EP2340891A1 - Wärmeplatte - Google Patents

Wärmeplatte Download PDF

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Publication number
EP2340891A1
EP2340891A1 EP09180562A EP09180562A EP2340891A1 EP 2340891 A1 EP2340891 A1 EP 2340891A1 EP 09180562 A EP09180562 A EP 09180562A EP 09180562 A EP09180562 A EP 09180562A EP 2340891 A1 EP2340891 A1 EP 2340891A1
Authority
EP
European Patent Office
Prior art keywords
heating
thermal plate
circuit board
plate according
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP09180562A
Other languages
English (en)
French (fr)
Inventor
Matthias Klotz
Thomas Clemens
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PEQLAB Biotechnologie GmbH
Original Assignee
PEQLAB Biotechnologie GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PEQLAB Biotechnologie GmbH filed Critical PEQLAB Biotechnologie GmbH
Priority to EP09180562A priority Critical patent/EP2340891A1/de
Publication of EP2340891A1 publication Critical patent/EP2340891A1/de
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L7/00—Heating or cooling apparatus; Heat insulating devices
    • B01L7/52—Heating or cooling apparatus; Heat insulating devices with provision for submitting samples to a predetermined sequence of different temperatures, e.g. for treating nucleic acid samples
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/06—Auxiliary integrated devices, integrated components
    • B01L2300/0627—Sensor or part of a sensor is integrated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/18—Means for temperature control
    • B01L2300/1805—Conductive heating, heat from thermostatted solids is conducted to receptacles, e.g. heating plates, blocks

