EP2359397A1 - Modular carrier - Google Patents

Modular carrier

Info

Publication number
EP2359397A1
EP2359397A1 EP09808983A EP09808983A EP2359397A1 EP 2359397 A1 EP2359397 A1 EP 2359397A1 EP 09808983 A EP09808983 A EP 09808983A EP 09808983 A EP09808983 A EP 09808983A EP 2359397 A1 EP2359397 A1 EP 2359397A1
Authority
EP
European Patent Office
Prior art keywords
plates
length
modular carrier
carrier according
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP09808983A
Other languages
German (de)
French (fr)
Inventor
Jörg PETZOLD
Frank Wegert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Q Cells SE
Original Assignee
Q Cells SE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Q Cells SE filed Critical Q Cells SE
Publication of EP2359397A1 publication Critical patent/EP2359397A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls

Definitions

  • the invention relates to a modular carrier for receiving, storing and transporting thin flat workpieces / semi-finished products such as wafers in the photovoltaic in mutually parallel and equally spaced position.
  • a carrier In order to process wafers for photovoltaic elements in an automatic process, they are picked up by a carrier in a mutually parallel and equally spaced position.
  • a carrier which comprises two opposing walls, a plurality of connecting elements connecting the walls, and a holding structure for holding the wafers in the carrier.
  • a large number of individual parts is required with the elements provided for this purpose.
  • the invention has the object to develop a carrier for receiving thin flat workpieces / semi-finished products, which consists of as few individual parts.
  • the required components are combined in three modules.
  • the first module is the Nutenplatte with the angle arranged below horizontal support.
  • the second module is formed by the two U-shaped end plates.
  • the third module consists of the spacer bars arranged between these two U-shaped end plates, two of which receive a groove plate at the top and bottom.
  • the groove plates and the spacer rods are used in the length L, wherein the length L is a uniform gradation.
  • the carrier can thus be made in length L or nx L, where n is always an integer.
  • n is always an integer.
  • the receiving surfaces of the grooves are formed elastically. By the damping thus effected a material protection of the workpieces / semi-finished products is achieved.
  • Recording surfaces of the grooves are executed with a different coefficient of friction. This has a displacement-inhibiting effect on external influences.
  • the modular carrier consists of the three modules grooved plate 1, end plates 2 and spacer bars 3.
  • the module grooved plate 1 includes the opposing grooved plates 11 with the pads 12.
  • This module grooved plate 1 has the length L.
  • the grooved plates 11 are arranged opposite each other so that there is always a groove on a common line.
  • Each of the two Nutenplatten 11 is received at the top and bottom of each of a spacer bar 31, 32.
  • the groove plate 11 is provided with corresponding holes.
  • Each of the two spacer rods 31, 32 is screwed on both sides with an end plate 21 and 22.
  • the distance between two opposing grooved plates 11 is so large that the material consisting of thin flat workpieces / semi-finished products, such as wafers for photovoltaic elements, can be accommodated.
  • each of the spacer bars 31, 32 is 2L. It is also possible alternatively to screw together each 2 individual spacer bars 31 with 31 and 32 with 32 with the individual length L and thus obtain the length 2 L. In a longer training of the carrier is handled accordingly.
  • the surfaces of the lower pads 12 are elastic, so that the sheet material is cushioned at the bottom of recording. As increasingly thinner material is used, there is also a risk that it bends sideways. To prevent this, the surface is either self-locking formed by roughening or as the grooved plates 11 provided with grooves.
  • these grooves can be formed elastically and / or friction-reducing at their receiving surfaces.
  • the groove plates 11 and, if appropriate, grooves located in the supports 12 can be made antistatic on their receiving surfaces.
  • This structural design of the carrier in modular design has the advantage that with a simple structure fewer items are needed.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention relates to a modular carrier for receiving, storing and transporting thin planar workpieces/semi-finished products, such as wafers for photovoltaic elements, in vertical positions that are parallel to each other and uniformly spaced. This problem is solved by a modular design of the carrier. The required components are combined into three modules (1 to 3). The first module is the groove plate (11) having the horizontal support (12) arranged beneath in an angled shape. The second module is formed by the two U-shaped end plates (21, 22). The third module comprises the spacer rods (31, 32), which are arranged between said two U-shaped end plates (21, 22) and of which two in each case receive a groove plate (11) at the top and the bottom. The groove plates (11) and the spacer rods (31, 32) are used at the length L, wherein the length L is uniformly graduated. In this way, the carrier can be produced in the length L or n x L, with n always being an integer. Two groove plates (11) are always arranged parallel to each other, with opposing grooves being located on a straight line. The distance of said grooves among each other is so large that a thin planar workpiece/semi-finished product can be easily inserted. The workpiece/semi-finished product rests against the support surface (12).

