EP2146069A1 - Heat-receiving member and exhaust pipe heat-releasing system - Google Patents
Heat-receiving member and exhaust pipe heat-releasing system Download PDFInfo
- Publication number
- EP2146069A1 EP2146069A1 EP09162273A EP09162273A EP2146069A1 EP 2146069 A1 EP2146069 A1 EP 2146069A1 EP 09162273 A EP09162273 A EP 09162273A EP 09162273 A EP09162273 A EP 09162273A EP 2146069 A1 EP2146069 A1 EP 2146069A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- heat
- receiving member
- region
- base
- emissivity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003578 releasing effect Effects 0.000 title claims description 45
- 239000002344 surface layer Substances 0.000 claims abstract description 141
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 33
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 32
- 238000007743 anodising Methods 0.000 claims abstract description 21
- 229910000838 Al alloy Inorganic materials 0.000 claims abstract description 10
- 239000002345 surface coating layer Substances 0.000 claims description 39
- 230000002093 peripheral effect Effects 0.000 claims description 33
- 229910052751 metal Inorganic materials 0.000 claims description 32
- 239000002184 metal Substances 0.000 claims description 32
- 239000011230 binding agent Substances 0.000 claims description 18
- 239000002182 crystalline inorganic material Substances 0.000 claims description 15
- 230000005855 radiation Effects 0.000 abstract description 31
- 238000012546 transfer Methods 0.000 abstract description 18
- 239000002585 base Substances 0.000 description 171
- 238000002048 anodisation reaction Methods 0.000 description 41
- 238000000034 method Methods 0.000 description 38
- 238000004040 coloring Methods 0.000 description 28
- 230000000873 masking effect Effects 0.000 description 24
- 230000000694 effects Effects 0.000 description 20
- 230000008646 thermal stress Effects 0.000 description 19
- 230000007423 decrease Effects 0.000 description 17
- 239000012212 insulator Substances 0.000 description 17
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- 238000011156 evaluation Methods 0.000 description 13
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- 239000003054 catalyst Substances 0.000 description 8
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- 238000000576 coating method Methods 0.000 description 8
- 238000005259 measurement Methods 0.000 description 8
- 229910052759 nickel Inorganic materials 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- MWUXSHHQAYIFBG-UHFFFAOYSA-N Nitric oxide Chemical compound O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 6
- 238000013329 compounding Methods 0.000 description 6
- 230000005611 electricity Effects 0.000 description 6
- 230000006872 improvement Effects 0.000 description 6
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- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
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- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 2
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- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 229910052788 barium Inorganic materials 0.000 description 2
- 238000009529 body temperature measurement Methods 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical class OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 2
- 229910002091 carbon monoxide Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000000446 fuel Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 2
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- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
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- 229910052723 transition metal Inorganic materials 0.000 description 2
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- LWIHDJKSTIGBAC-UHFFFAOYSA-K tripotassium phosphate Chemical compound [K+].[K+].[K+].[O-]P([O-])([O-])=O LWIHDJKSTIGBAC-UHFFFAOYSA-K 0.000 description 2
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 1
- IVORCBKUUYGUOL-UHFFFAOYSA-N 1-ethynyl-2,4-dimethoxybenzene Chemical compound COC1=CC=C(C#C)C(OC)=C1 IVORCBKUUYGUOL-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- WXHLLJAMBQLULT-UHFFFAOYSA-N 2-[[6-[4-(2-hydroxyethyl)piperazin-1-yl]-2-methylpyrimidin-4-yl]amino]-n-(2-methyl-6-sulfanylphenyl)-1,3-thiazole-5-carboxamide;hydrate Chemical compound O.C=1C(N2CCN(CCO)CC2)=NC(C)=NC=1NC(S1)=NC=C1C(=O)NC1=C(C)C=CC=C1S WXHLLJAMBQLULT-UHFFFAOYSA-N 0.000 description 1
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- 229910018461 Al—Mn Inorganic materials 0.000 description 1
- 229910018571 Al—Zn—Mg Inorganic materials 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
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- 229910017818 Cu—Mg Inorganic materials 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229910001374 Invar Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
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- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 238000000498 ball milling Methods 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
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- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
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- 229910000428 cobalt oxide Inorganic materials 0.000 description 1
- IVMYJDGYRUAWML-UHFFFAOYSA-N cobalt(ii) oxide Chemical compound [Co]=O IVMYJDGYRUAWML-UHFFFAOYSA-N 0.000 description 1
- 239000000567 combustion gas Substances 0.000 description 1
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- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
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- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 description 1
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- DHRLEVQXOMLTIM-UHFFFAOYSA-N phosphoric acid;trioxomolybdenum Chemical compound O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.OP(O)(O)=O DHRLEVQXOMLTIM-UHFFFAOYSA-N 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 235000011118 potassium hydroxide Nutrition 0.000 description 1
- 229910000160 potassium phosphate Inorganic materials 0.000 description 1
- 235000011009 potassium phosphates Nutrition 0.000 description 1
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- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 150000003754 zirconium Chemical class 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
- F01N—GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR MACHINES OR ENGINES IN GENERAL; GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR INTERNAL COMBUSTION ENGINES
- F01N13/00—Exhaust or silencing apparatus characterised by constructional features ; Exhaust or silencing apparatus, or parts thereof, having pertinent characteristics not provided for in, or of interest apart from, groups F01N1/00 - F01N5/00, F01N9/00, F01N11/00
- F01N13/08—Other arrangements or adaptations of exhaust conduits
- F01N13/10—Other arrangements or adaptations of exhaust conduits of exhaust manifolds
- F01N13/102—Other arrangements or adaptations of exhaust conduits of exhaust manifolds having thermal insulation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/022—Anodisation on selected surface areas
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/024—Anodisation under pulsed or modulated current or potential
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
- C25D11/18—After-treatment, e.g. pore-sealing
- C25D11/20—Electrolytic after-treatment
- C25D11/22—Electrolytic after-treatment for colouring layers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
- F01N—GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR MACHINES OR ENGINES IN GENERAL; GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR INTERNAL COMBUSTION ENGINES
- F01N13/00—Exhaust or silencing apparatus characterised by constructional features ; Exhaust or silencing apparatus, or parts thereof, having pertinent characteristics not provided for in, or of interest apart from, groups F01N1/00 - F01N5/00, F01N9/00, F01N11/00
- F01N13/08—Other arrangements or adaptations of exhaust conduits
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
- F01N—GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR MACHINES OR ENGINES IN GENERAL; GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR INTERNAL COMBUSTION ENGINES
- F01N2530/00—Selection of materials for tubes, chambers or housings
- F01N2530/06—Aluminium or alloys thereof
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
- F01N—GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR MACHINES OR ENGINES IN GENERAL; GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR INTERNAL COMBUSTION ENGINES
- F01N2530/00—Selection of materials for tubes, chambers or housings
- F01N2530/26—Multi-layered walls
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2245/00—Coatings; Surface treatments
- F28F2245/06—Coatings; Surface treatments having particular radiating, reflecting or absorbing features, e.g. for improving heat transfer by radiation
Definitions
- the present invention relates to a heat-receiving member and an exhaust pipe heat-releasing system.
- An exhaust pipe connected to a vehicle engine becomes significantly hot in driving operation because combustion gases (exhaust gases) flow therethrough.
- fuel is increased so as to avoid a rise in temperature of exhaust gases.
- a problem arises that the fuel efficiency is lowered and the concentration of exhaust gases is raised, so that the discharge amount of contaminants is increased.
- the temperature of the exhaust pipe is raised by a flow of exhaust gases, it causes heat degradation of the exhaust pipe.
- a catalyst for converting exhaust gases discharged from a vehicle engine.
- a three-way catalyst can convert contaminants such as hydrocarbon (HC), carbon monoxide (CO), and nitrogen oxide (NOx) which are contained in exhaust gases.
- HC hydrocarbon
- CO carbon monoxide
- NOx nitrogen oxide
- Patent Document 1 discloses a heat insulator that can appropriately cool an exhaust pipe connected to a vehicle engine.
- Fig. 1 is an exploded perspective view which illustrates a vehicle engine and a vicinity of an exhaust pipe connected to the vehicle engine.
- "110" indicates an engine and a cylinder head 117 is mounted on a top of a cylinder block 116 of the vehicle engine 110.
- an exhaust manifold 111 which contains cast iron with high heat resistance, is attached on one side face of the cylinder head 117.
- the exhaust manifold 111 has a function of gathering exhaust gases from respective cylinders and transferring the exhaust gases to a not-shown catalyst converter and the like. That is, the exhaust manifold 111 functions as an exhaust pipe through which exhaust gases from the engine flow. Part of the outer peripheral face of the exhaust manifold 111 is covered with a heat insulator 118. The heat insulator 118 is arranged over the outer peripheral face of the exhaust manifold 111 with a predetermined space therebetween.
- Patent Document 1 sets the emissivity of the heat insulator to be more than the emissivity of the exhaust manifold. Patent Document 1 describes that setting the relationships of the emissivities as such increases the amount of radiation heat transferred between the exhaust manifold and the heat insulator, and thus improves the cooling ability of the exhaust manifold.
- Patent Document 1 also describes that a black, heat-resistant coating is applied to the heat insulator that is made of cast iron so as to improve the emissivity of the heat insulator.
- the inventors of the present invention studied a method of applying to aluminum a black, heat-resistant coating which is similar to the coating disclosed in Patent Document 1 so as to increase the emissivity of aluminum.
- sufficient adhesion was not obtained between aluminum and the heat-resistant coating, and the heat-resistant coating peeled off from aluminum.
- the inventors were not able to increase the emissivity of aluminum by this method.
- the present invention was made in view of the above problem, and an object thereof is to provide a heat-receiving member which demonstrates excellent performance in receiving, by radiation heat transfer, heat energy that is released from a heat source such as an exhaust pipe; and an exhaust pipe heat-releasing system that can prevent the temperature of the exhaust pipe from rising too high.
- a heat-receiving member receives heat energy released from a heat source, and comprises: a base that contains aluminum or an aluminum alloy; and a surface layer that is formed by anodizing a surface of the base.
- the heat-receiving member according to claim 1 has the surface layer formed by anodizing the surface of the base that contains aluminum or an aluminum alloy.
- the emissivity of the surface layer formed by anodizing the surface of aluminum is higher than the emissivity of aluminum.
- High emissivity of the surface of the surface layer allows the surface layer to receive by radiation heat transfer a large amount of heat released from the heat source, when the heat-receiving member of the present invention is arranged with the surface layer thereof facing the heat source such as an exhaust pipe. That is, the heat-receiving member of the present invention is excellent at receiving, by radiation heat transfer, heat released from a heat source. Further, use of such a heat-receiving member makes it possible to promote heat release from the heat source.
- the interface between aluminum and a surface layer formed by anodization is chemically stable and the adhesion between aluminum and the surface layer is strong. Therefore, the surface layer does not peel off from aluminum.
- the heat-receiving member has a first region and a second region, the first region is located farther from a high-temperature part of the heat source than the second region, and the first region has emissivity higher than emissivity of the second region.
- the first region herein also means a region far from the high-temperature part of the heat source.
- the second region herein means another region or a region close to the high-temperature part of the heat source.
- the region having higher emissivity than the another region in the heat-receiving member according to claim 2 receives a large amount of heat per unit area because the region easily receives heat by radiation heat transfer.
- the region having higher emissivity than the another region is thus a region in which the temperature tends to rise due to heat reception. Accordingly, placing the region having higher emissivity than the another region at a location far from the high-temperature part of the adjacent heat source makes it more likely for the temperature of the heat-receiving member to rise even if the region is located far from the high-temperature part of the heat source; hence, generation of a low-temperature region inside the heat-receiving member can be prevented. That is, generation of a temperature difference inside the heat-receiving member can be prevented. Further, generation of thermal stress and distortion in the heat-receiving member can be prevented.
- a micropore is formed in the surface layer in the first region, and a metal is deposited in the micropore.
- Deposition of a metal in the micropore in the surface layer makes it possible to increase the emissivity of the region. That is, placing the region with a metal deposited in the micropore formed in the surface layer thereof at a location far from the high-temperature part of the heat source makes it possible to more effectively prevent generation of a low-temperature region inside the heat-receiving member.
- the second region includes a region in which the surface of the base is unanodized and exposed.
- the emissivity of the region with the surface of the base exposed thereon is low. Placing the region with the surface of the base exposed thereon at a location close to the high-temperature part of the heat source makes it possible to prevent the temperature of the heat-receiving member from rising too high even if the region is located close to the high-temperature part of the heat source; hence, generation of a high-temperature region inside the heat-receiving member can be prevented. That is, generation of a temperature difference inside the heat-receiving member can be prevented.
- a plurality of cracks are formed in the surface layer.
- a coefficient of thermal expansion of the surface layer formed by anodization is different from a coefficient of thermal expansion of aluminum or an aluminum alloy used as the base.
- a rise in the temperature of the heat-receiving member leads to application of thermal stress between the base and the surface layer.
- the thermal stress applied between the base and the surface layer is large or the thickness of the base is small, a fissure might be generated in the base (the base might split).
- the cracks are separated from each other.
- the cracks separated from each other absorb the thermal stress and grow upon application of the thermal stress to the surface layer. As a result, generation of a fissure in the base is effectively prevented. Further, the continuous surface layer increases the rigidity and thus makes it easier for the heat-receiving member to maintain the shape.
- At least one of the cracks has a zigzag shape.
- the cracks each have a zigzag shape, resistance to the force applied in a direction parallel to the cracks is generated. Hence, generation of a fissure in the base can be more effectively prevented.
- a surface layer is also formed on a surface on the reverse side of the surface of the base.
- surface layers are formed by anodizing both respective surfaces of the heat-receiving member, and therefore the emissivity of the both surfaces of the heat-receiving member becomes high. Then, the heat-receiving member can receive much heat on one surface and release much heat from the other surface. Accordingly, the temperature of the heat-receiving member tends not to rise, whereby the thermal stress to be generated in the heat-receiving member can be reduced. The lower the temperature of the heat-receiving member, the larger the amount of heat that the heat-receiving member can receive. For this reason, the temperature of the heat-receiving member is prevented from easily rising even when the heat-receiving member has received heat, and thus the heat-receiving member of the present invention can demonstrate better performance in receiving heat by radiation heat transfer.
- An exhaust pipe heat-releasing system comprises: an exhaust pipe including a cylindrical base that contains a metal; and a heat-receiving member arranged over the exhaust pipe, the heat-receiving member being a heat-receiving member according to any one of claims 1 to 8.
- the heat-receiving member of the present invention demonstrates excellent performance in receiving heat by radiation heat transfer. Hence, such a heat-receiving member arranged over the exhaust pipe can receive much radiation heat from the outer peripheral face of the exhaust pipe when the temperature of the exhaust pipe is increased by high-temperature exhaust gasses flowing through the exhaust pipe. Therefore, it is possible to prevent the temperature of the exhaust pipe from rising too high.
- the exhaust pipe heat-releasing system according to claim 10 is provided with a surface-coating layer that is formed on the outer peripheral face of the base included in the exhaust pipe, and that contains a crystalline inorganic material and an amorphous binder. Since provision of the surface-coating layer that contains a crystalline inorganic material and an amorphous binder leads to an increase in the emissivity of the outer peripheral face of the exhaust pipe, the amount of radiation heat from the outer peripheral face of the exhaust pipe is increased.
- the radiation heat from the outer peripheral face of the exhaust pipe is received by the heat-receiving member of the present invention which demonstrates excellent performance in receiving heat. That is, improvement in the amount of radiation heat from the outer peripheral face of the exhaust pipe is combined with improvement in the amount of heat received by the heat-receiving member. As a result, it is possible to more effectively prevent the temperature of the exhaust pipe from rising too high.
- the exhaust pipe has an emissivity of 0.78 or more.
- the emissivity falling in such a range leads to improvement in the amount of radiation heat from the outer peripheral face of the exhaust pipe, thereby even more effectively preventing the temperature of the exhaust pipe from rising too high.
- FIG. 2 is a cross-sectional view schematically illustrating an exemplary heat-receiving member of the present invention.
- a heat-receiving member 1 illustrated in Fig. 2 includes a base 20 that contains aluminum or an aluminum alloy, and a surface layer 30 formed by anodizing the surface of the base 20.
- the surface layer formed by anodizing the base has emissivity higher than the emissivity of aluminum.
- the emissivity (infrared emissivity) at a wavelength of 3 to 30 ⁇ m is, for example, 0.7 or more.
- the infrared emissivity can be measured by a radiometer (for example, an AERD produced by Kyoto Electronics Manufacturing Co., Ltd.).
- the kind of aluminum or an aluminum alloy to be used as the base is not particularly limited so long as it can be anodized.
- pure aluminum 1000 series
- Al-Cu-Mg alloys 2000 series
- Al-Mn alloys 3000 series
- Al-Si alloys 4000 series
- Al-Mg alloys 5000 series
- Al-Mg-Si alloys 6000 series
- Al-Zn-Mg alloys 7000 series
- the shape of the base is not particularly limited, and can be, for example, a plate such as a flat plate, a curved plate, and a flexed plate.
