EP2422363A1 - Procédé et dispositif pour l'introduction et l'évacuation de substrats - Google Patents

Procédé et dispositif pour l'introduction et l'évacuation de substrats

Info

Publication number
EP2422363A1
EP2422363A1 EP10720560A EP10720560A EP2422363A1 EP 2422363 A1 EP2422363 A1 EP 2422363A1 EP 10720560 A EP10720560 A EP 10720560A EP 10720560 A EP10720560 A EP 10720560A EP 2422363 A1 EP2422363 A1 EP 2422363A1
Authority
EP
European Patent Office
Prior art keywords
substrates
collecting container
lock
chamber
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP10720560A
Other languages
German (de)
English (en)
Inventor
Michael Reising
Stefan Kempf
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Singulus Technologies AG
Original Assignee
Singulus Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Singulus Technologies AG filed Critical Singulus Technologies AG
Publication of EP2422363A1 publication Critical patent/EP2422363A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber

Definitions

  • the present invention relates to a method and a device for feeding and discharging substrates into or from a production line or machine.
  • a method and apparatus are described in which damage to vacuum seals by substrate fragments and a malfunction of the machine or plant is avoided.
  • substrates In plants or machines substrates often have to be introduced and removed.
  • Existing machines work in a continuous process or in batch mode.
  • the substrates In the continuous process, the substrates are driven one after the other through the plant.
  • batch mode the substrates are transported in packages or in batches in processing areas of the plant. After that, the substrates arrive in packets or in stacks to the next process area.
  • any resulting substrate fragments may cause a shutdown if the equipment has to be stopped to transport the substrate fragments out of the equipment.
  • Substrate fragments which are not collected and transported directly out of the system may damage or contaminate seals and other lock components.
  • the substrates should be introduced and removed in a system that is as protected as possible in order to prevent air turbulence above and below the substrates so that the substrate does not break.
  • an object of the present invention to provide a method and an apparatus in which any substrate fragments do not remain in the lock area but are discharged from the system in the machine cycle. Another object is to reduce the risk of a machine stop by substrate fragments in the lock. In addition, the risk of whirled up fragments that settle on substrates or vacuum sealing surfaces should be reduced. A further The object of the invention is to avoid stresses on the substrates by turbulent air flows.
  • the invention is based on the following basic idea: Substrate fragments are transported with the aid of a collecting container together with finished substrates from the plant or machine. In this case, the collecting container is discharged together with the substrates in the machine cycle, so that when removing the substrate fragments no disturbance of the production process takes place and no additional power stroke is required.
  • the device for feeding in and out of substrates has a lock.
  • Processed substrates are transported by a transport device in the lock area.
  • the substrates can be held by a substrate carrier.
  • With a collecting container in the lock area the substrate fragments which may be formed during the infeed and outfeed are collected.
  • the processed substrates are discharged together with the collecting container and any existing fragments of substrate in the machine cycle.
  • the collecting container forms together with a lock cover an almost closed box, which keeps disturbing environmental influences from the substrate and thus reduces damage to the substrates during insertion and removal.
  • the collecting container When discharging the collecting container is raised, and thus separates the substrate carrier with the substrates of the transport device. Thereafter, the substrate carrier is discharged together with the substrates and the collecting container.
  • the collecting container is lowered and delivers the substrate carrier with the substrates to the transport device. Outside the plant or machine, the catch container with the substrate fragments is separated from the substrate carrier and the substrates.
  • the substrate carrier with the substrates is delivered to a device.
  • the collecting container is emptied. Alternatively, it is first checked whether there are substrate fragments in the collecting container. The collecting container is only emptied in this case if it actually contains fragments of substrate. Thereafter, the collection container is provided with a substrate carrier with new substrates for insertion.