Description

Modularer Carrier Modular carrier
Die Erfindung betrifft einen modularen Carrier zur Aufnahme, zum Speichern und zum Transport von dünnen flächigen Werkstücken/Halbzeugen wie zum Beispiel von Wafern in der Photovoltaik in zueinander paralleler und gleich beabstandeter Position.The invention relates to a modular carrier for receiving, storing and transporting thin flat workpieces / semi-finished products such as wafers in the photovoltaic in mutually parallel and equally spaced position.
Damit Wafer für photovoltaische Elemente in einem automatischen Prozess bearbeitet werden können, werden sie von einem Carrier in einer zueinander parallelen und gleich beabstandeten Position aufgenommen. So ist aus der Druckschrift DE 20 2007 003 416 U1 ein solcher Carrier bekannt, der aus zwei einander gegenüberliegenden Wänden, einer Mehrzahl die Wände verbindender Verbindungselemente und einer Haltestruktur zum Halten der Wafer im Carrier bestehl . Dazu wird mit den dafür vorgesehenen Elementen eine Vielzahl von Einzelteilen benötigt.In order to process wafers for photovoltaic elements in an automatic process, they are picked up by a carrier in a mutually parallel and equally spaced position. Thus, from document DE 20 2007 003 416 U1, such a carrier is known, which comprises two opposing walls, a plurality of connecting elements connecting the walls, and a holding structure for holding the wafers in the carrier. For this purpose, a large number of individual parts is required with the elements provided for this purpose.
Der Erfindung liegt die Aufgabe zugrunde, einen Carrier zur Aufnahme von dünnen flächigen Werkstücken/Halbzeugen zu entwickeln, der aus möglichst wenigen Einzelteilen besteht.The invention has the object to develop a carrier for receiving thin flat workpieces / semi-finished products, which consists of as few individual parts.
Diese Aufgabe wird nach dem kennzeichnenden Teil des Hauptanspruchs durch eine modulare Bauweise des Carrriers gelöst.This object is achieved by the characterizing part of the main claim by a modular design of the Carrriers.
Die benötigten Bauteile werden in drei Modulen zusammengefasst. Das erste Modul ist die Nutenplatte mit der darunter winkelförmig angeordneten waagerechten Auflage. Das zweite Modul wird von den beiden U-förmigen Endplatten gebildet. Das dritte Modul besteht aus den zwischen diesen beiden U-förmigen Endplatten angeordneten Distanzstäben, von denen jeweils zwei oben und unten eine Nutenplatte aufnehmen.The required components are combined in three modules. The first module is the Nutenplatte with the angle arranged below horizontal support. The second module is formed by the two U-shaped end plates. The third module consists of the spacer bars arranged between these two U-shaped end plates, two of which receive a groove plate at the top and bottom.
Die Nutenplatten und die Distanzstäbe werden in der Länge L verwendet, wobei die Länge L eine gleichmäßige Abstufung ist. Der Carrier kann so in der Länge L oder n x L hergestellt werden, wobei n immer eine ganze Zahl ist. Es sind immer zwei Nutenplatten parallel zueinander angeordnet, dabei befinden sich die Nuten auf einer Geraden. Der Abstand dieser Nuten untereinander ist so groß, dass eine dünnes flächiges Werkstück/Halbzeug leichtgängig eingeschoben werden kann. Unten wird das Werkstück/Halbzeug von der Auflagefläche gehalten. Sie ist elastisch, um das Werkstück/Halbzeug bei der Aufnahme abzufedern. Damit sich das Werkstück/Halbzeug nicht ungewollt seitlich verschiebt, kann die Oberfläche der Auflage entweder rau oder als Nut ausgeführt sein.The groove plates and the spacer rods are used in the length L, wherein the length L is a uniform gradation. The carrier can thus be made in length L or nx L, where n is always an integer. There are always two Nutenplatten arranged parallel to each other, while the grooves are on a straight line. The distance between these grooves is so great that a thin one flat workpiece / semi-finished smoothly inserted. Below is the workpiece / semi-finished held by the support surface. It is elastic to cushion the workpiece / semi-finished during recording. So that the workpiece / semifinished product does not move laterally unintentionally, the surface of the support can be made either rough or as a groove.
Um die dünnen flächigen Werkstücke/Halbzeuge in den Nuten der Nutenplatten und gegebenenfalls in den Auflagen festhalten zu können, werden die Aufnahmeflächen der Nuten elastisch ausgebildet. Durch die damit bewirkte Dämpfung wird eine Materialschonung der Werkstücke/Halbzeuge erreicht. Alternativ können dieIn order to hold the thin sheet-like workpieces / semi-finished products in the grooves of the grooved plates and optionally in the pads, the receiving surfaces of the grooves are formed elastically. By the damping thus effected a material protection of the workpieces / semi-finished products is achieved. Alternatively, the
Aufnahmeflächen der Nuten mit abweichendem Reibwert ausgeführt werden. Dies hat eine verschiebungshemmende Wirkung bei äußeren Einflüssen zur Folge.Recording surfaces of the grooves are executed with a different coefficient of friction. This has a displacement-inhibiting effect on external influences.