- the shape can be set to any shape according to the shape of the place in which the heat-receiving member is to be used.
- the base may be formed by laminating a plurality of bases.
- the thickness of the base is not particularly limited either, and can be set to any thickness according to the amount of heat to be received by the heat-receiving member and the expected operating temperature of the heat-receiving member.
- the thickness of the base to be used in production of the heat-receiving member is desirably from 0.1 to 1.5 mm, more desirably from 0.3 to 1.0 mm, and even more desirably from 0.4 to 0.8 mm.
- a thickness of less than 0.1 mm of the base may lead to insufficient strength.
- a thickness of more than 1.5 mm may lead to application of large compressive strain and large tensile strain to the surface layer upon deformation of the base.
- the thickness of the base is the sum of thicknesses of the laminated bases.
- the thickness of the base is different before and after the anodization.
- the surface of the base is taken as the reference position.
- an oxide film with a thickness of ⁇ Z is formed on the upper side of the reference position by anodization
- an oxide film with a thickness of ⁇ Z is to be simultaneously formed on the under side of the reference position by anodization, and thus the thickness of the base is to be decreased by ⁇ Z.
- the thickness of the base used in production of the heat-receiving member can be presumed to be a thickness ( ⁇ Z + T).
- the thickness ( ⁇ Z + T) is obtained by measuring the thickness (2 ⁇ ⁇ Z) of the surface layer and the thickness (T) of the base in the heat-receiving member after the anodization, and by adding a half of the thickness of the surface layer, which is ( ⁇ Z), to the measured thickness (T) of the base.
- the surface layer is formed by anodizing the base, that is, by passing an electric current through an electrolytic bath with the base serving as the anode.
- the thickness of the surface layer is desirably from 5 to 25 ⁇ m. A thickness of less than 5 ⁇ m of the surface layer may decrease the emissivity. On the other hand, a thickness of more than 25 ⁇ m of the surface layer may increase the rigidity of the surface layer and thus increase the thermal stress applied to the adjacent base, thereby tending to generate a fissure in the base.
- a thickness of more than 25 ⁇ m of the surface layer makes it difficult to perform electrolytic coloring. Further, a thickness of more than 25 ⁇ m of the surface layer is inefficient because it requires a longer time for anodization but does not lead to achievement of much effect of improving the emissivity.
- the thickness of the base and the thickness of the surface layer can be measured by observing the cross-section of the heat-receiving member with a SEM or the like.
- the electrolytic bath includes an acidic bath, an alkaline bath, and a bath of a non-aqueous solution such as a formamide series and a boric acid series.
- the acidic bath includes a bath of an aqueous solution in which one kind or two kinds or more of the following is/are dissolved: sulfuric acid, phosphoric acid, chromic acid, oxalic acid, sulfosalicylic acid, pyrophoric acid, sulfamic acid, phosphomolybdic acid, boric acid, malonic acid, succinic acid, maleic acid, citrate, tartaric acid, phthalic acid, itaconic acid, malic acid, glycolic acid, and the like.
- the alkaline bath includes a bath of an aqueous solution in which one kind or two kinds or more of the following is/are dissolved: sodium hydroxide, potassium hydroxide, sodium carbonate, potassium phosphate, ammonia water, and the like.
- the current waveform at the time of electrolysis includes waveforms of direct current (DC), alternate current (AC), a superposition of AC and DC, a combination of AC and DC, an imperfectly-rectified wave, a pulse wave, a rectangle wave, or the like.
- the electrolytic method includes a constant current method; a constant voltage method; a constant power method; a high-speed anodizing method based on a continuous current, an intermittent current, or current recovery; and the like.
- the heat-receiving member of the present embodiment may have a micropore formed in the surface layer.
- Fig. 3 is a cross-sectional view schematically illustrating an exemplary heat-receiving member of the present invention.
- a heat-receiving member 2 illustrated in Fig. 3 has a large number of micropores 40 formed in the surface layer 30.
- the micropores 40 are generated in the surface layer 30 when the thickness of the surface layer 30 formed by anodization becomes 10 to 20 nm. Further, as the anodization is continued on, the thickness of the surface layer 30 is increased and the depth of the micropores 40 is increased, whereby the plurality of deep micropores 40 are formed in the surface layer 30.
- the heat-receiving member of the present embodiment may have a metal deposited in the micropores.
- Fig. 4 is a cross-sectional view schematically illustrating an exemplary heat-receiving member of the present invention.
- a heat-receiving member 3 illustrated in Fig. 4 has a metal 50 precipitated and deposited in the micropores 40 illustrated in Fig. 3 by electrolytic coloring. Deposition of a metal in the micropores by electrolytic coloring further increases the emissivity of the surface layer.
- the metal to be deposited in the micropores include metals such as Ni, Cu, Co, Pd, Sn, Pb, and Cd.
- a particularly desirable metal among these is Ni or Co because they can increase the emissivity of the surface layer. Further, since use of Ni makes it easy to block the pore, Ni is more desirable.
- Examples of a method of depositing a metal in the micropores include a method of passing an electric current through an electrolytic bath, which includes a metal, with the surface layer formed by anodization serving as the cathode, and the like.
- the kind of electrolytic bath to be used to deposit a metal is not particularly limited.
- an electrolytic bath containing nickel sulfate can be used.
- silicate or zirconium hydroxide may be deposited in the micropores by alternately immersing a heat-receiving member in acid or alkali and in a silicate aqueous solution or zirconium salt bath.
- the micropores formed in the surface layer may be blocked by a general method such as a method of immersing a heat-receiving member in boiling water, a method of immersing a heat-receiving member in hot water that contains a metal salt, or the like.
- FIG. 5 is a cross-sectional view schematically illustrating an exemplary exhaust pipe heat-releasing system of the present invention.
- An exhaust pipe heat-releasing system 100 illustrated in Fig. 5 includes an exhaust pipe 101 having a cylindrical base 102 that contains a metal, and the heat-receiving member 1 of the present invention arranged over the exhaust pipe 101.
- the heat-receiving member 1 is arranged such that the surface layer 30 formed by anodizing the surface of the base 20 faces the outer peripheral face of the exhaust pipe 101.
- the heat transferred from the outer peripheral face of the exhaust pipe 101 to the surface layer 30 of the heat-receiving member 1 is schematically shown by arrows.
- the exhaust pipe 101 is a member that is connected to an internal combustion engine such as an engine and that allows high-temperature exhaust gases to flow therethrough.
- Examples of the material of a base 102 that forms the exhaust pipe 101 include metals such as stainless steel, steel, iron, and copper, and nickel-based alloys such as Inconel, Hastelloy, and Invar. These metal materials have high heat conductivity, and therefore can contribute to improvement in heat-releasing properties of the exhaust pipe 101.
- these metal materials have high heat resistance, and thus can be suitably used in high-temperature conditions.
- the exhaust pipe is allowed to have excellent resistance to thermal shock, excellent processability, excellent mechanical properties, and the like.
- the shape of the base 102 is not particularly limited as long as it is a cylindrical shape.
- the cross-sectional shape thereof may be a circular shape, or may be any other shape such as an elliptical shape and a polygonal shape.
- the heat-receiving member 1 has the surface layer 30 with high emissivity, as described above. Hence, the heat-receiving member 1 can receive on the surface of the surface layer 30 much heat that is radiated from the outer peripheral surface of the exhaust pipe 101 upon an increase of the temperature of the exhaust pipe 101.
- the shape of the heat-receiving member is not particularly limited as long as it does not disturb arrangement of the heat-receiving member over the exhaust pipe included in the exhaust pipe heat-releasing system.
- a shape may be acceptable for example in the case where the heat-receiving member of the present invention corresponds to the heat insulator illustrated in Fig. 1 and the surface of the surface layer of the heat-receiving member faces the outer peripheral face of the exhaust pipe.
- a heat-receiving member to be used in the exhaust pipe heat-releasing system of the present invention is not limited to the heat-receiving member 1 illustrated in Fig. 2 , and any heat-receiving member of the present invention described herein may be used.
- the heat-receiving member of the present embodiment has a surface layer formed by anodizing a surface of a base that contains aluminum or an aluminum alloy.
- the emissivity of the surface of the surface layer formed by anodization is higher than the emissivity of aluminum.
- the heat-receiving member of the present embodiment arranged with the surface layer thereof facing the heat source such as an exhaust pipe, can receive by radiation heat transfer a large amount of heat released from the heat source. That is, the heat-receiving member of the present embodiment demonstrates excellent performance in receiving, by radiation heat transfer, heat released from a heat source. Further, use of such a heat-receiving member makes it possible to promote heat release from the heat source.
- the heat-receiving members of the present embodiment may have micropores in the surface layer thereof, and a metal may be deposited in the micropores.
- a metal When a metal is deposited in the micropores in the surface layer, the emissivity of that region can be more increased.
- the exhaust pipe heat-releasing system of the present embodiment includes an exhaust pipe having a cylindrical base that contains a metal, and a heat-receiving member of the present invention arranged over the exhaust pipe.
- the heat-receiving member of the present invention demonstrates excellent performance in receiving heat by radiation heat transfer.
- Such a heat-receiving member arranged over the exhaust pipe can receive much radiation heat from the outer peripheral surface of the exhaust pipe when the temperature of the exhaust pipe is increased by high-temperature gasses flowing therethrough. Thus, it is possible to prevent the temperature of the exhaust pipe from rising too high.
- the electrolytic bath used was a sulfuric acid bath with a concentration of 200 g/L, and the electrolyte temperature was set to 15°C.
- the electrolytic method used was a multistep electrolytic method in which a low voltage (20 V) was applied in the first half of the process and a high voltage (40 V) was applied in the second half of the process. Thereafter, the plate was washed to remove the electrolytic solution. Part of the heat-receiving member after anodization was cut and the thickness of the surface layer formed by anodization was measured at five locations by SEM. The thicknesses thereof were in the range of 15 to 20 ⁇ m. Also, micropores were formed in the surface layer.
- the surface layer of the heat-receiving member produced in Example 1 was then electrolytically colored, that is, nickel was deposited in the micropores in the surface layer.
- the electrolytic bath used was a nickel sulfate bath.
- the electrolytic bath had a pH of within the range of 4 to 6, and a temperature of within the range of 5 to 30°C.
- the electrolytic treatment was performed by an alternate current of 5 to 60 V, with the surface layer of the heat-receiving member serving as the cathode and with a carbon rod serving as the anode.
- blocking of the micropores was performed by immersing the heat-receiving member in deionized water and boiling the water for 15 minutes.
- Heat-receiving members were produced by performing anodization, electrolytic coloring, and blocking in the same way as in Example 2 except that the thicknesses of the respective bases were set to 1.0, 2.0, and 5.0 mm.
- a base made of the same aluminum as in Example 1 without anodization and electrolytic coloring performed thereon was used as the heat-receiving member.
- the emissivity of the base before anodization, the emissivity of the surface layer of the heat-receiving member after anodization, and the emissivity of the surface layer of the heat-receiving member after electrolytic coloring were each measured by a radiometer (AERD produced by Kyoto Electronics Manufacturing Co., Ltd., wavelength: 3 to 30 ⁇ m).
- FIG. 6 is a cross-sectional view schematically illustrating a method of measuring heat-receiving performance of the heat-receiving member.
- a heat-receiving performance measuring machine 200 illustrated in Fig. 6 includes a heater 201 that is surrounded by a heat insulating material 202.
- the heater 201 is connected to a not-shown power source through a power source cable 203, and the temperature of the heater 201 can be increased by turning the power on.
- the upper face of the heat-receiving performance measuring machine 200 is open so that putting the heat-receiving member 1, the effect of which is to be measured, on the open face forms a closed space around the heater 201.
- the length shown by an arrow A in Fig. 6 indicates the long side (150 mm) of the heat-receiving member 1, and the length shown by an arrow B indicates the width (120 mm) of the closed space.
- the heat-receiving member 1 was placed on the upper face of the heat-receiving performance measuring machine 200 with the surface layer 30 facing the heater 201 side, and then the heater 201 was powered on. Next, the amount of electricity was adjusted so that the amounts of the radiation heat and the input electricity would be equal when the temperature of the heater was 500°C, and the amount of electricity at this time was recorded. The recorded amount of electricity was set to be the amount of heat received by the heat-receiving member. It should be noted that the heat-receiving member of Comparative Example 1, which has no surface layer formed therein, was placed with the surface of the base facing the heater side.
- the temperature of the heat-receiving member was measured at five locations when the amounts of the radiation heat and the input electricity were equalized with the temperature of the heater being 500°C.
- the measuring locations were the points shown by arrows C, D, E, F, and G, which were set by dividing at 30 mm intervals the width of 120 mm shown by the arrow B in Fig. 6 .
- the measuring locations are aligned at the midpoint (35 mm) of the short side (70 mm) of the heat-receiving member, and therefore the location E in Fig. 6 corresponds to the center of the heat-receiving member.
- the largest value and the smallest value among the temperatures measured at the five locations were derived, and then a value resulting from "the largest value - the smallest value" was used as an index that shows the variation of the temperature distribution inside the heat-receiving member.
- the heat-receiving members produced in the respective Examples and Comparative Example were tested by 500 cycles of a temperature cycle test in which a cycle of heating up to 250°C and cooling down to 25°C by water immersion was repeated. Then, the base after the temperature cycle test was visually observed to see whether a fissure was generated therein.
- Table 1 shows the temperatures of the location E in Fig. 6 .
- the temperature was highest at the location E, namely at the center of the heat-receiving member.
- a heat-receiving member with a very small fissure generated therein is shown as "+”
- a heat-receiving member with a large fissure generated therein is shown as "-”.
- the emissivity of the surface layer formed by anodization in Example 1 was considerably higher than the emissivity of the unanodized base in Comparative Example 1. Further, the amount of heat received by the heat-receiving member in Example 1 was larger than the amount of heat received by the heat-receiving member in Comparative Example 1. Since the amount of electricity, which was measured as the amount of heat received, is equal to the amount of radiation heat from the heater as the heat source, the heat release from the heat source was found to be accelerated by use of a heat-receiving member with high emissivity as in Example 1.
- electrolytic coloring as in Example 2 made it possible to further increase the emissivity of the heat-receiving member, and in this case, the amount of heat received was further increased.
- Example 2 and Examples 3 to 5 were compared to find out the effect of thickness of the base.
- the emissivity of the surface of the heat-receiving member with a surface layer formed thereon was 0.814.
- the highest temperature was observed at the location E in every Example, and when the thickness of the base was increased to 2.0 mm or to 5.0 mm, the highest temperature was decreased according to the increase thereof. Further, when the thickness of the base was increased to 2.0 mm or to 5.0 mm, the temperature difference between the highest temperature and the lowest temperature was decreased according to the increase of the thickness of the base.
- the reason for a decrease in the temperature difference according to the increase of the thickness of the base has not been revealed. However, the reason is considered to be that the amount of heat transferred within the base by heat conduction is increased when the thickness of the base is large, and that the temperatures within the heat-receiving member thus tend to be equalized.
- the amount of distortion in the heat-receiving member was decreased according to the increase of the thickness of the base. This is presumably because a large thickness of the base enhances the strength of the base and thereby tends not to generate a deformation of the base due to the thermal stress.
- a second embodiment which is one embodiment of the heat-receiving member of the present invention, is described with reference to the drawings.
- the emissivity of one region far from the high-temperature part of the heat source is higher than the emissivity of another region.
- Fig. 7 is a cross-sectional view schematically illustrating an exemplary heat-receiving member of the present invention.
- a heat-receiving member 4 illustrated in Fig. 7 has the surface layer 30 that is formed by anodizing the surface of the base 20, and the surface layer 30 has a large number of the micropores 40 formed therein.
- Part of one region in the surface layer 30 is electrolytically colored, and thus the micropores 40 in the region have the metal 50 deposited therein.
- Another region in the surface layer 30 is not electrolytically colored, and thus the micropores 40 in these regions do not have the metal 50 deposited therein.
- the region on which electrolytic coloring was performed (high-emissivity region) has emissivity higher than the emissivity of the region on which electrolytic coloring was not performed, and the region on which electrolytic coloring was not performed (low-emissivity region) has emissivity lower than the emissivity of the region on which electrolytic coloring was performed.
- Examples of the method of producing the heat-receiving member 4 include a method in which, after the surface layer has been formed by anodization in the same way as in the method of producing the heat-receiving member in the first embodiment, the region not to be electrolytically colored is masked at the time of the electrolytic coloring.
- the masking can be carried out by a method such as sticking a masking tape on the region. As a result, the masking allows the unmasked region to be a high-emissivity region, and allows the masked region to be a low-emissivity region.
- Fig. 8 is a cross-sectional view schematically illustrating an exemplary heat-receiving member of the present invention.
- a heat-receiving member 5 illustrated in Fig. 8 has the surface layer 30 formed by anodizing a part of the base 20. Another part of the base 20 is unanodized, and thus the surface of the base 20 is exposed.
- the region with the surface layer 30 formed therein by anodization has emissivity higher than that of the region with the surface of the base 20 exposed thereon.
- the region with the surface of the base 20 exposed thereon has emissivity lower than that of the region with the surface layer 30 formed therein.
