EP2630458B1 - Temperature sensor device - Google Patents

Temperature sensor device Download PDF

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Publication number
EP2630458B1
EP2630458B1 EP11770812.3A EP11770812A EP2630458B1 EP 2630458 B1 EP2630458 B1 EP 2630458B1 EP 11770812 A EP11770812 A EP 11770812A EP 2630458 B1 EP2630458 B1 EP 2630458B1
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EP
European Patent Office
Prior art keywords
temperature
region
sensor device
carrier substrate
temperature sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Not-in-force
Application number
EP11770812.3A
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German (de)
French (fr)
Other versions
EP2630458A2 (en
Inventor
Johannes Ante
Philippe Grass
Markus Herrmann
Andreas Ott
Willibald Reitmeier
Denny SCHÄDLICH
Manfred Weigl
Andreas Wildgen
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Continental Automotive GmbH
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Continental Automotive GmbH
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Publication of EP2630458A2 publication Critical patent/EP2630458A2/en
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Publication of EP2630458B1 publication Critical patent/EP2630458B1/en
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/18—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K13/00—Thermometers specially adapted for specific purposes
    • G01K13/02—Thermometers specially adapted for specific purposes for measuring temperature of moving fluids or granular materials capable of flow
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K13/00—Thermometers specially adapted for specific purposes
    • G01K13/02—Thermometers specially adapted for specific purposes for measuring temperature of moving fluids or granular materials capable of flow
    • G01K13/024—Thermometers specially adapted for specific purposes for measuring temperature of moving fluids or granular materials capable of flow of moving gases
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K3/00—Thermometers giving results other than momentary value of temperature
    • G01K3/08—Thermometers giving results other than momentary value of temperature giving differences of values; giving differentiated values
    • G01K3/14—Thermometers giving results other than momentary value of temperature giving differences of values; giving differentiated values in respect of space
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/42—Circuits effecting compensation of thermal inertia; Circuits for predicting the stationary value of a temperature
    • G01K7/427—Temperature calculation based on spatial modeling, e.g. spatial inter- or extrapolation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K2205/00—Application of thermometers in motors, e.g. of a vehicle
    • G01K2205/04—Application of thermometers in motors, e.g. of a vehicle for measuring exhaust gas temperature

