EP2470613A1 - Inductively curable adhesive composition - Google Patents
Inductively curable adhesive compositionInfo
- Publication number
- EP2470613A1 EP2470613A1 EP10727412A EP10727412A EP2470613A1 EP 2470613 A1 EP2470613 A1 EP 2470613A1 EP 10727412 A EP10727412 A EP 10727412A EP 10727412 A EP10727412 A EP 10727412A EP 2470613 A1 EP2470613 A1 EP 2470613A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- adhesive composition
- curable adhesive
- shell
- composition according
- core
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 53
- 239000000853 adhesive Substances 0.000 title claims abstract description 42
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 42
- 239000002245 particle Substances 0.000 claims abstract description 43
- 239000011258 core-shell material Substances 0.000 claims abstract description 20
- 230000005291 magnetic effect Effects 0.000 claims abstract description 14
- 229910044991 metal oxide Inorganic materials 0.000 claims abstract description 9
- 150000004706 metal oxides Chemical class 0.000 claims abstract description 9
- 229910021486 amorphous silicon dioxide Inorganic materials 0.000 claims abstract description 4
- 239000011164 primary particle Substances 0.000 claims abstract 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 29
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N iron oxide Inorganic materials [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 claims description 22
- 239000000377 silicon dioxide Substances 0.000 claims description 14
- 235000013980 iron oxide Nutrition 0.000 claims description 12
- SZVJSHCCFOBDDC-UHFFFAOYSA-N iron(II,III) oxide Inorganic materials O=[Fe]O[Fe]O[Fe]=O SZVJSHCCFOBDDC-UHFFFAOYSA-N 0.000 claims description 11
- 229920005862 polyol Polymers 0.000 claims description 11
- 150000003077 polyols Chemical group 0.000 claims description 11
- 235000012239 silicon dioxide Nutrition 0.000 claims description 9
- 150000001412 amines Chemical class 0.000 claims description 8
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims description 8
- 229910052595 hematite Inorganic materials 0.000 claims description 7
- LIKBJVNGSGBSGK-UHFFFAOYSA-N iron(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Fe+3].[Fe+3] LIKBJVNGSGBSGK-UHFFFAOYSA-N 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 239000011019 hematite Substances 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- 239000012948 isocyanate Substances 0.000 claims description 5
- 150000002513 isocyanates Chemical group 0.000 claims description 5
- 238000002156 mixing Methods 0.000 claims description 4
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 claims description 3
- 239000004848 polyfunctional curative Substances 0.000 claims description 3
- 229920006337 unsaturated polyester resin Polymers 0.000 claims description 3
- 239000000945 filler Substances 0.000 claims description 2
- VBMVTYDPPZVILR-UHFFFAOYSA-N iron(2+);oxygen(2-) Chemical class [O-2].[Fe+2] VBMVTYDPPZVILR-UHFFFAOYSA-N 0.000 claims description 2
- -1 siloxanes Chemical class 0.000 description 71
- 125000000217 alkyl group Chemical group 0.000 description 29
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 21
- 125000003118 aryl group Chemical group 0.000 description 19
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 16
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 11
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 10
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 230000001939 inductive effect Effects 0.000 description 8
- 239000011701 zinc Substances 0.000 description 8
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 7
- 239000011777 magnesium Substances 0.000 description 7
- 150000008064 anhydrides Chemical class 0.000 description 6
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 6
- 125000005442 diisocyanate group Chemical group 0.000 description 6
- 229910052742 iron Inorganic materials 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 150000001282 organosilanes Chemical class 0.000 description 6
- 229920001296 polysiloxane Polymers 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Natural products C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 5
- 150000001298 alcohols Chemical class 0.000 description 5
- 150000001735 carboxylic acids Chemical class 0.000 description 5
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 5
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 4
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 4
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 4
- 239000007795 chemical reaction product Substances 0.000 description 4
- 229910017052 cobalt Inorganic materials 0.000 description 4
- 239000010941 cobalt Substances 0.000 description 4
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 4
- 125000000753 cycloalkyl group Chemical group 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 230000003993 interaction Effects 0.000 description 4
- XMGQYMWWDOXHJM-UHFFFAOYSA-N limonene Chemical compound CC(=C)C1CCC(C)=CC1 XMGQYMWWDOXHJM-UHFFFAOYSA-N 0.000 description 4
- 239000011572 manganese Substances 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 229960004063 propylene glycol Drugs 0.000 description 4
- 229910006297 γ-Fe2O3 Inorganic materials 0.000 description 4
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 3
- 125000002947 alkylene group Chemical group 0.000 description 3
- 229910052793 cadmium Inorganic materials 0.000 description 3
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000002485 combustion reaction Methods 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229910052749 magnesium Inorganic materials 0.000 description 3
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 3
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 3
- 229920000570 polyether Polymers 0.000 description 3
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 3
- 229920002554 vinyl polymer Chemical group 0.000 description 3
- 229910052727 yttrium Inorganic materials 0.000 description 3
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- ARXKVVRQIIOZGF-UHFFFAOYSA-N 1,2,4-butanetriol Chemical compound OCCC(O)CO ARXKVVRQIIOZGF-UHFFFAOYSA-N 0.000 description 2
- NNOZGCICXAYKLW-UHFFFAOYSA-N 1,2-bis(2-isocyanatopropan-2-yl)benzene Chemical compound O=C=NC(C)(C)C1=CC=CC=C1C(C)(C)N=C=O NNOZGCICXAYKLW-UHFFFAOYSA-N 0.000 description 2
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 2
- YBYIRNPNPLQARY-UHFFFAOYSA-N 1H-indene Chemical compound C1=CC=C2CC=CC2=C1 YBYIRNPNPLQARY-UHFFFAOYSA-N 0.000 description 2
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 2
- OBETXYAYXDNJHR-UHFFFAOYSA-N 2-Ethylhexanoic acid Chemical compound CCCCC(CC)C(O)=O OBETXYAYXDNJHR-UHFFFAOYSA-N 0.000 description 2
- XJMMNTGIMDZPMU-UHFFFAOYSA-N 3-methylglutaric acid Chemical compound OC(=O)CC(C)CC(O)=O XJMMNTGIMDZPMU-UHFFFAOYSA-N 0.000 description 2
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- 229910007161 Si(CH3)3 Inorganic materials 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000002441 X-ray diffraction Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 238000005054 agglomeration Methods 0.000 description 2
- 230000002776 aggregation Effects 0.000 description 2
- 229910052788 barium Inorganic materials 0.000 description 2
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- KORSJDCBLAPZEQ-UHFFFAOYSA-N dicyclohexylmethane-4,4'-diisocyanate Chemical compound C1CC(N=C=O)CCC1CC1CCC(N=C=O)CC1 KORSJDCBLAPZEQ-UHFFFAOYSA-N 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 2
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 2
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 229910052744 lithium Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000003607 modifier Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- QOHMWDJIBGVPIF-UHFFFAOYSA-N n',n'-diethylpropane-1,3-diamine Chemical compound CCN(CC)CCCN QOHMWDJIBGVPIF-UHFFFAOYSA-N 0.000 description 2
