting groove, that is, they are clamped in the potting groove in a manner of interference fit, this ensures that the U-shape supports 6 will not move with respect to themold 1. Also, seen fromFigure 1 , the height of theU-shape support 6 is smaller than or equal to the depth of thepotting groove 2, so that the U-shape supports 6 will not protrude out from the potting material after the potting material is potted. -
Figure 2 is a schematic view of the mold according to the present invention, and being different fromFigure 1 , the U-shapesupport 6 is provided with a printedcircuit board 4, and multiple LED modules aslight emitting assemblies 3 are provided on the printedcircuit board 4. Seen fromFigure 2 , the printed circuit board is fixedly clamped in the U-shape supports 6, which is realized by a design that the width of the opening of theU-shape support 6 is slightly smaller than the width of the printedcircuit board 4, and in this situation, the printedcircuit board 4 is clamped in the potting groove in a manner of interference fit, this ensures that the printedcircuit board 4 will not move with respect to the U-shape supports 6. After arranging the printedcircuit board 4, a potting material is potted into thepotting groove 2, such as epoxy resin, polyurethane modified epoxy resin and polyurethane resin, and the mold is removed after curing the potting material to obtain a finished lamp chain. -
Figure 3 is a flow chart of the potting method according to the present invention. In the potting method according to the present invention, in step a), amold 1 having apotting groove 2 is provided; in step b), a fixing support is provided, that is, multiple U-shape supports 6, which are fixedly kept in thepotting groove 2; in step c), a printedcircuit board 4 provided with alight emitting assembly 3 is fixedly kept in the U-shape supports 6; in step d), a potting material 5 is potted into thepotting groove 2 and cured; and in step e), themold 1 is removed to obtain a finished lamp chain. - The descriptions above are only preferable embodiments of the present invention and are not used to restrict the present invention. For those skilled in the art, the present invention may have various changes and variations.
-
- 1
- Mold
- 2
- Potting groove
- 3
- Light emitting assembly (LED module)
- 4
- Printed circuit board (PCB)
- 5
- Potting material
- 6
- U-shape support
Claims (9)
- A potting method for a lamp chain, wherein the method comprises the following steps: a) providing a mold (1) having a potting groove (2); b) providing a fixing support which is fixedly kept in the potting groove (2); c) fixedly keeping a printed circuit board (4) provided with a light emitting assembly (3) in the fixed support; d) potting a potting material (5) into the potting groove (2) and curing the potting material (5); and e) removing the mold (1), characterized in that, in step a), the mold (1) of the potting groove (2) having a U-shape section contour is provided; and in step b) the fixing support consisting of multiple U-shape supports (6) spaced apart is provided.
- The potting method according to claim 1, characterized in that, in step b), the fixing support made of a flexible material is provided.
- The potting material according to claim 2, characterized in that, in step b), the fixing support made of a material the same with the potting material (5) is provided.
- The potting material according to claim 2, characterized in that, in step b), the fixing support made of a material similar to the potting material (5) is provided.
- The potting method according to claim 1, characterized in that, in step b), the fixing support is clamped in the potting groove (2).
- The potting method according to claim 1, characterized in that, in step c), the printed circuit board (4) is clamped in the fixing support.
- The potting method according to any of claims 1 to 6, characterized in that, in step b), the height of the U-shape support 6 is made to be less than or equal to the depth of the potting groove (2).
- The potting method according to any of claims 1 to 7, characterized in that, in step c), the depth of the opening of the U-shape support (6) is made to be greater than the thickness of the printed circuit board (4).