Definitions

  • the invention relates to a temperature sensor device.
  • a state variable that is used for monitoring and / or controlling the exhaust gas purification system is, for example, the exhaust gas temperature.
  • the heating device has a carrier and three planar heating elements arranged thereon.
  • the heating elements are applied as a thick film heating surface on the carrier, which is formed like a channel.
  • the heater has two temperature sensors provided on the outside of the carrier, wherein preferably a temperature sensor near one end of the carrier and the other temperature sensor close to the other end are provided in the longitudinal direction parallel to the recess.
  • GB 2 120 453 A discloses a temperature sensor for an anemometer.
  • the temperature sensor has a ceramic substrate.
  • the temperature sensor has two temperature-sensitive resistance elements which comprise a resistance layer. Between the resistance elements, an opening is arranged through the substrate.
  • the object underlying the invention is to provide a temperature sensor device which enables a precise determination of a gas temperature.
  • the invention is characterized by a temperature sensor device which has a carrier substrate as well as a first and a second temperature measuring structure.
  • the carrier substrate has a first region and a second region, wherein the first region is exposed to a gas flow during operation of the temperature sensor device and the second region is predeterminedly spaced from the first region in the axial direction along a longitudinal axis of the carrier substrate.
  • the first temperature measuring structure is arranged in the first area.
  • the second temperature measuring structure is arranged in the second area.
  • the first region represents a first end region of the carrier substrate and the second region a second end region of the carrier substrate.
  • the carrier substrate has a ceramic material.
  • the gas stream may flow in an exhaust line of an internal combustion engine.
  • the first temperature measuring structure and the second temperature measuring structure make it possible to detect a plurality of measured quantities that can be used for a precise determination of a gas temperature of the gas stream, preferably for determining an exhaust gas temperature of an exhaust gas in the exhaust gas line.
  • measuring and evaluating a temperature-dependent resistance of the first and second temperature measuring structures makes it possible to determine the gas temperature of the gas.
  • the detected measured variables and / or state variables of the gas stream derived therefrom can be used for different applications, for example for one or more control or regulating processes of the internal combustion engine be used.
  • a first sensor temperature in the region of the first temperature-measuring structure and a second sensor temperature in the region of the second temperature-measuring structure can be detected.
  • the gas temperature of the gas can be determined very precisely.
  • a possible thermal connection of the carrier substrate to components which do not have the gas temperature can lead to the first and / or the second sensor temperature differing from the gas temperature.
  • the carrier substrate is arranged in a housing which is attached to an exhaust pipe, whereby a thermal coupling with the exhaust pipe can arise. A driving speed and an ambient temperature can thus influence a temperature of the temperature measuring device.
  • Detecting the first sensor temperature and the second sensor temperature allows the gas temperature to be easily determined depending on the first sensor temperature and the second sensor temperature, for example, independent of heat flow from the carrier substrate to the exhaust pipe. This is particularly advantageous because the heat flow can depend on an ambient temperature and a driving speed and vehicle-specific structural conditions. A thermal decoupling between the temperature sensor device and the housing and / or contacting is thus not required.
  • the temperature sensor device can also be designed and arranged such that, during operation of the temperature sensor device, the second region can also be at least partially exposed to the gas flow.
  • the spacing between the first region and the second region can be predeterminable, for example, depending on a desired arrangement of the temperature sensor device in the exhaust system of an internal combustion engine and / or dependent on a predetermined minimum temperature difference between the first sensor temperature and second sensor temperature at a given gas temperature.
  • the carrier substrate can additionally be used for electrical connections which extend into a colder area outside the exhaust gas line. In this colder area can be transferred from a wiring on the carrier substrate on a plastic insulating cable guide.
  • the gas temperature can also be determined precisely when the first sensor temperature and the second sensor temperature each have a lower temperature than the gas temperature. As a result, demands on the high-temperature strength of the temperature sensor device can be reduced.
  • the arrangement of the first temperature measuring structure in the first end region of the carrier substrate and the second temperature measuring structure in the second end region of the carrier substrate enables cost-effective production.
  • the carrier substrate may essentially comprise the ceramic material, in particular consist of the ceramic material.
  • the ceramic material advantageously has a high electrical insulation and at the same time a high thermal conductivity.
  • the temperature sensor device may have a high response speed with respect to a temperature change. This can contribute to the fact that a temperature to be measured and / or a change in a temperature can be detected very precisely.
  • the ceramic material may be formed as aluminum oxide (Al 2 O 3 ).
  • the temperature measuring structure is connected via supply lines with connection contacts, which are arranged in the second region.
  • the second temperature-measuring structure can also be connected via leads to further connection contacts, which are preferably arranged in the second region of the carrier substrate.
  • the first temperature measuring structure and / or the second temperature measuring structure have a platinum alloy.
  • the first and second temperature measuring structures may essentially comprise the platinum alloy, in particular consist of the platinum alloy. This can contribute to the fact that the first and / or the second temperature measuring structure has a high resistance to high temperatures or mechanical and / or chemical loads.
  • the first temperature measuring structure and the second temperature measuring structure as well as the respective supply lines are formed in a first substrate plane and comprise a metallic alloy.
  • the metallic alloy may be formed as a platinum alloy.
  • the first temperature measuring structure and the second temperature measuring structure as well as the respective supply lines are arranged on a first surface of the carrier substrate.
  • the first temperature measuring structure is arranged in a first substrate plane of the carrier substrate and the second temperature measuring structure in a second substrate plane, for. B. on a second surface of the carrier substrate.
  • These first and second substrate planes may be approximately parallel and have an orthogonal predetermined distance to the longitudinal axis.
  • FIG. 1 shows a temperature sensor device 100.
  • the temperature sensor device 100 may be arranged for example in an exhaust line of an internal combustion engine of a motor vehicle. During operation of the internal combustion engine, a gas, in particular an exhaust gas, can flow in the exhaust gas line.
  • the temperature sensor device 100 has a carrier substrate 10.
  • the carrier substrate 10 may consist of a ceramic material or comprise at least one ceramic material, for example aluminum oxide (Al 2 O 3 ).
  • the temperature sensor device 100 has a first temperature measuring structure T1 and a second temperature measuring structure T2.
  • the first T1 and second temperature measurement structure T2 each have a meander-shaped conductor track guidance.
  • the first temperature measuring structure T1 is arranged, for example, in a first region B1 of the carrier substrate 10, wherein the first region B1 of the carrier substrate 10 represents, for example, a region of the carrier substrate 10 which is exposed to a gas flow during operation of the temperature sensor device 100.
  • the temperature sensor device 100 has a second temperature measuring structure T2, which is arranged in a second region B2 of the carrier substrate 10.
  • the second region B2 of the carrier substrate 10 is predeterminedly spaced from the first region B1.
  • the first region B1 represents a first end region of the carrier substrate 10
  • the second region B2 represents a second end region of the carrier substrate 10.
  • the first temperature measuring structure T1 is connected via leads Z to terminal contacts A.
  • the connection contacts A are arranged, for example, in the second region B2.
  • the second temperature measuring structure T2 can also be connected via leads Z to terminal contacts A.
  • the connection contacts A of the second temperature measuring structure T2 are preferably also arranged in the second region B2.
  • the first T1 and the second temperature measuring structure T2 are, for example, in a first substrate plane S1, z. B. on a first surface, the carrier substrate 10 is arranged.
  • the first temperature measuring structure T1 and / or the second temperature measuring structure T2 may comprise a platinum alloy.
  • the respective supply lines Z and the connection contacts A may also comprise the platinum alloy.
  • FIG. 2 shows a temperature measuring module 200 in a cross-sectional view.
  • FIG. 2 also shows the temperature sensor device 100 in a cross-sectional view.
  • first substrate planes S1 is approximately parallel to the longitudinal ash L.
  • the temperature measuring module 200 has a housing G, the temperature sensor device 100, cables K and contacts.
  • the housing G consists for example of a metallic material or has at least one metallic material.
  • the housing G is for example designed such that between the first region B1 and the second region B2, a first housing wall GW1 and the first surface of the carrier substrate 10 and a second housing wall GW2 and a second surface of the carrier substrate 10 approximately abut each other.
  • the housing G has a thread. This allows, for example, a simple mounting of the temperature sensor device 100, for example to an exhaust pipe.
  • the temperature measuring module 200 comprises a protective device U.
  • the protective device U is designed, for example, such that it encloses the first region B1 of the carrier substrate 10.
  • the respective terminal contacts A of the first T1 and second temperature measuring structure T2 are, for example, in each case connected by means of contacts, for example with spring contacts, with plastic-insulated cables K.
  • the contacts and the cables K have, for example, a flared connection.
  • the first T1 and second temperature measuring structure T2 and the associated supply line and terminal contacts A are applied to the carrier substrate 10, for example, in a printing operation.
  • these can be covered, for example, with a glass and / or ceramic layer in thick-film technology.
  • the first surface of the carrier substrate 10, with the exception of the terminal contacts A, can be covered flat with the glass and / or ceramic layer.
  • the temperature sensor device 100 advantageously has no electrical connection between different components and materials in a region which is exposed to very high temperatures.
  • An apparatus for operating the temperature sensing device 100 may include a computing unit having a program and data storage.
  • a program for operating the temperature sensor device 100 may be stored in the program memory.
  • the program can be executed. For example, in a first step of the program, a first measured variable is detected by means of the first temperature measuring structure T1. In a second step, a first temperature of the temperature sensor device 100 is determined as a function of the first measured variable. In a third step, a second measured variable is detected by means of the second temperature measuring structure T2 and, in a fourth step, a second temperature of the temperature sensor device 100 is determined as a function of this second measured variable.
  • a temperature gradient is determined as a function of the first and the second temperature.
  • the gas temperature of the gas is determined as a function of the temperature gradient and, for example, a predetermined extrapolation function. In this case, an order of the steps can be at least partially reversed and / or several steps can take place parallel in time.
  • the device for operating the temperature sensor device 100 may be part of a motor controller.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)

