EP2260977B1 - Lapping apparatus - Google Patents
Lapping apparatus Download PDFInfo
- Publication number
- EP2260977B1 EP2260977B1 EP09007778A EP09007778A EP2260977B1 EP 2260977 B1 EP2260977 B1 EP 2260977B1 EP 09007778 A EP09007778 A EP 09007778A EP 09007778 A EP09007778 A EP 09007778A EP 2260977 B1 EP2260977 B1 EP 2260977B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- cooler
- fixture
- grinding
- grinder
- heated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Not-in-force
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
Definitions
- the present invention in general relates to an apparatus for grinding a heated plane of a cooler
- a cooling device including vapor chamber or heat pipe
- a thermally conductive seat When operated, a cooling device, including vapor chamber or heat pipe, is first combined to a thermally conductive seat and is arranged a plurality of cooling fins thereon.
- one side of the thermally conductive seat is contacted closely with the heating electronic component.
- the heat generated from the heating electronic component is thermally conducted.
- the heated face of a general cooler is usually configured as a matte, which looks flat and smooth after machined.
- the roughness and flatness on the surface of the heated face is still poor, making the heated face and the heating component unable to be contacted closely, thereby, limiting the thermal conduction between the heated face and the heating electronic component. Therefore, if the roughness and the flatness on the heated face can be further improved, the contact tightness between the heated face and the heating electronic component will be thereby increased, so is the thermally conductive effect.
- Japan patent application publication No. 2003-188320 discloses a heat sink and its manufacturing method.
- the heat sink is provided with a heat-receiving surface, which is formed in a recessed state.
- a thermo-conductive medium is provided between the heat receiving surface and a heating surface of an element to be cooled.
- US 6,074,283 A discloses a lapping apparatus comprising a lapping plate, a fixture combined to the grinder and a pressure plate for pressing and clamping the work piece.
- this grinder does not disclose to press and clamp the work piece via a point contact manner and to arrange the fixture to the grinder elastically by means of an elastic element and to elevate and lower the fixture elastically with respect to the grinding plate.
- US 6,435,496 B1 is concerned with a low-profile rocking lever clamp that is provided with a workpiece-engaging edge that may be formed as a knife edge, an angled edge, a serrated edge, straight contact edge, and a rounded edge.
- a workpiece-engaging edge may be formed as a knife edge, an angled edge, a serrated edge, straight contact edge, and a rounded edge.
- the clamp is provided with a machinable workpiece engaging edge.
- the clamp is used for fixing a workpiece on a support.
- the invention is mainly to provide a grinding apparatus for grinding a heated plane of a cooler, so that the roughness and flatness on the surface of the heated plane is improved. Furthermore, the thermally conductive effect is enhanced due to a better contact relative to the heating electronic component.
- An apparatus for grinding the heated plane of a cooler in which a heated plane of a cooler is ground includes a grinder and a fixture, in which the grinder has a grinding plate and an abrasive supply barrel that is arranged above the grinding plate for supplying abrasive into the gap between the heated plane and the grinding plate.
- the fixture is combined to the grinder and has at least one pressure plate for arranging the cooler. Thereby, the pressure plate presses and clamps the cooler, making the heated plane of the cooler contact closely to the abrasive.
- the roughness on the surface of the heated plane can be under Ra 0.03 ⁇ m and the flatness can be under 10 ⁇ m.
- the invention is to arrange a fixture to a grinder.
- the fixture presses and clamps a cooler via a point contact manner, whereby the heated plane of the cooler can possess a better flatness and surface roughness after being ground. Therefore, the contact tightness between the heated plane and the heating electronic component is increased, further generating a better effect of thermal conduction and enhancing the practicability of the invention.
- Fig. 1 is an assembled illustration of a grinder and a fixture according to the present invention.
- the invention is to provide a method for grinding the heated plane of a cooler, in which a grinder 10 having grinding plate 11 and fixing frame 15 is provided.
- the grinding plate 11 is actuated by a motor 12 to rotate.