Weitere Einzelheiten und Vorteile des Erfindungsgegenstandes ergeben sich aus der nachfolgenden Beschreibung und der dazugehörigen Zeichnung, die einen modularen Carrier in einer perspektivischen Darstellung zeigt.Further details and advantages of the subject invention will become apparent from the following description and the accompanying drawings, which shows a modular carrier in a perspective view.
Der modulare Carrier besteht aus den drei Modulen Nutenplatte 1 , Endplatten 2 und Distanzstäbe 3. Zum Modul Nutenplatte 1 gehören die gegenüber liegenden Nutenplatten 11 mit den Auflagen 12. Dieses Modul Nutenplatte 1 weist die Länge L auf. Dabei sind die Nutenplatten 11 gegenüber liegend so angeordnet, dass sich immer eine Nut auf einer gemeinsamen Linie befindet. Jede der beiden Nutenplatten 11 wird oben und unten jeweils von einem Distanzstab 31 , 32 aufgenommen. Dazu ist die Nutenplatte 11 mit entsprechenden Bohrungen versehen. Jeder der beiden Distanzstäbe 31 , 32 wird beiderseits mit einer Endplatte 21 und 22 verschraubt. Der Abstand zweier gegenüber liegender Nutenplatten 11 ist so groß, dass das aus dünnen flächigen Werkstücken/Halbzeugen bestehende Material, wie beispielsweise Wafer für photovoltaische Elemente, aufgenommen werden kann.The modular carrier consists of the three modules grooved plate 1, end plates 2 and spacer bars 3. The module grooved plate 1 includes the opposing grooved plates 11 with the pads 12. This module grooved plate 1 has the length L. In this case, the grooved plates 11 are arranged opposite each other so that there is always a groove on a common line. Each of the two Nutenplatten 11 is received at the top and bottom of each of a spacer bar 31, 32. For this purpose, the groove plate 11 is provided with corresponding holes. Each of the two spacer rods 31, 32 is screwed on both sides with an end plate 21 and 22. The distance between two opposing grooved plates 11 is so large that the material consisting of thin flat workpieces / semi-finished products, such as wafers for photovoltaic elements, can be accommodated.
Bei dem Carrier nach dem Ausführungsbeispiel sind jeweils zwei Nutenplatten 11 mit der Einzellänge L hintereinander angeordnet. In diesem Fall beträgt die Länge jedes der Distanzstäbe 31 , 32 2L. Es ist auch alternativ möglich, jeweils 2 einzelne Distanzstäbe 31 mit 31 und 32 mit 32 mit der Einzellänge L miteinander zu verschrauben und so die Länge 2 L zu erhalten. Bei einer längeren Ausbildung des Carriers wird dementsprechend verfahren. Die Flächen der unteren Auflagen 12 sind elastisch ausgebildet, damit das flächige Material bei der Aufnahme unten abgefedert wird. Da im zunehmenden Maße immer dünneres Material verwendet wird, besteht auch die Gefahr, dass es seitlich durchbiegt. Um dies zu verhindern, wird die Oberfläche entweder selbsthemmend durch Aufrauen ausgebildet oder wie die Nutenplatten 11 mit Nuten versehen.In the case of the carrier according to the exemplary embodiment, two groove plates 11 each having the individual length L are arranged one behind the other. In this case, the length of each of the spacer bars 31, 32 is 2L. It is also possible alternatively to screw together each 2 individual spacer bars 31 with 31 and 32 with 32 with the individual length L and thus obtain the length 2 L. In a longer training of the carrier is handled accordingly. The surfaces of the lower pads 12 are elastic, so that the sheet material is cushioned at the bottom of recording. As increasingly thinner material is used, there is also a risk that it bends sideways. To prevent this, the surface is either self-locking formed by roughening or as the grooved plates 11 provided with grooves.
Um dem als dünnen flächigen Werkstücken/Halbzeugen ausgebildeten Material in den Nuten der Nutenplatten 11 und gegebenenfalls der Auflagen 12 einen ausreichenden Halt und Schutz zu geben, können diese Nuten an ihren Aufnahmeflächen elastisch und/oder reibmindernd ausgebildet werden.In order to give the material designed as a thin sheet-like workpieces / semifinished products in the grooves of the grooved plates 11 and optionally the supports 12 sufficient support and protection, these grooves can be formed elastically and / or friction-reducing at their receiving surfaces.
Um einen antistatischen Effekt zu erzielen, der die Werkstücke/Halbzeuge zusätzlich schützt, können die Nutenplatten 11 und gegebenenfalls in den Auflagen 12 befindlichen Nuten an ihren Aufnahmeflächen antistatisch ausgebildet sein. Diese konstruktive Ausbildung des Carriers in Modulbauweise ist mit dem Vorteil verbunden, dass bei einem einfachen Aufbau weniger Einzelteile benötigt werden. In order to achieve an antistatic effect, which additionally protects the workpieces / semi-finished products, the groove plates 11 and, if appropriate, grooves located in the supports 12 can be made antistatic on their receiving surfaces. This structural design of the carrier in modular design has the advantage that with a simple structure fewer items are needed.