- 229940117969 neopentyl glycol Drugs 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 229920005906 polyester polyol Polymers 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- YPFDHNVEDLHUCE-UHFFFAOYSA-N propane-1,3-diol Chemical compound OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 2
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
- 239000011541 reaction mixture Substances 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 150000005846 sugar alcohols Polymers 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- 238000009827 uniform distribution Methods 0.000 description 2
- 229920001567 vinyl ester resin Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- ZQHJVIHCDHJVII-OWOJBTEDSA-N (e)-2-chlorobut-2-enedioic acid Chemical compound OC(=O)\C=C(\Cl)C(O)=O ZQHJVIHCDHJVII-OWOJBTEDSA-N 0.000 description 1
- OZCRKDNRAAKDAN-HNQUOIGGSA-N (e)-but-1-ene-1,4-diol Chemical compound OCC\C=C\O OZCRKDNRAAKDAN-HNQUOIGGSA-N 0.000 description 1
- GFNDFCFPJQPVQL-UHFFFAOYSA-N 1,12-diisocyanatododecane Chemical compound O=C=NCCCCCCCCCCCCN=C=O GFNDFCFPJQPVQL-UHFFFAOYSA-N 0.000 description 1
- OYUWHGGWLCJJNP-UHFFFAOYSA-N 1,2-Dihydrophthalic acid Chemical compound OC(=O)C1C=CC=CC1C(O)=O OYUWHGGWLCJJNP-UHFFFAOYSA-N 0.000 description 1
- ZTNJGMFHJYGMDR-UHFFFAOYSA-N 1,2-diisocyanatoethane Chemical compound O=C=NCCN=C=O ZTNJGMFHJYGMDR-UHFFFAOYSA-N 0.000 description 1
- 229940058015 1,3-butylene glycol Drugs 0.000 description 1
- VGHSXKTVMPXHNG-UHFFFAOYSA-N 1,3-diisocyanatobenzene Chemical compound O=C=NC1=CC=CC(N=C=O)=C1 VGHSXKTVMPXHNG-UHFFFAOYSA-N 0.000 description 1
- PXGZQGDTEZPERC-UHFFFAOYSA-N 1,4-cyclohexanedicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)CC1 PXGZQGDTEZPERC-UHFFFAOYSA-N 0.000 description 1
- ALQLPWJFHRMHIU-UHFFFAOYSA-N 1,4-diisocyanatobenzene Chemical compound O=C=NC1=CC=C(N=C=O)C=C1 ALQLPWJFHRMHIU-UHFFFAOYSA-N 0.000 description 1
- OVBFMUAFNIIQAL-UHFFFAOYSA-N 1,4-diisocyanatobutane Chemical compound O=C=NCCCCN=C=O OVBFMUAFNIIQAL-UHFFFAOYSA-N 0.000 description 1
- CDMDQYCEEKCBGR-UHFFFAOYSA-N 1,4-diisocyanatocyclohexane Chemical compound O=C=NC1CCC(N=C=O)CC1 CDMDQYCEEKCBGR-UHFFFAOYSA-N 0.000 description 1
- SBJCUZQNHOLYMD-UHFFFAOYSA-N 1,5-Naphthalene diisocyanate Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1N=C=O SBJCUZQNHOLYMD-UHFFFAOYSA-N 0.000 description 1
- ATOUXIOKEJWULN-UHFFFAOYSA-N 1,6-diisocyanato-2,2,4-trimethylhexane Chemical compound O=C=NCCC(C)CC(C)(C)CN=C=O ATOUXIOKEJWULN-UHFFFAOYSA-N 0.000 description 1
- QGLRLXLDMZCFBP-UHFFFAOYSA-N 1,6-diisocyanato-2,4,4-trimethylhexane Chemical compound O=C=NCC(C)CC(C)(C)CCN=C=O QGLRLXLDMZCFBP-UHFFFAOYSA-N 0.000 description 1
- KTZVZZJJVJQZHV-UHFFFAOYSA-N 1-chloro-4-ethenylbenzene Chemical compound ClC1=CC=C(C=C)C=C1 KTZVZZJJVJQZHV-UHFFFAOYSA-N 0.000 description 1
- NFDXQGNDWIPXQL-UHFFFAOYSA-N 1-cyclooctyldiazocane Chemical compound C1CCCCCCC1N1NCCCCCC1 NFDXQGNDWIPXQL-UHFFFAOYSA-N 0.000 description 1
- WHFHDVDXYKOSKI-UHFFFAOYSA-N 1-ethenyl-4-ethylbenzene Chemical compound CCC1=CC=C(C=C)C=C1 WHFHDVDXYKOSKI-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- QEDJMOONZLUIMC-UHFFFAOYSA-N 1-tert-butyl-4-ethenylbenzene Chemical compound CC(C)(C)C1=CC=C(C=C)C=C1 QEDJMOONZLUIMC-UHFFFAOYSA-N 0.000 description 1
- JCTXKRPTIMZBJT-UHFFFAOYSA-N 2,2,4-trimethylpentane-1,3-diol Chemical compound CC(C)C(O)C(C)(C)CO JCTXKRPTIMZBJT-UHFFFAOYSA-N 0.000 description 1
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- 229910052719 titanium Inorganic materials 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- NMEPHPOFYLLFTK-UHFFFAOYSA-N trimethoxy(octyl)silane Chemical compound CCCCCCCC[Si](OC)(OC)OC NMEPHPOFYLLFTK-UHFFFAOYSA-N 0.000 description 1
- MEBONNVPKOBPEA-UHFFFAOYSA-N trimethyl cyclohexane Natural products CC1CCCCC1(C)C MEBONNVPKOBPEA-UHFFFAOYSA-N 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- 235000021122 unsaturated fatty acids Nutrition 0.000 description 1
- 150000004670 unsaturated fatty acids Chemical class 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/02—Ingredients treated with inorganic substances
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2475/00—Presence of polyurethane
Definitions
- the invention relates to an inductively curable adhesive composition which comprises core-shell particles whose shell comprises amorphous silicon dioxide and whose core comprises one or more magnetic metal oxides.
- a frequent drawback of prior-art adhesives is that the processing life (pot life) before parts become bonded is not long enough, whereas the cure time takes too long a duration. This drawback becomes noticeable in particular when bonding large areas, such as in the construction of vehicles, aircraft or watercraft.
- Another field in which adhesives are required to withstand high mechanical loads is the construction of wind turbines, and more particularly the construction of vanes for wind turbine rotors.
- Methods of producing the mouldings of the vanes of wind turbine rotors are known in the prior art. They involve first producing mouldings of two half-shells from a thermoset polymer, which are then bonded adhesively on the side facing away from the mould.
- the prior art has disclosed adhesive compositions which comprise superparamagnetic particles. These adhesive compositions can be cured inductively by magnetic or electromagnetic fields.
- DE-A-10163399 discloses an adhesive composition which has dispersed superparamagnetic particles of mixed metal oxide.
- the particles have an average diameter of 2 to 100 nm.
- the invention provides an inductively curable adhesive composition
- core-shell particles having an average particle diameter of 2 to 100 nm, the shell comprising or consisting of amorphous silicon dioxide and the core comprising or consisting of one or more magnetic metal oxides.
- the core-shell particles have an average diameter of 2 to 100 nm. This diameter may relate to isolated individual particles, to aggregated particles or to hybrid forms of the aforementioned particles. The average particle diameter may be determined by methods known to the person skilled in the art, such as laser diffraction or evaluation of TEM micrographs, for example.
- the core-shell particles comprise or are composed of particles which form intergrown cores and in which the intergrown cores are surrounded by a shell comprising silicon dioxide.
- the cores of the particles are magnetic. This means that they are ferrimagnetic, ferromagnetic and/or superparamagnetic. Preference may be given to particles having superparamagnetic properties.
- Superparamagnetic materials possess no permanent (equidirectional) arrangement of the elementary magnetic dipoles in the absence of external, acting magnetic fields. They may have a slight residual magnetization.
- the cores of the particles comprise or consist of magnetic metal oxides. Suitability is possessed more particularly by the oxides of iron, of cobalt, of nickel, of chromium, of europium, of yttrium, of samarium, or of gadolinium.
- the metal oxides may be present in a single modification or in different modifications.
- iron oxide may be in the form of gamma-Fe 2 O 3 ( ⁇ -Fe 2 O 3 ), Fe 3 O 4 , and mixtures of gamma-Fe 2 O 3 ( ⁇ -Fe 2 O 3 ) and/or Fe 3 O 4 .
- the metal oxides may further be present in the form of mixed oxide of at least two metals, with the metal components iron, cobalt, nickel, tin, zinc, cadmium, magnesium, manganese, copper, barium, lithium or yttrium.
- the metal oxides may further be substances having the general formula M 11 Fe 2 O 4 , in which M" is a metal component which comprises at least two different divalent metals.
- M is a metal component which comprises at least two different divalent metals.
- one of the divalent metals may be manganese, zinc, magnesium, cobalt, copper, cadmium or nickel.
- these may be ZnFe 2 O 4 , MnFe 2 O 4 , Mn 0 6Fe 04 Fe 2 O 4 , Mn 05 Zn 05 Fe 2 O 4 , Zn 0 ⁇ Fei 9 O 4 , Zn 02 Fei 8 O 4 , Zn 03 Fei, 7 O 4 , Zn 04 Fei 6 O 4 or Mn 039 Zn o 27 Fe 234 O 4 , MgFe 2 O 3 , Mg 1 2 Mn 02 Fei 6 O 4 , Mg 1 4 Mn 04 Fe 1 2 O 4 , Mg 1 6 Mn 06 Fe 08 O 4 , Mg 1 8 Mn 0 8 Fe 04 O 4 .