- the fixing frame 15 is fixed onto the grinder 10 and is arranged an abrasive supply barrel 13 thereon.
- the abrasive supply barrel 13 is filled with abrasive and has a nozzle 131 to inject the abrasive onto the grinding plate 11.
- the grinder 10 is additionally connected a fixture 20.
- At least one elastic element 14 e.g., spring, etc.
- the elastic element 14 keeps a gap 100 between the fixture 20 and the grinder 11, such that the fixture 20 can be displaced upwardly and downwardly in an elastic way.
- a driving device 21, such as hydraulic cylinder or pneumatic cylinder, is arranged on the fixing frame 15. The driving device 21 is connected by abutting against the fixture. By elevating or lowering the driving device 21, the fixture 20 is moved toward or far away the grinding plate 11.
- Fig. 2 and Fig. 3 are an illustration and a cross-sectional view of a cooler that is pressed and clamped by a fixture.
- the fixture 20 can correspond to the grinding plate 11 and is shown as a disk configuration.
- the circumference of the fixture 20 is divided equally to project out a plurality of pressure plates 22, each of which is arranged a cooler 30.
- the bottom portion of the pressure plate 22 is arranged a pointed bulge 221 that is abutted against the center of the cooler 30, thereby, the fixture 20 pressing and clamping the cooler 30 via a point contact manner.
- the cooler 30 includes a thermally conductive seat 31, at least one heat pipe 32 and a plurality of cooling fins 33.
- the heat pipe 32 has a flat evaporation section 321 and a condensation section 322.
- the thermally conductive seat 31 is arranged at least one slot 310, into which the flat evaporation section 321 is inset.
- the plural cooling fins 33 are arranged by being passed through by the condensation section 322 of the heat pipe 32.
- the flat evaporation section 321 is formed as a heated plane 34 provided for contacting the heat source.
- a cooler 30 is separately arranged under each pressure plate 22 of the fixture 20.
- an abrasive 132 is injected into the gap 100 between the grinder 11 and the heated plane 34.
- the abrasive 132 includes grinding liquid 1321 and grinding particle 1322, as shown in Fig. 7 .
- the driving device 21 is actuated, making the fixture 20 lowered down and the pressure plate 22 separately press and clamp the top portion of each thermally conductive seat 31.
- the pointed bulge 221 presses and clamps at the center of the thermally conductive seat 31, making each heated plane 34 touch the abrasive 132 and closely contact the grinding plate 11.
- the motor 12 is actuated to bring along the grinding plate 11 to make a circular rotation.
- the abrasive 132 can uniformly grind the heated plane 34.
- the flatness of the heated plane 34 is improved to obtain a best value of roughness on the surface.
- the driving device 21 is actuated again and lifted up. In so doing, the fixture 20 is rid of press and clamp and lifted up due to the elastically recovering force of the elastic element 14. Finally, the heated plane 34 of the cooler 30 gets rid of the relative contact with the grinding plate 11.
- the coolers 30 can be moved to another grinding machine to undergo next grinding.
- a series of grinding can be made in a grinder by separately injecting different abrasives 132 with different particle sizes.
- a grinding process can first be undergone by injecting an abrasive 132 with larger particles. After the first grinding process, another abrasive 132 with finer particle is then injected to undergo a second grinding process. Following each grinding process, a finer abrasive 132 is injected until the required accuracy of the heated plane 34 is reached.
- the value of the surface roughness is under Ra 0.03 ⁇ m, preferably, between Ra 0.03 ⁇ m and Ra 0.01 ⁇ m and the flatness is between 0.3 ⁇ m and 10 ⁇ m.
- Fig. 8 is a flowchart diagram showing a grinding method , in which a heated plane of a cooler is ground.