Description

Die Erfindung betrifft eine Temperatursensorvorrichtung.The invention relates to a temperature sensor device.

Zunehmend strengere gesetzliche Vorschriften erfordern eine Reduzierung der von einem Kraftfahrzeug ausgehenden Verbrennungsabgase. In diesem Zusammenhang werden Kraftfahrzeuge zunehmend mit Abgasreinigungsanlagen ausgestattet. Solche Abgasreinigungsanlagen werden während des Fahrbetriebs überwacht. Eine Zustandsgröße, die für eine Überwachung und/oder Steuerung der Abgasreinigungsanlage genutzt wird, ist beispielsweise die Abgastemperatur.Increasingly stringent legal regulations require a reduction in the combustion exhaust gases emanating from a motor vehicle. In this context, motor vehicles are increasingly equipped with emission control systems. Such emission control systems are monitored during driving. A state variable that is used for monitoring and / or controlling the exhaust gas purification system is, for example, the exhaust gas temperature.

DE 10 2007 058 833 A1 offenbart eine Heizeinrichtung für eine Waschmaschine. Die Heizeinrichtung weist einen Träger auf und drei darauf angeordnete flächige Heizelemente. Die Heizelemente sind als Dickschichtheizung flächig auf den Träger aufgebracht, wobei dieser rinnenartig ausgebildet ist. Die Heizeinrichtung weist zwei Temperatursensoren auf, die an der Außenseite des Trägers vorgesehen sind, wobei vorzugsweise ein Temperatursensor nahe dem einem Ende des Trägers und der andere Temperatursensor nahe an dem anderen Ende im Längsverlauf parallel zur Vertiefung vorgesehen sind. DE 10 2007 058 833 A1 discloses a heating device for a washing machine. The heating device has a carrier and three planar heating elements arranged thereon. The heating elements are applied as a thick film heating surface on the carrier, which is formed like a channel. The heater has two temperature sensors provided on the outside of the carrier, wherein preferably a temperature sensor near one end of the carrier and the other temperature sensor close to the other end are provided in the longitudinal direction parallel to the recess.

GB 2 120 453 A offenbart einen Temperatursensor für ein Anemometer. Der Temperatursensor weist ein keramisches Substrat auf. Der Temperatursensor weist zwei temperatursensible Widerstandselemente auf, die eine Widerstandschicht umfassen. Zwischen den Widerstandselementen ist eine Öffnung durch das Substrat angeordnet. GB 2 120 453 A discloses a temperature sensor for an anemometer. The temperature sensor has a ceramic substrate. The temperature sensor has two temperature-sensitive resistance elements which comprise a resistance layer. Between the resistance elements, an opening is arranged through the substrate.

Die Aufgabe, die der Erfindung zugrunde liegt, ist, eine Temperatursensorvorrichtung zu schaffen, die ein präzises Ermitteln einer Gastemperatur ermöglicht.The object underlying the invention is to provide a temperature sensor device which enables a precise determination of a gas temperature.

Die Aufgabe wird gelöst durch die Merkmale des unabhängigen Patentanspruchs. Vorteilhafte Ausgestaltungen der Erfindung sind in den Unteransprüchen gekennzeichnet.The object is solved by the features of the independent claim. Advantageous embodiments of the invention are characterized in the subclaims.

Gemäß einem ersten Aspekt zeichnet sich die Erfindung aus durch eine Temperatursensorvorrichtung, die ein Trägersubstrat sowie eine erste und eine zweite Temperaturmessstruktur aufweist. Das Trägersubstrat weist einen ersten Bereich und einen zweiten Bereich auf, wobei der erste Bereich beim Betrieb der Temperatursensorvorrichtung einem Gasstrom ausgesetzt ist und der zweite Bereich zu dem ersten Bereich in axialer Richtung entlang einer Längsachse des Trägersubstrats vorgegeben beabstandet ist. Die erste Temperaturmessstruktur ist in dem ersten Bereich angeordnet. Die zweite Temperaturmessstruktur ist in dem zweiten Bereich angeordnet. Der erste Bereich repräsentiert einen ersten Endbereich des Trägersubstrats und der zweite Bereich einen zweiten Endbereich des Trägersubstrats. Das Trägersubstrat weist einen keramischen Werkstoff auf.According to a first aspect, the invention is characterized by a temperature sensor device which has a carrier substrate as well as a first and a second temperature measuring structure. The carrier substrate has a first region and a second region, wherein the first region is exposed to a gas flow during operation of the temperature sensor device and the second region is predeterminedly spaced from the first region in the axial direction along a longitudinal axis of the carrier substrate. The first temperature measuring structure is arranged in the first area. The second temperature measuring structure is arranged in the second area. The first region represents a first end region of the carrier substrate and the second region a second end region of the carrier substrate. The carrier substrate has a ceramic material.