Claims

Patentansprüche claims
1. Modularer Carrier zur Aufnahme, zum Speichern und zum Transport von flächigem Material gleicher Größe, bestehend aus zwei beiderseits angeordneten U-förmigen Endplatten, zwei gegenüberliegend beabstandeten Nutenplatten, unteren Anschlägen und die beiden U-förmigen Endplatten verwindungsfrei miteinander verbindenden Distanzstäbe, wobei die Nuten in den Nutenplatten zueinander so angeordnet sind, dass sie sich gegenüberliegend jeweils auf einer Geraden befinden und ihr Abstand so groß ist wie die Breite eines flächigen Materials plus eines Differenzmaßes, gekennzeichnet dadurch, dass die einzelnen Bauteile aus drei Modulen (1 bis 3) bestehen, wobei das erste Modul (1) die Nutenplatte (11) mit der darunter winkelförmig angeordneten waagerechten Auflage (12) ist und die Nutenplatte (11) sowie die Auflage (12) eine gemeinsame Länge L aufweisen, das zweite Modul (2) die beiden U-förmigen Endplatten (21 , 22) bilden und das dritte Modul (3) als oberer und unterer Distanzstab (31 , 32) mit der Länge L jeweils eine Nutenplatte (11) fest aufnimmt und die beiden U-förmigen Endplatten (21 ,22) verwindungssteif miteinander verbindet.1. Modular carrier for receiving, storing and transporting flat material of the same size, consisting of two mutually arranged U-shaped end plates, two oppositely spaced Nutenplatten, lower stops and the two U-shaped end plates torsionally interconnecting spacer rods, wherein the grooves are arranged in the groove plates to each other so that they are located opposite each other on a straight line and their distance is as large as the width of a sheet material plus a difference measure, characterized in that the individual components consist of three modules (1 to 3), wherein the first module (1) is the grooved plate (11) with the below horizontally arranged horizontal support (12) and the grooved plate (11) and the support (12) have a common length L, the second module (2) the two U form-shaped end plates (21, 22) and the third module (3) as upper and lower spacer bar (31, 32) with the length L in each case a groove plate (11) firmly receives and connects the two U-shaped end plates (21, 22) torsionally rigid with each other.
2. Modularer Carrier nach Anspruch 1 , dadurch gekennzeichnet, dass er die Lange L oder n x L plus die Dicke der beiden Endplatten (21 , 22) aufweist, wobei n immer eine ganze Zahl ist.2. Modular carrier according to claim 1, characterized in that it has the length L or n x L plus the thickness of the two end plates (21, 22), wherein n is always an integer.
3. Modularer Carrier nach den Ansprüchen 1 und 2, dadurch gekennzeichnet, dass die waagerechte Auflage (22) des ersten Moduls (1) eine elastische Oberfläche aufweist, die entweder rau oder wie die Nutenplatten (11) mit Nuten versehen ist.3. Modular carrier according to claims 1 and 2, characterized in that the horizontal support (22) of the first module (1) has an elastic surface which is either rough or as the groove plates (11) provided with grooves.
4. Modularer Carrier nach den Ansprüchen 1 bis 3, dadurch gekennzeichnet, dass die Nutenplatten (11) mit Bohrungen versehen sind, durch die Distanzstäbe (21 ,22) hindurch gesteckt sind. 4. Modular carrier according to claims 1 to 3, characterized in that the groove plates (11) are provided with holes through which spacer rods (21, 22) are inserted through.