- a grinder 10 and a fixture 20, with a grinding plate 11 is first provided (step 61); next, a cooler 30 with a heated plane 34 is further provided (step 62); then, an abrasive 132 is injected into the gap between the grinding plate 11 and the heated plane 34 (step 63); during a series of grindings, different abrasives 132 with different particle sizes can be injected and, in the meantime, the fixture 20 presses and clamps the cooler 30 via a point contact manner, for example, another side of the heated plane 34 being pressed and clamped, making the heated plane 34 contact closely to the grinding plate 11 to touch the abrasive 132 (step 64); finally, the grinding plate 11 is rotated, making the heated plane 34 undergone at least one grinding process (step 65).
- the thermally conductive seat 31 has a bottom plane 311 that is arranged at least one slot 310, into which the flat evaporation section 321 of the heat pipe 32 is inset.
- the flat evaporation sections 321 are the heated plane 34. Nonetheless, when the surface of the flat evaporation sections 321 is flush with the bottom plane 311 of the thermally conductive seat 31, the heated plane 34 then includes the flat evaporation sections 321 and the bottom plane 311.
- a delicate plane like mirror is obtained, which is provided for closely contacting a heating electronic component to dissipate the heat thereof.
- Fig. 10 showing another cooler with ground heated plane .
- This embodiment is substantially same as the first embodiment. The differences are that the bottom plane 311' of the thermally conductive seat 31' is only arranged an accommodating groove 310'; the cooler 30' has three heat pipes 32', each of which has a flat evaporation section 321' passing through a plurality of cooling fins 33'; the three heat pipes 32' arranged in parallel and pressed (clamped) in the accommodating groove 310' are flush with each other to form a flat evaporation section 321'; similarly, when the surface of the flat evaporation sections 321' is higher than the bottom plane 311' of the thermally conductive seat 31', the flat evaporation sections 321' are the heated plane 34'; on the other hand, when the surface of the flat evaporation sections 321' is flush with the bottom plane 311' of the thermally conductive seat 31', the heated plane 34' then includes the flat evaporation sections 321' and the bottom plane 311'.
- the cooler 40 is a flat-plate heat pipe 41 that has a flat evaporation section 411 and is arranged a plurality of cooling fins 43.
- the flat evaporation section 411 is the heated plane 42 that is ground to make its surface possess better surface roughness and flatness, thereby, the heated plane 42 contacting the heating electronic component further closely to increase its thermally conductive effect.
- the ground heated plane is an indispensably design for a cooler indeed, which may positively reach the expected usage objective for solving the drawbacks of the prior arts.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
Description
- The present invention in general relates to an apparatus for grinding a heated plane of a cooler,
- Following progress of technology, computer hardware is developed toward the directions of high speed and high frequency for increasing its execution efficiency, but its power consumption is also increased relatively. Compared to the prior arts, the heat generated from today's electronic component is much more significant than the past's. If the accumulative heat is not removed in time, the electronic component will be overheated to lower down the operation efficiency, even cause damage. So, most electronic component needs cooling device to control the working temperature and keep it operated under normal condition.
- When operated, a cooling device, including vapor chamber or heat pipe, is first combined to a thermally conductive seat and is arranged a plurality of cooling fins thereon. Next, one side of the thermally conductive seat is contacted closely with the heating electronic component. Thereby, the heat generated from the heating electronic component is thermally conducted. However, since of the limitation of many factors, such as cooling space and power consumption, how to promote cooling efficiency as high as we can becomes an issue intended to be addressed urgently by industry.
- Nonetheless, the more flat a heated face of a cooler is, the more compact a thermal contact between the heated face and the heating electronic component will be. In other words, a good flatness of the heated face will promote the thermally conductive efficiency of the cooler. In addition, the heated face of a general cooler is usually configured as a matte, which looks flat and smooth after machined. However, in practice, the roughness and flatness on the surface of the heated face is still poor, making the heated face and the heating component unable to be contacted closely, thereby, limiting the thermal conduction between the heated face and the heating electronic component. Therefore, if the roughness and the flatness on the heated face can be further improved, the contact tightness between the heated face and the heating electronic component will be thereby increased, so is the thermally conductive effect.
- Japan patent application publication No.