Der Gasstrom kann in einem Abgasstrang einer Brennkraftmaschine strömen. Die erste Temperaturmessstruktur und die zweite Temperaturmessstruktur ermöglichen, dass mehrere Messgrößen erfasst werden können, die für ein präzises Ermitteln einer Gastemperatur des Gasstroms genutzt werden können, vorzugsweise zum Ermitteln einer Abgastemperatur eines Abgases in dem Abgasstrang. Hierbei ermöglicht ein Messen und Auswerten eines temperaturabhängigen Widerstandes der ersten und zweiten Temperaturmessstruktur ein Ermitteln der Gastemperatur des Gases. Die erfassten Messgrößen und/oder daraus abgeleitete Zustandsgrößen des Gasstroms können für verschiedene Anwendungen, beispielsweise für ein oder mehrere Steuer- oder Regelungsprozesse der Brennkraftmaschine genutzt werden. Es kann eine erste Sensortemperatur im Bereich der ersten Temperaturmessstruktur und eine zweite Sensortemperatur im Bereich der zweiten Temperaturmessstruktur erfasst werden. Abhängig von der ersten Sensortemperatur und der zweiten Sensortemperatur kann die Gastemperatur des Gases sehr präzise ermittelt werden. Eine mögliche thermische Anbindung des Trägersubstrats an Komponenten, die nicht die Gastemperatur aufweisen, kann dazu führen, dass sich die erste und/oder die zweite Sensortemperatur von der Gastemperatur unterscheiden. Beispielsweise ist das Trägersubstrat in einem Gehäuse angeordnet, das an einem Abgasrohr angebracht ist, wodurch eine thermische Kopplung mit dem Abgasrohr entstehen kann. Eine Fahrgeschwindigkeit sowie eine Umgebungstemperatur können so eine Temperatur der Temperaturmessvorrichtung beeinflussen. Ein Erfassen der ersten Sensortemperatur und der zweiten Sensortemperatur ermöglicht, dass die Gastemperatur abhängig von der ersten Sensortemperatur und der zweiten Sensortemperatur einfach ermittelt werden kann, beispielsweise unabhängig von einem Wärmefluss von dem Trägersubstrat an das Abgasrohr. Dies ist besonders vorteilhaft, da der Wärmefluss von einer Umgebungstemperatur und einer Fahrgeschwindigkeit sowie fahrzeugspezifischen baulichen Gegebenheiten abhängen kann. Eine thermische Entkopplung zwischen der Temperatursensorvorrichtung und dem Gehäuse und/oder Kontaktieren ist somit nicht erforderlich.The gas stream may flow in an exhaust line of an internal combustion engine. The first temperature measuring structure and the second temperature measuring structure make it possible to detect a plurality of measured quantities that can be used for a precise determination of a gas temperature of the gas stream, preferably for determining an exhaust gas temperature of an exhaust gas in the exhaust gas line. In this case, measuring and evaluating a temperature-dependent resistance of the first and second temperature measuring structures makes it possible to determine the gas temperature of the gas. The detected measured variables and / or state variables of the gas stream derived therefrom can be used for different applications, for example for one or more control or regulating processes of the internal combustion engine be used. A first sensor temperature in the region of the first temperature-measuring structure and a second sensor temperature in the region of the second temperature-measuring structure can be detected. Depending on the first sensor temperature and the second sensor temperature, the gas temperature of the gas can be determined very precisely. A possible thermal connection of the carrier substrate to components which do not have the gas temperature can lead to the first and / or the second sensor temperature differing from the gas temperature. For example, the carrier substrate is arranged in a housing which is attached to an exhaust pipe, whereby a thermal coupling with the exhaust pipe can arise. A driving speed and an ambient temperature can thus influence a temperature of the temperature measuring device. Detecting the first sensor temperature and the second sensor temperature allows the gas temperature to be easily determined depending on the first sensor temperature and the second sensor temperature, for example, independent of heat flow from the carrier substrate to the exhaust pipe. This is particularly advantageous because the heat flow can depend on an ambient temperature and a driving speed and vehicle-specific structural conditions. A thermal decoupling between the temperature sensor device and the housing and / or contacting is thus not required.

