EP2638567A2 - Method for loading and unloading a cassette - Google Patents

Method for loading and unloading a cassette

Info

Publication number
EP2638567A2
EP2638567A2 EP11833588.4A EP11833588A EP2638567A2 EP 2638567 A2 EP2638567 A2 EP 2638567A2 EP 11833588 A EP11833588 A EP 11833588A EP 2638567 A2 EP2638567 A2 EP 2638567A2
Authority
EP
European Patent Office
Prior art keywords
process cartridge
cassette
workpieces
loading
trays
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP11833588.4A
Other languages
German (de)
French (fr)
Inventor
Michael Schilp
Adolf Zitzmann
Josef Zimmermann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZS-HANDLING GMBH
Original Assignee
Zimmermann and Schilp Handhabungstechnik GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zimmermann and Schilp Handhabungstechnik GmbH filed Critical Zimmermann and Schilp Handhabungstechnik GmbH
Publication of EP2638567A2 publication Critical patent/EP2638567A2/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B5/00—Electrostatic spraying apparatus; Spraying apparatus with means for charging the spray electrically; Apparatus for spraying liquids or other fluent materials by other electric means
    • B05B5/08—Plant for applying liquids or other fluent materials to objects
    • B05B5/082—Plant for applying liquids or other fluent materials to objects characterised by means for supporting, holding or conveying the objects
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/6723—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one plating chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49815—Disassembling

Definitions

  • the present invention relates to a loading and unloading process for a process cartridge, the z. B. is used in plasma coating processes.
  • Such a process cartridge has a multiplicity of spaced carrier plates. In the spaces between these carrier plates to be processed flat workpieces such.
  • B. from semiconductor technology multiple grippers known that spaced a stack of these workpieces and at the same time bring in the process cartridge and can remove again. However, these multiple grippers are mainly suitable to store or resume the workpieces in the narrow compartments of the process cartridge.
  • the disadvantage of this technology is that the gripper systems required for this purpose are relatively complicated and thus expensive, or that erroneous loading frequently occurs when using grippers with lower precision and reliability, resulting in a relatively high fraction of wafer fracture.
  • Another disadvantage of the gripper systems is that they are not available for different sizes of process cartridges and therefore must be manufactured as custom-made. This increases the overall costs of such a process.
  • the object of the invention to provide a loading and unloading method for a process cartridge in which the workpieces can be supplied with high reliability quickly and safely and also removed again. Furthermore, the method should require a cost-effective device technology.
  • a loading and unloading process for a process cartridge which comprises the following process steps: a. Provision of a removable and mountable by means of a disassembly and assembly robot process cartridge, a disassembly and assembly robot any kind of fully automatic automatically operating device is to be understood.
  • the process cartridge is provided for a plasma coating process. It should be noted that due to the complicated handling of the very thin workpieces the process is particularly suitable for a plasma coating process.
  • the process cartridge is provided for an electrostatic Belackungs- process.
  • Fig. 1 shows a portion of a process cartridge 1 having a plurality of trays 2. It can be seen that the loading and unloading of workpieces with the conventional technology is difficult.

Abstract

The present invention relates to a method for loading and unloading a cassette which is used, for example, in plasma-coating processes, wherein the following method steps are carried out: a. supplying a cassette (1) which can be dismantled and assembled by means of a dismantling and assembling robot, b. automatically dismantling the cassette such that the floors (2) of the cassette are present in a separated state, c. feeding and assigning the floors (2) to at least one fitting machine, which fits the floors (2) with workpieces which are to be processed, d. assembling the fitted floors (2) to form the cassette (1), e. feeding the cassette (1) to the location at which the process is to be carried out, f. carrying out the process, g. feeding the cassette (1) to the dismantling and assembling robot or a further dismantling and assembling robot, h. dismantling the cassette such that the floors (2) of the cassette are present in a separated state, and i. automatically removing the processed workpieces.