2003-188320 -
US 6,074,283 A discloses a lapping apparatus comprising a lapping plate, a fixture combined to the grinder and a pressure plate for pressing and clamping the work piece. However, this grinder does not disclose to press and clamp the work piece via a point contact manner and to arrange the fixture to the grinder elastically by means of an elastic element and to elevate and lower the fixture elastically with respect to the grinding plate. -
US 6,435,496 B1 is concerned with a low-profile rocking lever clamp that is provided with a workpiece-engaging edge that may be formed as a knife edge, an angled edge, a serrated edge, straight contact edge, and a rounded edge. To permit clamping when a workpiece has a non-linear interface with the clamp, the clamp is provided with a machinable workpiece engaging edge. The clamp is used for fixing a workpiece on a support. - The invention is mainly to provide a grinding apparatus for grinding a heated plane of a cooler, so that the roughness and flatness on the surface of the heated plane is improved. Furthermore, the thermally conductive effect is enhanced due to a better contact relative to the heating electronic component.
- These objects are achieved by the apparatus of claim 1.
- An apparatus for grinding the heated plane of a cooler, in which a heated plane of a cooler is ground includes a grinder and a fixture, in which the grinder has a grinding plate and an abrasive supply barrel that is arranged above the grinding plate for supplying abrasive into the gap between the heated plane and the grinding plate. The fixture is combined to the grinder and has at least one pressure plate for arranging the cooler. Thereby, the pressure plate presses and clamps the cooler, making the heated plane of the cooler contact closely to the abrasive.
- After being ground by the apparatus according to the present invention, the roughness on the surface of the heated plane can be under Ra 0.03 µm and the flatness can be under 10 µm.
- Compared with the prior arts, the invention is to arrange a fixture to a grinder. The fixture presses and clamps a cooler via a point contact manner, whereby the heated plane of the cooler can possess a better flatness and surface roughness after being ground. Therefore, the contact tightness between the heated plane and the heating electronic component is increased, further generating a better effect of thermal conduction and enhancing the practicability of the invention.
- The features of the invention believed to be novel are set forth with particularity in the appended claims. The invention itself, however, may be best understood by reference to the following detailed description of the invention, which describes a number of embodiments of the invention, taken in conjunction with the accompanying drawings, in which:
-
Fig. 1 is an assembled illustration of a grinder and a fixture according to the present invention; -
Fig. 2 is an illustration of a cooler pressed and clamped by a fixture -
Fig. 3 is a cross-sectional view of a cooler pressed and clamped by a fixture -
Fig. 4 is a using illustration showing a cooler under a grinding process -
Fig. 5 is a lateral view of the invention when undergoing a grinding process; -
Fig. 6 is an illustration showing a grinding action of the invention; -
Fig. 7 is a locally enlarging illustration of the invention when undergoing a grinding process; -
Fig. 8 is a flowchart diagram showing a grinding method in which a heated plane of a cooler is ground; -
Fig. 9 shows a cooler with ground heated plane ; -
Fig. 10 shows a cooler with ground heated plane ; and ; and -
Fig. 11 shows another cooler with ground heated plane . - In cooperation with attached drawings, the technical contents and detailed description of the present invention are described thereinafter according to a number of preferable embodiments, not used to limit its executing scope.
