EP2510538A4 - Removal of masking material - Google Patents

Removal of masking material

Info

Publication number
EP2510538A4
EP2510538A4 EP10836729.3A EP10836729A EP2510538A4 EP 2510538 A4 EP2510538 A4 EP 2510538A4 EP 10836729 A EP10836729 A EP 10836729A EP 2510538 A4 EP2510538 A4 EP 2510538A4
Authority
EP
European Patent Office
Prior art keywords
removal
masking material
masking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP10836729.3A
Other languages
German (de)
French (fr)
Other versions
EP2510538A2 (en
Inventor
Ali Afzali-Ardakani
Thomas H Baum
Karl E Boggs
Emanuel I Cooper
Douglas Cywar
Matthew Kern
Mahmoud Khojasteh
George Gabriel Totir
Ronald W Nunes
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Technology Materials Inc
International Business Machines Corp
Original Assignee
Advanced Technology Materials Inc
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US12/636,015 external-priority patent/US8367555B2/en
Application filed by Advanced Technology Materials Inc, International Business Machines Corp filed Critical Advanced Technology Materials Inc
Publication of EP2510538A2 publication Critical patent/EP2510538A2/en
Publication of EP2510538A4 publication Critical patent/EP2510538A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31127—Etching organic layers
    • H01L21/31133—Etching organic layers by chemical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3063—Electrolytic etching
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/423—Stripping or agents therefor using liquids only containing mineral acids or salts thereof, containing mineral oxidizing substances, e.g. peroxy compounds

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • ing And Chemical Polishing (AREA)
  • Detergent Compositions (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
EP10836729.3A 2009-12-11 2010-12-10 Removal of masking material Withdrawn EP2510538A4 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/636,015 US8367555B2 (en) 2009-12-11 2009-12-11 Removal of masking material
US35624210P 2010-06-18 2010-06-18
PCT/US2010/059800 WO2011072188A2 (en) 2009-12-11 2010-12-10 Removal of masking material

Publications (2)

Publication Number Publication Date
EP2510538A2 EP2510538A2 (en) 2012-10-17
EP2510538A4 true EP2510538A4 (en) 2014-03-26

Family

ID=44146190

Family Applications (1)

Application Number Title Priority Date Filing Date
EP10836729.3A Withdrawn EP2510538A4 (en) 2009-12-11 2010-12-10 Removal of masking material

Country Status (7)

Country Link
EP (1) EP2510538A4 (en)
JP (1) JP2013513824A (en)
KR (1) KR20120108984A (en)
CN (1) CN103119694A (en)
SG (1) SG181642A1 (en)
TW (1) TW201140254A (en)
WO (1) WO2011072188A2 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012097143A2 (en) 2011-01-13 2012-07-19 Advanced Technology Materials, Inc. Formulations for the removal of particles generated by cerium- containing solutions
US8367556B1 (en) * 2011-12-01 2013-02-05 International Business Machines Corporation Use of an organic planarizing mask for cutting a plurality of gate lines
WO2013173738A1 (en) * 2012-05-18 2013-11-21 Advanced Technology Materials, Inc. Composition and process for stripping photoresist from a surface including titanium nitride
CN103235491A (en) * 2013-04-07 2013-08-07 北京七星华创电子股份有限公司 Resist stripper and application thereof
KR102166974B1 (en) * 2013-11-11 2020-10-16 도쿄엘렉트론가부시키가이샤 Method and hardware for enhanced removal of post etch polymer and hardmask removal
TWI595332B (en) * 2014-08-05 2017-08-11 頎邦科技股份有限公司 Method for photoresist stripping
CN106435616B (en) * 2016-10-10 2018-09-07 深圳大学 A kind of decoating liquid and withdrawal plating of TiNC films
KR101971459B1 (en) * 2017-06-05 2019-04-23 재원산업 주식회사 Composition for cleaning conductive member for fabricating organic light emitting device and cleaning method using the same
JP6992095B2 (en) * 2018-02-05 2022-01-13 富士フイルム株式会社 Substrate processing method, semiconductor device manufacturing method, substrate processing kit
CN115066104A (en) * 2022-07-09 2022-09-16 南通群安电子材料有限公司 Stripping liquid for thick photoresist

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006113621A2 (en) * 2005-04-15 2006-10-26 Advanced Technology Materials, Inc. Formulations for cleaning ion-implanted photoresist layers from microelectronic devices
US20080283090A1 (en) * 2007-05-18 2008-11-20 Dekraker David Process for treatment of substrates with water vapor or steam

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19639093A1 (en) * 1996-09-24 1998-03-26 Bosch Gmbh Robert Method for the wireless transmission of location information and useful information and transmitting / receiving device
US6162565A (en) * 1998-10-23 2000-12-19 International Business Machines Corporation Dilute acid rinse after develop for chrome etch
JP2002064101A (en) * 2000-08-21 2002-02-28 Casio Comput Co Ltd Method of forming wiring having chromium layer
US6599370B2 (en) * 2000-10-16 2003-07-29 Mallinckrodt Inc. Stabilized alkaline compositions for cleaning microelectronic substrates
JP2003017465A (en) * 2001-06-29 2003-01-17 Mitsubishi Electric Corp Semiconductor device and manufacturing method therefor
US7247567B2 (en) * 2004-06-16 2007-07-24 Cabot Microelectronics Corporation Method of polishing a tungsten-containing substrate

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006113621A2 (en) * 2005-04-15 2006-10-26 Advanced Technology Materials, Inc. Formulations for cleaning ion-implanted photoresist layers from microelectronic devices
US20080283090A1 (en) * 2007-05-18 2008-11-20 Dekraker David Process for treatment of substrates with water vapor or steam

Also Published As

Publication number Publication date
WO2011072188A2 (en) 2011-06-16
WO2011072188A3 (en) 2011-09-15
KR20120108984A (en) 2012-10-05
SG181642A1 (en) 2012-07-30
CN103119694A (en) 2013-05-22
EP2510538A2 (en) 2012-10-17
JP2013513824A (en) 2013-04-22
TW201140254A (en) 2011-11-16

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Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20120704

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

RIN1 Information on inventor provided before grant (corrected)

Inventor name: CYWAR, DOUGLAS

Inventor name: BOGGS, KARL E.

Inventor name: KERN, MATTHEW

Inventor name: BAUM, THOMAS H.

Inventor name: TOTIR, GEORGE GABRIEL

Inventor name: AFZALI-ARDAKANI, ALI

Inventor name: NUNES, RONALD W.

Inventor name: COOPER, EMANUEL I.

Inventor name: KHOJASTEH, MAHMOUD

RIN1 Information on inventor provided before grant (corrected)

Inventor name: NUNES, RONALD W.

Inventor name: AFZALI-ARDAKANI, ALI

Inventor name: TOTIR, GEORGE GABRIEL

Inventor name: KHOJASTEH, MAHMOUD

Inventor name: COOPER, EMANUEL I.

Inventor name: BOGGS, KARL E.

Inventor name: BAUM, THOMAS H.

Inventor name: CYWAR, DOUGLAS

Inventor name: KERN, MATTHEW

DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20140225

RIC1 Information provided on ipc code assigned before grant

Ipc: H01L 21/311 20060101AFI20140219BHEP

Ipc: G03F 7/42 20060101ALI20140219BHEP

STAA Information on the status of an ep patent application or granted ep patent

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18D Application deemed to be withdrawn

Effective date: 20140701