Description

Belade- und Entladeverfahren für eine Prozesskassette  Loading and unloading process for a process cartridge
Die vorliegende Erfindung bezieht sich auf ein Belade- und Entladeverfahren für eine Prozesskassette, die z. B. bei Plasmabeschichtungsprozessen eingesetzt wird. The present invention relates to a loading and unloading process for a process cartridge, the z. B. is used in plasma coating processes.
Eine derartige Prozesskassette weist eine Vielzahl von beabstandeter Trägerplat- ten auf. In die Zwischenräume zwischen diesen Trägerplatten werden die zu bearbeitenden flachen Werkstücke, wie z. B. Wafer eingebracht und nach der Bearbeitung wieder entnommen. Für diese Arbeitsschritte sind z. B. aus der Halbleitertechnologie Mehrfachgreifer bekannt, die einen Stapel dieser Werkstücke beabstandet und gleichzeitig in die Prozesskassette einbringen und wieder entneh- men können. Diese Mehrfachgreifer sind jedoch vorwiegend dazu geeignet, die Werkstücke in den schmalen Fächern der Prozesskassette abzulegen oder wieder aufzunehmen. Such a process cartridge has a multiplicity of spaced carrier plates. In the spaces between these carrier plates to be processed flat workpieces such. B. Wafer introduced and removed again after processing. For these steps are z. B. from semiconductor technology multiple grippers known that spaced a stack of these workpieces and at the same time bring in the process cartridge and can remove again. However, these multiple grippers are mainly suitable to store or resume the workpieces in the narrow compartments of the process cartridge.
Es gibt jedoch Einsatzfälle, bei denen die Werkstücke in den Fächern der Pro- zesskassette auch fixiert werden müssen. Diese Fixierung kann z. B. dann erforderlich werden, wenn die bestückte Prozesskassette anschließend von einem Roboter in verschiedenen Richtungen bewegt wird und die Werkstücke ohne eine Fixierung herausfallen würden. Eine weitere Notwendigkeit zur Fixierung besteht z. B. bei Plasmabeschichtun- gen. Dazu ist es notwendig, dass die Werkstücke einen sicheren elektrischen Kontakt zu einer Spannungsquelle haben. Das wird z. B. dadurch erreicht, in dem der rechteckige Wafer mit einem Vakuumgreifer in das Fach eingefahren und dann gedreht wird, so dass die Ecken des Wafers unter Halte- und Kontaktpins gedrückt werden, sodass sowohl eine mechanische Fixierung als auch eine elektrische Kontaktierung erfolgt. Die Entnahme des Wafers erfolgt auf die gleiche Weise, d. h., der Greifer fährt in das Fach ein, saugt den Wafer an und dreht ihn so, dass er ohne Kollision mit den Halte- und Kontaktpins herausgezogen werden kann. However, there are applications in which the workpieces must also be fixed in the compartments of the process cassette. This fixation can z. B. then be required if the populated process cartridge is then moved by a robot in different directions and the workpieces would fall out without a fixation. Another need for fixation is z. For this it is necessary that the workpieces have a safe electrical contact to a voltage source. This is z. B. thereby achieved, in which the rectangular wafer with a vacuum gripper retracted into the tray and is then rotated so that the corners of the wafer are pressed under holding and contact pins, so that both a mechanical fixation as well as an electrical contact takes place. The removal of the wafer takes place in the same way, ie, the gripper moves into the compartment, sucks the wafer and rotates it so that it can be pulled out without colliding with the holding and contact pins.
Der Nachteil dieser Technologie ist, dass die dazu erforderlichen Greifersysteme relativ aufwendig und somit teuer sind oder dass bei einem Einsatz von Greifern mit geringerer Präzision und Zuverlässigkeit es häufig zu Fehlbestückungen kommt, sodass ein relativ hoher Anteil an Waferbruch entsteht. Ein weiterer Nachteil der Greifersysteme besteht darin, dass sie nicht für unterschiedliche Größen der Prozesskassetten zur Verfügung stehen und daher als Sonderanfertigungen hergestellt werden müssen. Dadurch verteuern sich die Gesamtkosten eines soi- chen Prozesses. The disadvantage of this technology is that the gripper systems required for this purpose are relatively complicated and thus expensive, or that erroneous loading frequently occurs when using grippers with lower precision and reliability, resulting in a relatively high fraction of wafer fracture. Another disadvantage of the gripper systems is that they are not available for different sizes of process cartridges and therefore must be manufactured as custom-made. This increases the overall costs of such a process.
Somit besteht die Aufgabe der Erfindung, ein Belade- und Entladeverfahren für eine Prozesskassette bereitzustellen, bei welchem die Werkstücke mit einer hohen Zuverlässigkeit schnell und sicher zugeführt und ebenso wieder entnommen werden können. Weiterhin soll das Verfahren eine kostengünstige Gerätetechnik erfordern. Thus, the object of the invention to provide a loading and unloading method for a process cartridge in which the workpieces can be supplied with high reliability quickly and safely and also removed again. Furthermore, the method should require a cost-effective device technology.