- Please refer to
Fig. 1 , which is an assembled illustration of a grinder and a fixture according to the present invention. The invention is to provide a method for grinding the heated plane of a cooler, in which agrinder 10 havinggrinding plate 11 andfixing frame 15 is provided. Thegrinding plate 11 is actuated by amotor 12 to rotate. Thefixing frame 15 is fixed onto thegrinder 10 and is arranged anabrasive supply barrel 13 thereon. Theabrasive supply barrel 13 is filled with abrasive and has anozzle 131 to inject the abrasive onto thegrinding plate 11. - Above the
grinding plate 11, thegrinder 10 is additionally connected afixture 20. At least one elastic element 14 (e.g., spring, etc.) is arranged between thefixture 20 and thegrinder 10. Theelastic element 14 keeps agap 100 between thefixture 20 and thegrinder 11, such that thefixture 20 can be displaced upwardly and downwardly in an elastic way. In addition, adriving device 21, such as hydraulic cylinder or pneumatic cylinder, is arranged on thefixing frame 15. Thedriving device 21 is connected by abutting against the fixture. By elevating or lowering thedriving device 21, thefixture 20 is moved toward or far away thegrinding plate 11. - Please refer to
Fig. 2 andFig. 3 , which are an illustration and a cross-sectional view of a cooler that is pressed and clamped by a fixture. Thefixture 20 can correspond to thegrinding plate 11 and is shown as a disk configuration. The circumference of thefixture 20 is divided equally to project out a plurality ofpressure plates 22, each of which is arranged a cooler 30. In addition, the bottom portion of thepressure plate 22 is arranged a pointedbulge 221 that is abutted against the center of the cooler 30, thereby, thefixture 20 pressing and clamping the cooler 30 via a point contact manner. - In a preferable embodiment, the cooler 30 includes a thermally
conductive seat 31, at least oneheat pipe 32 and a plurality of coolingfins 33. Theheat pipe 32 has aflat evaporation section 321 and acondensation section 322. The thermallyconductive seat 31 is arranged at least oneslot 310, into which theflat evaporation section 321 is inset. In the meantime, theplural cooling fins 33 are arranged by being passed through by thecondensation section 322 of theheat pipe 32. In this case, theflat evaporation section 321 is formed as aheated plane 34 provided for contacting the heat source. When the top portion of the thermallyconductive seat 31 is pressed and clamped by the pointedbulge 221 of thepressure plate 22, theheated plane 34 of the cooler 30 is abutted against the grindingplate 11 and is arranged correspondingly. - Please refer to
Fig. 4 through Fig. 7 , separately showing a using illustration of a cooler under a grinding process, a lateral view of the invention when undergoing a grinding process, an illustration of a grinding action , and a locally enlarging illustration of the invention when undergoing a grinding process. Firstly, a cooler 30 is separately arranged under eachpressure plate 22 of thefixture 20. Secondly, an abrasive 132 is injected into thegap 100 between thegrinder 11 and theheated plane 34. The abrasive 132 includes grinding liquid 1321 and grindingparticle 1322, as shown inFig. 7 . Then, the drivingdevice 21 is actuated, making thefixture 20 lowered down and thepressure plate 22 separately press and clamp the top portion of each thermallyconductive seat 31. In so doing, thepointed bulge 221 presses and clamps at the center of the thermallyconductive seat 31, making eachheated plane 34 touch the abrasive 132 and closely contact the grindingplate 11. Next, themotor 12 is actuated to bring along the grindingplate 11 to make a circular rotation. By centrifugal force and pressing (clamping) operation, the abrasive 132 can uniformly grind theheated plane 34. Thereby, the flatness of theheated plane 34 is improved to obtain a best value of roughness on the surface. After the grinding is finished, the drivingdevice 21 is actuated again and lifted up. In so doing, thefixture 20 is rid of press and clamp and lifted up due to the elastically recovering force of theelastic element 14. Finally, theheated plane 34 of the cooler 30 gets rid of the relative contact with the grindingplate 11. - Subsequently, the
coolers 30 can be moved to another grinding machine to undergo next grinding. Or, a series of grinding can be made in a grinder by separately injectingdifferent abrasives 132 with different particle sizes. For example, a grinding process can first be undergone by injecting an abrasive 132 with larger particles. After the first grinding process, another abrasive 132 with finer particle is then injected to undergo a second grinding process. Following each grinding process, a finer abrasive 132 is injected until the required accuracy of theheated plane 34 is reached. In an embodiment, the value of the surface roughness is under Ra 0.03 µm, preferably, between Ra 0.03 µm and Ra 0.01 µm and the flatness is between 0.3 µm and 10 µm. - Please refer to