- the core-shell particles there may be compounds present between shell and core that are composed of the elements silicon, iron and oxygen, an example being iron silicate.
- the core is composed of one or more iron oxides comprising hematite, magnetite and maghemite.
- small amounts of beta-Fe 2 O 3 may be detected.
- the fraction - as determinable from X- ray diffraction diagrams - of hematite is preferably 1% to 10% by weight, more preferably 4% to 8% by weight, that of magnetite preferably 20% to 50% by weight, more preferably 35% to 40% by weight, and that of maghemite preferably 40% to 75% by weight, more preferably 50% to 60% by weight, with the fractions adding to 100% by weight.
- Core-shell particles which have this distribution are particularly suitable for inductive heating in a middle-frequency magnetic field of 3-100 kHz, preferably 20 to 60 kHz.
- the fraction - as determinable from the X-ray diffraction diagrams - of hematite is preferably 5% to 40% by weight, more preferably 10% to 30% by weight, that of magnetite preferably 50% to 90% by weight, more preferably 60% to 85% by weight, and that of maghemite preferably 5% to 30% by weight, more preferably 10% to 20% by weight, the fractions adding to 100%.
- Core- shell particles which have this distribution are particularly suitable for inductive heating in a high-frequency magnetic field of more than 100 kHz, preferably 400 to 1000 kHz.
- core-shell particles having a BET surface area of 10 to 80 m 2 /g, a shell thickness of 2 to 30 nm, and an iron oxide content of 60% to
- the BET surface area is 40 to 70 m 2 /g
- the shell thickness is 5 to 20 nm
- the iron oxide content is 80% to 90% by weight and the silicon dioxide content is 10% to 20% by weight, based in each case on the shell-encased particles, and
- the core comprises
- the BET surface area is 40 to 70 m 2 /g
- the shell thickness is 5 to 20 nm
- the iron oxide content is 80% to 90% by weight and the silicon dioxide content is 10% to 20% by weight, based in each case on the shell-encased particles, and
- the core comprises
- the core-shell particles present in surface-modified form. This may facilitate incorporation into an organic medium. It further improves the physical properties of the adhesive composition, and the heating rates that can be attained.
- the surface modifiers used for this purpose have at least one functional group which is able to interact or react chemically with reactive groups present on the surface of the core-shell particles, resulting in attachment. This attachment may be by chemical bond, such as covalent bonds, including coordinative bonds (complexes), or ionic bonds, of the functional group to the surface groups of the particles, whereas interactions include, for example, dipole-dipole interactions, polar interactions, hydrogen bonds and van der Waals' interactions. Preference is given to the formation of a chemical bond.
- halosilanes alkoxysilanes, silazanes and/or siloxanes. Examples thereof are:
- R' methyl-, aryl (for example -CgHs, substituted phenyl radicals), -C4Fg, OCF 2 -
- R may be methyl-, ethyl-, propyl-, butyl-,
- R' methyl-, aryl (for example -CgHs, substituted phenyl radicals),
- R alkyl, vinyl, aryl
- R' alkyl, vinyl, aryl,
- octamethylcyclotetrasiloxane D 4 m
- silanizing agents it is possible with preference to use trimethoxyoctylsilane
- the following substances can be used more particularly as polysiloxanes or silicone fluids of the type Y-O-[[SiRR') m -O]-[SiR"R'"-O] n ] u -Y with
- the fraction of the particles having a core-shell structure in the inductively curable adhesive composition of the invention is preferably 0.1 % to 20% by weight, and more preferably 0.5% to 10% by weight, based in each case on the adhesive composition.
- the inductively curable adhesive composition of the invention preferably comprises a resin which is obtainable by mixing at least two reactive components, it being possible for one or more of the reactive components to comprise particles having the core-shell structure.
- the reactive groups are preferably selected from the group consisting of an epoxy resin and an amine or an epoxy resin and a carboxylic anhydride or an acrylate and an amine or an isocyanate and a polyol or an epoxy resin, and isocyanate, a polyol and an amine.
- the resin in question may preferably be a resin obtainable by mixing an epoxy resin and a hardener preparation.
- the epoxy resin may be, for example, a resin based on a polyglycidyl ether, a polyhydroxide, a polyol or phenol. Examples include 2,2-bis-4-hydroxyphenylpropane
- the hardener preparation may comprise one or more anhydrides and/or amines.
- This anhydride is preferably from the group consisting of phthalic anhydride, tetrahydro-, hexahydro-, methyltetrahydro-, endomethylenetetrahydro-,
- methylenedimethylenetetrahydro-phthalic anhydride maleic anhydride/styrene copolymer, dodecenylsuccinic anhydride, tetrachlorophthalic anhydride and hexachloroendomethylenetetrahydrophthalic anhydride.
- the amine is preferably selected from the group consisting of aliphatic, cycloaliphatic, aromatic, araliphatic and heterocyclic amines.
- Examples include the following:
- - tertiary amines selected from the group consisting of N,N,N',N'-tetramethylhexane- 1 ,6-diamine, diazabicyclooctane, N,N-dimethylcyclohexylamine, tris-N,N- dimethylaminomethylphenol, N,N-dimethylamino-4-pyridine, N,N-dimethylamino-4- toluidine, N,N-diethyl-1 ,3-propanediamine, N,N-dimethylpropylenetramine, tris- 2,4,6-dimethylaminomethylphenol and tri-n-butylamine, 3-aminoethyl-3,5,5- trimethylcyclohexylamine, 1 ,4-cyclohexane bis(methylamine);
- alkylenediamines such as ethylenediamine or butane-1 ,4-diamine
- polyalkylenepolyamines such as diethylenetriamine, triethylenetetramine, tetraethylenepentamine, dipropylenetriamine or tripropylenetetramine
- N- N-hydroxyalkylderivates of polyalkylenepolyamines such as N- (hydroxyethyl)diethylenetriamine, or mono-N-2-hydroxypropyl derivates of triethylenetetramine
- polyoxyalkylenepolyamines such as polyoxyethylene- and polyoxypropylenediamines and -triamines
- N,N-dialkylalkylenediamines such as N,N-dimethylpropane-1 ,3-diamine or N, N- diethylpropane-1 ,3-diamine;
- - cycloaliphatic amines having an amino group or aminoalkyl group on the ring, such as 3-aminomethyl-3,5,5-trimethylcyclohexylamine (isophoronediamine);
- aromatic amines such as bis(4-aminophenyl)methane or
- N-aminoalkylpiperazines such as N-(2-aminoethyl)piperazine or N-(3- aminopropyl)piperazine;
- polyaminoamides for example reaction products of polyalkylenepolyamines with polymerized unsaturated fatty acids.
- the adhesive composition of the invention may further comprise one or more unsaturated polyesters or vinyl esters as resins.
- the unsaturated polyester resins comprise those based on unsaturated carboxylic acids or acid anhydrides and diols in a blend with unsaturated aromatic monomers.
- the unsaturated carboxylic acids and their anhydrides are generally dibasic, unsaturated, preferably alpha, beta-olefinically unsaturated, carboxylic acids.
- carboxylic acids and their anhydrides are maleic acid, fumaric acid, chloromaleic acid, itaconic acid, citraconic acid, methyleneglutaric acid and mesaconic acid and their esters or, preferably, their anhydrides, and also succinic acid, glutaric acid, methylglutaric acid, adipic acid, sebacic acid, pimelic acid, phthalic anhydride, ortho-phthalic acid, isophthalic acid, terephthalic acid, dihydrophthalic acid, tetrahydrophthalic acid, tetrachlorophthalic acid, dodecanedicarboxylic acids, cis-5- norbornene-2,3-dicarboxylic acid or anhydride, dimethyl-2,6-naphthenedicarboxylate, dimethyl-2,6-naphthenedicarboxylic acid, naphthenedicarboxylic acid or anhydride, and 1 ,4-cyclohexane
- polyester resins it is also possible to use monobasic, tribasic or higher polybasic carboxylic acids, for example ethylhexanoic acid, methacrylic acid, propionic acid, benzoic acid, 1 ,2,4- benzenetricarboxylic acid or 1 ,2,4,5-benzenetetracarboxylic acid.
