EP2609791A4 - Ausfallreduzierung in arrays aus lichtemittierenden vorrichtungen - Google Patents

Ausfallreduzierung in arrays aus lichtemittierenden vorrichtungen

Info

Publication number
EP2609791A4
EP2609791A4 EP11819246.7A EP11819246A EP2609791A4 EP 2609791 A4 EP2609791 A4 EP 2609791A4 EP 11819246 A EP11819246 A EP 11819246A EP 2609791 A4 EP2609791 A4 EP 2609791A4
Authority
EP
European Patent Office
Prior art keywords
arrays
light
emitting devices
failure mitigation
mitigation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP11819246.7A
Other languages
English (en)
French (fr)
Other versions
EP2609791A1 (de
Inventor
Michael Tischler
Philippe Schick
Calvin Wade Sheen
Paul Jungwirth
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cooledge Lighting Inc
Original Assignee
Cooledge Lighting Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US12/982,758 external-priority patent/US8493000B2/en
Priority claimed from US13/171,973 external-priority patent/US8384121B2/en
Application filed by Cooledge Lighting Inc filed Critical Cooledge Lighting Inc
Publication of EP2609791A1 publication Critical patent/EP2609791A1/de
Publication of EP2609791A4 publication Critical patent/EP2609791A4/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0292—Programmable, customizable or modifiable circuits having a modifiable lay-out, i.e. adapted for engineering changes or repair
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/30—Driver circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/50—Circuit arrangements for operating light-emitting diodes [LED] responsive to malfunctions or undesirable behaviour of LEDs; responsive to LED life; Protective circuits
    • H05B45/52—Circuit arrangements for operating light-emitting diodes [LED] responsive to malfunctions or undesirable behaviour of LEDs; responsive to LED life; Protective circuits in a parallel array of LEDs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B47/00—Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
    • H05B47/20—Responsive to malfunctions or to light source life; for protection
    • H05B47/29—Circuits providing for substitution of the light source in case of its failure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10363—Jumpers, i.e. non-printed cross-over connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/173—Adding connections between adjacent pads or conductors, e.g. for modifying or repairing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
EP11819246.7A 2010-08-25 2011-07-14 Ausfallreduzierung in arrays aus lichtemittierenden vorrichtungen Withdrawn EP2609791A4 (de)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
US37670710P 2010-08-25 2010-08-25
US39012810P 2010-10-05 2010-10-05
US39302710P 2010-10-14 2010-10-14
US12/982,758 US8493000B2 (en) 2010-01-04 2010-12-30 Method and system for driving light emitting elements
US201161433249P 2011-01-16 2011-01-16
US201161445416P 2011-02-22 2011-02-22
US201161447680P 2011-02-28 2011-02-28
US13/171,973 US8384121B2 (en) 2010-06-29 2011-06-29 Electronic devices with yielding substrates
PCT/CA2011/050436 WO2012024792A1 (en) 2010-08-25 2011-07-14 Failure mitigation in arrays of light-emitting devices

Publications (2)

Publication Number Publication Date
EP2609791A1 EP2609791A1 (de) 2013-07-03
EP2609791A4 true EP2609791A4 (de) 2014-08-06

Family

ID=45722791

Family Applications (1)

Application Number Title Priority Date Filing Date
EP11819246.7A Withdrawn EP2609791A4 (de) 2010-08-25 2011-07-14 Ausfallreduzierung in arrays aus lichtemittierenden vorrichtungen

Country Status (2)

Country Link
EP (1) EP2609791A4 (de)
WO (1) WO2012024792A1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8384114B2 (en) 2009-06-27 2013-02-26 Cooledge Lighting Inc. High efficiency LEDs and LED lamps
US8653539B2 (en) 2010-01-04 2014-02-18 Cooledge Lighting, Inc. Failure mitigation in arrays of light-emitting devices
EP2589082B1 (de) 2010-06-29 2018-08-08 Cooledge Lighting Inc. Elektronische vorrichtungen mit nachgebenden substraten
US9231178B2 (en) 2012-06-07 2016-01-05 Cooledge Lighting, Inc. Wafer-level flip chip device packages and related methods

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020179816A1 (en) * 2001-06-01 2002-12-05 Haines Joshua Paul Illumination apparatus utilizing light emitting diodes
US20080007885A1 (en) * 2006-07-05 2008-01-10 Texas Instruments Incorporated System for improving LED illumination reliability in projection display systems
US20080157689A1 (en) * 2005-09-20 2008-07-03 Akira Kato Led lighting device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4690323B2 (ja) * 2003-08-27 2011-06-01 オスラム・シルバニア・インコーポレイテッド Ｌｅｄ自動車用ランプのための駆動回路
US6942360B2 (en) * 2003-10-01 2005-09-13 Enertron, Inc. Methods and apparatus for an LED light engine
US7583244B2 (en) * 2006-05-11 2009-09-01 Ansaldo Sts Usa, Inc. Signal apparatus, light emitting diode (LED) drive circuit, LED display circuit, and display system including the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020179816A1 (en) * 2001-06-01 2002-12-05 Haines Joshua Paul Illumination apparatus utilizing light emitting diodes
US20080157689A1 (en) * 2005-09-20 2008-07-03 Akira Kato Led lighting device
US20080007885A1 (en) * 2006-07-05 2008-01-10 Texas Instruments Incorporated System for improving LED illumination reliability in projection display systems

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2012024792A1 *

Also Published As

Publication number Publication date
EP2609791A1 (de) 2013-07-03
WO2012024792A1 (en) 2012-03-01

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Legal Events

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PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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Effective date: 20130219

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DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20140708

RIC1 Information provided on ipc code assigned before grant

Ipc: H05B 37/04 20060101ALI20140702BHEP

Ipc: H05B 37/00 20060101AFI20140702BHEP

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Ipc: F21S 2/00 20060101ALI20140702BHEP

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Effective date: 20150205