Fig. 8 , which is a flowchart diagram showing a grinding method , in which a heated plane of a cooler is ground. As shown in this diagram, agrinder 10 and afixture 20, with a grindingplate 11, is first provided (step 61); next, a cooler 30 with aheated plane 34 is further provided (step 62); then, an abrasive 132 is injected into the gap between the grindingplate 11 and the heated plane 34 (step 63); during a series of grindings,different abrasives 132 with different particle sizes can be injected and, in the meantime, thefixture 20 presses and clamps the cooler 30 via a point contact manner, for example, another side of theheated plane 34 being pressed and clamped, making theheated plane 34 contact closely to the grindingplate 11 to touch the abrasive 132 (step 64); finally, the grindingplate 11 is rotated, making theheated plane 34 undergone at least one grinding process (step 65). - Please refer to
Fig. 9 showing a cooler with ground heated plane. The thermallyconductive seat 31 has abottom plane 311 that is arranged at least oneslot 310, into which theflat evaporation section 321 of theheat pipe 32 is inset. When the surface of theflat evaporation sections 321 is higher than thebottom plane 311 of the thermallyconductive seat 31, theflat evaporation sections 321 are theheated plane 34. Nonetheless, when the surface of theflat evaporation sections 321 is flush with thebottom plane 311 of the thermallyconductive seat 31, theheated plane 34 then includes theflat evaporation sections 321 and thebottom plane 311. After theheated plane 34 is ground, a delicate plane like mirror is obtained, which is provided for closely contacting a heating electronic component to dissipate the heat thereof. - Please refer to
Fig. 10 showing another cooler with ground heated plane . This embodiment is substantially same as the first embodiment. The differences are that the bottom plane 311' of the thermally conductive seat 31' is only arranged an accommodating groove 310'; the cooler 30' has three heat pipes 32', each of which has a flat evaporation section 321' passing through a plurality of cooling fins 33'; the three heat pipes 32' arranged in parallel and pressed (clamped) in the accommodating groove 310' are flush with each other to form a flat evaporation section 321'; similarly, when the surface of the flat evaporation sections 321' is higher than the bottom plane 311' of the thermally conductive seat 31', the flat evaporation sections 321' are the heated plane 34'; on the other hand, when the surface of the flat evaporation sections 321' is flush with the bottom plane 311' of the thermally conductive seat 31', the heated plane 34' then includes the flat evaporation sections 321' and the bottom plane 311'. - Please refer to
Fig. 11 showing a further cooler with ground heated plane . In this case, the cooler 40 is a flat-plate heat pipe 41 that has aflat evaporation section 411 and is arranged a plurality of coolingfins 43. Theflat evaporation section 411 is theheated plane 42 that is ground to make its surface possess better surface roughness and flatness, thereby, theheated plane 42 contacting the heating electronic component further closely to increase its thermally conductive effect. - Accordingly, through the constitution of aforementioned assemblies, a cooler with ground heated plane is thus obtained.
- Summarizing aforementioned description, the ground heated plane is an indispensably design for a cooler indeed, which may positively reach the expected usage objective for solving the drawbacks of the prior arts.
Claims (1)
- An apparatus for grinding heated plane of cooler, in which a heated plane (34, 34', 42) of a cooler (30, 30', 40) is ground, and which includes:a grinder (10), which has a grinding plate (11) and an abrasive supply barrel (13) that is arranged above the grinding plate (11) for supplying an abrasive (132) into a gap between the heated plane (34, 34', 42) and the grinding plate (11); anda fixture (20), which is combined to the grinder (10) and has at least one pressure plate (22) for arranging the cooler (30, 30', 40);thereby, the pressure plate (22) pressing and clamping the cooler (30, 30', 40), making the heated plane (34, 34', 42) contact closely to the abrasive (132) characterized in thata fixing frame (15) fixed to the grinder (10) and at least one elastic element (14) arranged between the fixture (20) and the grinder (10) for elastically arranging the fixture (20) to the grinder (10), and the grinder (10) further includes a driving device (21) arranged on the fixing frame (15) and abutted against the fixture (20) for driving the fixture (20) being elevated and lowered elastically to press and clamp the cooler (30, 30', 40) and, corresponding to the grinding plate (11), the fixture (20) is shown as a disk configuration, a circumference of which is divided into equal parts to project out a plurality of pressure plates (22), at a bottom part of each of which at least one pointed bulge (221) is arranged, which presses and clamps the cooler (30, 30', 40), such that the pressure plate (22) can press and clamp the cooler (30, 30', 40) via a point contact manner, and the abrasive (132) includes a grinding liquid (1321) and grinding particles (1322), while the abrasive supply barrel (13) has a nozzle (131).