Diese Aufgabe der Erfindung wird mit einem Belade- und Entladeverfahren für eine Prozesskassette gelöst, welches folgende Verfahrensschritte aufweist: a. Bereitstellen einer mittels eines Demontage- und Montage-Roboters demontierbaren und montierbaren Prozesskassette, wobei unter einem Demontage- und Montage-Roboter jede Art vollautomatisch automatisch arbeitende Vorrichtung zu verstehen ist. This object of the invention is achieved by a loading and unloading process for a process cartridge, which comprises the following process steps: a. Provision of a removable and mountable by means of a disassembly and assembly robot process cartridge, a disassembly and assembly robot any kind of fully automatic automatically operating device is to be understood.
b. automatisches Demontieren der Prozesskassette derart, dass die Böden der Prozesskassette separiert vorliegen, b. automatic dismantling of the process cartridge in such a way that the bottoms of the process cartridge are separated,
c. Zuführen und Zuordnen der Böden zu wenigstens einem Bestückungsautomaten, der die Böden mit zu bearbeitenden Werkstücken bestückt, d. Montieren der bestückten Böden zu der Prozesskassette, e. Zuführen der Prozesskassette zu dem Prozessort, an dem der Prozess durchgeführt werden soll, c. Feeding and assigning the trays to at least one automatic pick and place machine which equips the trays with workpieces to be processed, d. Mount the assembled trays to the process cartridge, e. Feeding the process cartridge to the process location where the process is to be performed
f. Durchführen des Prozesses, f. Performing the process,
g. Zuführen der Prozesskassette zu dem Demontage- und Montage-Roboter oder einem weiteren Demontage- und Montage-Roboter, G. Feeding the process cartridge to the disassembly and assembly robot or another disassembly and assembly robot,
h. Demontieren der Prozesskassette derart, dass die Böden der Prozesskassette separiert vorliegen und H. Disassemble the process cartridge such that the bottoms of the process cartridge are separated and
i, automatisches Entnehmen der bearbeiteten Werkstücke. i, automatic removal of machined workpieces.
Dem Fachmann ist klar, dass nunmehr die Böden erneut mit Werkstücken bestückt werden. Es bedarf keiner weiteren Erläuterung, dass die verschiedenen Böden auch an mehreren Bestückungsstationen bestückt werden können. Dem Fachmann ist auch geläufig, wie eine Vielzahl von Böden mittels eines Roboters zu einer Prozesskassette 1 wieder automatisch zusammenzufügen ist. It is clear to the person skilled in the art that now the floors will again be equipped with workpieces. It needs no further explanation that the different floors can be equipped at several placement stations. The person skilled in the art is also familiar with how a multiplicity of trays can be automatically reassembled by means of a robot to form a process cassette 1.
Durch diesen überraschenden Paradigmenwechsel in der Bestückungstechnologie ist es möglich, mit vergleichsweise geringem technologischen Aufwand eine sehr schnelle, zuverlässige und präzise Bestückung vorzunehmen, da die Werk- stücke nicht mehr seitlich in schmale Schlitze oder Fächer eingefädelt werden müssen, sondern relativ unkompliziert von oben auf die vereinzelten Böden 2 aufgesetzt und ggf. befestigt werden können. Besonders deutlich wird der Vorteil des erfindungsgemäßen Verfahrens, wenn es erforderlich ist, in den schmalen Fächern der Prozess kassette je ein erstes Werkstück an der Unterseite des Faches und ein zweites Werkstück parallel dazu an der Oberseite des Faches zu befestigen. Bei dem erfindungsgemäßen Verfahren wird dazu lediglich der Boden 2 gewendet, sodass die Rückseite ebenfalls mit Werkstücken bestückt werden kann. In diesem Fall sind Vorrichtungen zur Fixierung des Werkstücks auf dem Boden 2 vorgesehen, sodass die auf einer Seite aufgelegten Werkstücke nicht herunterfal- len, wenn der Boden gewendet wird. This surprising paradigm shift in the placement technology makes it possible to carry out a very fast, reliable and precise assembly with comparatively little technological effort, since the work pieces no longer have to be threaded laterally into narrow slots or compartments, but relatively uncomplicatedly from above onto the isolated floors 2 can be placed and possibly attached. Particularly clear is the advantage of the method according to the invention, when it is necessary to attach in the narrow compartments of the process cartridge depending on a first workpiece on the underside of the tray and a second workpiece parallel thereto at the top of the tray. In the method according to the invention only the bottom 2 is turned over, so that the back can also be equipped with workpieces. In this case, devices for fixing the workpiece are provided on the floor 2 so that the workpieces placed on one side do not fall down when the floor is turned.
Nach Anspruch 2 ist die Prozesskassette für einen Plasmabeschichtungsprozess vorgesehen. Es ist zu erwähnen, dass aufgrund des komplizierten Handlings der sehr dünnen Werkstücke das Verfahren für einem Plasmabeschichtungsprozess besonders geeignet ist. According to claim 2, the process cartridge is provided for a plasma coating process. It should be noted that due to the complicated handling of the very thin workpieces the process is particularly suitable for a plasma coating process.
Nach Anspruch 3 ist die Prozesskassette für einen elektrostatischen Belackungs- prozess vorgesehen. According to claim 3, the process cartridge is provided for an electrostatic Belackungs- process.
Die Fig. 1 zeigt einen Abschnitt einer Prozesskassette 1 mit einer Vielzahl von Böden 2. Es ist erkennbar, dass das Ein- und Ausbringen von Werkstücken mit der herkömmlichen Technologie schwierig ist. Fig. 1 shows a portion of a process cartridge 1 having a plurality of trays 2. It can be seen that the loading and unloading of workpieces with the conventional technology is difficult.