5. Modularer Carrier nach Anspruch 4, dadurch gekennzeichnet, dass zur formschlüssigen Verbindung der Nutenplatten (11) mit den Distanzstäben (21 , 22) alternativ werkzeuglos in Funktion bringbare Verbindungen vorgesehen sind.5. Modular carrier according to claim 4, characterized in that for the positive connection of the grooved plates (11) with the spacer bars (21, 22) are provided alternatively tool-free in function brought connections.
6. Modularer Carrier nach Anspruch 4, dadurch gekennzeichnet, dass die Distanzstäbe (21 , 22) entweder in der Länge L oder n x L als ein Stück verwendet oder in der Länge n x L aus mehreren Stücken zusammengesetzt wird.6. Modular carrier according to claim 4, characterized in that the spacer rods (21, 22) either in the length L or n x L used as a piece or in the length n x L composed of several pieces.
7. Modularer Carrier nach den Ansprüchen 1 bis 3, dadurch gekennzeichnet, dass die in den Nutenplatten (11) und gegebenenfalls in den Auflagen (12) befindlichen Nuten an ihren Aufnahmeflächen elastisch ausgebildet sind.7. Modular carrier according to claims 1 to 3, characterized in that in the groove plates (11) and optionally in the supports (12) located grooves are formed elastically on their receiving surfaces.
8. Modularer Carrier nach den Ansprüchen 1 bis 3, dadurch gekennzeichnet, dass die Nutenplatten (11) und gegebenenfalls in den Auflagen (12) befindlichen Nuten an ihren Aufnahmeflächen einen höheren Reibwert aufweisen.8. Modular carrier according to claims 1 to 3, characterized in that the Nutenplatten (11) and possibly in the supports (12) located grooves have a higher coefficient of friction at their receiving surfaces.
θ. Modularer Carrier nach den Ansprüchen 1 bis 3, dadurch gekennzeichnet, dass die Nutenplatten (11) antistatisch ausgebildet sind. θ, Modular carrier according to claims 1 to 3, characterized in that the groove plates (11) are formed antistatic.
EP09808983A 2008-12-16 2009-12-14 Modular carrier Withdrawn EP2359397A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008062123A DE102008062123A1 (en) 2008-12-16 2008-12-16 Modular carrier
PCT/DE2009/001767 WO2010075841A1 (en) 2008-12-16 2009-12-14 Modular carrier

Publications (1)

Publication Number Publication Date
EP2359397A1 true EP2359397A1 (en) 2011-08-24

Family

ID=42045412

Family Applications (1)

Application Number Title Priority Date Filing Date
EP09808983A Withdrawn EP2359397A1 (en) 2008-12-16 2009-12-14 Modular carrier

Country Status (5)

Country Link
US (1) US20110250039A1 (en)
EP (1) EP2359397A1 (en)
CA (1) CA2746693A1 (en)
DE (2) DE102008062123A1 (en)
WO (1) WO2010075841A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2711979A1 (en) 2012-09-24 2014-03-26 Meyer Burger AG Wafer cutting system
EP2711978A1 (en) 2012-09-24 2014-03-26 Meyer Burger AG Method of making wafers
EP2720258A1 (en) 2012-10-12 2014-04-16 Meyer Burger AG Wafer handling system
US9117863B1 (en) 2013-05-16 2015-08-25 Seagate Technology Llc Cassette configurations to support platters having different diameters
EP2944444A1 (en) 2014-05-16 2015-11-18 Meyer Burger AG Wafer processing method
US10020213B1 (en) * 2016-12-30 2018-07-10 Sunpower Corporation Semiconductor wafer carriers
CN116277347B (en) * 2023-03-07 2023-12-12 南通良禽佳木家居有限公司 Anticorrosive wood, production process thereof and wood soaking device thereof