- monobasic, tribasic or higher polybasic carboxylic acids for example ethylhexanoic acid, methacrylic acid, propionic acid, benzoic acid, 1 ,2,4- benzenetricarboxylic acid or 1 ,2,4,5-benzenetetracarboxylic acid.
- Suitable polyhydric alcohols include alkanediols and oxaalkanediols, examples being ethylene glycol, 1 ,2-propylene glycol, propane-1 ,3-diol, 1 ,3-butylene glycol, butane- 1 ,4-diol, hexane-1 ,6-diol, 2,2-dimethylpropane-1 ,3-diol, diethylene glycol, triethylene glycol, polyethylene glycol, cyclohexane-1 ,2-diol,
- 2,2-dimethyloctanediol 2,2-dimethyl-1 ,3-propanediol, pentaerythritol, dipentaerythritol, tripentaerythritol, trimethylolpropane, ditrimethylolpropane,
- the unsaturated polyester resin may further comprise a vinyl monomer, examples being styrene, methoxystyrene, divinylbenzene, 4-ethylstyrene,
- esters of acrylic acid and methacrylic acid with alcohols or polyols having in each case 1 to 18 carbon atoms, examples being methyl methacrylate, butyl acrylate, ethylhexyl acrylate, hydroxpropyl acrylate, lauryl acrylate, stearyl
- the adhesive composition of the invention may further comprise one or more polyols and one or more isocyanates, preferably diisocyanates.
- polyol components examples include ethylene glycol, propylene glycol, butane-1 ,4-diol, pentane-1 ,5-diol, hexane-1 ,6-diol, heptane-1 ,7-diol, octane-1 ,8-diol, glycerol, trimethylolpropane and pentaerythritol.
- polyol component it is additionally possible to use reaction products of low molecular mass polyfunctional alcohols with alkylene oxides, referred to as polyethers.
- the alkylene oxides have preferably 2 to 4 C atoms.
- Suitability is possessed for example by the reaction products of ethylene glycol, propylene glycol, the isomeric butanedioles, hexanedioles or 4,4'- dihydroxydiphenylpropane with ethylene oxide, propylene oxide or butylene oxide, or mixtures of two or more thereof.
- polyfunctional alcohols such as glycerol, trimethylolethane or trimethylolpropane, pentaerythritol or sugar alcohols, or mixtures of two or more thereof, with the stated alkylene oxides, to form polyether polyols.
- Particularly suitable polyether polyols are those having a molecular weight of about 100 to about 10 000, preferably of about 200 to about 5000.
- polyester polyols formed by reacting low molecular mass alcohols, more particularly ethylene glycol, diethylene glycol, neopentylglycol, hexanediol, butanediol, propylene glycol, glycerol or trimethylolpropane, with caprolactone.
- polyester polyols suitable as polyfunctional alcohols for the preparation of polyester polyols are 1 ,4-hydroxymethylcyclohexane, 2-methyl-1 ,3-propanediol, butane-1 ,2,4-triol, triethylene glycol, tetraethylene glycol, polyethylene glycol, dipropylene glycol, polypropylene glycol, dibutylene glycol and polybutylene glycol.
- the isocyanates may preferably be 1 ,5-naphthylene diisocyanate, 4,4'- diphenylmethane diisocyanate (MDI), hydrogenated MDI (H12MDI), xylylene diisocyanate (XDI), tetramethylxylylene diisocyanate (TMXDI),
- MDI 4,4'- diphenylmethane diisocyanate
- H12MDI hydrogenated MDI
- XDI xylylene diisocyanate
- TMXDI tetramethylxylylene diisocyanate
- the adhesive composition of the invention may further comprise fillers, such as talc, calcium carbonate or silicon dioxide.
- fillers such as talc, calcium carbonate or silicon dioxide.
- the silicon dioxide may preferably be precipitated or fumed (pyrogenically prepared) silicon dioxide powder.
- the silicon dioxide power may also be in surface-modified form.
- the invention further provides for the use of the adhesive composition for adhesively bonding rotor vanes of wind turbines.
- the adhesive composition of the invention leads to uniform distribution of the particles in the adhesive composition, and to a high efficiency on inductive curing.
- Example 1 Silica coated Iron Oxide
- This mixture is reacted in the combustion zone of the reactor in a flame generated by igniting a mixture of 7.9 m 3 (STP)/h of hydrogen and 21 m 3 (STP)/h of air.
- the residence time of the reaction mixture in the combustion zone is approx. 43 ms.
- the reaction mixture is cooled to 337°C by introducing 7 kg/h of water.
- the resulting solid is separated from the gaseous substances on a filter.
- the solid material displays a BET surface area of 60 m 2 /g, a mean particle diameter of 16 nm.
- the thickness of the shell is 3-8 nm.
- the silica content is 19.3 wt.-%, the iron oxide content is 81.7 wt.-%, in 7:85:7 ratio of maghemite, magnetite and haematite.
- Example 2 Adhesive Composition (according to invention)
- the silica coated iron oxide of Example 1 is dispersed in Epikote ® 828 Resin
- Example 3 Adhesive Composition (according to invention)
- the silica coated iron oxide of Example 1 is dispersed in the resin composition by using a dissolver.
- the curing composition is added.
- the mixture was cured inductively by using the high frequency generator Tru Heat HF 5010, made by HUTTINGER Elektronik at a frequency of 607 kHz. Results are shown in Table 2.
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Abstract
Inductively curable adhesive composition comprising core-shell particles having an average primary particle diameter of 2 to 100 nm, the shell comprising amorphous silicon dioxide and the core comprising one or more magnetic metal oxides. It can be used for adhesively bonding rotor vanes of wind turbines.
Description
Inductively curable adhesive composition
The invention relates to an inductively curable adhesive composition which comprises core-shell particles whose shell comprises amorphous silicon dioxide and whose core comprises one or more magnetic metal oxides. A frequent drawback of prior-art adhesives is that the processing life (pot life) before parts become bonded is not long enough, whereas the cure time takes too long a duration. This drawback becomes noticeable in particular when bonding large areas, such as in the construction of vehicles, aircraft or watercraft. Another field in which adhesives are required to withstand high mechanical loads is the construction of wind turbines, and more particularly the construction of vanes for wind turbine rotors.
Methods of producing the mouldings of the vanes of wind turbine rotors are known in the prior art. They involve first producing mouldings of two half-shells from a thermoset polymer, which are then bonded adhesively on the side facing away from the mould.
The prior art has disclosed adhesive compositions which comprise superparamagnetic particles. These adhesive compositions can be cured inductively by magnetic or electromagnetic fields. Thus, for example, DE-A-10163399 discloses an adhesive composition which has dispersed superparamagnetic particles of mixed metal oxide.
The particles have an average diameter of 2 to 100 nm. Through agglomeration or accretion of the superparamagnetic particles, it is difficult to ensure uniform distribution of the particles in the adhesive composition. Moreover, the agglomeration or accretion leads to a change in the magnetic properties of the particles and hence to a lower efficiency on inductive curing.
It was an object of the present invention to provide an adhesive composition which permits a long enough processing life when bonding relatively large areas, but at the same time can be rapidly cured.
The invention provides an inductively curable adhesive composition comprising core- shell particles having an average particle diameter of 2 to 100 nm, the shell comprising or consisting of amorphous silicon dioxide and the core comprising or consisting of one or more magnetic metal oxides. The core-shell particles have an average diameter of 2 to 100 nm. This diameter may relate to isolated individual particles, to aggregated particles or to hybrid forms of the
aforementioned particles. The average particle diameter may be determined by methods known to the person skilled in the art, such as laser diffraction or evaluation of TEM micrographs, for example. In one particular embodiment of the adhesive composition of the invention, the core-shell particles comprise or are composed of particles which form intergrown cores and in which the intergrown cores are surrounded by a shell comprising silicon dioxide.
The cores of the particles are magnetic. This means that they are ferrimagnetic, ferromagnetic and/or superparamagnetic. Preference may be given to particles having superparamagnetic properties. Superparamagnetic materials possess no permanent (equidirectional) arrangement of the elementary magnetic dipoles in the absence of external, acting magnetic fields. They may have a slight residual magnetization.
The cores of the particles comprise or consist of magnetic metal oxides. Suitability is possessed more particularly by the oxides of iron, of cobalt, of nickel, of chromium, of europium, of yttrium, of samarium, or of gadolinium. The metal oxides may be present in a single modification or in different modifications.