Die Temperatursensorvorrichtung kann auch derart ausgebildet und angeordnet sein, dass beim Betrieb der Temperatursensorvorrichtung auch der zweite Bereich zumindest teilweise dem Gasstrom ausgesetzt sein kann. Die Beabstandung zwischen dem ersten Bereich und dem zweiten Bereich kann vorgebbar sein, beispielsweise abhängig von einer gewünschten Anordnung der Temperatursensorvorrichtung in dem Abgasstrang einer Brennkraftmaschine und/oder abhängig von einer vorgegebenen minimalen Temperaturdifferenz zwischen der ersten Sensortemperatur und der zweiten Sensortemperatur bei einer vorgegebenen Gastemperatur. Das Trägersubstrat kann zusätzlich für elektrische Verbindungen genutzt werden, die bis in einen kälteren Bereich außerhalb des Abgasstrangs reichen. In diesem kälteren Bereich kann von einer Leitungsführung auf dem Trägersubstrat auf eine Kunststoff isolierende Kabelführung übergegangen werden. Die Gastemperatur kann insbesondere auch dann präzise ermittelt werden, wenn die erste Sensortemperatur und die zweite Sensortemperatur jeweils eine geringere Temperatur aufweisen als die Gastemperatur. Dadurch können Anforderungen an die Hochtemperaturfestigkeit der Temperatursensorvorrichtung reduziert werden.The temperature sensor device can also be designed and arranged such that, during operation of the temperature sensor device, the second region can also be at least partially exposed to the gas flow. The spacing between the first region and the second region can be predeterminable, for example, depending on a desired arrangement of the temperature sensor device in the exhaust system of an internal combustion engine and / or dependent on a predetermined minimum temperature difference between the first sensor temperature and second sensor temperature at a given gas temperature. The carrier substrate can additionally be used for electrical connections which extend into a colder area outside the exhaust gas line. In this colder area can be transferred from a wiring on the carrier substrate on a plastic insulating cable guide. In particular, the gas temperature can also be determined precisely when the first sensor temperature and the second sensor temperature each have a lower temperature than the gas temperature. As a result, demands on the high-temperature strength of the temperature sensor device can be reduced.

Die Anordnung der ersten Temperaturmessstruktur in dem ersten Endbereich des Trägersubstrats und der zweiten Temperaturmessstruktur in dem zweiten Endbereich des Trägersubstrats ermöglicht eine kostengünstige Herstellung.The arrangement of the first temperature measuring structure in the first end region of the carrier substrate and the second temperature measuring structure in the second end region of the carrier substrate enables cost-effective production.

Das Trägersubstrat kann im Wesentlichen den keramischen Werkstoff aufweisen, insbesondere aus dem keramischen Werkstoff bestehen. Der keramische Werkstoff weist vorteilhafterweise eine hohe elektrische Isolation und gleichzeitig eine hohe thermische Leitfähigkeit auf. Vorteilhafterweise kann aufgrund der hohen thermischen Leitfähigkeit die Temperatursensorvorrichtung eine hohe Ansprechgeschwindigkeit aufweisen bezüglich einer Temperaturänderung. Dies kann einen Beitrag leisten dazu, dass eine zu messende Temperatur und/oder eine Änderung einer Temperatur sehr präzise erfasst werden kann. Der keramische Werkstoff kann als Aluminiumoxid (Al2O3) ausgebildet sein.The carrier substrate may essentially comprise the ceramic material, in particular consist of the ceramic material. The ceramic material advantageously has a high electrical insulation and at the same time a high thermal conductivity. Advantageously, due to the high thermal conductivity, the temperature sensor device may have a high response speed with respect to a temperature change. This can contribute to the fact that a temperature to be measured and / or a change in a temperature can be detected very precisely. The ceramic material may be formed as aluminum oxide (Al 2 O 3 ).

In einer vorteilhaften Ausgestaltung ist die Temperaturmessstruktur über Zuleitungen mit Anschlusskontakten verbunden, die in dem zweiten Bereich angeordnet sind. Auch die zweite Temperaturmessstruktur kann über Zuleitungen mit weiteren Anschlusskontakten verbunden sein, die vorzugsweise in dem zweiten Bereich des Trägersubstrats angeordnet sind.In an advantageous embodiment, the temperature measuring structure is connected via supply lines with connection contacts, which are arranged in the second region. The second temperature-measuring structure can also be connected via leads to further connection contacts, which are preferably arranged in the second region of the carrier substrate.

In einer weiteren vorteilhaften Ausgestaltung weisen die erste Temperaturmessstruktur und/oder die zweite Temperaturmessstruktur eine Platinlegierung auf. Die erste und zweite Temperaturmessstruktur können im Wesentlichen die Platinlegierung aufweisen, insbesondere aus der Platinlegierung bestehen. Dies kann einen Beitrag leisten dazu, dass die erste und/oder die zweite Temperaturmessstruktur eine hohe Beständigkeit gegenüber hohen Temperaturen oder mechanischen und/oder chemischen Belastungen aufweist.In a further advantageous embodiment, the first temperature measuring structure and / or the second temperature measuring structure have a platinum alloy. The first and second temperature measuring structures may essentially comprise the platinum alloy, in particular consist of the platinum alloy. This can contribute to the fact that the first and / or the second temperature measuring structure has a high resistance to high temperatures or mechanical and / or chemical loads.