- the region with the surface of the base exposed thereon is arranged at a location close to the high-temperature part of the heat source.
- Examples of the method of producing the heat-receiving member 5 include a method in which a region not to be anodized is masked and then anodized upon production of a heat-receiving member in the first embodiment.
- the masking can be carried out by a method such as sticking a masking tape on the region.
- the masking allows the unmasked region to be a high-emissivity region, and allows the masked region to be a low-emissivity region.
- Fig. 9 is a cross-sectional view schematically illustrating an exemplary heat-receiving member of the present invention.
- a heat-receiving member 6 illustrated in Fig. 9 has the surface layer 30 formed by anodizing a part of the base 20. Further, the surface layer 30 is electrolytically colored, and thus the micropores 40 have the metal 50 deposited therein. Another part of the base 20 is not anodized and thus the surface of the base 20 is exposed.
- the anodized and electrolytically colored region (high-emissivity region) has emissivity higher than that of the region with the surface of the base 20 exposed thereon.
- the region with the surface of the base 20 exposed thereon (low-emissivity region) has emissivity lower than that of the anodized and electrolytically colored region.
- the difference in the emissivity between the high-emissivity region and the low-emissivity region is larger than the difference in the emissivity between the high-emissivity region and the low-emissivity region in the heat-receiving member 4 and the heat-receiving member 5.
- Examples of the method of producing the heat-receiving member 6 include a method in which a region not to be anodized is masked before anodization, and with the region being masked, the micropores are formed and the surface layer is then electrolytically colored. More specifically, further anodizing the produced heat-receiving member 5 so as to form micropores in the surface layer and then further electrolytically coloring the surface layer results in production of the heat-receiving member 6.
- the size of the region with emissivity lower than that of the another region is desirably from 5 to 95% of the total surface area. Further, the size of the area with emissivity lower than that of the another region is desirably larger than a size of 10 mm ⁇ 10 mm when the shape of the region is rectangular. Also, the difference in the emissivity between the high-emissivity region and the low-emissivity region is desirably from 0.01 to 0.90. Furthermore, a ratio (Y / X) of a length (Y) of the short side of the region with emissivity lower than that of the another region to a thickness (X) of the base is desirably 2 or more.
- the heat-receiving member of the present embodiment there is a region with emissivity higher than that of another region. Since the region having higher emissivity than emissivity of the another region is more likely to receive heat by radiation heat transfer, the amount of heat to be received per unit area is large. The region having higher emissivity than that of the another region is thus a region in which the temperature tends to rise due to reception of heat.
- placing the region having higher emissivity than the another region at a location far from the high-temperature part of the adjacent heat source makes it more likely for the temperature of the heat-receiving member to rise even if the region is located far from the high-temperature part of the heat source; hence, generation of a low-temperature region inside the heat-receiving member can be prevented. That is, generation of a temperature difference inside the heat-receiving member can be prevented. Further, generation of thermal stress and distortion in the heat-receiving member can be prevented.
- micropores may be formed in the surface layer in the region far from the high-temperature part of the heat source, and a metal may be deposited in the micropores.
- a metal may be deposited in the micropores. Deposition of a metal in the micropores in the surface layer makes it possible to increase the emissivity of the region. That is, placing the region with a metal deposited in the micropores formed in the surface layer thereof at a location far from the high-temperature part of the heat source makes it possible to more effectively prevent generation of a low-temperature region inside the heat-receiving member.
- a region close to the high-temperature part of the heat source may include a region in which the surface of the base is unanodized and exposed. Since the base is made of aluminum or an aluminum alloy, the emissivity of the region with the surface of the base exposed thereon is low. Placing the region with the surface of the base exposed thereon at a location close to the high-temperature part of the heat source makes it possible to prevent the temperature of the heat-receiving member from rising too high even if the region is located close to the high-temperature part of the heat source; hence, generation of a high-temperature region inside the heat-receiving member can be prevented. That is, generation of a temperature difference inside the heat-receiving member can be prevented.
- a base made of aluminum was anodized to form a surface layer on the base and to form micropores in the surface layer, in the same way as in Example 1.
- a masking tape (851T, produced by Sumitomo 3M Limited.) with a size of 20 mm ⁇ 20 mm was stuck.
- the surface layer was electrolytically colored in the same way as in Example 2, and thereby nickel was deposited in the micropores in the region without the masking tape stuck thereon.
- the masking tape was removed, and then blocking was carried out in the same way as in Example 2.
- a heat-receiving member produced thereby has a region on which electrolytic coloring was not performed, which is a "low-emissivity region", and a region on which electrolytic coloring was performed, which is a "high-emissivity region”.
- Example 2 At the center (the location E in Fig. 6 ) of the to-be anodized surface of the base that is of the same kind as the base used in Example 1, a masking tape with a size of 10 mm ⁇ 10 mm was stuck. Then, the base was anodized in the same way as in Example 1, and a surface layer was formed by anodization on a region without a masking tape stuck thereon, and further, micropores were formed in the surface layer. Subsequently, the surface layer was electrolytically colored in the same way as in Example 2, and thereby nickel was deposited in the micropores in the region without the masking tape stuck thereon. Thereafter, the masking tape was removed, and then blocking was carried out in the same way as in Example 2.
- a heat-receiving member produced thereby has a region on which anodization and electrolytic coloring were not performed, which is a "low-emissivity region", and a region on which anodization and electrolytic coloring were performed, which is a "high-emissivity region”.
- Heat-receiving members were produced by the same method as in Example 7 except that the respective masking tapes had a size of 20 mm ⁇ 20 mm and a size of 50 mm ⁇ 50 mm.
- Heat-receiving members were produced by the same method as in Example 7 except that the bases each had a thickness of 1.0 mm and the respective masking tapes had a size of 10 mm ⁇ 10 mm, a size of 20 mm ⁇ 20 mm, and a size of 50 mm ⁇ 50 mm.
- Heat-receiving members were produced by the same method as in Example 7 except that the bases each had a thickness of 2.0 mm and the respective masking tapes had a size of 10 mm ⁇ 10 mm, a size of 20 mm ⁇ 20 mm, and a size of 50 mm ⁇ 50 mm.
- Heat-receiving members were produced by the same method as in Example 7 except that the bases each had a thickness of 5.0 mm and the respective masking tapes had a size of 10 mm ⁇ 10 mm, a size of 20 mm ⁇ 20 mm, and a size of 50 mm ⁇ 50 mm.
- Table 2 shows the emissivities of the low-emissivity regions in the respective Examples.
- Example 6 in which the heat-receiving members were anodized and the low-emissivity region thereof was not electrolytically colored, the emissivity was 0.780.
- Examples 7 to 9 in which the low-emissivity regions in the heat-receiving members were not anodized nor electrolytically colored, the emissivity was 0.050, the same as that of the base.
- Table 2 does not show the emissivities of the high-emissivity regions and the emissivity in Example 2, those emissivities correspond to the emissivities of the anodized and electrolytically colored regions, and thus those emissivities are all 0.814.
- the heat-receiving member of Example 2 with uniform emissivity on the surface thereof had the highest temperature of 452°C at the location E in the heat-receiving member shown in Fig. 6 , that is, at the center of the heat-receiving member.
- the heat-receiving members of Examples 6 to 9 each of which had a low-emissivity region at the location E, had a temperature lower than the temperature of the heat-receiving member of Example 2 at the location E.
- Table 2 shows as "temperature decrease at location E" how many degrees the temperature dropped from the temperature at the location E in Example 2.
- Table 3 shows the temperatures measured at the locations C, D, E, F, and G shown in Fig. 6 , for Example 2 and Examples 6 to 9.
- Fig. 10 shows the relationships between the locations of temperature measurement and the temperatures of the respective heat-receiving members, which were measured in Example 2 and Examples 6 to 9.
- Example 6 the emissivity of the low-emissivity region is 0.780, and the difference between this emissivity and the emissivity of 0.814 of the high-emissivity region is 0.034.
- Such provision of a high-emissivity region and a low-emissivity region in the heat-receiving member decreases the temperature at the location E by 28°C; thus, the temperature difference between the highest temperature and the lowest temperature became 6°C, which made it possible to bring the temperature distribution within the heat-receiving member closer to the uniform distribution.
- Example 8 the emissivity of the low-emissivity region was 0.05, which led to a large decrease in the temperature at the location E by 73°C. Comparison with Example 6 in which the area of the low-emissivity region is 20 mm ⁇ 20 mm, the same area as in Example 8, reveals that lower emissivity in the low-emissivity region more greatly increases temperature-decrease effects.
- Examples 7 to 9 each having the same emissivity of 0.05 in the low-emissivity region and having a different area of the low-emissivity region reveals that a larger area of the low-emissivity region leads to a larger temperature decrease at the location E. Also, in each of Examples 8 and 9 in which the temperature decrease was large, the temperature was lowest at the location E within the heat-receiving member, and thus the line of the line chart of Examples 8 and 9 in Fig. 10 had a reverse shape of the line for Example 2.
- Examples 10 to 12 in which the bases each had a thickness of 1.0 mm, Examples 13 to 15 in which the bases each had a thickness of 2.0 mm, and Examples 16 to 18 in which the bases each had a thickness of 5.0 mm are respectively shown in Table 4, 5, or 6.
- Table 4 the result of the heat-receiving member of Example 3, 4, or 5 with uniform emissivity on the surface thereof is also shown.
- the respective values of "temperature decrease at location E" were calculated based on the temperature at the location E in Example 3, 4, or 5.
- the larger the thickness of the base the smaller the amount of distortion tended to be.
- the reason for this is considered to be that the mechanical strength of the base is increased as the thickness of the base is increased.
- a third embodiment which is one embodiment of the heat-receiving member of the present invention, is described with reference to the drawings.
- the heat-receiving member in the third embodiment has a plurality of cracks formed in the surface layer thereof.
- Fig. 11 is a cross-sectional view schematically illustrating an exemplary heat-receiving member of the present invention.
- a heat-receiving member 7 illustrated in Fig. 11 has the surface layer 30 formed by anodizing the surface of the base 20, and the surface layer 30 has a plurality of cracks 60 formed therein.
- Fig. 12 , Fig. 13 , and Fig. 14 each are a scanning electron microscope photograph that shows a surface of a surface layer of an exemplary heat-receiving member of the present invention which has cracks in the surface layer.
- a crack 61 has a zigzag shape as shown in the encircled region.
- a crack 62 is in a state where at least one end thereof has stopped growing and thus is not connected to another crack, as shown in the encircled region; the cracks are separated from each other.
- cracks 63 are formed as straight lines substantially parallel to each other in one direction, as shown by arrows.
- each crack is desirably from 0.01 to 15 ⁇ m.
- a width of more than 15 ⁇ m might generate a fissure in the base.
- Examples of the method of forming cracks in the surface layer include a method in which the heat-receiving member after anodization is bent so that it is distorted, and then the heat-receiving member is bent again so that it restores the original shape.
- the plurality of cracks are formed in the surface layer of the heat-receiving member of the present embodiment. Therefore, part of thermal stress, which is applied between the base and the surface layer, is absorbed at the cracked part. As a result, the thermal stress applied between the base and the surface layer is prevented from becoming large. As a result, generation of a fissure in the base due to the thermal stress can be prevented.
- the cracks may be separated from each other.
- the cracks absorb the thermal stress and grow upon application of the thermal stress to the surface layer, and thus make it possible to effectively prevent generation of a fissure in the base.
- the continuous surface layer increases the rigidity and thus makes it easier for the heat-receiving member to maintain the shape.
- At least one of the cracks may have a zigzag shape.
- a zigzag shape of the crack generates resistance to the force applied in the direction parallel to the crack, and therefore makes it possible to effectively prevent generation of a fissure in the base.
- a heat-receiving member was produced in the same way as in Example 2. Thereafter, the produced heat-receiving member was bended by hand to add distortion to the heat-receiving member. Then, cracks attributed from the distortion were observed. The cracks had a zigzag shape, and had widths of 0.01 to 15 ⁇ m at five locations when measured by SEM.
- Example 19 The heat-receiving member produced in Example 19 was evaluated for the same points (i) to (iv) as in Example 1. The results thereof are shown together in Table 7. For comparison, the result of the heat-receiving member of Example 2 with no crack formed in the surface layer thereof is also shown.
- the heat-receiving member produced in Example 19 had emissivity slightly lower than that of the heat-receiving member of Example 2. This decrease is considered to be due to inclusion of the surface of the base, which appeared at the cracked part, in the region the emissivity of which was measured. In the heat-receiving member produced in Example 19, no fissure was observed in the base because of the cracks. This result is shown as "++" in Table 7.
- a fourth embodiment which is one embodiment of the heat-receiving member of the present invention, is described with reference to the drawings.
- the heat-receiving member of the fourth embodiment has surface layers formed by anodizing both respective surfaces of the base thereof.
- Fig. 15 is a cross-sectional view schematically illustrating an exemplary heat-receiving member of the present invention.
- a heat-receiving member 11 illustrated in Fig. 15 has the base 20 both surfaces of which are anodized, and the base 20 has a surface layer 30a on the upper surface, and has a surface layer 30b on the lower surface.
- the surface layer 30a and the surface layer 30b respectively have micropores 40a and micropores 40b formed therein, and the micropores 40a and the micropores 40b respectively have a metal 50a and a metal 50b deposited therein. That is, the structure of one side of the heat-receiving member is the same as that of the heat-receiving member illustrated in Fig. 4 .
- the heat-receiving member illustrated in Fig. 15 is an exemplary heat-receiving member of the present embodiment.
- the surface layer of the heat-receiving member of the present embodiment any of the surface layers of the heat-receiving members that have been described thus far can be employed. Further, the conditions of the surface layer on the upper surface and lower surface may be different. Examples of such a structure include a structure in which the surface layer on the upper surface is electrolytically colored and the surface layer on the lower surface is not electrolytically colored, and the like.
- Examples of a method of forming surface layers by anodizing both respective surfaces of the base include a method in which the base without masking performed thereon is immersed into an electrolytic bath such that both surfaces of the base touch the electrolytic bath, and the like.
- one surface of the base may be anodized at one time.
- the temperature of the heat-receiving member tends not to rise, which makes it possible to decrease the thermal stress generated in the heat-receiving member.
- the lower the temperature of the heat-receiving member the larger the amount of heat that the heat-receiving member can receive; hence, the temperature of the heat-receiving member tends not to rise even at the time of heat reception, which makes it possible to produce a heat-receiving member that demonstrates excellent performance in receiving heat by radiation heat transfer.
- Example 1 A same base as the base used in Example 1 was immersed in an electrolytic bath without a masking tape being stuck on the base, and then both surfaces of the base were anodized to form respective surface layers on the both surfaces of the base. Then, micropores were further formed in the surface layers. Other conditions of anodization were same as those in Example 1.
- a masking tape was stuck for protection on the surface layer formed on a surface of the base which was to be a heat-releasing face when the base is used as a heat-receiving member. Then, the surface layer was electrolytically colored in the same way as in Example 2 so that nickel was deposited in the micropores. Thereafter, the masking tape was removed and blocking was carried out in the same way as in Example 2. In a heat-receiving member produced as thus described, one of the surfaces was anodized and electrolytically colored and the other surface was only anodized.
- a heat-receiving member was produced in the same way as in Example 20 except that a masking tape was not stuck on the surface layer before electrolytic coloring in Example 20. In a heat-receiving member produced as thus described, both faces were anodized and electrolytically colored.
- Example 20 The heat-receiving members produced in Examples 20 and 21 were evaluated for the same points (i) to (iv) as in Example 1.
- the heat-receiving member was placed such that the anodized and electrolytically colored surface faced the heaters and thus was used as a heat-receiving face. Further, the surface, which was only anodized, was arranged on the other side and set to be the heat-releasing face.
- Example 21 the sides that the surfaces of the heat-receiving member would face were optionally determined.
- Example 22 and Example 23 as described below were carried out.
- Example 22 a same heat-receiving member as that produced in Example 20 was used in measurement of heat-receiving performance. However, unlike in Example 20, the heat-receiving member was placed in reverse, that is, the surface on which only anodization was performed was used as the heat-receiving face, and the surface on which anodization and electrolytic coloring were performed was used as the heat-releasing face.
- Example 23 a same heat-receiving member as that produced in Example 2 was used in measurement of heat-receiving performance. However, unlike in Example 2, the heat-receiving member was placed in reverse, that is, the surface layer of the heat-receiving member was arranged on the farther side from the heaters and thus was used as the heat-releasing face, and the surface on which anodization was not performed was used as the heat-receiving face.
- the results of evaluation of Examples 20 to 23 are shown together in Table 8. For comparison, the result of the heat-receiving member of Example 2 is also shown.
- Example 20 to 22 since the emissivity is high both on the heat-receiving face and the heat-releasing face of the heat-receiving member, the amount of heat reception is more than 8700 W/m 2 . This amount of heat reception is very large compared to the result of the heat-receiving member of Example 2 which has high emissivity only on the heat-receiving face. That is, Examples 20 to 22 show that a large amount of heat release from the heat-receiving face by radiation heat transfer considerably increases the amount of heat reception of the heat-receiving member. Further, the highest temperature of the heat-receiving member is low despite the large amount of heat reception, which shows that heat release from the heat-receiving member was promoted.