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT09007778T ATE534489T1 (en) | 2009-06-12 | 2009-06-12 | LAPPING APPARATUS |
EP09007778A EP2260977B1 (en) | 2009-06-12 | 2009-06-12 | Lapping apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP09007778A EP2260977B1 (en) | 2009-06-12 | 2009-06-12 | Lapping apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2260977A1 EP2260977A1 (en) | 2010-12-15 |
EP2260977B1 true EP2260977B1 (en) | 2011-11-23 |
Family
ID=41302734
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP09007778A Not-in-force EP2260977B1 (en) | 2009-06-12 | 2009-06-12 | Lapping apparatus |
Country Status (2)
Country | Link |
---|---|
EP (1) | EP2260977B1 (en) |
AT (1) | ATE534489T1 (en) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06104817B2 (en) * | 1990-10-09 | 1994-12-21 | 日本研磨材工業株式会社 | Alumina-zirconia lap abrasive, method for producing the same, and polishing composition |
JP3982890B2 (en) * | 1997-08-06 | 2007-09-26 | 富士通株式会社 | Polishing apparatus, polishing jig used in the apparatus, and workpiece attaching member to be attached to the polishing jig |
US6435496B1 (en) | 1999-07-23 | 2002-08-20 | Steven E. Phillips | Low-profile rocking lever clamp |
JP2003188320A (en) | 2001-12-17 | 2003-07-04 | Matsushita Electric Ind Co Ltd | Heat sink for electronic component and its manufacturing method |
-
2009
- 2009-06-12 EP EP09007778A patent/EP2260977B1/en not_active Not-in-force
- 2009-06-12 AT AT09007778T patent/ATE534489T1/en active
Also Published As
Publication number | Publication date |
---|---|
ATE534489T1 (en) | 2011-12-15 |
EP2260977A1 (en) | 2010-12-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US8235768B2 (en) | Cooler with ground heated plane and grinding method and apparatus thereof | |
JP5324212B2 (en) | Resin coating method and resin coating apparatus | |
JP4313377B2 (en) | Thermally conductive material and method for producing the same | |
CN204711610U (en) | Engine cylinder cover bores and attacks heating wire hole machined fixture | |
JP5886700B2 (en) | Heat transfer sheet sticking device and heat transfer sheet sticking method | |
JP6335458B2 (en) | How to remove damaged epoxy from an electrostatic chuck | |
EP2260977B1 (en) | Lapping apparatus | |
US7169019B2 (en) | Method of monitoring surface status and life of pad by detecting temperature of polishing interface during chemical mechanical process | |
US10160090B2 (en) | Chemical mechanical polishing method | |
TWI593514B (en) | Grinding tool and method of manufacturing the same | |
KR101455474B1 (en) | Cooler with ground heated plane and grinding method and apparatus thereof | |
US20210305080A1 (en) | Wafer surface processing device | |
CN101905441B (en) | Radiator with ground heating plane, grinding method and device thereof | |
CN219788025U (en) | High-strength wear-resistant horseshoe-shaped resin grinding block | |
TW202121111A (en) | Water cooling head buckle structure | |
KR20160057585A (en) | Device for bonding wafer of wafer flattening apparatus and method for flattening wafer | |
TWI824722B (en) | Focus ring and method for processing semiconductor wafer | |
CN107855431A (en) | Integral electronic radiator pressure riveting device | |
CN216733165U (en) | Lower pressing plate and hot press | |
Ozeki et al. | Optimization of polishing conditions of rectangular substrate | |
CN216859371U (en) | Nano-diamond polishing clamp | |
CN201038143Y (en) | Radiator | |
US20220155049A1 (en) | High power device fault localization via die surface contouring | |
CN117766364A (en) | Focusing ring and semiconductor wafer processing method | |
KR101306170B1 (en) | Method for grinding and scribing cutting wheel |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20100614 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR |
|
AX | Request for extension of the european patent |
Extension state: AL BA RS |
|
17Q | First examination report despatched |
Effective date: 20101119 |
|
GRAP | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOSNIGR1 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: H05K 7/20 20060101ALI20110608BHEP Ipc: B24B 37/04 20060101AFI20110608BHEP |
|
RTI1 | Title (correction) |
Free format text: LAPPING APPARATUS |
|
GRAS | Grant fee paid |
Free format text: ORIGINAL CODE: EPIDOSNIGR3 |
|
GRAA | (expected) grant |
Free format text: ORIGINAL CODE: 0009210 |
|
AK | Designated contracting states |
Kind code of ref document: B1 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR |
|
REG | Reference to a national code |
Ref country code: GB Ref legal event code: FG4D |
|
REG | Reference to a national code |
Ref country code: CH Ref legal event code: EP |
|
REG | Reference to a national code |
Ref country code: IE Ref legal event code: FG4D |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R096 Ref document number: 602009003791 Country of ref document: DE Effective date: 20120202 |
|
REG | Reference to a national code |
Ref country code: NL Ref legal event code: T3 |
|
LTIE | Lt: invalidation of european patent or patent extension |