In einer weiteren vorteilhaften Ausgestaltung sind die erste Temperaturmessstruktur und die zweite Temperaturmessstruktur sowie die jeweiligen Zuleitungen in einer ersten Substratebene ausgebildet und weisen eine metallische Legierung auf. Dies ermöglicht eine günstige Herstellung der Temperatursensorvorrichtung, da so sämtliche metallische Strukturen der ersten Substratebene in einem Arbeitsschritt aufgebracht werden können, beispielsweise mittels eines Siebdrucks. Die metallische Legierung kann als Platinlegierung ausgebildet sein. Beispielsweise kann vorgesehen sein, dass die erste Temperaturmessstruktur und die zweite Temperaturmessstruktur sowie die jeweiligen Zuleitungen auf einer ersten Oberfläche des Trägersubstrats, angeordnet sind. Alternativ ist auch möglich, dass die erste Temperaturmessstruktur in einer ersten Substratebene des Trägersubstrats angeordnet ist und die zweite Temperaturmessstruktur in einer zweiten Substratebene, z. B. auf einer zweiten Oberfläche des Trägersubstrats. Diese erste und zweite Substratebene können näherungsweise parallel verlaufen und einen orthogonalen zu der Längsachse verlaufenden vorgegebenen Abstand aufweisen.In a further advantageous embodiment, the first temperature measuring structure and the second temperature measuring structure as well as the respective supply lines are formed in a first substrate plane and comprise a metallic alloy. This allows a favorable production of the temperature sensor device, since all metallic structures of the first substrate plane can be applied in one working step, for example by means of screen printing. The metallic alloy may be formed as a platinum alloy. For example, it can be provided that the first temperature measuring structure and the second temperature measuring structure as well as the respective supply lines are arranged on a first surface of the carrier substrate. Alternatively, it is also possible that the first temperature measuring structure is arranged in a first substrate plane of the carrier substrate and the second temperature measuring structure in a second substrate plane, for. B. on a second surface of the carrier substrate. These first and second substrate planes may be approximately parallel and have an orthogonal predetermined distance to the longitudinal axis.

Ausführungsbeispiele der Erfindung sind im Folgenden anhand der schematischen Zeichnungen näher erläutert. Es zeigen:

Figur 1
eine Temperatursensorvorrichtung und
Figur 2
ein Temperaturmessmodul.
Embodiments of the invention are explained in more detail below with reference to the schematic drawings. Show it:
FIG. 1
a temperature sensor device and
FIG. 2
a temperature measuring module.

Elemente gleicher Konstruktion oder Funktion sind figurenübergreifend mit den gleichen Bezugszeichen versehen.Elements of the same construction or function are provided across the figures with the same reference numerals.

Figur 1 zeigt eine Temperatursensorvorrichtung 100. Die Temperatursensorvorrichtung 100 kann beispielsweise in einem Abgasstrang einer Brennkraftmaschine eines Kraftfahrzeugs angeordnet sein. Während eines Betriebs der Brennkraftmaschine kann in dem Abgasstrang ein Gas, insbesondere ein Abgas, strömen. FIG. 1 shows a temperature sensor device 100. The temperature sensor device 100 may be arranged for example in an exhaust line of an internal combustion engine of a motor vehicle. During operation of the internal combustion engine, a gas, in particular an exhaust gas, can flow in the exhaust gas line.

Die Temperatursensorvorrichtung 100 weist ein Trägersubstrat 10 auf. Das Trägersubstrat 10 kann aus einem keramischen Werkstoff bestehen oder zumindest einen keramischen Werkstoff aufweisen, beispielsweise Aluminiumoxid (Al2O3).The temperature sensor device 100 has a carrier substrate 10. The carrier substrate 10 may consist of a ceramic material or comprise at least one ceramic material, for example aluminum oxide (Al 2 O 3 ).

Die Temperatursensorvorrichtung 100 weist eine erste Temperaturmessstruktur T1 und eine zweite Temperaturmessstruktur T2 auf. Die erste T1 und zweite Temperaturmessstruktur T2 weisen beispielsweise jeweils eine mäanderförmige Leiterbahnführung auf. Die erste Temperaturmessstruktur T1 ist beispielsweise in einem ersten Bereich B1 des Trägersubstrats 10 angeordnet, wobei der erste Bereich B1 des Trägersubstrats 10 beispielsweise einen Bereich des Trägersubstrats 10 repräsentiert, der beim Betrieb der Temperatursensorvorrichtung 100 einem Gasstrom ausgesetzt ist.The temperature sensor device 100 has a first temperature measuring structure T1 and a second temperature measuring structure T2. For example, the first T1 and second temperature measurement structure T2 each have a meander-shaped conductor track guidance. The first temperature measuring structure T1 is arranged, for example, in a first region B1 of the carrier substrate 10, wherein the first region B1 of the carrier substrate 10 represents, for example, a region of the carrier substrate 10 which is exposed to a gas flow during operation of the temperature sensor device 100.

Des Weiteren weist die Temperatursensorvorrichtung 100 eine zweite Temperaturmessstruktur T2 auf, die in einem zweiten Bereich B2 des Trägersubstrats 10 angeordnet ist. Der zweite Bereich B2 des Trägersubstrats 10 ist vorgegeben beabstandet von dem ersten Bereich B1. Beispielsweise repräsentiert der erste Bereich B1 einen ersten Endbereich des Trägersubstrats 10 und der zweite Bereich B2 einen zweiten Endbereich des Trägersubstrats 10.Furthermore, the temperature sensor device 100 has a second temperature measuring structure T2, which is arranged in a second region B2 of the carrier substrate 10. The second region B2 of the carrier substrate 10 is predeterminedly spaced from the first region B1. For example, the first region B1 represents a first end region of the carrier substrate 10 and the second region B2 represents a second end region of the carrier substrate 10.

Die erste Temperaturmessstruktur T1 ist über Zuleitungen Z mit Anschlusskontakten A verbunden. Die Anschlusskontakte A sind beispielsweise in dem zweiten Bereich B2 angeordnet. Auch die zweite Temperaturmessstruktur T2 kann über Zuleitungen Z mit Anschlusskontakten A verbunden sein. Vorzugsweise sind die Anschlusskontakte A der zweiten Temperaturmessstruktur T2 auch in dem zweiten Bereich B2 angeordnet.The first temperature measuring structure T1 is connected via leads Z to terminal contacts A. The connection contacts A are arranged, for example, in the second region B2. The second temperature measuring structure T2 can also be connected via leads Z to terminal contacts A. The connection contacts A of the second temperature measuring structure T2 are preferably also arranged in the second region B2.