Preferably, iron oxide may be in the form of gamma-Fe2O3 (γ-Fe2O3), Fe3O4, and mixtures of gamma-Fe2O3 (γ-Fe2O3) and/or Fe3O4.
The metal oxides may further be present in the form of mixed oxide of at least two metals, with the metal components iron, cobalt, nickel, tin, zinc, cadmium, magnesium, manganese, copper, barium, lithium or yttrium.
The metal oxides may further be substances having the general formula M11Fe2O4, in which M" is a metal component which comprises at least two different divalent metals. Preferably, one of the divalent metals may be manganese, zinc, magnesium, cobalt, copper, cadmium or nickel. Furthermore, the metal oxides may be composed of ternary systems of the general formula (Ma 1-x-y Mb xFey)"Fe2'"θ4 where Ma and Mb respectively are the metals manganese, cobalt, nickel, zinc, copper, magnesium, barium, yttrium, tin, lithium, cadmium, calcium, strontium, titanium, chromium, vanadium, niobium or molybdenum, with x = 0.05 to 0.95, y = 0 to 0.95 and x+y < 1.
With preference these may be ZnFe2O4, MnFe2O4, Mn06Fe04Fe2O4, Mn05Zn05Fe2O4, Zn0 ^ Fei 9O4, Zn02Fei 8O4, Zn03Fei,7O4, Zn04Fei 6O4 or Mn039Zno 27Fe234O4, MgFe2O3, Mg1 2Mn02Fei 6O4, Mg1 4Mn04Fe1 2O4, Mg1 6Mn06Fe08O4, Mg1 8Mn0 8Fe04O4.
In one particular embodiment, in the core-shell particles, there may be compounds present between shell and core that are composed of the elements silicon, iron and oxygen, an example being iron silicate.
In one particularly preferred embodiment of the invention, the core is composed of one or more iron oxides comprising hematite, magnetite and maghemite. In certain cases, small amounts of beta-Fe2O3 may be detected. The fraction - as determinable from X- ray diffraction diagrams - of hematite is preferably 1% to 10% by weight, more preferably 4% to 8% by weight, that of magnetite preferably 20% to 50% by weight, more preferably 35% to 40% by weight, and that of maghemite preferably 40% to 75% by weight, more preferably 50% to 60% by weight, with the fractions adding to 100% by weight. Core-shell particles which have this distribution are particularly suitable for inductive heating in a middle-frequency magnetic field of 3-100 kHz, preferably 20 to 60 kHz.
In another particular embodiment of the invention, the fraction - as determinable from the X-ray diffraction diagrams - of hematite is preferably 5% to 40% by weight, more preferably 10% to 30% by weight, that of magnetite preferably 50% to 90% by weight, more preferably 60% to 85% by weight, and that of maghemite preferably 5% to 30% by weight, more preferably 10% to 20% by weight, the fractions adding to 100%. Core- shell particles which have this distribution are particularly suitable for inductive heating in a high-frequency magnetic field of more than 100 kHz, preferably 400 to 1000 kHz.
Particular preference may be given to core-shell particles having a BET surface area of 10 to 80 m2/g, a shell thickness of 2 to 30 nm, and an iron oxide content of 60% to
90% by weight and a silicon dioxide content of 10% to 40% by weight, based in each case on the shell-encased particles.
Especially preferred for inductive curing in a middle-frequency magnetic field are core- shell particles in which
a) the BET surface area is 40 to 70 m2/g,
b) the shell thickness is 5 to 20 nm,
c) the iron oxide content is 80% to 90% by weight and the silicon dioxide content is
10% to 20% by weight, based in each case on the shell-encased particles, and where
d) the core comprises
d 1 ) 1 % to 10% of hematite,
d2) 20% to 50% of magnetite,
d3) 40% to 75% of maghemite,
the sum of these constituents being standardized to 100%.
Especially preferred for inductive curing in a high-frequency magnetic field are core- shell particles in which
a) the BET surface area is 40 to 70 m2/g,
b) the shell thickness is 5 to 20 nm,
c) the iron oxide content is 80% to 90% by weight and the silicon dioxide content is 10% to 20% by weight, based in each case on the shell-encased particles, and where
d) the core comprises
d1 ) 15% to 40% of hematite,
d2) 50% to 70% of magnetite,
d3) 5% to 30% of maghemite,
the sum of these constituents being standardized to 100%. In the adhesive compositions of the invention, it can be advantageous to have the core-shell particles present in surface-modified form. This may facilitate incorporation into an organic medium. It further improves the physical properties of the adhesive composition, and the heating rates that can be attained. The surface modifiers used for this purpose have at least one functional group which is able to interact or react chemically with reactive groups present on the surface of the core-shell particles, resulting in attachment. This attachment may be by chemical bond, such as covalent bonds, including coordinative bonds (complexes), or ionic bonds, of the functional group to the surface groups of the particles, whereas interactions include, for example, dipole-dipole interactions, polar interactions, hydrogen bonds and van der Waals' interactions. Preference is given to the formation of a chemical bond.
As surface modifiers it is possible with preference to use halosilanes, alkoxysilanes, silazanes and/or siloxanes.
Examples thereof are:
a) Organosilanes (RO)3Si(CnH2n+I) or (RO)3Si(CnH2n-I )
R = alkyl, such as, for example, methyl-, ethyl-, n-propyl-, isopropyl-, butyl- n = 1 - 20 b) Organosilanes R'x(RO)ySi(CnH2n+i ) or R'x(R0)ySi(CnH2n-1)
R = alkyl, such as, for example, methyl-, ethyl-, n-propyl-, isopropyl-, butyl- R' = alkyl, such as, for example, methyl-, ethyl-, n-propyl-, isopropyl-, butyl- R' = cycloalkyl
n = 1 - 20; x+y = 3; x = 1 ,2; y = 1 ,2 c) Haloorganosilanes X3Si(CnH2n+-] ) Or X3Si(CnH2n-1)
X = CI, Br; n = 1 - 20 d) Haloorganosilanes X2(R')Si(CnH2n+i ) or X2(R')Si(CnH2n-1)
X = Cl, Br; R' = alkyl, such as, for example, methyl-, ethyl-, n-propyl-,
isopropyl-, butyl-; R'=cycloalkyl; n = 1 - 20 e) Haloorganosilanes X(R')2Si(CnH2n+i ) or (R')2Si(CnH2n-1)
X = Cl, Br; R' = alkyl, such as, for example, methyl-, ethyl-, n-propyl-, isopropyl-, butyl-; R'=cycloalkyl; n = 1 - 20 f) Organosilanes (RO)3Si(CH2)m-R'
R = alkyl, such as, for example, methyl-, ethyl-, propyl-; m = 0.1 - 20
R' = methyl-, aryl (for example -CgHs, substituted phenyl radicals), -C4Fg, OCF2-
CHF-CF3, -C6F13, -0-CF2-CHF21 -NH2, -N3, -SCN, -CH=CH2, -NH-CH2-CH2- NH2, -N-(CH2-CH2-NH2)2, -0OC(CH3)C = CH2] -OCH2-CH(O)CH2]
-NH-CO-N-CO-(CH2)5, -NH-COO-CH3, -NH-COO-CH2-CH3, -NH- (CH2)3Si(OR)3] -Sx-(CH2)3Si(OR)3, -SH, -NR1R11R'" (R' = alkyl, aryl; R" = H, alkyl, aryl; R'" = H, alkyl, aryl, benzyl, C2H4NR"" R with R"" = H, alkyl and R =
