EP2356267A4 - Electrodeposition baths, systems and methods - Google Patents

Electrodeposition baths, systems and methods

Info

Publication number
EP2356267A4
EP2356267A4 EP09825108.5A EP09825108A EP2356267A4 EP 2356267 A4 EP2356267 A4 EP 2356267A4 EP 09825108 A EP09825108 A EP 09825108A EP 2356267 A4 EP2356267 A4 EP 2356267A4
Authority
EP
European Patent Office
Prior art keywords
systems
methods
electrodeposition baths
electrodeposition
baths
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP09825108.5A
Other languages
German (de)
French (fr)
Other versions
EP2356267A1 (en
Inventor
Glenn Sklar
John Cahalen
Nazila Dadvand
Alan C Lund
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xtalic Corp
Original Assignee
Xtalic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US12/267,010 external-priority patent/US7951600B2/en
Priority claimed from US12/266,979 external-priority patent/US20100116675A1/en
Application filed by Xtalic Corp filed Critical Xtalic Corp
Publication of EP2356267A1 publication Critical patent/EP2356267A1/en
Publication of EP2356267A4 publication Critical patent/EP2356267A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
    • B22F7/04—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/619—Amorphous layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/66—Electroplating: Baths therefor from melts
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G01N27/416—Systems
    • G01N27/42—Measuring deposition or liberation of materials from an electrolyte; Coulometry, i.e. measuring coulomb-equivalent of material in an electrolyte

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Composite Materials (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
EP09825108.5A 2008-11-07 2009-11-04 Electrodeposition baths, systems and methods Withdrawn EP2356267A4 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/267,010 US7951600B2 (en) 2008-11-07 2008-11-07 Electrodeposition baths, systems and methods
US12/266,979 US20100116675A1 (en) 2008-11-07 2008-11-07 Electrodeposition baths, systems and methods
PCT/US2009/005967 WO2010053540A1 (en) 2008-11-07 2009-11-04 Electrodeposition baths, systems and methods

Publications (2)

Publication Number Publication Date
EP2356267A1 EP2356267A1 (en) 2011-08-17
EP2356267A4 true EP2356267A4 (en) 2016-03-30

Family

ID=42153138

Family Applications (1)

Application Number Title Priority Date Filing Date
EP09825108.5A Withdrawn EP2356267A4 (en) 2008-11-07 2009-11-04 Electrodeposition baths, systems and methods

Country Status (6)

Country Link
EP (1) EP2356267A4 (en)
JP (2) JP2012508322A (en)
KR (1) KR20110083707A (en)
CN (1) CN102272356A (en)
CA (1) CA2742934A1 (en)
WO (1) WO2010053540A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6159726B2 (en) * 2011-09-14 2017-07-05 エクスタリック コーポレイションＸｔａｌｉｃ Ｃｏｒｐｏｒａｔｉｏｎ Coated products, electrodeposition baths, and related systems
EP2639335B1 (en) * 2012-03-14 2015-09-16 Atotech Deutschland GmbH Alkaline plating bath for electroless deposition of cobalt alloys
EP2671969A1 (en) * 2012-06-04 2013-12-11 ATOTECH Deutschland GmbH Plating bath for electroless deposition of nickel layers
KR101270770B1 (en) * 2012-10-04 2013-06-03 와이엠티 주식회사 Electroplating method for printed circuit board
JP2015209589A (en) * 2014-04-30 2015-11-24 日本エレクトロプレイテイング・エンジニヤース株式会社 Nickel-tungsten alloy plating solution
CN105420775A (en) * 2015-12-31 2016-03-23 上海应用技术学院 Method for preparing La-Ni-Mo-W/GO composite deposit layer on carbon steel substrate
JP6687409B2 (en) * 2016-02-09 2020-04-22 福田金属箔粉工業株式会社 High chroma treated copper foil, copper clad laminate using the treated copper foil, and method for producing the treated copper foil
KR101931202B1 (en) * 2017-04-04 2018-12-20 스카이다이아몬드 주식회사 The liquid stirring apparatus using a ultrasonic vibrator and the liquid stirring method using there for
CN108728871B (en) * 2018-06-26 2019-11-08 中南大学 A method of copper nanoparticle is prepared using fluorocarbon surfactant

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5413874A (en) * 1994-06-02 1995-05-09 Baldwin Hardware Corporation Article having a decorative and protective multilayer coating simulating brass
US5525206A (en) * 1995-02-01 1996-06-11 Enthone-Omi, Inc. Brightening additive for tungsten alloy electroplate
US20060154084A1 (en) * 2005-01-10 2006-07-13 Massachusetts Institute Of Technology Production of metal glass in bulk form

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4002543A (en) * 1974-04-01 1977-01-11 Oxy Metal Industries Corporation Electrodeposition of bright nickel-iron deposits
US4699696A (en) * 1986-04-15 1987-10-13 Omi International Corporation Zinc-nickel alloy electrolyte and process
JPS648717A (en) * 1987-07-01 1989-01-12 Nec Corp Pseudo noise series code generating circuit
DE19637018A1 (en) * 1996-09-12 1998-03-19 Bayer Ag Process for the production of rigid and flexible circuits
US6683446B1 (en) * 1998-12-22 2004-01-27 John Pope Electrode array for development and testing of materials
JP2004325441A (en) * 2003-04-25 2004-11-18 Rohm & Haas Electronic Materials Llc Analytical method
US20050173255A1 (en) * 2004-02-05 2005-08-11 George Bokisa Electroplated quaternary alloys
CN100585399C (en) * 2006-01-23 2010-01-27 浙江大学宁波理工学院 Method for determining multiple brightening agents in nickel plating solution

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5413874A (en) * 1994-06-02 1995-05-09 Baldwin Hardware Corporation Article having a decorative and protective multilayer coating simulating brass
US5525206A (en) * 1995-02-01 1996-06-11 Enthone-Omi, Inc. Brightening additive for tungsten alloy electroplate
US20060154084A1 (en) * 2005-01-10 2006-07-13 Massachusetts Institute Of Technology Production of metal glass in bulk form

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2010053540A1 *

Also Published As

Publication number Publication date
WO2010053540A1 (en) 2010-05-14
JP2012508322A (en) 2012-04-05
EP2356267A1 (en) 2011-08-17
CA2742934A1 (en) 2010-05-14
JP2015165053A (en) 2015-09-17
CN102272356A (en) 2011-12-07
KR20110083707A (en) 2011-07-20

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RIC1 Information provided on ipc code assigned before grant

Ipc: C25D 5/18 20060101ALI20151029BHEP

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