Die erste T1 und die zweite Temperaturmessstruktur T2 sind beispielsweise in einer ersten Substratebene S1, z. B. auf einer ersten Oberfläche, des Trägersubstrats 10 angeordnet. Beispielsweise können die erste Temperaturmessstruktur T1 und/oder die zweite Temperaturmessstruktur T2 eine Platinlegierung aufweisen. Vorteilhafterweise können auch die jeweiligen Zuleitungen Z und die Anschlusskontakte A die Platinlegierung aufweisen.The first T1 and the second temperature measuring structure T2 are, for example, in a first substrate plane S1, z. B. on a first surface, the carrier substrate 10 is arranged. For example, the first temperature measuring structure T1 and / or the second temperature measuring structure T2 may comprise a platinum alloy. Advantageously, the respective supply lines Z and the connection contacts A may also comprise the platinum alloy.

Figur 2 zeigt ein Temperaturmessmodul 200 in einer Querschnittdarstellung. Figur 2 zeigt die Temperatursensorvorrichtung 100 ebenfalls in einer Querschnittdarstellung. Die in Figur 1 gezeigte erste Substratebenen S1 verläuft näherungsweise parallel zu der Längsasche L. FIG. 2 shows a temperature measuring module 200 in a cross-sectional view. FIG. 2 also shows the temperature sensor device 100 in a cross-sectional view. In the FIG. 1 shown first substrate planes S1 is approximately parallel to the longitudinal ash L.

Das Temperaturmessmodul 200 weist ein Gehäuse G, die Temperatursensorvorrichtung 100, Kabel K und Kontakte auf.The temperature measuring module 200 has a housing G, the temperature sensor device 100, cables K and contacts.

Das Gehäuse G besteht beispielsweise aus einem metallischen Werkstoff oder weist zumindest einen metallischen Werkstoff auf. Das Gehäuse G ist beispielsweise derart ausgebildet, dass zwischen dem ersten Bereich B1 und dem zweiten Bereich B2 eine erste Gehäusewand GW1 und die erste Oberfläche des Trägersubstrats 10 sowie eine zweite Gehäusewand GW2 und eine zweite Oberfläche des Trägersubstrats 10 näherungsweise aneinander anliegen. Das Gehäuse G weist ein Gewinde auf. Dies ermöglicht beispielsweise eine einfache Montage der Temperatursensorvorrichtung 100, beispielsweise an ein Abgasrohr.The housing G consists for example of a metallic material or has at least one metallic material. The housing G is for example designed such that between the first region B1 and the second region B2, a first housing wall GW1 and the first surface of the carrier substrate 10 and a second housing wall GW2 and a second surface of the carrier substrate 10 approximately abut each other. The housing G has a thread. This allows, for example, a simple mounting of the temperature sensor device 100, for example to an exhaust pipe.

Des Weiteren umfasst das Temperaturmessmodul 200 eine Schutzvorrichtung U. Die Schutzvorrichtung U ist beispielsweise derart ausgebildet, dass sie den ersten Bereich B1 des Trägersubstrats 10 umhüllt. Die jeweiligen Anschlusskontakte A der ersten T1 und zweiten Temperaturmessstruktur T2 sind beispielsweise jeweils mittels Kontakten, beispielsweise mit Federkontakten, mit kunststoffisolierten Kabeln K verbunden. Die Kontakte und die Kabel K weisen beispielsweise eine Bördelverbindung auf. Die erste T1 und zweite Temperaturmessstruktur T2 sowie die zugehörige Zuleitung und Anschlusskontakte A werden beispielsweise in einem Druckvorgang auf das Trägersubstrat 10 aufgebracht. Zum Schutz der ersten T1 und zweiten Temperaturmessstruktur T2 sowie der jeweiligen Zuleitungen Z können diese beispielsweise mit einer Glas- und/oder Keramikschicht in Dickschichttechnologie abgedeckt werden. Beispielsweise kann die erste Oberfläche des Trägersubstrats 10 mit Ausnahme der Anschlusskontakte A flächig mit der Glas- und/oder Keramikschicht abgedeckt werden. Die Temperatursensorvorrichtung 100 weist vorteilhafterweise in einem Bereich, der sehr hohe Temperaturen ausgesetzt ist, keine elektrische Verbindung zwischen unterschiedlichen Bauteilen und Materialien auf.Furthermore, the temperature measuring module 200 comprises a protective device U. The protective device U is designed, for example, such that it encloses the first region B1 of the carrier substrate 10. The respective terminal contacts A of the first T1 and second temperature measuring structure T2 are, for example, in each case connected by means of contacts, for example with spring contacts, with plastic-insulated cables K. The contacts and the cables K have, for example, a flared connection. The first T1 and second temperature measuring structure T2 and the associated supply line and terminal contacts A are applied to the carrier substrate 10, for example, in a printing operation. To protect the first T1 and second temperature measuring structure T2 and the respective leads Z, these can be covered, for example, with a glass and / or ceramic layer in thick-film technology. By way of example, the first surface of the carrier substrate 10, with the exception of the terminal contacts A, can be covered flat with the glass and / or ceramic layer. The temperature sensor device 100 advantageously has no electrical connection between different components and materials in a region which is exposed to very high temperatures.