H, alkyl) g) Organosilanes of the type (R")x(R0)ySi(CH2)m-R'
R" = alkyl; x+y = 2; cycloalkyl x= 1 ,2; y = 1 ,2; m = 0.1 to 20
R' = R' = methyl-, aryl (for example -CgHs, substituted phenyl radicals),
C4F9, OCF2-CHF-CF3, -C6F13, -0-CF2-CHF21 -NH2, -N3, -SCN, -CH=CH2, - NH-CH2-CH2-NH2, -N-(CH2-CH2-NH2)2, -0OC(CH3)C = CH2] -OCH2-CH(O)CH2] - NH-CO-N-CO-(CH2)5, -NH-COO-CH3, -NH-COO-CH2-CH3, -NH-(CH2)3Si(OR)3] -Sx-(CH2)3Si(OR)3, -SH, -NR1R11R'" (R' = alkyl, aryl; R" = H, alkyl, aryl; R'" = H, alkyl, aryl, benzyl, C2H4NR"" R with R"" = H, alkyl and R = H, alkyl) h) Haloorganosilanes X3Si(CH2)m-R'
X = Cl, Br; m = 0.1 - 20; R' = methyl-, aryl (for example -CgHs, substituted phenyl radicals), -C4F9, -OCF2-CHF-CF3, -C6F13, -O-CF2-CHF2] -NH2, -N3, -SCN, -CH=CH2, -NH-CH2-CH2-NH2, -N-(CH2-CH2-NH2)2, -0OC(CH3)C = CH2] - OCH2-CH(O)CH2 : -NH-CO-N-CO-(CH2)5] -NH-COO-CH3, -NH-COO-CH2-CH3,
-NH-(CH2)3Si(OR)3] -Sx-(CH2)3Si(OR)3, -SH, i) Haloorganosilanes (R)X2Si(CH2)m-R'
X = Cl, Br; R = alkyl, such as methyl-, ethyl-, propyl-; m = 0.1 - 20
R' = methyl-, aryl (e.g. -CgHs, substituted phenyl radicals), -C4F9, -OCF2- CHF-CF3, -C6F13, -0-CF2-CHF2, -NH2, -N3, -SCN, -CH=CH2, -NH-CH2-
CH2-NH2, -N-(CH2-CH2-NH2)2, -0OC(CH3)C = CH2] -OCH2-CH(O)CH2]
-NH-CO-N-CO-(CH2)5] -NH-COO-CH3, -NH-COO-CH2-CH3,
-NH-(CH2)3Si(OR)3, where R may be methyl-, ethyl-, propyl-, butyl-,
Sx-(CH2)3Si(OR)3, where R may be methyl-, ethyl-, propyl-, butyl-, and
-SH j) Haloorganosilanes (R)2X Si(CH2)m-R'
X = CI, Br; R = alkyl; m = 0.1 - 20
R' = methyl-, aryl (for example -CgHs, substituted phenyl radicals),
-C4F9, -OCF2-CHF-CF3, -C6F1 3, -O-CF2-CHF2]
-NH2, -N3, -SCN, -CH=CH2, -NH-CH2-CH2-NH2,
-N-(CH2-CH2-NH2),, -0OC(CH3)C = CH2] -OCH2-CH(O)CH2
-NH-CO-N-CO-(CH2)5] -NH-COO-CH3, -NH-COO-CH2-CH3,
-NH-(CH2)3Si(OR)3] -Sχ-(CH2)3Si(OR)3, -SH,
k) Silazanes of the type R'F^Si-NH-SiF^R'
R = alkyl, vinyl, aryl
R' = alkyl, vinyl, aryl,
Hexamethyldisilazane I) Cyclic polysiloxanes of type D 3, D 4 or D 5, with D3, D4 and D5 referring to cyclic polysiloxanes having 3, 4 or 5 units of the type -O-Si(CH3)2-. For example, octamethylcyclotetrasiloxane = D 4 m) Polysiloxanes or silicone fluids of type Y-O-[[SiRR')m-O]-[SiR"R'"-O]n]u-Y with
m = 0,1 ,2,3,...., n = 0,1 ,2,3,..., u = 0,1 ,2,3,...
Y = CH3, H, CnH2n+1 with n = 1-20; Si(CH3)3, Si(CH3)2H, Si(CH3)2OH,
Si(CH3)2(OCH3), Si(CH3)2(CnH2n+1) with n = 1-20
R = alkyl, such as CnH2n+1 , where n = 1 to 20, aryl, such as phenyl radicals and substituted phenyl radicals, (CH2)n-NH2, H
R'= alkyl, such as CnH2n+1 , where n = 1 to 20, aryl, such as phenyl radicals and substituted phenyl radicals, (CH2)n-NH2, H
R" = alkyl, such as CnH2n+1, with n = 1 to 20, aryl, such as phenyl radicals and substituted phenyl radicals, (CH2)n-NH2, H
R'" = alkyl, such as CnH2n+1, with n = 1 to 20, aryl, such as phenyl radicals and substituted phenyl radicals, (CH2)n-NH2, H As silanizing agents it is possible with preference to use trimethoxyoctylsilane
[(CH3O)3-Si-C8H17] (for example DYN ASYLAN® OCTMO, Degussa AG).
The following substances can be used more particularly as polysiloxanes or silicone fluids of the type Y-O-[[SiRR')m-O]-[SiR"R'"-O]n]u-Y with
R = alkyl, H; R' = alkyl, H; R" = alkyl, H; R'" = alkyl, H; Y = CH3, H, CnH2n+1 with n=1-20; Y = Si(CH3)3, Si(CH3)2H, Si(CH3)2OH, Si(CH3)2(OCH3), Si(CH3)2(CnH2n+1) with n=1-20; m = 0,1 ,2,3,...oo; n = 0,1 ,2,3,...α>; u = 0,1 , 2,3, ...∞.
The fraction of the particles having a core-shell structure in the inductively curable adhesive composition of the invention is preferably 0.1 % to 20% by weight, and more preferably 0.5% to 10% by weight, based in each case on the adhesive composition. The inductively curable adhesive composition of the invention preferably comprises a
resin which is obtainable by mixing at least two reactive components, it being possible for one or more of the reactive components to comprise particles having the core-shell structure.
The reactive groups are preferably selected from the group consisting of an epoxy resin and an amine or an epoxy resin and a carboxylic anhydride or an acrylate and an amine or an isocyanate and a polyol or an epoxy resin, and isocyanate, a polyol and an amine.
The resin in question may preferably be a resin obtainable by mixing an epoxy resin and a hardener preparation. The epoxy resin may be, for example, a resin based on a polyglycidyl ether, a polyhydroxide, a polyol or phenol. Examples include 2,2-bis-4-hydroxyphenylpropane
(bisphenol A),
bis-4-hydroxyphenylpropane (bisphenol F), a phenol-formaldehydenovolak or a cresol- formaldehydenovolak. The hardener preparation may comprise one or more anhydrides and/or amines.
This anhydride is preferably from the group consisting of phthalic anhydride, tetrahydro-, hexahydro-, methyltetrahydro-, endomethylenetetrahydro-,
methylenedimethylenetetrahydro-phthalic anhydride, maleic anhydride/styrene copolymer, dodecenylsuccinic anhydride, tetrachlorophthalic anhydride and hexachloroendomethylenetetrahydrophthalic anhydride.
The amine is preferably selected from the group consisting of aliphatic, cycloaliphatic, aromatic, araliphatic and heterocyclic amines.
Examples include the following:
- tertiary amines selected from the group consisting of N,N,N',N'-tetramethylhexane- 1 ,6-diamine, diazabicyclooctane, N,N-dimethylcyclohexylamine, tris-N,N- dimethylaminomethylphenol, N,N-dimethylamino-4-pyridine, N,N-dimethylamino-4- toluidine, N,N-diethyl-1 ,3-propanediamine, N,N-dimethylpropylenetramine, tris- 2,4,6-dimethylaminomethylphenol and tri-n-butylamine, 3-aminoethyl-3,5,5- trimethylcyclohexylamine, 1 ,4-cyclohexane bis(methylamine);
- alkylenediamines such as ethylenediamine or butane-1 ,4-diamine;
polyalkylenepolyamines such as diethylenetriamine, triethylenetetramine, tetraethylenepentamine, dipropylenetriamine or tripropylenetetramine;
- N-hydroxyalkylderivates of polyalkylenepolyamines, such as N- (hydroxyethyl)diethylenetriamine, or mono-N-2-hydroxypropyl derivates of triethylenetetramine; polyoxyalkylenepolyamines such as polyoxyethylene- and polyoxypropylenediamines and -triamines;
- N,N-dialkylalkylenediamines such as N,N-dimethylpropane-1 ,3-diamine or N, N- diethylpropane-1 ,3-diamine;
- cycloaliphatic amines having an amino group or aminoalkyl group on the ring, such as 3-aminomethyl-3,5,5-trimethylcyclohexylamine (isophoronediamine);
- aromatic amines such as bis(4-aminophenyl)methane or
bis(4-aminophenyl) sulphone;
- N-aminoalkylpiperazines such as N-(2-aminoethyl)piperazine or N-(3- aminopropyl)piperazine;
- polyaminoamides, for example reaction products of polyalkylenepolyamines with polymerized unsaturated fatty acids.