  • the sluice lid provided at the lock can be hood-shaped. By using a flat lock cover, the volume to be evacuated is kept low. This allows rapid evacuation or flooding of the lock volume. Each lock cover can always grab the same collection container.
  • 1 a is a top view of a transport device
  • FIG. 1b shows a sectional view along the dashed line in FIG. 1a, FIG.
  • FIG. 2a is a schematic representation of a device according to the Invention for feeding in and out of substrates, in which a transport device transports a substrate in the lock area,
  • FIG. 2b shows a schematic representation of a device according to the invention for feeding in and removing substrates, in which a collecting container receives the substrate carrier with the substrates during sealing of the lock area
  • Fig. 2c is a schematic representation of a device according to Invention for feeding and discharging substrates, in which the collecting container is discharged with substrate fragments together with the substrates.
  • FIG. 1 a shows a top view of a transport device 4 of a system or machine for substrates 5.
  • the transport device 4 has deflectable sealing frames 6 and substrate carriers 7.
  • the substrate carriers 7 are fastened via suspension devices 8 to the deflectable sealing frame 6.
  • On the substrate carriers 7 are substrates 5.
  • the transport device 4 is, as shown in Fig. Ia, e.g. designed as a turntable.
  • the turntable 4 can rotate about the axis A perpendicular to the plane of the drawing.
  • a specific processing area for example, lock area, heating area, process area, etc.
  • the substrates 5 are transported by the transport device 4 in an XY plane (corresponding to the plane of the drawing in FIG. 1a).
  • a transport device is also possible, which transports a substrate 5 linearly in the XY plane.
  • Fig. Ib shows a sectional view along the dashed line in Fig. Ia.
  • the vertical direction of Fig. Ib corresponds to the Z direction.
  • the substrate 5 is held by the substrate carrier 7.
  • the substrate carrier 7 is in turn supported by the suspension devices 8 and is thereby connected to the deflectable sealing frame 6.
  • the deflectable sealing frame 6 has two sealing surfaces 10, 11 in the Z direction.
  • two springs 12 are shown within the sealing frame 6, two springs 12 are shown.
  • the springs 12 are, as shown in Fig. Ib, connected via a connecting element 13 with the transport device 4.
  • the sealing frame 6 is held in a central position without the action of an external force in the Z direction with respect to the thickness of the transport device 4 measured in the Z direction.
  • the sealing frame 6 can be connected to the transport device 4 via leaf springs. Several leaf springs are then incorporated in the XY plane as a guide and prevent the displacement of the sealing frame 6, a shift in the XY plane relative to the transport device. 4
  • the lifting device 17 is guided in a vacuum-tight manner through the chamber bottom 32 with a vacuum feedthrough 34.
  • a lock cover 18 which in the closed state seals the chamber 1 or the lock 2 in a vacuum-tight manner against the chamber ceiling 31.
  • the lock cover 18 is connected to an arm 9 for moving the lock cover.
  • the lock area 2 must be sealed for discharging the substrates 5 against the vacuum chamber 1 of the system or machine so that it can be flooded.
  • a closure device 16 is raised below the lock area 2 by a lifting device 17 in the chamber bottom 32.
  • the closure device 16 contacts the lower O-ring 14 of the deflectable sealing frame 6 during the stroke.
  • the deflectable sealing frame 6 is deflected upward in the Z direction perpendicular to the XY plane.
  • the sealing frame 6 is deflected until the second, ie upper O-ring 14 of the sealing frame 6 seals against the chamber ceiling 31.
  • the O-rings 14 can also be attached to the closure device 16 or the chamber ceiling 31.
  • the collecting container 3 By raising the closure device 16 by the lifting device 17, the collecting container 3 is raised at the same time. As a result, the collecting container 3 picks up the substrate carrier 7 and lifts it out of the suspension unit. As shown in FIG. 2b, centering pins 20 of the collecting container 3 penetrate suitable bores in the substrate carrier 7 in order to establish a connection and guidance between collecting container 3 and substrate carrier 7.
  • the centering pins 20 are dimensioned sufficiently long so that they can engage in the collecting container fastening devices. Alternatively, centering tips move in recesses on the underside of the substrate carrier without penetrating it.
  • Fig. 2c shows the removal of the substrates 5 from the chamber 1 and the lock 2 of the plant.
  • the substrates 5 are lifted out of the system together with the substrate carrier 7 and the collecting container 3 with the substrate fragments 19.