Eine Vorrichtung zum Betreiben der Temperatursensorvorrichtung 100 kann eine Recheneinheit mit einem Programm und Datenspeicher aufweisen. Hierbei kann ein Programm zum Betreiben der Temperatursensorvorrichtung 100 in dem Programmspeicher gespeichert sein. Mittels der Recheneinheit kann das Programm ausgeführt werden. Beispielsweise wird in einem ersten Schritt des Programms mittels der ersten Temperaturmessstruktur T1 eine erste Messgröße erfasst. In einem zweiten Schritt wird abhängig von der ersten Messgröße eine erste Temperatur der Temperatursensorvorrichtung 100 ermittelt. In einem dritten Schritt wird mittels der zweiten Temperaturmessstruktur T2 eine zweite Messgröße erfasst und in einem vierten Schritt abhängig von dieser zweiten Messgröße eine zweite Temperatur der Temperatursensorvorrichtung 100 ermittelt. In einem fünften Schritt wird abhängig von der ersten und der zweiten Temperatur ein Temperaturgradient ermittelt. In einem sechsten Schritt wird abhängig von dem Temperaturgradienten und beispielsweise einer vorgegebenen Extrapolationsfunktion die Gastemperatur des Gases ermittelt. Hierbei kann eine Reihenfolge der Schritte zumindest teilweise umgekehrt werden und/oder mehrere Schritte können zeitlich parallel ablaufen. Die Vorrichtung zum Betreiben der Temperatursensorvorrichtung 100 kann Teil einer Motorsteuerung sein.An apparatus for operating the temperature sensing device 100 may include a computing unit having a program and data storage. Here, a program for operating the temperature sensor device 100 may be stored in the program memory. By means of the arithmetic unit, the program can be executed. For example, in a first step of the program, a first measured variable is detected by means of the first temperature measuring structure T1. In a second step, a first temperature of the temperature sensor device 100 is determined as a function of the first measured variable. In a third step, a second measured variable is detected by means of the second temperature measuring structure T2 and, in a fourth step, a second temperature of the temperature sensor device 100 is determined as a function of this second measured variable. In a fifth step, a temperature gradient is determined as a function of the first and the second temperature. In a sixth step, the gas temperature of the gas is determined as a function of the temperature gradient and, for example, a predetermined extrapolation function. In this case, an order of the steps can be at least partially reversed and / or several steps can take place parallel in time. The device for operating the temperature sensor device 100 may be part of a motor controller.

Claims (4)

  1. Temperature sensor device (100) for arrangement in an exhaust tract of an internal combustion engine, comprising:
    - a carrier substrate (10) which has a first region (B1) and a second region (B2), wherein the first region (B1) is exposed to a gas stream during the operation of the temperature sensor device (100) and the second region (B2) is spaced apart to a predefined extent relative to the first region (B1) in an axial direction along a longitudinal axis (L) of the carrier substrate (10),
    - a first temperature measurement structure (T1) arranged in the first region (B1),
    - and a second temperature measurement structure (T2) arranged in the second region (B2), wherein the first region (B1) represents a first end region of the carrier substrate (10), and the carrier substrate (10) has a ceramic material,
    characterized in that the second region (B2) represents a second end region of the carrier substrate (10).
  2. Temperature sensor device (100) according to Claim 1, in which the first temperature measurement structure (T1) is connected via supply lines to connection terminals (A) which are arranged in the second region (B2).
  3. Temperature sensor device (100) according to one of the preceding claims, in which the first temperature measurement structure (T1) and/or the second temperature measurement structure (T2) have/has a platinum alloy.
  4. Temperature sensor device (100) according to one of the preceding claims, in which the first temperature measurement structure (T1) and the second temperature measurement structure (T2) and the respective supply lines (Z) are formed in a first substrate plane (S1) and have a metallic alloy.
EP11770812.3A 2010-10-21 2011-10-20 Temperature sensor device Not-in-force EP2630458B1 (en)

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DE102010049008A DE102010049008B3 (en) 2010-10-21 2010-10-21 Temperature sensor device
PCT/EP2011/068348 WO2012052514A2 (en) 2010-10-21 2011-10-20 Temperature sensor device

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EP2630458B1 true EP2630458B1 (en) 2015-12-30

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DE102013216256A1 (en) * 2013-08-15 2014-09-11 E.G.O. Elektro-Gerätebau GmbH Temperature sensing device and temperature controller
DE102016101862A1 (en) * 2016-02-03 2017-08-03 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Method for determining a temperature, system for determining a temperature and using a system for determining a temperature
US10725485B2 (en) * 2016-12-15 2020-07-28 Lam Research Corporation System and method for calculating substrate support temperature
DE102017116505A1 (en) * 2017-07-21 2019-01-24 Endress+Hauser Conducta Gmbh+Co. Kg Sensor of process automation technology and method for determining the temperature of a medium
DE102019108304B3 (en) * 2019-03-29 2020-08-13 Ecom Instruments Gmbh Electronic circuit arrangement for temperature monitoring
DE102019129820A1 (en) * 2019-11-05 2021-05-06 Innovative Sensor Technology Ist Ag Evaluating the measurement quality of the sensor element for detecting an object temperature

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DE2635901C2 (en) * 1976-08-10 1983-06-01 Robert Bosch Gmbh, 7000 Stuttgart Device for regulating the temperature of a room
GB2120453B (en) * 1982-04-30 1985-09-11 Welwyn Elecronics Limited Temperature sensor
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