- Example 23 the amount of heat reception was small in Example 23 in which the heat-receiving member had high emissivity only on the heat-releasing face and had low emissivity on the heat-receiving face.
- a fifth embodiment which is one embodiment of the exhaust pipe heat-releasing system of the present invention, is described with reference to the drawings.
- a surface-coating layer containing a crystalline inorganic material and an amorphous binder is formed on the outer peripheral face of the exhaust pipe described in the exhaust pipe heat-releasing system of the first embodiment.
- FIG. 16 is a cross-sectional view schematically illustrating an exemplary exhaust pipe heat-releasing system of the present invention.
- An exhaust pipe 151 that forms an exhaust pipe heat-releasing system 150 illustrated in Fig. 16 has a cylindrical base 102 that contains a metal; and a surface-coating layer 103 containing a crystalline inorganic material and an amorphous binder, which is formed on the outer peripheral face of the base 102. Further, the heat-receiving member 1 is placed such that the surface layer 30 formed by anodization faces the surface-coating layer 103 of the exhaust pipe 151. Arrows illustrated in Fig. 16 schematically show heat transferred from the surface-coating layer 103, which is formed on the outer peripheral face of the exhaust pipe 151, to the surface layer 30 of the heat-receiving member 1.
- the surface-coating layer 103 has an emissivity of 0.78 or more at a wavelength of 3 to 30 ⁇ m. Provision of the surface-coating layer 103 with high emissivity on the outer peripheral face of the exhaust pipe 151 makes it possible to effectively release heat in the exhaust pipe 151 to the outside of the exhaust pipe 151 by radiation heat transfer.
- the material of the crystalline inorganic material contained in the surface-coating layer 103 is not particularly limited.
- An oxide of a transition metal is desirably used, and specific examples thereof include manganese dioxide, manganese oxide, iron oxide, cobalt oxide, copper oxide, chrome oxide and nickel oxide. Each of these may be used alone or two or more kinds of these may be used in combination. These oxides of transition metals are suitably used for producing crystalline inorganic materials having high emissivity.
- amorphous binder examples include barium glass, boron glass, strontium glass, alumina-silicate glass, soda-zinc glass and soda-barium glass. Each of these may be used alone or two or more kinds of these may be used in combination.
- Such an amorphous binder is a low-melting-point glass and its softening temperature is in the range of 400 to 1100°C. Accordingly, melting the amorphous inorganic binder to coat the outer peripheral face of the base of the exhaust pipe and then firing the base make it possible to easily form a robust surface-coating layer on the outer peripheral face of the base.
- the melting point thereof is desirably in the range of 400 to 1100°C.
- the low-melting-point glass has a melting point of less than 400°C, there is a case where the glass easily softens during use and extraneous matters adhere to the glass.
- the melting point exceeds 1100°C, there is a case where the heating in formation of a surface-coating layer deteriorates the base.
- a desirable lower limit is 10% by weight and a desirable upper limit is 90% by weight.
- the compounding amount of the crystalline inorganic material is less than 10% by weight, there is a case where the infrared emissivity is insufficient and the heat-releasing property in a high-temperature region is inferior.
- the compounding ratio exceeds 90% by weight, there is a case where the adhesion between the heat-releasing layer and the base of the exhaust pipe is lowered.
- a more desirable lower limit is 30% by weight and a more desirable upper limit is 70% by weight.
- the surface-coating layer have a thickness of 0.5 to 10 ⁇ m.
- the surface-coating layer has a thickness of less than 0.5 ⁇ m, a sufficient heat-releasing property might not be ensured.
- the surface-coating layer has a thickness exceeding 10 ⁇ m, cracks might appear on the surface-coating layer or the exhaust pipe might be deformed.
- the surface-coating layer is formed on the entire outer peripheral face of the exhaust pipe because, in this case, the area of the surface-coating layer will be largest and the surface-coating layer will have a particularly excellent heat-releasing property.
- a surface-coating layer may be formed only on a part of the outer peripheral face of the exhaust pipe; particularly when the surface-coating layer is formed on the surface that faces the heat-receiving member, it may not be formed on other parts on the exhaust pipe.
- cleaning is performed so as to remove impurities on a surface of the base of the exhaust pipe.
- the cleaning is not particularly limited, and conventionally known cleaning may be used. More specifically, ultrasonic cleaning in alcohol solvent, and the like may be used.
- roughening may be optionally performed on the surface of the base of the exhaust pipe in order to enlarge a specific surface area of the outer peripheral face of the base of the exhaust pipe or to adjust the maximum height Rz of the inner face of the base of the exhaust pipe. More specifically, roughening such as sandblasting, etching and high-temperature oxidation may be performed. Each of the treatments may be used alone or two or more kinds of these may be used in combination.
- a crystalline inorganic material and an amorphous binder are wet-mixed so as to prepare a raw material composition for a surface-coating layer. More specifically, a powder of a crystalline inorganic material and a powder of an amorphous binder are prepared so that each has a predetermined particle size, a predetermined shape, and the like. Respective powders are dry-mixed at a predetermined compounding ratio to obtain a mixed powder. Then, water is added thereto and the mixture is wet-mixed by ball milling so as to prepare a raw material composition for a surface-coating layer.
- the compounding ratio of the mixed powder and water is not particularly limited.
- an inorganic fiber or an organic solvent may be blended to the raw material composition for a surface-coating layer.
- the outer peripheral face of the base of the exhaust pipe is coated with the raw material composition for a surface-coating layer.
- a method for coating with the raw material composition for a surface-coating layer for example, spray coating; electrostatic coating; ink jet; transfer using a stamp, a roller or the like; brush coating and the like may be used.
- the base of the exhaust pipe may be immersed in the raw material composition for a surface-coating layer so as to be coated with the raw material composition for a surface-coating layer.
- At least one of plating such as nickel plating and chrome plating, oxidation of the outer peripheral face of the metal base, and the like may be performed before the coating of the outer peripheral face of a base of the exhaust pipe with a raw material composition for a surface-coating layer.
- plating such as nickel plating and chrome plating, oxidation of the outer peripheral face of the metal base, and the like may be performed before the coating of the outer peripheral face of a base of the exhaust pipe with a raw material composition for a surface-coating layer.
- the exhaust pipe coated with the raw material composition for a surface-coating layer is fired. More specifically, after the exhaust pipe coated with the raw material composition for a surface-coating layer is dried, a surface-coating layer is formed by firing.
- the firing temperature is desirably set to the melting point of the amorphous binder or higher, and it is desirably 700 to 1100°C.
- the firing temperature depends on the kind of the blended amorphous binder.
- the exhaust pipe heat-releasing system of the present embodiment can achieve the following effects in addition to the effect (3) described in the first embodiment.
- the exhaust pipe heat-releasing system of the present embodiment is provided with a surface-coating layer that contains a crystalline inorganic material and an amorphous binder on the outer peripheral face of the base of the exhaust pipe. Provision of a surface-coating layer containing a crystalline inorganic material and an amorphous binder increases the emissivity of the outer peripheral face of the exhaust pipe, thereby increasing the amount of radiation heat from the outer peripheral face of the exhaust pipe.
- the radiation heat from the outer peripheral face of the exhaust pipe is received by the heat-receiving member of the present invention which demonstrates excellent performance in receiving heat. That is, improvement in the amount of radiation heat from the outer peripheral face of the exhaust pipe is combined with improvement in the amount of heat received by the heat-receiving member, which more effectively prevents the temperature of the exhaust pipe from rising too high.
- the exhaust pipe of the exhaust pipe heat-releasing system of the present embodiment has an emissivity (emissivity of the surface-coating layer) of 0.78 or more. Emissivity of the exhaust pipe in such a range increases the amount of radiation heat from the outer peripheral face of the exhaust pipe. As a result, it is possible to still more effectively prevent the temperature of the exhaust pipe from rising too high.
- the heat-receiving member of the present invention may be arranged as a different member from a heat insulator.
- Fig. 17 is an exploded perspective view schematically illustrating exemplary arrangement of the heat-receiving member of the present invention as a different member from the heat insulator.
- the heat-receiving member 1 of the present invention is arranged between the exhaust manifold 111 and the heat insulator 118, with the surface layer 30 of the heat-receiving member 1 being on the exhaust manifold 111 side. Even such arrangement of a heat-receiving member makes it possible to increase the cooling ability of an exhaust manifold.
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Abstract
Description
- The present invention relates to a heat-receiving member and an exhaust pipe heat-releasing system.
- An exhaust pipe connected to a vehicle engine becomes significantly hot in driving operation because combustion gases (exhaust gases) flow therethrough. In a high-load and high-revolution area of the engine, fuel is increased so as to avoid a rise in temperature of exhaust gases. In such a case, however, a problem arises that the fuel efficiency is lowered and the concentration of exhaust gases is raised, so that the discharge amount of contaminants is increased.
Further, when the temperature of the exhaust pipe is raised by a flow of exhaust gases, it causes heat degradation of the exhaust pipe. - Inside an exhaust pipe, a catalyst is provided for converting exhaust gases discharged from a vehicle engine. For example, a three-way catalyst can convert contaminants such as hydrocarbon (HC), carbon monoxide (CO), and nitrogen oxide (NOx) which are contained in exhaust gases.
In order to convert these contaminants by a three-way catalyst more efficiently, it is necessary to maintain the three-way catalyst at a predetermined activation temperature. - However, in a high-speed operation of a vehicle engine, exhaust gases become very hot and there may be a case where the temperature of a three-way catalyst becomes out of the effective range for conversion of exhaust gases and the three-way catalyst fails to convert contaminants properly. Moreover, there may be a case where the three-way catalyst is thermally deteriorated due to high-temperature exhaust gases.
- Accordingly, it is desirable that, in the high-speed operation of the vehicle engine, the temperature of the exhaust pipe connected to a vehicle engine not rise too high and the exhaust pipe be appropriately cooled.
Patent Document 1 discloses a heat insulator that can appropriately cool an exhaust pipe connected to a vehicle engine. -
- Patent Document 1:
JP-A 6-336923 -
Fig. 1 is an exploded perspective view which illustrates a vehicle engine and a vicinity of an exhaust pipe connected to the vehicle engine.
InFig. 1 , "110" indicates an engine and acylinder head 117 is mounted on a top of acylinder block 116 of thevehicle engine 110. Further, anexhaust manifold 111, which contains cast iron with high heat resistance, is attached on one side face of thecylinder head 117. - The
exhaust manifold 111 has a function of gathering exhaust gases from respective cylinders and transferring the exhaust gases to a not-shown catalyst converter and the like. That is, theexhaust manifold 111 functions as an exhaust pipe through which exhaust gases from the engine flow.
Part of the outer peripheral face of theexhaust manifold 111 is covered with aheat insulator 118. Theheat insulator 118 is arranged over the outer peripheral face of theexhaust manifold 111 with a predetermined space therebetween. -
Patent Document 1 sets the emissivity of the heat insulator to be more than the emissivity of the exhaust manifold.Patent Document 1 describes that setting the relationships of the emissivities as such increases the amount of radiation heat transferred between the exhaust manifold and the heat insulator, and thus improves the cooling ability of the exhaust manifold. -
Patent Document 1 also describes that a black, heat-resistant coating is applied to the heat insulator that is made of cast iron so as to improve the emissivity of the heat insulator. - Recently, aluminum or an aluminum alloy (hereinafter referred also to simply as aluminum) has often been used as a material for a heat insulator in order to reduce the vehicle body weight, and the like.
However, when a heat insulator made of aluminum is arranged so as to cover the peripheries of an exhaust manifold, the amount of heat for the heat insulator to receive from an exhaust pipe by radiation heat transfer is not so large because aluminum is a material with low emissivity.
Hence, there has been a problem in which the temperature of the exhaust pipe, when aluminum is used as a material for a heat insulator, cannot be decreased by radiation heat transfer and therefore the temperature of the exhaust pipe rises too high. - In view of such a problem, the inventors of the present invention studied a method of applying to aluminum a black, heat-resistant coating which is similar to the coating disclosed in
Patent Document 1 so as to increase the emissivity of aluminum. However, sufficient adhesion was not obtained between aluminum and the heat-resistant coating, and the heat-resistant coating peeled off from aluminum. Thus, the inventors were not able to increase the emissivity of aluminum by this method. - The present invention was made in view of the above problem, and an object thereof is to provide a heat-receiving member which demonstrates excellent performance in receiving, by radiation heat transfer, heat energy that is released from a heat source such as an exhaust pipe; and an exhaust pipe heat-releasing system that can prevent the temperature of the exhaust pipe from rising too high.
- That is, a heat-receiving member according to
claim 1 receives heat energy released from a heat source, and comprises: a base that contains aluminum or an aluminum alloy; and a surface layer that is formed by anodizing a surface of the base. - The heat-receiving member according to
claim 1 has the surface layer formed by anodizing the surface of the base that contains aluminum or an aluminum alloy.
The emissivity of the surface layer formed by anodizing the surface of aluminum is higher than the emissivity of aluminum. High emissivity of the surface of the surface layer allows the surface layer to receive by radiation heat transfer a large amount of heat released from the heat source, when the heat-receiving member of the present invention is arranged with the surface layer thereof facing the heat source such as an exhaust pipe. That is, the heat-receiving member of the present invention is excellent at receiving, by radiation heat transfer, heat released from a heat source. Further, use of such a heat-receiving member makes it possible to promote heat release from the heat source.
The interface between aluminum and a surface layer formed by anodization is chemically stable and the adhesion between aluminum and the surface layer is strong. Therefore, the surface layer does not peel off from aluminum. - In the heat-receiving member according to
claim 2, the heat-receiving member has a first region and a second region, the first region is located farther from a high-temperature part of the heat source than the second region, and the first region has emissivity higher than emissivity of the second region.
The first region herein also means a region far from the high-temperature part of the heat source. The second region herein means another region or a region close to the high-temperature part of the heat source.
Now, the variation of temperature distribution inside the heat-receiving member adjacent to the heat source is considered. With regard to the temperatures of respective regions in the heat-receiving member, much heat is transferred to the region close to the high-temperature part of the heat source, and thus the temperature of the region tends to rise. On the other hand, not much heat is transferred to the region far from the high-temperature part of the heat source, and thus the temperature of the region tends not to rise. As a result, a high-temperature region and a low-temperature region generate inside the heat-receiving member. This temperature difference inside the heat-receiving member leads to generation of thermal stress in the heat-receiving member, which might distort the heat-receiving member. - The region having higher emissivity than the another region in the heat-receiving member according to
claim 2 receives a large amount of heat per unit area because the region easily receives heat by radiation heat transfer. The region having higher emissivity than the another region is thus a region in which the temperature tends to rise due to heat reception. Accordingly, placing the region having higher emissivity than the another region at a location far from the high-temperature part of the adjacent heat source makes it more likely for the temperature of the heat-receiving member to rise even if the region is located far from the high-temperature part of the heat source; hence, generation of a low-temperature region inside the heat-receiving member can be prevented.
That is, generation of a temperature difference inside the heat-receiving member can be prevented. Further, generation of thermal stress and distortion in the heat-receiving member can be prevented. - In the heat-receiving member according to
claim 3, a micropore is formed in the surface layer in the first region, and a metal is deposited in the micropore.
Deposition of a metal in the micropore in the surface layer makes it possible to increase the emissivity of the region. That is, placing the region with a metal deposited in the micropore formed in the surface layer thereof at a location far from the high-temperature part of the heat source makes it possible to more effectively prevent generation of a low-temperature region inside the heat-receiving member. - In the heat-receiving member according to claim 4, the second region includes a region in which the surface of the base is unanodized and exposed.
In this case, the emissivity of the region with the surface of the base exposed thereon is low. Placing the region with the surface of the base exposed thereon at a location close to the high-temperature part of the heat source makes it possible to prevent the temperature of the heat-receiving member from rising too high even if the region is located close to the high-temperature part of the heat source; hence, generation of a high-temperature region inside the heat-receiving member can be prevented. That is, generation of a temperature difference inside the heat-receiving member can be prevented. - In the heat-receiving member according to
claim 5, a plurality of cracks are formed in the surface layer.
Here, a coefficient of thermal expansion of the surface layer formed by anodization is different from a coefficient of thermal expansion of aluminum or an aluminum alloy used as the base. Thus, a rise in the temperature of the heat-receiving member leads to application of thermal stress between the base and the surface layer. When the thermal stress applied between the base and the surface layer is large or the thickness of the base is small, a fissure might be generated in the base (the base might split). - Since the plurality of cracks are formed in the surface layer of the heat-receiving member according to
claim 5, part of the thermal stress applied between the base and the surface layer is absorbed at the cracked parts, whereby an increase in the thermal stress applied between the base and the surface layer is prevented. As a result, generation of a fissure in the base due to the thermal stress can be prevented. - In the heat-receiving member according to
claim 6, the cracks are separated from each other.
The cracks separated from each other absorb the thermal stress and grow upon application of the thermal stress to the surface layer. As a result, generation of a fissure in the base is effectively prevented. Further, the continuous surface layer increases the rigidity and thus makes it easier for the heat-receiving member to maintain the shape. - In the heat-receiving member according to
claim 7, at least one of the cracks has a zigzag shape.