  • the collecting container 3 is connected to the lock cover 18.
  • collecting container 3 and lock cover 18 form a nearly closed box around the substrates 5.
  • the volume of air above and below the substrates 5 between the lock cover 18 and the collection container 3 is minimized and almost trapped. Therefore, 5 forces hardly occur due to air turbulence on the substrates 5 even with rapid movements perpendicular to the surface of the substrates.
  • Such air turbulence could lead to pre-damage or even breakage of the fragile substrates 5 during fast movements.
  • air turbulences hardly affect the substrates 5, but take place only outside the system of collecting container 3 and lock cover 18.
  • the substrate carrier 7 with the processed substrates 5 is delivered to a device, not shown, for further treatment.
  • the collecting container 3 is emptied. Alternatively, the emptying movement of the collecting container 3 is carried out only if there are substrate fragments 19 in it. Whether there are substrate fragments 19 in the collecting container 3, can be determined for example via a suitable sensor. Thereafter, the collecting container 3 is provided again for introduction. For this purpose, the collecting container is again connected to a substrate carrier 7 with substrates 5 and attached to the lock cover 18. About the arm 9, the almost closed box, consisting of collecting container 3, substrate carrier 7 with substrates 5 and Schleusende- disgust 18, lifted into the chamber 1 or lock 2 and deposited on the closure device 16. If a plurality of lock cover 18 and collecting boxes 3 are used, each lock cover 18 can be connected to always the same receptacle 3.
  • the lock cover 18 is again sealed against the outside of the chamber ceiling 31 and the lock 2 is evacuated.
  • the lifting device 17 By lowering the lifting device 17, the deflectable sealing frame 6 is brought back into its central position.
  • the collecting container 3 which rests on the closure device 16, and transfers the substrate carrier 7 with the still untreated substrates 5 to the transport device 4.
  • the substrate carrier 7 is suspended in the suspension devices 8 of the deflectable sealing frame 6 of the transport device 4 and through further lowering the lifting device 17 with resting collecting container 3, the centering pins 20 release the substrate carrier 7 with the substrate 5.
  • the transport device 4 can then transport the introduced substrate 5 to the next processing area (for example, heating area, process area, etc.) and move the next substrates 5 into the lock area 2 for removal.
  • the next processing area for example, heating area, process area, etc.
  • each process step must take place within a certain time. After this time, the substrates 5 are transported further. All processes described above, such as Transporting the substrates 5 in the lock, lifting the substrate support 7 during sealing and flooding of the lock, lifting the almost closed box from collecting container 3 and lock cover 18, replacing the substrates 5 and emptying the collecting container 3 and slipping the new substrates 5 therefore find in the machine cycle instead of.
  • the centering pins 20 are used simultaneously for receiving the substrate support 7 and for suspension on the lock cover 18. With an arm 9 of the lock cover 18 is transported together with the substrate carrier 7, the substrates 5 and the collecting container 3 from the lock to the next processing station.
  • the centering pins can be used only for receiving the substrate carrier. In this case, a receiving element such as a centering hook for connecting the lock cover is required with the collecting container.
  • centering pins only for connection between the collecting container and the substrate carrier and after opening the lock by removing the lock cover the substrate carrier with the substrate and the collecting container attached to the container with a suitable, not shown handling or Transport device to capture and transport to the next processing station. The infiltration is then carried out in the reverse order.
  • the substrate fragments 19 can be discharged in the machine cycle with the collecting container 3 and the substrates 5 from the chamber 1 of the plant or machine.
  • the system need not be stopped in order to discharge substrate fragments 19, since the removal of the substrate fragments takes place simultaneously with the removal of the substrates.
  • the risk of a machine stop by substrate fragments 19 in the lock 2 is reduced.
  • the risk of damage to the equipment (e.g., vacuum seals) by sharp-edged substrate fragments 19 is reduced.
  • the risk is reduced that swirled substrate fragments 19 settle on the substrates 5 or vacuum sealing surfaces.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Sampling And Sample Adjustment (AREA)