The adhesive composition of the invention may further comprise one or more unsaturated polyesters or vinyl esters as resins.
The unsaturated polyester resins comprise those based on unsaturated carboxylic acids or acid anhydrides and diols in a blend with unsaturated aromatic monomers.
The unsaturated carboxylic acids and their anhydrides are generally dibasic, unsaturated, preferably alpha, beta-olefinically unsaturated, carboxylic acids.
Examples of these carboxylic acids and their anhydrides are maleic acid, fumaric acid, chloromaleic acid, itaconic acid, citraconic acid, methyleneglutaric acid and mesaconic acid and their esters or, preferably, their anhydrides, and also succinic acid, glutaric acid, methylglutaric acid, adipic acid, sebacic acid, pimelic acid, phthalic anhydride, ortho-phthalic acid, isophthalic acid, terephthalic acid, dihydrophthalic acid, tetrahydrophthalic acid, tetrachlorophthalic acid, dodecanedicarboxylic acids, cis-5- norbornene-2,3-dicarboxylic acid or anhydride, dimethyl-2,6-naphthenedicarboxylate, dimethyl-2,6-naphthenedicarboxylic acid, naphthenedicarboxylic acid or anhydride, and 1 ,4-cyclohexanedicarboxylic acid. In the preparation of the polyester resins it is
also possible to use monobasic, tribasic or higher polybasic carboxylic acids, for example ethylhexanoic acid, methacrylic acid, propionic acid, benzoic acid, 1 ,2,4- benzenetricarboxylic acid or 1 ,2,4,5-benzenetetracarboxylic acid.
Suitable polyhydric alcohols include alkanediols and oxaalkanediols, examples being ethylene glycol, 1 ,2-propylene glycol, propane-1 ,3-diol, 1 ,3-butylene glycol, butane- 1 ,4-diol, hexane-1 ,6-diol, 2,2-dimethylpropane-1 ,3-diol, diethylene glycol, triethylene glycol, polyethylene glycol, cyclohexane-1 ,2-diol,
2,2-bis(p-hydroxycyclohexyl)propane, butene-1 ,4-diol,
5-norbornene-2,2-dimethylol, 2,3-norbornenediol, cyclohexanedimethanol, neopentyl glycol, dimethylpropane-1 ,3-diol, 2,2-dimethylheptanediol,
2,2-dimethyloctanediol, 2,2-dimethyl-1 ,3-propanediol, pentaerythritol, dipentaerythritol, tripentaerythritol, trimethylolpropane, ditrimethylolpropane,
2,2,4-trimethyl-1 ,3-pentanediol and 2-butyl-2-ethyl-1 ,3-propanediol.
The unsaturated polyester resin may further comprise a vinyl monomer, examples being styrene, methoxystyrene, divinylbenzene, 4-ethylstyrene,
4-methylstyrene, 4-tert-butylstyrene, p-chlorostyrene or vinyltoluene; esters of acrylic acid and methacrylic acid with alcohols or polyols (such as those described above) having in each case 1 to 18 carbon atoms, examples being methyl methacrylate, butyl acrylate, ethylhexyl acrylate, hydroxpropyl acrylate, lauryl acrylate, stearyl
methacrylate, lauryl methacrylate, butanediol diacrylate and trimethylolpropane triacrylate, allyl esters, for example diallyl phthalate, and vinyl esters, for example vinyl ethylhexanoate, vinyl pivalate, limonene, dipentene, vinyl ethers, indene, allylbenzene and the like. Also suitable are mixtures of these compounds. Preferred components are styrene, alpha-methylstyrene, vinyltoluene and divinylbenzene. The adhesive composition of the invention may further comprise one or more polyols and one or more isocyanates, preferably diisocyanates.
Examples of suitable polyol components include ethylene glycol, propylene glycol, butane-1 ,4-diol, pentane-1 ,5-diol, hexane-1 ,6-diol, heptane-1 ,7-diol, octane-1 ,8-diol, glycerol, trimethylolpropane and pentaerythritol. As polyol component it is additionally possible to use reaction products of low molecular mass polyfunctional alcohols with alkylene oxides, referred to as polyethers. The alkylene oxides have preferably 2 to 4 C atoms. Suitability is possessed for example by the reaction products of ethylene
glycol, propylene glycol, the isomeric butanedioles, hexanedioles or 4,4'- dihydroxydiphenylpropane with ethylene oxide, propylene oxide or butylene oxide, or mixtures of two or more thereof. Also suitable, furthermore, are the reaction products of polyfunctional alcohols, such as glycerol, trimethylolethane or trimethylolpropane, pentaerythritol or sugar alcohols, or mixtures of two or more thereof, with the stated alkylene oxides, to form polyether polyols. Particularly suitable polyether polyols are those having a molecular weight of about 100 to about 10 000, preferably of about 200 to about 5000.
There may also be polyester polyols formed by reacting low molecular mass alcohols, more particularly ethylene glycol, diethylene glycol, neopentylglycol, hexanediol, butanediol, propylene glycol, glycerol or trimethylolpropane, with caprolactone.
Likewise suitable as polyfunctional alcohols for the preparation of polyester polyols are 1 ,4-hydroxymethylcyclohexane, 2-methyl-1 ,3-propanediol, butane-1 ,2,4-triol, triethylene glycol, tetraethylene glycol, polyethylene glycol, dipropylene glycol, polypropylene glycol, dibutylene glycol and polybutylene glycol.
The isocyanates may preferably be 1 ,5-naphthylene diisocyanate, 4,4'- diphenylmethane diisocyanate (MDI), hydrogenated MDI (H12MDI), xylylene diisocyanate (XDI), tetramethylxylylene diisocyanate (TMXDI),
4,4'-diphenyldimethylmethane diisocyanate, di- and tetraalkylenediphenylmethane diisocyanate, 4,4'-dibenzyl diisocyanate, 1 ,3-phenylene diisocyanate,
1 ,4-phenylene diisocyanate, the isomers of tolylene diisocyanate (TDI),
1 -methyl^^-diisocyanatocyclohexane, 1 ,6-diisocyanato-2,2,4-trimethylhexane, 1 ,6- diisocyanato-2,4,4-trimethylhexane, 1 -isocyanatomethyl-S-isocyanato-i ,5,5- trimethylcyclohexane (IPDI), chlorinated and brominated diisocyanates, phosphorus- containing diisocyanates, 4,4'-diisocyanatophenylperfluoroethane, tetramethoxybutane
1 ,4-diisocyanate, butane 1 ,4-diisocyanate, hexane 1 ,6-diisocyanate (HDI), dicyclohexylmethane diisocyanate, cyclohexane 1 ,4-diisocyanate, ethylene diisocyanate, bisisocyanatoethyl phthalate,
1-chloromethylphenyl 2,4-diisocyanate, 1-bromomethylphenyl 2,6-diisocyanate, 3,3- bischloromethyl ether 4,4'-diphenyl diisocyanate, trimethylhexamethylene
diisocyanate, 1 ,4-diisocyanatobutane and 1 ,12-diisocyanatododecane.
The adhesive composition of the invention may further comprise fillers, such as talc, calcium carbonate or silicon dioxide. The silicon dioxide may preferably be precipitated
or fumed (pyrogenically prepared) silicon dioxide powder. The silicon dioxide power may also be in surface-modified form.
The invention further provides for the use of the adhesive composition for adhesively bonding rotor vanes of wind turbines. The adhesive composition of the invention leads to uniform distribution of the particles in the adhesive composition, and to a high efficiency on inductive curing.
Examples
Example 1 : Silica coated Iron Oxide
A stream of a vaporous mixture of 0.62 kg/h of SiCI4 and 0.02 kg/h of monosilane, and a second stream in the form of an aerosol obtained from a 25 percent by weight solution of iron(ll) chloride, corresponding to 1.85 kg/h of iron(ll) chloride, in water, and 5 m3 (STP)/h of nitrogen as an atomizing gas at room temperature (23°C) by means of a two-substance nozzle, are introduced separately into the mixing zone of a reactor.