Claims

Ansprüche claims
1. Belade- und Entladeverfahren für eine Prozesskassette (1 ), welches folgende Verfahrensschritte aufweist: a. Bereitstellen einer mittels eines Demontage- und Montage-Roboters demontierbaren und montierbaren Prozesskassette (1 ), b. automatisches Demontieren der Prozesskassette derart, dass die Böden (2) der Prozesskassette separiert vorliegen, c. Zuführen und Zuordnen der Böden (2) zu wenigstens einem Bestückungsautomaten, der die Böden (2) mit zu bearbeitenden Werkstücken bestückt, d. Montieren der bestückten Böden (2} zu der Prozesskassette (1), e. Zuführen der Prozesskassette (1) zu dem Prozessort, an dem der Prozess durchgeführt werden soll, f. Durchführen des Prozesses, g. Zuführen der Prozesskassette {1 ) zu dem Demontage- und Montage-Roboter oder einem weiteren Demontage- und Montage-Roboter, h. Demontieren der Prozesskassette derart, dass die Böden (2) der Prozesskas- sette separiert vorliegen und t. automatisches Entnehmen der bearbeiteten Werkstücke. 1. Loading and unloading method for a process cartridge (1), which comprises the following method steps: a. Providing a process cartridge (1) removable and mountable by means of a disassembly and assembly robot, b. automatic disassembly of the process cartridge such that the trays (2) of the process cartridge are separated, c. Feeding and allocating the trays (2) to at least one automatic pick and place machine which equips the trays (2) with workpieces to be processed, d. Mounting the loaded trays (2) to the process cartridge (1), e) feeding the process cartridge (1) to the process location where the process is to be performed, f) performing the process, g Disassembly and assembly robot or another disassembly and assembly robot, h. Disassemble the process cartridge in such a way that the trays (2) of the process cartridge are separated and t. automatic removal of machined workpieces.
2. Belade- und Entladeverfahren nach Anspruch 1 , wobei die Prozesskassette für einen Plasmabesch ichtungsprozess vorgesehen ist. 2. Loading and unloading method according to claim 1, wherein the process cartridge is provided for a plasma coating process.
3. Belade- und Entladeverfahren nach Anspruch 1 , wobei die Prozesskassette für einen elektrostatischen Belackungsprozess vorgesehen ist. 3. Loading and unloading method according to claim 1, wherein the process cartridge is provided for an electrostatic Belackungsprozess.
EP11833588.4A 2010-11-11 2011-11-11 Method for loading and unloading a cassette Withdrawn EP2638567A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102010050918 2010-11-11
PCT/DE2011/001977 WO2012062288A2 (en) 2010-11-11 2011-11-11 Method for loading and unloading a cassette

Publications (1)

Publication Number Publication Date
EP2638567A2 true EP2638567A2 (en) 2013-09-18

Family

ID=45974179

Family Applications (1)

Application Number Title Priority Date Filing Date
EP11833588.4A Withdrawn EP2638567A2 (en) 2010-11-11 2011-11-11 Method for loading and unloading a cassette

Country Status (7)

Country Link
US (1) US20140041186A1 (en)
EP (1) EP2638567A2 (en)
JP (1) JP2014503989A (en)
KR (1) KR20130117809A (en)
CN (1) CN103283012A (en)
DE (1) DE102011118276A1 (en)
WO (1) WO2012062288A2 (en)

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KR101729454B1 (en) 2013-07-22 2017-04-21 제트에스-핸들링 게엠베하 Device for inspecting workpiece surfaces and strip materials
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Also Published As

Publication number Publication date
WO2012062288A2 (en) 2012-05-18
DE102011118276A1 (en) 2012-08-23
US20140041186A1 (en) 2014-02-13
KR20130117809A (en) 2013-10-28
WO2012062288A3 (en) 2012-08-23
CN103283012A (en) 2013-09-04
JP2014503989A (en) 2014-02-13

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