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3926305A (en) * 1973-07-12 1975-12-16 Fluoroware Inc Wafer basket
US4318749A (en) * 1980-06-23 1982-03-09 Rca Corporation Wettable carrier in gas drying system for wafers
JPS6085538A (en) * 1983-10-18 1985-05-15 Nec Kansai Ltd Manufacture of semiconductor
US4817263A (en) * 1986-06-19 1989-04-04 W.R. Grace & Co. Method of storing electrostatic discharge sensitive devices
US4696395A (en) * 1986-11-14 1987-09-29 Northrop Corporation Substrate container
US5114018A (en) * 1989-09-20 1992-05-19 International Business Machines Corporation Versatile product carrier
US5657879A (en) * 1996-02-05 1997-08-19 Seh America, Inc. Combination wafer carrier and storage device
JP4855569B2 (en) * 2000-10-20 2012-01-18 コーニング インコーポレイテッド Container for packing glass substrates
US6845779B2 (en) * 2001-11-13 2005-01-25 Fsi International, Inc. Edge gripping device for handling a set of semiconductor wafers in an immersion processing system
US7121414B2 (en) * 2001-12-28 2006-10-17 Brooks Automation, Inc. Semiconductor cassette reducer
JP2003243496A (en) * 2002-02-15 2003-08-29 Dainippon Printing Co Ltd Substrate storage case
US7748532B2 (en) * 2002-10-10 2010-07-06 Seagate Technology Llc Cassette for holding disks of different diameters
TWI276580B (en) * 2003-12-18 2007-03-21 Miraial Co Ltd Lid unit for thin-plate supporting container
DE202007003416U1 (en) 2007-03-04 2007-05-31 Jonas & Redmann Automationstechnik Gmbh Automation carrier for substrate e.g. wafer, has stopper, where front edges of wafer facing stopper are guided into ridge plates lying one on another with its side edge areas, during loading of carrier for arrangement

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO2010075841A1 *

Also Published As

Publication number Publication date
US20110250039A1 (en) 2011-10-13
DE102008062123A1 (en) 2010-06-17
DE112009003127A5 (en) 2011-11-17
CA2746693A1 (en) 2010-07-08
WO2010075841A1 (en) 2010-07-08

Similar Documents

Publication Publication Date Title
EP2359397A1 (en) Modular carrier
DE102018114621A1 (en) Carrier system for arranging a photovoltaic unit comprising at least one photovoltaic module
DE3205795A1 (en) DEVICE FOR HOLDING PRINTED CIRCUIT BOARDS
DE102019211603B4 (en) Substrate magazine, substrate magazine system and substrate assembly system
DE102010032008A1 (en) Wine rack
EP0419851B1 (en) Holder for articles to be electroplated
WO2018138033A1 (en) Solar panel with multi-function mounting elements and multi-function mounting elements
DE202016000783U1 (en) furniture frame
DE10144028A1 (en) Modular machine frame
DE102010037754B4 (en) Device for fixing
DE102014226715A1 (en) Packaging for roller conveyor modules
EP2674987B1 (en) Module holder for solar modules and assembly with multiple module holders
DE102017201435B3 (en) Solar panel with multi-function fittings and multi-function fittings
WO2010094278A1 (en) Method and device for forming a packet-like back-to-back wafer batch
DE102018202125B4 (en) Bar of a stage structure of the framework type
DE202011002660U1 (en) Single spring element
DE102015102475A1 (en) Substrate carrier for flat substrates
DE102008024406A1 (en) Test system for testing mechanical loading capacity of photovoltaic module of solar energy system, has carriages arranged to form rows, where lowest carriage in rows is provided against lower section of frame for abrasion of sloping output
DE202023002202U1 (en) Coil storage device
DE102013105818B4 (en) Housing for receiving a plurality of plate-shaped substrates
DE202021103845U1 (en) Goods separator for shelves
DE202020004114U1 (en) Modular table top that can be dismantled - modular table segments for exchanging add-on parts and for easier transport
DE212021000575U1 (en) System for assembling a support structure, in particular for photovoltaic panels
DE202023104680U1 (en) Spring element for an upholstery base and arrangement with several spring elements
DE102021126349A1 (en) Modular frame for mounting solar modules at an angle to a set-up surface

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20110616

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR

DAX Request for extension of the european patent (deleted)
19U Interruption of proceedings before grant

Effective date: 20120701

19W Proceedings resumed before grant after interruption of proceedings

Effective date: 20140303

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20140903