- The potting method according to any of claims 1 to 8, characterized in that the potting material (5) is epoxy resin, polyurethane modified epoxy resin and polyurethane resin.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010616336.2A CN102563557B (en) | 2010-12-30 | 2010-12-30 | Method for packing for lamp bar |
PCT/EP2011/072578 WO2012089494A1 (en) | 2010-12-30 | 2011-12-13 | Potting method for lamp chain |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2658698A1 EP2658698A1 (en) | 2013-11-06 |
EP2658698B1 true EP2658698B1 (en) | 2015-11-18 |
Family
ID=45491534
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP11808612.3A Active EP2658698B1 (en) | 2010-12-30 | 2011-12-13 | Potting method for lamp chain |
Country Status (4)
Country | Link |
---|---|
US (1) | US9508506B2 (en) |
EP (1) | EP2658698B1 (en) |
CN (1) | CN102563557B (en) |
WO (1) | WO2012089494A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103633224A (en) * | 2013-11-21 | 2014-03-12 | 东莞美盛电器制品有限公司 | LED (light-emitting diode) light source module and production process thereof |
CN110440166B (en) * | 2019-08-07 | 2021-11-09 | 广州市莱帝亚照明股份有限公司 | Manufacturing method of LED waterproof lamp strip |
IT202000028001A1 (en) * | 2020-11-23 | 2022-05-23 | Demak S R L | PROCESS OF MANUFACTURING A LIGHTING DEVICE |
Family Cites Families (17)
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US4305796A (en) * | 1980-09-12 | 1981-12-15 | International Harvester Company | Methods of preparing polyimides and artifacts composed thereof |
US4761720A (en) * | 1987-05-14 | 1988-08-02 | Wolo Manufacturing Corporation | Illuminated tape |
CA2106112A1 (en) * | 1992-09-22 | 1994-03-23 | Unison Industries, Inc. | Potted electrical components and methods of making the same |
JP3018016B2 (en) * | 1996-10-01 | 2000-03-13 | エイテックス株式会社 | Display device manufacturing method |
US6896834B2 (en) * | 2001-09-10 | 2005-05-24 | Alliant Techsystems, Inc. | Method of applying ablative insulation coatings |
JP2006073600A (en) * | 2004-08-31 | 2006-03-16 | Renesas Technology Corp | Semiconductor device and manufacturing method thereof |
JP4524454B2 (en) * | 2004-11-19 | 2010-08-18 | ルネサスエレクトロニクス株式会社 | Electronic device and manufacturing method thereof |
WO2006093889A2 (en) * | 2005-02-28 | 2006-09-08 | Color Kinetics Incorporated | Configurations and methods for embedding electronics or light emitters in manufactured materials |
WO2008078746A1 (en) * | 2006-12-26 | 2008-07-03 | Panasonic Corporation | Semiconductor element mounting structure and semiconductor element mounting method |
JP2009117536A (en) * | 2007-11-05 | 2009-05-28 | Towa Corp | Resin-sealed light emitter, and manufacturing method thereof |
CN101504938A (en) * | 2008-02-05 | 2009-08-12 | 华信精密股份有限公司 | LED encapsulation structure and LED encapsulation method |
KR101458077B1 (en) * | 2008-05-01 | 2014-11-04 | 삼성전자 주식회사 | Light Emitting Device and Preparing Method thereof |
JP2010114427A (en) * | 2008-10-08 | 2010-05-20 | Sumitomo Chemical Co Ltd | Substrate for use in chip type led package |
JP2010135763A (en) * | 2008-11-05 | 2010-06-17 | Toshiba Corp | Apparatus for manufacturing led device, method for manufacturing the same, and led device |
JP5416946B2 (en) * | 2008-11-05 | 2014-02-12 | 株式会社東芝 | Phosphor solution |
US8555493B2 (en) * | 2010-04-23 | 2013-10-15 | Psion, Inc. | Method of manufacturing a molded printed circuit board |
EP2447595B1 (en) * | 2010-10-27 | 2017-08-02 | LG Innotek Co., Ltd. | Light emitting module |
-
2010
- 2010-12-30 CN CN201010616336.2A patent/CN102563557B/en active Active
-
2011
- 2011-12-13 EP EP11808612.3A patent/EP2658698B1/en active Active
- 2011-12-13 US US13/976,066 patent/US9508506B2/en active Active
- 2011-12-13 WO PCT/EP2011/072578 patent/WO2012089494A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2012089494A1 (en) | 2012-07-05 |
EP2658698A1 (en) | 2013-11-06 |
CN102563557A (en) | 2012-07-11 |
US9508506B2 (en) | 2016-11-29 |
US20140191440A1 (en) | 2014-07-10 |
CN102563557B (en) | 2016-08-17 |
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