When the cracks each have a zigzag shape, resistance to the force applied in a direction parallel to the cracks is generated. Hence, generation of a fissure in the base can be more effectively prevented. - In the heat-receiving member according to
claim 8, a surface layer is also formed on a surface on the reverse side of the surface of the base.
In this case, surface layers are formed by anodizing both respective surfaces of the heat-receiving member, and therefore the emissivity of the both surfaces of the heat-receiving member becomes high. Then, the heat-receiving member can receive much heat on one surface and release much heat from the other surface. Accordingly, the temperature of the heat-receiving member tends not to rise, whereby the thermal stress to be generated in the heat-receiving member can be reduced.
The lower the temperature of the heat-receiving member, the larger the amount of heat that the heat-receiving member can receive. For this reason, the temperature of the heat-receiving member is prevented from easily rising even when the heat-receiving member has received heat, and thus the heat-receiving member of the present invention can demonstrate better performance in receiving heat by radiation heat transfer. - An exhaust pipe heat-releasing system according to
claim 9 comprises: an exhaust pipe including a cylindrical base that contains a metal; and a heat-receiving member arranged over the exhaust pipe, the heat-receiving member being a heat-receiving member according to any one ofclaims 1 to 8.
The heat-receiving member of the present invention demonstrates excellent performance in receiving heat by radiation heat transfer. Hence, such a heat-receiving member arranged over the exhaust pipe can receive much radiation heat from the outer peripheral face of the exhaust pipe when the temperature of the exhaust pipe is increased by high-temperature exhaust gasses flowing through the exhaust pipe. Therefore, it is possible to prevent the temperature of the exhaust pipe from rising too high. - The exhaust pipe heat-releasing system according to
claim 10 is provided with a surface-coating layer that is formed on the outer peripheral face of the base included in the exhaust pipe, and that contains a crystalline inorganic material and an amorphous binder.
Since provision of the surface-coating layer that contains a crystalline inorganic material and an amorphous binder leads to an increase in the emissivity of the outer peripheral face of the exhaust pipe, the amount of radiation heat from the outer peripheral face of the exhaust pipe is increased. The radiation heat from the outer peripheral face of the exhaust pipe is received by the heat-receiving member of the present invention which demonstrates excellent performance in receiving heat.
That is, improvement in the amount of radiation heat from the outer peripheral face of the exhaust pipe is combined with improvement in the amount of heat received by the heat-receiving member. As a result, it is possible to more effectively prevent the temperature of the exhaust pipe from rising too high. - In the exhaust pipe heat-releasing system according to
claim 11, the exhaust pipe has an emissivity of 0.78 or more. The emissivity falling in such a range leads to improvement in the amount of radiation heat from the outer peripheral face of the exhaust pipe, thereby even more effectively preventing the temperature of the exhaust pipe from rising too high. - Hereinafter, a first embodiment, which is one embodiment of a heat-receiving member and an exhaust pipe heat-releasing system according to the present invention, is described with reference to drawings.
First, the heat-receiving member of the present invention is described.
Fig. 2 is a cross-sectional view schematically illustrating an exemplary heat-receiving member of the present invention.
A heat-receivingmember 1 illustrated inFig. 2 includes a base 20 that contains aluminum or an aluminum alloy, and asurface layer 30 formed by anodizing the surface of thebase 20. - The surface layer formed by anodizing the base has emissivity higher than the emissivity of aluminum. The emissivity (infrared emissivity) at a wavelength of 3 to 30 µm is, for example, 0.7 or more. The infrared emissivity can be measured by a radiometer (for example, an AERD produced by Kyoto Electronics Manufacturing Co., Ltd.).
- The kind of aluminum or an aluminum alloy to be used as the base is not particularly limited so long as it can be anodized. For example, pure aluminum (1000 series), Al-Cu-Mg alloys (2000 series), Al-Mn alloys (3000 series), Al-Si alloys (4000 series), Al-Mg alloys (5000 series), Al-Mg-Si alloys (6000 series), Al-Zn-Mg alloys (7000 series), or the like can be used.
- The shape of the base is not particularly limited, and can be, for example, a plate such as a flat plate, a curved plate, and a flexed plate. The shape can be set to any shape according to the shape of the place in which the heat-receiving member is to be used. The base may be formed by laminating a plurality of bases.
Further, the thickness of the base is not particularly limited either, and can be set to any thickness according to the amount of heat to be received by the heat-receiving member and the expected operating temperature of the heat-receiving member.
In the case where a heat-receiving member is to be provided in the exhaust pipe heat-releasing system of the present invention, the thickness of the base to be used in production of the heat-receiving member is desirably from 0.1 to 1.5 mm, more desirably from 0.3 to 1.0 mm, and even more desirably from 0.4 to 0.8 mm.
A thickness of less than 0.1 mm of the base may lead to insufficient strength. On the other hand, a thickness of more than 1.5 mm may lead to application of large compressive strain and large tensile strain to the surface layer upon deformation of the base.
In the case where the base is formed by laminating a plurality of bases, the thickness of the base is the sum of thicknesses of the laminated bases. - The thickness of the base is different before and after the anodization. Suppose that the surface of the base is taken as the reference position. When an oxide film with a thickness of ΔZ is formed on the upper side of the reference position by anodization, an oxide film with a thickness of ΔZ is to be simultaneously formed on the under side of the reference position by anodization, and thus the thickness of the base is to be decreased by ΔZ.
Accordingly, the thickness of the base used in production of the heat-receiving member can be presumed to be a thickness (ΔZ + T). The thickness (ΔZ + T) is obtained by measuring the thickness (2 × ΔZ) of the surface layer and the thickness (T) of the base in the heat-receiving member after the anodization, and by adding a half of the thickness of the surface layer, which is (ΔZ), to the measured thickness (T) of the base. - The surface layer is formed by anodizing the base, that is, by passing an electric current through an electrolytic bath with the base serving as the anode.
In the case of anodizing only one surface of the base, it is desirable that a masking tape or the like be put on the surface not to be anodized, for protection.
The thickness of the surface layer is desirably from 5 to 25 µm.
A thickness of less than 5 µm of the surface layer may decrease the emissivity. On the other hand, a thickness of more than 25 µm of the surface layer may increase the rigidity of the surface layer and thus increase the thermal stress applied to the adjacent base, thereby tending to generate a fissure in the base. Also, a thickness of more than 25 µm of the surface layer makes it difficult to perform electrolytic coloring. Further, a thickness of more than 25 µm of the surface layer is inefficient because it requires a longer time for anodization but does not lead to achievement of much effect of improving the emissivity.
The thickness of the base and the thickness of the surface layer can be measured by observing the cross-section of the heat-receiving member with a SEM or the like. - The electrolytic bath includes an acidic bath, an alkaline bath, and a bath of a non-aqueous solution such as a formamide series and a boric acid series. The acidic bath includes a bath of an aqueous solution in which one kind or two kinds or more of the following is/are dissolved: sulfuric acid, phosphoric acid, chromic acid, oxalic acid, sulfosalicylic acid, pyrophoric acid, sulfamic acid, phosphomolybdic acid, boric acid, malonic acid, succinic acid, maleic acid, citrate, tartaric acid, phthalic acid, itaconic acid, malic acid, glycolic acid, and the like.
The alkaline bath includes a bath of an aqueous solution in which one kind or two kinds or more of the following is/are dissolved: sodium hydroxide, potassium hydroxide, sodium carbonate, potassium phosphate, ammonia water, and the like. - The current waveform at the time of electrolysis includes waveforms of direct current (DC), alternate current (AC), a superposition of AC and DC, a combination of AC and DC, an imperfectly-rectified wave, a pulse wave, a rectangle wave, or the like.
The electrolytic method includes a constant current method; a constant voltage method; a constant power method; a high-speed anodizing method based on a continuous current, an intermittent current, or current recovery; and the like. - The heat-receiving member of the present embodiment may have a micropore formed in the surface layer.
Fig. 3 is a cross-sectional view schematically illustrating an exemplary heat-receiving member of the present invention.
A heat-receivingmember 2 illustrated inFig. 3 has a large number ofmicropores 40 formed in thesurface layer 30.
Themicropores 40 are generated in thesurface layer 30 when the thickness of thesurface layer 30 formed by anodization becomes 10 to 20 nm. Further, as the anodization is continued on, the thickness of thesurface layer 30 is increased and the depth of themicropores 40 is increased, whereby the plurality ofdeep micropores 40 are formed in thesurface layer 30. - The heat-receiving member of the present embodiment may have a metal deposited in the micropores.
Fig. 4 is a cross-sectional view schematically illustrating an exemplary heat-receiving member of the present invention.
A heat-receivingmember 3 illustrated inFig. 4 has ametal 50 precipitated and deposited in themicropores 40 illustrated inFig. 3 by electrolytic coloring.
Deposition of a metal in the micropores by electrolytic coloring further increases the emissivity of the surface layer.
Examples of the metal to be deposited in the micropores include metals such as Ni, Cu, Co, Pd, Sn, Pb, and Cd. A particularly desirable metal among these is Ni or Co because they can increase the emissivity of the surface layer.
Further, since use of Ni makes it easy to block the pore, Ni is more desirable. - Examples of a method of depositing a metal in the micropores include a method of passing an electric current through an electrolytic bath, which includes a metal, with the surface layer formed by anodization serving as the cathode, and the like.
The kind of electrolytic bath to be used to deposit a metal is not particularly limited. For example, in the case of depositing Ni, an electrolytic bath containing nickel sulfate can be used. - Further, silicate or zirconium hydroxide may be deposited in the micropores by alternately immersing a heat-receiving member in acid or alkali and in a silicate aqueous solution or zirconium salt bath.
- In the heat-receiving members as illustrated in
Figs. 3 and4 , the micropores formed in the surface layer may be blocked by a general method such as a method of immersing a heat-receiving member in boiling water, a method of immersing a heat-receiving member in hot water that contains a metal salt, or the like. - Next, the exhaust pipe heat-releasing system of the present invention is described.
Fig. 5 is a cross-sectional view schematically illustrating an exemplary exhaust pipe heat-releasing system of the present invention.
An exhaust pipe heat-releasingsystem 100 illustrated inFig. 5 includes an exhaust pipe 101 having acylindrical base 102 that contains a metal, and the heat-receivingmember 1 of the present invention arranged over the exhaust pipe 101.
The heat-receivingmember 1 is arranged such that thesurface layer 30 formed by anodizing the surface of the base 20 faces the outer peripheral face of the exhaust pipe 101.
InFig. 5 , the heat transferred from the outer peripheral face of the exhaust pipe 101 to thesurface layer 30 of the heat-receivingmember 1 is schematically shown by arrows. - The exhaust pipe 101 is a member that is connected to an internal combustion engine such as an engine and that allows high-temperature exhaust gases to flow therethrough.
Examples of the material of a base 102 that forms the exhaust pipe 101 include metals such as stainless steel, steel, iron, and copper, and nickel-based alloys such as Inconel, Hastelloy, and Invar. These metal materials have high heat conductivity, and therefore can contribute to improvement in heat-releasing properties of the exhaust pipe 101. - Further, these metal materials have high heat resistance, and thus can be suitably used in high-temperature conditions. By using these metal materials as the base of the exhaust pipe, the exhaust pipe is allowed to have excellent resistance to thermal shock, excellent processability, excellent mechanical properties, and the like.
- The shape of the
base 102 is not particularly limited as long as it is a cylindrical shape. The cross-sectional shape thereof may be a circular shape, or may be any other shape such as an elliptical shape and a polygonal shape. - The heat-receiving
member 1 has thesurface layer 30 with high emissivity, as described above. Hence, the heat-receivingmember 1 can receive on the surface of thesurface layer 30 much heat that is radiated from the outer peripheral surface of the exhaust pipe 101 upon an increase of the temperature of the exhaust pipe 101. - The shape of the heat-receiving member is not particularly limited as long as it does not disturb arrangement of the heat-receiving member over the exhaust pipe included in the exhaust pipe heat-releasing system. A shape may be acceptable for example in the case where the heat-receiving member of the present invention corresponds to the heat insulator illustrated in
Fig. 1 and the surface of the surface layer of the heat-receiving member faces the outer peripheral face of the exhaust pipe. - A heat-receiving member to be used in the exhaust pipe heat-releasing system of the present invention is not limited to the heat-receiving
member 1 illustrated inFig. 2 , and any heat-receiving member of the present invention described herein may be used. - In the following, effects achieved by the heat-receiving member and the exhaust pipe heat-releasing system in the present embodiment are described.
(1) The heat-receiving member of the present embodiment has a surface layer formed by anodizing a surface of a base that contains aluminum or an aluminum alloy. The emissivity of the surface of the surface layer formed by anodization is higher than the emissivity of aluminum. When the emissivity of the surface of the surface layer is high, the heat-receiving member of the present embodiment, arranged with the surface layer thereof facing the heat source such as an exhaust pipe, can receive by radiation heat transfer a large amount of heat released from the heat source. That is, the heat-receiving member of the present embodiment demonstrates excellent performance in receiving, by radiation heat transfer, heat released from a heat source. Further, use of such a heat-receiving member makes it possible to promote heat release from the heat source. - (2) The heat-receiving members of the present embodiment may have micropores in the surface layer thereof, and a metal may be deposited in the micropores. When a metal is deposited in the micropores in the surface layer, the emissivity of that region can be more increased.
- (3) The exhaust pipe heat-releasing system of the present embodiment includes an exhaust pipe having a cylindrical base that contains a metal, and a heat-receiving member of the present invention arranged over the exhaust pipe.
The heat-receiving member of the present invention demonstrates excellent performance in receiving heat by radiation heat transfer. Such a heat-receiving member arranged over the exhaust pipe can receive much radiation heat from the outer peripheral surface of the exhaust pipe when the temperature of the exhaust pipe is increased by high-temperature gasses flowing therethrough. Thus, it is possible to prevent the temperature of the exhaust pipe from rising too high. - Hereinafter, Examples are described which more specifically disclose the first embodiment of the present invention. However, the present embodiment is not limited to these Examples.
- A plate (150 mm × 70 mm × 0.5 mm (thickness)) made of aluminum (A1050) was prepared as the base, and the surface thereof not to be anodized was protected by sticking a masking tape. Next, the plate was anodized so that a surface layer was formed on the surface of the plate. As a result, a heat-receiving member was produced.
At the time of anodization, the electrolytic bath used was a sulfuric acid bath with a concentration of 200 g/L, and the electrolyte temperature was set to 15°C. The electrolytic method used was a multistep electrolytic method in which a low voltage (20 V) was applied in the first half of the process and a high voltage (40 V) was applied in the second half of the process. Thereafter, the plate was washed to remove the electrolytic solution.
Part of the heat-receiving member after anodization was cut and the thickness of the surface layer formed by anodization was measured at five locations by SEM. The thicknesses thereof were in the range of 15 to 20 µm.
Also, micropores were formed in the surface layer. - The surface layer of the heat-receiving member produced in Example 1 was then electrolytically colored, that is, nickel was deposited in the micropores in the surface layer.
The electrolytic bath used was a nickel sulfate bath. The electrolytic bath had a pH of within the range of 4 to 6, and a temperature of within the range of 5 to 30°C. The electrolytic treatment was performed by an alternate current of 5 to 60 V, with the surface layer of the heat-receiving member serving as the cathode and with a carbon rod serving as the anode. Then, blocking of the micropores was performed by immersing the heat-receiving member in deionized water and boiling the water for 15 minutes. - Heat-receiving members were produced by performing anodization, electrolytic coloring, and blocking in the same way as in Example 2 except that the thicknesses of the respective bases were set to 1.0, 2.0, and 5.0 mm.
- A base made of the same aluminum as in Example 1 without anodization and electrolytic coloring performed thereon was used as the heat-receiving member.
- The heat-receiving members produced in the respective Examples and Comparative Example were each evaluated for the following points.
- The emissivity of the base before anodization, the emissivity of the surface layer of the heat-receiving member after anodization, and the emissivity of the surface layer of the heat-receiving member after electrolytic coloring were each measured by a radiometer (AERD produced by Kyoto Electronics Manufacturing Co., Ltd., wavelength: 3 to 30 µm).
-
Fig. 6 is a cross-sectional view schematically illustrating a method of measuring heat-receiving performance of the heat-receiving member.
A heat-receivingperformance measuring machine 200 illustrated inFig. 6 includes aheater 201 that is surrounded by aheat insulating material 202. Theheater 201 is connected to a not-shown power source through apower source cable 203, and the temperature of theheater 201 can be increased by turning the power on. The upper face of the heat-receivingperformance measuring machine 200 is open so that putting the heat-receivingmember 1, the effect of which is to be measured, on the open face forms a closed space around theheater 201.
The length shown by an arrow A inFig. 6 indicates the long side (150 mm) of the heat-receivingmember 1, and the length shown by an arrow B indicates the width (120 mm) of the closed space. - In measurement of the heat-receiving performance, the heat-receiving
member 1 was placed on the upper face of the heat-receivingperformance measuring machine 200 with thesurface layer 30 facing theheater 201 side, and then theheater 201 was powered on.