Abstract

L'invention concerne un procédé et un dispositif pour l'introduction et l'évacuation de substrats. Via un dispositif de transport (4), des substrats (5) sont transportés dans un sas (2). Dans le sas, on trouve en dessous des substrats (5) un récipient de collecte (3) avec lequel des morceaux d'éventuels éclats de substrat (19) sont collectés. Après le remplissage du sas (2), les substrats (5) sont évacués conjointement au récipient de collecte (3) et au couvercle du sas (18). Le couvercle du sas (18) et le récipient de collecte (3) forment dans ce cas une boîte quasiment fermée autour des substrats (5). Après le changement des substrats (5) et le vidage du récipient de collecte (3), les nouveaux substrats (5) sont introduits ensemble avec le récipient de collecte. Pour un processus de production efficace, toutes les étapes s'effectuent en un cycle de machine.
EP10720560A 2009-04-24 2010-04-23 Procédé et dispositif pour l'introduction et l'évacuation de substrats Withdrawn EP2422363A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102009018777 2009-04-24
DE102009037291.1A DE102009037291B4 (de) 2009-04-24 2009-08-12 Verfahren und Vorrichtung zum Ein- und Ausschleusen von Substraten
PCT/EP2010/055455 WO2010122153A1 (fr) 2009-04-24 2010-04-23 Procédé et dispositif pour l'introduction et l'évacuation de substrats

Publications (1)

Publication Number Publication Date
EP2422363A1 true EP2422363A1 (fr) 2012-02-29

Family

ID=42932572

Family Applications (1)

Application Number Title Priority Date Filing Date
EP10720560A Withdrawn EP2422363A1 (fr) 2009-04-24 2010-04-23 Procédé et dispositif pour l'introduction et l'évacuation de substrats

Country Status (4)

Country Link
US (1) US8740536B2 (fr)
EP (1) EP2422363A1 (fr)
DE (1) DE102009037291B4 (fr)
WO (1) WO2010122153A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5749002B2 (ja) * 2010-12-28 2015-07-15 芝浦メカトロニクス株式会社 ロードロック装置および真空処理装置
JP5917750B2 (ja) * 2015-05-12 2016-05-18 芝浦メカトロニクス株式会社 ロードロック装置および真空処理装置

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US5095927A (en) * 1987-04-27 1992-03-17 Semitool, Inc. Semiconductor processor gas-liquid separation
EP1179611B1 (fr) * 1992-10-06 2004-09-15 Unaxis Balzers Aktiengesellschaft Enceinte pour le transport des substrats
KR0182167B1 (ko) 1996-03-19 1999-04-15 김광호 웨이퍼 캐리어의 건식 세정 장치
US5820329A (en) 1997-04-10 1998-10-13 Tokyo Electron Limited Vacuum processing apparatus with low particle generating wafer clamp
US6139591A (en) * 1998-03-04 2000-10-31 Tokyo Seimitsu Co., Ltd. Wafer separating and cleaning apparatus and process
US6535628B2 (en) * 1998-10-15 2003-03-18 Applied Materials, Inc. Detection of wafer fragments in a wafer processing apparatus
US5992638A (en) 1998-11-11 1999-11-30 Empak, Inc. Advanced wafer shipper
AU4779600A (en) 1999-05-20 2000-12-12 Nikon Corporation Container for holder exposure apparatus, device manufacturing method, and device manufacturing apparatus
KR100481178B1 (ko) * 2002-09-03 2005-04-07 삼성전자주식회사 기판유무검사장치
US20050183665A1 (en) * 2004-02-24 2005-08-25 Advanced Display Process Engineering Co., Ltd. Apparatus for manufacturing flat-panel display
JP2009514235A (ja) * 2005-10-27 2009-04-02 アシスト テクノロジーズ インコーポレイテッド 水平方向配列ストッカ

Non-Patent Citations (1)

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Title
See references of WO2010122153A1 *

Also Published As

Publication number Publication date
US20120027543A1 (en) 2012-02-02
DE102009037291A1 (de) 2010-11-11
DE102009037291B4 (de) 2020-06-10
WO2010122153A1 (fr) 2010-10-28
US8740536B2 (en) 2014-06-03

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