EP2518401A3 - Heat dissipating device - Google Patents

Heat dissipating device Download PDF

Info

Publication number
EP2518401A3
EP2518401A3 EP11179403A EP11179403A EP2518401A3 EP 2518401 A3 EP2518401 A3 EP 2518401A3 EP 11179403 A EP11179403 A EP 11179403A EP 11179403 A EP11179403 A EP 11179403A EP 2518401 A3 EP2518401 A3 EP 2518401A3
Authority
EP
European Patent Office
Prior art keywords
heat dissipating
tubular body
dissipating device
open end
extension section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP11179403A
Other languages
German (de)
French (fr)
Other versions
EP2518401A2 (en
Inventor
Shih-Che Tseng
Mao-Sung Hsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tyntek Corp
Original Assignee
Tyntek Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tyntek Corp filed Critical Tyntek Corp
Publication of EP2518401A2 publication Critical patent/EP2518401A2/en
Publication of EP2518401A3 publication Critical patent/EP2518401A3/en
Withdrawn legal-status Critical Current

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat dissipating device includes a tubular body (2) having a first open end (211), and a plurality of heat dissipating fins (3), each having a fin body (31) and a first engaging portion (32) formed on the fin body (31) for engaging the first open end (211) of the tubular body (2) in a manner that the heat dissipating fins (3) are disposed to radiate from and to surround the tubular body (2). The first engaging portion (32) includes a first extension section (321) bent from the fin body (31), and a first hook (322) extending from the first extension section (321) for hooking onto the tubular body (2) at the first open end (211).
EP11179403A 2011-04-27 2011-08-30 Heat dissipating device Withdrawn EP2518401A3 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011101105191A CN102760705A (en) 2011-04-27 2011-04-27 Heat radiator

Publications (2)

Publication Number Publication Date
EP2518401A2 EP2518401A2 (en) 2012-10-31
EP2518401A3 true EP2518401A3 (en) 2012-12-05

Family

ID=44677577

Family Applications (1)

Application Number Title Priority Date Filing Date
EP11179403A Withdrawn EP2518401A3 (en) 2011-04-27 2011-08-30 Heat dissipating device

Country Status (4)

Country Link
US (1) US20120273180A1 (en)
EP (1) EP2518401A3 (en)
JP (1) JP2012235078A (en)
CN (1) CN102760705A (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102588757B (en) * 2011-01-14 2015-06-17 富瑞精密组件(昆山)有限公司 Lamp
TWM409367U (en) * 2011-01-28 2011-08-11 Fin Core Corp Heat-dissipation module and LED lamp having heat-dissipation module
US20130235578A1 (en) * 2011-07-05 2013-09-12 Industrial Technology Research Institute Illumination device and assembling method thereof
US20130118725A1 (en) * 2011-11-10 2013-05-16 Shyh-Ming Chen Heat Sink and Fins Thereof
US9052093B2 (en) * 2013-03-14 2015-06-09 Cree, Inc. LED lamp and heat sink
TWI506227B (en) * 2014-08-05 2015-11-01 Lite On Technology Corp Light-emitting device
USD790737S1 (en) * 2015-01-07 2017-06-27 Cree, Inc. LED lamp
US20170097122A1 (en) * 2015-10-06 2017-04-06 Hsu Li Yen Led lamp holder
CN105603364B (en) * 2016-03-16 2018-11-23 深圳市华星光电技术有限公司 Heat-transfer device and vapor deposition crucible
JP6648206B2 (en) * 2018-07-19 2020-02-14 三菱電機株式会社 Heat radiation fins, heat sinks and lighting equipment
CN109611704B (en) * 2018-12-10 2024-01-26 中山市一群狼照明科技有限公司 Ball bubble
CN212361634U (en) * 2020-06-23 2021-01-15 漳州立达信光电子科技有限公司 Ball bulb lamp

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM395787U (en) * 2010-06-09 2011-01-01 Hong Kuan Technology Co Ltd LED and heat dissipation module thereof
WO2011029724A1 (en) * 2009-09-14 2011-03-17 Osram Gesellschaft mit beschränkter Haftung Lighting device and method for producing a heat sink of the lighting device and the lighting device

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3713706B2 (en) * 2001-09-28 2005-11-09 日本電気株式会社 Heat dissipation structure, package assembly, and heat dissipation sheet
US6729384B1 (en) * 2003-06-06 2004-05-04 Hsiang Kang Enterprises Co., Ltd. Cooling fin assembly
JP4411147B2 (en) * 2004-06-24 2010-02-10 株式会社日立製作所 Heat sink with fan
CN100518468C (en) * 2005-10-14 2009-07-22 鸿富锦精密工业(深圳)有限公司 Radiator
TW200934362A (en) * 2008-01-16 2009-08-01 Neng Tyi Prec Ind Co Ltd Method of manufacturing heat dissipaters having heat sinks and structure thereof
CN201242058Y (en) * 2008-08-04 2009-05-20 王文汶 LED light fitting
US7918587B2 (en) * 2008-11-05 2011-04-05 Chaun-Choung Technology Corp. LED fixture and mask structure thereof
CN201302412Y (en) * 2008-11-13 2009-09-02 彩威实业有限公司 Radiator and radiating fins thereof
JP3151869U (en) * 2009-04-27 2009-07-09 信睿企業有限公司 Heat sink fixing structure of heat dissipation module
JP5185346B2 (en) * 2010-09-15 2013-04-17 株式会社日本自動車部品総合研究所 heatsink
TWM409367U (en) * 2011-01-28 2011-08-11 Fin Core Corp Heat-dissipation module and LED lamp having heat-dissipation module

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011029724A1 (en) * 2009-09-14 2011-03-17 Osram Gesellschaft mit beschränkter Haftung Lighting device and method for producing a heat sink of the lighting device and the lighting device
TWM395787U (en) * 2010-06-09 2011-01-01 Hong Kuan Technology Co Ltd LED and heat dissipation module thereof

Also Published As

Publication number Publication date
US20120273180A1 (en) 2012-11-01
CN102760705A (en) 2012-10-31
EP2518401A2 (en) 2012-10-31
JP2012235078A (en) 2012-11-29

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