Next, the amount of electricity was adjusted so that the amounts of the radiation heat and the input electricity would be equal when the temperature of the heater was 500°C, and the amount of electricity at this time was recorded.
The recorded amount of electricity was set to be the amount of heat received by the heat-receiving member.
It should be noted that the heat-receiving member of Comparative Example 1, which has no surface layer formed therein, was placed with the surface of the base facing the heater side. - Further, the temperature of the heat-receiving member was measured at five locations when the amounts of the radiation heat and the input electricity were equalized with the temperature of the heater being 500°C.
The measuring locations were the points shown by arrows C, D, E, F, and G, which were set by dividing at 30 mm intervals the width of 120 mm shown by the arrow B inFig. 6 .
Here, the measuring locations are aligned at the midpoint (35 mm) of the short side (70 mm) of the heat-receiving member, and therefore the location E inFig. 6 corresponds to the center of the heat-receiving member.
Thereafter, the largest value and the smallest value among the temperatures measured at the five locations were derived, and then a value resulting from "the largest value - the smallest value" was used as an index that shows the variation of the temperature distribution inside the heat-receiving member. - Displacement of the location E in
Fig. 6 in the measurement test of the heat-receiving performance in (ii) was measured by a non-contact type displacement meter. - The heat-receiving members produced in the respective Examples and Comparative Example were tested by 500 cycles of a temperature cycle test in which a cycle of heating up to 250°C and cooling down to 25°C by water immersion was repeated. Then, the base after the temperature cycle test was visually observed to see whether a fissure was generated therein.
- The evaluation results of the points (i) to (iv) with respect to the heat-receiving members produced in the respective Examples and Comparative Example are shown together in Table 1.
Table 1 shows the temperatures of the location E inFig. 6 . In Examples 1 to 5 and Comparative Example 1, the temperature was highest at the location E, namely at the center of the heat-receiving member.
With respect to generation of fissures, a heat-receiving member with a very small fissure generated therein is shown as "+", and a heat-receiving member with a large fissure generated therein is shown as "-". -
[Table 1] Heat-receiving member Evaluation result Thickness of base Anodization Electrolytic coloring Emissivity Temperature at location E Highest temperature Lowest temperature Tempereature difference Amount of heat reception Amount of distortion Fissure (mm) (°C) (°C) (°C) (°C) (W/m2) (mm) Example 1 0.5 performed not performed 0.780 448 448 418 30 2798 2.5 + Example 2 0.5 performed performed 0.814 452 452 423 29 2817 2.6 + Example 3 1.0 performed performed 0.814 452 452 421 31 2810 0.6 + Example 4 2.0 performed performed 0.814 438 438 419 19 2747 0.3 + Example 5 5.0 performed performed 0.814 418 418 407 11 2617 0.3 + Comparative
Example 15.0 not performed not performed 0.050 315 315 299 16 1755 1.9 - - Here, the emissivity of the surface layer formed by anodization in Example 1 was considerably higher than the emissivity of the unanodized base in Comparative Example 1. Further, the amount of heat received by the heat-receiving member in Example 1 was larger than the amount of heat received by the heat-receiving member in Comparative Example 1.
Since the amount of electricity, which was measured as the amount of heat received, is equal to the amount of radiation heat from the heater as the heat source, the heat release from the heat source was found to be accelerated by use of a heat-receiving member with high emissivity as in Example 1. - Further, electrolytic coloring as in Example 2 made it possible to further increase the emissivity of the heat-receiving member, and in this case, the amount of heat received was further increased.
- Example 2 and Examples 3 to 5 were compared to find out the effect of thickness of the base. In every Example, the emissivity of the surface of the heat-receiving member with a surface layer formed thereon was 0.814.
The highest temperature was observed at the location E in every Example, and when the thickness of the base was increased to 2.0 mm or to 5.0 mm, the highest temperature was decreased according to the increase thereof. Further, when the thickness of the base was increased to 2.0 mm or to 5.0 mm, the temperature difference between the highest temperature and the lowest temperature was decreased according to the increase of the thickness of the base.
The reason for a decrease in the temperature difference according to the increase of the thickness of the base has not been revealed. However, the reason is considered to be that the amount of heat transferred within the base by heat conduction is increased when the thickness of the base is large, and that the temperatures within the heat-receiving member thus tend to be equalized. - Furthermore, the amount of distortion in the heat-receiving member was decreased according to the increase of the thickness of the base. This is presumably because a large thickness of the base enhances the strength of the base and thereby tends not to generate a deformation of the base due to the thermal stress.
- With respect to generation of fissures in the base, a very small fissure was observed in the base of the heat-receiving members in Examples 1 to 5.
On the other hand, a large fissure was generated in the base in Comparative Example 1. The large fissure in the base was presumably caused by the heat resistance of an unanodized aluminum base which is lower than the heat resistance of an anodized aluminum base. - Next, a second embodiment, which is one embodiment of the heat-receiving member of the present invention, is described with reference to the drawings.
In the heat-receiving member of the second embodiment, the emissivity of one region far from the high-temperature part of the heat source is higher than the emissivity of another region.
Fig. 7 is a cross-sectional view schematically illustrating an exemplary heat-receiving member of the present invention.
A heat-receiving member 4 illustrated inFig. 7 has thesurface layer 30 that is formed by anodizing the surface of thebase 20, and thesurface layer 30 has a large number of themicropores 40 formed therein.
Part of one region in thesurface layer 30 is electrolytically colored, and thus themicropores 40 in the region have themetal 50 deposited therein. Another region in thesurface layer 30 is not electrolytically colored, and thus themicropores 40 in these regions do not have themetal 50 deposited therein. - In the heat-receiving member 4, the region on which electrolytic coloring was performed (high-emissivity region) has emissivity higher than the emissivity of the region on which electrolytic coloring was not performed, and the region on which electrolytic coloring was not performed (low-emissivity region) has emissivity lower than the emissivity of the region on which electrolytic coloring was performed.
- Examples of the method of producing the heat-receiving member 4 include a method in which, after the surface layer has been formed by anodization in the same way as in the method of producing the heat-receiving member in the first embodiment, the region not to be electrolytically colored is masked at the time of the electrolytic coloring.
The masking can be carried out by a method such as sticking a masking tape on the region.
As a result, the masking allows the unmasked region to be a high-emissivity region, and allows the masked region to be a low-emissivity region. -
Fig. 8 is a cross-sectional view schematically illustrating an exemplary heat-receiving member of the present invention.
A heat-receivingmember 5 illustrated inFig. 8 has thesurface layer 30 formed by anodizing a part of thebase 20. Another part of thebase 20 is unanodized, and thus the surface of thebase 20 is exposed. - In the heat-receiving
member 5, the region with thesurface layer 30 formed therein by anodization (high-emissivity region) has emissivity higher than that of the region with the surface of the base 20 exposed thereon. On the other hand, the region with the surface of the base 20 exposed thereon (low-emissivity region) has emissivity lower than that of the region with thesurface layer 30 formed therein. The region with the surface of the base exposed thereon is arranged at a location close to the high-temperature part of the heat source. - Examples of the method of producing the heat-receiving
member 5 include a method in which a region not to be anodized is masked and then anodized upon production of a heat-receiving member in the first embodiment.
The masking can be carried out by a method such as sticking a masking tape on the region.
As a result, the masking allows the unmasked region to be a high-emissivity region, and allows the masked region to be a low-emissivity region. -
Fig. 9 is a cross-sectional view schematically illustrating an exemplary heat-receiving member of the present invention.
A heat-receivingmember 6 illustrated inFig. 9 has thesurface layer 30 formed by anodizing a part of thebase 20. Further, thesurface layer 30 is electrolytically colored, and thus themicropores 40 have themetal 50 deposited therein. Another part of thebase 20 is not anodized and thus the surface of thebase 20 is exposed. - In the heat-receiving
member 6, the anodized and electrolytically colored region (high-emissivity region) has emissivity higher than that of the region with the surface of the base 20 exposed thereon. On the other hand, the region with the surface of the base 20 exposed thereon (low-emissivity region) has emissivity lower than that of the anodized and electrolytically colored region.
In the heat-receivingmember 6, the difference in the emissivity between the high-emissivity region and the low-emissivity region is larger than the difference in the emissivity between the high-emissivity region and the low-emissivity region in the heat-receiving member 4 and the heat-receivingmember 5. - Examples of the method of producing the heat-receiving
member 6 include a method in which a region not to be anodized is masked before anodization, and with the region being masked, the micropores are formed and the surface layer is then electrolytically colored.
More specifically, further anodizing the produced heat-receivingmember 5 so as to form micropores in the surface layer and then further electrolytically coloring the surface layer results in production of the heat-receivingmember 6. - In the heat-receiving member of the second embodiment, the size of the region with emissivity lower than that of the another region is desirably from 5 to 95% of the total surface area.
Further, the size of the area with emissivity lower than that of the another region is desirably larger than a size of 10 mm × 10 mm when the shape of the region is rectangular.
Also, the difference in the emissivity between the high-emissivity region and the low-emissivity region is desirably from 0.01 to 0.90.
Furthermore, a ratio (Y / X) of a length (Y) of the short side of the region with emissivity lower than that of the another region to a thickness (X) of the base is desirably 2 or more. - In the following, effects of the heat-receiving member of the present embodiment are described.
In the present embodiment, in addition to the effects (1) and (2) described in the first embodiment, the following effects can be achieved.
(4) In the heat-receiving member of the present embodiment, there is a region with emissivity higher than that of another region. Since the region having higher emissivity than emissivity of the another region is more likely to receive heat by radiation heat transfer, the amount of heat to be received per unit area is large. The region having higher emissivity than that of the another region is thus a region in which the temperature tends to rise due to reception of heat. Accordingly, placing the region having higher emissivity than the another region at a location far from the high-temperature part of the adjacent heat source makes it more likely for the temperature of the heat-receiving member to rise even if the region is located far from the high-temperature part of the heat source; hence, generation of a low-temperature region inside the heat-receiving member can be prevented.
That is, generation of a temperature difference inside the heat-receiving member can be prevented. Further, generation of thermal stress and distortion in the heat-receiving member can be prevented. - (5) In the heat-receiving member of the present embodiment, micropores may be formed in the surface layer in the region far from the high-temperature part of the heat source, and a metal may be deposited in the micropores.
Deposition of a metal in the micropores in the surface layer makes it possible to increase the emissivity of the region. That is, placing the region with a metal deposited in the micropores formed in the surface layer thereof at a location far from the high-temperature part of the heat source makes it possible to more effectively prevent generation of a low-temperature region inside the heat-receiving member. - (6) In the heat-receiving member of the present embodiment, a region close to the high-temperature part of the heat source may include a region in which the surface of the base is unanodized and exposed.
Since the base is made of aluminum or an aluminum alloy, the emissivity of the region with the surface of the base exposed thereon is low. Placing the region with the surface of the base exposed thereon at a location close to the high-temperature part of the heat source makes it possible to prevent the temperature of the heat-receiving member from rising too high even if the region is located close to the high-temperature part of the heat source; hence, generation of a high-temperature region inside the heat-receiving member can be prevented. That is, generation of a temperature difference inside the heat-receiving member can be prevented. - Hereinafter, Examples are described which more specifically disclose the second embodiment of the present invention. However, the present embodiment is not limited to these Examples.
- A base made of aluminum was anodized to form a surface layer on the base and to form micropores in the surface layer, in the same way as in Example 1.
Next, at the center (the location E inFig. 6 ) of the anodized surface, a masking tape (851T, produced by Sumitomo 3M Limited.) with a size of 20 mm × 20 mm was stuck.
Subsequently, the surface layer was electrolytically colored in the same way as in Example 2, and thereby nickel was deposited in the micropores in the region without the masking tape stuck thereon.
Thereafter, the masking tape was removed, and then blocking was carried out in the same way as in Example 2.
A heat-receiving member produced thereby has a region on which electrolytic coloring was not performed, which is a "low-emissivity region", and a region on which electrolytic coloring was performed, which is a "high-emissivity region". - At the center (the location E in
Fig. 6 ) of the to-be anodized surface of the base that is of the same kind as the base used in Example 1, a masking tape with a size of 10 mm × 10 mm was stuck.
Then, the base was anodized in the same way as in Example 1, and a surface layer was formed by anodization on a region without a masking tape stuck thereon, and further, micropores were formed in the surface layer.
Subsequently, the surface layer was electrolytically colored in the same way as in Example 2, and thereby nickel was deposited in the micropores in the region without the masking tape stuck thereon.
Thereafter, the masking tape was removed, and then blocking was carried out in the same way as in Example 2.
A heat-receiving member produced thereby has a region on which anodization and electrolytic coloring were not performed, which is a "low-emissivity region", and a region on which anodization and electrolytic coloring were performed, which is a "high-emissivity region". - Heat-receiving members were produced by the same method as in Example 7 except that the respective masking tapes had a size of 20 mm × 20 mm and a size of 50 mm × 50 mm.
- Heat-receiving members were produced by the same method as in Example 7 except that the bases each had a thickness of 1.0 mm and the respective masking tapes had a size of 10 mm × 10 mm, a size of 20 mm × 20 mm, and a size of 50 mm × 50 mm.
- Heat-receiving members were produced by the same method as in Example 7 except that the bases each had a thickness of 2.0 mm and the respective masking tapes had a size of 10 mm × 10 mm, a size of 20 mm × 20 mm, and a size of 50 mm × 50 mm.
- Heat-receiving members were produced by the same method as in Example 7 except that the bases each had a thickness of 5.0 mm and the respective masking tapes had a size of 10 mm × 10 mm, a size of 20 mm × 20 mm, and a size of 50 mm × 50 mm.
- The heat-receiving members produced in the respective Examples were evaluated for the same points (i) to (iv) as in Example 1.
- First, evaluation results of the heat-receiving members of Examples 6 to 9 each with the base having a thickness of 0.5 mm are shown together in Table 2. For comparison, the result of the heat-receiving member of Example 2 which had uniform emissivity on the surface thereof is also shown.
-
[Table 2] Heat-receiving member Evaluation result Thickness of base Low-emissivity region Highest temperature Lowest temperature Temperature difference Temperature at location E Temperature decrease at location E Amount of heat reception Amount of distortion Fissure Anodization Electrolytic coloring Emissivity Size (mm) (mm × mm) (°C) (°C) (°C) (°C) (°C) (W/m2) (mm) Example 2 0.5 N/A N/A N/A N/A 452 423 29 452 0 2817 2.6 + Example 6 0.5 performed not performed 0.780 20 × 20 424 418 6 424 28 2674 2.3 + Example 7 0.5 not performed not performed 0.050 10 × 10 439 409 30 439 13 2709 1.2 + Example 8 0.5 not performed not performed 0.050 20 × 20 402 379 23 379 73 2452 2.0 + Example 9 0.5 not performed not performed 0.050 50 × 50 392 359 33 359 93 2302 1.3 + - Table 2 shows the emissivities of the low-emissivity regions in the respective Examples. In Example 6 in which the heat-receiving members were anodized and the low-emissivity region thereof was not electrolytically colored, the emissivity was 0.780. In Examples 7 to 9 in which the low-emissivity regions in the heat-receiving members were not anodized nor electrolytically colored, the emissivity was 0.050, the same as that of the base.
Although Table 2 does not show the emissivities of the high-emissivity regions and the emissivity in Example 2, those emissivities correspond to the emissivities of the anodized and electrolytically colored regions, and thus those emissivities are all 0.814. - The heat-receiving member of Example 2 with uniform emissivity on the surface thereof had the highest temperature of 452°C at the location E in the heat-receiving member shown in
Fig. 6 , that is, at the center of the heat-receiving member.
On the other hand, the heat-receiving members of Examples 6 to 9, each of which had a low-emissivity region at the location E, had a temperature lower than the temperature of the heat-receiving member of Example 2 at the location E. Table 2 shows as "temperature decrease at location E" how many degrees the temperature dropped from the temperature at the location E in Example 2. - Further, Table 3 shows the temperatures measured at the locations C, D, E, F, and G shown in
Fig. 6 , for Example 2 and Examples 6 to 9. Furthermore,Fig. 10 shows the relationships between the locations of temperature measurement and the temperatures of the respective heat-receiving members, which were measured in Example 2 and Examples 6 to 9. -
[Table 3] Heat-receiving member Evaluation result Thickness of base Low-emissivity region Location C Location D Location E Location F Location G Anodization Electrolytic coloring Emissivity Size (mm) (mm × mm) (°C) (°C) (°C) (°C) (°C) Example 2 0.5 N/A N/A N/A N/A 423 439 452 447 423 Example 6 0.5 performed not performed 0.780 20 × 20 418 419 424 418 418 Example 7 0.5 not performed not performed 0.050 10 × 10 410 426 439 434 409 Example 8 0.5 not performed not performed 0.050 20 × 20 400 392 379 389 402 Example 9 0.5 not performed not performed 0.050 50 × 50 390 367 359 363 392 - Hereinafter, the evaluation results are described with reference to Table 2, Table 3, and
Fig. 10 .