Definitions

  • the present invention is directed to a thermal plate for heating and/or cooling several caps.
  • the thermal plate according to the present invention may in particular be utilized in an apparatus for performing PCR analysis.
  • PCR polymerase chain reaction
  • the thermal cycler heats and cools the reaction tubes or caps to achieve the temperatures required at each step of the reaction.
  • a PCR usually consists of a series of 20-40 repeated temperature changes called cycles (each of which typically consists of 2-3 discrete temperature steps).
  • the thermal cycler typically has a thermal block with holes where tubes or caps holding the PCR reaction mixtures can be inserted.
  • the thermal cycler then raises and lowers the temperature of the block in discrete, pre-programmed steps.
  • the temperature is typically controlled by use of peltier elements.
  • Some thermal cyclers contain silver blocks to achieve fast temperature changes and uniform temperature throughout the block.
  • Some thermal cyclers are equipped with multiple blocks along several different PCR reactions to be carried out simultaneously. It is furthermore known to provide a temperature gradient function, which allows different temperatures in different parts of the block.
  • thermal cyclers In order to perform and control complex PCR cycles thermal cyclers typically comprise a large number of heating elements, temperature sensors and further electrical and optical components such as light sources and light detectors. The requirements in this regard for thermal cyclers increase on a daily basis.
  • thermal cyclers it requires, however, rather complex manufacturing processes and causes substantial costs to incorporate these electrical components in thermal cyclers according to the prior art. Furthermore, the more electrical and/or optical components are part of a thermal cycler the less reliability can be guaranteed.
  • thermal plate for heating and/or cooling several tubes or caps, in particular a thermal plate for a Thermal cycler, which can be easily and cost effective manufactured and which at the same time works more reliable. It is another object of the present invention to provide a thermal plate which can be easily equipped with a large amount of electrical and/or optical components. Further objects of the present invention are to provide a thermal plate which has a comparably small heat capacity and a comparably large thermal conductivity and to provide a thermal plate which allows for an easy malfunction diagnosis.
  • the present invention is directed to a thermal plate for use in a PCR apparatus for heating and/or cooling several tubes or caps.
  • the thermal plate comprises a base plate of thermally conducting material comprising a circuit board, several receptacles for tubes or caps being in thermal contact with the base plate and means for heating and/or cooling.
  • the present invention is based on the idea to provide a thermal plate whose base plate comprises or consists of a conventional circuit board of a thermally conducting material.
  • a circuit board may be manufactured using well-known industrial processes. Furthermore, it is quite easy to equip such a conventional circuit board with active and/or passive electronics.
  • the circuit board comprises one or more temperature sensors.
  • the receptacles which are adapted to receive tubes or caps with a sample to be analysed, are preferably arranged in a matrix of columns and lines.
  • the circuit board comprises one temperature sensor per column and/or line.
  • the circuit board comprises one or more optical sensors to detect or measure electromagnetic radiation.
  • the terms "light” and “electromagnetic radiation” are used in the present invention to describe any kind of electromagnetic radiation including UV-light, infrared light and light in the optically visible spectrum.
  • the circuit board comprises one or more sources of electromagnetic radiation including visible light.
  • one optical sensor and/or one light source is provided per receptacle.
  • one light source is provided for all or several receptacles, wherein the light is directed from the light source to the receptacles by means of a light guide.
  • the circuit board comprises optical sensors and/or optical detectors the receptacles are preferably optically transparent in the spectrum of the electromagnetic radiation and/or comprise optically transparent windows.
  • the circuit board comprises heating and/or cooling elements, e.g., heating resistors, peltier elements or the like.
  • the heating and/or cooling elements may be provided in addition to the means for heating and/or cooling or the means for heating and/or cooling may comprise the heating and/or cooling elements.
  • a first alternative means for heating and/or cooling are provided external to the circuit board, which may be assisted by additional heating and/or cooling elements on the circuit board while, according to a second alternative, the means for heating and/or cooling are only provided on the circuit board.
  • heating and/or cooling elements are provided on the circuit board it is preferred that the receptacles are arranged in a matrix of columns and lines and that the circuit board comprises one heating and/or cooling elements per column and/or line.
  • a well-controlled temperature gradient may be provided along one or two directions of the matrix of receptacles.
  • one heating and/or cooling element is provided per receptacle.
  • the temperature may be controlled in each receptacle separately.
  • the circuit board comprises digital electronics components adapted to save, process and/or output data.
  • the thermal plate according to the present invention comprises a central processing unit adapted to control the means for heating and/or cooling, the optical sensors, the temperature sensors, the light sources, the heating and/or cooling elements and/or the digital electronics components.
  • the circuit board and/or the central processing unit are preferably adapted to control the thermal cycles and to perform a predetermined measurement protocol.
  • the circuit board and/or the central processing unit are preferably further adapted to save the output of the different sensors, to analyse and/or process said output and to provide a set of data which represents the result of the measurement protocol.
  • the present invention provides a thermal plate for heating and/or cooling several tubes or caps.
  • the thermal plate comprises a base plate of thermally conducting material, several receptacles for tubes or caps being in Thermal contact with the base plate, a support structure for supporting the receptacles being in thermal contact with the base plate and means for heating and/or cooling the base plate, wherein the support structure together with the base plate provides a substantially closed hollow space surrounding the receptacles.
  • the receptacles are adapted to receive tubes or caps in such a manner that the tubes or caps are in thermal contact with the base plate.
  • the solid thermal block known from the prior art by a honeycomb-like or porous structure, which effectively reduces the thermal mass.
  • the thermal plate according to the present invention may much faster adapt to or reach the temperature steps of the typical PCR cycles. While the heat capacity of the thermal plate according to the present invention is reduced compared to the prior art, the thermal conductivity is nevertheless large enough to provide for fast temperature cycles.