Effective date: 20111123 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: NO Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20120223 Ref country code: LT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20111123 Ref country code: IS Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20120323 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: LV Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20111123 Ref country code: SI Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20111123 Ref country code: BE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20111123 Ref country code: HR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20111123 Ref country code: GR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20120224 Ref country code: PT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20120323 Ref country code: SE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20111123 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: CY Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20111123 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: CZ Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20111123 Ref country code: BG Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20120223 Ref country code: EE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20111123 Ref country code: DK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20111123 Ref country code: SK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20111123 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: PL Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20111123 Ref country code: RO Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20111123 |
|
REG | Reference to a national code |
Ref country code: AT Ref legal event code: MK05 Ref document number: 534489 Country of ref document: AT Kind code of ref document: T Effective date: 20111123 |
|
PLBE | No opposition filed within time limit |
Free format text: ORIGINAL CODE: 0009261 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT |
|
26N | No opposition filed |
Effective date: 20120824 |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R097 Ref document number: 602009003791 Country of ref document: DE Effective date: 20120824 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: MC Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20120630 Ref country code: AT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20111123 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: MK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20111123 |
|
REG | Reference to a national code |
Ref country code: IE Ref legal event code: MM4A |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: ES Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20120305 Ref country code: IE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20120612 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: FI Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20111123 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: MT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20111123 |
|
REG | Reference to a national code |
Ref country code: CH Ref legal event code: PL |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: TR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20111123 Ref country code: CH Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20130630 Ref country code: LI Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20130630 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: LU Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20120612 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: HU Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20090612 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: IT Payment date: 20140611 Year of fee payment: 6 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: NL Payment date: 20140610 Year of fee payment: 6 |
|
REG | Reference to a national code |
Ref country code: FR Ref legal event code: PLFP Year of fee payment: 7 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: DE Payment date: 20150609 Year of fee payment: 7 Ref country code: GB Payment date: 20150610 Year of fee payment: 7 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: FR Payment date: 20150608 Year of fee payment: 7 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: IT Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20150612 |
|
REG | Reference to a national code |
Ref country code: NL Ref legal event code: MM Effective date: 20150701 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: NL Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20150701 |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R119 Ref document number: 602009003791 Country of ref document: DE |
|
GBPC | Gb: european patent ceased through non-payment of renewal fee |
Effective date: 20160612 |
|
REG | Reference to a national code |
Ref country code: FR Ref legal event code: ST Effective date: 20170228 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: DE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20170103 Ref country code: FR Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20160630 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: GB Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20160612 |