In Example 6, the emissivity of the low-emissivity region is 0.780, and the difference between this emissivity and the emissivity of 0.814 of the high-emissivity region is 0.034. Such provision of a high-emissivity region and a low-emissivity region in the heat-receiving member decreases the temperature at the location E by 28°C; thus, the temperature difference between the highest temperature and the lowest temperature became 6°C, which made it possible to bring the temperature distribution within the heat-receiving member closer to the uniform distribution. - In Example 8, the emissivity of the low-emissivity region was 0.05, which led to a large decrease in the temperature at the location E by 73°C. Comparison with Example 6 in which the area of the low-emissivity region is 20 mm × 20 mm, the same area as in Example 8, reveals that lower emissivity in the low-emissivity region more greatly increases temperature-decrease effects.
- Comparison among Examples 7 to 9 each having the same emissivity of 0.05 in the low-emissivity region and having a different area of the low-emissivity region reveals that a larger area of the low-emissivity region leads to a larger temperature decrease at the location E.
Also, in each of Examples 8 and 9 in which the temperature decrease was large, the temperature was lowest at the location E within the heat-receiving member, and thus the line of the line chart of Examples 8 and 9 inFig. 10 had a reverse shape of the line for Example 2. - Those results revealed that provision of a high-emissivity region and a low-emissivity region in the heat-receiving member makes it possible to prevent the temperature from rising too high in a certain region within the heat-receiving member, and to prevent the temperature from falling too low in a certain region. The results also revealed that appropriately adjusting the emissivities and sizes in the high-emissivity region and in the low-emissivity region makes it possible to adjust the temperature distribution inside the heat-receiving member.
- Next, the evaluation results of Examples 10 to 12 in which the bases each had a thickness of 1.0 mm, Examples 13 to 15 in which the bases each had a thickness of 2.0 mm, and Examples 16 to 18 in which the bases each had a thickness of 5.0 mm are respectively shown in Table 4, 5, or 6.
For comparison, the result of the heat-receiving member of Example 3, 4, or 5 with uniform emissivity on the surface thereof is also shown. The respective values of "temperature decrease at location E" were calculated based on the temperature at the location E in Example 3, 4, or 5. -
[Table 4] Heat-receiving member Evaluation result Thickness of base Low-emissivity region Highest temperature Lowest temperature Temperature difference Temperature at location E Temperature decrease at location E Amount of heat reception Amount of distortion Fissure Anodization Electrolytic coloring Emissivity Size (mm) (mm × mm) (°C) (°C) (°C) (°C) (°C) (W/m2) (mm) Example 3 1.0 N/A N/A N/A N/A 452 421 31 452 0 2810 0.6 + Example 10 1.0 not performed not performed 0.050 10 × 10 443 410 33 443 9 2738 0.5 + Example 11 1.0 not performed not performed 0.050 20 × 20 405 387 18 387 65 2486 0.5 + Example 12 1.0 not performed not performed 0.050 50 × 50 394 362 32 362 90 2332 0.8 + -
[Table 5] Heat-receiving member Evaluation result Thickness of base Low-emissivity region Highest temperature Lowest temperature Temperature difference Temperature at location E Temperature decrease at location E Amount of heat reception Amount of distortion Fissure Anodization Electrolytic coloring Emissivity Size (mm) (mm × mm) (°C) (°C) (°C) (°C) (°C) (W/m2) (mm) Example 4 2.0 N/A N/A N/A N/A 438 419 19 438 0 2747 0.3 + Example 13 2.0 not performed not performed 0.050 10 × 10 426 412 14 426 12 2669 0.4 + Example 14 2.0 not performed not performed 0.050 20 × 20 404 393 11 393 45 2495 0.4 + Example 15 2.0 not performed not performed 0.050 50 × 50 394 373 21 373 65 2363 0.4 + -
[Table 6] Heat-receiving member Evaluation result Thickness of base Low-emissivity regions Highest temperature Lowest temperature Temperature difference Temperature at location E Temperature decrease at location E Amount of heat reception Amount of distortion Fissure Anodization Electrolytic coloring Emissivity Size (mm) (mm × mm) (°C) (°C) (°C) (°C) (°C) (W/m2) (mm) Example 5 5.0 N/A N/A N/A N/A 418 407 11 418 0 2617 0.3 + Example 16 5.0 not performed not performed 0.050 10 × 10 412 407 7 412 6 2585 0.3 + Example 17 5.0 not performed not performed 0.050 20 × 20 402 391 11 391 27 2480 0.3 + Example 18 5.0 not performed not performed 0.050 50 × 50 395 387 8 387 31 2440 0.4 + - From the results shown in Table 2 and Tables 4 to 6, effects exerted on the characteristics of the heat-receiving member by the thickness of the base were studied.
When the heat-receiving members of Examples with the respective bases having the same thickness are compared, the larger the size of the low-emissivity region, the larger the temperature decrease at the location E. - Comparison of the results of the heat-receiving members of Examples with the same sizes of the low emissivity regions and with different thicknesses of the bases showed that the larger the thickness of the base, the smaller the temperature decrease tended to be.
Although the reason for this has not been revealed, it is assumed that, since a larger thickness of the base leads to a larger amount of heat transferred inside the base by heat conduction, influences of an increase/decrease of the emissivity are thereby small. - Also, the larger the thickness of the base, the smaller the amount of distortion tended to be. The reason for this is considered to be that the mechanical strength of the base is increased as the thickness of the base is increased.
- These results revealed that appropriately adjusting the emissivities and sizes of the high-emissivity region and the low-emissivity region according to the thickness of the base makes it possible to adjust the temperature distribution inside the heat-receiving member.
- Now, a third embodiment, which is one embodiment of the heat-receiving member of the present invention, is described with reference to the drawings.
The heat-receiving member in the third embodiment has a plurality of cracks formed in the surface layer thereof.
Fig. 11 is a cross-sectional view schematically illustrating an exemplary heat-receiving member of the present invention.
A heat-receivingmember 7 illustrated inFig. 11 has thesurface layer 30 formed by anodizing the surface of thebase 20, and thesurface layer 30 has a plurality ofcracks 60 formed therein. -
Fig. 12 ,Fig. 13 , andFig. 14 each are a scanning electron microscope photograph that shows a surface of a surface layer of an exemplary heat-receiving member of the present invention which has cracks in the surface layer.
In the surface layer shown inFig. 12 , acrack 61 has a zigzag shape as shown in the encircled region.
In the surface layer shown inFig. 13 , acrack 62 is in a state where at least one end thereof has stopped growing and thus is not connected to another crack, as shown in the encircled region; the cracks are separated from each other.
In the surface layer shown inFig. 14 , cracks 63 are formed as straight lines substantially parallel to each other in one direction, as shown by arrows. - The width of each crack is desirably from 0.01 to 15 µm.
A width of more than 15 µm might generate a fissure in the base. - Examples of the method of forming cracks in the surface layer include a method in which the heat-receiving member after anodization is bent so that it is distorted, and then the heat-receiving member is bent again so that it restores the original shape.
- In the following, effects of the heat-receiving member of the present embodiment are described. In the present embodiment, the following effects can be exerted in addition to the effects (1) and (2) that have been described in the first embodiment.
(7) The plurality of cracks are formed in the surface layer of the heat-receiving member of the present embodiment. Therefore, part of thermal stress, which is applied between the base and the surface layer, is absorbed at the cracked part. As a result, the thermal stress applied between the base and the surface layer is prevented from becoming large. As a result, generation of a fissure in the base due to the thermal stress can be prevented. - (8) In the heat-receiving member of the present embodiment, the cracks may be separated from each other.
In the case where the cracks are separated from each other, the cracks absorb the thermal stress and grow upon application of the thermal stress to the surface layer, and thus make it possible to effectively prevent generation of a fissure in the base. Further, the continuous surface layer increases the rigidity and thus makes it easier for the heat-receiving member to maintain the shape. - (9) In the heat-receiving member of the present embodiment, at least one of the cracks may have a zigzag shape.
A zigzag shape of the crack generates resistance to the force applied in the direction parallel to the crack, and therefore makes it possible to effectively prevent generation of a fissure in the base. - Hereinafter, Examples are described which more specifically disclose the third embodiment of the present invention. However, the present embodiment is not limited to these Examples.
- A heat-receiving member was produced in the same way as in Example 2. Thereafter, the produced heat-receiving member was bended by hand to add distortion to the heat-receiving member. Then, cracks attributed from the distortion were observed.
The cracks had a zigzag shape, and had widths of 0.01 to 15 µm at five locations when measured by SEM. - The heat-receiving member produced in Example 19 was evaluated for the same points (i) to (iv) as in Example 1. The results thereof are shown together in Table 7. For comparison, the result of the heat-receiving member of Example 2 with no crack formed in the surface layer thereof is also shown.
[Table 7] Heat-receiving member Evaluation result Thickness of base Anodization Electrolytic coloring Crack Emissivity Temperature at location E Highest temperature Lowest temperature Temperature difference Amount of heat reception Amount of distortion Fissure (mm) (°C) (°C) (°C) (°C) (W/m2) (mm) Example 2 0.5 performed performed not formed 0.814 452 452 423 29 2817 2.6 + Example 19 0.5 performed performed formed 0.806 449 449 421 28 2784 1.9 ++ - The heat-receiving member produced in Example 19 had emissivity slightly lower than that of the heat-receiving member of Example 2. This decrease is considered to be due to inclusion of the surface of the base, which appeared at the cracked part, in the region the emissivity of which was measured.
In the heat-receiving member produced in Example 19, no fissure was observed in the base because of the cracks.
This result is shown as "++" in Table 7. - Now, a fourth embodiment, which is one embodiment of the heat-receiving member of the present invention, is described with reference to the drawings.
The heat-receiving member of the fourth embodiment has surface layers formed by anodizing both respective surfaces of the base thereof.
Fig. 15 is a cross-sectional view schematically illustrating an exemplary heat-receiving member of the present invention.
A heat-receivingmember 11 illustrated inFig. 15 has the base 20 both surfaces of which are anodized, and thebase 20 has asurface layer 30a on the upper surface, and has asurface layer 30b on the lower surface.
Thesurface layer 30a and thesurface layer 30b respectively havemicropores 40a andmicropores 40b formed therein, and themicropores 40a and themicropores 40b respectively have ametal 50a and ametal 50b deposited therein.
That is, the structure of one side of the heat-receiving member is the same as that of the heat-receiving member illustrated inFig. 4 . - The heat-receiving member illustrated in
Fig. 15 is an exemplary heat-receiving member of the present embodiment. As the surface layer of the heat-receiving member of the present embodiment, any of the surface layers of the heat-receiving members that have been described thus far can be employed.
Further, the conditions of the surface layer on the upper surface and lower surface may be different. Examples of such a structure include a structure in which the surface layer on the upper surface is electrolytically colored and the surface layer on the lower surface is not electrolytically colored, and the like. - Examples of a method of forming surface layers by anodizing both respective surfaces of the base include a method in which the base without masking performed thereon is immersed into an electrolytic bath such that both surfaces of the base touch the electrolytic bath, and the like. Alternatively, one surface of the base may be anodized at one time.
- In the following, effects of the heat-receiving member of the present embodiment are described. In the present embodiment, changing the structure of the surface layer makes it possible to achieve the following effects on the respective surfaces in addition to achievement of the respective effects (1) and (2) and effects (4) to (9), the effects having been described in the first to third embodiments.
(10) In the heat-receiving member of the present embodiment, surface layers are formed by anodizing both respective surfaces of the heat-receiving member, and thus the emissivity of the both surfaces of the heat-receiving member is high. As a result, it becomes possible for the heat-receiving member to receive much heat on one surface and release much heat from the other surface. Therefore, the temperature of the heat-receiving member tends not to rise, which makes it possible to decrease the thermal stress generated in the heat-receiving member.
Further, the lower the temperature of the heat-receiving member, the larger the amount of heat that the heat-receiving member can receive; hence, the temperature of the heat-receiving member tends not to rise even at the time of heat reception, which makes it possible to produce a heat-receiving member that demonstrates excellent performance in receiving heat by radiation heat transfer. - In the following, Examples are described which more specifically disclose the fourth embodiment of the present invention. However, the present embodiment is not limited to these Examples.
- A same base as the base used in Example 1 was immersed in an electrolytic bath without a masking tape being stuck on the base, and then both surfaces of the base were anodized to form respective surface layers on the both surfaces of the base. Then, micropores were further formed in the surface layers.
Other conditions of anodization were same as those in Example 1. - Next, a masking tape was stuck for protection on the surface layer formed on a surface of the base which was to be a heat-releasing face when the base is used as a heat-receiving member. Then, the surface layer was electrolytically colored in the same way as in Example 2 so that nickel was deposited in the micropores.
Thereafter, the masking tape was removed and blocking was carried out in the same way as in Example 2.
In a heat-receiving member produced as thus described, one of the surfaces was anodized and electrolytically colored and the other surface was only anodized. - A heat-receiving member was produced in the same way as in Example 20 except that a masking tape was not stuck on the surface layer before electrolytic coloring in Example 20.
In a heat-receiving member produced as thus described, both faces were anodized and electrolytically colored. - The heat-receiving members produced in Examples 20 and 21 were evaluated for the same points (i) to (iv) as in Example 1. In Example 20, the heat-receiving member was placed such that the anodized and electrolytically colored surface faced the heaters and thus was used as a heat-receiving face. Further, the surface, which was only anodized, was arranged on the other side and set to be the heat-releasing face. In Example 21, the sides that the surfaces of the heat-receiving member would face were optionally determined.
Furthermore, Example 22 and Example 23 as described below were carried out. - In Example 22, a same heat-receiving member as that produced in Example 20 was used in measurement of heat-receiving performance. However, unlike in Example 20, the heat-receiving member was placed in reverse, that is, the surface on which only anodization was performed was used as the heat-receiving face, and the surface on which anodization and electrolytic coloring were performed was used as the heat-releasing face.
- In Example 23, a same heat-receiving member as that produced in Example 2 was used in measurement of heat-receiving performance. However, unlike in Example 2, the heat-receiving member was placed in reverse, that is, the surface layer of the heat-receiving member was arranged on the farther side from the heaters and thus was used as the heat-releasing face, and the surface on which anodization was not performed was used as the heat-receiving face.
The results of evaluation of Examples 20 to 23 are shown together in Table 8. For comparison, the result of the heat-receiving member of Example 2 is also shown. -
[Table 8] Heat-receiving member Evaluation result Thickness of base Heat-receiving face Heat-releasing face of Fissure Anodization Electrolytic coloring Emissivity Anodization Electrolytic coloring Emissivity Temperature at location E Highest temperature Lowest temperature Temperature difference Amount of heat reception Amount of distortion (mm) (°C) (°C) (°C) (°C) (W/m2) (mm) Example 2 0.5 performed performed 0.814 not performed not performed 0.850 452 452 423 29 2817 2.6 + Example 20 0.5 performed performed 0.814 performed not performed 0.780 372 372 357 15 8848 1.7 + Example 21 0.5 performed performed 0.814 performed performed 0.814 366 366 346 20 9059 1.5 + Example 22 0.5 performed not performed 0.780 performed performed 0.814 356 356 340 16 8768 1.6 + Example 23 0.5 not performed not performed 0.050 performed performed 0.814 136 136 127 9 1788 1.3 + - In each of Examples 20 to 22, since the emissivity is high both on the heat-receiving face and the heat-releasing face of the heat-receiving member, the amount of heat reception is more than 8700 W/m2. This amount of heat reception is very large compared to the result of the heat-receiving member of Example 2 which has high emissivity only on the heat-receiving face.
That is, Examples 20 to 22 show that a large amount of heat release from the heat-receiving face by radiation heat transfer considerably increases the amount of heat reception of the heat-receiving member.
Further, the highest temperature of the heat-receiving member is low despite the large amount of heat reception, which shows that heat release from the heat-receiving member was promoted.
It should be noted that the amount of heat reception was small in Example 23 in which the heat-receiving member had high emissivity only on the heat-releasing face and had low emissivity on the heat-receiving face.
These results show that providing respective surface layers on both surfaces of the heat-receiving member by anodization so as to increase the emissivity on a heat-receiving face and a heat-releasing face makes it possible to produce a heat-receiving member which demonstrates excellent performance in receiving heat by radiation heat transfer. - Next, a fifth embodiment, which is one embodiment of the exhaust pipe heat-releasing system of the present invention, is described with reference to the drawings.
In the exhaust pipe heat-releasing system of the present embodiment, a surface-coating layer containing a crystalline inorganic material and an amorphous binder is formed on the outer peripheral face of the exhaust pipe described in the exhaust pipe heat-releasing system of the first embodiment. -
Fig. 16 is a cross-sectional view schematically illustrating an exemplary exhaust pipe heat-releasing system of the present invention.
Anexhaust pipe 151 that forms an exhaust pipe heat-releasingsystem 150 illustrated inFig. 16 has acylindrical base 102 that contains a metal; and a surface-coating layer 103 containing a crystalline inorganic material and an amorphous binder, which is formed on the outer peripheral face of thebase 102.
Further, the heat-receivingmember 1 is placed such that thesurface layer 30 formed by anodization faces the surface-coating layer 103 of theexhaust pipe 151.