  • the support structure for supporting the receptacles comprises vent holes.
  • a fluid stream may be utilized to additionally heat and/or cool the thermal plate.
  • the thermal plate comprises a fan.
  • the support structure comprises an inlet and an outlet for a cooling and/or heating fluid.
  • the fluid may be ambient air or another gas, water, oil or another fluid which is suitable for cooling and/or heating.
  • the thermal plate further comprises means for pumping the cooling fluid through the support structure.
  • the support structure accommodates one or more temperature sensors.
  • the one or more temperature sensors should be in thermal contact with the receptacles for the tubes or caps, either in direct contact or in indirect contact via, e.g., the base plate.
  • the one or more temperature sensors are located close to or adjacent the receptacles for the tubes or caps.
  • the support structure accommodates one or more optical sensors for analyzing light originating from the receptacles.
  • the support structure accommodates one or more light sources.
  • the term "light source” in the context of the present application is to be understood as any source of electromagnetic radiation including inter alia UV-light, infrared light and light from the optically visible spectrum.
  • the one or more optical sensors and the one or more light sources are preferably arranged in such a manner that light emitted from the light sources is directed into the receptacles for the tubes or caps, i.e.
  • the receptacles are optically transparent and/or comprise optically transparent windows with respect to the light emitted by the light sources. If optically transparent windows are provided, the receptacle may comprise only one window (reflective mode) or two or more windows (for measuring transmission and/or scattered light).
  • the support structure and the receptacles have a thermal conductivity of at least 0.02 W/K per receptacle, preferably of at least 0.2 W/K per receptacle.
  • the base plate and/or the support structure is made of one or a combination of the following materials : Cu, Al, Ag, Sn, Fe, C, Ceramics.
  • the receptacles have a volume between 50 ⁇ l and 300 ⁇ l, more preferably between 100 ⁇ l and 250 ⁇ l.
  • the heat capacity of the Thermal plate divided by the number of receptacles is smaller than 1.6 J/K, more preferably smaller than 1.2 J/K.
  • the apparatus comprising a thermal plate as described above.
  • FIG. 1 shows a cross section of a preferred embodiment of the thermal plate according to the present invention.
  • the thermal plate comprises a base plate 1 of thermally conducting material, several receptacles 2 for tubes or caps and a support structure 3 for supporting the receptacles. Both the receptacles and the support structure are in thermal contact with the base plate 1.
  • means for heating and/or cooling the base plate are provided and indicated with reference numeral 4.
  • the means for heating and/or cooling 4 comprises one or more peltier elements.
  • the means for heating and/or cooling may also be incorporated in the base plate 1.
  • the support structure 4 together with the base plate 1 provide a substantially closed hollow space surrounding the receptacles 2.
  • the receptacles are adapted to receive tubes or caps, which preferably accurately fit into the receptacles. Thus, good heat transfer from the receptacles to the tubes or caps can be guaranteed. While the support structure 3 shown in Figure 1 is advantageous, the scope of the present invention is not restricted to a thermal plate having such a support structure 3.
  • the receptacles 2 may also be mounted in close proximity to the base plate 1 by different means, e.g., by a solid block of thermally conducting material.
  • the base plate 1 of a thermally conducting material comprises a circuit board or consists of a circuit board. Such a circuit board 1 is shown in a perspective view in Figure 2 .
  • the circuit board 1 preferably comprises several electronic and/or optical components. These electronic or optical components may be temperature sensors such as resistance thermometers (e.g. PT1000), thermistors, peltier elements or the like, optical light sources of electromagnetic radiation, optical detectors for measuring light reflected, scattered or transmitted through a sample provided in tubes or caps received in the receptacles 2 or other components which may be suitable to perform a PCR analysis.
  • the circuit board provided in the base plate of the thermal plate according to the present invention has several purposes at the same time: since the circuit board is made of a thermally conducting material the circuit board allows for good heat transfer between the means for heating and/or cooling 4 (see Figure 1 ) and the tubes or caps received in the receptacles 2. Furthermore, the circuit board provides for a temperature transfer from the tubes or caps received in the receptacles 2 and the temperature sensors provided on the circuit board. The circuit board further provides a support structure for the temperature sensors, the heating and/or cooling elements and further electronic or optical sensors. Furthermore, digital electronic components adapted to save, process and/or output data may be provided on the circuit board. The circuit board may further be utilized for wiring the electronic and/or optical components with an interface of the thermal plate.
  • the circuit board may be manufactured as is well-known in the art.
  • a circuit diagram is provided on the circuit board with several connections for the temperature sensors, the optical sensors, the heating and/or cooling elements and the like. These components may, e.g., be soldered to those connections. It is furthermore quite easy to equip the circuit board with further passive and/or active electronic components such as analog digital converter, processors with software and/or firmware, digital memories, fuses and the like.
  • the thermal plate according to the present invention provides several advantages in view of the prior art. It is evidently quite easy to provide a large amount of sensors and further electronic and/or optical components in close proximity to the receptacles. Thus, temperature may be measured in close proximity to the receptacles and thus to the samples. Mounting of the sensors and further electronic components may be automatized using standard industrial mounting or equipment techniques. Since the circuit board may be equipped with memory elements, logic components and/or a central processing unit, an "intelligent" thermal plate can be provided. Thus, the thermal plate according to the present invention may control the PCR cycles, process the PCR data and/or communicate with a further central, processing unit. The thermal plate may further save, process and/or output data relating to identification, configuration and control parameters.
  • the thermal plate according to the present invention may also act autonomously and may be adapted to control sensors and/or heating elements without any input from external. Since it is easy to increase the amount of electronic and/or optical components on the circuit board there may be provided redundant sensors for a more detailed measurement of the temperature gradients and to improve malfunction diagnosis.