This mixture is reacted in the combustion zone of the reactor in a flame generated by igniting a mixture of 7.9 m3 (STP)/h of hydrogen and 21 m3 (STP)/h of air. The residence time of the reaction mixture in the combustion zone is approx. 43 ms.
In the cooling zone which follows downstream of the combustion zone, the reaction mixture is cooled to 337°C by introducing 7 kg/h of water.
The resulting solid is separated from the gaseous substances on a filter. The solid material displays a BET surface area of 60 m2/g, a mean particle diameter of 16 nm. The thickness of the shell is 3-8 nm. The silica content is 19.3 wt.-%, the iron oxide content is 81.7 wt.-%, in 7:85:7 ratio of maghemite, magnetite and haematite.
Example 2: Adhesive Composition (according to invention)
The silica coated iron oxide of Example 1 is dispersed in Epikote® 828 Resin
(Resolution Performance Products; based on Bisphenol A) by using a dissolver.
Vestamin® IPD (Evonik Degussa; isophorone diamine) is added as a curing agent. The mixture was cured inductively by using the high frequency generator Tru Heat HF 5010, made by HUTTINGER Elektronik at a frequency of 607 kHz. Results are shown in Table 1.
Table 1 : Inductive curing of adhesive composition of Example 2
Silica coated iron oxide*
2 wt.-% 3 wt.-% 5 wt.-%
VESTAMINT IPD [g] 100 100
Epikote® 828 [g] 441 441
Conversion [%] after
2 minutes 99 100 100
3 minutes 100
* referring to the sum of VESTAM IN® IPD and Epikote 828
Example 3: Adhesive Composition (according to invention)
The silica coated iron oxide of Example 1 is dispersed in the resin composition by using a dissolver. The curing composition is added. The mixture was cured inductively by using the high frequency generator Tru Heat HF 5010, made by HUTTINGER Elektronik at a frequency of 607 kHz. Results are shown in Table 2.
Table 2: Inductive curing of adhesive composition of Example 3
referring to the sum of resin composition and curing composition; Evonik Degussa;
& UPPC
The results shown in Tables 1 and 2 demonstrate the efficiency of the inductively curable adhesive composition according to the invention.
Claims
1 . Inductively curable adhesive composition comprising core-shell particles having an average primary particle diameter of 2 to 100 nm, the shell comprising amorphous silicon dioxide and the core comprising one or more magnetic metal oxides.
2. Inductively curable adhesive composition according to Claim 1 , characterized in that the core-shell particles comprise particles which form intergrown cores surrounded by a shell comprising silicon dioxide.
3. Inductively curable adhesive composition according to either of Claims 1 and 2, characterized in that the core is composed of one or more iron oxides comprising hematite, magnetite and maghemite.
4. Inductively curable adhesive composition according to any of Claims 1 to 3, characterized in that the core-shell particles have
a) a BET surface area of 10 to 80 m2/g,
b) a shell thickness of 2 to 30 nm and
c) an iron oxide content of 60% to 90% by weight and a silicon dioxide
content of 10% to 40% by weight, based in each case on the shell-encased particles.
5. Inductively curable adhesive composition according to any of Claims 1 to 4, characterized in that the shell is surface-modified.
6. Inductively curable adhesive composition according to any of Claims 1 to 5, characterized in that the fraction of the particles with core-shell structure is 0.1% to 20% by weight, based on the adhesive composition.
7. Inductively curable adhesive composition according to any of Claims 1 to 6, characterized in that it comprises a reactive resin which is obtainable by mixing at least two reactive components, one or more of the reactive components comprising particles having the core-shell structure.
8. Inductively curable adhesive composition according to any of Claims 1 to 6, characterized in that one reactive component is an epoxy resin and a second reactive component is a hardener selected from one or more carboxylic anhydrides, one or more amines, or a mixture of carboxylic anhydrides and amines.
9. Inductively curable adhesive composition according to any of Claims 1 to 6, characterized in that one reactive component is an unsaturated polyester resin and another reactive component is a polyol.
10. Inductively curable adhesive composition according to any of Claims 1 to 6, characterized in that one reactive component is an isocyanate and another reactive component is a polyol.
1 1. Inductively curable adhesive composition according to any of Claims 1 to 10, characterized in that it comprises fillers.
12. Use of the inductively curable adhesive composition according to any of Claims 1 to 11 for adhesively bonding rotor vanes of wind turbines.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE200910028942 DE102009028942A1 (en) | 2009-08-27 | 2009-08-27 | Inductively curable adhesive composition |
| PCT/EP2010/058971 WO2011023430A1 (en) | 2009-08-27 | 2010-06-24 | Inductively curable adhesive composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP2470613A1 true EP2470613A1 (en) | 2012-07-04 |
Family
ID=43038062
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP10727412A Withdrawn EP2470613A1 (en) | 2009-08-27 | 2010-06-24 | Inductively curable adhesive composition |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP2470613A1 (en) |
| DE (1) | DE102009028942A1 (en) |
| WO (1) | WO2011023430A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11760907B2 (en) | 2020-08-19 | 2023-09-19 | Lg Chem, Ltd. | Adhesive resin composition for semiconductor, adhesive film for semiconductor device using the same and dicing die bonding film using the same |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012158196A2 (en) * | 2010-11-05 | 2012-11-22 | Massachusetts Institute Of Technology | Core-shell magnetic particles and related methods |
| TWI493009B (en) * | 2011-09-27 | 2015-07-21 | Hon Hai Prec Ind Co Ltd | Ultraviolet light curing adhesive and dispensing method of same |
| US8959690B2 (en) | 2012-06-29 | 2015-02-24 | Nike, Inc. | Induction heating apparatuses and processes for footwear manufacturing |
| US9986787B2 (en) | 2012-06-29 | 2018-06-05 | Nike, Inc. | Induction heating apparatuses and processes for footwear manufacturing |
| CN102994033B (en) * | 2012-10-31 | 2014-01-08 | 安徽东方金河精密机械制造有限公司 | Polyester adhesive |
| CN103834316B (en) * | 2012-11-26 | 2017-11-21 | 鸿富锦精密工业(深圳)有限公司 | Adhesive structure, surface conditioning agent and tear off method |
| WO2016032795A1 (en) * | 2014-08-29 | 2016-03-03 | 3M Innovative Properties Company | Inductively curable composition |
| GB201611165D0 (en) | 2016-06-27 | 2016-08-10 | Univ Limerick | Adhesive composition |
| GB2574037A (en) * | 2018-05-23 | 2019-11-27 | Paul Pomeroy Jason | Glass fibre composition |
| CN109735284A (en) * | 2018-12-30 | 2019-05-10 | 南京臻致新材料科技有限公司 | A kind of polyurethane resin host agent and preparation method thereof |
| DE102019120049B4 (en) * | 2019-07-24 | 2025-07-31 | Bundesdruckerei Gmbh | Process and hot melt adhesive for producing a value or security document consisting of several layers and value or security document |
| EP4541834A1 (en) * | 2023-10-20 | 2025-04-23 | Aerox Advanced Polymers, SL. | Process to adhere parts of a wind turbine based on induction heating |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| DE19614136A1 (en) * | 1996-04-10 | 1997-10-16 | Inst Neue Mat Gemein Gmbh | Process for the production of agglomerate-free nanoscale iron oxide particles with a hydrolysis-resistant coating |
| DE10037884A1 (en) * | 2000-08-03 | 2002-02-21 | Henkel Kgaa | Accelerated curing process |
| KR100628841B1 (en) * | 2001-11-13 | 2006-09-29 | 데구사 아게 | Curable bonded assemblies capable of being dissociated |
| DE10163399A1 (en) | 2001-12-21 | 2003-07-10 | Sustech Gmbh & Co Kg | Nanoparticulate preparation |
-
2009
- 2009-08-27 DE DE200910028942 patent/DE102009028942A1/en not_active Withdrawn
-
2010
- 2010-06-24 WO PCT/EP2010/058971 patent/WO2011023430A1/en not_active Ceased
- 2010-06-24 EP EP10727412A patent/EP2470613A1/en not_active Withdrawn
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| See references of WO2011023430A1 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11760907B2 (en) | 2020-08-19 | 2023-09-19 | Lg Chem, Ltd. | Adhesive resin composition for semiconductor, adhesive film for semiconductor device using the same and dicing die bonding film using the same |
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