Arrows illustrated inFig. 16 schematically show heat transferred from the surface-coating layer 103, which is formed on the outer peripheral face of theexhaust pipe 151, to thesurface layer 30 of the heat-receivingmember 1. - The surface-
coating layer 103 has an emissivity of 0.78 or more at a wavelength of 3 to 30 µm. Provision of the surface-coating layer 103 with high emissivity on the outer peripheral face of theexhaust pipe 151 makes it possible to effectively release heat in theexhaust pipe 151 to the outside of theexhaust pipe 151 by radiation heat transfer. - The material of the crystalline inorganic material contained in the surface-
coating layer 103 is not particularly limited. An oxide of a transition metal is desirably used, and specific examples thereof include manganese dioxide, manganese oxide, iron oxide, cobalt oxide, copper oxide, chrome oxide and nickel oxide. Each of these may be used alone or two or more kinds of these may be used in combination.
These oxides of transition metals are suitably used for producing crystalline inorganic materials having high emissivity. - Examples of the amorphous binder include barium glass, boron glass, strontium glass, alumina-silicate glass, soda-zinc glass and soda-barium glass. Each of these may be used alone or two or more kinds of these may be used in combination.
- Such an amorphous binder is a low-melting-point glass and its softening temperature is in the range of 400 to 1100°C. Accordingly, melting the amorphous inorganic binder to coat the outer peripheral face of the base of the exhaust pipe and then firing the base make it possible to easily form a robust surface-coating layer on the outer peripheral face of the base.
- When the amorphous binder is a low-melting-point glass, the melting point thereof is desirably in the range of 400 to 1100°C.
When the low-melting-point glass has a melting point of less than 400°C, there is a case where the glass easily softens during use and extraneous matters adhere to the glass. On the other hand, when the melting point exceeds 1100°C, there is a case where the heating in formation of a surface-coating layer deteriorates the base. - In the surface-coating layer containing the crystalline inorganic material and the amorphous binder, with respect to a compounding amount of the crystalline inorganic material, a desirable lower limit is 10% by weight and a desirable upper limit is 90% by weight.
When the compounding amount of the crystalline inorganic material is less than 10% by weight, there is a case where the infrared emissivity is insufficient and the heat-releasing property in a high-temperature region is inferior. On the other hand, when the compounding ratio exceeds 90% by weight, there is a case where the adhesion between the heat-releasing layer and the base of the exhaust pipe is lowered.
With respect to the compounding amount of the crystalline inorganic material, a more desirable lower limit is 30% by weight and a more desirable upper limit is 70% by weight. - It is desirable that the surface-coating layer have a thickness of 0.5 to 10 µm.
When the surface-coating layer has a thickness of less than 0.5 µm, a sufficient heat-releasing property might not be ensured. On the other hand, when the surface-coating layer has a thickness exceeding 10 µm, cracks might appear on the surface-coating layer or the exhaust pipe might be deformed. - It is desirable that the surface-coating layer is formed on the entire outer peripheral face of the exhaust pipe because, in this case, the area of the surface-coating layer will be largest and the surface-coating layer will have a particularly excellent heat-releasing property. However, a surface-coating layer may be formed only on a part of the outer peripheral face of the exhaust pipe; particularly when the surface-coating layer is formed on the surface that faces the heat-receiving member, it may not be formed on other parts on the exhaust pipe.
- Hereinafter, a method of producing an exhaust pipe to be used in the exhaust pipe heat-releasing system of the present embodiment is described in accordance with the order of processes.
- (I) Using a cylindrical exhaust pipe processed into a predetermined shape as a starting material, cleaning is performed so as to remove impurities on a surface of the base of the exhaust pipe.
The cleaning is not particularly limited, and conventionally known cleaning may be used. More specifically, ultrasonic cleaning in alcohol solvent, and the like may be used. - Further, after the cleaning, roughening may be optionally performed on the surface of the base of the exhaust pipe in order to enlarge a specific surface area of the outer peripheral face of the base of the exhaust pipe or to adjust the maximum height Rz of the inner face of the base of the exhaust pipe. More specifically, roughening such as sandblasting, etching and high-temperature oxidation may be performed. Each of the treatments may be used alone or two or more kinds of these may be used in combination.
- (II) Separately, a crystalline inorganic material and an amorphous binder are wet-mixed so as to prepare a raw material composition for a surface-coating layer.
More specifically, a powder of a crystalline inorganic material and a powder of an amorphous binder are prepared so that each has a predetermined particle size, a predetermined shape, and the like. Respective powders are dry-mixed at a predetermined compounding ratio to obtain a mixed powder. Then, water is added thereto and the mixture is wet-mixed by ball milling so as to prepare a raw material composition for a surface-coating layer.
The compounding ratio of the mixed powder and water is not particularly limited. However, around 100 parts by weight of water with respect to 100 parts by weight of a mixed powder is desirable. The reason for this is that a viscosity suitable for applying to the base of the exhaust pipe can be obtained. According to need, an inorganic fiber or an organic solvent may be blended to the raw material composition for a surface-coating layer. - (III) The outer peripheral face of the base of the exhaust pipe is coated with the raw material composition for a surface-coating layer.
As a method for coating with the raw material composition for a surface-coating layer, for example, spray coating; electrostatic coating; ink jet; transfer using a stamp, a roller or the like; brush coating and the like may be used.
In addition, the base of the exhaust pipe may be immersed in the raw material composition for a surface-coating layer so as to be coated with the raw material composition for a surface-coating layer. - At least one of plating such as nickel plating and chrome plating, oxidation of the outer peripheral face of the metal base, and the like may be performed before the coating of the outer peripheral face of a base of the exhaust pipe with a raw material composition for a surface-coating layer.
The reason for this is that there is a case where an adhesion property between a base of the exhaust pipe and a surface-coating layer is improved. - (IV) The exhaust pipe coated with the raw material composition for a surface-coating layer is fired.
More specifically, after the exhaust pipe coated with the raw material composition for a surface-coating layer is dried, a surface-coating layer is formed by firing.
The firing temperature is desirably set to the melting point of the amorphous binder or higher, and it is desirably 700 to 1100°C. The firing temperature depends on the kind of the blended amorphous binder. By setting the firing temperature to the melting point of the amorphous binder or higher, the exhaust pipe and the amorphous binder can be adhered solidly, so that a surface-coating layer solidly adhered to the base can be formed.
Through such processes, an exhaust pipe to be used in the exhaust pipe heat-releasing system of the present embodiment can be produced. - In the following, effects of the exhaust pipe heat-releasing system of the present embodiment are described. The exhaust pipe heat-releasing system of the present embodiment can achieve the following effects in addition to the effect (3) described in the first embodiment.
(11) The exhaust pipe heat-releasing system of the present embodiment is provided with a surface-coating layer that contains a crystalline inorganic material and an amorphous binder on the outer peripheral face of the base of the exhaust pipe.
Provision of a surface-coating layer containing a crystalline inorganic material and an amorphous binder increases the emissivity of the outer peripheral face of the exhaust pipe, thereby increasing the amount of radiation heat from the outer peripheral face of the exhaust pipe. Then, the radiation heat from the outer peripheral face of the exhaust pipe is received by the heat-receiving member of the present invention which demonstrates excellent performance in receiving heat.
That is, improvement in the amount of radiation heat from the outer peripheral face of the exhaust pipe is combined with improvement in the amount of heat received by the heat-receiving member, which more effectively prevents the temperature of the exhaust pipe from rising too high. - (12) The exhaust pipe of the exhaust pipe heat-releasing system of the present embodiment has an emissivity (emissivity of the surface-coating layer) of 0.78 or more. Emissivity of the exhaust pipe in such a range increases the amount of radiation heat from the outer peripheral face of the exhaust pipe. As a result, it is possible to still more effectively prevent the temperature of the exhaust pipe from rising too high.
- In the case where the heat-receiving member of the present invention is used as a heat-receiving member for receiving heat from an exhaust manifold of an engine, the heat-receiving member may be arranged as a different member from a heat insulator.
Fig. 17 is an exploded perspective view schematically illustrating exemplary arrangement of the heat-receiving member of the present invention as a different member from the heat insulator.
InFig. 17 , the heat-receivingmember 1 of the present invention is arranged between theexhaust manifold 111 and theheat insulator 118, with thesurface layer 30 of the heat-receivingmember 1 being on theexhaust manifold 111 side.
Even such arrangement of a heat-receiving member makes it possible to increase the cooling ability of an exhaust manifold. -
-
Fig. 1 is an exploded perspective view which illustrates a vehicle engine and a vicinity of an exhaust pipe connected to the vehicle engine. -
Fig. 2 is a cross-sectional view schematically illustrating an exemplary heat-receiving member of the present invention. -
Fig. 3 is a cross-sectional view schematically illustrating an exemplary heat-receiving member of the present invention. -
Fig. 4 is a cross-sectional view schematically illustrating an exemplary heat-receiving member of the present invention. -
Fig. 5 is a cross-sectional view schematically illustrating an exemplary exhaust pipe heat-releasing system of the present invention. -
Fig. 6 is a cross-sectional view schematically illustrating a method of measuring heat receiving performance of a heat-receiving member. -
Fig. 7 is a cross-sectional view schematically illustrating an exemplary heat-receiving member of the present invention. -
Fig. 8 is a cross-sectional view schematically illustrating an exemplary heat-receiving member of the present invention. -
Fig. 9 is a cross-sectional view schematically illustrating an exemplary heat-receiving member of the present invention. -
Fig. 10 is a view showing the relationships between the locations of temperature measurement and the temperatures of the respective heat-receiving members which were measured in Example 2 and Examples 6 to 9. -
Fig. 11 is a cross-sectional view schematically illustrating an exemplary heat-receiving member of the present invention. -
Fig. 12 is a scanning electron microscope photograph that shows a surface of a surface layer of an exemplary heat-receiving member of the present invention which has cracks in the surface layer. -
Fig. 13 is a scanning electron microscope photograph that shows a surface of a surface layer of an exemplary heat-receiving member of the present invention which has cracks in the surface layer. -
Fig. 14 is a scanning electron microscope photograph that shows a surface of a surface layer of an exemplary heat-receiving member of the present invention which has cracks in the surface layer. -
Fig. 15 is a cross-sectional view schematically illustrating an exemplary heat-receiving member of the present invention. -
Fig. 16 is a cross-sectional view schematically illustrating an exemplary exhaust pipe heat-releasing system of the present invention. -
Fig. 17 is an exploded perspective view schematically illustrating exemplary arrangement of a heat-receiving member of the present invention as a different member from a heat insulator. -
- 1 to 11
- Heat-receiving member
- 20
- Base (base of heat-receiving member)
- 30, 30a, 30b
- Surface layer
- 40, 40a, 40b
- Micropore
- 50, 50a, 50b
- Metal
- 60, 61, 62, 63
- Crack
- 100, 150
- Exhaust pipe heat-releasing system
- 101, 151
- Exhaust pipe
- 102
- Base (base of exhaust pipe)
- 103
- Surface-coating layer
- 110
- Engine
- 111
- Exhaust manifold (exhaust pipe)
- 118
- Heat insulator
Claims (11)
- A heat-receiving member, which receives heat energy released from a heat source, comprising:a base that contains aluminum or an aluminum alloy; anda surface layer that is formed by anodizing a surface of the base.
- The heat-receiving member according to claim 1, wherein
the heat-receiving member has a first region and a second region,
the first region is located farther from a high-temperature part of the heat source than the second region, and
the first region has emissivity higher than emissivity of the second region. - The heat-receiving member according to claim 2, wherein
a micropore is formed in said surface layer in the first region, and a metal is deposited in said micropore. - The heat-receiving member according to claim 2, wherein
the second region includes a region in which the surface of the base is unanodized and exposed. - The heat-receiving member according to any one of claims 1 to 4,
wherein
a plurality of cracks are formed in said surface layer. - The heat-receiving member according to claim 5, wherein
said cracks are separated from each other. - The heat-receiving member according to claim 5 or 6, wherein
at least one of said cracks has a zigzag shape. - The heat-receiving member according to any one of claims 1 to 7,
wherein
a surface layer is also formed on a surface on the reverse side of said surface of the base. - An exhaust pipe heat-releasing system comprising:an exhaust pipe including a cylindrical base that contains a metal; anda heat-receiving member arranged over said exhaust pipe, said heat-receiving member being a heat-receiving member according to any one of claims 1 to 8.
- The exhaust pipe heat-releasing system according to claim 9, the system further comprising:a surface-coating layer that is formed on the outer peripheral face of said base included in said exhaust pipe, and that contains a crystalline inorganic material and an amorphous binder.
- The exhaust pipe heat-releasing system according to claim 10,
wherein
said exhaust pipe has an emissivity of 0.78 or more.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008179380A JP2010018831A (en) | 2008-07-09 | 2008-07-09 | Heat-receiving member and exhaust pipe heat-releasing system |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2146069A1 true EP2146069A1 (en) | 2010-01-20 |
EP2146069B1 EP2146069B1 (en) | 2013-11-20 |
Family
ID=41136851
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP09162273.8A Active EP2146069B1 (en) | 2008-07-09 | 2009-06-09 | Heat-receiving member and exhaust pipe heat-releasing system |
Country Status (3)
Country | Link |
---|---|
US (1) | US20100005792A1 (en) |
EP (1) | EP2146069B1 (en) |
JP (1) | JP2010018831A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2500539A1 (en) * | 2011-03-16 | 2012-09-19 | Ibiden Co., Ltd. | Exhaust pipe |
WO2014118609A1 (en) * | 2013-01-29 | 2014-08-07 | Toyota Jidosha Kabushiki Kaisha | Heat radiation member and method for manufacturing the same |
DE112009005163B4 (en) * | 2009-08-21 | 2014-10-09 | Ibiden Co., Ltd. | Insulation for a component of an exhaust system |
US8992170B2 (en) | 2010-12-20 | 2015-03-31 | Siemens Aktiengesellschaft | Wind turbine, method of control of a wind turbine and air-conditioning system |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
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JP4852025B2 (en) * | 2007-11-28 | 2012-01-11 | イビデン株式会社 | Exhaust pipe |
JP2010162776A (en) * | 2009-01-16 | 2010-07-29 | Nissan Motor Co Ltd | Heat transfer device |
DE102010048973A1 (en) * | 2010-10-20 | 2012-04-26 | Isolite Gmbh | exhaust manifold |
JP5884447B2 (en) * | 2011-11-30 | 2016-03-15 | オイレス工業株式会社 | Cylindrical gasket, manufacturing method thereof, and plug-in type exhaust pipe joint using the cylindrical gasket |
DE102013221375A1 (en) * | 2013-10-22 | 2015-04-23 | Ford Global Technologies, Llc | Method for producing a coated bore surface, in particular a cylinder bore |
JP6363348B2 (en) * | 2014-01-23 | 2018-07-25 | イビデン株式会社 | Multi-layer coated aluminum substrate |
JP6363347B2 (en) * | 2014-01-23 | 2018-07-25 | イビデン株式会社 | Multi-layer coated aluminum substrate |
JP6397637B2 (en) * | 2014-03-04 | 2018-09-26 | イビデン株式会社 | Multi-layer coated aluminum substrate |
JP6633534B2 (en) * | 2014-10-06 | 2020-01-22 | 日東電工株式会社 | Masking sheet for chemical treatment |
JP6178303B2 (en) * | 2014-12-26 | 2017-08-09 | トヨタ自動車株式会社 | Internal combustion engine |
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- 2008-07-09 JP JP2008179380A patent/JP2010018831A/en active Pending
-
2009
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- 2009-07-06 US US12/498,059 patent/US20100005792A1/en not_active Abandoned
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GB1467039A (en) * | 1975-05-22 | 1977-03-16 | Oconnell J | Heat absorption and/or radiation panels |
JPS5819654A (en) | 1981-07-28 | 1983-02-04 | Nippon Light Metal Co Ltd | Formation of selective absorber film for solar energy |
DE4206247C1 (en) | 1992-02-28 | 1993-06-03 | Mtu Friedrichshafen Gmbh | |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
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DE112009005163B4 (en) * | 2009-08-21 | 2014-10-09 | Ibiden Co., Ltd. | Insulation for a component of an exhaust system |
US8992170B2 (en) | 2010-12-20 | 2015-03-31 | Siemens Aktiengesellschaft | Wind turbine, method of control of a wind turbine and air-conditioning system |
EP2500539A1 (en) * | 2011-03-16 | 2012-09-19 | Ibiden Co., Ltd. | Exhaust pipe |
US9188251B2 (en) | 2011-03-16 | 2015-11-17 | Ibiden Co., Ltd. | Exhaust pipe |
US9534710B2 (en) | 2011-03-16 | 2017-01-03 | Ibiden Co., Ltd. | Heat releasing pipe |
WO2014118609A1 (en) * | 2013-01-29 | 2014-08-07 | Toyota Jidosha Kabushiki Kaisha | Heat radiation member and method for manufacturing the same |
RU2612469C1 (en) * | 2013-01-29 | 2017-03-09 | Тойота Дзидося Кабусики Кайся | Heat radiating element and its fabrication method |
Also Published As
Publication number | Publication date |
---|---|
JP2010018831A (en) | 2010-01-28 |
EP2146069B1 (en) | 2013-11-20 |
US20100005792A1 (en) | 2010-01-14 |
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