Landscapes

  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Clinical Laboratory Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
EP09180562A 2009-12-23 2009-12-23 Wärmeplatte Withdrawn EP2340891A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP09180562A EP2340891A1 (de) 2009-12-23 2009-12-23 Wärmeplatte

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP09180562A EP2340891A1 (de) 2009-12-23 2009-12-23 Wärmeplatte

Publications (1)

Publication Number Publication Date
EP2340891A1 true EP2340891A1 (de) 2011-07-06

Family

ID=42194806

Family Applications (1)

Application Number Title Priority Date Filing Date
EP09180562A Withdrawn EP2340891A1 (de) 2009-12-23 2009-12-23 Wärmeplatte

Country Status (1)

Country Link
EP (1) EP2340891A1 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017508630A (ja) * 2013-12-31 2017-03-30 キヤノン ユー．エス． ライフ サイエンシズ， インコーポレイテッドＣａｎｏｎ Ｕ．Ｓ． Ｌｉｆｅ Ｓｃｉｅｎｃｅｓ， Ｉｎｃ． 積層マイクロ流体デバイスのプリント回路基板設計
EP2566622B1 (de) * 2010-05-03 2017-04-12 Eppendorf AG Kondensatvermeidungshaube

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030008286A1 (en) * 2001-07-05 2003-01-09 Institute Of Microelectronics Miniaturized multi-chamber thermal cycler for independent thermal multiplexing
US6781056B1 (en) * 2003-02-28 2004-08-24 Motorola, Inc. Heater for temperature control integrated in circuit board and method of manufacture
US20080299013A1 (en) * 2005-07-25 2008-12-04 Frakunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E. V. Chip-Holder for a Micro-Fluidic Chip

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030008286A1 (en) * 2001-07-05 2003-01-09 Institute Of Microelectronics Miniaturized multi-chamber thermal cycler for independent thermal multiplexing
US6781056B1 (en) * 2003-02-28 2004-08-24 Motorola, Inc. Heater for temperature control integrated in circuit board and method of manufacture
US20080299013A1 (en) * 2005-07-25 2008-12-04 Frakunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E. V. Chip-Holder for a Micro-Fluidic Chip

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2566622B1 (de) * 2010-05-03 2017-04-12 Eppendorf AG Kondensatvermeidungshaube
JP2017508630A (ja) * 2013-12-31 2017-03-30 キヤノン ユー．エス． ライフ サイエンシズ， インコーポレイテッドＣａｎｏｎ Ｕ．Ｓ． Ｌｉｆｅ Ｓｃｉｅｎｃｅｓ， Ｉｎｃ． 積層マイクロ流体デバイスのプリント回路基板設計
EP3089937A4 (de) * 2013-12-31 2017-11-22 Canon U.S. Life Sciences, Inc. Leiterplattenentwürfe für laminierte mikrofluidische vorrichtungen

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